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Sample records for acid etched microtexture

  1. Acid-etched microtexture for enhancement of bone growth into porous-coated implants.

    Hacking, S A; Harvey, E J; Tanzer, M; Krygier, J J; Bobyn, J D

    2003-11-01

    We designed an in vivo study to determine if the superimposition of a microtexture on the surface of sintered titanium beads affected the extent of bone ingrowth. Cylindrical titanium intramedullary implants were coated with titanium beads to form a porous finish using commercial sintering techniques. A control group of implants was left in the as-sintered condition. The test group was etched in a boiling acidic solution to create an irregular surface over the entire porous coating. Six experimental dogs underwent simultaneous bilateral femoral intramedullary implantation of a control implant and an acid etched implant. At 12 weeks, the implants were harvested in situ and the femora processed for undecalcified, histological examination. Eight transverse serial sections for each implant were analysed by backscattered electron microscopy and the extent of bone ingrowth was quantified by computer-aided image analysis. The extent of bone ingrowth into the control implants was 15.8% while the extent of bone ingrowth into the etched implants was 25.3%, a difference of 60% that was statistically significant. These results are consistent with other research that documents the positive effect of microtextured surfaces on bone formation at an implant surface. The acid etching process developed for this study represents a simple method for enhancing the potential of commonly available porous coatings for biological fixation.

  2. Micro-texturing into DLC/diamond coated molds and dies via high density oxygen plasma etching

    Yunata Ersyzario Edo

    2015-01-01

    Full Text Available Diamond-Like Carbon (DLC and Chemical Vapor Deposition (CVD-diamond films have been widely utilized not only as a hard protective coating for molds and dies but also as a functional substrate for bio-MEMS/NEMS. Micro-texturing into these hard coated molds and dies provides a productive tool to duplicate the original mother micro-patterns onto various work materials and to construct any tailored micro-textures for sensors and actuators. In the present paper, the high density oxygen plasma etching method is utilized to make micro-line and micro-groove patterns onto the DLC and diamond coatings. Our developing oxygen plasma etching system is introduced together with characterization on the plasma state during etching. In this quantitative plasma diagnosis, both the population of activated species and the electron and ion densities are identified through the emissive light spectroscopy and the Langmuir probe method. In addition, the on-line monitoring of the plasmas helps to describe the etching process. DLC coated WC (Co specimen is first employed to describe the etching mechanism by the present method. Chemical Vapor Deposition (CVD diamond coated WC (Co is also employed to demonstrate the reliable capacity of the present high density oxygen plasma etching. This oxygen plasma etching performance is discussed by comparison of the etching rates.

  3. Effect of phosphoric acid etching on the shear bond strength of two self-etch adhesives

    SABATINI, Camila

    2013-01-01

    Objective To evaluate the effect of optional phosphoric acid etching on the shear bond strength (SBS) of two self-etch adhesives to enamel and dentin. Material and Methods Ninety-six bovine mandibular incisors were ground flat to obtain enamel and dentin substrates. A two-step self-etch adhesive (FL-Bond II) and a one-step self-etch adhesive (BeautiBond) were applied with and without a preliminary acid etching to both the enamel and dentin. The specimens were equally and randomly assigned t...

  4. The research on conformal acid etching process of glass ceramic

    Wang, Kepeng; Guo, Peiji

    2014-08-01

    A series of experiments have been done to explore the effect of different conditions on the hydrofluoric acid etching. The hydrofluoric acid was used to etch the glass ceramic called "ZERODUR", which is invented by SCHOTT in Germany. The glass ceramic was processed into cylindrical samples. The hydrofluoric acid etching was done in a plastic beaker. The concentration of hydrofluoric acid and the etching time were changed to measure the changes of geometric tolerance and I observed the surface using a microscope in order to find an appropriate condition of hydrofluoric acid etching.

  5. Effect of phosphoric acid etching on the shear bond strength of two self-etch adhesives

    Camila SABATINI

    2013-01-01

    Full Text Available Objective To evaluate the effect of optional phosphoric acid etching on the shear bond strength (SBS of two self-etch adhesives to enamel and dentin. Material and Methods Ninety-six bovine mandibular incisors were ground flat to obtain enamel and dentin substrates. A two-step self-etch adhesive (FL-Bond II and a one-step self-etch adhesive (BeautiBond were applied with and without a preliminary acid etching to both the enamel and dentin. The specimens were equally and randomly assigned to 4 groups per substrate (n=12 as follows: FL-Bond II etched; FL-Bond II un-etched; BeautiBond etched; BeautiBond un-etched. Composite cylinders (Filtek Z100 were bonded onto the treated tooth structure. The shear bond strength was evaluated after 24 hours of storage (37°C, 100% humidity with a testing machine (Ultra-tester at a speed of 1 mm/min. The data was analyzed using a two-way ANOVA and post-hoc Tukey's test with a significance level of p<0.05. A field emission scanning electron microscope was used for the failure mode analysis. Results Both adhesives evidenced a significant decrease in the dentin SBS with the use of an optional phosphoric acid-etching step (p<0.05. Preliminary phosphoric acid etching yielded significantly higher enamel SBS for FL-Bond II (p<0.05 only, but not for BeautiBond. FL-Bond II applied to un-etched dentin demonstrated the highest mean bond strength (37.7±3.2 MPa and BeautiBond applied to etched dentin showed the lowest mean bond strength (18.3±6.7 MPa among all tested groups (p<0.05. Conclusion The use of a preliminary acid-etching step with 37.5% phosphoric acid had a significant adverse effect on the dentin bond strength of the self-etch adhesives evaluated while providing improvement on the enamel bond strength only for FL-Bond II. This suggests that the potential benefit that may be derived from an additional etching step with phosphoric acid does not justify the risk of adversely affecting the bond strength to dentin.

  6. Human Mesenchymal Stem Cell Morphology and Migration on Microtextured Titanium

    Banik, Brittany L.; Riley, Thomas R.; Platt, Christina J.; Brown, Justin L.

    2016-01-01

    The implant used in spinal fusion procedures is an essential component to achieving successful arthrodesis. At the cellular level, the implant impacts healing and fusion through a series of steps: first, mesenchymal stem cells (MSCs) need to adhere and proliferate to cover the implant; second, the MSCs must differentiate into osteoblasts; third, the osteoid matrix produced by the osteoblasts needs to generate new bone tissue, thoroughly integrating the implant with the vertebrate above and below. Previous research has demonstrated that microtextured titanium is advantageous over smooth titanium and PEEK implants for both promoting osteogenic differentiation and integrating with host bone tissue; however, no investigation to date has examined the early morphology and migration of MSCs on these surfaces. This study details cell spreading and morphology changes over 24 h, rate and directionality of migration 6–18 h post-seeding, differentiation markers at 10 days, and the long-term morphology of MSCs at 7 days, on microtextured, acid-etched titanium (endoskeleton), smooth titanium, and smooth PEEK surfaces. The results demonstrate that in all metrics, the two titanium surfaces outperformed the PEEK surface. Furthermore, the rough acid-etched titanium surface presented the most favorable overall results, demonstrating the random migration needed to efficiently cover a surface in addition to morphologies consistent with osteoblasts and preosteoblasts. PMID:27243001

  7. Comparison of Self-Etch Primers with Conventional Acid Etching System on Orthodontic Brackets

    Zope, Amit; Zope-Khalekar, Yogita; Chitko, Shrikant S.; Kerudi, Veerendra V.; Patil, Harshal Ashok; Jaltare, Pratik; Dolas, Siddhesh G

    2016-01-01

    Introduction The self-etching primer system consists of etchant and primer dispersed in a single unit. The etching and priming are merged as a single step leading to fewer stages in bonding procedure and reduction in the number of steps that also reduces the chance of introduction of error, resulting in saving time for the clinician. It also results in smaller extent of enamel decalcification. Aim To compare the Shear Bond Strength (SBS) of orthodontic bracket bonded with Self-Etch Primers (SEP) and conventional acid etching system and to study the surface appearance of teeth after debonding; etching with conventional acid etch and self-etch priming, using stereomicroscope. Materials and Methods Five Groups (n=20) were created randomly from a total of 100 extracted premolars. In a control Group A, etching of enamel was done with 37% phosphoric acid and bonding of stainless steel brackets with Transbond XT (3M Unitek, Monrovia, California). Enamel conditioning in left over four Groups was done with self-etching primers and adhesives as follows: Group B-Transbond Plus (3M Unitek), Group C Xeno V+ (Dentsply), Group D-G-Bond (GC), Group E-One-Coat (Coltene). The Adhesive Remnant Index (ARI) score was also evaluated. Additionally, the surface roughness using profilometer were observed. Results Mean SBS of Group A was 18.26±7.5MPa, Group B was 10.93±4.02MPa, Group C was 6.88±2.91MPa while of Group D was 7.78±4.13MPa and Group E was 10.39±5.22MPa respectively. In conventional group ARI scores shows that over half of the adhesive was remaining on the surface of tooth (score 1 to 3). In self-etching primer groups ARI scores show that there was no or minor amount of adhesive remaining on the surface of tooth (score 4 and 5). SEP produces a lesser surface roughness on the enamel than conventional etching. However, statistical analysis shows significant correlation (p<0.001) of bond strength with surface roughness of enamel. Conclusion All groups might show clinically

  8. Crystal growth vs. conventional acid etching: A comparative evaluation of etch patterns, penetration depths, and bond strengths

    Devanna Raghu

    2008-01-01

    Full Text Available The present study was undertaken to investigate the effect on enamel surface, penetration depth, and bond strength produced by 37% phosphoric acid and 20% sulfated polyacrylic acid as etching agents for direct bonding. Eighty teeth were used to study the efficacy of the etching agents on the enamel surface, penetration depth, and tensile bond strength. It was determined from the present study that a 30 sec application of 20% sulfated polyacrylic acid produced comparable etching topography with that of 37% phosphoric acid applied for 30 sec. The 37% phosphoric acid dissolves enamel to a greater extent than does the 20% sulfated polyacrylic acid. Instron Universal testing machine was used to evaluate the bond strengths of the two etching agents. Twenty percent sulfated polyacrylic acid provided adequate tensile bond strength. It was ascertained that crystal growth can be an alternative to conventional phosphoric acid etching as it dissolves lesser enamel and provides adequate tensile bond strength.

  9. Dental zirconia can be etched by hydrofluoric acid.

    Sriamporn, Tool; Thamrongananskul, Niyom; Busabok, Chumphol; Poolthong, Sushit; Uo, Motohiro; Tagami, Junji

    2014-01-01

    The surface morphology and crystal structure change of dental zirconia after hydrofluoric acid (HF) etching were evaluated. Four groups of sintered zirconia specimens were 1) control group, 2) immersion in 9.5%HF at 25°C for 1, 2, 3, or 24 h, 3) immersion in 9.5%HF at 80°C for 1, 3, 5, or 30 min and 4) immersion in 48%HF at 25°C for 30 or 60 min. The specimens were evaluated under SEM and XRD. The SEM analysis revealed changes in surface topography for all the HF-etched zirconia specimens. The irregularities surface increased with increasingly longer immersion times and higher etching solution temperatures. The XRD analysis of the HFetched zirconia specimens revealed the presence of a crystalline monoclinic phase along with a tetragonal form. It was concluded HF can etch dental zirconia ceramic, creating micro-morphological changes. Tetragonal-to-monoclinic phase transformation was induced on the etched zirconia surface.

  10. STUDY ON THE EFFECTS OF ACID ETCHING ON AFFECTED ENAMEL

    Simona Stoleriu

    2011-12-01

    Full Text Available The purpose of the study was to establish and compare the effects of ortophosphoric and hydrochloric acids on the enamel affected by incipient carious lesions with different evolution. Materials and method. 20 teeth with acute and chronic non-cavitary carious lesions were considered for the study. The teeth were sectioned in two halves through the middle of the non-cavitary lesions. The halves of 5 white spot-type lesions and of 5 brown spot-type ones were analyzed as to their surface roughness, on an atomic force microscope (AFM. 5 halves with white spot-type lesions and 5 halves with brown spot-type ones were subjected to acid etching with 37% ortophosphoric acid (Scotchbond etchant gel, 3M ESPE, and an equal number of samples was subjected to the action of 15% hydrochloric acid (ICON-etch, DMG Dental Products Ltd for 2 min, then washed with water and analyzed by AFM. Results. The initial surface roughness of the enamel was higher in the white spot–type carious lesions, comparatively with the brown spot-type ones. For both types of carious non-cavitary lesions, acid etching with phosphoric and hydrochloric acid significantly increased the surface roughness of the enamel, comparatively with the status of the enamel surface prior to etching. The hydrochloric acid led to a surface roughness significantly higher than in the case of ortophosphoric acid, in both acute and chronic non-cavitary carious lesions. The roughness values obtained through etching with ortophosphoric and hydrochloric acid were higher in the white spot-type carious lesions, comparatively with the brown spot-type ones. Conclusions. Both the 37% ortophosphoric acid and the 15% hydrochloric acid determined a significantly higher surface roughness of the enamel affected by acute and chronic non-cavitary carious lesions. The surface condition of the brown spot-type carious lesions was less significantly modified, comparatively with that of the white spot-type lesions, by the

  11. Human Mesenchymal Stem Cell Morphology and Migration on Micro-Textured Titanium

    Brittany eBanik

    2016-05-01

    Full Text Available The implant used in spinal fusion procedures is an essential component to achieving successful arthrodesis. At the cellular level, the implant impacts healing and fusion through a series of steps: first, mesenchymal stem cells (MSCs need to adhere and proliferate to cover the implant; second, the MSCs must differentiate into osteoblasts; third, the osteoid matrix produced by the osteoblasts needs to generate new bone tissue, thoroughly integrating the implant with the vertebrate above and below. Previous research has demonstrated that micro-textured titanium is advantageous over smooth titanium and PEEK implants for both promoting osteogenic differentiation and integrating with host bone tissue; however, no investigation to date has examined the early morphology and migration of MSCs on these surfaces. This study details cell spreading and morphology changes over 24 hours, rate and directionality of migration 6 to 18 hours post seeding, differentiation markers at 10 days, and the long term morphology of MSCs at 7 days, on micro-textured, acid-etched titanium (Endoskeleton, smooth titanium, and smooth PEEK surfaces. The results demonstrate in all metrics, the two titanium surfaces outperformed the PEEK surface. Furthermore, the rough acid-etched titanium surface presented the most favorable overall results, demonstrating the random migration needed to efficiently cover a surface in addition to morphologies consistent with osteoblasts and preosteoblasts.

  12. Dental enamel roughness with different acid etching times: Atomic force microscopy study

    2012-01-01

    Objective: An important characteristic of human dental enamel not yet studied in detail is its surface roughness in mesoscopic scale. This study evaluated quantitatively and qualitatively the surface topography of acid etched enamel with different etching times. Materials and Methods: Ninety-six human maxillary bicuspids were randomly distributed into three groups (n=32): T0 (control), pumiced; T15, 35% phosphoric acid etched enamel for 15 s; T30, 35% phosphoric acid etched enamel for 30 s. R...

  13. Can previous acid etching increase the bond strength of a self-etching primer adhesive to enamel?

    Ana Paula Morales Cobra Carvalho

    2009-06-01

    Full Text Available Because a greater research effort has been directed to analyzing the adhesive effectiveness of self etch primers to dentin, the aim of this study was to evaluate, by microtensile testing, the bond strength to enamel of a composite resin combined with a conventional adhesive system or with a self-etching primer adhesive, used according to its original prescription or used with previous acid etching. Thirty bovine teeth were divided into 3 groups with 10 teeth each (n= 10. In one of the groups, a self-etching primer (Clearfil SE Bond - Kuraray was applied in accordance with the manufacturer's instructions and, in the other, it was applied after previous acid etching. In the third group, a conventional adhesive system (Scotchbond Multipurpose Plus - 3M-ESPE was applied in accordance with the manufacturer's instructions. The results obtained by analysis of variance revealed significant differences between the adhesive systems (F = 22.31. The self-etching primer (Clearfil SE Bond presented lower enamel bond strength values than the conventional adhesive system (Scotchbond Multipurpose Plus (m = 39.70 ± 7.07 MPa both when used according to the original prescription (m = 27.81 ± 2.64 MPa and with previous acid etching (m = 25.08 ± 4.92 MPa.

  14. Bonding to enamel/dentin etched with phosphoric and hydrofluoric acids.

    Barghi, Nassar; Covington, Kendra; Fischer, Dan E; Herbold, Edward T

    2004-10-01

    Repairing porcelain intraorally allows clinicians to provide their patients with a conservative means of treating fractured or debonded restorations. This requires, however, the etching of both porcelain and tooth structure with etching solutions. It is thus relevant to understand the effect that different etching procedures have on shear bond strengths of composite resins to both dentin and enamel structures. Based on the results of this investigation, the authors recommend isolation of tooth structures and the etching of porcelain with hydrofluoric acid.

  15. Bond strengths of all-ceramics: acid vs laser etching.

    Gökçe, B; Ozpinar, B; Dündar, M; Cömlekoglu, E; Sen, B H; Güngör, M A

    2007-01-01

    Various applications of dental lasers on dental materials have been proposed for surface modifications. This study evaluated whether laser etching could be an alternative to hydrofluoric acid (HF) etching. One hundred and ten lithia-based all-ceramic specimens (Empress 2) (R: 4 mm, h: 4 mm) were prepared and divided into five groups (n = 22/group). The untreated specimens served as the control, while one of the experimental groups was treated with 9.5% HF for 30 seconds. Three remaining test groups were treated with different laser (Er:YAG laser wavelength:2940 nm, OpusDent) power settings: 300 mJ, 600 mJ and 900 mJ. Ten specimens in each group were luted to the other 10 specimens by a dual-curing cement (Variolink II), and shear-bond strength (SBS) tests were performed (Autograph, crosshead speed: 0.5 mm/minute). The results were statistically analyzed (Kruskal Wallis and Mann Whitney-U, alpha = .05). Mean SBS (MPa) were 31.9 +/- 4.0, 41.4 +/- 4.3, 42.8 +/- 6.2, 29.2 +/- 4.5 and 27.4 +/- 3.8 for the control and HF, 300, 600 and 900 mJ groups, respectively. SEM evaluations revealed different surface morphologies depending on the laser parameters. The differences between HF acid and 300 mJ, when compared with the control, 600 and 900 mJ groups, were significant (p < .05). The 300 mJ laser group exhibited the highest shear-bond strength values, indicating that laser etching could also be used for surface treatments.

  16. The responses to surface wettability gradients induced by chitosan nanofilms on microtextured titanium mediated by specific integrin receptors

    Park, Jung Hwa; Wasilewski, Christine E.; Almodovar, Noelia; Olivares-Navarrete, Rene; Boyan, Barbara D.; Tannenbaum, Rina; Schwartz, Zvi

    2013-01-01

    Microtexture and chemistry of implant surfaces are important variables for modulating cellular responses. Surface chemistry and wettability are connected directly. While each of these surface properties can influence cell response, it is difficult to decouple their specific contributions. To address this problem, the aims of this study were to develop a surface wettability gradient with a specific chemistry without altering micron scale roughness and to investigate the role of surface wettability on osteoblast response. Microtextured sandblasted/acid-etched (SLA, Sa = 3.1 μm) titanium disks were treated with oxygen plasma to increase reactive oxygen density on the surface. At 0, 2, 6, 10, and 24 h after removing them from the plasma, the surfaces were coated with chitosan for 30 min, rinsed and dried. Modified SLA surfaces are denoted as SLA/h in air prior to coating. Surface characterization demonstrated that this process yielded differing wettability (SLA0 < SLA2 < SLA10 < SLA24) without modifying the micron scale features of the surface. Cell number was reduced in a wettability-dependent manner, except for the most water-wettable surface, SLA24. There was no difference in alkaline phosphatase activity with differing wettability. Increased wettability yielded increased osteocalcin and osteoprotegerin production, except on the SLA24 surfaces. mRNA for integrins α1, α2, α5, β1, and β3 was sensitive to surface wettability. However, surface wettability did not affect mRNA levels for integrin α3. Silencing β1 increased cell number with reduced osteocalcin and osteoprotegerin in a wettability-dependent manner. Surface wettability as a primary regulator enhanced osteoblast differentiation, but integrin expression and silencing β1 results indicate that surface wettability regulates osteoblast through differential integrin expression profiles than microtexture does. The results may indicate that both microtexture and wettability with a specific chemistry have

  17. Growth of carbon nanotubes on Si/SiO{sub 2} wafer etched by hydrofluoric acid under different etching durations

    Tan, Lling-Lling [Chemical Engineering Discipline, School of Engineering, Monash University, Jalan Lagoon Selatan, 46150 Bandar Sunway, Selangor (Malaysia); Chai, Siang-Piao, E-mail: chai.siang.piao@monash.edu [Chemical Engineering Discipline, School of Engineering, Monash University, Jalan Lagoon Selatan, 46150 Bandar Sunway, Selangor (Malaysia); Mohamed, Abdul Rahman [School of Chemical Engineering, Universiti Sains Malaysia, Engineering Campus, Seri Ampangan, 14300 NibongTebal, Pulau Pinang (Malaysia)

    2012-05-15

    The preparation of SiO{sub 2} nanoparticles for the metal-free catalyst growth of carbon nanotubes (CNTs) was investigated. SiO{sub 2} nanoparticles were generated by etching Si/SiO{sub 2} wafers with 48-50% hydrofluoric acid. Etching duration was varied to study its effects on the generation of the SiO{sub 2} nanoparticles. Atomic force microscopy characterization showed that etching at 1 min was the most effective considering the significant numbers of SiO{sub 2} nanoparticles obtained under this condition. The wafer etched at 1 min after chemical vapor deposition at 900 Degree-Sign C for 1 h demonstrated a low I{sub D}/I{sub G} from Raman analysis which establishes that CNTs with highly ordered graphitic structures were grown. Raman analysis also showed a strong radial breathing mode peak in the low-frequency range for the substrate following the 1 min etching process after the reaction.

  18. Atomic force microscopy observation of the enamel roughness and depth profile after phosphoric acid etching.

    Loyola-Rodriguez, Juan Pablo; Zavala-Alonso, Veronica; Reyes-Vela, Enrique; Patiño-Marin, Nuria; Ruiz, Facundo; Anusavice, Kenneth J

    2010-01-01

    The aim was to compare the enamel surface roughness (ESR) and absolute depth profile (ADP) (mean peak-to-valley height) by atomic force microscopy (AFM) before and after using four different phosphoric acids. A total of 160 enamel samples from 40 upper premolars were prepared. The inclusion criterion was that the teeth have healthy enamel. Exclusion criteria included any of the following conditions: facial restorations, caries lesions, enamel hypoplasia and dental fluorosis. Evaluations of the ESR and ADP were carried out by AFM. The Mann-Whitney U-test was used to compare continuous variables and the Wilcoxon test was used to analyze the differences between before and after etching. There were statistically significant differences (P roughness and absolute depth before and after using four different phosphoric acids in healthy enamel; Etch-37 and Scotchbond Etching Gel showed higher profiles after etching (P roughness and ADP before and after using four different phosphoric acids in healthy enamel. However, consistently Etch-37 and Scotchbond Etching Gel showed the highest increase regarding the ESR and ADP after etching healthy enamel. AFM was a useful tool to study site-specific structural topography changes in enamel after phosphoric acid etching.

  19. Nanostructural effect of acid-etching and fluoride application on human primary and permanent tooth enamels

    Cheong, Youjin [Department of Biomedical Engineering and Healthcare Industry Research Institute, College of Medicine, Kyung Hee University, Seoul (Korea, Republic of); Choi, Samjin [Department of Biomedical Engineering and Healthcare Industry Research Institute, College of Medicine, Kyung Hee University, Seoul (Korea, Republic of); Department of Orthodontics, College of Dental Medicine, Kyung Hee University, Seoul (Korea, Republic of); Kim, So Jung [Department of Pediatric Dentistry, College of Dental Medicine, Kyung Hee University, Seoul (Korea, Republic of); Park, Hun-Kuk, E-mail: sigmoidus@khu.ac.kr [Department of Biomedical Engineering and Healthcare Industry Research Institute, College of Medicine, Kyung Hee University, Seoul (Korea, Republic of); Program of Medical Engineering, Kyung Hee University, Seoul (Korea, Republic of)

    2012-07-01

    This study examined the nanostructural effects of fluoride application and the acid-etching time with respect to the time elapsed after fluoride application on the primary and permanent tooth enamel layers using atomic force microscopy (AFM) and scanning electron microscopy (SEM). 192 non-carious teeth were assigned to sixteen experimental groups (n = 12) including primary (1 to 8) and permanent (9 to 16) teeth, based on the timing of acid-etching with 37% phosphoric acid after an acidulated phosphate fluoride (APF) pre-treatment. The APF pre-treatment led to a decrease in surface roughness in both the primary and permanent teeth. After the APF treatment, the roughness in both primary and permanent teeth increased with the time elapsed. An acid-etching time of 40 s led to increased nanostructural changes in the enamel surfaces compared to the conventional acid-etching time of 20 s. This acid-etching process led to a higher roughness changes in the primary teeth than in the permanent teeth. To obtain proper enamel adhesion of a sealant after APF pre-treatment, it is important to apply acid-etching two weeks after pre-treatment. In addition, the acid-etching time should be prolonged to apply etching more quickly than two weeks, regardless of the primary and permanent teeth. Highlights: Black-Right-Pointing-Pointer APF pre-treatment led to decreased surface roughness in the enamel. Black-Right-Pointing-Pointer After APF treatment, the more roughness increased with increasing time elapsed. Black-Right-Pointing-Pointer Acid-etching should be performed two weeks after fluoride application.

  20. Rolled-Up Nanotech: Illumination-Controlled Hydrofluoric Acid Etching of AlAs Sacrificial Layers

    Costescu Ruxandra

    2009-01-01

    Full Text Available Abstract The effect of illumination on the hydrofluoric acid etching of AlAs sacrificial layers with systematically varied thicknesses in order to release and roll up InGaAs/GaAs bilayers was studied. For thicknesses of AlAs below 10 nm, there were two etching regimes for the area under illumination: one at low illumination intensities, in which the etching and releasing proceeds as expected and one at higher intensities in which the etching and any releasing are completely suppressed. The “etch suppression” area is well defined by the illumination spot, a feature that can be used to create heterogeneously etched regions with a high degree of control, shown here on patterned samples. Together with the studied self-limitation effect, the technique offers a way to determine the position of rolled-up micro- and nanotubes independently from the predefined lithographic pattern.

  1. Rolled-Up Nanotech: Illumination-Controlled Hydrofluoric Acid Etching of AlAs Sacrificial Layers

    Costescu, Ruxandra M.; Deneke, Christoph; Thurmer, Dominic J.; Schmidt, Oliver G.

    2009-12-01

    The effect of illumination on the hydrofluoric acid etching of AlAs sacrificial layers with systematically varied thicknesses in order to release and roll up InGaAs/GaAs bilayers was studied. For thicknesses of AlAs below 10 nm, there were two etching regimes for the area under illumination: one at low illumination intensities, in which the etching and releasing proceeds as expected and one at higher intensities in which the etching and any releasing are completely suppressed. The “etch suppression” area is well defined by the illumination spot, a feature that can be used to create heterogeneously etched regions with a high degree of control, shown here on patterned samples. Together with the studied self-limitation effect, the technique offers a way to determine the position of rolled-up micro- and nanotubes independently from the predefined lithographic pattern.

  2. Resin Adaptation of Radicular Dentin Tubules after Endodontic Instrumentation and Acid Etching.

    1983-02-01

    the manuscript. DISCLAIMERS The statements, opinions, and advertisements in the Journal of Endodontics are solely those of the individual authors...I RD-Ai26 872 RESIN ADAPTATION OF RADICULAR DENTIN TUBULES AFTER / I ENDODONTIC INSTRUMENTATION AND ACID ETCHING(U) WALTER I REED ARMY INST OF...Adaptation to Radicular Dentin Tubules SbisoofpeAfter Endodontic Instrumentation and Acid Etching 1982-1983 6. PERFORMING ORG. REPORTNUMBER -, AUTHOR(a) S

  3. Study of wet etching thin films of indium tin oxide in oxalic acid by monitoring the resistance

    Mammana, Suelene S., E-mail: ssmammana@abinfo.com.br [Brazilian Association for Informatics - ABINFO, Rua Deusdete Martins Gomes 163, CEP 13084-723, Campinas, SP (Brazil); Greatti, Alessandra; Luiz, Francis H.; Costa, Francisca I. da; Mammana, Alaide P. [Brazilian Association for Informatics - ABINFO, Rua Deusdete Martins Gomes 163, CEP 13084-723, Campinas, SP (Brazil); Calligaris, Guilherme A.; Cardoso, Lisandro P. [Institute of Physics Gleb Wataghin, State University of Campinas-UNICAMP, CEP 13083-859, Campinas, SP (Brazil); Mammana, Carlos I.Z.; Engelsen, Daniel den [Brazilian Association for Informatics - ABINFO, Rua Deusdete Martins Gomes 163, CEP 13084-723, Campinas, SP (Brazil)

    2014-09-30

    We describe a study on wet etching of thin films of indium tin oxide (ITO) using a simple method by monitoring the resistance of the thin film in aqueous solutions of oxalic acid and hydrochloric acid. Generally three different regimes can be distinguished during etching ITO in acids: (1) initial etching, which is slow, (2) a fast etching phase and (3) slow etching stage at the end. These regimes are explained in terms of a porosity–roughness model. This porosity model has been confirmed largely by X-ray reflection measurements at grazing incidence, roughness measurements and scanning electron microscopy (SEM). A reliable method for monitoring the resistance during etching has been developed. This method is based on a 2-strips measuring jig with a very low series contact resistance. The activation energy of the etch rate of ITO films was found to be 80 ± 5 kJ/mol for oxalic acid and 56 ± 5 kJ/mol for HCl. SEM analyses in the final stage of the etching process indicate an enrichment of Sn in the residual film material. These observations are explained in terms of preferential etching of In{sub 2}O{sub 3}. X-ray analyses showed that the density of the ITO film decreased by etching. By adding ferric chloride to the oxalic acid solution we could accelerate the etch rate substantially. - Highlights: • Etching of indium tin oxide thin films by monitoring the resistance. • Oxalic acid has 2–3 times lower etch rate than concentrated HCl. • The etch rate in oxalic acid can be accelerated substantially by adding FeCl{sub 3}. • The proposed etching model for indium tin oxide was confirmed by X-ray analysis and scanning electron microscopy. • Energy Dispersive X-ray Spectroscopy analyses showed preferential etching of In{sub 2}O{sub 3}, enriching the film with SnO{sub 2}.

  4. Effect of Phosphoric Acid on the Self Etching Primer Bond Strength and its Relation to Oral Health Status

    E Yassini

    2005-06-01

    Full Text Available Self etching primers, due to ease of manipulation, have been extensively used in recent years. These self etching primers containing a relatively weak acid, may not provide an optimal bond strength. The purpose of the present in-vitro investigation was to evaluate the effects of 37% phosphoric acid application prior to applying self etching primers on composite bond strength. In this experimental study a total of 48 premolar and molar teeth, free of caries, filling, abrasion, crack or other dental defects were selected. The extracted teeth were immediately stored in physiologic serum and divided randomly into two equal groups (n=24.Each group was also divided into two subgroups of twelve teeth each as follows: Subgroup A: enamel was not acid-etched, subgroup B: enamel was acid-etched (group I.Subgroup C: dentin was not acid- etched, subgroup D: dentin was acid-etched (group II.In acid-conditioned groups, water rinsing was followed by the application of a bonding agent (Etch & Primer 3, however for non-acid-treated groups, just the bonding agent was used. Then composite resin blocks (1.5×2 mm and 2.5 mm in diameter were formed and light cured at all directions for 40 seconds, following this the specimens were placed in an Instron universal testing machine to determine shear bond strength. The data were analyzed by t-test. Results showed that no statistically significant differences were between the mean values of etch and un-etch enamel (P=0.232, similarly those of etch and un-etch dentin (P=0.148. In this investigation we concluded that acidic components employed in self-etching primers were of weak type, but self-etching primers could be used without phosphoric acid conditioning.

  5. Comparison of shear bond strength of reattached incisor fragment using Er,Cr:YSGG laser etching and conventional acid etching: An in vitro study

    Kumar, Gyanendra; Goswami, Mridula; Dhillon, Jatinder Kaur

    2016-01-01

    Aim: The aim of this invitro study is to evaluate the shear bond strength of reattached fractured incisor fragments using Er,Cr:YSGG laser and conventional acid etching without additional tooth preparation. Materials and methods: Forty extracted human teeth were divided in two groups of 20 each (Groups A and B). In Group A, fractured surface was treated by an Er, Cr: YSGG laser system (Waterlase MD, Biolase Technology Inc., San Clemente, CA, USA) operating at a wavelength of 2,780 nm and frequency of 20 Hz. In Group B, fractured surface was etched using 37% phosphoric acid (Scotchbond, 3M). In both the groups, further subdivision with 10 sample each was made based on horizontal and oblique fracture. After laser or acid etching, all the samples were reattached using flowable composite resin and light cured. The samples were tested for shear bond strength. Results: Mean shear bond strength for Group A (94.70±39.158) was lower as compared to Group B (121.25±49.937), although the difference was not statistically significant(p value=0.121). Similarly no statistical significant difference was observed amongst the subgroups. (p>0.05) Conclusion: Er,Cr:YSGG laser etching in reattachment of fractured incisor fragment is a good alternative to conventional acid etching. Er,Cr:YSGG showed comparable efficiency in rebonding of fractured teeth fragment as acid etching. PMID:27721563

  6. Evaluating EDTA as a substitute for phosphoric acid-etching of enamel and dentin.

    Imbery, Terence A; Kennedy, Matthew; Janus, Charles; Moon, Peter C

    2012-01-01

    Matrix metalloproteinases (MMPs) are proteolytic enzymes released when dentin is acid-etched. The enzymes are capable of destroying unprotected collagen fibrils that are not encapsulated by the dentin adhesive. Chlorhexidine applied after etching inhibits the activation of released MMPs, whereas neutral ethylenediamine tetra-acetic acid (EDTA) prevents the release of MMPs. The purpose of this study was to determine if conditioning enamel and dentin with EDTA can be a substitute for treating acid-etching enamel and dentin with chlorhexidine. A column of composite resin was bonded to enamel and dentin after conditioning. Shear bond strengths were evaluated after 48 hours and after accelerated aging for three hours in 12% sodium hypochlorite. Shear bond strengths ranged from 15.6 MP a for accelerated aged EDTA enamel specimens to 26.8 MPa for dentin conditioned with EDTA and tested after 48 hours. A three-way ANOVA and a Tukey HSD test found statistically significant differences among the eight groups and the three independent variables (P EDTA was successfully substituted for phosphoric acid-etched enamel and dentin treated with chlorhexidine. Interactions of conditioning agent and aging were significant for dentin but not for enamel. In an effort to reduce the detrimental effects of MMPs, conditioning enamel and dentin with EDTA is an alternative to treating acid-etched dentin and enamel with chlorhexidine.

  7. Dental enamel roughness with different acid etching times: Atomic force microscopy study

    Bruno Bochnia Cerci

    2012-01-01

    Full Text Available Objective: An important characteristic of human dental enamel not yet studied in detail is its surface roughness in mesoscopic scale. This study evaluated quantitatively and qualitatively the surface topography of acid etched enamel with different etching times. Materials and Methods: Ninety-six human maxillary bicuspids were randomly distributed into three groups (n=32: T0 (control, pumiced; T15, 35% phosphoric acid etched enamel for 15 s; T30, 35% phosphoric acid etched enamel for 30 s. Roughness measurements Ra, Rz and root mean square (RMS and 3D images of enamel′s topography were obtained with atomic force microscopy (AFM, which is a powerful technique to obtain direct measurements on microscale features. Results and Conclusions: Roughness variables Ra, Rz and RMS presented statistically significant differences to all groups (P<0.000, with values increasing with etching time. This increase was greater from T0 to T15 than from T15 to T30. Enamel surface alterations T15 to T30 occur mainly due to increase in height and deepening of prisms central region.

  8. Effect of acid etching of glass ionomer cement surface on the microleakage of sandwich restorations.

    Bona, Alvaro Della; Pinzetta, Caroline; Rosa, Vinícius

    2007-06-01

    The purposes of this study were to evaluate the sealing ability of different glass ionomer cements (GICs) used for sandwich restorations and to assess the effect of acid etching of GIC on microleakage at GIC-resin composite interface. Forty cavities were prepared on the proximal surfaces of 20 permanent human premolars (2 cavities per tooth), assigned to 4 groups (n=10) and restored as follows: Group CIE - conventional GIC (CI) was applied onto the axial and cervical cavity walls, allowed setting for 5 min and acid etched (E) along the cavity margins with 35% phosphoric acid for 15 s, washed for 30 s and water was blotted; the adhesive system was applied and light cured for 10 s, completing the restoration with composite resin light cured for 40 s; Group CIN - same as Group CIE, except for acid etching of the CI surface; Group RME - same as CIE, but using a resin modified GIC (RMGIC); Group RMN - same as Group RME, except for acid etching of the RMGIC surface. Specimens were soaked in 1% methylene blue dye solution at 24 degrees C for 24 h, rinsed under running water for 1 h, bisected longitudinally and dye penetration was measured following the ISO/TS 11405-2003 standard. Results were statistically analyzed by Kruskal-Wallis and chi-square tests (a=0.05). Dye penetration scores were as follow: CIE - 2.5; CIN - 2.5; RME - 0.9; and RMN - 0.6. The results suggest that phosphoric acid etching of GIC prior to the placement of composite resin does not improve the sealing ability of sandwich restorations. The RMGIC was more effective in preventing dye penetration at the GIC-resin composite-dentin interfaces than CI.

  9. Effect of acid etching of glass ionomer cement surface on the microleakage of sandwich restorations

    Álvaro Della Bona

    2007-06-01

    Full Text Available The purposes of this study were to evaluate the sealing ability of different glass ionomer cements (GICs used for sandwich restorations and to assess the effect of acid etching of GIC on microleakage at GIC-resin composite interface. Forty cavities were prepared on the proximal surfaces of 20 permanent human premolars (2 cavities per tooth, assigned to 4 groups (n=10 and restored as follows: Group CIE - conventional GIC (CI was applied onto the axial and cervical cavity walls, allowed setting for 5 min and acid etched (E along the cavity margins with 35% phosphoric acid for 15 s, washed for 30 s and water was blotted; the adhesive system was applied and light cured for 10 s, completing the restoration with composite resin light cured for 40 s; Group CIN - same as Group CIE, except for acid etching of the CI surface; Group RME - same as CIE, but using a resin modified GIC (RMGIC; Group RMN - same as Group RME, except for acid etching of the RMGIC surface. Specimens were soaked in 1% methylene blue dye solution at 24ºC for 24 h, rinsed under running water for 1 h, bisected longitudinally and dye penetration was measured following the ISO/TS 11405-2003 standard. Results were statistically analyzed by Kruskal-Wallis and chi-square tests (a=0.05. Dye penetration scores were as follow: CIE - 2.5; CIN - 2.5; RME - 0.9; and RMN - 0.6. The results suggest that phosphoric acid etching of GIC prior to the placement of composite resin does not improve the sealing ability of sandwich restorations. The RMGIC was more effective in preventing dye penetration at the GIC-resin composite-dentin interfaces than CI.

  10. The initial behaviour of freshly etched copper in modertely acid, aerated chloride solutions

    Bech-Nielsen, Gregers; Jaskula, M.; Chorkendorff, Ib;

    2002-01-01

    When freshly etched samples of various types of copper were exposed in moderately acid, aerated chloride solutions, two phenomena were observed. First the corrosion potential and the pH of the solution decreased over a shorter time, then the potential increased over a long period (600-1500 min), ...

  11. Phosphoric acid-etching promotes bond strength and formation of acid-base resistant zone on enamel.

    Li, N; Nikaido, T; Alireza, S; Takagaki, T; Chen, J-H; Tagami, J

    2013-01-01

    This study examined the effect of phosphoric acid (PA) etching on the bond strength and acid-base resistant zone (ABRZ) formation of a two-step self-etching adhesive (SEA) system to enamel. An etch-and-rinse adhesive (EAR) system Single Bond (SB) and a two-step SEA system Clearfil SE Bond (SE) were used. Human teeth were randomly divided into four groups according to different adhesive treatments: 1) SB; 2) SE; 3) 35% PA etching→SE primer→SE adhesive (PA/SEp+a); (4) 35% PA etching→SE adhesive (PA/SEa). Microshear bond strength to enamel was measured and then statistically analyzed using one-way analysis of variance and the Tukey honestly significant difference test. The failure mode was recorded and analyzed by χ( 2 ) test. The etching pattern of the enamel surface was observed with scanning electron microscope (SEM). The bonded interface was exposed to a demineralizing solution (pH=4.5) for 4.5 hours and then 5% sodium hypochlorite with ultrasonication for 30 minutes. After argon-ion etching, the interfacial ultrastructure was observed using SEM. The microshear bond strength to enamel of the SE group was significantly lower (p<0.05) than that of the three PA-etched groups, although the latter three were not significantly different from one another. The ABRZ was detected in all the groups. In morphological observation, the ABRZ in the three PA-etched groups were obviously thicker compared with the SE group with an irregular wave-shaped edge.

  12. Effect of EDTA and Phosphoric Acid Pretreatment on the Bonding Effectiveness of Self-Etch Adhesives to Ground Enamel

    Ibrahim, Ihab M.; Elkassas, Dina W.; Yousry, Mai M.

    2010-01-01

    Objectives: This in vitro study determined the effect of enamel pretreatment with phosphoric acid and ethylenediaminetetraacetic acid (EDTA) on the bond strength of strong, intermediary strong, and mild self-etching adhesive systems. Methods: Ninety sound human premolars were used. Resin composite cylinders were bonded to flat ground enamel surfaces using three self-etching adhesive systems: strong Adper Prompt L-Pop (pH=0.9–1.0), intermediary strong AdheSE (pH=1.6–1.7), and mild Frog (pH=2). Adhesive systems were applied either according to manufacturer instructions (control) or after pretreatment with either phosphoric acid or EDTA (n=10). After 24 hours, shear bond strength was tested using a universal testing machine at a cross-head speed of 0.5 mm/minute. Ultra-morphological characterization of the surface topography and resin/enamel interfaces as well as representative fractured enamel specimens were examined using scanning electron microscopy (SEM). Results: Neither surface pretreatment statistically increased the mean shear bond strength values of either the strong or the intermediary strong self-etching adhesive systems. However, phosphoric acid pretreatment significantly increased the mean shear bond strength values of the mild self-etching adhesive system. SEM examination of enamel surface topography showed that phosphoric acid pretreatment deepened the same etching pattern of the strong and intermediary strong adhesive systems but converted the irregular etching pattern of the mild self-etching adhesive system to a regular etching pattern. SEM examination of the resin/enamel interface revealed that deepening of the etching pattern was consistent with increase in the length of resin tags. EDTA pretreatment had a negligible effect on ultra-morphological features. Conclusions: Use of phosphoric acid pretreatment can be beneficial with mild self-etching adhesive systems for bonding to enamel. PMID:20922162

  13. In vitro short-term bonding performance of zirconia treated with hot acid etching and primer conditioning etching and primer conditioning.

    Xie, Haifeng; Chen, Chen; Dai, Wenyong; Chen, Gang; Zhang, Feimin

    2013-01-01

    This study aimed to investigate and compare the resin bond strengths of zirconia conditioned as follows: alumina sandblasting; alumina sandblasting+application of 10-MDP-containing primer; alumina sandblasting+application of Z-Prime Plus or Metal/Zirconia Primer (new zirconia primers); tribochemical silica coating+silanization; hot acid etching in three different combinations [H2SO4/(NH4)2SO4, HF/HNO3, H2SO4/HF/HNO3]+application of 10-MDP-containing primer. Shear bond strengths (SBS) after water storage for 24 h and 40 days were measured to assess resin bonding performance. Surface and chemical properties of conditioned zirconia surfaces and primers were characterized using scanning electron microscopy, energy dispersive X-ray spectrometry, Fourier transform infrared spectroscopy, and atomic force microscopy. Surface roughness ranked in descending order was: hot acid etching > tribochemical silica coating > alumina sandblasting. Combination of tribochemical silica coating and silanization showed the highest initial SBS (12.46±2.13 MPa) (P<0.01). Etching with H2SO4/(NH4)2SO4 (13.15±3.24 MPa) and HF/HNO3 (13.48±2.15 MPa) showed significantly better bond durability (P<0.01). Hot acid etching seemed to be a promising surface roughening treatment to improve resin-zirconia bonding.

  14. Hydrogen content in titanium and a titanium-zirconium alloy after acid etching.

    Frank, Matthias J; Walter, Martin S; Lyngstadaas, S Petter; Wintermantel, Erich; Haugen, Håvard J

    2013-04-01

    Dental implant alloys made from titanium and zirconium are known for their high mechanical strength, fracture toughness and corrosion resistance in comparison with commercially pure titanium. The aim of the study was to investigate possible differences in the surface chemistry and/or surface topography of titanium and titanium-zirconium surfaces after sand blasting and acid etching. The two surfaces were compared by X-ray photoelectron spectroscopy, secondary ion mass spectroscopy, scanning electron microscopy and profilometry. The 1.9 times greater surface hydrogen concentration of titanium zirconium compared to titanium was found to be the major difference between the two materials. Zirconium appeared to enhance hydride formation on titanium alloys when etched in acid. Surface topography revealed significant differences on the micro and nanoscale. Surface roughness was increased significantly (pzirconium alloy. High-resolution images showed nanostructures only present on titanium zirconium.

  15. Improved Resin–Zirconia Bonding by Room Temperature Hydrofluoric Acid Etching

    Mun-Hwan Lee

    2015-03-01

    Full Text Available This in vitro study was conducted to evaluate the shear bond strength of “non-self-adhesive” resin to dental zirconia etched with hydrofluoric acid (HF at room temperature and to compare it to that of air-abraded zirconia. Sintered zirconia plates were air-abraded (control or etched with 10%, 20%, or 30% HF for either 5 or 30 min. After cleaning, the surfaces were characterized using various analytical techniques. Three resin cylinders (Duo-Link were bonded to each treated plate. All bonded specimens were stored in water at 37 °C for 24 h, and then half of them were additionally thermocycled 5000 times prior to the shear bond-strength tests (n = 12. The formation of micro- and nano-porosities on the etched surfaces increased with increasing concentration and application time of the HF solution. The surface wettability of zirconia also increased with increasing surface roughness. Higher concentrations and longer application times of the HF solution produced higher bond-strength values. Infiltration of the resin into the micro- and nano-porosities was observed by scanning electron microscopy. This in vitro study suggests that HF slowly etches zirconia ceramic surfaces at room temperature, thereby improving the resin–zirconia bond strength by the formation of retentive sites.

  16. Effect of acid-etching on remineralization of enamel white spot lesions.

    Al-Khateeb, S; Exterkate, R; Angmar-Månsson, B; ten Cate, J M; ten Cate, B

    2000-02-01

    This in vitro study aimed at investigating whether full remineralization would occur in white spot lesions when the surface porosity was increased by acid-etching. The effect of fluoride was also investigated. Enamel blocks with in vitro produced white spot lesions were used. Group A was exposed to a remineralizing solution only. In group B, the lesions were etched with 35% phosphoric acid for 30 s, then treated as in group A. Group C was treated as group A + daily treatment with a fluoride toothpaste slurry (1,000 ppm) for 5 min. Group D was treated as group B + the daily fluoride treatment of group C. The remineralization was measured weekly with Quantitative Light-induced Fluorescence during the experimental period. After 10 weeks of remineralization, mineral profiles were assessed with transverse microradiography. The enamel fluorescence was partly regained. There were significant differences in the lesion depth, mineral content at the surface layer, and integrated mineral loss between the groups. Addition of fluoride accelerated the remineralization only in the beginning; in later stages the process leveled out and even reached a plateau in all the groups. It was concluded that full remineralization was not achieved by etching, by the addition of fluoride, nor by the combination of both treatments in this in vitro study.

  17. Shear bond strength and debonding characteristics of metal and ceramic brackets bonded with conventional acid-etch and self-etch primer systems: An in-vivo study

    Mirzakouchaki, Behnam; Sharghi, Reza; Shirazi, Samaneh; Moghimi, Mahsan; Shahrbaf, Shirin

    2016-01-01

    Background Different in-vitro studies have reported various results regarding shear bond strength (SBS) of orthodontic brackets when SEP technique is compared to conventional system. This in-vivo study was designed to compare the effect of conventional acid-etching and self-etching primer adhesive (SEP) systems on SBS and debonding characteristics of metal and ceramic orthodontic brackets. Material and Methods 120 intact first maxillary and mandibular premolars of 30 orthodontic patients were selected and bonded with metal and ceramic brackets using conventional acid-etch or self-etch primer system. The bonded brackets were incorporated into the wire during the study period to simulate the real orthodontic treatment condition. The teeth were extracted and debonded after 30 days. The SBS, debonding characteristics and adhesive remnant indices (ARI) were determined in all groups. Results The mean SBS of metal brackets was 10.63±1.42 MPa in conventional and 9.38±1.53 MPa in SEP system, (P=0.004). No statistically significant difference was noted between conventional and SEP systems in ceramic brackets. The frequency of 1, 2 and 3 ARI scores and debonding within the adhesive were the most common among all groups. No statistically significant difference was observed regarding ARI or failure mode of debonded specimens in different brackets or bonding systems. Conclusions The SBS of metal brackets bonded using conventional system was significantly higher than SEP system, although the SBS of SEP system was clinically acceptable. No significant difference was found between conventional and SEP systems used with ceramic brackets. Total SBS of metal brackets was significantly higher than ceramic brackets. Due to adequate SBS of SEP system in bonding the metal brackets, it can be used as an alternative for conventional system. Key words:Shear bond strength, Orthodontic brackets, Adhesive remnant index, self-etch. PMID:26855704

  18. Nitric-phosphoric acid etching effects on the surface chemical composition of CdTe thin film.

    Irfan, Irfan; Ding, Huanjun; Xia, Wei; Lin, Hao; Tang, Ching W.; Gao, Yongli

    2009-03-01

    Nitric-phosphoric (NP) acid etching has been regarded as one of the most successful methods for the formation of low resistance back contact with the metal electrode in CdTe based solar cells. We report back surface chemical composition for eight different durations of NP etching of CdTe polycrystalline thin film. We studied the surfaces with x-ray photoemission spectroscopy (XPS), ultraviolet photoemission spectroscopy (UPS), inverse photoemission spectroscopy (IEPS) and atomic force microscopy (AFM). Etching dependence on the back surface composition and electronic structure was observed. Valence and conduction band shifts relative to the Fermi level of the system with different etching duration were analyzed. The sample was left in open ambient condition for three weeks and XPS data were obtained again in order to study the difference in surface chemical composition with the pristine CdTe film. Unetched and highly etched part of the sample were sputtered and the depth profile analyzed.

  19. Influence of pH, bleaching agents, and acid etching on surface wear of bovine enamel

    Ana Flávia Soares

    2016-02-01

    Full Text Available ABSTRACT Development of new materials for tooth bleaching justifies the need for studies to evaluate the changes in the enamel surface caused by different bleaching protocols. Objective The aim of this study was to evaluate the bovine dental enamel wear in function of different bleaching gel protocols, acid etching and pH variation. Material and Methods Sixty fragments of bovine teeth were cut, obtaining a control and test areas. In the test area, one half received etching followed by a bleaching gel application, and the other half, only the bleaching gel. The fragments were randomly divided into six groups (n=10, each one received one bleaching session with five hydrogen peroxide gel applications of 8 min, activated with hybrid light, diode laser/blue LED (HL or diode laser/violet LED (VHL (experimental: Control (C; 35% Total Blanc Office (TBO35HL; 35% Lase Peroxide Sensy (LPS35HL; 25% Lase Peroxide Sensy II (LPS25HL; 15% Lase Peroxide Lite (LPL15HL; and 10% hydrogen peroxide (experimental (EXP10VHL. pH values were determined by a pHmeter at the initial and final time periods. Specimens were stored, subjected to simulated brushing cycles, and the superficial wear was determined (μm. ANOVA and Tukey´s tests were applied (α=0.05. Results The pH showed a slight decrease, except for Group LPL15HL. Group LPS25HL showed the highest degree of wear, with and without etching. Conclusion There was a decrease from the initial to the final pH. Different bleaching gels were able to increase the surface wear values after simulated brushing. Acid etching before bleaching increased surface wear values in all groups.

  20. Effect of hydrofluoric acid etching duration on the roughness and flexural strength of a lithium disilicate-based glass ceramic.

    Zogheib, Lucas Villaça; Bona, Alvaro Della; Kimpara, Estevão Tomomitsu; McCabe, John F

    2011-01-01

    The aim of this study was to examine the effect of different acid etching times on the surface roughness and flexural strength of a lithium disilicate-based glass ceramic. Ceramic bar-shaped specimens (16 mm x 2 mm x 2 mm) were produced from ceramic blocks. All specimens were polished and sonically cleaned in distilled water. Specimens were randomly divided into 5 groups (n=15). Group A (control) no treatment. Groups B-E were etched with 4.9% hydrofluoric acid (HF) for 4 different etching periods: 20 s, 60 s, 90 s and 180 s, respectively. Etched surfaces were observed under scanning electron microscopy. Surface profilometry was used to examine the roughness of the etched ceramic surfaces, and the specimens were loaded to failure using a 3-point bending test to determine the flexural strength. Data were analyzed using one-way ANOVA and Tukey's test (?=0.05). All etching periods produced significantly rougher surfaces than the control group (p<0.05). Roughness values increased with the increase of the etching time. The mean flexural strength values were (MPa): A=417 ± 55; B=367 ± 68; C=363 ± 84; D=329 ± 70; and E=314 ± 62. HF etching significantly reduced the mean flexural strength as the etching time increased (p=0.003). In conclusion, the findings of this study showed that the increase of HF etching time affected the surface roughness and the flexural strength of a lithium disilicate-based glass ceramic, confirming the study hypothesis.

  1. Oxidation and etching behaviors of the InAs surface in various acidic and basic chemical solutions

    Na, Jihoon; Lee, Seunghyo; Lim, Sangwoo

    2017-04-01

    Indium arsenide (InAs) is the candidate of choice as a new channel material for application in future technologies beyond the Si-based electronic devices because it has a much higher electron mobility than silicon. In this study, the oxidation and etching behaviors of InAs (100) in various acidic and basic solutions, such as HF, HCl, H2SO4, NaOH, KOH, and NH4OH, were investigated. In addition, the effect of pH on the oxidation and etching reactions taking place on the InAs surface was studied using solutions with a pH ranging from 1 to 13. It was observed that the oxidation of the InAs surface was hindered in acidic solutions, which was attributed to the dissolution of the oxidized surface layer. In particular, the treatment of the InAs surface using a strongly acidic solution with a pH of less than 3 produced an oxide-free surface due to the predominant etching of the InAs surface. The addition of H2O2 to the acidic solutions greatly increased the etching rate of the InAs surface, which suggests that the oxidation process is the rate-limiting step in the sequence of reactions that occur during the etching of the InAs surface in acidic solutions. The etching of InAs was suppressed in neutral solutions, which resulted in the formation of a relatively thicker oxide layer on the surface, and mild etching of the InAs surface took place in basic solutions. However, in basic solutions, the addition of H2O2 did not significantly contribute to the increase of the oxidation state of the InAs surface; thus, its effect on the etching rate of InAs was smaller than in acidic solutions.

  2. The Effect of Hydrofluoric Acid Etching Duration on the Surface Micromorphology, Roughness, and Wettability of Dental Ceramics

    Ramakrishnaiah, Ravikumar; Alkheraif, Abdulaziz A.; Divakar, Darshan Devang; Matinlinna, Jukka P.; Vallittu, Pekka K.

    2016-01-01

    The current laboratory study is evaluating the effect of hydrofluoric acid etching duration on the surface characteristics of five silica-based glass ceramics. Changes in the pore pattern, crystal structure, roughness, and wettability were compared and evaluated. Seventy-five rectangularly shaped specimens were cut from each material (IPS e-max™, Dentsply Celtra™, Vita Suprinity™, Vita mark II™, and Vita Suprinity FC™); the sectioned samples were finished, polished, and ultrasonically cleaned. Specimens were randomly assigned into study groups: control (no etching) and four experimental groups (20, 40, 80 and 160 s of etching). The etched surfaces’ microstructure including crystal structure, pore pattern, pore depth, and pore width was studied under a scanning electron microscope, and the surface roughness and wettability were analyzed using a non-contact surface profilometer and a contact angle measuring device, respectively. The results were statistically analyzed using one-way analysis of variance (ANOVA) and the post hoc Tukey’s test. The results showed a significant change in the pore number, pore pattern, crystal structure, surface roughness, and wettability with increased etching duration. Etching for a short time resulted in small pores, and etching for longer times resulted in wider, irregular grooves. A significant increase in the surface roughness and wettability was observed with an increase in the etching duration. The findings also suggested a strong association between the surface roughness and wettability. PMID:27240353

  3. The Effect of Hydrofluoric Acid Etching Duration on the Surface Micromorphology, Roughness, and Wettability of Dental Ceramics

    Ravikumar Ramakrishnaiah

    2016-05-01

    Full Text Available The current laboratory study is evaluating the effect of hydrofluoric acid etching duration on the surface characteristics of five silica-based glass ceramics. Changes in the pore pattern, crystal structure, roughness, and wettability were compared and evaluated. Seventy-five rectangularly shaped specimens were cut from each material (IPS e-max™, Dentsply Celtra™, Vita Suprinity™, Vita mark II™, and Vita Suprinity FC™; the sectioned samples were finished, polished, and ultrasonically cleaned. Specimens were randomly assigned into study groups: control (no etching and four experimental groups (20, 40, 80 and 160 s of etching. The etched surfaces’ microstructure including crystal structure, pore pattern, pore depth, and pore width was studied under a scanning electron microscope, and the surface roughness and wettability were analyzed using a non-contact surface profilometer and a contact angle measuring device, respectively. The results were statistically analyzed using one-way analysis of variance (ANOVA and the post hoc Tukey’s test. The results showed a significant change in the pore number, pore pattern, crystal structure, surface roughness, and wettability with increased etching duration. Etching for a short time resulted in small pores, and etching for longer times resulted in wider, irregular grooves. A significant increase in the surface roughness and wettability was observed with an increase in the etching duration. The findings also suggested a strong association between the surface roughness and wettability.

  4. The Effect of Hydrofluoric Acid Etching Duration on the Surface Micromorphology, Roughness, and Wettability of Dental Ceramics.

    Ramakrishnaiah, Ravikumar; Alkheraif, Abdulaziz A; Divakar, Darshan Devang; Matinlinna, Jukka P; Vallittu, Pekka K

    2016-05-27

    The current laboratory study is evaluating the effect of hydrofluoric acid etching duration on the surface characteristics of five silica-based glass ceramics. Changes in the pore pattern, crystal structure, roughness, and wettability were compared and evaluated. Seventy-five rectangularly shaped specimens were cut from each material (IPS e-max™, Dentsply Celtra™, Vita Suprinity™, Vita mark II™, and Vita Suprinity FC™); the sectioned samples were finished, polished, and ultrasonically cleaned. Specimens were randomly assigned into study groups: control (no etching) and four experimental groups (20, 40, 80 and 160 s of etching). The etched surfaces' microstructure including crystal structure, pore pattern, pore depth, and pore width was studied under a scanning electron microscope, and the surface roughness and wettability were analyzed using a non-contact surface profilometer and a contact angle measuring device, respectively. The results were statistically analyzed using one-way analysis of variance (ANOVA) and the post hoc Tukey's test. The results showed a significant change in the pore number, pore pattern, crystal structure, surface roughness, and wettability with increased etching duration. Etching for a short time resulted in small pores, and etching for longer times resulted in wider, irregular grooves. A significant increase in the surface roughness and wettability was observed with an increase in the etching duration. The findings also suggested a strong association between the surface roughness and wettability.

  5. Shear Bond Strength of an Etch-and-rinse Adhesive to Er:YAG Laser- and/or Phosphoric Acid-treated Dentin

    Davari, Abdolrahim; Sadeghi, Mostafa; Bakhshi, Hamid

    2013-01-01

    Background and aims. Er:YAG laser irradiation has been claimed to improve the adhesive properties of dentin; therefore, it has been proposed as an alternative to acid etching. The aim of this in vitro study was to investigate the shear bond strength of an etch-and-rinse adhesive system to dentin surfaces following Er:YAG laser and/or phosphoric acid etching. Materials and methods. The roots of 75 sound maxillary premolars were sectioned below the CEJ and the crowns were embedded in auto-polymerizing acrylic resin with the buccal surfaces facing up. The buccal surfaces were ground using a diamond bur and polished until the dentin was exposed; the samples were randomly divided into five groups (n=15) according to the surface treatment: (1) acid etching; (2) laser etching; (3) laser etching followed by acid etching; (4) acid etching followed by laser etching and (5) no acid etching and no laser etching (control group). Composite resin rods (Point 4, Kerr Co) were bonded to treated dentin surfaces with an etch-and-rise adhesive system (Optibond FL, Kerr Co) and light-cured.After storage for two weeks at 37°C and 100% humidity and then thermocycling, bond strength was measured with a Zwick Universal Testing Machine at a crosshead speed of 1 mm/min. Data was analyzed using parametric and non-parametric tests (P<0.05). Results. Mean shear bond strength for acid etching (20.1±1.8 MPa) and acid+laser (15.6±3.5 MPa) groups were significantly higher than those for laser+acid (15.6±3.5 MPa), laser etching (14.1±3.4 MPa) and control (8.1±2.1 MPa) groups. However, there were no significant differences between acid etching and acid+laser groups, and between laser+acid and laser groups. Conclusion. When the cavity is prepared by bur, it is not necessary to etch the dentin surface by Er:YAG laser following acid etching and acid etching after laser etching. PMID:23875083

  6. Improvement of enamel bond strengths for conventional and resin-modified glass ionomers: acid-etching vs. conditioning*

    Zhang, Ling; Tang, Tian; Zhang, Zhen-liang; Liang, Bing; Wang, Xiao-miao; Fu, Bai-ping

    2013-01-01

    Objective: This study deals with the effect of phosphoric acid etching and conditioning on enamel micro-tensile bond strengths (μTBSs) of conventional and resin-modified glass ionomer cements (GICs/RMGICs). Methods: Forty-eight bovine incisors were prepared into rectangular blocks. Highly-polished labial enamel surfaces were either acid-etched, conditioned with liquids of cements, or not further treated (control). Subsequently, two matching pre-treated enamel surfaces were cemented together with one of four cements [two GICs: Fuji I (GC), Ketac Cem Easymix (3M ESPE); two RMGICs: Fuji Plus (GC), RelyX Luting (3M ESPE)] in preparation for μTBS tests. Pre-treated enamel surfaces and cement-enamel interfaces were analyzed by scanning electron microscopy (SEM). Results: Phosphoric acid etching significantly increased the enamel μTBS of GICs/RMGICs. Conditioning with the liquids of the cements produced significantly weaker or equivalent enamel μTBS compared to the control. Regardless of etching, RMGICs yielded stronger enamel μTBS than GICs. A visible hybrid layer was found at certain enamel-cement interfaces of the etched enamels. Conclusions: Phosphoric acid etching significantly increased the enamel μTBSs of GICs/RMGICs. Phosphoric acid etching should be recommended to etch the enamel margins before the cementation of the prostheses such as inlays and onlays, using GICs/RMGICs to improve the bond strengths. RMGICs provided stronger enamel bond strength than GICs and conditioning did not increase enamel bond strength. PMID:24190447

  7. Ultrastructure of the surface of dental enamel with molar incisor hypomineralization (MIH) with and without acid etching.

    Bozal, Carola B; Kaplan, Andrea; Ortolani, Andrea; Cortese, Silvina G; Biondi, Ana M

    2015-01-01

    The aim of the present work was to analyze the ultrastructure and mineral composition of the surface of the enamel on a molar with MIH, with and without acid etching. A permanent tooth without clinical MIH lesions (control) and a tooth with clinical diagnosis of mild and moderate MIH, with indication for extraction, were processed with and without acid etching (H3PO4 37%, 20") for observation with scanning electron microscope (SEM) ZEISS (Supra 40) and mineral composition analysis with an EDS detector (Oxford Instruments). The control enamel showed normal prismatic surface and etching pattern. The clinically healthy enamel on the tooth with MIH revealed partial loss of prismatic pattern. The mild lesion was porous with occasional cracks. The moderate lesion was more porous, with larger cracks and many scales. The mineral composition of the affected surfaces had lower Ca and P content and higher O and C. On the tooth with MIH, even on normal looking enamel, the demineralization does not correspond to an etching pattern, and exhibits exposure of crystals with rods with rounded ends and less demineralization in the inter-prismatic spaces. Acid etching increased the presence of cracks and deep pores in the adamantine structure of the enamel with lesion. In moderate lesions, the mineral composition had higher content of Ca, P and Cl. Enamel with MIH, even on clinically intact adamantine surfaces, shows severe alterations in the ultrastructure and changes in ionic composition, which affect the acid etching pattern and may interfere with adhesion.

  8. Acid etching and plasma sterilization fail to improve osseointegration of grit blasted titanium implants

    Mortensen, Mikkel Saksø; Jakobsen, Stig Storgaard; Saksø, Henrik;

    2012-01-01

    Interaction between implant surface and surrounding bone influences implant fixation. We attempted to improve the bone-implant interaction by 1) adding surface micro scale topography by acid etching, and 2) removing surface-adherent pro-inflammatory agents by plasma cleaning. Implant fixation...... was evaluated by implant osseointegration and biomechanical fixation.The study consisted of two paired animal sub-studies where 10 skeletally mature Labrador dogs were used. Grit blasted titanium alloy implants were inserted press fit in each proximal tibia. In the first study grit blasted implants were...

  9. Influence of Acid Etching on Wettability of Ion-exchanged Aluminosilicate Float Glass

    LI Xiaoyu

    2016-12-01

    Full Text Available The influence of acid etching time on wettability of ion-exchanged aluminosilicate float glass was investigated. The contact angle, roughness and surface composition were measured. The results show that the contact angle increases to a maximum value in the first 7 min and then decreases with the corrosion time. The main reason that cause the change of the contact angle is the change of surface roughness and the content of fluorine atom. The contact angle on the tin side is always larger than that on the air side which is caused by the tin ions on the tin side.

  10. Histologic and biomechanical evaluation of alumina-blasted/acid-etched and resorbable blasting media surfaces.

    Bonfante, Estevam A; Marin, Charles; Granato, Rodrigo; Suzuki, Marcelo; Hjerppe, Jenni; Witek, Lukasz; Coelho, Paulo G

    2012-10-01

    This study evaluated the early biomechanical fixation and bone-to-implant contact (BIC) of an alumina-blasted/acid-etched (AB/AE) compared with an experimental resorbable blasting media (RBM) surface in a canine model. Higher texturization was observed for the RBM than for the AB/AE surface, and the presence of calcium and phosphorus was only observed for the RBM surface. Time in vivo and implant surface did not influence torque. For both surfaces, BIC significantly increased from 2 to 4 weeks.

  11. Microtextures in recent and fossil caliche

    Nagtegaal, Peter J.C.

    1969-01-01

    Microtextures of calcite in recent caliche are similar to those of authigenic calcite in Upper Carboniferous, Permian and Lower Triassic continental sandstones and mudstones in the South-Central Pyrenees, Spain. Except for one profile in the Permian, no complete caliche profiles containing calcrete

  12. In situ chemical functionalization of gallium nitride with phosphonic acid derivatives during etching.

    Wilkins, Stewart J; Greenough, Michelle; Arellano, Consuelo; Paskova, Tania; Ivanisevic, Albena

    2014-03-04

    In situ functionalization of polar (c plane) and nonpolar (a plane) gallium nitride (GaN) was performed by adding (3-bromopropyl) phosphonic acid or propyl phosphonic acid to a phosphoric acid etch. The target was to modulate the emission properties and oxide formation of GaN, which was explored through surface characterization with atomic force microscopy, X-ray photoelectron spectroscopy, photoluminescence (PL), inductively coupled plasma-mass spectrometry, and water contact angle. The use of (3-bromopropyl) phosphonic acid and propyl phosphonic acid in phosphoric acid demonstrated lower amounts of gallium oxide formation and greater hydrophobicity for both sample sets, while also improving PL emission of polar GaN samples. In addition to crystal orientation, growth-related factors such as defect density in bulk GaN versus thin GaN films residing on sapphire substrates were investigated as well as their responses to in situ functionalization. Thin nonpolar GaN layers were the most sensitive to etching treatments due in part to higher defect densities (stacking faults and threading dislocations), which accounts for large surface depressions. High-quality GaN (both free-standing bulk polar and bulk nonpolar) demonstrated increased sensitivity to oxide formation. Room-temperature PL stands out as an excellent technique to identify nonradiative recombination as observed in the spectra of heteroepitaxially grown GaN samples. The chemical methods applied to tune optical and physical properties of GaN provide a quantitative framework for future novel chemical and biochemical sensor development.

  13. Microtextured Silicon Surfaces for Detectors, Sensors & Photovoltaics

    Carey, JE; Mazur, E

    2005-05-19

    With support from this award we studied a novel silicon microtexturing process and its application in silicon-based infrared photodetectors. By irradiating the surface of a silicon wafer with intense femtosecond laser pulses in the presence of certain gases or liquids, the originally shiny, flat surface is transformed into a dark array of microstructures. The resulting microtextured surface has near-unity absorption from near-ultraviolet to infrared wavelengths well below the band gap. The high, broad absorption of microtextured silicon could enable the production of silicon-based photodiodes for use as inexpensive, room-temperature multi-spectral photodetectors. Such detectors would find use in numerous applications including environmental sensors, solar energy, and infrared imaging. The goals of this study were to learn about microtextured surfaces and then develop and test prototype silicon detectors for the visible and infrared. We were extremely successful in achieving our goals. During the first two years of this award, we learned a great deal about how microtextured surfaces form and what leads to their remarkable optical properties. We used this knowledge to build prototype detectors with high sensitivity in both the visible and in the near-infrared. We obtained room-temperature responsivities as high as 100 A/W at 1064 nm, two orders of magnitude higher than standard silicon photodiodes. For wavelengths below the band gap, we obtained responsivities as high as 50 mA/W at 1330 nm and 35 mA/W at 1550 nm, close to the responsivity of InGaAs photodiodes and five orders of magnitude higher than silicon devices in this wavelength region.

  14. Cell Adhesion and in Vivo Osseointegration of Sandblasted/Acid Etched/Anodized Dental Implants

    Mu-Hyon Kim

    2015-05-01

    Full Text Available The authors describe a new type of titanium (Ti implant as a Modi-anodized (ANO Ti implant, the surface of which was treated by sandblasting, acid etching (SLA, and anodized techniques. The aim of the present study was to evaluate the adhesion of MG-63 cells to Modi-ANO surface treated Ti in vitro and to investigate its osseointegration characteristics in vivo. Four different types of Ti implants were examined, that is, machined Ti (control, SLA, anodized, and Modi-ANO Ti. In the cell adhesion study, Modi-ANO Ti showed higher initial MG-63 cell adhesion and induced greater filopodia growth than other groups. In vivo study in a beagle model revealed the bone-to-implant contact (BIC of Modi-ANO Ti (74.20% ± 10.89% was much greater than those of machined (33.58% ± 8.63%, SLA (58.47% ± 12.89, or ANO Ti (59.62% ± 18.30%. In conclusion, this study demonstrates that Modi-ANO Ti implants produced by sandblasting, acid etching, and anodizing improve cell adhesion and bone ongrowth as compared with machined, SLA, or ANO Ti implants. These findings suggest that the application of Modi-ANO surface treatment could improve the osseointegration of dental implant.

  15. In vitro remineralization of acid-etched human enamel with Ca 3SiO 5

    Dong, Zhihong; Chang, Jiang; Deng, Yan; Joiner, Andrew

    2010-02-01

    Bioactive and inductive silicate-based bioceramics play an important role in hard tissue prosthetics such as bone and teeth. In the present study, a model was established to study the acid-etched enamel remineralization with tricalcium silicate (Ca 3SiO 5, C 3S) paste in vitro. After soaking in simulated oral fluid (SOF), Ca-P precipitation layer was formed on the enamel surface, with the prolonged soaking time, apatite layer turned into density and uniformity and thickness increasingly from 250 to 350 nm for 1 day to 1.7-1.9 μm for 7 days. Structure of apatite crystals was similar to that of hydroxyapatite (HAp). At the same time, surface smoothness of the remineralized layer is favorable for the oral hygiene. These results suggested that C 3S treated the acid-etched enamel can induce apatite formation, indicating the biomimic mineralization ability, and C 3S could be used as an agent of inductive biomineralization for the enamel prosthesis and protection.

  16. Hydrogen content in titanium and a titanium–zirconium alloy after acid etching

    Frank, Matthias J.; Walter, Martin S. [Department of Biomaterials, Institute for Clinical Dentistry, University of Oslo, P.O. Box 1109, Blindern, NO-0317 Oslo (Norway); Institute of Medical and Polymer Engineering, Chair of Medical Engineering, Technische Universität München, Boltzmannstrasse 15, 85748 Garching (Germany); Lyngstadaas, S. Petter [Department of Biomaterials, Institute for Clinical Dentistry, University of Oslo, P.O. Box 1109, Blindern, NO-0317 Oslo (Norway); Wintermantel, Erich [Institute of Medical and Polymer Engineering, Chair of Medical Engineering, Technische Universität München, Boltzmannstrasse 15, 85748 Garching (Germany); Haugen, Håvard J., E-mail: h.j.haugen@odont.uio.no [Department of Biomaterials, Institute for Clinical Dentistry, University of Oslo, P.O. Box 1109, Blindern, NO-0317 Oslo (Norway)

    2013-04-01

    Dental implant alloys made from titanium and zirconium are known for their high mechanical strength, fracture toughness and corrosion resistance in comparison with commercially pure titanium. The aim of the study was to investigate possible differences in the surface chemistry and/or surface topography of titanium and titanium–zirconium surfaces after sand blasting and acid etching. The two surfaces were compared by X-ray photoelectron spectroscopy, secondary ion mass spectroscopy, scanning electron microscopy and profilometry. The 1.9 times greater surface hydrogen concentration of titanium zirconium compared to titanium was found to be the major difference between the two materials. Zirconium appeared to enhance hydride formation on titanium alloys when etched in acid. Surface topography revealed significant differences on the micro and nanoscale. Surface roughness was increased significantly (p < 0.01) on the titanium–zirconium alloy. High-resolution images showed nanostructures only present on titanium zirconium. - Highlights: ► TiZr alloy showed increased hydrogen levels over Ti. ► The alloying element Zr appeared to catalyze hydrogen absorption in Ti. ► Surface roughness was significantly increased for the TiZr alloy over Ti. ► TiZr alloy revealed nanostructures not observed for Ti.

  17. Micro-Texture Synthesis by Phase Randomization

    Bruno Galerne

    2011-09-01

    Full Text Available This contribution is concerned with texture synthesis by example, the process of generating new texture images from a given sample. The Random Phase Noise algorithm presented here synthesizes a texture from an original image by simply randomizing its Fourier phase. It is able to reproduce textures which are characterized by their Fourier modulus, namely the random phase textures (or micro-textures.

  18. Fabrication of Alumina Nanowires from Porous Alumina Membranes by Etching in Phosphoric Acid Solution

    Wang, Xuehua; Li, Chengyong; Ma, Lianjiao; Cao, Hong; Zhang, Baohua

    Alumina nanowires (ANWs) with high aspect ratios were synthesized by the chemical etching of porous alumina membranes (PAMs) in phosphoric acid solution. The morphology and structure of ANWs were analyzed by SEM and XRD, respectively. The results showed that the typical features of ANWs are around 35 nm in diameter and around 20 μm in length, the crystalline structure of the ANWs was amorphous, which was in accordance with that of the PAMs. Furthermore, the morphology of the PAMs was characterized by AFM and SEM in detail. On the basis of AFM and SEM observations, a possible formation mechanism of ANWs was discussed, and the inhomogeneous of the dissolution between the triple points and the side walls was considered to be the essential factor deciding the formation of ANWs.

  19. A selective etching phenomenon on {001} faceted anatase titanium dioxide single crystal surfaces by hydrofluoric acid.

    Wang, Yun; Zhang, Haimin; Han, Yanhe; Liu, Porun; Yao, Xiangdong; Zhao, Huijun

    2011-03-14

    A selective etching phenomenon on {001} faceted anatase TiO(2) single crystal surfaces by HF and associated etching mechanism are reported. Density functional theory (DFT) calculations reveal that HF stabilizes the grown {001} facets at low concentrations, but selectively destroys the grown {001} facets at high concentrations.

  20. Inactivation of Matrix-bound MMPs by Cross-linking Agents in Acid Etched Dentin

    Scheffel, Débora Lopes Salles; Hebling, Josimeri; Scheffel, Régis Henke; Agee, Kelly A.; Turco, Gianluca; de Souza Costa, Carlos Alberto; Pashley, David H.

    2014-01-01

    Objectives Published TEM analysis of in vivo resin-dentin bonds shows that in 44 months almost 70% of collagen fibrils from the hybrid layer disappear. Matrix metalloproteinases (MMPs) play an important role in that process and are thought to be the main factor responsible for the solubitization of dentin collagen. Therefore, this study aimed to evaluate the inactivation of matrix-bound MMPs by carbodiimide (EDC) or proanthocyanidin (PA) both cross-linking agents, or the MMP-inhibitor, chlorhexidine (CHX), on acid-etched dentin using a simplified MMP assay method. Methods Dentin beams (1×1×6mm) were obtained from mid-coronal dentin of sound third molars and randomly divided into 6 groups (G) according to the dentin treatment: G1: Deionized water (control), G2: 0.1M EDC, G3: 0.5M EDC, G4: 0.5M EDC+35% HEMA, G5: 5% Proanthocyanidin (PA) and G6: 2% CHX. The beams were etched for 15s with 37% phosphoric acid, rinsed and then immersed for 60s in one of the treatment solutions. The total MMP activity of dentin was analyzed for 1 h by colorimetric assay (Sensolyte). Data were submitted to Wilcoxon non-parametric test and Mann-Whitney tests (p>0.05). Results All experimental cross-linking solutions significantly reduced MMP activity compared to control, except 0.1M EDC (53.6% ±16.1). No difference was observed between cross-linking agents and 2% CHX 0.5M EDC + 35% HEMA (92.3% ±8.0) was similar to 0.5M EDC (89.1% ±6.4), 5% PA (100.8% ±10.9) and 2% CHX (83.4% ±10.9). Conclusion Dentin treatment with cross-linking agents is effective to significantly reduce MMP activity. Mixing 0.5M EDC and 35% HEMA did not influence EDC inhibitor potential. PMID:23786610

  1. Shear bond strength between porcelain and nano filler composite resin with or without 9% hydrofluoric acid etching

    Kun Ismiyatin

    2009-06-01

    Full Text Available Background: Reparation technique on restorations with broken or damaged porcelain which are still attached with the teeth are difficult, because it is very hard to remove the porcelain restoration without damaging it, and it needs a long time. Various ways have been developed to repair the broken porcelain, one of them is the use of composite resin as the material for the restoration of fractured porcelain. Repairing porcelain inside the mouth without removing the restoration of the damaged porcelain using light cured composite resins material seems to be an advantageous option because it is relatively simple, has low risks, good esthetically and cheap. Purpose: The objective of this study was to find out the difference of shear bond strength in porcelain reparation using nano filler composite resin with or without 9% hydrofluoric acid etching by using Autograph measuring device. Methods: Twenty pieces of the porcelain samples devided into 2 groups. Group I: etching process using 9% hydrofluoric acid, and group II : without etching process. Result: The data was analyzed using t test in a p value of 0.0001 (p≤0.05, which means there is a significant different of shear bond strength between treated group I and II. The biggest shear bond strength was in treatment group I. Conclusion: The use of 9% hydrofluoric acid on the surface of porcelain can increase the shear bond strength between porcelain and nano filler composite resin.

  2. Instrumentation With Ultrasonic Scalers Facilitates Cleaning of the Sandblasted and Acid-Etched Titanium Implants.

    Park, Jun-Beom; Lee, Sung-Hoon; Kim, NamRyang; Park, Seojin; Jin, Seong-Ho; Choi, Bong-Kyu; Kim, Kack-Kyun; Ko, Youngkyung

    2015-08-01

    Mechanical instrumentation is widely used to debride dental implants, but this may alter the surface properties of titanium, which in turn may influence bacterial adhesion and make it more difficult to remove the biofilm. This in vitro study was performed (1) to assess the amount of biofilm formation on a sand-blasted and acid-etched titanium fixture treated with ultrasonic scalers with metal, plastic, and carbon tips and (2) to evaluate how this treatment of titanium surfaces affects implant cleaning by brushing with dentifrice. The titanium fixtures were treated with various ultrasonic scaler tips, and surface roughness parameters were measured by confocal microscopy. Biofilm was formed on the treated fixtures by using pooled saliva from 10 subjects, and the quantity of the adherent bacteria was compared with crystal violet assay. The fixture surfaces with biofilm were brushed for total of 30 seconds with a toothbrush with dentifrice. The bacteria remaining on the brushed fixture surfaces were quantified by scanning electron microscopy. Surface changes were evident, and the changes of the surfaces were more discernible when metal tips were used. A statistically significant decrease in roughness value (arithmetic mean height of the surface) was seen in the 2 metal-tip groups and the single plastic-tip group. After brushing with dentifrice, the treated surfaces in all the treatment groups showed significantly fewer bacteria compared with the untreated surfaces in the control group, and the parts of the surfaces left untreated in the test groups. Within the limits of this study, treatment of titanium fixture surfaces with ultrasonic metal, plastic, or carbon tips significantly enhanced the bacterial removal efficacy of brushing. Thorough instrumentation that smooths the whole exposed surface may facilitate maintenance of the implants.

  3. Comparison of bond strength and surface morphology of dental enamel for acid and Nd-YAG laser etching

    Parmeswearan, Diagaradjane; Ganesan, Singaravelu; Ratna, P.; Koteeswaran, D.

    1999-05-01

    Recently, laser pretreatment of dental enamel has emerged as a new technique in the field of orthodontics. However, the changes in the morphology of the enamel surface is very much dependent on the wavelength of laser, emission mode of the laser, energy density, exposure time and the nature of the substance absorbing the energy. Based on these, we made a comparative in vitro study on laser etching with acid etching with reference to their bond strength. Studies were conducted on 90 freshly extracted, non carious, human maxillary or mandibular anteriors and premolars. Out of 90, 60 were randomly selected for laser irradiation. The other 30 were used for conventional acid pretreatment. The group of 60 were subjected to Nd-YAG laser exposure (1060 nm, 10 Hz) at differetn fluences. The remaining 30 were acid pretreated with 30% orthophosphoric acid. Suitable Begg's brackets were selected and bound to the pretreated surface and the bond strength were tested using Instron testing machine. The bond strength achieved through acid pretreatment is found to be appreciably greater than the laser pretreated tooth. Though the bond strength achieved through the acid pretreated tooth is found to be significantly greater than the laser pretreated specimens, the laser pretreatement is found to be successful enough to produce a clinically acceptable bond strength of > 0.60 Kb/mm. Examination of the laser pre-treated tooth under SEM showed globule formation which may produce the mechanical interface required for the retention of the resin material.

  4. Fabrication of Highly-Oleophobic and Superhydrophobic Surfaces on Microtextured al Substrates

    Liu, Changsong; Zhou, Jigen; Zheng, Dongmei; Wan, Yong; Li, Zhiwen

    2011-06-01

    Theoretical calculations suggest that creating highly-oleophobic surfaces would require a surface energy lower than that of any known materials. In the present work, we demonstrate microtextured Al substrate surfaces with veins-like micro/nanostructures displaying apparent contact angles (CA) greater than 120°, even with nitromethane (surface tension γ1 = 37 mN/m). The Al substrate was microtextured by a chemical solution mixed by zinc nitrate hexahydrate, hexamethyltetramine and a little of hydrofluoric acid. A fluoroalkylsilane (FAS) agent was used to tune the surface wettability. The Al substrates were microtextured by veins-like micro/nanostructures and generating a solid-liquid-vapor composite interface. Combination with FAS modification, the Al surfaces resulted in an oleophobicity with CA for nitromethane was 126.3° (152.7° for diethylene glycol, γ1 = 45.2 mN/m). In addition, the Al surfaces demonstrated a low rolling-off angle with oleophobic behavior is induced mainly by topography, which form a composite surface of air and solid with oil drop sitting partially on air. The results are expected to promote the study on self-cleaning applications, especially in the condition with oil contaminations.

  5. Histological structures and acidic etching sensitivities of the enamels at the occlusal pit parts in the deciduous and permanent teeth

    Takahashi, Masashi [Department of Dental Hygiene, Nippon Dental University College at Niigata, Niigata 951-8580 (Japan)]. E-mail: masashi@ngt.ndu.ac.jp; Zheng, Jinhua [Department of Oral Anatomy, School of Dentistry at Niigata, Nippon Dental University, Niigata 951-8580 (Japan); Mori, Kazuhisa [Department of Oral Surgery, School of Dentistry at Niigata, Nippon Dental University, Niigata 951-8580 (Japan); Mataga, Izumi [Department of Oral Surgery, School of Dentistry at Niigata, Nippon Dental University, Niigata 951-8580 (Japan); Kobayashi, Kan [Department of Oral Anatomy, School of Dentistry at Niigata, Nippon Dental University, Niigata 951-8580 (Japan)

    2006-05-15

    The purpose of this study is to compare the histological structures and acidic etching sensitivities of the enamels at the occlusal pit parts between the deciduous molars and permanent molars. They were observed by the polarizing and scanning electron microscopies. The enamel rods were less made slender by EDTA etching and the outlines of the apatite crystals, constituting the enamel rods, were clearer at the occlusal pit part of the deciduous molar than that of the permanent molar in reverse of that at the cusp part. It is thought that the enamel at the occlusal pit part of the permanent molar is more easily decayed by the dental caries than that of the deciduous molar because the former is more easily decayed by the acidic etching than the latter in reverse at the cusp part. It is considered that the thin superficialmost layer of the enamel at the occlusal pit part of the permanent molar has originally higher degree of resistance to the dental caries.

  6. Micro/nanofabrication of poly({sub L}-lactic acid) using focused ion beam direct etching

    Oyama, Tomoko Gowa; Nagasawa, Naotsugu; Taguchi, Mitsumasa [Quantum Beam Science Directorate, Japan Atomic Energy Agency, 1233 Watanuki-machi, Takasaki, Gunma 370-1292 (Japan); Hinata, Toru; Washio, Masakazu [Research Institute for Science and Engineering, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555 (Japan); Oshima, Akihiro; Tagawa, Seiichi [Research Institute for Science and Engineering, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555 (Japan); The Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka 567-0047 (Japan)

    2013-10-14

    Micro/nanofabrication of biocompatible and biodegradable poly({sub L}-lactic acid) (PLLA) using focused Ga ion beam direct etching was evaluated for future bio-device applications. The fabrication performance was determined with different ion fluences and fluxes (beam currents), and it was found that the etching speed and fabrication accuracy were affected by irradiation-induced heat. Focused ion beam (FIB)-irradiated surfaces were analyzed using micro-area X-ray photoelectron spectroscopy. Owing to reactions such as the physical sputtering of atoms and radiation-induced decomposition, PLLA was gradually carbonized with increasing C=C bonds. Controlled micro/nanostructures of PLLA were fabricated with C=C bond-rich surfaces expected to have good cell attachment properties.

  7. Influence of duration of phosphoric acid pre-etching on bond durability of universal adhesives and surface free-energy characteristics of enamel.

    Tsujimoto, Akimasa; Barkmeier, Wayne W; Takamizawa, Toshiki; Watanabe, Hidehiko; Johnson, William W; Latta, Mark A; Miyazaki, Masashi

    2016-08-01

    The purpose of this study was to evaluate the influence of duration of phosphoric acid pre-etching on the bond durability of universal adhesives and the surface free-energy characteristics of enamel. Three universal adhesives and extracted human molars were used. Two no-pre-etching groups were prepared: ground enamel; and enamel after ultrasonic cleaning with distilled water for 30 s to remove the smear layer. Four pre-etching groups were prepared: enamel pre-etched with phosphoric acid for 3, 5, 10, and 15 s. Shear bond strength (SBS) values of universal adhesive after no thermal cycling and after 30,000 or 60,000 thermal cycles, and surface free-energy values of enamel surfaces, calculated from contact angle measurements, were determined. The specimens that had been pre-etched showed significantly higher SBS and surface free-energy values than the specimens that had not been pre-etched, regardless of the aging condition and adhesive type. The SBS and surface free-energy values did not increase for pre-etching times of longer than 3 s. There were no significant differences in SBS values and surface free-energy characteristics between the specimens with and without a smear layer. The results of this study suggest that phosphoric acid pre-etching of enamel improves the bond durability of universal adhesives and the surface free-energy characteristics of enamel, but these bonding properties do not increase for phosphoric acid pre-etching times of longer than 3 s.

  8. Influence of acid-etching and ceramic primers on the repair of a glass ceramic.

    Queiroz, J R C; Souza, Rodrigo O A; Nogueira Junior, L; Ozcan, M; Bottino, M A

    2012-01-01

    The objective of this study was to evaluate the influence of different primers on the microtensile bond strength (μTBS) between a feldspathic ceramic and two composites. Forty blocks (6.0 x 6.0 x 5.0 mm³) were prepared from Vita Mark II . After polishing, they were randomly divided into 10 groups according to the surface treatment: Group 1, hydrofluoric acid 10% (HF) + silane; Group 2, CoJet + silane; Group 3, HF + Metal/Zirconia Primer; Group 4, HF + Clearfil Primer; Group 5, HF + Alloy Primer; Group 6, HF + V-Primer; Group 7, Metal/Zirconia Primer; Group 8, Clearfil Primer; Group 9, Alloy Primer; Group 10, V-Primer. After each surface treatment, an adhesive was applied and one of two composite resins was incrementally built up. The sticks obtained from each block (bonded area: 1.0 mm² ± 0.2 mm) were stored in distilled water at 37 degrees C for 30 days and submitted to thermocycling (7,000 cycles; 5 degrees C/55 degrees C ± 1 degree C). The μTBS test was carried out using a universal testing machine (1.0 mm/min). Data were analyzed using ANOVA and a Tukey test (a = 0.05). The surface treatments significantly affected the results (P 0.05). The bond strength means (MPa) were as follows: Group 1a = 29.6; Group 1b = 33.7; Group 2a = 28.9; Group 2b = 27.1; Group 3a = 13.8; Group 3b = 14.9; Group 4a = 18.6; Group 4b = 19.4; Group 5a = 15.3; Group 5b = 16.5; Group 6a = 11; Group 6b = 18; Groups 7a to 10b = 0. While the use of primers alone was not sufficient for adequate bond strengths to feldspathic ceramic, HF etching followed by any silane delivered higher bond strength.

  9. Bond strength of composite to dentin: effect of acid etching and laser irradiation through an uncured self-etch adhesive system

    Castro, F. L. A.; Carvalho, J. G.; Andrade, M. F.; Saad, J. R. C.; Hebling, J.; Lizarelli, R. F. Z.

    2014-08-01

    This study evaluated the effect on micro-tensile bond strength (µ-TBS) of laser irradiation of etched/unetched dentin through an uncured self-etching adhesive. Dentinal surfaces were treated with Clearfil SE Bond Adhesive (CSE) either according to the manufacturer’s instructions (CSE) or without applying the primer (CSE/NP). The dentin was irradiated through the uncured adhesive, using an Nd:YAG laser at 0.75 or 1 W power settings. The adhesive was cured, composite crowns were built up, and the teeth were sectioned into beams (0.49 mm2) to be stressed under tension. Data were analyzed using one-way ANOVA and Tukey statistics (α = 5%). Dentin of the fractured specimens and the interfaces of untested beams were observed under scanning electron microscopy (SEM). The results showed that non-etched irradiated surfaces presented higher µ-TBS than etched and irradiated surfaces (p 0.05). SEM showed solidification globules on the surfaces of the specimens. The interfaces were similar on irradiated and non-irradiated surfaces. Laser irradiation of dentin through the uncured adhesive did not lead to higher µ-TBS when compared to the suggested manufacturer’s technique. However, this treatment brought benefits when performed on unetched dentin, since bond strengths were higher when compared to etched dentin.

  10. Acid etching process for fabrication of Bi2Sr2CaCu2O8+x stack

    ZHANG Jie; CHEN Jian; WU JingBo; KANG Lin; XU WeiWei; WU PeiHeng

    2007-01-01

    We adopted a new method, acid etching process, to fabricate the intrinsic Josephson junctions based on the Bi2Sr2CaCu2O8+x single crystals. By soaking the crystals into the dilute hydrochloric acid, we fabricated a junction stack successfully, and meantime made the surrounding area insulated. A certain concentration of hydrochloric acid was used to maintain the roughness of the modified layer. The current-voltage characteristic was achieved through the four terminal measurement. We could control the junctions' number by changing the concentration and the soaking time. We also found that the thickness of the stack was equal to the average height of the insulation layer. Such a simple, convenient and controllable fabrication method with a high yield might widen the applications of the intrinsic Josephson junctions.

  11. A comparative study of shear bond strength of orthodontic bracket after acid-etched and Er:YAG treatment on enamel surface

    Leão, Juliana C.; Mota, Cláudia C. B. O.; Cassimiro-silva, Patricia F.; Gomes, Anderson S. L.

    2016-02-01

    This study aimed to evaluate the shear bond strength (SBS) of teeth prepared for orthodontic bracket bonding with 37% phosphoric acid and Er:YAG laser. Forty bovine incisors were divided into two groups. In Group I, the teeth were conditioned with 37% phosphoric acid and brackets were bonded with Transbond XT; in Group II, the teeth were irradiated with Er:YAG and bonding with Transbond XT. After SBS test, the adhesive remnant index was determined. Adhesion to dental hard tissues after Er:YAG laser etching was inferior to that obtained after acid etching but exceeded what is believed to be clinically sufficient strength, and therefore can be used in patients.

  12. Surface Topographical Changes of a Failing Acid-Etched Long-Term in Function Retrieved Dental Implant.

    Monje, Alberto; González-García, Raúl; Fernández-Calderón, María Coronada; Hierro-Oliva, Margarita; González-Martín, María Luisa; Del Amo, Fernando Suarez-Lopez; Galindo-Moreno, Pablo; Wang, Hom-Lay; Monje, Florencio

    2016-02-01

    The aim of the present study was to report the main topographical and chemical changes of a failing 18-year in function retrieved acid-etching implant in the micro- and nanoscales. A partially edentulous 45 year old rehabilitated with a dental implant at 18 years of age exhibited mobility. After careful examination, a 3.25 × 13-mm press-fit dental implant was retrieved. Scanning electron microscope (SEM) analysis was carried out to study topographical changes of the retrieved implant compared with an unused implant with similar topographical characteristics. Moreover, X-ray photoelectron spectroscopy (XPS) analysis was used to study the surface composition of the retrieved failing implant. Clear changes related to the dual dioxide layer are present as visible in ≥×500 magnification. In addition, it was found that, for the retrieved implant, the surface composition consisted mainly of Ti2p, O1s, C1s, and Al2p. Also, a meaningful decrease of N and C was noticed, whereas the peaks of Ti2p, Al2p, and O1s increased when analyzing deeper (up to ×2000s) in the sample. It was shown that the superficial surface of a retrieved press-fit dual acid-etched implant 18 years after placement is impaired. However, the causes and consequences for these changes cannot be determined.

  13. Relation between etch-pit morphology and step retreat velocity on a calcite surface in aspartic acid solution

    Yoshino, Toru; Kagi, Hiroyuki; Kamiya, Natsumi; Kokawa, Ryohei

    2010-04-01

    Effects of L-aspartic acid ( L-Asp) on dissolution of calcite were investigated. The step retreat velocity and dissolution rate of calcite were measured simultaneously using an AFM flow-through system. The etch-pit morphology of calcite was observed using confocal laser scanning microscopy. Results show that the etch-pit morphologies changed drastically depending on the L-Asp concentration ([ L-Asp]) in the order of rhomboidal, pentagonal, and triangular (not perfectly, but retaining an extra step). The change in obtuse step directions and appearance of the [0 1 0] step triggered these morphological changes. Addition of L-Asp accelerated all step retreats at [ L-Asp]0.01 M, L-Asp inhibited the retreats of obtuse steps and [0 1 0] step, although the retreat velocities of acute steps were constant irrespective of [ L-Asp]. These results suggest that the directional changes and the inhibition of retreat velocities of obtuse steps were attributed to the generation of [ 4 1 1] and [4 5 1] steps caused by L-Asp. Moreover, we confirmed the preferential effects of L-Asp on the [4 8 1] + to [ 4 4 1] ± step edge, and proposed the preferential effects of L-Asp on the [ 4 1 1] to [4 5 1] step edge.

  14. Effect of hydrofluoric acid concentration on the evolution of photoluminescence characteristics in porous silicon nanowires prepared by Ag-assisted electroless etching method

    Najar, Adel

    2012-01-01

    We report on the structural and optical properties of porous silicon nanowires (PSiNWs) fabricated using silver (Ag) ions assisted electroless etching method. Silicon nanocrystallites with sizes <5 nm embedded in amorphous silica have been observed from PSiNW samples etched using the optimum hydrofluoric acid (HF) concentration. The strongest photoluminescence (PL) signal has been measured from samples etched with 4.8 M of HF, beyond which a significant decreasing in PL emission intensity has been observed. A qualitative model is proposed for the formation of PSiNWs in the presence of Ag catalyst. This model affirms our observations in PL enhancement for samples etched using HF <4.8 M and the eventual PL reduction for samples etched beyond 4.8 M of HF concentration. The enhancement in PL signals has been associated to the formation of PSiNWs and the quantum confinement effect in the Si nanocrystallites. Compared to PSiNWs without Si-O x, the HF treated samples exhibited significant blue PL peak shift of 100 nm. This effect has been correlated to the formation of defect states in the surface oxide. PSiNWs fabricated using the electroless etching method can find useful applications in optical sensors and as anti-reflection layer in silicon-based solar cells. © 2012 American Institute of Physics.

  15. Comparison of shear bond strength and surface structure between conventional acid etching and air-abrasion of human enamel.

    Olsen, M E; Bishara, S E; Damon, P; Jakobsen, J R

    1997-11-01

    Recently, air-abrasion technology has been examined for potential applications within dentistry, including the field of orthodontics. The purpose of this study was to compare the traditional acid-etch technique with an air-abrasion surface preparation technique, with two different sizes of abrading particles. The following parameters were evaluated: (a) shear bond strength, (b) bond failure location, and (c) enamel surface preparation, as viewed through a scanning electron microscope. Sixty extracted human third molars were pumiced and divided into three groups of 20. The first group was etched with a 37% phosphoric acid gel for 30 seconds, rinsed for 30 seconds, and dried for 20 seconds. The second and third groups were air-abraded with (a) a 50 microm particle and (b) a 90 microm particle of aluminum oxide, with the Micro-etcher microabrasion machine (Danville Engineering Inc.). All three groups had molar stainless steel orthodontic brackets bonded to the buccal surface of each tooth with Transbond XT bonding system (3M Unitek). A Zwick Universal Testing Machine (Calitek Corp.) was used to determine shear bond strengths. The analysis of variance was used to compare the three groups. The Adhesive Remnant Index (ARI) was used to evaluate the residual adhesive on the enamel after bracket removal. The chi square test was used to evaluate differences in the ARI scores among the groups. The significance for all tests was predetermined at p shear bond strength among the three groups (p = 0.0001). The Duncan Multiple Range test showed a significant decrease in shear bond strength in the air-abraded groups. The chi square test revealed significant differences among the ARI scores of the acid-etched group and the air-abraded groups (chi(2) = 0.0001), indicating no adhesive remained on the enamel surface after debonding when air-abrasion was used. In conclusion, the current findings indicate that enamel surface preparation using air-abrasion results in a significant lower

  16. UV-induced graft polymerization of acrylic acid in the sub-micronchannels of oxidized PET track-etched membrane

    Korolkov, Ilya V.; Mashentseva, Anastassiya A. [The L.N. Gumilyov Eurasian National University, Satpayev str., 2, 010008 Astana (Kazakhstan); Institute of Nuclear Physics Republic of Kazakhstan, 050032, Ibragimov str., 1, Almaty (Kazakhstan); Güven, Olgun [Department of Chemistry, Hacettepe University, 06800 Beytepe, Ankara (Turkey); Taltenov, Abzal A. [The L.N. Gumilyov Eurasian National University, Satpayev str., 2, 010008 Astana (Kazakhstan)

    2015-12-15

    In this article, we report on functionalization of track-etched membrane based on poly(ethylene terephthalate) (PET TeMs) oxidized by advanced oxidation systems and by grafting of acrylic acid using photochemical initiation technique for the purpose of increasing functionality thus expanding its practical application. Among advanced oxidation processes (H{sub 2}O{sub 2}/UV) system had been chosen to introduce maximum concentration of carboxylic acid groups. Benzophenone (BP) photo-initiator was first immobilized on the surfaces of cylindrical pores which were later filled with aq. acrylic acid solution. UV-irradiation from both sides of PET TeMs has led to the formation of grafted poly(acrylic acid) (PAA) chains inside the membrane sub-micronchannels. Effect of oxygen-rich surface of PET TeMs on BP adsorption and subsequent process of photo-induced graft polymerization of acrylic acid (AA) were studied by ESR. The surface of oxidized and AA grafted PET TeMs was characterized by UV–vis, ATR-FTIR, XPS spectroscopies and by SEM.

  17. An In Vitro Comparison of the Bond Strength of Composite to Superficial and Deep Dentin, Treated With Er:YAG Laser Irradiation or Acid-Etching

    Alaghehmand, Homayoon; Nezhad Nasrollah, Fatemeh; Nokhbatolfoghahaei, Hanieh; Fekrazad, Reza

    2016-01-01

    Introduction: The aim of this study was to compare the micro-shear bond strength of composite resin on superficial and deep dentin after conditioning with phosphoric acid and Erbium-Doped Yttrium Aluminum Garnet (Er:YAG) laser. Methods: Thirty human molars were selected, roots were removed and crowns were bisected to provide a total of 60 half-crowns. Specimens were ground to expose superficial and deep dentin. Samples were assigned to six groups: (1) AS (acid etching of superficial dentin); (2) AD (acid etching of deep dentin); (3) LS (Er:YAG laser irradiation on superficial dentin); (4) LD (Er:YAG laser irradiation on deep dentin); (5) LAS (Er:YAG laser irradiation on superficial dentin followed by acid etching); (6) LAD (Er:YAG laser irradiation on deep dentin followed by acid etching) The adhesive protocol was performed. Samples were thermocycled and micro-shear bond strength was tested to failure. The data were submitted to statistical analysis with one-way analysis of variance (ANOVA) and Tukey post hoc test. Results: The AS group, demonstrated the greatest amount of micro-shear bond strength. Statistical analysis showed a decrease in bond strength in laser-treated groups which was more significant for deep dentin. Conclusion: Preparation of dentin with laser did not improve bonding to superficial and deep dentin. PMID:28144437

  18. Redox buffered hydrofluoric acid etchant for the reduction of galvanic attack during release etching of MEMS devices having noble material films

    Hankins, Matthew G.

    2009-10-06

    Etchant solutions comprising a redox buffer can be used during the release etch step to reduce damage to the structural layers of a MEMS device that has noble material films. A preferred redox buffer comprises a soluble thiophosphoric acid, ester, or salt that maintains the electrochemical potential of the etchant solution at a level that prevents oxidation of the structural material. Therefore, the redox buffer preferentially oxidizes in place of the structural material. The sacrificial redox buffer thereby protects the exposed structural layers while permitting the dissolution of sacrificial oxide layers during the release etch.

  19. Micro-shear bond strength and surface micromorphology of a feldspathic ceramic treated with different cleaning methods after hydrofluoric acid etching

    Henrique Caballero STEINHAUSER

    2014-04-01

    Full Text Available Objective: The aim of this study was to evaluate the effect of feldspathic ceramic surface cleaning on micro-shear bond strength and ceramic surface morphology. Material and Methods: Forty discs of feldspathic ceramic were prepared and etched with 10% hydrofluoric acid for 2 minutes. The discs were randomly distributed into five groups (n=8: C: no treatment, S: water spray + air drying for 1 minute, US: immersion in ultrasonic bath for 5 minutes, F: etching with 37% phosphoric acid for 1 minute, followed by 1-minute rinse, F+US: etching with 37% phosphoric acid for 1 minute, 1-minute rinse and ultrasonic bath for 5 minutes. Composite cylinders were bonded to the discs following application of silane and hydrophobic adhesive for micro-shear bond strength testing in a universal testing machine at 0.5 mm/min crosshead speed until failure. Stereomicroscopy was used to classify failure type. Surface micromorphology of each treatment type was evaluated by scanning electron microscopy at 500 and 2,500 times magnification. Results: One-way ANOVA test showed no significant difference between treatments (p=0.3197 and the most common failure types were cohesive resin cohesion followed by adhesive failure. Micro-shear bond strength of the feldspathic ceramic substrate to the adhesive system was not influenced by the different surface cleaning techniques. Absence of or less residue was observed after etching with hydrofluoric acid for the groups US and F+US. Conclusions: Combining ceramic cleaning techniques with hydrofluoric acid etching did not affect ceramic bond strength, whereas, when cleaning was associated with ultrasound, less residue was observed.

  20. Effect of self-etching primer vs phosphoric acid etchant on bonding to bur-prepared dentin.

    Ogata, M; Harada, N; Yamaguchi, S; Nakajima, M; Tagami, J

    2002-01-01

    This study evaluated the effect of dentin conditioner on tensile bond strength to dentin prepared with different types of burs. A self-etching primer system, Mac-Bond II (MB, Tokuyama Dental) and a phosphoric acid etching system, Single Bond (SB, 3M) were used for conditioning. Twenty-four extracted intact human molars were ground flat to expose occlusal dentin. After the dentin surfaces were polished with #600 SiC paper, the teeth were randomly divided into a control group and three experimental groups according to the bur grits used: #600 SiC paper only as the control, fine cut steel bur (SB600), crosscut steel bur (SB703) and regular grit diamond bur (DB) mounted in a dental handpiece utilizing water cooling. The dentin surfaces were treated with one of two adhesive systems, then composite buildups were done with Clearfil AP-X (Kuraray Medical). After soaking the bond specimens for 24 hours in 37 degrees C water, multiple vertical serial sections (0.7 mm thick, 7-8 slices per one tooth) were made, trimmed to form an hour-glass shape with a 1.0 mm2 cross-section and tensile bond strengths were determined at a crosshead speed of 1 mm/minute. Statistical analysis was made using one and two-way ANOVA and Fisher's PLSD test (pbond strength (TBS) among the groups that received bur preparation, and there were no statistical differences among SB600, SB703 and the control. For SB, the TBS of SB703 was the highest, and there were no statistical differences among the other groups and the control. The influence of the method used to prepare dentin for micro-tensile bond strength testing was dependent on the adhesive system used.

  1. Correlation between ISQ and Insertion Torque values using double acid-etched implants

    Sebastián Gallardo

    2016-12-01

    Full Text Available Aim The purpose of this study was threefold: (1 to consider whether there was a correlation between stability quotient values (ISQ and insertion torque values (IT at implant placement (2; to determine which of these values were more related to success or failure; and (3 to determine the influence of bone type and implant length, diameter and shape in the study results. Materials and methods A retrospective clinical study was carried out between June 2012 and June 2014. The insertion torque and resonance frequency values of 279 double achid etched implants (Osseotite, Biomet 3i, Implant Innovations Inc., Palm Beach Gardens, USA, with conical and parallel walls, and of different diameters and lengths, were tested at the moment of insertion in 90 patients of different age (18-82 years of age/ average: 60.89 years and of both genders (58 females and 32 males. Collected data were processed and subjected to statistical analysis. Results The mean ISQ value was 70.54, showing no statistical significance between successful and unsuccessful implants. The mean IT value was 44.18. In this case, the values obtained showed a difference between successful and unsuccessful implants, yet not statistically significant (p> 0.05. However, statistically significant differences were found in relation to bone type, shape and length of the implants in IT as well as ISQ values. In the former case (IT values, the differences were only related to diameter. Conclusion There was a correlation between ISQ and IT values; with no significant difference concerning success or failure. The variables analyzed showed statistical differences, except for diameter, which was only significant for IT.

  2. Comparison of Shear Bond Strength of Orthodontic Brackets Bonded to Enamel Prepared By Er:YAG Laser and Conven-tional Acid-Etching

    M.H. Hosseini

    2012-01-01

    Full Text Available Introduction: The purpose of this study was to compare shear bond strength (SBS of orthodontic brackets bonded to enamel prepared by Er:YAG laser with two different powers and conventional acid-etching.Materials and Methods: Forty-five human premolars extracted for orthodontic purposes were randomly assigned to three groups based on conditioning method: Group 1- conventional etching with 37% phosphoric acid; Group 2- irradiation with Er:YAG laser at 1 W; and Group 3- irradiation with Er:YAG laser at 1.5 W. Metal brackets were bonded on prepared enamel using a light-cured composite. All groups were subjected to thermocycling process. Then, the specimens mounted in auto-cure acryle and shear bond strength were measured using a universal testing machine with a crosshead speed of 0.5 mm per second. After debonding, the amount of resin remaining on the teeth was determined using the adhesive remnant index (ARI scored 1 to 5. One-way analysis of variance was used to compare shear bond strengths and the Kruskal-Wallis test was performed to evaluate differences in the ARI for different etching types.Results: The mean and standard deviation of conventional acid-etch group, 1W laser group and 1.5W laser group was 3.82 ± 1.16, 6.97 ± 3.64 and 6.93 ± 4.87, respectively.Conclusion: The mean SBS obtained with an Er:YAG laser operated at 1W or 1.5W is approximately similar to that of conventional etching. However, the high variability of values in bond strength of irradiated enamel should be considered to find the appropriate parameters for applying Er:YAG laser as a favorable alternative for surface conditioning.

  3. Correlation of film density and wet etch rate in hydrofluoric acid of plasma enhanced atomic layer deposited silicon nitride

    Provine, J.; Schindler, Peter; Kim, Yongmin; Walch, Steve P.; Kim, Hyo Jin; Kim, Ki-Hyun; Prinz, Fritz B.

    2016-06-01

    The continued scaling in transistors and memory elements has necessitated the development of atomic layer deposition (ALD) of silicon nitride (SiNx), particularly for use a low k dielectric spacer. One of the key material properties needed for SiNx films is a low wet etch rate (WER) in hydrofluoric (HF) acid. In this work, we report on the evaluation of multiple precursors for plasma enhanced atomic layer deposition (PEALD) of SiNx and evaluate the film's WER in 100:1 dilutions of HF in H2O. The remote plasma capability available in PEALD, enabled controlling the density of the SiNx film. Namely, prolonged plasma exposure made films denser which corresponded to lower WER in a systematic fashion. We determined that there is a strong correlation between WER and the density of the film that extends across multiple precursors, PEALD reactors, and a variety of process conditions. Limiting all steps in the deposition to a maximum temperature of 350 °C, it was shown to be possible to achieve a WER in PEALD SiNx of 6.1 Å/min, which is similar to WER of SiNx from LPCVD reactions at 850 °C.

  4. Correlation of film density and wet etch rate in hydrofluoric acid of plasma enhanced atomic layer deposited silicon nitride

    J. Provine

    2016-06-01

    Full Text Available The continued scaling in transistors and memory elements has necessitated the development of atomic layer deposition (ALD of silicon nitride (SiNx, particularly for use a low k dielectric spacer. One of the key material properties needed for SiNx films is a low wet etch rate (WER in hydrofluoric (HF acid. In this work, we report on the evaluation of multiple precursors for plasma enhanced atomic layer deposition (PEALD of SiNx and evaluate the film’s WER in 100:1 dilutions of HF in H2O. The remote plasma capability available in PEALD, enabled controlling the density of the SiNx film. Namely, prolonged plasma exposure made films denser which corresponded to lower WER in a systematic fashion. We determined that there is a strong correlation between WER and the density of the film that extends across multiple precursors, PEALD reactors, and a variety of process conditions. Limiting all steps in the deposition to a maximum temperature of 350 °C, it was shown to be possible to achieve a WER in PEALD SiNx of 6.1 Å/min, which is similar to WER of SiNx from LPCVD reactions at 850 °C.

  5. Discovery of Naturally Etched Fission Tracks and Alpha-Recoil Tracks in Submarine Glasses: Reevaluation of a Putative Biosignature for Earth and Mars

    Jason E. French

    2016-01-01

    Full Text Available Over the last two decades, conspicuously “biogenic-looking” corrosion microtextures have been found to occur globally within volcanic glass of the in situ oceanic crust, ophiolites, and greenstone belts dating back to ~3.5 Ga. These so-called “tubular” and “granular” microtextures are widely interpreted to represent bona fide microbial trace fossils; however, possible nonbiological origins for these complex alteration microtextures have yet to be explored. Here, we reevaluate the origin of these enigmatic microtextures from a strictly nonbiological standpoint, using a case study on submarine glasses from the western North Atlantic Ocean (DSDP 418A. By combining petrographic and SEM observations of corrosion microtextures at the glass-palagonite interface, considerations of the tectonic setting, measurement of U and Th concentrations of fresh basaltic glass by ICP-MS, and theoretical modelling of the present-day distribution of radiation damage in basaltic glass caused by radioactive decay of U and Th, we reinterpret these enigmatic microtextures as the end product of the preferential corrosion/dissolution of radiation damage (alpha-recoil tracks and fission tracks in the glass by seawater, possibly combined with pressure solution etch-tunnelling. Our findings have important implications for geomicrobiology, astrobiological exploration of Mars, and understanding of the long-term breakdown of nuclear waste glass.

  6. Prospective clinical evaluation of 273 modified acid-etched dental implants: 1- to 5- year results

    Michele De Franco

    2012-03-01

    Full Text Available Aim: The aim of this study was to evaluate the implant survival and the implant-crown success of implants with surface treated with organic acids. Materials and methods: A total of 273 implants (Implus®, Leader-Novaxa, Milan, Italy were inserted in 63 patients, from June 2006 to June 2010, in a single clinical centre. In each annual follow up session, clinical, radiographic and prosthetic parameters were evaluated. The implant-crown success criteria included the absence of pain, suppuration and clinical mobility, a distance between the implant shoulder and the first visible bone contact (DIB <2.0 mm from the surgery and the absence of prosthetic complications at the implantabutment interface. Prosthetic restorations were 32 fixed partial prostheses, 48 single crowns and 16 fixed full arches. Results: The cumulative survival rate was 95.70% (93.81 maxilla, 98.24% mandible. Among the surviving implants, the implant-crown success was 96.07%. At the 5-year control, the mean DIB was 1.2 mm (± 0.5. Conclusion: Implants with surface treated with organic acids seem to represent a good solution for the prosthetic rehabilitation of partially and completely edentulous patients.

  7. Effect of an Indirect Composite Resin Surface Treatment with Two Types of Lasers: Nd: YAG, Er:YAG and Acid Etching on the Microshear Bond Strength of a Resin Cement

    2014-01-01

    Introduction: In order to increase the bonding strength of the composite resin cements to the indirect composites, experiments such as the creation of surface roughness with sandblasting, acid-etching, silane application, laser, etc. have been carried out. However, there is no consensus about the results. Therefore, the purpose of this study was to investigate the effect of Er: YAG and Nd: YAG lasers and acid etching on microshear bond strength of an indirect composite resin. Methods: Aft...

  8. Modulated regeneration of acid-etched human tooth enamel by a functionalized dendrimer that is an analog of amelogenin.

    Chen, Mei; Yang, Jiaojiao; Li, Jiyao; Liang, Kunneng; He, Libang; Lin, Zaifu; Chen, Xingyu; Ren, Xiaokang; Li, Jianshu

    2014-10-01

    In the bioinspired repair process of tooth enamel, it is important to simultaneously mimic the organic-matrix-induced biomineralization and increase the binding strength at the remineralization interface. In this work, a fourth-generation polyamidoamine dendrimer (PAMAM) is modified by dimethyl phosphate to obtain phosphate-terminated dendrimer (PAMAM-PO3H2) since it has a similar dimensional scale and peripheral functionalities to that of amelogenin, which plays important role in the natural development process of enamel. Its phosphate group has stronger affinity for calcium ion than carboxyl group and can simultaneously provide strong hydroxyapatite (HA)-binding capability. The MTT assay demonstrates the low cytotoxicity of PAMAM-PO3H2. Adsorption tests indicate that PAMAM-PO3H2 can be tightly adsorbed on the human tooth enamel. Scanning electron microscopy and X-ray diffraction are used to analyze the remineralization process. After being incubated in artificial saliva for 3weeks, there is a newly generated HA layer of 11.23μm thickness on the acid-etched tooth enamel treated by PAMAM-PO3H2, while the thickness for the carboxyl-terminated one (PAMAM-COOH) is only 6.02μm. PAMAM-PO3H2 can regulate the remineralization process to form ordered new crystals oriented along the Z-axis and produce an enamel prism-like structure that is similar to that of natural tooth enamel. The animal experiment also demonstrates that PAMAM-PO3H2 can induce significant HA regeneration in the oral cavity of rats. Thus PAMAM-PO3H2 shows great potential as a biomimetic restorative material for human tooth enamel.

  9. Micro-PIXE and micro-RBS characterization of micropores in porous silicon prepared using microwave-assisted hydrofluoric acid etching.

    Ahmad, Muthanna; Grime, Geoffrey W

    2013-04-01

    Porous silicon (PS) has been prepared using a microwave-assisted hydrofluoric acid (HF) etching method from a silicon wafer pre-implanted with 5 MeV Cu ions. The use of microbeam proton-induced X-ray emission (micro-PIXE) and microbeam Rutherford backscattering techniques reveals for the first time the capability of these techniques for studying the formation of micropores. The porous structures observed from micro-PIXE imaging results are compared to scanning electron microscope images. It was observed that the implanted copper accumulates in the same location as the pores and that at high implanted dose the pores form large-scale patterns of lines and concentric circles. This is the first work demonstrating the use of microwave-assisted HF etching in the formation of PS.

  10. Plasma-Enhanced Atomic Layer Deposition of SiN-AlN Composites for Ultra Low Wet Etch Rates in Hydrofluoric Acid.

    Kim, Yongmin; Provine, J; Walch, Stephen P; Park, Joonsuk; Phuthong, Witchukorn; Dadlani, Anup L; Kim, Hyo-Jin; Schindler, Peter; Kim, Kihyun; Prinz, Fritz B

    2016-07-13

    The continued scaling in transistors and memory elements has necessitated the development of atomic layer deposited (ALD) of hydrofluoric acid (HF) etch resistant and electrically insulating films for sidewall spacer processing. Silicon nitride (SiN) has been the prototypical material for this need and extensive work has been conducted into realizing sufficiently lower wet etch rates (WERs) as well as leakage currents to meet industry needs. In this work, we report on the development of plasma-enhanced atomic layer deposition (PEALD) composites of SiN and AlN to minimize WER and leakage current density. In particular, the role of aluminum and the optimum amount of Al contained in the composite structures have been explored. Films with near zero WER in dilute HF and leakage currents density similar to pure PEALD SiN films could be simultaneously realized through composites which incorporate ≥13 at. % Al, with a maximum thermal budget of 350 °C.

  11. Marginal microleakage in vitro study on class V cavities prepared with Er:YAG laser and etched with acid or etched with Er:YAG laser and acid; Estudo in vitro da microinfiltracao marginal em cavidades classe V preparadas com laser de Er:YAG e condicionadas com acido ou com laser de Er:YAG e acido

    Tavares, Henrique Dutra Simoes

    2001-07-01

    Microleakage at the interface between the teeth and the restorative materials remains a problem with composite resin restorations. Microleakage at the gingival margins of class V cavities restorations still challenge as they are usually placed in dentin and/or cementum. Previous studies have shown that the cavity preparation with Er:YAG laser is possible. It has been reported that Er:YAG laser has ability to create irregular surface providing micromechanical retention for adhesive dental restorative materials and to improve marginal sealing. The purpose of this in vitro study was to evaluate the marginal microleakage on class V cavities prepared with Er:YAG laser and etched with acid or with Er:YAG laser and acid, in compared to those prepared and etched conventionally. Thirty human molars were divided into three groups, namely: group I - prepared with Er:YAG laser (KaVo KEY Laser II - Germany) and etched with 37% phosphoric acid; group II - prepared with Er:YAG laser and etched with Er:YAG laser and 37% phosphoric acid; group III (control group) - prepared with high speed drill and etched with 37% phosphoric acid. All cavities were treated with same adhesive system (Single Bond - 3M) and restored with the composite resin (Z100 - 3M), according to the manufacturer's instructions. The specimens were stored at 37 deg C in water for 24 hours, polished with Sof-Lex discs (3M), thermally stressed, sealed with a nail polish coating except for the area of the restoration and 1 mm around it, and immersed in a 50% aqueous solution of silver nitrate for 24 hours. After that, the specimens were rinsed in water, soaked in a photodeveloping solution and exposed to a fluorescent light for 8 hours. The teeth were embedded in an autopolymerizing resin and sectioned longitudinally using a diamond saw microtome under running water. The sections were photographed. The microleakage at the occlusal cavity and at the gingival margins of each specimen was evaluated with scores (0

  12. EBSD analysis of the microtexture of Ba-hexaferrite samples

    Koblischka-Veneva, A.; Koblischka, M. R.; Schmauch, J.; Chen, Y.; Harris, V. G.

    2010-01-01

    The microtexture of differently prepared Ba-hexaferrite samples is investigated by means of electron backscatter diffraction (EBSD). Kikuchi patterns are obtained with a high image quality, enabling a spatial resolution of the EBSD maps of about 20 nm. The spatially highly resolved EBSD mappings provide additional information (individual grain orientation, misorientation angles, grain size distribution) as compared to the standard analysis techniques, which can contribute to an optimization of the growth process. Furthermore, as the crystallographic orientation of each grain is known, an exact analysis of the grain aspect ratio becomes possible which provides further insight to the microstructural dependence of the magnetic properties of ferrites.

  13. Laser microtexturing of implant surfaces for enhanced tissue integration

    Ricci, J.L. [Univ. of Medicine and Dentistry of New Jersey, Newark, NJ (United States). Dept. of Orthodontics; Alexander, H. [Orthogen Corp., Springfield, NJ (United States)

    2001-07-01

    The success or failure of bone and soft tissue-fixed medical devices, such as dental and orthopaedic implants, depends on a complex combination of biological and mechanical factors. These factors are intimately associated with the interface between the implant surface and the surrounding tissue, and are largely determined by the composition, surface chemistry, and surface microgeometry of the implant. The relative contributions of these factors are difficult to assess. This study addresses the contribution of surface microtexture, on a controlled level, to tissue integration. (orig.)

  14. Optical investigation of the intergrowth structure and accessibility of Brønsted acid sites in etched SSZ-13 zeolite crystals by confocal fluorescence microscopy.

    Sommer, Linn; Svelle, Stian; Lillerud, Karl Petter; Stöcker, Michael; Weckhuysen, Bert M; Olsbye, Unni

    2010-11-02

    Template decomposition followed by confocal fluorescence microscopy reveals a tetragonal-pyramidal intergrowth of subunits in micrometer-sized nearly cubic SSZ-13 zeolite crystals. In order to accentuate intergrowth boundaries and defect-rich areas within the individual large zeolite crystals, a treatment with an etching NaOH solution is applied. The defective areas are visualized by monitoring the spatial distribution of fluorescent tracer molecules within the individual SSZ-13 crystals by confocal fluorescence microscopy. These fluorescent tracer molecules are formed at the inner and outer crystal surfaces by utilizing the catalytic activity of the zeolite in the oligomerization reaction of styrene derivatives. This approach reveals various types of etching patterns that are an indication for the defectiveness of the studied crystals. We can show that specially one type of crystals, denoted as core-shell type, is highly accessible to the styrene molecules after etching. Despite the large crystal dimensions, the whole core-shell type SSZ-13 crystal is utilized for catalytic reaction. Furthermore, the confocal fluorescence microscopy measurements indicate a nonuniform distribution of the catalytically important Brønsted acid sites underlining the importance of space-resolved measurements.

  15. Effect of acid vapor etching on morphological and opto-electric properties of flat silicon and silicon nanowire arrays: A comparative study

    Amri, Chohdi; Ouertani, Rachid; Hamdi, Abderrahmen; Ezzaouia, Hatem

    2016-03-01

    In this paper, we report a comparative study between porous silicon (pSi) and porous silicon nanowires (pSiNWs). Acid Vapor Etching (AVE) treatment has been used to perform porous structure on flat Si and SiNWs array substrates respectively. SiNW structure is prepared by the widely used Silver catalyzed etching method. SEM and TEM images show that AVE treatment induces porous structure in the whole Si wafer and the SiNW sidewall. Comparatively to pSi, pSiNWs exhibit a low reflectivity in the whole spectral range which decreases with etching duration. However, the reflectivity of pSi changes with porous layer thickness. Both pSi and pSiNWs exhibit a significant PL peak situated at 2 eV. PL peaks are attributed to the quantum confinement effect in the silicon nanocrystallites (SiNCs). We discussed the significant enhancement in the peak intensities and a shift toward lower energy displayed in Raman spectra for both pSi and pSiNWs. We reported a correlative study of the AVE treatment effect on the minority carrier life time of flat silicon and SiNW arrays with the passivation effect of chemical induced silicon oxides highlighted by FTIR spectra.

  16. Effect of erbium-doped: yttrium, aluminium and garnet laser irradiation on the surface microstructure and roughness of sand-blasted, large grit, acid-etched implants

    2011-01-01

    Purpose The present study was performed to evaluate the effect of erbium-doped: yttrium, aluminium and garnet (Er:YAG) laser irradiation on sand-blasted, large grit, acid-etched (SLA) implant surface microstructure according to varying energy levels and application times of the laser. Methods The implant surface was irradiated by the Er:YAG laser under combined conditions of 100, 140, or 180 mJ/pulse and an application time of 1 minute, 1.5 minutes, or 2 minutes. Scanning electron microscopy ...

  17. Quantificational Etching of AAO Template

    Guojun SONG; Dong CHEN; Zhi PENG; Xilin SHE; Jianjiang LI; Ping HAN

    2007-01-01

    Ni nanowires were prepared by electrodeposition in porous anodized aluminum oxide (AAO) template from a composite electrolyte solution. Well-ordered Ni nanowire arrays with controllable length were then made by the partial removal of AAO using a mixture of phosphoric acid and chromic acid (6 wt pct H3PO4:1.8 wt pct H3CrO4). The images of Ni nanowire arrays were studied by scanning electron microscopy (SEM) to determine the relationship between etching time and the length of Ni nanowire arrays. The results indicate that the length of nanowires exposed from the template can be accurately controlled by controlling etching time.

  18. Morphology of resin-dentin interfaces after Er,Cr:YSGG laser and acid etching preparation and application of different bonding systems.

    Beer, Franziska; Buchmair, Alfred; Körpert, Wolfram; Marvastian, Leila; Wernisch, Johann; Moritz, Andreas

    2012-07-01

    The goal of this study was to show the modifications in the ultrastructure of the dentin surface morphology following different surface treatments. The stability of the adhesive compound with dentin after laser preparation compared with conventional preparation using different bonding agents was evaluated. An Er,Cr:YSGG laser and 36% phosphoric acid in combination with various bonding systems were used. A total of 100 caries-free human third molars were used in this study. Immediately after surgical removal teeth were cut using a band saw and 1-mm thick dentin slices were created starting at a distance of 4 mm from the cusp plane to ensure complete removal of the enamel. The discs were polished with silicon carbide paper into rectangular shapes to a size of 6 × 4 mm (±0,2 mm).The discs as well as the remaining teeth stumps were stored in 0.9% NaCl at room temperature. The specimens were divided into three main groups (group I laser group, group II etch group, group III laser and etch group) and each group was subdivided into three subgroups which were allocated to the different bonding systems (subgroup A Excite, subgroup B Scotchbond, subgroup C Syntac). Each disc and the corresponding tooth stump were treated in the same way. After preparation the bonding composite material was applied according to the manufacturers' guidelines in a hollow tube of 2 mm diameter to the disc as well as to the corresponding tooth stump. Shear bond strength testing and environmental scanning electron microscopy were used to assess the morphology and stability of the resin-dentin interface. The self-etching bonding system showed the highest and the most constant shear values in all three main groups, thus enabling etching with phosphoric acid after laser preparation to be avoided. Thus we conclude that laser preparation creates a surface texture that allows prediction of the quality of the restoration without the risk of negative influences during the following treatment steps. This

  19. Plasma-nitriding assisted micro-texturing into stainless steel molds

    Aizawa Tatsuhiko

    2015-01-01

    Full Text Available Micro-texturing has grown up to be one of the most promising procedures. This related application required for large-area, fine micro-texturing onto the stainless steel mold materials. A new method other than laser-machining, micro-milling or micro-EDM was awaited for further advancement of this micro-texturing. In the present paper, a plasma nitriding assisted micro-texturing was developed to make various kinds of micro-patterns onto the martensitic stainless steels. First, original patterns were printed onto the surface of substrate by using the ink-jet printer. Then, the masked substrate was subjected to high density plasma nitriding; the un-masked surfaces were nitrided to have higher hardness. This nitrided substrate was further treated by sand-blasting to selectively dig the soft, masked surfaces. Finally, the micro-patterned martensitic stainless steel substrate was fabricated as a mold to duplicate these micro-patterns onto the work materials. The spatial resolution and depth profile controllability of this plasma nitriding assisted micro-texturing was investigated for variety of initial micro-patterns. The original size and dimension of initial micro-patterns were precisely compared with the three dimensional geometry of micro-textures after blasting treatment. The plastic cover case for smart cellular phones was employed to demonstrate how useful this processing is in practice.

  20. Copper-assisted, anti-reflection etching of silicon surfaces

    Toor, Fatima; Branz, Howard

    2014-08-26

    A method (300) for etching a silicon surface (116) to reduce reflectivity. The method (300) includes electroless deposition of copper nanoparticles about 20 nanometers in size on the silicon surface (116), with a particle-to-particle spacing of 3 to 8 nanometers. The method (300) includes positioning (310) the substrate (112) with a silicon surface (116) into a vessel (122). The vessel (122) is filled (340) with a volume of an etching solution (124) so as to cover the silicon surface (116). The etching solution (124) includes an oxidant-etchant solution (146), e.g., an aqueous solution of hydrofluoric acid and hydrogen peroxide. The silicon surface (116) is etched (350) by agitating the etching solution (124) with, for example, ultrasonic agitation, and the etching may include heating (360) the etching solution (124) and directing light (365) onto the silicon surface (116). During the etching, copper nanoparticles enhance or drive the etching process.

  1. Effect of cavity preparation method on microtensile bond strength of a self-etching primer vs phosphoric acid etchant to enamel.

    de Souza-Zaroni, Wanessa Christine; Delfino, Carina Sinclér; Ciccone-Nogueira, Juliane Cristina; Palma-Dibb, Regina Guenka; Corona, Silmara Aparecida Milori

    2007-10-01

    This study evaluated the effect of cavity preparation using air abrasion or carbide bur on bond strength to enamel treated with a self-etching primer (Tyrian SPE) or a phosphoric acid etchant. Twenty-four molars were divided into three groups: high-speed; standard handpiece (ST air abrasion) or supersonic handpiece (SP air abrasion) of the same air-abrasive system. The enamel surfaces were treated with one of the two etchants and the same adhesive agent One Step Plus, and then composite buildups were done with Filtek Z250. After 24 h at 37 degrees C, beams (0.8 mm2) were obtained and subjected to tensile stress in a universal testing machine (0.5 mm/min). The data were submitted to analysis of variance and Tukey's test (P cavity preparation method was dependent on the conditioning system used, only when using carbide-bur preparation technique.

  2. Effect of bulk microstructure of commercially pure titanium on surface characteristics and fatigue properties after surface modification by sand blasting and acid-etching.

    Medvedev, A E; Ng, H P; Lapovok, R; Estrin, Y; Lowe, T C; Anumalasetty, V N

    2016-04-01

    Surface modification techniques are widely used to enhance the biological response to the implant materials. These techniques generally create a roughened surface, effectively increasing the surface area thus promoting cell adhesion. However, a negative side effect is a higher susceptibility of a roughened surface to failure due to the presence of multiple stress concentrators. The purpose of the study reported here was to examine the effects of surface modification by sand blasting and acid-etching (SLA) on the microstructure and fatigue performance of coarse-grained and ultrafine-grained (UFG) commercially pure titanium. Finer grain sizes, produced by equal channel angular pressing, resulted in lower values of surface roughness in SLA-processed material. This effect was associated with greater resistance of the UFG structure to plastic deformation. The fatigue properties of UFG Ti were found to be superior to those of coarse-grained Ti and conventional Ti-6Al-4V, both before and after SLA-treatment.

  3. Etching of Crystalline ZnO Surfaces upon Phosphonic Acid Adsorption: Guidelines for the Realization of Well-Engineered Functional Self-Assembled Monolayers.

    Ostapenko, Alexandra; Klöffel, Tobias; Eußner, Jens; Harms, Klaus; Dehnen, Stefanie; Meyer, Bernd; Witte, Gregor

    2016-06-01

    Functionalization of metal oxides by means of covalently bound self-assembled monolayers (SAMs) offers a tailoring of surface electronic properties such as their work function and, in combination with its large charge carrier mobility, renders ZnO a promising conductive oxide for use as transparent electrode material in optoelectronic devices. In this study, we show that the formation of phosphonic acid-anchored SAMs on ZnO competes with an unwanted chemical side reaction, leading to the formation of surface precipitates and severe surface damage at prolonged immersion times of several days. Combining atomic force microscopy (AFM), X-ray diffraction (XRD), and thermal desorption spectroscopy (TDS), the stability and structure of the aggregates formed upon immersion of ZnO single crystal surfaces of different orientations [(0001̅), (0001), and (101̅0)] in phenylphosphonic acid (PPA) solution were studied. By intentionally increasing the immersion time to more than 1 week, large crystalline precipitates are formed, which are identified as zinc phosphonate. Moreover, the energetics and the reaction pathway of this transformation have been evaluated using density functional theory (DFT), showing that zinc phosphonate is thermodynamically more favorable than phosphonic acid SAMs on ZnO. Precipitation is also found for phosphonic acids with fluorinated aromatic backbones, while less precipitation occurs upon formation of SAMs with phenylphosphinic anchoring units. By contrast, no precipitates are formed when PPA monolayer films are prepared by sublimation under vacuum conditions, yielding smooth surfaces without noticeable etching.

  4. Etch Figure on a Garnet Crystal Formed by Alkaline Reagents and Its Difference from That Formed by Acid Solution%石榴子石晶体碱腐蚀像及其与酸腐蚀像的对比

    刘河清; 赵珊茸; 徐畅; 李坤

    2011-01-01

    In this paper, NaOH-KOH mixture of melt and KOH solution were used to corrode a garnet crystal. The etch figures on faces (or sections) with different crystallographic directions were observed, and a stereographic model of etch figures were established. The difference between the etch figures formed by HF solution and alkaline reagents on the same crystal face or section was also analyzed. It is indicated that both alkaline etching and acid etching can reflect the characteristics of the crystal symmetry. Comparison shows that alkaline etching figure is the same as acid etching figure on { 100 } and {110} , but alkaline etching figure is different from acid etching figure on { 120} , {221}、{ 111} and {211}. The study can be used for the crystallography orientation of garnet group minerals, and it is also be used to reveal the pH geological environment for garnet formation.%本文采用NaOH-KOH混合熔融物和KOH溶液对石榴子石晶体各种不同的结晶学方向的晶面(切面)进行腐蚀实验,建立了石榴子石碱腐蚀像的立体模型,并与酸(HF溶液)腐蚀像模型进行对比.研究发现碱腐蚀像与酸腐蚀像一样能很好的反映晶体的对称特点,并发现在{ 100}、{110}晶面(切面)上碱腐蚀像与酸腐蚀像相同,而在{120}、{221}、{111}、{211}晶面(切面)上,碱腐蚀像与酸腐蚀像不同.该研究可以用来对石榴子石族矿物进行结晶学定向,同时具有揭示矿物所处地质环境酸碱性的指示意义.

  5. Plasma assisted nitriding for micro-texturing onto martensitic stainless steels*

    Katoh Takahisa

    2015-01-01

    Full Text Available Micro-texturing method has grown up to be one of the most promising procedures to form micro-lines, micro-dots and micro-grooves onto the mold-die materials and to duplicate these micro-patterns onto metallic or polymer sheets via stamping or injection molding. This related application requires for large-area, fine micro-texturing onto the martensitic stainless steel mold-die materials. A new method other than laser-machining, micro-milling or micro-EDM is awaited for further advancement of this micro-texturing. In the present paper, a new micro-texturing method is developed on the basis of the plasma assisted nitriding to transform the two-dimensionally designed micro-patterns to the three dimensional micro-textures in the martensitic stainless steels. First, original patterns are printed onto the surface of stainless steel molds by using the dispenser or the ink-jet printer. Then, the masked mold is subjected to high density plasma nitriding; the un-masked surfaces are nitrided to have higher hardness, 1400 Hv than the matrix hardness, 200 Hv of stainless steels. This nitrided mold is further treated by sand-blasting to selectively remove the soft, masked surfaces. Finally, the micro-patterned martensitic stainless steel mold is fabricated as a tool to duplicate these micro-patterns onto the plastic materials by the injection molding.

  6. Microstructural and microtextural analysis of InterPulse GTCAW welds in Cp-Ti and Ti-6Al-4V

    Leary, Rowan K., E-mail: rkl26@cam.ac.uk [Institute for Materials Research, University of Leeds, Leeds LS2 9JT (United Kingdom); Merson, Eleanor [National Metals Technology Centre, Swinden House, Moorgate Road, Rotherham S60 3AR (United Kingdom); Birmingham, Keith; Harvey, David [VBC Group, Castle Business Park, Pavilion Way, Loughborough, Leicestershire LE11 5GW (United Kingdom); Brydson, Rik, E-mail: mtlrmdb@leeds.ac.uk [Institute for Materials Research, University of Leeds, Leeds LS2 9JT (United Kingdom)

    2010-11-15

    Research highlights: {yields} Evaluation of a new low heat input welding technique for titanium alloys. {yields} Demonstration of the potential to tailor weld microstructures and microtextures. {yields} New insight into the mechanisms of microtextural evolution in titanium alloys. {yields} {alpha} Variants sharing a common 112-bar 0 pole are found to cluster into groups. {yields} Direct analysis of the impact of microtexture on mechanical properties. - Abstract: The InterPulse technique is an advanced gas tungsten constricted arc welding (GTCAW) method for controlled heat input welding of titanium alloys. Microstructural and microtextural analysis has been used to show that the technique has the potential to produce high integrity welds in Cp-Ti and Ti-6Al-4V while welding outside of a vacuum chamber and without a trailing gas shield. The arc waveform control provided by the technique is shown to have the potential to tailor weld macrostructures, microstructures and microtextures. At the cooling rates associated with the technique, {alpha}-variants sharing a common (112-bar 0) pole are found to cluster together into groups within prior {beta} grains, leading to large areas where all variants are separated by a misorientation of 60 deg. Characterisation of these microtextures may provide new insight into microtexture-properties relations and the mechanisms of microtextural evolution.

  7. Comparison of alkaline phosphatase activity of MC3T3-E1 cells cultured on different Ti surfaces: modified sandblasted with large grit and acid-etched (MSLA), laser-treated, and laser and acid-treated Ti surfaces

    Li, Lin-Jie; Kim, So-Nam

    2016-01-01

    PURPOSE In this study, the aim of this study was to evaluate the effect of implant surface treatment on cell differentiation of osteoblast cells. For this purpose, three surfaces were compared: (1) a modified SLA (MSLA: sand-blasted with large grit, acid-etched, and immersed in 0.9% NaCl), (2) a laser treatment (LT: laser treatment) titanium surface and (3) a laser and acid-treated (LAT: laser treatment, acid-etched) titanium surface. MATERIALS AND METHODS The MSLA surfaces were considered as the control group, and LT and LAT surfaces as test groups. Alkaline phosphatase expression (ALP) was used to quantify osteoblastic differentiation of MC3T3-E1 cell. Surface roughness was evaluated by a contact profilometer (URFPAK-SV; Mitutoyo, Kawasaki, Japan) and characterized by two parameters: mean roughness (Ra) and maximum peak-to-valley height (Rt). RESULTS Scanning electron microscope revealed that MSLA (control group) surface was not as rough as LT, LAT surface (test groups). Alkaline phosphatase expression, the measure of osteoblastic differentiation, and total ALP expression by surface-adherent cells were found to be highest at 21 days for all three surfaces tested (P.05). CONCLUSION This study suggested that MSLA and LAT surfaces exhibited more favorable environment for osteoblast differentiation when compared with LT surface, the results that are important for implant surface modification studies. PMID:27350860

  8. Effect of pre-etching on sealing ability of two current self-etching adhesives

    K Khosravi

    2005-05-01

    Full Text Available Background: We evaluated the effect of phosphoric acid etching on microleakage of two current self-etching adhesives on enamel margins in comparison to a conventional total- etch system. Methods: Sixty buccal class V cavities were made at the cemento-enamel junction with beveled enamel margins of extracted human premolar teeth and randomly divided into five groups (12 specimens in each group. Group 1 was applying with Clearfil SE bond, Group 2 with 35% phosphoric acid etching of enamel margins plus Clearfil SE bond, Group3 with I bond, Group 4 with 35% phosphoric acid etching of enamel margins plus I bond and Group5 with Scotchbond multi-purpose. All groups restored with a composite resins. After 24 hours storage with 100% humidity, the samples were thermocycled, immersed in a dye solution and sectioned buccoligually and enamel margins microleakage were evaluated on a scale of 0 to 2. Results: The differences between Groups 1 & 3 and Groups 3 & 4 were significant (P<0.05 but no significant differences between Groups1 & 2 or 1 & 5 were observed. Conclusion: The findings suggest that all-in-one adhesive systems need pre-etching enamel margins with phosphoric acid for effectively seal. Key words: Self-Etching Adhesives, Microleakage, Enamel, Total-Etch system

  9. Catalyst-referred etching of silicon

    Hideyuki Hara et al

    2007-01-01

    Full Text Available A Si wafer and polysilicon deposited on a Si wafer were planarized using catalyst-referred etching (CARE. Two apparatuses were produced for local etching and for planarization. The local etching apparatus was used to planarize polysilicon and the planarization apparatus was used to planarize Si wafers. Platinum and hydrofluoric acid were used as the catalytic plate and the source of reactive species, respectively. The processed surfaces were observed by optical interferometry, atomic force microscopy (AFM and scanning electron microscopy (SEM. The results indicate that the CARE-processed surface is flat and undamaged.

  10. State of the art etch-and-rinse adhesives

    Pashley, David H.; Tay, Franklin R.; Breschi, Lorenzo; Tjäderhane, Leo; Carvalho, Ricardo M.; Carrilho, Marcela; Tezvergil-Mutluay, Arzu

    2010-01-01

    Etch-and-rinse adhesive systems are the oldest of the multi-generation evolution of resin bonding systems. In the 3-step version, they involve acid-etching, priming and application of a separate adhesive. Each step can accomplish multiple goals. This review explores the therapeutic opportunities of each separate step. Acid-etching, using 32-37% phosphoric acid (pH 0.1-0.4) not only simultaneously etches enamel and dentin, but the low pH kills many residual bacteria. Some etchants include anti...

  11. Microtextural analysis of quartz grains of tsunami and non-tsunami deposits - A case study from Tirúa (Chile)

    Bellanova, Piero; Bahlburg, Heinrich; Nentwig, Vanessa; Spiske, Michaela

    2016-08-01

    In order to estimate the tsunami hazard it is essential to reliably identify and differentiate tsunami deposits from other high-energy events like storms. Recently, the microtextural analysis of quartz grain surfaces was introduced as a method to differentiate between tsunami and other deposits. Using tsunami deposits sampled from a bank profile of the Tirúa river (central Chile), an area that was significantly affected by the 2010 and 1960 Chile tsunamis, we tested the microtextural analysis method for its capability to identify tsunami deposits. A total of 815 quartz grain surfaces of two tsunami layers, two non-tsunami marsh sediment samples, and three reference samples from nearby beach, dune and river were analyzed using scanning electron microscopy (SEM). We grouped the detected microtexture features into five microtextural families: angularity, fresh surfaces, percussion marks, adhering particles and dissolution features. Both the tsunami deposits and reference samples reveal high numbers of fresh surfaces and percussion marks. Thus, there are no statistically significant differences between tsunami, beach, dune and river deposits in characteristics and abundances in all microtextural families. Our study indicates that the microtextural analysis of quartz grains may not be a suitable method to identify tsunami deposits in Tirúa (Chile), due to local factors such as high numbers of inherited microtextures and the possible effects of the high amount of heavy minerals.

  12. Resistance to fracture of endodontically treated premolars restored with glass ionomer cement or acid etch composite resin: An in vitro study

    B Ranga

    2010-01-01

    Full Text Available Aim: Due to the weakness of endodontically treated posterior teeth requires more strengthened restoration to withstand occlusal forces. The purpose of the present study was to determine and compare the resistance to fracture of endodontically treated maxillary 1 st premolars restored with different materials in mesio-occluso-distal (MOD cavity preparations. Materials and Methods: MOD cavity preparations in 80 endodontically treated maxillary 1 st premolars were restored using four different methods. Fiber rings were filled with stone plaster and the teeth were placed into the plaster up to the level of cemento-enamel junction. The teeth were grouped according to restorative method, mounted in an Instrom T.T. machine, and the buccal walls subjected to a slowly increasing compressive force until fracture occurred. Result: The force of fracture of the walls of each tooth was recorded and the results in the various groups compared. All teeth fractured in a similar manner irrespective of the restorative method used. Conclusion: The resistance to the fracture of the teeth was the same when they were stored with glass ionomer cement as a base over which composite resin was placed. When the entire cavities were filled with glass ionomer cement, the resistance to fracture of the teeth decreased significantly compared with the acid etch resin technique.

  13. Effects of rhBMP-2 on Sandblasted and Acid Etched Titanium Implant Surfaces on Bone Regeneration and Osseointegration: Spilt-Mouth Designed Pilot Study

    Nam-Ho Kim

    2015-01-01

    Full Text Available This study was conducted to evaluate effects of rhBMP-2 applied at different concentrations to sandblasted and acid etched (SLA implants on osseointegration and bone regeneration in a bone defect of beagle dogs as pilot study using split-mouth design. Methods. For experimental groups, SLA implants were coated with different concentrations of rhBMP-2 (0.1, 0.5, and 1 mg/mL. After assessment of surface characteristics and rhBMP-2 releasing profile, the experimental groups and untreated control groups (n = 6 in each group, two animals in each group were placed in split-mouth designed animal models with buccal open defect. At 8 weeks after implant placement, implant stability quotients (ISQ values were recorded and vertical bone height (VBH, mm, bone-to-implant contact ratio (BIC, %, and bone volume (BV, % in the upper 3 mm defect areas were measured. Results. The ISQ values were highest in the 1.0 group. Mean values of VBH (mm, BIC (%, and BV (% were greater in the 0.5 mg/mL and 1.0 mg/mL groups than those in 0.1 and control groups in buccal defect areas. Conclusion. In the open defect area surrounding the SLA implant, coating with 0.5 and 1.0 mg/mL concentrations of rhBMP-2 was more effective, compared with untreated group, in promoting bone regeneration and osseointegration.

  14. Radiation induced deposition of copper nanoparticles inside the nanochannels of poly(acrylic acid)-grafted poly(ethylene terephthalate) track-etched membranes

    Korolkov, Ilya V.; Güven, Olgun; Mashentseva, Anastassiya A.; Atıcı, Ayse Bakar; Gorin, Yevgeniy G.; Zdorovets, Maxim V.; Taltenov, Abzal A.

    2017-01-01

    Poly(ethylene terephthalate) PET, track-etched membranes (TeMs) with 400 nm average pore size were UV-grafted with poly(acrylic acid) (PAA) after oxidation of inner surfaces by H2O2/UV system. Carboxylate groups of grafted PAA chains were easily complexed with Cu2+ ions in aqueous solutions. These ions were converted into metallic copper nanoparticles (NPs) by radiation-induced reduction of copper ions in aqueous-alcohol solution by gamma rays in the dose range of 46-250 kGy. Copper ions chelating with -COOH groups of PAA chains grafted on PET TeMs form polymer-metal ion complex that prevent the formation of agglomerates during reduction of copper ions to metallic nanoparticles. The detailed analysis by X-Ray diffraction technique (XRD), transmission electron microscopy (TEM), scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX) confirmed the deposition of copper nanoparticles with the average size of 70 nm on the inner surface of nanochannels of PET TeMs. Samples were also investigated by FTIR, ESR spectroscopies to follow copper ion reduction.

  15. Early bone response to machined, sandblasting acid etching (SLA) and novel surface-functionalization (SLAffinity) titanium implants: characterization, biomechanical analysis and histological evaluation in pigs.

    Chiang, Hsi-Jen; Hsu, Heng-Jui; Peng, Pei-Wen; Wu, Ching-Zong; Ou, Keng-Liang; Cheng, Han-Yi; Walinski, Christopher J; Sugiatno, Erwan

    2016-02-01

    The purpose of the present study was to examine early tissue response and osseointegration in the animal model. The surface morphologies of SLAffinity were characterized using scanning electron microscopy and atomic force microscopy. The microstructures were examined by X-ray diffraction, and hardness was measured by nanoindentation. Moreover, the safety and toxicity properties were evaluated using computer-aided programs and cell cytotoxicity assays. In the animal model, implants were installed in the mandibular canine-premolar area of 12 miniature pigs. Each pig received three implants: machine, sandblasted, large grit, acid-etched, and SLAffinity-treated implants. The results showed that surface treatment did affect bone-to-implant contact (BIC) significantly. At 3 weeks, the SLAffinity-treated implants were found to present significantly higher BIC values than the untreated implants. The SLAffinity treatments enhanced osseointegration significantly, especially at early stages of bone tissue healing. As described above, the results of the present study demonstrate that the SLAffinity treatment is a reliable surface modification method.

  16. Screening of a model for the distribution of dye in dye-encapsulated silica through the gradual etching of the outermost silica layer using hydrofluoric acid.

    Wi, Rinbok; Lee, Kyoung G; Yoon, Sun Hong; Lee, Sang Geun; Imran, Muhammad; Kim, Do Hyun

    2011-07-01

    Monodispersed spherical silica particles emitting blue light were prepared by incorporating 2,5-bis(5-tert-butyl-2-benzoxazolyl)thiophene (BBOT) into a silica matrix. The morphological and photoluminescent properties were investigated to confirm the proper incorporation of BBOT into the silica matrix, using an electron microscope and a fluorescence spectrometer. Four possible models representing the distribution of the dye molecules in a dye-encapsulated silica particle were proposed. To analyze the distribution of the BBOT dye in the BBOT-encapsulated silica, the fluorescent emission intensity was measured while reducing the particle diameter by etching the outermost silica layer with hydrofluoric acid with 0-0.5 wt.% concentrations. The distribution of BBOT in a silica particle was investigated based on the relationship between the changes in particle diameter and the changes in emission intensity. The emission intensity of the BBOT-encapsulated silica particle oscillated with the decreasing particle diameter. This result supported the multilayered model. Information regarding the distribution of the dye in the silica matrix will provide valuable information for understanding the formation mechanism of dye-encapsulated silica.

  17. Improve the Properties of p-i-n α-Si:H Thin-Film Solar Cells Using the Diluted Hydrochloric Acid-Etched GZO Thin Films

    Fang-Hsing Wang

    2013-01-01

    Full Text Available Gallium-doped zinc oxide (GZO thin films were deposited on glass, and the process parameters are RF power of 50 W and working pressure of 5 mTorr, and the substrate temperature was changed from room temperature to 300°C. At first, the thickness was around 300 nm by controlling the deposition time. The effects of substrate temperature on the crystallinity, lattice constant (c, carrier mobility, carrier concentration, resistivity, and optical transmission rate of the GZO thin films were studied. The 200°C-deposited GZO thin films had the best crystallinity, the larger carrier concentration and carrier mobility, and the lowest resistivity. For that, the thickness of the GZO thin films was extended to around 1000 nm. Hydrochloric (HCl acid solutions with different concentrations (0.1%, 0.2%, and 0.5% were used to etch the surfaces of the GZO thin films, which were then used as the substrate electrodes to fabricate the p-i-n α-Si:H thin-film solar cells. The haze ratio of the GZO thin films increased with increasing HCl concentration, and that would effectively enhance light trapping inside the absorber material of solar cells and then improve the efficiency of the fabricated thin-film solar cells.

  18. Adult stem cells properties in terms of commitment, aging and biological safety of grit-blasted and Acid-etched ti dental implants surfaces.

    Gardin, Chiara; Ferroni, Letizia; Bressan, Eriberto; Calvo-Guirado, José L; Degidi, Marco; Piattelli, Adriano; Zavan, Barbara

    2014-01-01

    Titanium (Ti) is one of the most widely used biomaterials for manufacturing dental implants. The implant surface properties strongly influence osseointegration. The aim of the present study was to in vitro investigate the characteristics of Ti dental implants in terms of mutagenicity, hemocompatibility, biocompatibility, osteoinductivity and biological safety. The Ames test was used to test the mutagenicity of the Ti dental implants, and the hemolysis assay for evaluating their hemocompatibility. Human adipose - derived stem cells (ADSCs) were then seeded onto these implants in order to evaluate their cytotoxicity. Gene expression analyzing with real-time PCR was carried out to investigate the osteoinductivity of the biomaterials. Finally, the genetic stability of the cells cultured onto dental implants was determined by karyotyping. Our results demonstrated that Ti dental implants are not mutagenic, do not cause hemolysis, and are biocompatible. The MTT assay revealed that ADSCs, seeded on Ti dental implants, proliferate up to 30 days in culture. Moreover, ADSCs loaded on Ti dental implants show a substantial expression of some osteoblast specific markers, such as COL1A1, OPN, ALPL, and RUNX2, as well as chromosomal stability after 30 days of culture in a medium without osteogenic factors. In conclusion, the grit-blasted and acid-etched treatment seems to favor the adhesion and proliferation of ADSCs and improve the osteoinductivity of Ti dental implant surfaces.

  19. Er:YAG laser radiation etching of enamel

    Dostalova, Tatjana; Jelinkova, Helena; Krejsa, Otakar; Hamal, Karel; Kubelka, Jiri; Prochazka, Stanislav

    1996-12-01

    This study compares the effects of acid treatment and Er:YAG laser radiation on the enamel. The permanent human molars were used. Oval cavities in the buccal surface were prepared and the edges of cavities were irradiated by Er:YAG radiation. The energy of laser was 105 mJ and repetition rate 1 Hz. The radiation was focused by CaF2 lens and the sample was placed in the focus. Ten samples were etched by 35 percent phosphoric acid during 60 s. Than cavities were filled with composite resin following manufacturers directions. By laser etching the structure enamel in section was rougher. The optimal connection between the enamel and composite resin was achieved in 75 percent by acid etching and in 79.2 percent by Er:YAG laser etching. Er:YAG laser etching could be alternative method for etching of enamel.

  20. 24% Indigenously Prepared Ethylene Diamine Tetra Acetic Acid Compared to Self-Etching Adhesives and their Effect on Shear Bond Strength of Composites in Primary Teeth: An In-vitro Study

    Nagar, Priya; Tandil, Yogesh L.; T.P., Chandru; Gupta, Anamika; Kalaria, Devendra; Kumar, Prafful

    2015-01-01

    Background: Over the years, it has been known that 34% phosphoric acid is the benchmark in etchants with the best shear bond strength shown with composites in primary teeth. However, with latest technological advancements and innovations, in order to reduce the number of steps and less damage to the tooth structure, non-rinse conditioner (NRC) & Single-Etch and various other etchants have been tried and tested. These etchants have been found to have shear bond strength comparable to phosphori...

  1. Regulation of Osteoblast Differentiation by Acid-Etched and/or Grit-Blasted Titanium Substrate Topography Is Enhanced by 1,25(OH)2D3 in a Sex-Dependent Manner.

    Olivares-Navarrete, Rene; Hyzy, Sharon L; Boyan, Barbara D; Schwartz, Zvi

    2015-01-01

    This study assessed contributions of micron-scale topography on clinically relevant titanium (Ti) to differentiation of osteoprogenitor cells and osteoblasts; the interaction of this effect with 1α,25-dihydroxyvitamin D3 (1α,25(OH)2D3); and if the effects are sex-dependent. Male and female rat bone marrow cells (BMCs) were cultured on acid-etched (A, R a = 0.87 μm), grit-blasted (GB, R a = 3.90 μm), or grit-blasted/acid-etched (SLA, R a = 3.22 μm) Ti. BMCs were sensitive to surface topography and underwent osteoblast differentiation. This was greatest on SLA; acid etching and grit blasting contributed additively. Primary osteoblasts were also sensitive to SLA, with less effect from individual structural components, demonstrated by enhanced local factor production. Sex-dependent responses of BMCs to topography varied with parameter whereas male and female osteoblasts responded similarly to surface treatment. 1α,25(OH)2D3 enhanced cell responses on all surfaces similarly. Effects were sex-dependent and male cells grown on a complex microstructured surface were much more sensitive than female cells. These results indicate that effects of the complex SLA topography are greater than acid etching or grit blasting alone on multipotent BMCs and committed osteoblasts and that individual parameters are sex-specific. The effect of 1α,25(OH)2D3 was sex dependent. The results also suggest that levels of 1α,25(OH)2D3 in the patient may be important in osseointegration.

  2. Nanoparticle-based etching of silicon surfaces

    Branz, Howard; Duda, Anna; Ginley, David S.; Yost, Vernon; Meier, Daniel; Ward, James S.

    2011-12-13

    A method (300) of texturing silicon surfaces (116) such to reduce reflectivity of a silicon wafer (110) for use in solar cells. The method (300) includes filling (330, 340) a vessel (122) with a volume of an etching solution (124) so as to cover the silicon surface 116) of a wafer or substrate (112). The etching solution (124) is made up of a catalytic nanomaterial (140) and an oxidant-etchant solution (146). The catalytic nanomaterial (140) may include gold or silver nanoparticles or noble metal nanoparticles, each of which may be a colloidal solution. The oxidant-etchant solution (146) includes an etching agent (142), such as hydrofluoric acid, and an oxidizing agent (144), such as hydrogen peroxide. Etching (350) is performed for a period of time including agitating or stirring the etching solution (124). The etch time may be selected such that the etched silicon surface (116) has a reflectivity of less than about 15 percent such as 1 to 10 percent in a 350 to 1000 nanometer wavelength range.

  3. Plasma etching an introduction

    Manos, Dennis M

    1989-01-01

    Plasma etching plays an essential role in microelectronic circuit manufacturing. Suitable for researchers, process engineers, and graduate students, this book introduces the basic physics and chemistry of electrical discharges and relates them to plasma etching mechanisms. Throughout the volume the authors offer practical examples of process chemistry, equipment design, and production methods.

  4. Improvement of multicrystalline silicon wafer solar cells by post-fabrication wet-chemical etching in phosphoric acid

    A Mefoued; M Fathi; J Bhatt; A Messaoud; B Palahouane; N Benrekaa

    2011-12-01

    In this study, we have improved electrical characteristics such as the efficiency () and the fill factor (FF) of finished multicrystalline silicon (-Si) solar cells by using a new chemical treatment with a hot phosphoric (H3PO4) acidic solution. These -Si solar cells were made by a standard industrial process with screen-printed contacts and a silicon nitride (SiN) antireflection coating. We have deposited SiN thin layer (80 nm) on -type -Si substrate by the mean of plasma enhanced chemical vapour deposition (PECVD) technique. The reactive gases used as precursors inside PECVD chamber are a mixture of silane (SiH4) and ammonia (NH3) at a temperature of 380°C. The developed H3PO4 chemical surface treatment has improved from 5.4 to 7.7% and FF from 50.4 to 70.8%, this means a relative increase of up to 40% from the initial values of and FF. In order to explain these improvements, physical (AFM, EDX), chemical (FTIR) and optical (spectrophotometer) analyses were done.

  5. Surface Microtextures of Slipping Zone Soil of Some Landslides in the Three Gorges Reservoir District and Their Significance

    2000-01-01

    The mineral assemblage and content and surface microtextures of slipping zone soil of several landslides in the Three Gorges Reservoir District have been analyzed using the scanning electron microscope (SEM) and X-ray diffractometer (XRD). All the mineral assemblages are similar in these landslides. The main minerals are montmorillonite, illite, kaolinite, chlorite, quartz and feldspar. There are two kinds of surface microtexture in the slipping zone soil, i.e., linear scratches and arcuate scratches. Based on analyses of the changes of the microtextures, one can obtain information about the number, directions and stages of landslide movements. The authors have also studied the mechanism of landslide formation, evaluated the stability of landslides and revival possibility of ancient landslides and forecasted the activity of similar landslides in different districts. The surface microtexture features of stable landslides and mobile landslides are summarized and it is concluded that the existence of filamentous bacteria may result in or increase movements of landslides.

  6. Chemical etching of deformation sub-structures in quartz

    Wegner, M. W.; Christie, J. M.

    1983-02-01

    Chemical etching of dislocations has been studied in natural and synthetic quartz single crystals, in deformed synthetic quartz and in naturally and experimentally deformed quartzites. The ability of different etchants to produce polished or preferentially etched surfaces on quartz is described. Dislocation etching was achieved on all crystal planes examined by using a saturated solution of ammonium bifluoride as the etchant. Appropriate etching times were determined for etching quartzites for grain size, subgrain boundaries, deformation lamellae, dislocations and twins. Growth and polished surfaces of synthetic single crystal quartz were similarly etched and dislocation etch pits, characteristic of various orientations were found. The use of ammonium bifluoride proved to be expecially advantageous for the basal plane, producing a polished surface with etch pits, suitable for dislocation etch pit counting. “Double” etch pits have been found on Dauphiné twin boundaries on the basal plane and the first order prism, using this etchant. Slip lines and deformation bands were suitably etched on deformed synthetic crystal surfaces for identification of the slip planes. Other acidic etchants have been explored and their application to the study of deformation structures in quartz crystals is discussed.

  7. Etching in microsystem technology

    Kohler, Michael

    2008-01-01

    Microcomponents and microdevices are increasingly finding application in everyday life. The specific functions of all modern microdevices depend strongly on the selection and combination of the materials used in their construction, i.e., the chemical and physical solid-state properties of these materials, and their treatment. The precise patterning of various materials, which is normally performed by lithographic etching processes, is a prerequisite for the fabrication of microdevices.The microtechnical etching of functional patterns is a multidisciplinary area, the basis for the etching p

  8. Dry etching for microelectronics

    Powell, RA

    1984-01-01

    This volume collects together for the first time a series of in-depth, critical reviews of important topics in dry etching, such as dry processing of III-V compound semiconductors, dry etching of refractory metal silicides and dry etching aluminium and aluminium alloys. This topical format provides the reader with more specialised information and references than found in a general review article. In addition, it presents a broad perspective which would otherwise have to be gained by reading a large number of individual research papers. An additional important and unique feature of this book

  9. Feasibility of hydrofluoric acid etched sand particles for enrichment and determination of polychlorinated biphenyls at trace levels in environmental water samples.

    Xing, Han-Zhu; Chen, Xiang-Feng; Wang, Xia; Wang, Ming-Lin; Zhao, Ru-Song

    2014-06-01

    This study aims to investigate the feasibility of etched sand particles being used as solid-phase extraction adsorbents to enrich polychlorinated biphenyls (PCBs), which are typical persistent organic pollutants in the environment, at trace levels. Gas chromatography-tandem mass spectrometry was selected to detect the compounds. Etched sand particles exhibited excellent merits on the enrichment of PCBs. Related important factors affecting extraction efficiencies were investigated and optimized in detail. Under optimized conditions, low limits of detection (0.42 to 3.69 ng L(-1)), wide linear range (10 to 1,000 ng L(-1)), and high repeatability (1.9 to 8.2%) were achieved. The developed method was validated with several real water samples, and satisfactory results were obtained. All of these findings indicate that etched sand particles would be useful for the enrichment and determination of organic pollutants at trace levels in water samples.

  10. Metasomatic Mechanism of Weathering-Pedogenesis of Carbonate Rocks: I. Mineralogical and Micro-Textural Evidence

    朱立军; 李景阳

    2002-01-01

    On the basis of mineralogical, geochemical and micro-textural studies of the typical sections of the red weathering crust of carbonate rocks in the subtropical karst areas of Guizhou Province and Guangxi Autonomous Region, we have found, either on a microscopic or on a macroscopical scale and in different positions of the sections, the most direct and most important mineralogical and micro-textural evidence for the development of metasomatism in the process of weathering-pedogenesis of numerous carbonate rocks. This paper also has expounded for the first time and systematically the mechanism of metasomatism involved in the process of weathering pedogenesis of carbonate rocks and proposed the sequence of mineral metasomatic evolution in the process of weathering-pedogenesis of carbonate rocks.

  11. Teasing apart the contributions of hard dietary items on 3D dental microtextures in primates.

    Calandra, Ivan; Schulz, Ellen; Pinnow, Mona; Krohn, Susanne; Kaiser, Thomas M

    2012-07-01

    3D dental microtexture analysis is a powerful tool for reconstructing the diets of extinct primates. This method is based on the comparison of fossils with extant species of known diet. The diets of primates are highly diversified and include fruits, seeds, grass, tree leaves, bark, roots, tubers, and animal resources. Fruits remain the main component in the diets of most primates. We tested whether the proportion of fruit consumed is correlated with dental microtexture. Two methods of microtexture analysis, the scale-sensitive fractal analysis (SSFA) and the Dental Areal Surface Texture Analysis (DASTA; after ISO/FDIS 25178-2), were applied to specimens of eight primate species (Alouatta seniculus, Gorilla gorilla, Lophocebus albigena, Macaca fascicularis, Pan troglodytes, Papio cynocephalus, Pongo abelii, Theropithecus gelada). These species largely differ in the mean annual proportion of fruit (from 0 to 90%) in their diet, as well as in their consumption of other hard items (seeds, bark, and insect cuticles) and of abrasive plants. We find the complexity and heterogeneity of textures (SSFA) to correlate with the proportion of fruits consumed. Textural fill volume (SSFA) indicates the proportion of both fruits and other hard items processed. Furthermore, anisotropy (SSFA) relates to the consumption of abrasive plants like grass and other monocots. ISO parameters valley height, root mean square height, material volume, density of peaks, and closed hill and dale areas (DASTA) describe the functional interaction between food items and enamel facets during mastication. The shallow, plastic deformation of enamel surfaces induced by small hard particles, such as phytoliths or dust, results in flat microtexture relief, whereas the brittle, deep fracture caused by large hard items such as hard seeds creates larger relief.

  12. Multi-scale microstructural characterization of micro-textured Ti-6Al-4V surfaces

    Soboyejo, W.O.; Mercer, C.; Allameh, S.; Nemetski, B. [Princeton Materials Inst., NJ (United States). Dept. of Mechanical and Aerospace Engineering; Marcantonio, N. [Brown Univ., Providence, RI (United States). Div. of Engineering; Ricci, J.L. [Univ. of Medicine and Dentistry of New Jersey, Newark, NJ (United States). Dept. of Orthodontics

    2001-07-01

    This paper presents the results of a multi-scale microstructural characterization of micro-textured Ti-6Al-4V surfaces that are used in biomedical implants. The hierarchies of substructural and microstructural features associated with laser micro-texturing, mechanical polishing and surface blasting with alumina pellets are elucidated via atomic force microscopy (AFM), transmission electron microscopy (TEM), scanning electron microscopy (SEM) and optical microscopy (OM). The nano-scale roughness profiles for the different surface textures are characterized via AFM. Sub-micron precipitates and dislocation substructures associated with wrought processing and laser processing are revealed by TEM. OM and SEM micro- and mesoscale images of the groove structures and then described before discussing the implications of the result for the optimization of laser processing schemes. The implications of the results are examined for the fabrication of micro-textured surfaces that will facilitate the self organization of proteins, and the attachment of mammalian cells to the Ti-6Al-4V surfaces in biomedical implants. (orig.)

  13. Dentin diffusion of HEMA released from etch-and-rinse and self-etch bonding systems.

    Rathke, Andreas; Alt, Andreas; Gambin, Nadin; Haller, Bernd

    2007-12-01

    The aim of this in vitro study was to determine the diffusion of 2-hydroxyethyl methacrylate (HEMA) released from different bonding systems (BS) through dentin. Occlusal cavities with a remaining dentin thickness (RDT) of 0.5 mm (n=90) and 0.25 mm (n=80), respectively, were prepared in dentin discs of non-carious human molars. Artificial pulp chambers were attached to the pulpal side of each dentin disc. Bonding systems were applied with (Clearfil SE Bond, OptiBond FL, OptiBond Solo Plus) or without (AdheSE, Adper Prompt L-Pop, Clearfil SE Bond, OptiBond FL, OptiBond Solo Plus Self Etch, Xeno III) prior phosphoric acid etching. HEMA was detected by gas chromatography/mass spectrometry (n=10 per BS and RDT). The highest mean HEMA concentration was found in the 0.25 mm RDT group treated with OptiBond FL (13.3 microg) and the lowest mean HEMA concentration was detected in the 0.5 mm RDT group treated with AdheSE (0.5 microg). At 0.25 mm RDT the quantities of HEMA recovered in the artificial pulp chambers were significantly higher than at 0.5 mm RDT, except for Clearfil SE Bond. Etching with phosphoric acid increased the detected HEMA quantities compared with self-etch BS. In deep cavity preparations, etching with phosphoric acid should be avoided in favor of the use of self-etch BS.

  14. Optimization of roughness, reflectance and photoluminescence for acid textured mc-Si solar cells etched at different HF/HNO{sub 3} concentrations

    Gonzalez-Diaz, B. [Departamento de Fisica Basica, Universidad de La Laguna, Avda. Astrofisico Francisco Sanchez, 38204 La Laguna, S/C de Tenerife (Spain); Guerrero-Lemus, R. [Departamento de Fisica Basica, Universidad de La Laguna, Avda. Astrofisico Francisco Sanchez, 38204 La Laguna, S/C de Tenerife (Spain); Fundacion de Estudios de Economia Aplicada. Catedra Focus-Abengoa. Jorge Juan, 46, 28001 Madrid (Spain)], E-mail: rglemus@ull.es; Diaz-Herrera, B.; Marrero, N. [Departamento de Fisica Basica, Universidad de La Laguna, Avda. Astrofisico Francisco Sanchez, 38204 La Laguna, S/C de Tenerife (Spain); Mendez-Ramos, J.; Borchert, Dietmar [Departamento de Fisica Fundamental, Experimental Electronica y Sistemas, Universidad de La Laguna, Avda. Astrofisico Francisco Sanchez, 38204 La Laguna, S/C de Tenerife (Spain); Labour und Servicecentre, Institut fuer Solare Energiesysteme, Fraunhofer Institut, Auf der Reihe 2, 45884 Gelsenkirchen (Germany)

    2009-03-15

    The surface structure of multi-crystalline silicon (mc-Si) etched in HF/HNO{sub 3} at different HF/HNO{sub 3} concentrations is optimized for being applied in solar cells. The resulting texture, which determines the efficiency of solar cells, was characterized by means of scanning electron microscopy (SEM) and optical spectroscopy. The roughness of the surface increases and the reflectance decreases when the content of HNO{sub 3} in the etching solution is increased to a limit. The produced etched pits on the surface have been identified by SEM and the surface mean roughness has been characterized by atomic force microscopy (AFM). Also, depending on the concentration of the electrolyte, the mc-Si samples exhibit photoluminescence in the VIS range under UV excitation. The PL reveals the presence of nanocrystals on the surface of the etched samples. The surface structure is also optimized for an adequate placement of the metallic contact on top. Finally the solar cells were performed in order to investigate the dependence of the roughness, reflectance and photoluminescence to the solar efficiency.

  15. Dry etching technology for semiconductors

    Nojiri, Kazuo

    2015-01-01

    This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits.  The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes.  The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning ...

  16. Effect of Ethylene diamine tetra acetic acid and sodium hypochlorite solution conditioning on microtensile bond strength of one-step self-etch adhesives

    Kasraei, Shahin; Azarsina, Mohadese; Khamverdi, Zahra

    2013-01-01

    Background: Attempts to improve bond strength of self-etch adhesives can enhance the durability of composite restorations. Aims: The aim of the present study was to evaluate the effect of collagen and smear layer removal with sodium hypochlorite solution (NaOCl) and EDTA on micro-tensile bond strength (μTBS) of self-etch adhesives to dentin. Settings and Design: It was an in-vitro study. Materials and Methods: Seventy-two teeth were divided into eight groups and their crowns were ground perpendicular to their long axis to expose dentin. The teeth were polished with silicon-carbide papers. The groups were treated as follows: No conditioning, 0.5-M EDTA conditioning, 2.5% NaOCl conditioning, NaOCl + EDTA conditioning. The surfaces were rinsed and blot-dried. Clearfil S3 and I-Bond were applied according to manufacturers’ instructions and restored with Z100 composite. After 500 cycles of thermo-cycling between 5°C and 55°C, the samples were sectioned and tested for μTBS. Statistical Analysis: Data were analyzed by two-way ANOVA and Tukey-HSD test. Results: The highest μTBS was recorded with Clearfil S3 + NaOCl + EDTA, and the lowest was recorded with I-Bond without conditioning. μTBS in EDTA-and EDTA + NaOCl-treated groups was significantly higher than the control and NaOCl-conditioned groups. Conclusions: Application of EDTA or EDTA + NaOCl before one-step self-etch adhesives increased μTBS. PMID:23833459

  17. Orthodox etching of HVPE-grown GaN

    Weyher, J.L.; Lazar, S.; Macht, L.; Liliental-Weber, Z.; Molnar,R.J.; Muller, S.; Nowak, G.; Grzegory, I.

    2006-08-10

    Orthodox etching of HVPE-grown GaN in molten eutectic of KOH + NaOH (E etch) and in hot sulfuric and phosphoric acids (HH etch) is discussed in detail. Three size grades of pits are formed by the preferential E etching at the outcrops of threading dislocations on the Ga-polar surface of GaN. Using transmission electron microscopy (TEM) as the calibration tool it is shown that the largest pits are formed on screw, intermediate on mixed and the smallest on edge dislocations. This sequence of size does not follow the sequence of the Burgers values (and thus the magnitude of the elastic energy) of corresponding dislocations. This discrepancy is explained taking into account the effect of decoration of dislocations, the degree of which is expected to be different depending on the lattice deformation around the dislocations, i.e. on the edge component of the Burgers vector. It is argued that the large scatter of optimal etching temperatures required for revealing all three types of dislocations in HVPE-grown samples from different sources also depends upon the energetic status of dislocations. The role of kinetics for reliability of etching in both etches is discussed and the way of optimization of the etching parameters is shown.

  18. Spatial variation of the etch rate for deep etching of silicon by reactive ion etching

    Andersen, Bo Asp Møller; Hansen, Ole; Kristensen, Martin

    1997-01-01

    The macroscopic uniformity of deep etching into silicon by reactive ion etching (RIE) with a SF6-O-2 plasma was studied. The spatial variation of the etch rate across a 4 inch wafer in a single wafer system is a function of the process parameters and the configuration of the etch chamber. It was ......The macroscopic uniformity of deep etching into silicon by reactive ion etching (RIE) with a SF6-O-2 plasma was studied. The spatial variation of the etch rate across a 4 inch wafer in a single wafer system is a function of the process parameters and the configuration of the etch chamber....... It was found that, for a constant load of silicon exposed to the plasma, the etch rate variation can be controlled through the applied rf power, the chamber pressure, and the gas mixture. It was also found that the etch rate uniformity varies with the load of silicon exposed to the plasma. The result...... is a balance between the flux of neutral radicals and the flux of energetic ions to the surface. This balance is due to the RIE etch mechanism, which involves synergism between the two fluxes. (C) 1997 American Vacuum Society....

  19. Test of the microtextural analysis of quartz grains of tsunami and non-tsunami deposits in Tirúa (Chile) - an unsuitable method for a valid tsunami identification

    Bellanova, P.; Bahlburg, H.; Nentwig, V.

    2015-12-01

    The tsunami caused by the 2010 Maule earthquake (MW 8.8) significantly affected the village of Tirúa (Central Chile). In order to estimate the hazard potential of tsunami events it is essential to reliably identify and differentiate tsunami deposits from deposits of other high-energy events like storms. Recently, the microtextural analysis of quartz grain surfaces was introduced as a method to differentiate between tsunami and other deposits. We tested the microtextural analysis method for its capability to identify tsunami deposits using paleotsunami intercalations from a bank profile of the Tirúa river. A total of 815 quartz grains of 4 river bank samples (2 tsunamigenic, 2 non-tsunamigenic) and of 3 reference samples from nearby beach, dune and river were analyzed. In order to generate a valid statistical basis even within individual grain size fractions a large number of grains was studied. Another reason was to compensate the error of the operator's subjectivity during random picking and microtexture observation. Grain surfaces were analyzed using SEM. We detected 30 individual microtextures grouped into five microtextural families according to angularity, fresh surfaces, percussion marks, adhering particles and dissolution. The grains from the tsunami deposits have high numbers of fresh surfaces and percussion marks. However, in comparison with the non-tsunamigenic deposits and all reference samples (beach, dune and river) the tsunamigenic deposits do not show statistically significant differences in characteristics and abundances in all microtextural families. The homogeneity in microtextural results of all samples indicate the absence of differences between tsunamigenic, beach dune and river deposits. A distinct tsunami signature could not be identified from our microtextural analysis. Our study indicates that the microtextural analysis of quartz grains may not be a suitable method to identify tsunami deposits.

  20. 磨除后酸蚀对氟斑牙正畸托槽脱落率的影响%Effects of bonding after microabrasion with normal acid etching time on losing ratio of orthodontic brackets to dental fluorosis

    董晶; 张哲湛

    2016-01-01

    越高.对于中、重度氟斑牙的临床矫治,磨除后酸蚀法治疗效果优于延长酸蚀时间法.%Objective To investigate the effects of losing ratio of orthodontic brackets bonding after prolonged etching time (prolonged etching time method) and microabrasion with normal acid etching time (etching after microabrasion method) to different degree of dental fluorosis.Methods A total of 30 patients with dental fluorosis were selected from the cases treated in the Department of Stomatology,Lianyungang Hospital of Traditional Chinese Medicine.They were classified as 3 groups from mild to severe degree according to Dean's criteria,10 people per group.Patients within each group were randomly assigned to 2 subgroups,5 people per subgroup;prolonged etching time method and etching after microabrasion method were used,respectively,in each subgroup.The total and first losing ratios of brackets at five time points (1,2,4,12 and 24 weeks) were observed.The losing ratio differences of orthodontic brackets between the two disposing measures bonding to different degree of dental fluorosis were analyzed.Resuts The total bracket loss rates were 38.3% (46/120) and 21.4% (25/117),respectively,in severe dental fluorosis disposed by prolonged etching time method and etching after microabrasion method.It was significantly higher than that of the same processing method of mild and moderate dental fluorosis groups,in which the total bracket loss rates were 12.5% (15/120),18.1% (21/116),7.6% (9/118) and 5.8% (7/120),respectively,and the differences were statistically significant (x2 =21.12,11.87,8.96,12.24,all P < 0.01).The total loss rate of etching after microabrasion method was lower than that of prolonged etching time method in mild dental fluorosis group,the difference was not statistically significant (x2 =1.56,P > 0.05).The total loss rates of etching after microabrasion method were lower than that of prolonged etching time method in moderate and severe

  1. Unveiling the wet chemical etching characteristics of polydimethylsiloxane film for soft micromachining applications

    Kakati, A.; Maji, D.; Das, S.

    2017-01-01

    Micromachining of a polydimethylsiloxane (PDMS) microstructure by wet chemical etching is explored for microelectromechanical systems (MEMS) and microfluidic applications. A 100 µm thick PDMS film was patterned with different microstructure designs by wet chemical etching using a N-methyl-2-pyrrolidone (C16H36FN) and tetra-n-butylammonium fluoride (C5H9NO) mixture solution with 3:1 volume ratio after lithography for studying etching characteristics. The patterning parameters, such as etch rate, surface roughness, pH of etchant solution with time, were thoroughly investigated. A detailed study of surface morphology with etching time revealed nonlinear behaviour of the PDMS surface roughness and etch rate. A maximum rate of 1.45 µm min-1 for 10 min etching with surface roughness of 360 nm was achieved. A new approach of wet chemical etching with pH controlled doped etchant was introduced for lower surface roughness of etched microstructures, and a constant etch rate during etching. Variation of the etching rate and surface roughness by pH controlled etching was performed by doping 5-15 gm l-1 of silicic acid (SiO2x H2O) into the traditional etchant solution. PDMS etching by silicic acid doped etchant solution showed a reduction in surface roughness from 400 nm to 220 nm for the same 15 µm etching. This study is beneficial for micromachining of various MEMS and microfluidic structures such as micropillars, microchannels, and other PDMS microstructures.

  2. Effect of Ethylene diamine tetra acetic acid and sodium hypochlorite solution conditioning on microtensile bond strength of one-step self-etch adhesives

    Shahin Kasraei

    2013-01-01

    Settings and Design: It was an in-vitro study. Materials and Methods: Seventy-two teeth were divided into eight groups and their crowns were ground perpendicular to their long axis to expose dentin. The teeth were polished with silicon-carbide papers. The groups were treated as follows: No conditioning, 0.5-M EDTA conditioning, 2.5% NaOCl conditioning, NaOCl + EDTA conditioning. The surfaces were rinsed and blot-dried. Clearfil S3 and I-Bond were applied according to manufacturers′ instructions and restored with Z100 composite. After 500 cycles of thermo-cycling between 5±C and 55±C, the samples were sectioned and tested for μTBS. Statistical Analysis: Data were analyzed by two-way ANOVA and Tukey-HSD test. Results: The highest μTBS was recorded with Clearfil S3 + NaOCl + EDTA, and the lowest was recorded with I-Bond without conditioning. μTBS in EDTA-and EDTA + NaOCl-treated groups was significantly higher than the control and NaOCl-conditioned groups. Conclusions: Application of EDTA or EDTA + NaOCl before one-step self-etch adhesives increased μTBS.

  3. Shock-thermal history of Kavarpura IVA iron: Evidences from microtextures and nickel profiling

    Ray, Dwijesh; Ghosh, S.; Murty, S. V. S.

    2015-11-01

    We classify Kavarpura iron (fell in August, 2006, in Rajasthan, India), an inclusion-free member of high-Ni IVA group. Widmanstätten pattern and finger-cellular plessites textures characteristic of IVA group are present in Kavarpura. Symmetric and asymmetric textural zoning within the cloudy taenite and plessite refer to long term martensitisation process with mean metallographic cooling rate of 200 °C/Ma. Imprints of variable shock pressure domains (Neumann bands and shock hatched ε kamacite) suggest alteration by up to 600 kb shock pressure. Degeneration of cellular plessites, bending of finger plessites and plastic flowage of taenites bear textural evidences corresponding to post-shock annealing which is further confirmed by Ni profiles across the cloudy taenites and plessites under high shock pressure domains. Based on microtextural evidences and Ni profiling, we suggest Kavarpura had cooled at steady state and subsequently suffered multiple impacts.

  4. Effect of Addition of Al on Crystal Structure Microtexture and Magnetostriction Coefficient in Tb0.3 Dy0.7 Fe1.95 Alloy

    Jiang Liping; Zhao Zengqi; Wu Shuangxia; Huang Jimin; Zuo Liang

    2004-01-01

    The effect of addition of A1 on crystal structure microtexture and magnetostrictioncoefficient in Tb0.3Dy0.7Fe1.95 alloy were studied.The results show that addition of A1 does not change crystal structure of alloy and the precipitates increase in the microtexture as addition of A1 increases.At a certain magnetic field, magnetostriction coefficient decreased as addition of Al increased.

  5. Microinfiltração em dentes decíduos em função de materiais restauradores e condicionamento ácido Microleakage in primary teeth related to restorative materials and acid etching

    Sandra Kalil BUSSADORI

    1999-12-01

    Full Text Available A pesquisa teve como objetivo avaliar a microinfiltração em restaurações de quatro materiais (Dyract, Vitremer, Z100 e Fuji II LC, em dentes decíduos, realizando ou não condicionamento ácido. Foram feitas dez restaurações (5 OM e 5 OD para cada condição experimental. As cavidades tinham as dimensões (mm: 4 de altura, 3 de largura e 2 de profundidade. Os materiais foram manipulados conforme instruções dos fabricantes. Os dentes restaurados, após sete dias de armazenagem foram submetidos à ciclagem térmica (700 ciclos a 5 e 55ºC, com um minuto em cada banho. Em seqüência os corpos-de-prova foram preparados para a imersão em azul de metileno a 0,5%, pH 7,2, por quatro horas, após o que foram preparados para a avaliação do grau de infiltração. Os resultados permitiram concluir que: foi grande a diferença de escores entre materiais (de infiltração nula, 0, a 4 máxima; médias de 0,1 (Dyract a 4,0 (Fuji II LC; os materiais Vitremer e Z100 não diferiram entre si e se encontraram com valores entre os outros dois; o condicionamento ácido influiu apenas com o material Fuji II LC.The purpose of this research was to evaluate microleakage on proximal restorations of primary teeth, using four materials (Dyract, Vitremer, Z100 and Fuji II LC. Acid etching was performed in only one group. Proximal cavities were prepared with the following measures (mm: height, 4; width, 3; depth, 2. Restoring was performed according to manufacturer’s instructions, and specimens were stored in distilled water for seven days, at 37ºC. Afterwards, thermal cycling was performed (700 cycles at 5 and 55ºC, for one minute in each temperature. Specimens were then immersed in 0.5% methylene blue solution, and prepared for evaluation. The results led to the following conclusions: there were great differences of scores between materials, 0.1 (Dyract and 4.0 (Fuji II LC; Vitremer and Z100 presented similar values (respectively, in scores, 1.7 and 1

  6. ZERODUR: bending strength data for etched surfaces

    Hartmann, Peter; Leys, Antoine; Carré, Antoine; Kerz, Franca; Westerhoff, Thomas

    2014-07-01

    In a continuous effort since 2007 a considerable amount of new data and information has been gathered on the bending strength of the extremely low thermal expansion glass ceramic ZERODUR®. By fitting a three parameter Weibull distribution to the data it could be shown that for homogenously ground surfaces minimum breakage stresses exist lying much higher than the previously applied design limits. In order to achieve even higher allowable stress values diamond grain ground surfaces have been acid etched, a procedure widely accepted as strength increasing measure. If surfaces are etched taking off layers with thickness which are comparable to the maximum micro crack depth of the preceding grinding process they also show statistical distributions compatible with a three parameter Weibull distribution. SCHOTT has performed additional measurement series with etch solutions with variable composition testing the applicability of this distribution and the possibility to achieve further increase of the minimum breakage stress. For long term loading applications strength change with time and environmental media are important. The parameter needed for prediction calculations which is combining these influences is the stress corrosion constant. Results from the past differ significantly from each other. On the basis of new investigations better information will be provided for choosing the best value for the given application conditions.

  7. Bond strength with various etching times on young permanent teeth

    Wang, W.N.; Lu, T.C. (School of Dentistry, National Defense Medical Center, Taipei, Taiwan (China))

    1991-07-01

    Tensile bond strengths of an orthodontic resin cement were compared for 15-, 30-, 60-, 90-, or 120-second etching times, with a 37% phosphoric acid solution on the enamel surfaces of young permanent teeth. Fifty extracted premolars from 9- to 16-year-old children were used for testing. An orthodontic composite resin was used to bond the bracket directly onto the buccal surface of the enamel. The tensile bond strengths were tested with an Instron machine. Bond failure interfaces between bracket bases and teeth surfaces were examined with a scanning electron microscope and calculated with mapping of energy-dispersive x-ray spectrometry. The results of tensile bond strength for 15-, 30-, 60-, or 90-second etching times were not statistically different. For the 120-second etching time, the decrease was significant. Of the bond failures, 43%-49% occurred between bracket and resin interface, 12% to 24% within the resin itself, 32%-40% between resin and tooth interface, and 0% to 4% contained enamel fragments. There was no statistical difference in percentage of bond failure interface distribution between bracket base and resin, resin and enamel, or the enamel detachment. Cohesive failure within the resin itself at the 120-second etching time was less than at other etching times, with a statistical significance. To achieve good retention, to decrease enamel loss, and to reduce moisture contamination in the clinic, as well as to save chairside time, a 15-second etching time is suggested for teenage orthodontic patients.

  8. SEM analysis of the acid-etched enamel patterns promoted by acidic monomers and phosphoric acids Avaliação em MEV do padrão de condicionamento do esmalte dental promovido por monômeros ácidos e o ácido fosfórico

    Mirela Sanae Shinohara

    2006-12-01

    Full Text Available ABSTRACT OBJECTIVE: Although self-etching bonding systems (SES are indicated to prepare dental enamel for bonding, concerns have been expressed regarding their effectiveness. The aim of this study was to analyze the etching pattern (EP of nine SES in comparison with 35% and 34% phosphoric acid etchants (FA on intact (IN and ground (GR enamel surface. MATERIALS AND METHODS: Twenty-two human third molars were sectioned in mesial-distal and buccal-lingual directions, and four dental fragments were obtained from each tooth. Half of the fragments were ground using 600-grit SiC paper and the other half remained intact. The fragments were randomly assigned into 22 groups, according to the texture of enamel surface (IN and GR and the technique to etch the enamel (34% FA, 35% FA, AdheSE primer; Brush & Bond; Clearfil Protect Bond primer; iBond; One-up Bond F; OptiBond Solo Plus primer; Tyrian SPE primer; Unifil Bond primer and Xeno III. Conditioners were applied to IN and GR enamel surfaces, according to the manufacturer's instructions. Specimens etched with phosphoric acids were washed with water, while the surfaces treated with SES were submitted to alternate rinsing with alcohol and acetone. The specimens were dried, sputter-coated and examined under a scanning electron microscope. RESULTS: For both IN and GR enamel surfaces, the EP of 34 and 35% FA was deeper and more homogeneous in comparison to EP of SES, except for Tyrian SPE. The acidic monomer action of self-etching systems was more effective on GR enamel. CONCLUSION: Most of the SES are less aggressive than phosphoric acid etchants and their etching effects were reduced on intact enamel surfaces.OBJETIVO: Apesar dos sistemas adesivos autocondicionantes (SAA serem indicados para aplicação no esmalte dental, preocupação tem sido relatada com relação a sua efetividade. O objetivo deste estudo foi avaliar o padrão de condicionamento ácido (PCA promovido por nove SAA e comparar ao PCA

  9. Silicon Deep Etching Techniques for MEMS Devices

    WU Ying; OU Yi-hong; JIANG Yong-qing; LI Bin

    2003-01-01

    Silicon deep etching technique is the key fabrication step in the development of MEMS. The mask selectivity and the lateral etching control are the two primary factors that decide the result of deep etching process. These two factors are studied in this paper. The experimental results show that the higher selectivity can be gotten when F- gas is used as etching gas and Al is introduced as mask layer. The lateral etching problems can be solved by adjusting the etching condition, such as increasing the RF power, changing the gas composition and flow volume of etching machine.

  10. Microtextural evolution of different TRC AA8006 alloy sections with homogenization

    Zhong-wei Chen; Long-fei Shen; Jing Zhao

    2015-01-01

    Grain microtexture evolution in twin-roll cast AA8006 alloy sheets subjected to different treatments was investigated using elec-tron backscatter diffraction. The textures of rolling-transverse and normal-transverse sections were characterized in original as-cast twin-roll casting and cold-rolled samples as well as samples homogenized at 500°C for 8 h and at 580°C for 4 h. It is found that grains on both the rolling-transverse and normal-transverse sections of cold-rolled samples are made finer by rolling deformation and coarsened after homog-enization. Annealing temperature has a stronger effect on the microstructural evolution than annealing time. The grain growth direction is parallel to the normal-transverse section, while grain deformation is more stable on the rolling direction than on the normal direction. The rolling orientations display more obvious anisotropy on the normal-transverse sections than on the rolling-transverse sections. Grain recrys-tallization and growth occur much easier on the normal-transverse section than on the rolling-transverse section for samples homogenized at 500°C for 8 h. A special misorientation relationship between cold deformation texture, such as S orientation{123}and cube orienta-tion|Xaxis [cubic], and recrystallization texture after homogenization, such as R orientation{124}and P orientation{011}, is observed.

  11. Wetting behaviour of laser synthetic surface microtextures on Ti-6Al-4V for bioapplication.

    Dahotre, Narendra B; Paital, Sameer R; Samant, Anoop N; Daniel, Claus

    2010-04-28

    Wettability at the surface of an implant material plays a key role in its success as it modulates the protein adsorption and thereby influences cell attachment and tissue integration at the interface. Hence, surface engineering of implantable materials to enhance wettability to physiological fluid under in vivo conditions is an area of active research. In light of this, in the present work, laser-based optical interference and direct melting techniques were used to develop synthetic microtextures on Ti-6Al-4V alloys, and their effects on wettability were studied systematically. Improved wettability to simulated body fluid and distilled water was observed for Ca-P coatings obtained by direct melting technique. This superior wettability was attributed to both the appropriate surface chemistry and the three-dimensional surface features obtained using this technique. To assert a better control on surface texture and wettability, a three-dimensional thermal model based on COMSOL's multiphysics was employed to predict the features obtained by laser melting technique. The effect of physical texture and wetting on biocompatibility of laser-processed Ca-P coatings was evaluated in the preliminary efforts on culturing of mouse MC3T3-E1 osteoblast cells.

  12. Regenerative Electroless Etching of Silicon.

    Kolasinski, Kurt W; Gimbar, Nathan J; Yu, Haibo; Aindow, Mark; Mäkilä, Ermei; Salonen, Jarno

    2017-01-09

    Regenerative electroless etching (ReEtching), described herein for the first time, is a method of producing nanostructured semiconductors in which an oxidant (Ox1 ) is used as a catalytic agent to facilitate the reaction between a semiconductor and a second oxidant (Ox2 ) that would be unreactive in the primary reaction. Ox2 is used to regenerate Ox1 , which is capable of initiating etching by injecting holes into the semiconductor valence band. Therefore, the extent of reaction is controlled by the amount of Ox2 added, and the rate of reaction is controlled by the injection rate of Ox2 . This general strategy is demonstrated specifically for the production of highly luminescent, nanocrystalline porous Si from the reaction of V2 O5 in HF(aq) as Ox1 and H2 O2 (aq) as Ox2 with Si powder and wafers.

  13. Martian surface microtexture from orbital CRISM multi-angular observations: A new perspective for the characterization of the geological processes

    Fernando, J.; Schmidt, F.; Douté, S.

    2016-09-01

    The surface of Mars has a high morphological and mineralogical diversity due to the intricacy of external, internal processes, and exchanges with the atmosphere, the hydrosphere and the cryosphere. In particular, liquid water played an important role in surface evolution. However, the origin, duration and intensity of those wet events have been highly debated, especially in the clay-bearing geological units. Similarly, questions still remain about magma crystallization and volatile quantity of the dominant basaltic crust. In this work, six sites having hydrated minerals, salts and basaltic signatures (i.e., Mawrth Vallis, Holden crater, Eberswalde crater, Capri mensa, Eridania basin, Terra Sirenum) are investigated in order to better characterize the geological processes responsible for their formation and evolution (e.g., fluvial, lacustrine, in situ weathering, evaporitic, volcanic and aeolian processes). For that purpose, we use orbital multi-angular measurements from the Compact Reconnaissance Imaging Spectrometer for Mars (CRISM) instrument on-board the Mars Reconnaissance Orbiter spacecraft to analyze the manner in which light is scattered by the surface materials (photometry) in the near-infrared range (at 750 nm). The surface bidirectional reflectance depends on the composition but also on the surface microtexture such as the grain size distribution, morphology, internal structure and surface roughness, tracers of the geological processes. The Hapke semi-analytical model of radiative transfer in granular medium is used to model the surface bidirectional reflectance estimated at 750 nm from the orbital measurements after an atmospheric correction. The model depends on different radiative properties (e.g., single scattering albedo, grain phase function and regolith roughness) related to the surface composition and microtexture. In particular previous laboratory works showed that the particle phase function parameters, which describe the characteristics of the

  14. Effect of benzotriazole on the anisotropic electrolytic etching of copper

    Papapanayiotou, D.; Deligianni, H.; Alkire, R.C. [Univ. of Illinois, Urbana, IL (United States)

    1998-09-01

    Electrolytic etching of copper foil at the base of cavities formed by patterned photoresist was investigated in 0.5 M sulfuric acid solutions which either contained 40 mM benzotriazole (BTA) or were free of BTA. It was found that undercutting (metal dissolution beneath the photoresist) was minimized by the action of surface films in both solutions. It was also found that the nature of the surface films and the mechanism by which they enhanced etch anisotropy differed. In additive-free solutions, anisotropic etching was observed under conditions of applied potential and flow for which mass transfer was suppressed in the interior corner regions of cavities. Such operating conditions in additive-free solutions displayed characteristic current transients. In BTA-containing solutions, the etch profiles were highly dependent on applied potential. In contrast to the additive-free solutions, the flow conditions in BTA-containing solutions had little effect on the current transients or on the degree of undercutting within the region of applied potential in which anisotropic etching was achievable.

  15. 丹酚酸B对人牙本质自酸蚀粘结强度的影响%Effect of Salvianolic Acid B on the Bond Strength of Self- etch Adhesive System to Human Dentin.

    杨光; 袁柱炫

    2011-01-01

    目的:探讨丹酚酸B对牙本质自酸蚀粘结即刻及长期粘结强度的影响.方法:将10颗新鲜拔除的人下颌第三磨牙去除牙 合面牙釉质,暴露中层牙本质,打磨后制备出标准粘结面,以硬组织切片机将每颗牙均分为近中及远中两部分,自凝塑料包埋牙根,随机选取每颗实验牙的近中或远中部分共10个牙体单位于牙本质粘结面涂布两层Adper Prompt自酸蚀粘结剂(3M ESPE),光固化10 s后以Filtek Z350通用型纳米树脂(3M ESPE)堆塑5 mm高的树脂核;其余10个牙体单位则先以丹酚酸B处理牙本质粘结面,再以相同方法与材料制作树脂核.以硬组织切片机将各牙体单位切为1 mm×1 mm×8 mm的微拉伸试件,每个牙体单位选出2个试件并随机分组,最终形成A1、A2、B1、B2四组(n=10),A1设为对照组.对A1、B1组试件进行即刻微拉伸强度测试,A2、B2组试件水储6个月后进行微拉伸强度测试,评估其粘结强度.实验所得结果采用SPSS18.0软件进行ANOVA两因素方差分析和LSD多重检验.结果:丹酚酸B处理与未处理组的即刻微拉伸强度分别为(40.05±2.24) MPa、(41.58±1.98) MPa,两组即刻粘结强度无统计学差异;6个月水储后丹酚酸B处理组微拉伸强度为(18.96±2.05) MPa,高于未处理组(13.14±2.17) MPa (P<0.05).结论:丹酚酸B对牙本质自酸蚀粘结的即刻粘结强度没有明显影响,但能有效减缓长期(6个月)粘结强度的降.%Objective: To evaluate the effect of salvianolic acid B (one kind of matrix metalloproteinase inhibitor) on micro tensile bond strength (TBS) of self-etch adhesive system to human dentin.Methods: The occlusal enamal of 10 extracted lower third molars was removed to expose the flat middle coronal dentin and the dentin surfaces were grounded to standard adhesive surfaces.Each tooth was divided into mesial and distal parts equally and the roots were embedded in self-curing resin.One part of each tooth was randomly taken to be

  16. Methods for dry etching semiconductor devices

    Bauer, Todd; Gross, Andrew John; Clews, Peggy J.; Olsson, Roy H.

    2016-11-01

    The present invention provides methods for etching semiconductor devices, such aluminum nitride resonators. The methods herein allow for devices having improved etch profiles, such that nearly vertical sidewalls can be obtained. In some examples, the method employs a dry etch step with a primary etchant gas that omits BCl.sub.3, a common additive.

  17. Post-synthetic Anisotropic Wet-Chemical Etching of Colloidal Sodalite ZIF Crystals

    Avci, Civan; Ariñez-Soriano, Javier; Carné-Sánchez, Arnau; Guillerm, Vincent; Carbonell, Carlos; Imaz, Inhar; Maspoch, Daniel

    2016-01-01

    Controlling the shape of metal-organic framework (MOF) crystals is important for understanding their crystallization and useful for myriad applications. However, despite the many advances in shaping of inorganic nanoparticles, post-synthetic shape control of MOFs and, in general, molecular crystals remains embryonic. Herein we report using a simple wet-chemistry process at room temperature to control the anisotropic etching of colloidal ZIF-8 and ZIF-67 crystals. Our work enables uniform reshaping of these porous materials into unprecedented morphologies, including cubic and tetrahedral crystals, and even hollow boxes, via acid-base reaction and subsequent sequestration of leached metal ions. Etching tests on these ZIFs reveal that etching occurs preferentially in the crystallographic directions richer in metal-ligand bonds; that, among these directions, the etching rate tends to be faster on the crystal surfaces of higher dimensionality; and that the etching can be modulated by adjusting the pH of the etchant solution. PMID:26458081

  18. Note: Dissolved hydrogen detection in power transformer oil based on chemically etched fiber Bragg grating.

    Jiang, Jun; Ma, Guo-ming; Song, Hong-tu; Zhou, Hong-yang; Li, Cheng-rong; Luo, Ying-ting; Wang, Hong-bin

    2015-10-01

    A fiber Bragg grating (FBG) sensor based on chemically etched cladding to detect dissolved hydrogen is proposed and studied in this paper. Low hydrogen concentration tests have been carried out in mixed gases and transformer oil to investigate the repeatability and sensitivity. Moreover, to estimate the influence of etched cladding thickness, a physical model of FBG-based hydrogen sensor is analyzed. Experimental results prove that thin cladding chemically etched by HF acid solution improves the response to hydrogen detection in oil effectively. At last, the sensitivity of FBG sensor chemically etched 16 μm could be as high as 0.060 pm/(μl/l), increased by more than 30% in comparison to un-etched FBG.

  19. Microtextural Characteristics and Origin of Dolomites in the Tepearasi Formation, SW of Beysehir-Konya, Turkey

    2002-01-01

    The Tepearasi Formation of the autochthonous Geyikdagi Group in the Central Tauride Belt, SE of Beysehir, is Dogger in age and consists dominantly of massive limestones and greyish dolomites occurring within the middle to upper sections. The total thickness of the dolomitic levels ranges from 100–300 m and laterally extends 500–700 m. Three types of dolomite were distinguished through petrographic analyses: homogeneous, mottled (saddle-crystalline) and joint-filling dolomite, which were interpreted to have formed in two different stages, early diagenetic and late diagenetic. The homogeneous dolomite of the early diagenetic stage is light-coloured and monotonous-textured and shows the form of a dolosparite mosaic. The mottled dolomite formed in the late diagenetic stage is light- to dark-coloured and coarsely granular idiomorphic. The other type of late diagenetic dolomite, described as the joint-filling type, presents a crystal growth pattern from the joint walls towards the centre of the joint space. It is associated with coarse calcite crystals as well as primary dolomite crystal clasts which were formed in the early diagenetic stage. In addition to these characteristics, cataclastic texture indicating the influence of tectonism is also observed. Microtexture-oriented scanning electron microscopy (SEM) studies indicate that mottled dolomites show zonal structures and contain secondary dissolution vugs. SEM studies also revealed the existence of some remains (calcite, clay etc.) in joint-filling dolomites. Analyses by energy dispersive spectrometry (EDS) indicate the existence of clay minerals (likely to be illite) in the pores of dolomite. Isotope studies conducted to shed light onto the origin of the dolomites of the Tepearasi Formation yielded the results of ?18O= –2.48 to – 3.87‰ and ?13C=0.93 to 1.12‰ for the early diagenetic homogeneous dolomites. Mottled and joint-filling type dolomites of the late diagenetic stage, on the other hand, gave the

  20. Effect of acid etching and desensitization on the bonding strength of dentin and zirconia%脱敏及脱敏后酸蚀对牙本质与氧化锆粘结强度的影响

    邓琳琳; 王璐; 邱雨; 付钢

    2014-01-01

    Objective:To evaluate the effects of acid etching and two kinds desensitizing agents on zirconia and dentin in order to provide references for clinical treatment.Methods:Fifty molars(the third molar) without caries were collected and the crowns of the molars were removed to expose the dentin.All samples were divided into control group A and experimental groups B,B1,C,C1 (n=10).All 50 molars were immersed into 1∶3 fetal bovine serum solution and were taken out 1 d after.No treatment was made in group A;molars in groups B and B 1 were coated by Gluma desensitizer; molars of groups C,and C 1 were treated by water.Before bonding,molars in groups B1 and C1 were treated by phosphoric acid for 15 seconds while no treatment was made in other groups.The dentin of specimens were bonded with zirconia with the same size at the bottom and the shear strength was determined.The results were analyzed by software of SPSS 17.0.Results:The bonding strength:A group(9.626 ± 0.318) MPa,B group(12.577 ± 0.374) MPa,B1 group (15.650 ± 0.344) MPa,C group(9.530 ± 0.391) MPa,C1 group(12.740 ± 0.310) MPa.There were statistical differences between groups(P<0.05) except comparison between group A and group C(P>0.05) and between group B and group C1 (P>0.05).Conclusion:Gluma desensitizer can enhance the bonding strength of Rely XTM Unicem on dentin.Proper phosphoric acid etching of dentin treated by water laser or Gluma desensitization can enhance the bonding strength of Rely XTM Unicem on dentin.%目的:比较2种脱敏方式及脱敏后酸蚀对氧化锆与牙本质粘结强度的影响,为其临床应用提供实验依据.方法:收集无龋完整的第三磨牙50颗,截去冠端,暴露牙本质,将其随机分成对照组A、实验组B、B1和C、C1(n=10),均浸入1∶3稀释的胎牛血清溶液备用.1d后取出,A组无处理,B、B1组涂布Gluma脱敏剂,C、C1组用水激光处理.粘结前B1、C1组磷酸酸蚀15s,其余各组不处理,各标本牙本质

  1. Study of Thermal Electrical Modified Etching for Glass and Its Application in Structure Etching

    Zhan Zhan

    2017-02-01

    Full Text Available In this work, an accelerating etching method for glass named thermal electrical modified etching (TEM etching is investigated. Based on the identification of the effect in anodic bonding, a novel method for glass structure micromachining is proposed using TEM etching. To validate the method, TEM-etched glasses are prepared and their morphology is tested, revealing the feasibility of the new method for micro/nano structure micromachining. Furthermore, two kinds of edge effect in the TEM and etching processes are analyzed. Additionally, a parameter study of TEM etching involving transferred charge, applied pressure, and etching roughness is conducted to evaluate this method. The study shows that TEM etching is a promising manufacture method for glass with low process temperature, three-dimensional self-control ability, and low equipment requirement.

  2. Sistemas adhesivos autograbadores en esmalte: ventajas e inconvenientes Self-etching adhesive systems on enamel: advantages and disadvantages

    M.A Gomes Moreira

    2004-08-01

    Full Text Available Se mide la resistencia adhesiva de cinco sistemas adhesivos autograbadores y se compara con dos monocomponentes, en esmalte bovino, utilizando cuatro protocolos de aplicación diferentes (según fabricante, con ácido, dos tiempos y dos capas. Asimismo se evalúan con MEB los patrones de grabado ácido de estos sistemas adhesivos, muy heterogéneos en los autograbadores. Todos los sistemas autograbadores presentan valores aceptables de resistencia adhesiva.The bond strength to bovine enamel of five self-etching adhesive systems was measured comparing to two total etch adhesive systems and using different application modes (following manufacturers' instructions, with a previous acid etching, duplicating priming time and doubling the number of adhesives' layers. The etching patterns were analized with scanning electron microscopy showing the self-etching adhesives different aggressiveness. All self-etching systems showed reliable bond strength values.

  3. Microtexture Analysis and Modeling of Ambient Fatigue and Creep-Fatigue Damages in Ti-6Al-4V Alloy

    Kumar, Jalaj; Singh, A. K.; Raman, S. Ganesh Sundara; Kumar, Vikas

    2017-02-01

    In the present investigation, microtexture analysis using electron back-scattered diffraction technique has been performed to study fatigue- and creep-fatigue damages and associated deformation structures in Ti-6Al-4V alloy. Special emphasis has been given to low-angle grain boundary configuration and its possible application as a damage indicator. Damage is mostly present in the form of voids as investigated through scanning electron microscopy. Stored deformation energies have been evaluated for the strain-controlled fatigue-, the stress-controlled fatigue-, and the creep-fatigue-tested samples. Stored deformation energies have also been analyzed vis-à-vis total damage energies to quantify the contribution of damages to various samples. A relation between the stored deformation energy and the applied strain amplitude has been proposed in this study.

  4. Etching of glass microchips with supercritical water.

    Karásek, Pavel; Grym, Jakub; Roth, Michal; Planeta, Josef; Foret, František

    2015-01-07

    A novel method of etching channels in glass microchips with the most tunable solvent, water, was tested as an alternative to common hydrogen fluoride-containing etchants. The etching properties of water strongly depend on temperature and pressure, especially in the vicinity of the water critical point. The chips were etched at the subcritical, supercritical and critical temperature of water, and the resulting channel shape, width, depth and surface morphology were studied by scanning electron microscopy and 3D laser profilometry. Channels etched with the hot water were compared with the chips etched with standard hydrogen fluoride-containing solution. Depending on the water pressure and temperature, the silicate dissolved from the glass could be re-deposited on the channel surface. This interesting phenomenon is described together with the conditions necessary for its utilization. The results illustrate the versatility of pure water as a glass etching and surface morphing agent.

  5. Etching.

    1980-09-01

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  6. Selective etching of silicon carbide films

    Gao, Di; Howe, Roger T.; Maboudian, Roya

    2006-12-19

    A method of etching silicon carbide using a nonmetallic mask layer. The method includes providing a silicon carbide substrate; forming a non-metallic mask layer by applying a layer of material on the substrate; patterning the mask layer to expose underlying areas of the substrate; and etching the underlying areas of the substrate with a plasma at a first rate, while etching the mask layer at a rate lower than the first rate.

  7. Silicon germanium mask for deep silicon etching

    Serry, Mohamed

    2014-07-29

    Polycrystalline silicon germanium (SiGe) can offer excellent etch selectivity to silicon during cryogenic deep reactive ion etching in an SF.sub.6/O.sub.2 plasma. Etch selectivity of over 800:1 (Si:SiGe) may be achieved at etch temperatures from -80 degrees Celsius to -140 degrees Celsius. High aspect ratio structures with high resolution may be patterned into Si substrates using SiGe as a hard mask layer for construction of microelectromechanical systems (MEMS) devices and semiconductor devices.

  8. Black Germanium fabricated by reactive ion etching

    Steglich, Martin; Käsebier, Thomas; Kley, Ernst-Bernhard; Tünnermann, Andreas

    2016-09-01

    A reactive ion etching technique for the preparation of statistical "Black Germanium" antireflection surfaces, relying on self-organization in a Cl2 etch chemistry, is presented. The morphology of the fabricated Black Germanium surfaces is the result of a random lateral distribution of pyramidal etch pits with heights around (1450 ± 150) nm and sidewall angles between 80° and 85°. The pyramids' base edges are oriented along the crystal directions of Germanium, indicating a crystal anisotropy of the etching process. In the Vis-NIR, the tapered Black Germanium surface structure suppresses interface reflection to structure in optoelectronics and IR optics.

  9. Dry etching technologies for reflective multilayer

    Iino, Yoshinori; Karyu, Makoto; Ita, Hirotsugu; Kase, Yoshihisa; Yoshimori, Tomoaki; Muto, Makoto; Nonaka, Mikio; Iwami, Munenori

    2012-11-01

    We have developed a highly integrated methodology for patterning Extreme Ultraviolet (EUV) mask, which has been highlighted for the lithography technique at the 14nm half-pitch generation and beyond. The EUV mask is characterized as a reflective-type mask which is completely different compared with conventional transparent-type of photo mask. And it requires not only patterning of absorber layer without damaging the underlying multi reflective layers (40 Si/Mo layers) but also etching multi reflective layers. In this case, the dry etch process has generally faced technical challenges such as the difficulties in CD control, etch damage to quartz substrate and low selectivity to the mask resist. Shibaura Mechatronics ARESTM mask etch system and its optimized etch process has already achieved the maximal etch performance at patterning two-layered absorber. And in this study, our process technologies of multi reflective layers will be evaluated by means of optimal combination of process gases and our optimized plasma produced by certain source power and bias power. When our ARES™ is used for multilayer etching, the user can choose to etch the absorber layer at the same time or etch only the multilayer.

  10. Los implantes de titanio con superficie grabada con ácidos: Un seguimiento clínico a 2 años Titanium implants with acid etched surface: A 2-year clinical follow-up

    E. Velasco Ortega

    2004-12-01

    Full Text Available Introducción. La tecnologia implantológica está mejorando la experiencia clínica de los implantes oseointegrados, con nuevos diseños y composición en su superficie. El estudio muestra la evaluación de los implantes oseointegrados de titanio con superficie grabada con ácidos y carga precoz en pacientes con pérdida dental unitaria, parcial y total. Métodos. 35 pacientes fueron tratados con 100 implantes TSA Defcon®, 53 en la mandibula y 47 en el maxilar superior. Todos los implantes fueron insertados en 1 fase quirúrgica. Los implantes fueron cargados funcionalmente tras un periodo de tiempo de 6 semanas (mandibula y de 8 semanas (maxilar superior. Los hallazgos clínicos (implantológicos y prostodóncicos se han seguido durante 2 años. Resultados. Tras la cicatrización (6-8 semanas, 19pacientes fueron restaurados con coronas unitarias (54,3%,9 pacientes con sobre dentaduras (25,7% y 7 pacientes con puentes fijos (20%, respectivamente. Se observaron complicaciones precoces, durante el periodo de cicatrización libre de carga funcional, en 3 implantes que fueron extraidos por movilidad. Estos resultados indican una supervivencia y éxito de los implantes, de 97%. Conclusiones. Los hallazgos clínicos del presente estudio sugieren que la utilización de los implantes de titanio con superficie grabada al ácido pueden obtener la oseointegración y ser cargados precozmente, representando un procedimiento técnico con éxito en los pacientes con pérdida de dientes.Introduction. Implant technology is improving the clinical experience of osseointegrated implants with new designs and compositions of their surfaceso This study reports the results of evaluation of titanium implants with acid-etched surface and early loading in patients with unitary, partially and fully tooth loss. Methods. 100 TSA Defcon® implants were inserted in 36 patients. 63 implants were placed in the mandible and 47 in the maxilla. All implants were inserted in one

  11. Restoration of obliterated engraved marks on steel surfaces by chemical etching reagent.

    Song, Qingfang

    2015-05-01

    Chemical etching technique is widely used for restoration of obliterated engraved marks on steel surface in the field of public security. The consumed thickness of steel surface during restoration process is considered as a major criterion for evaluating the efficiency of the chemical etching reagent. The thinner the consumed thickness, the higher the restoration efficiency. According to chemical principles, maintaining the continuous oxidative capabilities of etching reagents and increasing the kinetic rate difference of the reaction between the engraved and non-engraved area with the chemical etching reagent can effectively reduce the consumed steel thickness. The study employed steel surface from the engine case of motorcycle and the car frame of automobile. The chemical etching reagents are composed of nitric acid as the oxidizer, hydrofluoric acid as the coordination agent and mixed with glacial acetic acid or acetone as the solvents. Based on the performance evaluation of three different etching reagents, the one composed of HNO3, HF and acetone gave the best result.

  12. AFM and SEM study of the effects of etching on IPS-Empress 2 TM dental ceramic

    Luo, X.-P.; Silikas, N.; Allaf, M.; Wilson, N. H. F.; Watts, D. C.

    2001-10-01

    The aim of this study was to investigate the effects of increasing etching time on the surface of the new dental material, IPS-Empress 2 TM glass ceramic. Twenty one IPS-Empress 2 TM glass ceramic samples were made from IPS-Empress 2 TM ingots through lost-wax, hot-pressed ceramic fabrication technology. All samples were highly polished and cleaned ultrasonically for 5 min in acetone before and after etching with 9.6% hydrofluoric acid gel. The etching times were 0, 10, 20, 30, 60, 90 and 120 s respectively. Microstructure was analysed by scanning electron microscopy (SEM) and atomic force microscopy (AFM) was used to evaluate the surface roughness and topography. Observations with SEM showed that etching with hydrofluoric acid resulted in preferential dissolution of glass matrix, and that partially supported crystals within the glass matrix were lost with increasing etching time. AFM measurements indicated that etching increased the surface roughness of the glass-ceramic. A simple least-squares linear regression was used to establish a relationship between surface roughness parameters ( Ra, RMS), and etching time, for which r2>0.94. This study demonstrates the benefits of combining two microscopic methods for a better understanding of the surface. SEM showed the mode of action of hydrofluoric acid on the ceramic and AFM provided valuable data regarding the extent of surface degradation relative to etching time.

  13. Etch Pits and Threading Dislocations in GaN Films Grown by Metal-Organic Chemical Vapor Deposition

    陆敏; 常昕; 黎子兰; 杨志坚; 张国义; 章蓓

    2003-01-01

    High quality epitaxial GaN films on (0001) sapphire substrates were grown by a commercial metal-organic chemical vapour deposition system. The, etch pits and threading dislocations in GaN films is studied by a scanning electron microscope (SEM) and a transmission-electron microscope (TEM). The SEM images of GaN films, etched in mixed acid solution (H3PO4:H2SO4 = 1: 3) and molten KOH exhibit notably different, etching pit densities of 5 × 108/cm2 and 4 × 107/cm2, respectively, which probably indicate that more kinds of, etching pits were revealed when, etched in mixed acid solution (H3PO4:H2SO4 = 1: 3). Cross section TEM of GaN films with different g vectors showed the portions of different threading dislocations. Theoretical calculation indicates that the lattice and thermal expansion coefficient mismatch may be the main origins of pure edge threading dislocations.

  14. Anisotropic textured silicon obtained by stain-etching at low etching rates

    Gonzalez-DIaz, B [Departamento de Fisica Basica, Universidad de La Laguna, Avda, AstrofIsico Francisco Sanchez, 38204 La Laguna, S/C de Tenerife (Spain); Guerrero-Lemus, R [Departamento de Fisica Basica, Universidad de La Laguna, Avda, AstrofIsico Francisco Sanchez, 38204 La Laguna, S/C de Tenerife (Spain); Marrero, N [Departamento de Fisica Basica, Universidad de La Laguna, Avda, AstrofIsico Francisco Sanchez, 38204 La Laguna, S/C de Tenerife (Spain); Hernandez-RodrIguez, C [Departamento de Fisica Basica, Universidad de La Laguna, Avda, AstrofIsico Francisco Sanchez, 38204 La Laguna, S/C de Tenerife (Spain); Ben-Hander, F A [Departamento de Fisica Aplicada, C-XII, Universidad Autonoma de Madrid, 28049 Madrid (Spain); MartInez-Duart, J M [Departamento de Fisica Aplicada, C-XII, Universidad Autonoma de Madrid, 28049 Madrid (Spain)

    2006-02-21

    The structure, luminescence and etching kinetics for porous silicon stain-etched at different temperatures are studied. The results reveal that for temperatures below 10 deg. C and for short etching times, a novel anisotropic structure based on surface roughness preferentially oriented in the (100) direction is observed. At temperatures higher than 10 deg. C or large etching times, typical macropores and mesopores with non-preferential pore wall orientation are detected. The luminescence spectra of the samples with preferential surface roughness orientation are red-shifted with respect to the samples with typical isotropic orientation. The results are interpreted in terms of average etching rates and pore growth.

  15. Note: electrochemical etching of sharp iridium tips.

    Lalanne, Jean-Benoît; Paul, William; Oliver, David; Grütter, Peter H

    2011-11-01

    We describe an etching procedure for the production of sharp iridium tips with apex radii of 15-70 nm, as determined by scanning electron microscopy, field ion microscopy, and field emission measurements. A coarse electrochemical etch followed by zone electropolishing is performed in a relatively harmless calcium chloride solution with high success rate.

  16. Micro-textures in plagioclase from 1994e1995 eruption, Barren Island Volcano:Evidence of dynamic magma plumbing system in the Andaman subduction zone

    M.L. Renjith

    2014-01-01

    A systematic account of micro-textures and a few compositional profiles of plagioclase from high-alumina basaltic aa lava erupted during the year 1994e1995, from Barren Island Volcano, NE India ocean, are presented for the first time. The identified micro-textures can be grouped into two categories:(i) Growth related textures in the form of coarse/fine-sieve morphology, fine-scale oscillatory zoning and resorption surfaces resulted when the equilibrium at the crystal-melt interface was fluctuated due to change in temperature or H2O or pressure or composition of the crystallizing melt;and (ii) morphological texture, like glomerocryst, synneusis, swallow-tailed crystal, microlite and broken crystals, formed by the influence of dynamic behavior of the crystallizing magma (convection, turbulence, degassing, etc.). Each micro-texture has developed in a specific magmatic environment, accordingly, a first order magma plumbing model and crystallization dynamics are envisaged for the studied lava unit. Magma generated has undergone extensive fractional crystallization of An-rich plagioclase in stable magmatic environment at a deeper depth. Subsequently they ascend to a shallow chamber where the newly brought crystals and pre-existing crystals have undergone dynamic crystallization via dissolution-regrowth processes in a convective self-mixing environment. Such repeated recharge-recycling processes have produced various populations of plagioclase with different micro-textural stratigraphy in the studied lava unit. Intermittent degassing and eruption related decompression have also played a major role in the final stage of crystallization dynamics.

  17. Etch selectivity of a wet chemical formulation for premetal cleaning

    Epton, Jeremy W.; Jarrett, Deborah L.; Doohan, Ian J.

    2001-04-01

    This paper examines the relative etching rates of doped and thermal silicon dioxide when using NSSL etchant, comprising of a mixture of ammonium fluoride, water and ammonium dihydrogen phosphate [(NH4)H2PO4] and investigates their dependence on both temperature and mixture composition. The possible reaction mechanism is discussed and compared with the known mechanism for standard buffered oxide etchants (BOE). The observed etch selectivity and mechanisms of BOE and NSSL are also compared with the behavior of a third chemical formulation, referred to as mixed oxide etchant, which comprises of ammonium fluoride (NH4F) solution, diammonium hydrogen phosphate [(NH4)2HPO4] and orthophosphoric acid (H3PO4). It is concluded that no major change in oxide selectivity is observed if either BOE or NSSL etchants are used in the metal pre-clean process.

  18. Etching Behavior of Aluminum Alloy Extrusions

    Zhu, Hanliang

    2014-11-01

    The etching treatment is an important process step in influencing the surface quality of anodized aluminum alloy extrusions. The aim of etching is to produce a homogeneously matte surface. However, in the etching process, further surface imperfections can be generated on the extrusion surface due to uneven materials loss from different microstructural components. These surface imperfections formed prior to anodizing can significantly influence the surface quality of the final anodized extrusion products. In this article, various factors that influence the materials loss during alkaline etching of aluminum alloy extrusions are investigated. The influencing variables considered include etching process parameters, Fe-rich particles, Mg-Si precipitates, and extrusion profiles. This study provides a basis for improving the surface quality in industrial extrusion products by optimizing various process parameters.

  19. Graphene nanoribbons: Relevance of etching process

    Simonet, P., E-mail: psimonet@phys.ethz.ch; Bischoff, D.; Moser, A.; Ihn, T.; Ensslin, K. [Solid State Physics Laboratory, ETH Zurich, Zurich 8093 (Switzerland)

    2015-05-14

    Most graphene nanoribbons in the experimental literature are patterned using plasma etching. Various etching processes induce different types of defects and do not necessarily result in the same electronic and structural ribbon properties. This study focuses on two frequently used etching techniques, namely, O{sub 2} plasma ashing and O{sub 2 }+ Ar reactive ion etching (RIE). O{sub 2} plasma ashing represents an alternative to RIE physical etching for sensitive substrates, as it is a more gentle chemical process. We find that plasma ashing creates defective graphene in the exposed trenches, resulting in instabilities in the ribbon transport. These are probably caused by more or larger localized states at the edges of the ashed device compared to the RIE defined device.

  20. Selective enamel etching: effect on marginal adaptation of self-etch LED-cured bond systems in aged Class I composite restorations.

    Souza-Junior, E J; Prieto, L T; Araújo, C T P; Paulillo, L A M S

    2012-01-01

    The aim of this study was to evaluate the influence of previous enamel etch and light emitting diode (LED) curing on gap formation of self-etch adhesive systems in Class I composite restorations after thermomechanical aging (TMA). Thus, on 192 human molars, a box-shaped Class I cavity was prepared maintaining enamel margins. Self-etch adhesives (Clearfil SE and Clearfil S3) were used to restore the preparation with a microhybrid composite. Before application of the adhesives, half of the teeth were enamel etched for 15 seconds with 37% phosphoric acid; the other half were not etched. For the photoactivation of the adhesives and composite, three light-curing units (LCUs) were used: one polywave (Ultra-Lume LED 5, UL) and two single-peak (FlashLite 1401, FL and Radii-cal, RD) LEDs. After this, epoxy resin replicas of the occlusal surface were made, and the specimens were submitted to TMA. New replicas were made from the aged specimens for marginal adaptation analysis by scanning electron microscopy. Data were submitted to Kruskal-Wallis and Wilcoxon tests (α=0.05). Before TMA, when enamel was etched before the application of S3, no gap formation was observed; however, there were gaps at the interface for the other tested conditions, with a statistical difference (p≤0.05). After TMA, the selective enamel etching previous to the S3 application, regardless of the LCU, promoted higher marginal adaptation compared to the other tested groups (p≤0.05). Prior to TMA, higher marginal integrity was observed, in comparison with specimens after TMA (p≤0.05). With regard to Clearfil SE and Clearfil Tri-S cured with FL, no differences of gap formation were found between before and after aging (5.3 ± 3.8 and 7.4 ± 7.5, respectively), especially when the Clearfil Tri-S was used in the conventional protocol. When cured with RD or UL and not etched, Clearfil Tri-S presented the higher gap formation. In conclusion, additional enamel etching promoted better marginal integrity

  1. Surface passivation of silicon nanowires based metal nano-particle assisted chemical etching for photovoltaic applications

    Ben Rabha, Mohamed; Khezami, Lotfi; Jemai, Abdelbasset Bessadok; Alhathlool, Raed; Ajbar, Abdelhamid

    2017-03-01

    Metal Nano-particle Assisted Chemical Etching (MNpACE) is an extraordinary developed wet etching method for producing uniform semiconductor nanostructure (silicon nanowires) from patterned metallic film on crystalline silicon surface. The metal films facilitate the etching in HF and H2O2 solution and produce silicon nanowires (SiNWs).The creation of different SiNWs morphologies by changing the etching time and its effects on optical and optoelectronic properties was investigated. The combination effect of formed SiNWs and stain etching treatment in acid (HF/HNO3/H2O) solution on the surface morphology of Si wafers as well as on the optical and optoelectronic properties especially a PL response at 640 nm are presented. As a results, the effective lifetime (τeff) and surface recombination velocity (Seff) evolution of SiNWs after stain etching treatment showed significant improvements and less than 1% reflectance was achieved over the wavelength range of 400-800 nm and more than 36% reduction was observed compared to untreated surface. It has, thus, been demonstrated that all these factors may lead to improved energy efficiency from 8% to nearly 14.2% for a cell with SiNWs treated in acid (HF/HNO3/H2O) solution.

  2. Wet etching of InSb surfaces in aqueous solutions: Controlled oxide formation

    Aureau, D., E-mail: damien.aureau@chimie.uvsq.fr [Institut Lavoisier UVSQ-CNRS UMR 8180, 45 avenue des Etats Unis, Versailles, 78035 (France); Chaghi, R.; Gerard, I. [Institut Lavoisier UVSQ-CNRS UMR 8180, 45 avenue des Etats Unis, Versailles, 78035 (France); Sik, H.; Fleury, J. [Sagem Defense Sécurité, 72-74, rue de la tour Billy, 95101, Argenteuil Cedex (France); Etcheberry, A. [Institut Lavoisier UVSQ-CNRS UMR 8180, 45 avenue des Etats Unis, Versailles, 78035 (France)

    2013-07-01

    This paper investigates the wet etching of InSb surfaces by two different oxidant agents: Br{sub 2} and H{sub 2}O{sub 2} and the consecutive oxides generation onto the surfaces. The strong dependence between the chemical composition of the etching baths and the nature of the final surface chemistry of this low band-gap III–V semiconductor will be especially highlighted. One aqueous etching solution combined hydrobromic acid and Bromine (HBr–Br{sub 2}:H{sub 2}O) with adjusted concentrations. The other solution combines orthophosphoric and citric acids with hydrogen peroxide (H{sub 3}PO{sub 4}–H{sub 2}O{sub 2}:H{sub 2}O). Depending on its composition, each formulation gave rise to variable etching rate. The dosage of Indium traces in the etching solution by atomic absorption spectroscopy (AAS) gives the kinetic variation of the dissolution process. The variations on etching rates are associated to the properties and the nature of the formed oxides on InSb surfaces. Surface characterization is specifically performed by X-ray photoelectron spectroscopy (XPS). A clear evidence of the differences between the formed oxides is highlighted. Atomic force microscopy is used to monitor the surface morphology and pointed out that very different final morphologies can be reached. This paper presents new results on the strong variability of the InSb oxides in relation with the InSb reactivity toward environment interaction.

  3. Effect of wet etching process on the morphology and transmittance of fluorine doped tin oxide (FTO)

    Triana, S. L.; Kusumandari; Suryana, R.

    2016-11-01

    Wet etching process was performed on the surface of FTO. The FTO coated glasses subtrates with size of 2×2 cm covered by screen were patterned using zinc powder and concentrated hydrochloric acid (1 M). The substrates were then cleaned in ultrasonic baths of special detergent(helmanex) diluted in deionized water and isopropanol in sequence. The screens with various of hole size denotes by T32, T49 and T55 were used in order to create a pattern of surface textured. The atomic force microscopy (AFM) image revealed that wet etching process changes the morphology of FTO. It indicates that texturization occured. Moreover, from the UV-Vis Spectrophotometer measurement, the transmittance of FTO increase after wet etching process. The time of etching and pattern of screen were affect to the morphology and the transmittance of FTO.

  4. Optimal conditions for the preparation of superhydrophobic surfaces on al substrates using a simple etching approach

    Ruan, Min; Li, Wen; Wang, Baoshan; Luo, Qiang; Ma, Fumin; Yu, Zhanlong

    2012-07-01

    Many methods have been proposed to develop the fabrication techniques for superhydrophobic surfaces. However, such techniques are still at their infant stage and suffer many shortcomings. In this paper, the superhydrophobic surfaces on an Al substrate were prepared by a simple etching method. Effects of etching time, modifiers, and modification concentration and time were investigated, and optimal conditions for the best superhydrophobicity were studied. It was demonstrated that for etching the aluminum plate in Beck's dislocation, if the etching time was 15 s, modifier was Lauric acid-ethanol solution, and modification concentration and time was 5% and 1.5 h, respectively, the surface exhibited a water contact angle as high as 167.5° and a contact angle hysteresis as low as 2.3°.

  5. Wet Etching of Heat Treated Atomic Layer Chemical Vapor Deposited Zirconium Oxide in HF Based Solutions

    Balasubramanian, Sriram; Raghavan, Srini

    2008-06-01

    Alternative materials are being considered to replace silicon dioxide as gate dielectric material. Of these, the oxides of hafnium and zirconium show the most promise. However, integrating these new high-k materials into the existing complementary metal-oxide-semiconductor (CMOS) process remains a challenge. One particular area of concern is the wet etching of heat treated high-k dielectrics. In this paper, work done on the wet etching of heat treated atomic layer chemical vapor deposited (ALCVD) zirconium oxide in HF based solutions is presented. It was found that heat treated material, while refractory to wet etching at room temperature, is more amenable to etching at higher temperatures when methane sulfonic acid is added to dilute HF solutions. Selectivity over SiO2 is still a concern.

  6. Silver ion mediated shape control of platinum nanoparticles: Removal of silver by selective etching leads to increased catalytic activity

    Grass, Michael E.; Yue, Yao; Habas, Susan E.; Rioux, Robert M.; Teall, Chelsea I.; Somorjai, G.A.

    2008-01-09

    A procedure has been developed for the selective etching of Ag from Pt nanoparticles of well-defined shape, resulting in the formation of elementally-pure Pt cubes, cuboctahedra, or octahedra, with a largest vertex-to-vertex distance of {approx}9.5 nm from Ag-modified Pt nanoparticles. A nitric acid etching process was applied Pt nanoparticles supported on mesoporous silica, as well as nanoparticles dispersed in aqueous solution. The characterization of the silica-supported particles by XRD, TEM, and N{sub 2} adsorption measurements demonstrated that the structure of the nanoparticles and the mesoporous support remained conserved during etching in concentrated nitric acid. Both elemental analysis and ethylene hydrogenation indicated etching of Ag is only effective when [HNO{sub 3}] {ge} 7 M; below this concentration, the removal of Ag is only {approx}10%. Ethylene hydrogenation activity increased by four orders of magnitude after the etching of Pt octahedra that contained the highest fraction of silver. High-resolution transmission electron microscopy of the unsupported particles after etching demonstrated that etching does not alter the surface structure of the Pt nanoparticles. High [HNO{sub 3}] led to the decomposition of the capping agent, polyvinylpyrollidone (PVP); infrared spectroscopy confirmed that many decomposition products were present on the surface during etching, including carbon monoxide.

  7. 氢氟酸处理时间对可切削玻璃陶瓷粘接后断裂强度的影响%The influence of hydrofluoric acid etching time on fracture strength of cemented machinable glass ceramic

    黄宏; 张鹏; 黎日照

    2015-01-01

    目的:研究氢氟酸凝胶处理时间对可切削玻璃陶瓷粘接后断裂强度的影响。方法收集人离体磨牙50颗,垂直牙长轴磨除牙合面釉质;将CEREC Blocs可切削玻璃陶瓷瓷块加工成片状试件后,随机分成5组,每组10片,用质量分数9.5%的氢氟酸凝胶进行处理,处理时间分别为30 s( B组)、60 s( C组)、120 s( D组)、240 s ( E组),A组为对照组,不用氢氟酸凝胶处理;用Variolink® N粘接系统将处理后的瓷片与离体牙进行粘接,万能试验机上测试瓷片的断裂载荷,对数据进行单因素方差分析和LSD检验。结果 A组、B组、C组、D组、E组试件断裂载荷值分别为(1774±153) N、(2190±180) N、(2336±173) N、(2097±174) N、(2075±202) N。5组试件断裂载荷均数间的差异有统计学意义(F=13.5,P<0.001)。 LSD检验结果显示A组断裂载荷值均小于其余各组,差异均有统计学意义(P<0.05);C组载荷值大于D、E组,差异有统计学意义(P<0.05)。结论氢氟酸处理可提高试件粘接后的断裂强度,处理时间超过120 s后断裂强度下降,但仍高于不作氢氟酸处理组。%Objective To evaluate the fracture strength of cemented machinable glass ceramic after being etched with hydrofluoric acid for different time periods and provide guides for clinical hydrofluoric etching. Methods 50 human mo-lars were collected, and occlusal enamel was removed. Sirona CEREC Blocs were processed into plate-shape, divided in-to 5 groups and etched with hydrofluoric acid for 30 s ( Group B) , 60 s ( Group C) , 120 s ( Group D) and 240 s ( Group E) respectively, while Group A remained untreated. Then all specimens were cemented onto the collected molars with Variolink® N cement system. Fracture loads were measured with a universal testing machine. The results were analyzed by one-way ANOVA and LSD test. Results Fracture loads of Group A to E were ( 1 774 ± 153) N, ( 2 190 ± 180) N, ( 2 336 ± 173) N, ( 2 097 ± 174) N, ( 2

  8. An In Vitro Evaluation of Leakage of Two Etch and Rinse and Two Self-Etch Adhesives after Thermocycling

    Sabine Geerts

    2012-01-01

    interfaces. In our experiment Etch and Rinse adhesives remain better than Self-Etch adhesives at enamel interface. In addition, there was no statistical difference between 1-step (ADSE-1 and 2-step (ADSE Self-Etch adhesives.

  9. Effect evaluation of phosphoric acid etching combined with flowable composite resin in pit and fissure sealant of young per-manent molars%磷酸酸蚀结合流动树脂对年轻恒牙窝沟封闭的疗效分析

    谢妮娜; 宋文婷; 魏路明; 刘宗响

    2015-01-01

    Objective After the teeth were etched with 35%phosphoric acid,the first permanent molars were sealed by 3M flowable composite resin and common pit and fissure sealant so as to compare the retention rate and caries prevalence rate of dental caries by the two kinds of sealing material.Methods 240 permanent mandibular first molars with deep fissures and with no caries among 120 chil-dren of 7-9 years old were selected.The self export control method was used.According to the result of coin tossing,one side was cho-sen as the phosphoric acid +3M flowable resin group,and the other side the phosphoric acid etching +3M pit and fissure sealant group.After 3 months,6 months,12 months,and 24 months,pit and fissure sealant retention and caries rates were respectively exam-ined.Results In the 3rd and 6th months,pit and fissure sealant retention,and caries decrease rate between two groups were different with no statistical significance (P>0.05).In the 12th and 24th months,retention and caries decrease rates in the flowable composite resin group were higher than those in the pit and fissure sealant group,while caries incidence rate was lower than that in the pit and fis-sure sealant group.The differences were statistically significant (P<0.05).Conclusions The clinical effect of the phosphoric acid etching combined with flowable composite resin is better than that of phosphoric acid etching combined with pit and fissure sealant.The former method can increase retention rate of sealing materials,thus lowering prevalence rate of dental caries.%目的:比较3M流动树脂和3M窝沟封闭剂为第一恒磨牙行窝沟封闭术,2种材料窝沟封闭的保留率及龋病发生率情况。方法选择7~9岁120例240颗窝沟较深无龋的下颌第一恒磨牙,采用自身半口对照方法,掷币法随机选择一侧为3M流动树脂组,另一侧则为3M窝沟封闭剂组。于术后3、6、12、24个月复查,检查两组窝沟封闭材料的保留率和封闭后牙

  10. Effect of hydrofluoric acid etching time on the topography and surface roughness of lithium disilicate glass ceramic%氢氟酸处理对二硅酸锂玻璃陶瓷表面形貌及粗糙度的影响

    任冬锋; 骆小平

    2013-01-01

    目的 探讨氢氟酸处理时间对二硅酸锂玻璃陶瓷表面形貌及粗糙度的影响,拟为与之相关的玻璃陶瓷机械强度和树脂粘接强度做出初步解释.方法 采用失蜡铸造法制作直径10 mm、厚1 mm的玻璃陶瓷片状试件15个,打磨抛光之后随机分为5组,每组3个.陶瓷表面分别接受9.5%的氢氟酸凝胶酸蚀处理0、20、40、60和120 s.使用原子力显微镜(AFM)测量表面粗糙度参数和酸蚀深度,观测其表面三维形貌,并结合使用场发射扫描电子显微镜(FE-SEM)对陶瓷表面微观结构进行观察分析.结果 FE-SEM观察显示,陶瓷表面的玻璃基质首先被氢氟酸侵蚀溶解,随着酸蚀时间的延长,玻璃基质进一步被侵蚀,部分晶体结构也从陶瓷表面脱落、消失.AFM测量酸蚀表面得出,对照组、20、40、60和120 s氢氟酸处理组陶瓷片表面粗糙度Ra[分别为(17.2±1.6)、(241.8±23.6)、(290.6±38.2)、(322.6±19.6)和(371.3 ± 43.0) nm]随氢氟酸酸蚀时间的延长而显著增加(P<0.05),且与酸蚀时间成正相关.结论 氢氟酸处理可显著增加二硅酸锂陶瓷表面粗糙度.结合使用FE-SEM和AFM能够更好地对玻璃陶瓷的酸蚀表面微观形貌结构进行分析评价.%Objective To analyze the effect of hydrofluoric acid (HFA) etching time on the surface roughness and the topography of lithium disilicate glass ceramic.Methods Fifteen glass ceramic disks (10 mm in diameter and 1 mm in thickness) were made from IPS e.max(R) Press ingots by lost-wax,hot-pressed ceramic fabrication technology,and then divided randomly into five groups (three per group) after polishing.The ceramic surfaces of different groups were etched by 9.5% hydrofluoric acid gel for 0,20,40,60,and 120 s,respectively.Atomic force microscope (AFM) was used to evaluate the surface roughness and the 3D topography.Microstructure was also analyzed by the field emission scanning electron microscope (FE-SEM).Results The result showed

  11. Electroless epitaxial etching for semiconductor applications

    McCarthy, Anthony M.

    2002-01-01

    A method for fabricating thin-film single-crystal silicon on insulator substrates using electroless etching for achieving efficient etch stopping on epitaxial silicon substrates. Microelectric circuits and devices are prepared on epitaxial silicon wafers in a standard fabrication facility. The wafers are bonded to a holding substrate. The silicon bulk is removed using electroless etching leaving the circuit contained within the epitaxial layer remaining on the holding substrate. A photolithographic operation is then performed to define streets and wire bond pad areas for electrical access to the circuit.

  12. Effect of surface etching on condensing heat transfer

    Seok, Sung Chul; Park, Jae Won; Jung, Jiyeon; Choi, Chonggun; Choi, Gyu Hong; Hwang, Seung Sik; Chung, Tae Yong; Shin, Donghoon [Kookmin University, Seoul (Korea, Republic of); Kim, Jin Jun [Hoseo University, Asan (Korea, Republic of)

    2016-02-15

    This study conducted experiments on humid air condensation during heat transfer in an air preheating exchanger attached to a home condensing boiler to improve thermal efficiency. An etchant composed of sulfuric acid and sodium nitrate was used to create roughness on the heat exchanger surface made from STS430J1L. A counter flow heat exchanger was fabricated to test the performance of heat transfer. Results showed that the overall heat transfer coefficients of all specimens treated with etchant improved with respect to the original specimens (not treated with etchant), and the overall heat transfer coefficient of the 60 s etching specimen increased by up to 15%. However, the increasing rate of the heat transfer coefficient was disproportional to the etching time. When the etching time specifically increased above 60 s, the heat transfer coefficient decreased. This effect was assumed to be caused by surface characteristics such as contact angle. Furthermore, a smaller contact angle or higher hydrophilicity leads to higher heat transfer coefficient.

  13. A microtexture investigation of recrystallization during friction stir processing of as-cast NiAl bronze

    Oh-Ishi, Keiichiro; Zhilyaev, Alexander P.; McNelley, Terry R.

    2006-07-01

    As-cast NiAl bronze (NAB) was subjected to friction stir processing (FSP). Orientation imaging microscopy (OIM) methods were used to obtain microtexture data in the stir zone (SZ) and along its periphery. At selected SZ locations, orientation data were obtained by convergent beam electron diffraction (CBED) methods in transmission electron microscopy (TEM). Random α phase textures were apparent in the SZ. The α grains tended to be equiaxed, exhibited annealing twins, and were refined to 1 to 2 µm at the edge of the SZ. The population of subgrain boundaries in α phase grains was highest near the plate surface in contact with the tool and decreased with depth in the SZ, reflecting deformation by the tool shoulder after the passage of the tool pin. Distinct shear texture components were apparent in the thermomechanically affected zone (TMAZ) outside of and along the periphery of the SZ. A texture gradient from the TMAZ into the SZ was apparent and was steeper on the advancing side and under the SZ center than on the retreating side. The apparent shear plane tended to align with the local interface between the SZ and TMAZ, while the shear direction tended to align with the FSP traversing direction. In this material, the SZ-TMAZ interface is a distinct boundary between recrystallized and deformed regions and the α-phase grain refinement reflects dynamic recrystallization and, in locations near the SZ-TMAZ interface, particle-stimulated nucleation (PSN) at undissolved Fe3Al particles.

  14. Freeze fracture and freeze etching.

    Chandler, Douglas E; Sharp, William P

    2014-01-01

    Freeze fracture depends on the property of frozen tissues or cells, when cracked open, to split along the hydrophobic interior of membranes, thus revealing broad panoramas of membrane interior. These large panoramas reveal the three-dimensional contours of membranes making the methods well suited to studying changes in membrane architecture. Freshly split membrane faces are visualized by platinum or tungsten shadowing and carbon backing to form a replica that is then cleaned of tissue and imaged by TEM. Etching, i.e., removal of ice from the frozen fractured specimen by sublimation prior to shadowing, can also reveal the true surfaces of the membrane as well as the extracellular matrix and cytoskeletal networks that contact the membranes. Since the resolution of detail in the metal replicas formed is 1-2 nm, these methods can also be used to visualize macromolecules or macromolecular assemblies either in situ or displayed on a mica surface. These methods are available for either specimens that have been chemically fixed or specimens that have been rapidly frozen without chemical intervention.

  15. Effects of etching and adhesive applications on the bond strength between composite resin and glass-ionomer cements

    Tijen Pamir

    2012-12-01

    Full Text Available OBJECTIVE: This study determined the effects of various surface treatment modalities on the bond strength of composite resins to glass-ionomer cements. MATERIAL AND METHODS: Conventional (KetacTM Molar Quick ApplicapTM or resin-modified (PhotacTM Fil Quick AplicapTM glass-ionomer cements were prepared. Two-step etch-rinse & bond adhesive (AdperTM Single Bond 2 or single-step self-etching adhesive (AdperTM PromptTM L-PopTM was applied to the set cements. In the etch-rinse & bond group, the sample surfaces were pre-treated as follows: (1 no etching, (2 15 s of etching with 35% phosphoric acid, (3 30 s of etching, and (4 60 s of etching. Following the placement of the composite resin (FiltekTM Z250, the bond strength was measured in a universal testing machine and the data obtained were analyzed with the two-way analysis of variance (ANOVA followed by the Tukey's HSD post hoc analysis (p=0.05. Then, the fractured surfaces were examined by scanning electron microscopy. RESULTS: The bond strength of the composite resin to the conventional glass-ionomer cement was significantly lower than that to the resin-modified glass-ionomer cement (p0.05. However, a greater bond strength was obtained with 30 s of phosphoric acid application. CONCLUSIONS: The resin-modified glass-ionomer cement improved the bond strength of the composite resin to the glass-ionomer cement. Both etch-rinse & bond and self-etching adhesives may be used effectively in the lamination of glass-ionomer cements. However, an etching time of at least 30 s appears to be optimal.

  16. Semiconductor structure and recess formation etch technique

    Lu, Bin; Sun, Min; Palacios, Tomas Apostol

    2017-02-14

    A semiconductor structure has a first layer that includes a first semiconductor material and a second layer that includes a second semiconductor material. The first semiconductor material is selectively etchable over the second semiconductor material using a first etching process. The first layer is disposed over the second layer. A recess is disposed at least in the first layer. Also described is a method of forming a semiconductor structure that includes a recess. The method includes etching a region in a first layer using a first etching process. The first layer includes a first semiconductor material. The first etching process stops at a second layer beneath the first layer. The second layer includes a second semiconductor material.

  17. Influence of the LED curing source and selective enamel etching on dentin bond strength of self-etch adhesives in class I composite restorations.

    Souza-Junior, Eduardo José; Araújo, Cíntia Tereza Pimenta; Prieto, Lúcia Trazzi; Paulillo, Luís Alexandre Maffei Sartini

    2012-11-01

    The aim of this study was to evaluate the influence of the LED curing unit and selective enamel etching on dentin microtensile bond strength (μTBS) for self-etch adhesives in class I composite restorations. On 96 human molars, box-shaped class I cavities were made maintaining enamel margins. Self-etch adhesives (Clearfil SE - CSE and Clearfil S(3) - S3) were used to bond a microhybrid composite. Before adhesive application, half of the teeth were enamel acid-etched and the other half was not. Adhesives and composites were cured with the following light curing units (LCUs): one polywave (UltraLume 5 - UL) and two single-peak (FlashLite 1401 - FL and Radii Cal - RD) LEDs. The specimens were then submitted to thermomechanical aging and longitudinally sectioned to obtain bonded sticks (0.9 mm(2)) to be tested in tension at 0.5 mm/min. The failure mode was then recorded. The μTBS data were submitted to a three-way ANOVA and Tukey's (α = 0.05). For S3, the selective enamel-etching provided lower μTBS values (20.7 ± 2.7) compared to the non-etched specimens (26.7 ± 2.2). UL yielded higher μTBS values (24.1 ± 3.2) in comparison to the photoactivation approach with FL (18.8 ±3.9) and RD (19.9 ±1.8) for CSE. The two-step CSE was not influenced by the enamel etching (p ≥ 0.05). Enamel acid etching in class I composite restorations affects the dentin μTBS of the one-step self-etch adhesive Clearfil S(3), with no alterations for Clearfil SE bond strength. The polywave LED promoted better bond strength for the two-step adhesive compared to the single-peak ones.

  18. Investigation of defects and surface polarity in GaN using hot wet etching together with microscopy and diffraction techniques

    Visconti, P.; Huang, D.; Reshchikov, M.A.; Yun, F.; Cingolani, R.; Smith, D.J.; Jasinski, J.; Swider, W.; Liliental-Weber, Z.; Morkoc, H.

    2002-04-08

    The availability of reliable and quick methods to determine defect density and polarity in GaN films is of great interest. We have used photo-electrochemical (PEC) and hot wet etching using H{sub 3}PO{sub 4} and molten KOH to estimate the defect density in GaN films grown by hydride vapor phase epitaxy (HVPE) and molecular beam epitaxy (MBE). Free-standing whiskers and hexagonal etch pits are formed by PEC and wet etching respectively. Using Atomic Force Microscopy (AFM), we found the whisker density to be similar to etch pit densities for samples etched under precise conditions. Additionally Transmission Electron Microscopy (TEM) observations confirmed dislocation densities obtained by etching which increased our confidence in the consistency of methods used. Hot wet etching was used also to investigate the polarity of GaN films together with Convergent Beam Electron Diffraction (CBED) and AFM imaging. We found that hot H{sub 3}PO{sub 4} etches N-polarity GaN films very quickly resulting in the complete removal or drastic change of surface morphology as revealed by AFM or optical microscopy. On the contrary, the acid attacks only defect sites in Ga-polarity films producing nanometer-scale pits but leaving the defect-free GaN intact and the morphology unchanged. Additionally, the polarity assignments were related to the as-grown morphology and to the growth conditions of the buffer layer and the subsequent GaN layer.

  19. Plasma/Neutral-Beam Etching Apparatus

    Langer, William; Cohen, Samuel; Cuthbertson, John; Manos, Dennis; Motley, Robert

    1989-01-01

    Energies of neutral particles controllable. Apparatus developed to produce intense beams of reactant atoms for simulating low-Earth-orbit oxygen erosion, for studying beam-gas collisions, and for etching semiconductor substrates. Neutral beam formed by neutralization and reflection of accelerated plasma on metal plate. Plasma ejected from coaxial plasma gun toward neutralizing plate, where turned into beam of atoms or molecules and aimed at substrate to be etched.

  20. Improved thrombogenicity on oxygen etched Ti6Al4V surfaces

    Riedel, Nicholas A. [Department of Mechanical Engineering, Colorado State University, Fort Collins, CO 80523 (United States); Smith, Barbara S. [School of Biomedical Engineering, Colorado State University, Fort Collins, CO 80523 (United States); Williams, John D. [Department of Mechanical Engineering, Colorado State University, Fort Collins, CO 80523 (United States); Popat, Ketul C., E-mail: ketul.popat@colostate.edu [Department of Mechanical Engineering, Colorado State University, Fort Collins, CO 80523 (United States); School of Biomedical Engineering, Colorado State University, Fort Collins, CO 80523 (United States)

    2012-07-01

    Thrombus formation on blood contacting biomaterials continues to be a key factor in initiating a critical mode of failure in implantable devices, requiring immediate attention. In the interest of evaluating a solution for one of the most widely used biomaterials, titanium and its alloys, this study focuses on the use of a novel surface oxidation treatment to improve the blood compatibility. This study examines the possibility of using oblique angle ion etching to produce a high quality oxide layer that enhances blood compatibility on medical grade titanium alloy Ti6Al4V. An X-ray photoelectron spectroscopy (XPS) analysis of these oxygen-rich surfaces confirmed the presence of TiO{sub 2} peaks and also indicated increased surface oxidation as well as a reduction in surface defects. After 2 h of contact with whole human plasma, the oxygen etched substrates demonstrated a reduction in both platelet adhesion and activation as compared to bare titanium substrates. The whole blood clotting behavior was evaluated for up to 45 min, showing a significant decrease in clot formation on oxygen etched substrates. Finally, a bicinchoninic acid (BCA) total protein assay and XPS were used to evaluate the degree of key blood serum protein (fibrinogen, albumin, immunoglobulin G) adsorption on the substrates. The results showed similar protein levels for both the oxygen etched and control substrates. These results indicate that oblique angle oxygen etching may be a promising method to increase the thrombogenicity of Ti6Al4V. - Highlights: Black-Right-Pointing-Pointer Oblique angle oxygen ion etching creates a high quality, uniform oxide surface. Black-Right-Pointing-Pointer Oxygen etched substrates showed fewer adhered platelets. Black-Right-Pointing-Pointer Platelet activation was reduced by the improved oxide surface. Black-Right-Pointing-Pointer Oxygen etched substrates exhibited increased whole blood clotting times. Black-Right-Pointing-Pointer Although clotting reductions were

  1. RNA of tobacco etch virus contains poly(A)

    Hari, V.; Siegel, A.; Rozek, C.; Timberlake, W.E.

    1979-01-30

    The RNA of tobacco etch virus was extracted and found to have a molecular weight of 3.2 x 10/sup 6/ based on an extrapolation from polyacrylamide-gel electrophoresis mobility. The RNA from the virus could be separated into two classes, one containing and one lacking polyadenylate isostichs of sufficient length to bind to polyuridylic-acid-agarose. The two classes were present in variable amounts depending on the batch of virus used for isolation of RNA and both classes were infectious.

  2. Development of Localized Plasma Etching System for Failure Analyses in Semiconductor Devices: (3)Etching-Monitoring Using Quadrupole Mass Spectrometry

    Takahashi, Satoshi; Horie, Tomoyuki; Shirayama, Yuya; Yokosuka, Shuntaro; Kashimura, Kenta; Hayashi, Akihiro; Iwase, Chikatsu; Shimbori, Shun'ichiro; Tokumoto, Hiroshi; Naitoh, Yasuhisa; Shimizu, Tetsuo

    Quadrupole mass spectrometry (QMS) has been applied to monitor the etching processes in a localized plasma etching system. An inward plasma was employed for etching in which the etching gas was discharged in the narrow gap between the etched sample and the entrance of an evacuating capillary tube. As the etching products are immediately evacuated through the capillary, a QMS system equipped at the capillary exit is able to analyze the products without any loss in concentration via diffusion into the chamber. Two kinds of samples, thermally grown SiO2 on Si and spin-coated polyimide film on Si, were etched, and the chemical species in the evacuated etching gas were analyzed with QMS, which enables monitoring of the composition of the surface being etched. Samples of thermal SiO2 were etched with CF4 plasma. The peak height of the SiF3+ signal during the SiO2 etching was lower than that observed during etching of the silicon substrate, leading to endpoint detection. The endpoint detection of the polyimide film etching was conducted using two etching gases: pure O2 and pure CF4. When O2 was used, the endpoint was detected by the decrease of the mass peak attributed to CO. When CF4 was employed, the plasma was able to etch both the polyimide film and Si substrate. Then the endpoint was detected by the increase of the mass peak of SiF3+ produced by the etching of the Si substrate.

  3. Peculiarities of latent track etching in SiO2/Si structures irradiated with Ar, Kr and Xe ions

    Al'zhanova, A.; Dauletbekova, A.; Komarov, F.; Vlasukova, L.; Yuvchenko, V.; Akilbekov, A.; Zdorovets, M.

    2016-05-01

    The process of latent track etching in SiO2/Si structures irradiated with 40Ar (38 MeV), 84Kr (59 MeV) and 132Xe (133 and 200 MeV) ions has been investigated. The experimental results of SiO2 etching in a hydrofluoric acid solution have been compared with the results of computer simulation based on the thermal spike model. It has been confirmed that the formation of a molten region along the swift ion trajectory with minimum radius of 3 nm can serve as a theoretical criterion for the reproducible latent track etching tracks in SiO2.

  4. Polymerization monitoring in plasma etching systems

    Kim, Jinsoo

    1999-11-01

    In plasma etching processes, the polymers used to enhance etch anisotropy and selectivity also deposit on various parts of the reaction chamber. This polymerization on reactor surface not only strongly affects the concentration of reactants in the plasma discharge, eventually changing the etching characteristics, but also can produce particulates which lower yield. This thesis explores the development of a direct in-situ polymerization monitoring sensor to minimize the drifts in plasma etching processes. In addition, polymerization dependencies on basic processing parameters and polymerization effects on etching characteristics have been explored for the first time using a direct in-situ sensor. The polymer buildup process is a strong function of parameters such as power, base pressure, and flow rate, and is also dependent on the reactor materials used, temperature, and the hydrogen/oxygen concentrations present. Experiments performed in an Applied Materials 8300 plasma etcher show a significant increase in polymerization with increased pressure and flow rates and a decrease as a function of power. These experiments provide insight into how the chamber state changes under the different processing recipes used for etching specific material layers and also suggest how the chamber seasoning process can best be carried out. The reactor surface, which serves as both a source and a sink for reactive gas species, not only strongly affects the concentration of reactants in the plasma discharge, eventually changing the etching characteristics, but also can produce particulates which lower yield. The etch rate and selectivity variations for specific silicon dioxide and silicon nitride etching recipes have been explored as a function of the polymer thickness on the reactor walls. The etch rates of nitride and polysilicon decrease dramatically with polymer thickness up to a thickness of 60nm, while the oxide etch rate remains virtually constant due to the polymerization

  5. Effect of helium ion beam treatment on the etching rate of silicon nitride

    Petrov, Yu.V., E-mail: y.petrov@spbu.ru; Sharov, T.V.; Baraban, A.P.; Vyvenko, O.F.

    2015-04-15

    We investigated the effect of the helium ion implantation on the etching rate of silicon nitride in hydrofluoric acid. 30 keV helium ions were implanted into a 500-nm-thick silicon nitride film on silicon. Ion fluences from 10{sup 15} to 10{sup 17} cm{sup −2} were used. Etching was performed in a hydrofluoric acid solution. All samples were investigated with a scanning electron microscope and atomic force microscope. It was found that helium ion implantation can increase the etching rate by a factor of three. This results in the formation of a well in the implanted area after etching. The maximum depth of the well is about 180 nm and is limited by the penetration depth of 30 keV helium ions. Two possible reasons for enhanced etching are suggested: enhancement by ion-induced defects and electrostatic interaction of ions of the etchant with ion-induced space charge of silicon nitride. The recombination of ion-induced defects is also discussed.

  6. 基于丙烯酸-丙烯酰胺共聚物的氧化铟锡蚀刻油墨的制备与性能%Preparation and Properties of Indium Tin Oxide Etching Ink Based on Acrylic Acid-Acrylamide Copolymer

    钟英立; 杨鑫; 孙金媛; 陈建忠; 刘英菊; 杨卓鸿

    2012-01-01

    The low viscosity poly (acrylic acid-acrylamide) (P (AA-co-AM)) resin was synthesized by solution polymerization using acrylicacid and acrylamide as the monomers. The properties of the resin were characterized by rotational viscometer and thermogravimetric analyser. A new type of indium tin oxide (ITO) etching ink was prepared using P(AA-co-AM) resin as connection material. The water retention property, pH change and etched image resolution of the ink were evaluated. Results showed that the suit- able resin can be prepared by optimizing the synthesis process. The so prepared resin didn't decompose beneath 150 ℃. The water loss rate of the ink was range 3.68% and 5.34%after exposing to air for 3 h. The image resolution used this ink was better than the commercially available ink after storing 60 d. More over, the etching capability did not decline and pH value almost did not change.%以丙烯酸(AA)、丙烯酰胺(AM)为单体,采用水溶液聚合法制备了低黏度聚(丙烯酸-丙烯酰胺)P(AA—Co—AM)树脂。使用旋转黏度计和热重分析仪等测试了树脂的性质,并以该树脂为连接料,制备了新型水性氧化铟锡(ITO)蚀刻油墨。探讨了该油墨的保水性、pH变化和蚀刻图像解析度等。结果表明:通过优化合成工艺可制备分子量适宜的P(AA—CO—AM)树脂,它在150℃以下无分解现象;油墨在使用3h后失水率仅为3.68%-5.34%,存放60d后pH基本无变化,且丝网印刷效果明显好于市售油墨。

  7. An etching mask and a method to produce an etching mask

    2016-01-01

    The present invention relates to an etching mask comprising silicon containing block copolymers produced by self-assembly techniques onto silicon or graphene substrate. Through the use of the etching mask, nanostructures having long linear features having sub-10 nm width can be produced....

  8. Wetting effects on in vitro bioactivity and in vitro biocompatibility of laser micro-textured Ca-P coating.

    Paital, Sameer R; Cao, Zheng; He, Wei; Dahotre, Narendra B

    2010-06-01

    Calcium phosphate (Ca-P) coating on the Ti-6Al-4V alloy enhances osteoblast adhesion and tissue formation at the bone implant interface. In light of this, in the current work a laser-based coating technique was used to synthesize two different micro-textured (100 microm and 200 microm spaced line patterns) Ca-P coatings on the Ti-6Al-4V alloy and its effect on wettability and osteoblast cell adhesion were systematically studied. X-ray diffraction (XRD) analysis of the coated samples indicated the presence of precursor material, Ca10(PO4)6(OH)2 (HA) and various other additional phases such as CaTiO3, Ca3(PO4)2, TiO2 (anatase) and TiO2 (rutile) owing to the reaction between the precursor (HA) and substrate (Ti-6Al-4V) during laser processing. Confocal laser scanning microscopy-based characterization of coated samples indicated that the samples processed at 100 microm line spacing demonstrated a reduced surface roughness and smaller texture parameter value as compared to the samples processed at 200 microm spacing. The surface energy and wettability of the 100 microm spaced samples measured using a static sessile drop technique demonstrated higher surface energy and increased hydrophilicity as compared to the control (untreated Ti-6Al-4V) and the samples processed at 200 microm spacing. The tendency of coated samples for mineralization through generation of an apatite-like phase during immersion in a simulated body fluid was indicative of their in vitro bioactive nature. In light of higher surface energy and increased hydrophilicity the in vitro biocompatibility of the samples with 100 microm line spacing was demonstrated through increased cell proliferation and cell adhesion of mouse MC3T3-E1 osteoblast-like cells.

  9. Dry etched SiO2 Mask for HgCdTe Etching Process

    Chen, Y. Y.; Ye, Z. H.; Sun, C. H.; Deng, L. G.; Zhang, S.; Xing, W.; Hu, X. N.; Ding, R. J.; He, L.

    2016-09-01

    A highly anisotropic etching process with low etch-induced damage is indispensable for advanced HgCdTe (MCT) infrared focal plane array (IRFPA) detectors. The inductively coupled plasma (ICP) enhanced reactive ion etching technique has been widely adopted in manufacturing HgCdTe IRFPA devices. An accurately patterned mask with sharp edges is decisive to accomplish pattern duplication. It has been reported by our group that the SiO2 mask functions well in etching HgCdTe with high selectivity. However, the wet process in defining the SiO2 mask is limited by ambiguous edges and nonuniform patterns. In this report, we patterned SiO2 with a mature ICP etching technique, prior to which a thin ZnS film was deposited by thermal evaporation. The SiO2 film etching can be terminated at the auto-stopping point of the ZnS layer thanks to the high selectivity of SiO2/ZnS in SF6 based etchant. Consequently, MCT etching was directly performed without any other treatment. This mask showed acceptable profile due to the maturity of the SiO2 etching process. The well-defined SiO2 pattern and the etched smooth surfaces were investigated with scanning electron microscopy and atomic force microscope. This new mask process could transfer the patterns exactly with very small etch-bias. A cavity with aspect-ratio (AR) of 1.2 and root mean square roughness of 1.77 nm was achieved first, slightly higher AR of 1.67 was also get with better mask profile. This masking process ensures good uniformity and surely benefits the delineation of shrinking pixels with its high resolution.

  10. Facet selective etching of Au microcrystallites

    Gangaiah Mettela and Giridhar U. Kulkarni

    2015-01-01

    High-symmetry crystals exhibit isotropic properties. Inducing anisotropy, e.g., by facet selective etching, is considered implausible in face-centered cubic (FCC) metals, particularly gold, which, in addition to being an FCC, is noble. We report for the first time the facet selective etching of Au microcrystals obtained in the form of cuboctahedra and pentagonal rods from the thermolysis of a gold- organic precursor. The selective etching of {111} and {100} facets was achieved using a capping method in which tetraoctylammonium cations selectively cap the {111} facets while Br- ions protect the {100} facets. The exposed facets are oxidized by O2/C1-, yielding a variety of interesting geometries. The facet selective etching of the Au microcrystallites is governed only by the nature of the facets; the geometry of the microcystallite does not appear to play a significant role. The etched surfaces appear rough, but a closer examination reveals well-defined corrugations that are indexable to high hkl values. Such surfaces exhibit enhanced Raman activity.

  11. Photoelectrochemistry and Etching of SiC: a Comparison with Si

    Kelly, J.J.; van Dorp, D.H.; Weyher, J.L.

    2007-01-01

    The anodic electrochemistry and etching of the group IV compound semiconductor SiC was studied in both KOH and acidic fluoride solutions. The results for p-type and n-type electrodes are compared with those obtained for the group IV elemental semiconductor Si. We point out a number of interesting ap

  12. Biomechanical and histomorphometric analysis of etched and non-etched resorbable blasting media processed implant surfaces: an experimental study in dogs.

    Marin, Charles; Granato, Rodrigo; Suzuki, Marcelo; Janal, Malvin N; Gil, Jose N; Nemcovsky, Carlos; Bonfante, Estevam A; Coelho, Paulo G

    2010-07-01

    This study characterized the interplay between topography/chemistry and early bone response of etched and no-etched resorbable blasted media (RBM) processed surfaces. Screw-root form Ti-6Al-4V implants treated with alumina blasting/acid-etching (AB/AE), RBM alone (RBM), and RBM + acid-etching (RBMa) were evaluated. The surface was characterized by scanning electron microscopy, atomic force microscopy, and X-ray photoelectron spectroscopy. Implants placed in the tibia of dogs remained 3 and 5 weeks in vivo. Following euthanasia, half of the specimens were torqued to interface failure and the remaining subjected to bone-to-implant contact (BIC) and bone area fraction occupied (BAFO) between threads evaluation. The AB/AE surface was rougher than the RBM and RBMa. Higher levels of calcium and phosphorous were observed for the RBM surface compared to the RBMa. No significant differences were observed in torque, BIC, and BAFO between surfaces. Woven bone formation at 3 weeks and its initial replacement by lamellar bone at 5 weeks were observed around all implants' surfaces.

  13. 柠檬酸对腐蚀铝箔高压阳极氧化膜微观结构与电化学性能的影响%Effect of citric acid on microstructure and electrochemical characteristics of high voltage anodized alumina film formed on etched Al Foils

    班朝磊; 何业东; 邵鑫

    2011-01-01

    将高压铝电解电容器用腐蚀铝箔与沸水反应,然后再在硼酸溶液或硼酸-柠檬酸混合酸溶液中进行530 V高压阳极氧化制得耐压薄膜,应用透射电镜(TEM)、X射线衍射(XRD)研究不同电解液所形成的高压阳极氧化膜的微观结构与结晶程度,利用电化学交流阻抗(EIS)、LCR数字电桥与小电流充电测试阳极氧化膜的电化学性能.结果表明:高压阳极氧化膜具有明显层状结构,内层结晶程度较高、外层结晶程度较低;与单纯硼酸溶液所形成的氧化膜相比,混合酸液所形成的阳极氧化膜的外层结晶程度与晶粒平均尺寸较大,抗电场强度与比电容均比较高,但相变使得氧化膜外层微观缺陷密度增多,氧化膜比电阻与耐电压值有所降低.%Aluminum capacitor foils with a tunnel etch structure were reacted with boiling water and then anodized at 530 V in boric acid solution or boric acid+citric acid mixed solution. The microstructure and crystallinity of the resulting anodized film were examined by TEM and XRD. The special capacitance, resistance and withstanding voltage of the film were explored with electrochemical impedance spectroscopy (EIS), LCR meter and small-current charging. The results show that the high voltage anodized oxide film consists of an inner layer with high crystallinity and an outer layer with low crystallinity. However, the crystallinity of the film formed in boric acid+citric acid mixed solution is higher than that of the film formed in only boric acid solution, leading to an increase in film's field strength and special capacitance. Meanwhile, there are more defects from phase transformation in the out layer of the film formed in boric acid+citric acid mixed solution than in that of film formed in only boric acid solution, leading to a decrease in film's resistance and withstanding voltage.

  14. Analytical model of plasma-chemical etching in planar reactor

    Veselov, D. S.; Bakun, A. D.; Voronov, Yu A.; Kireev, V. Yu; Vasileva, O. V.

    2016-09-01

    The paper discusses an analytical model of plasma-chemical etching in planar diode- type reactor. Analytical expressions of etch rate and etch anisotropy were obtained. It is shown that etch anisotropy increases with increasing the ion current and ion energy. At the same time, etch selectivity of processed material decreases as compared with the mask. Etch rate decreases with the distance from the centre axis of the reactor. To decrease the loading effect, it is necessary to reduce the wafer temperature and pressure in the reactor, as well as increase the gas flow rate through the reactor.

  15. Single beam determination of porosity and etch rate in situ during etching of porous silicon

    Foss, S. E.; Kan, P. Y. Y.; Finstad, T. G.

    2005-06-01

    A laser reflection method has been developed and tested for analyzing the etching of porous silicon (PS) films. It allows in situ measurement and analysis of the time dependency of the etch rate, the thickness, the average porosity, the porosity profile, and the interface roughness. The interaction of an infrared laser beam with a layered system consisting of a PS layer and a substrate during etching results in interferences in the reflected beam which is analyzed by the short-time Fourier transform. This method is used for analysis of samples prepared with etching solutions containing different concentrations of HF and glycerol and at different current densities and temperatures. Variations in the etch rate and porosity during etching are observed, which are important effects to account for when optical elements in PS are made. The method enables feedback control of the etching so that PS films with a well-controlled porosity are obtainable. By using different beam diameters it is possible to probe interface roughness at different length scales. Obtained porosity, thickness, and roughness values are in agreement with values measured with standard methods.

  16. Etching patterns on the micro‐ and nanoscale

    Michael-Lindhard, Jonas; Herstrøm, Berit; Stöhr, Frederik;

    2014-01-01

    in a liquid reacts with material from the substrate is the ability to fine‐tune the etch process. In wet processing the removal of material generally occurs indiscriminately of direction in the substrate ‐ hence in all directions. This puts a strong limitation on what may be achieved in terms of designs...... and polymer injection molding. High precision patterns of, for instance microfluidic devices, are etched intosilicon which is then electroplated with nickel that will serve as a stamp in the polymer injection molding tool where thousands of devices may be replicated. In addition to silicon and its derived...

  17. Effects of chlorhexidine in self-etching adhesive: 24 hours results.

    Nishitani, Yoshihiro; Hosaka, Keiichi; Hoshika, Tomohiro; Yoshiyama, Masahiro; Pashley, David H

    2013-01-01

    It is known that chlorhexidine (CHX) does not inhibit micro-tensile bond strengths (MTBS) when it is used in etch-and-rinse adhesives. In that technique, CHX is applied to dentin as a primer after phosphoric acid-etching before bonding with Single Bond. It would be more convenient if it is possible to incorporate CHX into the adhesive. The purpose of this study was to compare the MTBS and the FT-IR percent conversion of an all-in-one self-etching adhesives contained varying concentration of CHX. Extracted human third molars were bonded with a control all-in-one adhesive or experimental versions containing 0.5, 1, 2 or 5% CHX. The MTBS and the percent conversion of experimental adhesives containing up to 1% CHX were not significantly CHX-free control adhesives. However, addition of 2 or especially 5% CHX experimental adhesives produced significant reductions in both the MTBS and the percent conversion.

  18. Nanometer scale high-aspect-ratio trench etching at controllable angles using ballistic reactive ion etching

    Cybart, Shane; Roediger, Peter; Ulin-Avila, Erick; Wu, Stephen; Wong, Travis; Dynes, Robert

    2012-11-30

    We demonstrate a low pressure reactive ion etching process capable of patterning nanometer scale angled sidewalls and three dimensional structures in photoresist. At low pressure the plasma has a large dark space region where the etchant ions have very large highly-directional mean free paths. Mounting the sample entirely within this dark space allows for etching at angles relative to the cathode with minimal undercutting, resulting in high-aspect ratio nanometer scale angled features. By reversing the initial angle and performing a second etch we create three-dimensional mask profiles.

  19. Polymer masks for structured surface and plasma etching

    Vital, Alexane [Centre de Recherche sur la Matière Divisée (CRMD), 1b rue de la Férollerie, F45071 Orléans Cedex (France); Groupe de Recherches sur l’Énergétique des Milieux Ionisés (GREMI), Polytech’Orléans, 14 rue d’Issoudun, B.P. 6744, F45067 Orléans Cedex 2 (France); Vayer, Marylène, E-mail: marylene.vayer@univ-orleans.fr [Centre de Recherche sur la Matière Divisée (CRMD), 1b rue de la Férollerie, F45071 Orléans Cedex (France); Sinturel, Christophe [Centre de Recherche sur la Matière Divisée (CRMD), 1b rue de la Férollerie, F45071 Orléans Cedex (France); Tillocher, Thomas; Lefaucheux, Philippe; Dussart, Rémi [Groupe de Recherches sur l’Énergétique des Milieux Ionisés (GREMI), Polytech’Orléans, 14 rue d’Issoudun, B.P. 6744, F45067 Orléans Cedex 2 (France)

    2015-03-30

    Graphical abstract: - Highlights: • Sub-micrometric silicon structures were prepared by cryogenic plasma etching. • Polymer templates based on phase-separated films of PS/PLA were used. • Silica structured masks were prepared by filling the polymer templates. • Etching of underlying silicon through silica templates gave original structures. - Abstract: Silica and silicon structures have been prepared at the sub-micrometer length-scale, using laterally phase-separated thin films of poly(styrene) (PS) and poly(lactic acid) (PLA) homopolymer blends. The selective removal of one polymer and the filling of the released space by silica precursor solution led, after calcination, to silica structures on silicon such as arrays of bowl-shape features or pillars, layers with through or non-through cylindrical holes, which has not been observed for some of them. The control of the morphology of the initial polymer film was a key point to achieve such type of structures. Particularly relevant was the use of solvent vapor annealing (vs thermal annealing) of the initial spin-coated films that favored and stabilized laterally phase-separated morphologies. Characteristic dimension of the domains were shown to be coupled with the thickness of the film, thinner films giving smaller domain sizes. Despite a relatively high incompatibility of the two polymers, a macro-phase separation was prevented in all the studied conditions. Sub-micrometric domains were formed, and for the thinner films, nanometric domains as small as 74 nm in size can be obtained. The silica structures formed by the infiltration of the polymer templates were used as hard masks for the cryogenic etching of underlying silicon. New structured surfaces, arrays of silicon pillars which can be plain or hollow at the upper part or arrays of cylindrical holes were formed. A selectivity as high as 21 was obtained using this type of mask for 1.5 μm deep holes having a typical diameter of 200 nm.

  20. Evaluation of Cu Ion Concentration Effects on Cu Etching Rate in Chemical-Mechanical Polishing Slurry

    Nishizawa, Hideaki; Sugiura, Osamu; Matsumura, Yoshiyuki; Kinoshita, Masaharu

    2007-04-01

    The effects of Cu ion concentration of the different solutions on Cu etching rate were investigated. From the dipping experiment of Cu substrates in different solutions of malic acid, hydrogen peroxide (H2O2), benzotriazole (BTA), and Cu ions, it was revealed that Cu etching rate is increased if the concentration of Cu(II) ions added in the solution is high. This is considered to be caused by the effect of Cu(II) ions on H2O2 molecules. In the solution of pH 7, the Cu etching rate increased markedly between 1.7× 10-4 and 3.4× 10-4 M Cu(II) ion concentrations. The maximum increase in the etching rate was from 990 to 2200 nm/min at a H2O2 concentration of 2 wt %. In the solution of pH 3, a marked change in the etching rate was not observed. Our results show that the concentration of Cu ions on the polishing pad in chemical-mechanical polishing (CMP) process is very important.

  1. Effectiveness of an Er:YAG laser in etching the enamel surface for orthodontic bracket retention.

    Kim, Jung-Ho; Kwon, Oh-Won; Kim, Hyung-Il; Kwon, Yong Hoon

    2005-12-01

    The purpose of this study was to test the effectiveness of an Er:YAG laser in etching the enamel surface for orthodontic treatment. Bovine incisors were either acid-etched or laser-treated. An orthodontic bracket was attached on each treated surface using one-step dentin adhesive and self-curing resin. Tensile bond strength was then evaluated. In addition, the surface morphology of specimens treated with phosphoric acid/laser and self-etching primer, as well as the cross-section of enamel-primer-resin interfaces, were observed. One-Up Bond F-treated specimens after Er:YAG laser ablation showed statistically similar tensile bond strength (9.9 +/- 1.3 MPa) to that of phosphoric acid-etched specimens (11.8 +/- 1.7 MPa). Surface roughness and thickness of the enamel-primer-resin interfaces did not much affect the tensile bond strength of the tested specimens. In conclusion, Er:YAG laser ablation achieved clinically acceptable level of tensile bond strength when used with One-Up Bond F.

  2. Review of micromachining of ceramics by etching

    H.T.TING; K.A.ABOU-EL-HOSSEIN; H.B.CHUA

    2009-01-01

    In the last two decades, there has been an enormous surge in interest in ceramic materials and, as a result, there have been significant advances in their development and applications. Their inherent properties, such as capability of operating at temperatures far above metals, high level of hardness and toughness, low coefficient of thermal expansion and high thermal conductivity rendered ceramics to be one of the leading engineering materials. Many research works have been conducted in the past few years on machining of advanced ceramics using different processing methods in order to obtain a better surface roughness, higher material removal rate and improved tool life. Micromachining using chemical etching is one of those methods that do not involve the problem of tool life and direct tool-work piece contact. However, only a few research works have been done on micromachining of ceramics using chemical etching. Hence, study of chemical machining of advanced ceramics is still needed as the process has found wide application in the industry because of its relative low operating costs. In this work, we summarize the recent progresses in machining of different types of advanced ceramics, material processing methods such as wet etching and dry etching, and finally the prospects for control of material removal rate and surface quality in the process of ceramic micromachining.

  3. Localized mechanics of dentin self-etching adhesive system

    Rodolfo Bruniera Anchieta

    2007-08-01

    Full Text Available The bond strength of composite resins (CRs to dentin is influenced by the interfacial microstructure of the hybrid layer (HL and the resin tags (TAG. The contemporary self-etching primer adhesive systems overcame the inconvenient of the etch-and-rinse protocol. Studies, however, have demonstrated that HL thickness and TAG length vary according to the wetting time and additional use of acid-etching prior to self-etching primers. This study investigated the localized stress distribution in the HL and the dentin/adhesive interface. Two HL thicknesses (3 or 6 µm, two TAG lengths (13 or 17 µm and two loading conditions (perpendicular and oblique-25º were investigated by the finite element (FE analysis. Five two-dimensional FE models (M of a dentin specimen restored with CR (38 x 64 µm were constructed: M1 - no HL and no TAG; M2 - 3 µm of HL and 13 µm of TAG; M3 - 3 µm of HL and 17 µm of TAG; M4 - 6 µm of HL and 13 µm of TAG; and M5 - 6 µm of HL and 17 µm of TAG. Two distributed loadings (L (20N were applied on CR surface: L1 - perpendicular, and L2 - oblique (25º. Fixed interfacial conditions were assigned on the border of the dentin specimen. Ansys 10.0 (Ansys®, Houston, PA, USA software was used to calculate the stress fields. The peak of von Mises (sigmavM and maximum principal stress (sigmamax was higher in L2 than in L1. Microstructures (HL and TAG had no effect on local stresses for L1. Decreasing HL decreased sigmavM and sigmamax in all structures for L2, but the TAG length had influence only on the peributular dentin. The thickness of HL had more influence on the sigmavM and sigmamax than TAG length. The peritubular dentin and its adjacent structures showed the highest sigmavM and sigmamax, mainly in the oblique loading.

  4. Superhydrophobic coatings for aluminium surfaces synthesized by chemical etching process

    Priya Varshney

    2016-10-01

    Full Text Available In this paper, the superhydrophobic coatings on aluminium surfaces were prepared by two-step (chemical etching followed by coating and one-step (chemical etching and coating in a single step processes using potassium hydroxide and lauric acid. Besides, surface immersion time in solutions was varied in both processes. Wettability and surface morphologies of treated aluminium surfaces were characterized using contact angle measurement technique and scanning electron microscopy, respectively. Microstructures are formed on the treated aluminium surfaces which lead to increase in contact angle of the surface (>150°. Also on increasing immersion time, contact angle further increases due to increase in size and depth of microstructures. Additionally, these superhydrophobic coatings show excellent self-cleaning and corrosion-resistant behavior. Water jet impact, floatation on water surface, and low temperature condensation tests assert the excellent water-repellent nature of coatings. Further, coatings are to be found mechanically, thermally, and ultraviolet stable. Along with, these coatings are found to be excellent regeneration ability as verified experimentally. Although aforesaid both processes generate durable and regenerable superhydrophobic aluminium surfaces with excellent self-cleaning, corrosion-resistant, and water-repellent characteristics, but one-step process is proved more efficient and less time consuming than two-step process and promises to produce superhydrophobic coatings for industrial applications.

  5. Wettability investigating on the wet etching textured multicrystalline silicon wafer

    Liu, Xiangju; Niu, Yuchao; Zhai, Tongguang; Ma, Yuying; Zhen, Yongtai; Ma, Xiaoyu; Gao, Ying

    2016-02-01

    In order to investigate the wettability properties of multicrystalline silicon (mc-Si), the different surface structures were fabricated on the as-cut p-type multi-wire slurry sawn mc-Si wafers, such as as-cut, polished and etched in various acid solutions. The contact angles and the XRD spectra of these samples were measured. It was noted that both the surface structures and the use of surfactant, such as Tween 80, made a stronger effect on wettability of the Si wafer. Due to the lipophilic groups of Tween 80 combined with the Si atoms while the hydrophilic groups of it were outward, a lipophilic surface of Si changed into a hydrophilic one and the rougher the surface, the stronger the hydrophily. Thus, it is feasible to add an appropriate surfactant into the etching solution during black-Si wafer fabrication for solar cells. In addition, different crystal plains of Si had different dangling bond density, so that their surface energies were different. A surface with higher surface energy could attract more water atoms and its wettability was better. However, the effect of crystal plain on the surface wettability was much weaker than surface morphology.

  6. Advanced dry etching studies for micro- and nano-systems

    Rasmussen, Kristian Hagsted

    used for structuring of a magnetic device containing four different materials in nine layers. The materials, tantalum, tantalum oxide, iridiummanganese, and permalloy, can all be etched by reactive ion etching, however the thin layers and the need to etch all layers in one process makes ion beam...

  7. Dopant Selective Reactive Ion Etching of Silicon Carbide

    Okojie, Robert (Inventor)

    2016-01-01

    A method for selectively etching a substrate is provided. In one embodiment, an epilayer is grown on top of the substrate. A resistive element may be defined and etched into the epilayer. On the other side of the substrate, the substrate is selectively etched up to the resistive element, leaving a suspended resistive element.

  8. Microtensile bond strength of etch and rinse versus self-etch adhesive systems.

    Hamouda, Ibrahim M; Samra, Nagia R; Badawi, Manal F

    2011-04-01

    The aim of this study was to compare the microtensile bond strength of the etch and rinse adhesive versus one-component or two-component self-etch adhesives. Twelve intact human molar teeth were cleaned and the occlusal enamel of the teeth was removed. The exposed dentin surfaces were polished and rinsed, and the adhesives were applied. A microhybride composite resin was applied to form specimens of 4 mm height and 6 mm diameter. The specimens were sectioned perpendicular to the adhesive interface to produce dentin-resin composite sticks, with an adhesive area of approximately 1.4 mm(2). The sticks were subjected to tensile loading until failure occurred. The debonded areas were examined with a scanning electron microscope to determine the site of failure. The results showed that the microtensile bond strength of the etch and rinse adhesive was higher than that of one-component or two-component self-etch adhesives. The scanning electron microscope examination of the dentin surfaces revealed adhesive and mixed modes of failure. The adhesive mode of failure occurred at the adhesive/dentin interface, while the mixed mode of failure occurred partially in the composite and partially at the adhesive/dentin interface. It was concluded that the etch and rinse adhesive had higher microtensile bond strength when compared to that of the self-etch adhesives.

  9. Characterization of electric discharge machining, subsequent etching and shot-peening as a surface treatment for orthopedic implants

    Stráský, Josef; Havlíková, Jana; Bačáková, Lucie; Harcuba, Petr; Mhaede, Mansour; Janeček, Miloš

    2013-09-01

    Presented work aims at multi-method characterization of combined surface treatment of Ti-6Al-4V alloy for biomedical use. Surface treatment consists of consequent use of electric discharge machining (EDM), acid etching and shot peening. Surface layers are analyzed employing scanning electron microscopy and energy dispersive X-ray spectroscopy. Acid etching by strong Kroll's reagent is capable of removing surface layer of transformed material created by EDM. Acid etching also creates partly nanostructured surface and significantly contributes to the enhanced proliferation of the bone cells. The cell growth could be positively affected by the superimposed bone-inspired structure of the surface with the morphological features in macro-, micro- and nano-range. Shot peening significantly improves poor fatigue performance after EDM. Final fatigue performance is comparable to benchmark electropolished material without any adverse surface effect. The proposed three-step surface treatment is a low-cost process capable of producing material that is applicable in orthopedics.

  10. Comparative evaluation of antibacterial activity of total-etch and self-etch adhesive systems: An ex vitro study

    Swathi Amin

    2014-01-01

    Full Text Available Aim: The aim of this ex vivo study was to compare the antibacterial activity of total-etch and self-etch adhesive systems against Streptococcus mutans, Lactobacillus acidophilus, and Actinomyces viscosus through disk diffusion method. Materials and Methods: The antibacterial effects of Single Bond (SB and Adper Prompt (AP and aqueous solution of chlorhexidine 0.2% (positive control were tested against standard strain of S. mutans, L. acidophilus, and A. viscosus using the disk diffusion method. The diameters of inhibition zones were measured in millimeters. Data was analyzed using Kruskal-Wallis test. Mann-Whitney U test was used for pairwise comparison. Result: Of all the materials tested, AP showed the maximum inhibitory action against S. mutans and L. acidophilus. Aqueous solution of chlorhexidine 0.2% showed the maximum inhibitory action against A. viscosus. Very minimal antibacterial effect was noted for SB. Conclusion: The antibacterial effects observed for the tested different dentin bonding systems may be related to the acidic nature of the materials.

  11. Four-year water degradation of a total-etch and two self-etching adhesives bonded to dentin

    A.I. Abdalla; A.J. Feilzer

    2008-01-01

    Objectives: To evaluate effect of direct and indirect water storage on the microtensile dentin bond strength of one total-etch and two self-etching adhesives. Methods: The adhesive materials were: one total-etch adhesive; ‘Admira Bond’ and two selfetch adhesives; ‘Clearfil SE Bond’ and ‘Hybrid Bond’

  12. Effectiveness of Two Self-Etchings Bonded Clinically in Caries Affected Dentin with Homogeneous Smear Layer

    Roberto Pinna

    2015-01-01

    Full Text Available Aim. To examine the interface of two self-etchings in carious affected dentin (CAD, under clinical conditions. Materials and Methods. Class I cavities were prepared in 21 carious premolars, refining them by the use of a fine diamond bur in order to create similar smear layer interference. The mild self-etching Clearfil SE Bond (CSE, pH = 2.0, and the strong Tyrian SPE-One Step Plus (TSO, pH = 0.5, were applied followed by a composite. Teeth were extracted and processed for TEM. The primer’s osmolarity of the self-etchings was also calculated using a microosmometer. Results. CSE hybrid layer retained smear layer residues and scattered crystallites as an effect of the mild acidity. A high presence of hydroxyapatite still protected the affected fibres within the hybrid layer. CSE primer demonstrated values of 3220 mOsm/kg. TSO interdiffusion showed strong demineralization. Resin tags were not formed in the dentinal tubules which remained obstructed by crystals. However, dissolution of peritubular dentin and porosities were observed in the intertubular regions. The osmolarity of TSO was 8200 mOsm/kg. Conclusion. Increasing the acidity and osmolarity of the self-etchings increases interference in the homogeneous reinforcement of CAD, which may predispose the hybrid layer to instability and hydrolytic degradation overtime.

  13. SU-8 etching in inductively coupled oxygen plasma

    Rasmussen, Kristian Hagsted; Keller, Stephan Sylvest; Jensen, Flemming

    2013-01-01

    Structuring or removal of the epoxy based, photo sensitive polymer SU-8 by inductively coupled plasma reactive ion etching (ICP-RIE) was investigated as a function of plasma chemistry, bias power, temperature, and pressure. In a pure oxygen plasma, surface accumulation of antimony from the photo......-initiator introduced severe roughness and reduced etch rate significantly. Addition of SF6 to the plasma chemistry reduced the antimony surface concentration with lower roughness and higher etch rate as an outcome. Furthermore the etch anisotropy could be tuned by controlling the bias power. Etch rates up to 800 nm...

  14. 不同表面酸蚀处理对纤维桩与树脂黏结强度影响的实验研究%Effects of different acid etching methods on the bond strength between fiber post and resin

    李磊; 张兴乐; 苏哲君; 时静华; 马莉; 葛志华

    2011-01-01

    目的:观察不同表面酸蚀处理对纤维桩与树脂黏结强度的影响.方法:直径1.25 mm的玻璃纤维桩24根随机分为4组,用300 mL/L过氧化氢(H)、40g/L氢氟酸(F)、320g/L磷酸(P)和蒸馏水(对照组)对纤维桩进行表面处理,并于表面涂布树脂黏结剂后用树脂水门汀将其黏结于树脂模具中.试件在万能材料试验机上进行推出实验.结果:F组黏结强度均值最高(30.28±2.36) MPa,其次为H组(26.15±1.56)MPa,P组(23.71±3.47) MPa,对照组(C组)最小(22.39±2.48) MPa.单因素方差分析及多重比较显示:F组与H组、P组、C组之间有统计学差异(P<0.05);H组与P组、C组之间有统计学差异(P<0.05);P组与C组之间无统计学差异(p>0.05).结论:用300mL/L过氧化氢、40g/L氢氟酸对纤维桩表面进行处理,可有效提高纤维桩与树脂黏结强度.%ABM: To evaluate the effects of different acid etching on the bond strength between fiber postand resin. METHODS: Twenty-four glass fiber posts were divided into 4 groups and were treated with 30% methyl-ene chloride (H), 4% hydrofluoric acid (F) and 32% phosphoretic acid (P) respectively, and then bonded to resin blocks. Push-out tests were performed in a universal testing machine and the bond strength was evaluated. RESULTS: F group showed the highest mean bond strength (30.28 ±2.36)Mpa, which was significantly higher than H group (26.15±1.56)Mpa, P group (23.71 ±3.47)Mpa and C group (22. 39 ±2.48)Mpa (P0. 05). CONCLUSION; Etching by 4% hydrofluoric acid and 30% methylene chloride can significantly enhances bond strength between glass fiber post and resin.

  15. Patterning of platinum (Pt) thin films by chemical wet etching in Aqua Regia

    Köllensperger, P. A.; Karl, W. J.; Ahmad, M. M.; Pike, W. T.; Green, M.

    2012-06-01

    The chemical and physical properties of platinum (Pt) make it a useful material for microelectromechanical systems and microfluidic applications such as lab-on-a-chip devices. Platinum thin-films are frequently employed in applications where electrodes with high chemical stability, low electrical resistance or a high melting point are needed. Due to its chemical inertness it is however also one of the most difficult metals to pattern. The gold standard for patterning is chlorine RIE etching, a capital-intensive process not available in all labs. Here we present simple fabrication protocols for wet etching Pt thin-films in hot Aqua Regia based on sputtered Ti/Pt/Cr and Cr/Pt/Cr metal multilayers. Chromium (Cr) or titanium (Ti) is used as an adhesion layer for the Pt. Cr is used as a hard masking layer during the Pt etch as it can be easily and accurately patterned with photoresist and withstands the Aqua Regia. The Cr pattern is transferred into the Pt and the Cr mask later removed. Only standard chemicals and cleanroom equipment/tools are required. Prior to the Aqua Regia etch any surface passivation on the Pt is needs to be removed. This is usually achieved by a quick dip in dilute hydrofluoric acid (HF). HF is usually also used for wet-etching the Ti adhesion layer. We avoid the use of HF for both steps by replacing the HF-dip with an argon (Ar) plasma treatment and etching the Ti layer with a hydrogen peroxide (H2O2) based etchant.

  16. Surface engineering of SiC via sublimation etching

    Jokubavicius, Valdas; Yazdi, Gholam R.; Ivanov, Ivan G.; Niu, Yuran; Zakharov, Alexei; Iakimov, Tihomir; Syväjärvi, Mikael; Yakimova, Rositsa

    2016-12-01

    We present a technique for etching of SiC which is based on sublimation and can be used to modify the morphology and reconstruction of silicon carbide surface for subsequent epitaxial growth of various materials, for example graphene. The sublimation etching of 6H-, 4H- and 3C-SiC was explored in vacuum (10-5 mbar) and Ar (700 mbar) ambient using two different etching arrangements which can be considered as Si-C and Si-C-Ta chemical systems exhibiting different vapor phase stoichiometry at a given temperature. The surfaces of different polytypes etched under similar conditions are compared and the etching mechanism is discussed with an emphasis on the role of tantalum as a carbon getter. To demonstrate applicability of such etching process graphene nanoribbons were grown on a 4H-SiC surface that was pre-patterned using the thermal etching technique presented in this study.

  17. Block copolymer templated etching on silicon.

    Qiao, Yinghong; Wang, Dong; Buriak, Jillian M

    2007-02-01

    The use of self-assembled polymer structures to direct the formation of mesoscopic (1-100 nm) features on silicon could provide a fabrication-compatible means to produce nanoscale patterns, supplementing conventional lithographic techniques. Here we demonstrate nanoscale etching of silicon, applying standard aqueous-based fluoride etchants, to produce three-dimensional nanoscale features with controllable shapes, sizes, average spacing, and chemical functionalization. The block copolymers serve to direct the silicon surface chemistry by controlling the spatial location of the reaction as well as concentration of reagents. The interiors of the resulting etched nanoscale features may be selectively functionalized with organic monolayers, metal nanoparticles, and other materials, leading to a range of ordered arrays on silicon.

  18. Development of Wet-Etching Tools for Precision Optical Figuring

    Rushford, M C; Dixit, S N; Hyde, R; Britten, J A; Nissen, J; Aasen, M; Toeppen, J; Hoaglan, C; Nelson, C; Summers, L; Thomas, I

    2004-01-27

    This FY03 final report on Wet Etch Figuring involves a 2D thermal tool. Its purpose is to flatten (0.3 to 1 mm thickness) sheets of glass faster thus cheaper than conventional sub aperture tools. An array of resistors on a circuit board was used to heat acid over the glass Optical Path Difference (OPD) thick spots and at times this heating extended over the most of the glass aperture. Where the acid is heated on the glass it dissolves faster. A self-referencing interferometer measured the glass thickness, its design taking advantage of the parallel nature and thinness of these glass sheets. This measurement is used in close loop control of the heating patterns of the circuit board thus glass and acid. Only the glass and acid were to be moved to make the tool logistically simple to use in mass production. A set of 4-circuit board, covering 80 x 80-cm aperture was ordered, but only one 40 x 40-cm board was put together and tested for this report. The interferometer measurement of glass OPD was slower than needed on some glass profiles. Sometimes the interference fringes were too fine to resolve which would alias the sign of the glass thickness profile. This also caused the phase unwrapping code (FLYNN) to struggle thus run slowly at times taking hours, for a 10 inch square area. We did extensive work to improve the speed of this code. We tried many different phase unwrapping codes. Eventually running (FLYNN) on a farm of networked computers. Most of the work reported here is therefore limited to a 10-inch square aperture. Researched into fabricating a better interferometer lens from Plexiglas so to have less of the scattered light issues of Fresnel lens groves near field scattering patterns, this set the Nyquest limit. There was also a problem with the initial concept of wetting the 1737 glass on its bottom side with acid. The wetted 1737 glass developed an Achromatic AR coating, spoiling the reflection needed to see glass thickness interference fringes. In response

  19. Characterization of stain etched p-type silicon in aqueous HF solutions containing HNO{sub 3} or KMnO{sub 4}

    Mogoda, A.S., E-mail: awad_mogoda@hotmail.com [Department of Chemistry, Faculty of Science, Cairo University, Giza (Egypt); Ahmad, Y.H.; Badawy, W.A. [Department of Chemistry, Faculty of Science, Cairo University, Giza (Egypt)

    2011-04-15

    Research highlights: {yields} Stain etching of p-Si in aqueous HF solutions containing HNO{sub 3} or KMnO{sub 4} was investigated. {yields} The electrical conductivity of the etched Si surfaces was measured using impedance technique. {yields} Scanning electron microscope and energy disperse X-ray were used to analyze the etched surfaces. {yields} Etching in aqueous HF solution containing HNO{sub 3} led to formation of a porous silicon layer. {yields} The formation of the porous silicon layer in HF/KMnO{sub 4} was accompanied by deposition of K{sub 2}SiF{sub 6} on the pores surfaces. - Abstract: Stain etching of p-type silicon in hydrofluoric acid solutions containing nitric acid or potassium permanganate as an oxidizing agent has been examined. The effects of etching time, oxidizing agent and HF concentrations on the electrochemical behavior of etched silicon surfaces have been investigated by electrochemical impedance spectroscopy (EIS). An electrical equivalent circuit was used for fitting the impedance data. The morphology and the chemical composition of the etched Si surface were studied using scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) techniques, respectively. A porous silicon layer was formed on Si etched in HF solutions containing HNO{sub 3}, while etching in HF solutions containing KMnO{sub 4} led to the formation of a porous layer and simultaneous deposition of K{sub 2}SiF{sub 6} inside the pores. The thickness of K{sub 2}SiF{sub 6} layer increases with increasing the KMnO{sub 4} concentration and decreases as the concentration of HF increases.

  20. Characterization of aluminum surfaces: Sorption and etching

    Polkinghorne, Jeannette Clera

    Aluminum, due to its low density and low cost, is a key material for future lightweight applications. However, like other structural materials, aluminum is subject to various forms of corrosion damage that annually costs the United States approximately 5% of its GNP [1]. The main goal is to investigate the effects of various solution anions on aluminum surfaces, and specifically probe pit initiation and inhibition. Using surface analysis techniques including X-ray photoelectron spectroscopy, Auger electron spectroscopy, and scanning electron microscopy, results have been correlated with those obtained from electrochemical methods and a radiolabeling technique developed in the Wieckowski laboratory. Analysis of data has indicated that important variables include type of anion, solution pH, and applied electrode potential. While aggressive anions such as chloride are usually studied to elucidate corrosion processes to work ultimately toward inhibition, its corrosive properties can be successfully utilized in the drive for higher energy and smaller-scale storage devices. Fundamental information gained regarding anion interaction with the aluminum surface can be applied to tailor etch processes. Standard electrochemical techniques and SEM are respectively used to etch and analyze the aluminum substrate. Aluminum electrolytic capacitors are comprised of aluminum anode foil covered by an anodically grown aluminum oxide dielectric film, electrolytic paper impregnated with electrolyte, and aluminum cathode foil. Two main processes are involved in the fabrication of aluminum electrolytic capacitors, namely etching and anodic oxide formation. Etching of the anode foil results in a higher surface area (up to 20 times area enlargement compared to unetched foil) that translates into a higher capacitance gain, permitting more compact and lighter capacitor manufacture. Anodic oxide formation on the anode, creates the required dielectric to withstand high voltage operation. A

  1. Synthesis and Characterization of Chemically Etched Nanostructured Silicon

    Mughal, Asad Jahangir

    2012-05-01

    Silicon is an essential element in today’s modern world. Nanostructured Si is a more recently studied variant, which has currently garnered much attention. When its spatial dimensions are confined below a certain limit, its optical properties change dramatically. It transforms from an indirect bandgap material that does not absorb or emit light efficiently into one which can emit visible light at room temperatures. Although much work has been conducted in understanding the properties of nanostructured Si, in particular porous Si surfaces, a clear understanding of the origin of photoluminescence has not yet been produced. Typical synthesis approaches used to produce nanostructured Si, in particular porous Si and nanocrystalline Si have involved complex preparations used at high temperatures, pressures, or currents. The purpose of this thesis is to develop an easier synthesis approach to produce nanostructured Si as well as arrive at a clearer understanding of the origin of photoluminescence in these systems. We used a simple chemical etching technique followed by sonication to produce nanostructured Si suspensions. The etching process involved producing pores on the surface of a Si substrate in a solution containing hydrofluoric acid and an oxidant. Nanocrystalline Si as well as nanoscale amorphous porous Si suspensions were successfully synthesized using this process. We probed into the phase, composition, and origin of photoluminescence in these materials, through the use of several characterization techniques. TEM and SEM were used to determine morphology and phase. FT-IR and XPS were employed to study chemical compositions, and steady state and time resolved optical spectroscopy techniques were applied to resolve their photoluminescent properties. Our work has revealed that the type of oxidant utilized during etching had a significant impact on the final product. When using nitric acid as the oxidant, we formed nanocrystalline Si suspensions composed of

  2. Transport through track etched polymeric blend membrane

    Kamlendra Awasthi; Vaibhav Kulshreshtha; B Tripathi; N K Acharya; M Singh; Y K Vijay

    2006-06-01

    Polymer blends of polycarbonate (PC) and polysulphone (PSF) having thickness, 27 m, are prepared by solution cast method. The transport properties of pores in a blend membrane are examined. The pores were produced in this membrane by a track etching technique. For this purpose, a thin polymer membrane was penetrated by a single heavy ion of Ni7+ of 100 MeV, followed by preferential chemical etching of the ion track. Ion permeation measurements show that pores in polymeric membrane are charged or neutralized, which depends upon the variation in concentration of the solvent. The – curve at concentration, N/10, shows that the pores are negatively charged, whereas at concentration, N/20, the linear nature of – curve indicates that the pores approach towards neutralized state and on further concentration, N/40, the pores become fully neutralized, consequently the rectifier behaviour of pores has been omitted. The gas permeability of hydrogen and carbon dioxide of this membrane was measured with increasing etching time. The permeability was measured from both the sides. Permeability at the front was larger than the permeability at the back which shows asymmetric behaviour of membranes.

  3. Crystallographic orientation dependent etching of graphene layers

    Nemes-Incze, Peter; Biro, Laszlo Peter [Research Institute for Technical Physics and Materials Science, PO. Box 49, 1525 Budapest (Hungary); Magda, Gabor [Budapest University of Technology and Economics (BME), PO Box 91, 1521 Budapest (Hungary); Kamaras, Katalin [Research Institute for Solid State Physics and Optics, Hungarian Academy of Sciences, PO Box 49, 1525, Budapest (Hungary)

    2010-04-15

    Graphene has gripped the scientific community ever since its discovery in 2004, with very promising electronic properties and hopes to integrate graphene into nanoelectronic devices. For graphene to make its way into electronic devices, two major obstacles have to be overcome: reproducible preparation of large area graphene samples and patterning techniques to obtain functional components. In this paper we present a graphene etching technique, which is crystallographic orientation selective and allows for the patterning of graphene layers using a chemical reduction process. The process involves the reduction of the SiO{sub 2} support by the carbon in the graphene itself. This reaction only occurs at the sample edges and does not result in the degradation of the graphene crystal lattice itself. However, we have observed evidence of strong hole doping in our etched samples. This etching technique opens up new possibilities in graphene patterning and modification. (copyright 2010 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)

  4. Two-Layer Microstructures Fabricated by One-Step Anisotropic Wet Etching of Si in KOH Solution

    Han Lu

    2016-01-01

    Full Text Available Anisotropic etching of silicon in potassium hydroxide (KOH is an important technology in micromachining. The residue deposition from KOH etching of Si is typically regarded as a disadvantage of this technology. In this report, we make use of this residue as a second masking layer to fabricate two-layer complex structures. Square patterns with size in the range of 15–150 μm and gap distance of 5 μm have been designed and tested. The residue masking layer appears when the substrate is over-etched in hydrofluoric acid (HF solution over a threshold. The two-layer structures of micropyramids surrounded by wall-like structures are obtained according to the two different masking layers of SiO2 and residue. The residue masking layer is stable and can survive over KOH etching for long time to achieve deep Si etching. The process parameters of etchant concentration, temperature, etching time and pattern size have been investigated. With well-controlled two-layer structures, useful structures could be designed for applications in plasmonic and microfluidic devices in the future.

  5. Effect of a functional monomer (MDP) on the enamel bond durability of single-step self-etch adhesives.

    Tsuchiya, Kenji; Takamizawa, Toshiki; Barkmeier, Wayne W; Tsubota, Keishi; Tsujimoto, Akimasa; Berry, Thomas P; Erickson, Robert L; Latta, Mark A; Miyazaki, Masashi

    2016-02-01

    The present study aimed to determine the effect of the functional monomer, 10-methacryloxydecyl dihydrogen phosphate (MDP), on the enamel bond durability of single-step self-etch adhesives through integrating fatigue testing and long-term water storage. An MDP-containing self-etch adhesive, Clearfil Bond SE ONE (SE), and an experimental adhesive, MDP-free (MF), which comprised the same ingredients as SE apart from MDP, were used. Shear bond strength (SBS) and shear fatigue strength (SFS) were measured with or without phosphoric acid pre-etching. The specimens were stored in distilled water for 24 h, 6 months, or 1 yr. Although similar SBS and SFS values were obtained for SE with pre-etching and for MF after 24 h of storage in distilled water, SE with pre-etching showed higher SBS and SFS values than MF after storage in water for 6 months or 1 yr. Regardless of the pre-etching procedure, SE showed higher SBS and SFS values after 6 months of storage in distilled water than after 24 h or 1 yr. To conclude, MDP might play an important role in enhancing not only bond strength but also bond durability with respect to repeated subcritical loading after long-term water storage.

  6. Geochemical, microtextural and petrological studies of the Samba prospect in the Zambian Copperbelt basement: a metamorphosed Palaeoproterozoic porphyry Cu deposit.

    Master, Sharad; Mirrander Ndhlovu, N.

    2015-04-01

    Ever since Wakefield (1978, IMM Trans., B87, 43-52) described a porphyry-type meta-morphosed Cu prospect, the ca 50 Mt, 0.5% Cu Samba deposit (12.717°S, 27.833°E), hosted by porphyry-associated quartz-sericite-biotite schists in northern Zambia, there has been controversy about its origin and significance. This is because it is situated in the basement to the world's largest stratabound sediment-hosted copper province, the Central African Copperbelt, which is hosted by rocks of the Neoproterozoic Katanga Supergroup. Mineralization in the pre-Katangan basement has long played a prominent role in ore genetic models, with some authors suggesting that basement Cu mineralization may have been recycled into the Katangan basin through erosion and redeposition, while others have suggested that the circulation of fluids through Cu-rich basement may have leached out the metals which are found concentrated in the Katangan orebodies. On the basis of ca 490-460 Ma Ar-Ar ages, Hitzman et al. (2012, Sillitoe Vol., SEG Spec. Publ., 16, 487-514) suggested that Samba represents late-stage impregnation of copper mineralization into the basement, and that it was one of the youngest copper deposits known in the Central African Copperbelt. If the Samba deposit really is that young, then it would have post-dated regional deformation and metamorphism (560-510 Ma), and it ought to be undeformed and unmetamorphosed. The Samba mineralization consists of chalcopyrite and bornite, occurring as disseminations, stringers and veinlets, found in a zone >1 km along strike, in steeply-dipping lenses up to 10m thick and >150m deep. Our new major and trace element XRF geochemical data (14 samples) show that the host rocks are mainly calc-alkaline metadacites. Cu is correlated with Ag (Cu/Ag ~10,000:1) with no Au or Mo. Our study focused on the microtextures and petrology of the Samba ores. We confirm that there is alteration of similar style to that accompanying classical porphyry Cu mineralization

  7. Micromorphology of ceramic etching pattern for two CAD-CAM and one conventional feldspathic porcelain and need for post-etching cleaning.

    Onisor, Ioana; Rocca, Giovanni Tommaso; Krejci, Ivo

    2014-01-01

    The aim of this in vitro study was to observe the effect of hydrofluoric acid (HF) on the surface of two glass ceramics for Cerec and to compare it with the effect on a conventional glass ceramic. Discs were cut from a feldspathic ceramic block (VitaMKII) and from a leucite reinforced glass ceramic (IPS EMPRESS CAD) for Cerec. 5% and 9% HF concentrations were used during 1 min and 2 min each. Afterwards samples were thoroughly water rinsed for 30 s. Half of the 9% HF 1 min samples were subsequently submitted to a complex post-etching cleaning. All samples were observed under a scanning electron microscope (SEM). The conventional feldspathic ceramic samples were built up on a refractory die and a platinum foil. They were treated with 9% HF for 2 min and water rinsed for 30 s. Half of the samples were submitted to the same post-etching cleaning protocol. All samples were examined under SEM and EDX. The Cerec ceramic samples and the platinum foil ones were clean and free of any precipitate after 30 s of water rinsing. Acid concentration, times of application and the postetching cleaning treatment did not influence the cleanliness of the samples. A thick layer of deposit was observed only on the refractory die samples. This was only diminished after the post-etching treatment. The EDX analysis detected the presence of fluoride (F) only on the refractory die samples.

  8. HF-based etching processes for improving laser damage resistance of fused silica optical surfaces

    Suratwala, T I; Miller, P E; Bude, J D; Steele, R A; Shen, N; Monticelli, M V; Feit, M D; Laurence, T A; Norton, M A; Carr, C W; Wong, L L

    2010-02-23

    The effect of various HF-based etching processes on the laser damage resistance of scratched fused silica surfaces has been investigated. Conventionally polished and subsequently scratched fused silica plates were treated by submerging in various HF-based etchants (HF or NH{sub 4}F:HF at various ratios and concentrations) under different process conditions (e.g., agitation frequencies, etch times, rinse conditions, and environmental cleanliness). Subsequently, the laser damage resistance (at 351 or 355 nm) of the treated surface was measured. The laser damage resistance was found to be strongly process dependent and scaled inversely with scratch width. The etching process was optimized to remove or prevent the presence of identified precursors (chemical impurities, fracture surfaces, and silica-based redeposit) known to lead to laser damage initiation. The redeposit precursor was reduced (and hence the damage threshold was increased) by: (1) increasing the SiF{sub 6}{sup 2-} solubility through reduction in the NH4F concentration and impurity cation impurities, and (2) improving the mass transport of reaction product (SiF{sub 6}{sup 2-}) (using high frequency ultrasonic agitation and excessive spray rinsing) away from the etched surface. A 2D finite element crack-etching and rinsing mass transport model (incorporating diffusion and advection) was used to predict reaction product concentration. The predictions are consistent with the experimentally observed process trends. The laser damage thresholds also increased with etched amount (up to {approx}30 {micro}m), which has been attributed to: (1) etching through lateral cracks where there is poor acid penetration, and (2) increasing the crack opening resulting in increased mass transport rates. With the optimized etch process, laser damage resistance increased dramatically; the average threshold fluence for damage initiation for 30 {micro}m wide scratches increased from 7 to 41 J/cm{sup 2}, and the statistical

  9. [Restoration of composite on etched stainless steel crowns. (1)].

    Goto, G; Zang, Y; Hosoya, Y

    1990-01-01

    Object of investigation The retention of composite resin to etched stainless steel crowns was tested as a possible method for restoring primary anterior teeth. Method employed 1) SEM observation Stainless steel crowns (Sankin Manufacture Co.) were etched with an aqua resia to create surface roughness and undercut to retain the composite resin to the crowns. Etching times were 1, 2, 3, 5, 8, 10 and 20 minutes, then washed in a 70% alcohol solution using an ultrasonic washer and dried. A total of 96 etched samples and non etched control samples were observed through the scanning electron microscope (Hitachi 520). 2) Shear bond strength test Stainless steel crowns were etched in an aqua resia from 1 to 20 minutes, then washed and dried. Composite resin (Photo Clearfil A, Kuraray Co.) with the bonding agent was placed on the crowns and the shear bond strength was tested in 56 samples using an Autograph (DCS-500, Shimazu). Results 1) SEM observation showed that the etching surface of stainless steel crowns created surface roughness and undercut. The most desirable surface was obtained in the 3 to 5 minute etching time specimens. 2) The highest bond strength was obtained in a 3 minute etching specimen. It was 42.12 MPa, although 29.26 MPa in mean value. Conclusion Etching with an aqua resia increased the adherence of composite resin to the surface of stainless steel crowns.

  10. Histologic Evaluation of Human Pulp Response to Total Etch and Self Etch Adhesive Systems

    Malekipour, Mohammad Reza; Razavi, Sayed Mohammad; Khazaei, Saber; Kazemi, Shantia; Behnamanesh, Maryam; Shirani, Farzaneh

    2013-01-01

    Background To investigate pulp response to the application of two types adhesive systems (total-etch and self-etch) in human premolar teeth. Materials and Methods Cavities limited to enamel walls in all margins with 2.5 mm depth were prepared on buccal surfaces of thirty three human premolars. The cavities were treated with the following adhesive. Single Bond (SB) and Prompt L-Pop (PLP). The teeth were extracted after 30 days and prepared due to histological technique. Results Pulp responses ...

  11. Growth, etching, and stability of sputtered ZnO:Al for thin-film silicon solar cells

    Owen, Jorj Ian

    2011-07-01

    Aluminum-doped zinc oxide (ZnO:Al) can fulfill many requirements in thin-film solar cells, acting as (1) a transparent contact through which the incident light is transmitted, (2) part of the back reflector, and (3) a source of light scattering. Magnetron sputtered ZnO:Al thin-films are highly transparent, conductive, and are typically texturized by post-deposition etching in a dilute hydrochloric acid (HCl) solution to achieve light scattering. The ZnO:Al thin-film electronic and optical properties, as well as the surface texture after etching, depend on the deposition conditions and the post-deposition treatments. Despite having been used in thin-film solar cells for more than a decade, many aspects regarding the growth, effects of heat treatments, environmental stability, and etching of sputtered ZnO:Al are not fully understood. This work endeavors to further the understanding of ZnO:Al for the purpose improving silicon thin-film solar cell efficiency and reducing ZnO:Al production costs. With regard to the growth of ZnO:Al, the influence of various deposition conditions on the resultant electrical and structural properties and their evolution with film thickness were studied. The surface electrical properties extracted from a multilayer model show that while carrier concentration of the surface layer saturates already at film thickness of 100 nm, the surface mobility continues to increases with film thickness, and it is concluded that electronic transport across grain boundaries limits mobility in ZnO:Al thin films. ZnO:Al deposited onto a previously etched ZnO:Al surface grows epitaxially, preserving both the original orientation and grain structure. Further, it is determined that a typical ZnO:Al used in thin-film silicon solar cells grows Zn-terminated on glass substrates. Concerning the affects of heat treatments and stability, it is demonstrated that a layer of amorphous silicon can protect ZnO:Al from degradation during annealing, and the mobility of Zn

  12. Influence of microhybrid resin and etching times on bleached enamel for the bonding of ceramic brackets.

    Firoozmand, Leily Macedo; Brandão, Juliana Viana Pereira; Fialho, Melissa Proença Nogueira

    2013-01-01

    The aim of this study was to evaluate the shear bond strength (SBS) of polycrystalline ceramic brackets (PCB) bonded after bleaching treatment using different composite resins and enamel etching times. A total of 144 bovine incisors were randomly divided into two study groups (n = 72, each) as follows: G1, enamel bleached with 35% hydrogen peroxide, and G2 (control group), enamel unbleached. After the bleaching treatment, the samples were stored in artificial saliva for 14 days. These groups were further divided into two subgroups (n = 36, each) as follows: GA, brackets bonded with Transbond XT (3M) and GB, brackets bonded with Filtek Z250 (3M). For each resin used, three different etching times with 37% phosphoric acid (15, 30 and 60 seconds) were tested. SBS tests were performed using a universal testing machine (EMIC), and the adhesive remnant index (ARI) score was verified. Significant differences among the three experimental conditions and interactions between the groups were observed. The type of composite resin accounted for 24% of the influence on the bond strength, whereas the etching time and bleaching treatment accounted for 14.5% and 10% of the influence on bond strength, respectively. The ARI revealed that the most common area of adhesion failure was at the composite resin-bracket interface. The type of composite resin, etching time and external bleaching significantly influenced the SBS of PCB on enamel, even after 14 days of saliva storage.

  13. Influence of microhybrid resin and etching times on bleached enamel for the bonding of ceramic brackets

    Leily Macedo Firoozmand

    2013-04-01

    Full Text Available The aim of this study was to evaluate the shear bond strength (SBS of polycrystalline ceramic brackets (PCB bonded after bleaching treatment using different composite resins and enamel etching times. A total of 144 bovine incisors were randomly divided into two study groups (n = 72, each as follows: G1, enamel bleached with 35% hydrogen peroxide, and G2 (control group, enamel unbleached. After the bleaching treatment, the samples were stored in artificial saliva for 14 days. These groups were further divided into two subgroups (n = 36, each as follows: GA, brackets bonded with Transbond XT (3M and GB, brackets bonded with Filtek Z250 (3M. For each resin used, three different etching times with 37% phosphoric acid (15, 30 and 60 seconds were tested. SBS tests were performed using a universal testing machine (EMIC, and the adhesive remnant index (ARI score was verified. Significant differences among the three experimental conditions and interactions between the groups were observed. The type of composite resin accounted for 24% of the influence on the bond strength, whereas the etching time and bleaching treatment accounted for 14.5% and 10% of the influence on bond strength, respectively. The ARI revealed that the most common area of adhesion failure was at the composite resin-bracket interface. The type of composite resin, etching time and external bleaching significantly influenced the SBS of PCB on enamel, even after 14 days of saliva storage.

  14. Extreme ultraviolet lithography mask etch study and overview

    Wu, Banqiu; Kumar, Ajay; Chandrachood, Madhavi; Sabharwal, Amitabh

    2013-04-01

    An overview of extreme ultraviolet lithography (EUVL) mask etch is presented and a EUVL mask etch study was carried out. Today, EUVL implementation has three critical challenges that hinder its adoption: extreme ultraviolet (EUV) source power, resist resolution-line width roughness-sensitivity, and a qualified EUVL mask. The EUVL mask defect challenges result from defects generated during blank preparation, absorber and multilayer deposition processes, as well as patterning, etching and wet clean processes. Stringent control on several performance criteria including critical dimension (CD) uniformity, etch bias, micro-loading, profile control, defect control, and high etch selectivity requirement to capping layer is required during the resist pattern duplication on the underlying absorber layer. EUVL mask absorbers comprise of mainly tantalum-based materials rather than chrome- or MoSi-based materials used in standard optical masks. Compared to the conventional chrome-based absorbers and phase shift materials, tantalum-based absorbers need high ion energy to obtain moderate etch rates. However, high ion energy may lower resist selectivity, and could introduce defects. Current EUVL mask consists of an anti-reflective layer on top of the bulk absorber. Recent studies indicate that a native oxide layer would suffice as an anti-reflective coating layer during the electron beam inspection. The absorber thickness and the material properties are optimized based on optical density targets for the mask as well as electromagnetic field effects and optics requirements of the patterning tools. EUVL mask etch processes are modified according to the structure of the absorber, its material, and thickness. However, etch product volatility is the fundamental requirement. Overlapping lithographic exposure near chip border may require etching through the multilayer, resulting in challenges in profile control and etch selectivity. Optical proximity correction is applied to further

  15. Time-varying wetting behavior on copper wafer treated by wet-etching

    Tu, Sheng-Hung; Wu, Chuan-Chang [Department of Chemical and Materials Engineering, National Central University, Jhongli 320, Taiwan, ROC (China); Wu, Hsing-Chen [Advanced Technology Materials Inc, Hsinchu 310, Taiwan, ROC (China); Cheng, Shao-Liang [Department of Chemical and Materials Engineering, National Central University, Jhongli 320, Taiwan, ROC (China); Sheng, Yu-Jane, E-mail: yjsheng@ntu.edu.tw [Department of Chemical Engineering, National Taiwan University, Taipei 106, Taiwan, ROC (China); Tsao, Heng-Kwong, E-mail: hktsao@cc.ncu.edu.tw [Department of Chemical and Materials Engineering, National Central University, Jhongli 320, Taiwan, ROC (China)

    2015-06-30

    Graphical abstract: - Highlights: • A thin oxide layer always remains on surfaces of Cu wafers after aqueous etching. • A pure Cu wafer is obtained by the HAc treatment and the water CA is about 45°. • The oxide layer and CA grow with time after the Cu wafer is exposed to air. • Surface roughness and hydrophobicity of pure Cu wafers grow rapidly in vacuum. - Abstract: The wet cleaning process in semiconductor fabrication often involves the immersion of the copper wafer into etching solutions and thereby its surface properties are significantly altered. The wetting behavior of a copper film deposited on silicon wafer is investigated after a short dip in various etching solutions. The etchants include glacial acetic acid and dilute solutions of nitric acid, hydrofluoric acid, and tetramethylammonium hydroxide. It was found that in most cases a thin oxide layer still remains on the surface of as-received Cu wafers when they are subject to etching treatments. However, a pure Cu wafer can be obtained by the glacial acetic acid treatment and its water contact angle (CA) is about 45°. As the pure Cu wafer is placed in the ambient condition, the oxide thickness grows rapidly to the range of 10–20 Å within 3 h and the CA on the hydrophilic surface also rises. In the vacuum, it is surprising to find that the CA and surface roughness of the pure Cu wafer can grow significantly. These interesting results may be attributed to the rearrangement of surface Cu atoms to reduce the surface free energy.

  16. Cosmogenic and implanted radionuclides studied by selective etching of lunar soils

    Jull, A J T; McHargue, L R; Burr, G S; Donahue, D J

    2000-01-01

    We have made new measurements of the concentrations of sup 1 sup 4 C and sup 1 sup 0 Be in lunar surface soils. We discuss the results of these new studies based on different acid etching methods, which provide useful information for future experiments. We also discuss the implications of these results for the production of these radionuclides by galactic and solar cosmic radiation, and the direct implantation of solar-energetic particles into lunar surface material.

  17. Adhesive dentistry: the development of immediate dentin sealing/selective etching bonding technique.

    Helvey, Gregg A

    2011-01-01

    A major objective of dental research over the past 60 years has been a search for the "dream-team" of dental adhesives. In fact, a recent Medline search produced more than 6,500 papers on dentin bonding and its techniques. Adhesive systems are designed to retain direct and indirect restorations, minimize leakage at the margin, and be simple to place while producing consistent results. The development of materials and techniques has an interesting history; some have recirculated from the past and are being used in some form today. Buonocore used the etchant phosphoric acid at the beginning of the adhesive revolution. Though not accepted for many years it eventually became the "gold standard" for etching enamel. Technique sensitivity moved it out of favor and, through the development of self-etching acidic primers, was eliminated from some adhesive systems. Although these primers may have successfully addressed postoperative sensitivity, adhesion was compromised. The bond strength of these systems has now been improved with the incorporation of phosphoric acid-etch to condition enamel prior to using the adhesive system. This article will trace the history of adhesive techniques and materials and how it has led to the creation of a new technique that combines two bonding methods.

  18. Modification of etching patterns in bovine dental enamel.

    Lees, S; Trombly, P L; Skobe, Z; Gariepy, E E; Trull, A F

    1979-08-01

    It is presumed that the etching pattern is controlled by the residual organic content of dental enamel. Pretreatment with 1.ON NaOH sould remove the organic material and modify the etching pattern. SEM studies and other tests for physical and chemical properties show that the predicted modification of the etching pattern, when the tooth surface is pretreated with NaOH solution, occurs apparently without other changes or properties.

  19. Dislocation Etching Solutions for Mercury Cadmium Selenide

    2014-09-01

    be obtained in order to develop better etching solutions. 13 6. References 1. Brill G, Chen Y, Wijewarnasuriya P. J. Elect. Mater. 2011;40...PJ, Jacobs RN, Markunas JK, Jaime-Vasquez M, Almeida LA, Stoltz AJ, Wijewarnasuriya PS, Brill G, Chen Y, Lee U, Vilela MF, Peterson J, Johnson SM...Elect. Mater. 1995;24:505. 5. Doyle K, Swartz CH, Dinan JH, Myers TH, Brill G, Chen Y, VanMil BL, Wijewarnasuriya P. J. Vac. Sci. Technol. B 2013;31

  20. In vitro analysis of riboflavin-modified, experimental, two-step etch-and-rinse dentin adhesive: Fourier transform infrared spectroscopy and micro-Raman studies

    Daood, Umer; Swee Heng, Chan; Neo Chiew Lian, Jennifer; Fawzy, Amr S

    2014-01-01

    To modify two-step experimental etch-and-rinse dentin adhesive with different concentrations of riboflavin and to study its effect on the bond strength, degree of conversion, along with resin infiltration within the demineralized dentin substrate, an experimental adhesive-system was modified with different concentrations of riboflavin (m/m, 0, 1%, 3%, 5% and 10%). Dentin surfaces were etched with 37% phosphoric acid, bonded with respective adhesives, restored with restorative composite–resin,...

  1. Microleakage of composite resin restoration in cavities prepared by Er,Cr:YSGG laser irradiation and etched bur cavities in primary teeth.

    Hossain, Mozammal; Nakamura, Yukio; Yamada, Yoshishige; Murakami, Yoshiko; Matsumoto, Koukichi

    2002-01-01

    In this in vitro study, the surface alterations of enamel and dentin in cavities prepared by Er,Cr:YSGG laser irradiation was investigated by scanning electron microscopy and compared to the microleakage degree after composite resin restoration with etched bur cavities in human primary teeth. The results confirmed that laser cavity surface facilitated a good adhesion with the restorative materials; the acid etch step can be easily avoided with the laser treatment.

  2. Lateral electrochemical etching of III-nitride materials for microfabrication

    Han, Jung

    2017-02-28

    Conductivity-selective lateral etching of III-nitride materials is described. Methods and structures for making vertical cavity surface emitting lasers with distributed Bragg reflectors via electrochemical etching are described. Layer-selective, lateral electrochemical etching of multi-layer stacks is employed to form semiconductor/air DBR structures adjacent active multiple quantum well regions of the lasers. The electrochemical etching techniques are suitable for high-volume production of lasers and other III-nitride devices, such as lasers, HEMT transistors, power transistors, MEMs structures, and LEDs.

  3. INCREASING THE PHOTOLUMINESCENCE INTENSITY OF Ge ISLANDS BY CHEMICAL ETCHING

    高斐; 黄昌俊; 黄大定; 李建平; 孔梅影; 曾一平; 李晋闽; 林兰英

    2001-01-01

    Self-assembled Ge islands were grown on Si(100) substrate by Si2H6-Ge molecular beam epitaxy. After beingsubjected to chemical etching, it is found that the photoluminescence from the etched Ge islands became more intense and shifted to the higher-energy side compared to that of the as-deposited Ge islands. This behaviour was explained by the effect of chemical etching on the morphology of the Ge islands. Our results demonstrate that chemical etching can be a way to change the luminescence property of the as-deposited islands.

  4. Fabrication of silicon nanowire arrays by macroscopic galvanic cell-driven metal catalyzed electroless etching in aerated HF solution.

    Liu, Lin; Peng, Kui-Qing; Hu, Ya; Wu, Xiao-Ling; Lee, Shuit-Tong

    2014-03-05

    Macroscopic galvanic cell-driven metal catalyzed electroless etching (MCEE) of silicon in aqueous hydrofluoric acid (HF) solution is devised to fabricate silicon nanowire (SiNW) arrays with dissolved oxygen acting as the one and only oxidizing agent. The key aspect of this strategy is the use of a graphite or other noble metal electrode that is electrically coupled with silicon substrate.

  5. A new concept for spatially divided Deep Reactive Ion Etching with ALD-based passivation

    Roozeboom, F.; Kniknie, B.J.; Lankhorst, A.M.; Winands, G.; Knaapen, R.; Smets, M.; Poodt, P.W.G.; Dingemans, G.; Keuning, W.; Kessels, W.M.M.

    2012-01-01

    Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles of 1) Si-etching with SF6 to form gaseous SiFx etch products, and 2) passivation with C4F8 that polymerizes as a protecting fluorocarbon deposit on the sidewalls and bottom of the etched features. In

  6. The wettability between etching solutions and the surface of multicrystalline silicon wafer during metal-assisted chemical etching process

    Niu, Y. C.; Liu, Z.; Liu, X. J.; Gao, Y.; Lin, W. L.; Liu, H. T.; Jiang, Y. S.; Ren, X. K.

    2017-01-01

    In order to investigate the wettability of multicrystalline silicon (mc-Si) with the etching solutions during metal-assisted chemical etching process, different surface structures were fabricated on the p-type multi-wire slurry sawn mc-Si wafers, such as as-cut wafers, polished wafers, and wafers etched in different solutions. The contact angles of different etching solutions on the surfaces of the wafers were measured. It was noted that all contact angles of etching solutions were smaller than the corresponding ones of deionized water, but the contact angles of different etching solutions were quite different. Among the contact angles of the etching solutions of AgNO3-HF, H2O2-HF, TMAH and HNO3-HF, the contact angle of TMAH solution was much larger than the others and that of HNO3-HF solution was much smaller. It is suggested that the larger contact angle may lead to an unevenly etching of silicon wafer due to the long retention of big bubbles on the wafers in the etching reaction, which should be paid attention to and overcome.

  7. Admittance spectroscopy of CdTe/CdS solar cells subjected to varied nitric-phosphoric etching conditions.

    2007-01-01

    In this work we investigate the electric and structural properties of CdTe/CdS solar cells subjected to a nitric-phosphoric (NP) acid etching procedure, employed for the formation of a Te-rich layer before back contacting. The etching time is used as the only variable parameter in the study, while admittance spectroscopy is employed for the characterization of the cells' electric properties as well as for the analysis of the defect energy levels. Particular attention was also given to the cha...

  8. Anisotropy of synthetic diamond in catalytic etching using iron powder

    Wang, Junsha [College of Materials Science and Engineering, Hunan University, Hunan 410082 (China); Department of Mechanical Engineering, Keio University, Yokohama 223-8522 (Japan); Wan, Long, E-mail: wanlong1799@163.com [College of Materials Science and Engineering, Hunan University, Hunan 410082 (China); Chen, Jing [College of Materials Science and Engineering, Hunan University, Hunan 410082 (China); Yan, Jiwang [Department of Mechanical Engineering, Keio University, Yokohama 223-8522 (Japan)

    2015-08-15

    Highlights: • Synthetic diamond crystallites were etched using iron without requiring hydrogen. • The effect of temperature on the etching behaviour was demonstrated. • The anisotropy of etching on different crystal planes was investigated. • The extent of etching on diamond surface was examined quantitatively. • A schematic model for diamond etching by iron is being proposed. - Abstract: This paper demonstrated a novel technique for catalytic etching of synthetic diamond crystallites using iron (Fe) powder without flowing gas. The effect of temperature on the etching behaviour on different crystal planes of diamond was investigated. The surface morphology and surface roughness of the processed diamond were examined by scanning electron microscope (SEM) and laser-probe surface profiling. In addition, the material composition of the Fe-treated diamond was characterized using micro-Raman spectroscopy and the distribution of chemical elements and structural changes on Fe-loaded diamond surfaces were analyzed by energy dispersive X-ray spectroscopy (EDS) and X-ray diffraction (XRD), respectively. Results showed that at the same temperature the {1 0 0} plane was etched faster than the {1 1 1} plane, and that the etching rate of both {1 0 0} and {1 1 1} plane increased with temperature. The etch pits on {1 0 0} plane were reversed pyramid with flat {1 1 1} walls, while the etch holes on {1 1 1} plane were characterized with flat bottom. It was also demonstrated that graphitization of diamond and subsequent carbon diffusion in molten iron were two main factors resulting in the removal of carbon from the diamond surface.

  9. Growing and Etching MoS2 on Carbon Nanotube Film for Enhanced Electrochemical Performance

    Weiyu Xu

    2016-09-01

    Full Text Available In this work we directly synthesized molybdenum disulfide (MoS2 nanosheets on carbon nanotube film (MoS2@CNT via a two-step chemical vapor deposition method (CVD. By etching the obtained MoS2@CNT into 10% wt HNO3, the morphology of MoS2 decorated on CNT bundles was modulated, resulting in more catalytic active MoS2 edges being exposed for significantly enhanced electrochemical performance. Our results revealed that an 8 h acid etching sample exhibited the best performance for the oxygen evolution reaction, i.e., the current density reached 10 mA/cm2 under 375 mV over-potential, and the tafel slope was as low as 94 mV/dec. The enhanced behavior was mainly originated from the more catalytic sites in MoS2 induced by the acid etching treatment and the higher conductivity from the supporting CNT films. Our study provides a new route to produce two-dimensional layers on CNT films with tunable morphology, and thus may open a window for exploring its promising applications in the fields of catalytic-, electronic-, and electrochemical-related fields.

  10. Optical and Electrical Performance of ZnO Films Textured by Chemical Etching

    Shiuh-Chuan HER

    2015-11-01

    Full Text Available Zinc oxide (ZnO films were prepared by radio frequency (RF magnetron sputtering on the glass substrate as transparent conductive oxide films. For silicon solar cells, a proper surface texture is essential to introduce light scattering and subsequent light trapping to enhance the current generation. In this study, the magnetron-sputtered ZnO films were textured by wet-chemical etching in diluted hydrochloric acid (HCl for better light scattering. The diffuse transmittance of the surface textured ZnO films was measured to evaluate the light scattering. The influence of hydrochloric acid concentration on the morphology, optical and electrical properties of the surface-textured ZnO film was investigated. The ZnO film etched in 0.05M HCl solution for 30 s exhibited average diffuse transmittance in the visible wavelength range of 9.52 % and good resistivity of 1.10 x 10-3 W×cm while the as-deposited ZnO film had average diffuse transmittance of 0.51 % and relatively high resistivity of 5.84 x 10-2 W×cm. Experimental results illustrated that the optical and electrical performance of ZnO films can be significantly improved by introducing the surface texture through the wet-chemical etching process.DOI: http://dx.doi.org/10.5755/j01.ms.21.4.9624

  11. Electronegativity-dependent tin etching from thin films

    Pachecka, M.; Sturm, J.M.; Kruijs, van de R.W.E.; Lee, C.J.; Bijkerk, F.

    2016-01-01

    The influence of a thin film substrate material on the etching of a thin layer of deposited tin (Sn) by hydrogen radicals was studied. The amount of remaining Sn was quantified for materials that cover a range of electronegativities. We show that, for metals, etching depends on the relative electron

  12. Reactive ion etching of quartz and Pyrex for microelectronic applications

    Zeze, D. A.; Forrest, R. D.; Carey, J. D.; Cox, D. C.; Robertson, I. D.; Weiss, B. L.; Silva, S. R. P.

    2002-10-01

    The reactive ion etching of quartz and Pyrex substrates was carried out using CF4/Ar and CF4/O2 gas mixtures in a combined radio frequency (rf)/microwave (μw) plasma. It was observed that the etch rate and the surface morphology of the etched regions depended on the gas mixture (CF4/Ar or CF4/O2), the relative concentration of CF4 in the gas mixture, the rf power (and the associated self-induced bias) and microwave power. An etch rate of 95 nm/min for quartz was achieved. For samples covered with a thin metal layer, ex situ high resolution scanning electron microscopy and atomic force microscopy imaging indicated that, during etching, surface roughness is produced on the surface beneath the thin metallic mask. Near vertical sidewalls with a taper angle greater than 80° and smooth etched surfaces at the nanometric scale were fabricated by carefully controlling the etching parameters and the masking technique. A simulation of the electrostatic field distribution was carried out to understand the etching process using these masks for the fabrication of high definition features.

  13. The effect of exposure duration of self etch dentin bonding on the toxicity of human gingival fibroblast of cell culture

    Sri Lestari

    2008-06-01

    Full Text Available Self etch dentin bonding created to make light easily activate the application of composite resin on tooth surface. The monomer content has acid effect that could irritate tooth pulp. The purpose of this study was to evaluate the effect of light exposure duration of self etch dentin bonding on toxicity of human gingival fibroblast of cell culture by MTT assay. Self etch dentin bonding was used as on experimental unit and the sample was exposed by visible light curing in different duration: 10, 20, 30 seconds and immerged in artificial saliva in pH 7 for 24 hours. 100 µl artificial saliva was exposed to human gingival fibroblast of cell culture 20.000 cells/100 µl RPMI for 24 hours. Toxicity was evaluated by MTT assay, optical density was measured using 550 nm spectrophotometer. The data was analyzed using Kruskal Wallis in 5% degree of significance. The result showed that increasing exposure duration (10, 20, 30 seconds of self etch dentin bonding will reduce the toxicity of human gingival fibroblast of cell culture. It is concluded that 30 seconds-exposure of self etch dentin bonding will reduce the toxicity of human gingival fibroblast of cell culture.

  14. 椭圆状微织构自润滑车刀切削性能试验%Cutting Performance of Self-lubricating Turning Tools with Elliptical Micro-textures

    吴泽; 邓建新; 邢佑强; 程洁; 赵军

    2012-01-01

    采用激光加工方法在硬质合金刀具前刀面易磨损区域加工椭圆状微织构,并在微织构中填充MoS2固体润滑剂,制备了微织构自润滑刀具.运用有限元方法分析了微织构对刀具刀尖处应力分布的影响;将微织构自润滑刀具与传统刀具进行了干切削45号钢的对比试验.结果表明:微织构的存在对刀尖处的应力分布无显著影响,与传统刀具相比,微织构自润滑刀具能够有效降低切削力和切削温度,减小切屑变形,增加切屑卷曲,同时减缓刀具前刀面磨损.%Elliptical micro-textures were made by using laser on the rake face of the tungsten carbide cutting inserts. Molybdenum disulfide ( MoS2 ) solid lubricants were embedded into the micro-textures to form self-lubricating textured tools. Finite element analysis was conducted to assess the effect of micro-texture on the stress distribution of the cutting inserts. Dry cutting tests were carried out with these self-lubricated cutting tools and conventional cemented carbide tools. As the results, there is no conspicuous adverse effect on the stress distribution of the tool nose with micro-textures on the rake face. The cutting forces and the cutting temperatures with the self-lubricating textured tools were greatly reduced compared with that of conventional cemented carbide tools. Meanwhile, the rake wear and the chip deformation were reduced, and the chip coiling was improved with micro-texturing lubrication.

  15. Fast pore etching on high resistivity n-type silicon via photoelectrochemistry

    Bao Xiao-Qing; Ge Dao-Han; Zhang Sheng; Li Jin-Peng; Zhou Ping; Jiao Ji-Wei; Wang Yue-Lin

    2009-01-01

    In this paper, five factors, namely the HF (hydrofluoric acid) concentration, field strength, illumination intensity as well as the oxidizing-power and conductivity of electrolytes were found to strongly affect the fast pore etching. The oxidizing power of aqueous HF electrolyte of different concentrations was especially measured and analysed. A positive correlation between optimal bias and HF concentration was generally observed and the relationship was semi-quantitatively interpreted. Pore density notably increased with enhanced HF-concentration or bias even on patterned substrates where 2D (two-dimensional) nuclei were densely pre-textured. The etch rate can reach 400μm/h and the aspect ratio of pores can be readily driven up to 250.

  16. Chemical Composition of Nanoporous Layer Formed by Electrochemical Etching of p-Type GaAs

    Bioud, Youcef A.; Boucherif, Abderraouf; Belarouci, Ali; Paradis, Etienne; Drouin, Dominique; Arès, Richard

    2016-10-01

    We have performed a detailed characterization study of electrochemically etched p-type GaAs in a hydrofluoric acid-based electrolyte. The samples were investigated and characterized through cathodoluminescence (CL), X-ray diffraction (XRD), energy-dispersive X-ray spectroscopy (EDX), and X-ray photoelectron spectroscopy (XPS). It was found that after electrochemical etching, the porous layer showed a major decrease in the CL intensity and a change in chemical composition and in the crystalline phase. Contrary to previous reports on p-GaAs porosification, which stated that the formed layer is composed of porous GaAs, we report evidence that the porous layer is in fact mainly constituted of porous As2O3. Finally, a qualitative model is proposed to explain the porous As2O3 layer formation on p-GaAs substrate.

  17. Fabrication of honeycomb texture on poly-Si by laser interference and chemical etching

    Yang, Bogeum; Lee, Myeongkyu, E-mail: myeong@yonsei.ac.kr

    2013-11-01

    In this paper, we present a laser-interference method to fabricate honeycomb textures on poly-Si wafer for reflection reduction. When exposed to three interfering pulsed laser beams at 532 nm, the Si surface was periodically melted in accordance with the interference pattern. As a result, concave holes were generated on the surface because the melted material overflowed and condensed at the periphery. Subsequent acid etching revealed uniform and clean honeycomb textures. The texture depth could be controlled by varying the irradiation condition and a minimum reflectance of 10% was obtained. Transmission electron microscopy analysis showed that no irradiation-induced damage remained after etching. This approach can be a cost-effective alternative to lithographic processes for fabricating high-efficiency poly-Si solar cells.

  18. Silicon nanowire photodetectors made by metal-assisted chemical etching

    Xu, Ying; Ni, Chuan; Sarangan, Andrew

    2016-09-01

    Silicon nanowires have unique optical effects, and have potential applications in photodetectors. They can exhibit simple optical effects such as anti-reflection, but can also produce quantum confined effects. In this work, we have fabricated silicon photodetectors, and then post-processed them by etching nanowires on the incident surface. These nanowires were produced by a wet-chemical etching process known as the metal-assisted-chemical etching, abbreviated as MACE. N-type silicon substrates were doped by thermal diffusion from a solid ceramic source, followed by etching, patterning and contact metallization. The detectors were first tested for functionality and optical performance. The nanowires were then made by depositing an ultra-thin film of gold below its percolation thickness to produce an interconnected porous film. This was then used as a template to etch high aspect ratio nanowires into the face of the detectors with a HF:H2O2 mixture.

  19. Composition/bandgap selective dry photochemical etching of semiconductor materials

    Ashby, C.I.H.; Dishman, J.L.

    1985-10-11

    Disclosed is a method of selectively photochemically dry etching a first semiconductor material of a given composition and direct bandgap Eg/sub 1/ in the presence of a second semiconductor material of a different composition and direct bandgap Eg/sub 2/, wherein Eg/sub 2/ > Eg/sub 1/, said second semiconductor material substantially not being etched during said method. The method comprises subjecting both materials to the same photon flux and to the same gaseous etchant under conditions where said etchant would be ineffective for chemical etching of either material were the photons not present, said photons being of an energy greater than Eg/sub 1/ but less than Eg/sub 2/, whereby said first semiconductor material is photochemically etched and said second material is substantially not etched.

  20. Composition/bandgap selective dry photochemical etching of semiconductor materials

    Ashby, Carol I. H. (Edgewood, NM); Dishman, James L. (Albuquerque, NM)

    1987-01-01

    A method of selectively photochemically dry etching a first semiconductor material of a given composition and direct bandgap Eg.sub.1 in the presence of a second semiconductor material of a different composition and direct bandgap Eg.sub.2, wherein Eg.sub.2 >Eg.sub.1, said second semiconductor material substantially not being etched during said method, comprises subjecting both materials to the same photon flux and to the same gaseous etchant under conditions where said etchant would be ineffective for chemical etching of either material were the photons not present, said photons being of an energy greater than Eg.sub.1 but less than Eg.sub.2, whereby said first semiconductor material is photochemically etched and said second material is substantially not etched.

  1. Composition/bandgap selective dry photochemical etching of semiconductor materials

    Ashby, C.I.H.; Dishman, J.L.

    1987-03-10

    A method is described of selectively photochemically dry etching a first semiconductor material of a given composition and direct bandgap E/sub g1/ in the presence of a second semiconductor material of a different composition and direct bandgap E/sub g2/, wherein E/sub g2/>E/sub g1/. The second semiconductor material is not substantially etched during the method, comprising subjecting both materials to the same photon flux and to the same gaseous etchant under conditions where the etchant would be ineffective for chemical etching of either material where the photons are not present, the photons being of an energy greater than E/sub g1/ but less than E/sub g2/, whereby the first semiconductor material is photochemically etched and the second material is substantially not etched.

  2. Optimize Etching Based Single Mode Fiber Optic Temperature Sensor

    Ajay Kumar

    2014-02-01

    Full Text Available This paper presents a description of etching process for fabrication single mode optical fiber sensors. The process of fabrication demonstrates an optimized etching based method to fabricate single mode fiber (SMF optic sensors in specified constant time and temperature. We propose a single mode optical fiber based temperature sensor, where the temperature sensing region is obtained by etching its cladding diameter over small length to a critical value. It is observed that the light transmission through etched fiber at 1550 nm wavelength optical source becomes highly temperature sensitive, compared to the temperature insensitive behavior observed in un-etched fiber for the range on 30ºC to 100ºC at 1550 nm. The sensor response under temperature cycling is repeatable and, proposed to be useful for low frequency analogue signal transmission over optical fiber by means of inline thermal modulation approach.

  3. Thermal neutron dosimetry using electrochemical etching

    Su, S.J.; Sanders, M.E.; Morgan, K.Z.

    1979-07-10

    This study demonstrates the feasibility of using high LET particle radiators to determine the thermal neutron dose by reaction particle registration in low background polycarbonate foils using electrochemical etching. When used in conjunction with the already proven fast neutron recoil particle track registration technique, a viable fast and thermal neutron dosimeter is realized with the advantages of being: non-fading, insensitive to low LET radiation reactions, inexpensive in both processing and materials, useable over a wide dose range, a permanant record and good reproducibility, highly sensitive, and tissue equivalent and a dose equivalent response over a wide range. Most importantly, it finally provides a simple and reliable dosimeter for both the fast and thermal neutron components.

  4. Adhesion of indirect MOD resin composite inlays luted with self-adhesive and self-etching resin cements.

    Inukai, T; Abe, T; Ito, Y; Pilecki, P; Wilson, R F; Watson, T F; Foxton, R M

    2012-01-01

    This study investigated the effect of loading on the bond strength to dentin and microleakage of MOD indirect composite restorations bonded with self-adhesive and self-etching resin cements with or without acid etching of the proximal enamel margins. Class II MOD cavities were prepared in 48 molar teeth into dentin and divided into three groups of 16 teeth. Impressions were taken and indirect composite inlays fabricated (Estenia C & B). The enamel margins of the proximal boxes of half the specimens were phosphoric acid etched, and the inlays were cemented with one of three cements (Panavia F 2.0, SA Cement, or Rely X Unicem). After luting, eight teeth in each cement group were mechanically loaded at 2.5 cycles/s for 250,000 cycles. Unloaded teeth acted as controls. Teeth were stored in Rhodamine B solution for 24 hours, sectioned buccolingually at the proximal boxes to examine microleakage using confocal microscopy, and further sectioned for μTBS testing of the resin-dentin interface. Analysis of variance was performed to assess the effect of loading and acid etching on microleakage and bond strength. Acid etching had no effect on microleakage. No significant difference in the dentin bond strengths between the three cements existed after loading. Panavia F 2.0 exhibited a significant reduction in bond strength. With regard to microleakage at the proximal boxes, loading had no effect on dye penetration at the cavity floor. However, at the axial walls, loading had a significant deleterious effect on Panavia F 2.0. No difference in microleakage existed between the three cements at both sites before and after loading. In conclusion, the two tested self-adhesive cements exhibited similar bond strengths before and after loading to the self-etching resin cement. Loading reduced dentin bond strengths and increased microleakage at the resin-dentin interface. However, acid etching of the enamel margins had no significant effect on microleakage in the approximal regions of

  5. Anodic etching of GaN based film with a strong phase-separated InGaN/GaN layer: Mechanism and properties

    Gao, Qingxue; Liu, Rong; Xiao, Hongdi; Cao, Dezhong; Liu, Jianqiang; Ma, Jin

    2016-11-01

    A strong phase-separated InGaN/GaN layer, which consists of multiple quantum wells (MQW) and superlattices (SL) layers and can produce a blue wavelength spectrum, has been grown on n-GaN thin film, and then fabricated into nanoporous structures by electrochemical etching method in oxalic acid. Scanning electron microscopy (SEM) technique reveals that the etching voltage of 8 V leads to a vertically aligned nanoporous structure, whereas the films etched at 15 V show branching pores within the n-GaN layer. Due to the low doping concentration of barriers (GaN layers) in the InGaN/GaN layer, we observed a record-low rate of etching (partial relaxation of compressive stress due to the increased light-extracting surface area and light-guiding effect. Such a compressive stress relaxation can be further confirmed by Raman spectra.

  6. Formation of Micro- and Nanostructures on the Nanotitanium Surface by Chemical Etching and Deposition of Titania Films by Atomic Layer Deposition (ALD

    Denis V. Nazarov

    2015-12-01

    Full Text Available In this study, an integrated approach was used for the preparation of a nanotitanium-based bioactive material. The integrated approach included three methods: severe plastic deformation (SPD, chemical etching and atomic layer deposition (ALD. For the first time, it was experimentally shown that the nature of the etching medium (acidic or basic Piranha solutions and the etching time have a significant qualitative impact on the nanotitanium surface structure both at the nano- and microscale. The etched samples were coated with crystalline biocompatible TiO2 films with a thickness of 20 nm by Atomic Layer Deposition (ALD. Comparative study of the adhesive and spreading properties of human osteoblasts MG-63 has demonstrated that presence of nano- and microscale structures and crystalline titanium oxide on the surface of nanotitanium improve bioactive properties of the material.

  7. E-beam inspection of EUV mask defects: To etch or not to etch?

    Bonam, Ravi; Tien, Hung-Yu; Park, Chanro; Halle, Scott; Wang, Fei; Corliss, Daniel; Fang, Wei; Jau, Jack

    2014-04-01

    EUV Lithography is aimed to be inserted into mainstream production for sub-20nm pattern fabrication. Unlike conventional optical lithography, frequent defectivity monitors (adders, repeaters etc.) are required in EUV lithography. Due to sub-20nm pattern and defect dimensions e-beam inspection of critical pattern areas is essential for yield monitor. In previous work we showed sub-10nm defect detection sensitivity1 on patterned resist wafers. In this work we report 8-10× improvement in scan rates of etched patterns compared to resist patterns without loss in defect detection sensitivity. We observed good etch transfer of sub-10nm resist features. A combination of smart scan strategies with improved etched pattern scan rates can further improve throughput of e-beam inspection. An EUV programmed defect mask with Line/Space, Contact patterns was used to evaluate printability of defects and defect detection (Die-Die and Die-Database) capability of the e-beam inspection tool. Defect inspection tool parameters such as averaging, threshold value were varied to assess its detection capability and were compared to previously obtained results on resist patterns.

  8. Optimized condition for etching fused-silica phase gratings with inductively coupled plasma technology.

    Wang, Shunquan; Zhou, Changhe; Ru, Huayi; Zhang, Yanyan

    2005-07-20

    Polymer deposition is a serious problem associated with the etching of fused silica by use of inductively coupled plasma (ICP) technology, and it usually prevents further etching. We report an optimized etching condition under which no polymer deposition will occur for etching fused silica with ICP technology. Under the optimized etching condition, surfaces of the fabricated fused silica gratings are smooth and clean. Etch rate of fused silica is relatively high, and it demonstrates a linear relation between etched depth and working time. Results of the diffraction of gratings fabricated under the optimized etching condition match theoretical results well.

  9. Particle precipitation in connection with KOH etching of silicon

    Nielsen, Christian Bergenstof; Christensen, Carsten; Pedersen, Casper

    2004-01-01

    This paper considers the precipitation of iron oxide particles in connection with the KOH etching of cavities in silicon wafers. The findings presented in this paper suggest that the source to the particles is the KOH pellets used for making the etching solution. Experiments show that the precipi...... of the change in free energy of adsorption, the Pourbaix diagram, the electrochemical double- layer thickness and silicon dopant type, and concentration. (C) 2004 The Electrochemical Society.......This paper considers the precipitation of iron oxide particles in connection with the KOH etching of cavities in silicon wafers. The findings presented in this paper suggest that the source to the particles is the KOH pellets used for making the etching solution. Experiments show...... that the precipitation is independent of KOH etching time, but that the amount of deposited material varies with dopant type and dopant concentration. The experiments also suggest that the precipitation occurs when the silicon wafers are removed from the KOH etching solution and not during the etching procedure. When...

  10. Dry etching technologies for the advanced binary film

    Iino, Yoshinori; Karyu, Makoto; Ita, Hirotsugu; Yoshimori, Tomoaki; Azumano, Hidehito; Muto, Makoto; Nonaka, Mikio

    2011-11-01

    ABF (Advanced Binary Film) developed by Hoya as a photomask for 32 (nm) and larger specifications provides excellent resistance to both mask cleaning and 193 (nm) excimer laser and thereby helps extend the lifetime of the mask itself compared to conventional photomasks and consequently reduces the semiconductor manufacturing cost [1,2,3]. Because ABF uses Ta-based films, which are different from Cr film or MoSi films commonly used for photomask, a new process is required for its etching technology. A patterning technology for ABF was established to perform the dry etching process for Ta-based films by using the knowledge gained from absorption layer etching for EUV mask that required the same Ta-film etching process [4]. Using the mask etching system ARES, which is manufactured by Shibaura Mechatronics, and its optimized etching process, a favorable CD (Critical Dimension) uniformity, a CD linearity and other etching characteristics were obtained in ABF patterning. Those results are reported here.

  11. Solid polymer electrolyte composite membrane comprising plasma etched porous support

    Liu, Han; LaConti, Anthony B.

    2010-10-05

    A solid polymer electrolyte composite membrane and method of manufacturing the same. According to one embodiment, the composite membrane comprises a rigid, non-electrically-conducting support, the support preferably being a sheet of polyimide having a thickness of about 7.5 to 15 microns. The support has a plurality of cylindrical pores extending perpendicularly between opposing top and bottom surfaces of the support. The pores, which preferably have a diameter of about 0.1 to 5 microns, are made by plasma etching and preferably are arranged in a defined pattern, for example, with fewer pores located in areas of high membrane stress and more pores located in areas of low membrane stress. The pores are filled with a first solid polymer electrolyte, such as a perfluorosulfonic acid (PFSA) polymer. A second solid polymer electrolyte, which may be the same as or different than the first solid polymer electrolyte, may be deposited over the top and/or bottom of the first solid polymer electrolyte.

  12. Evaluation of shear bond strength of metallic and ceramic brackets bonded to enamel prepared with self-etching primer.

    Uysal, Tancan; Ustdal, Ayca; Kurt, Gokmen

    2010-04-01

    The aim of this in vitro study was to evaluate the shear bond strength (SBS) of different metallic and ceramic bracket bonding combinations using self-etching primers (SEPs). Eighty freshly extracted human premolar teeth were randomly divided into four equal groups for bonding with ceramic or metallic brackets as follows: group 1, metallic brackets bonded with conventional acid etching; group 2, metallic brackets bonded with Transbond Plus Self-Etching primer (TPSEP); group 3, ceramic brackets bonded as per group 1; group 4, ceramic brackets bonded as per group 2. The SBS of these brackets was measured and recorded in megapascals (MPa). The adhesive remnant index (ARI) scores were determined after bracket failure. Data were analyzed with the analysis of variance, Tukey, and chi-square tests. The bond strength of group 3 (mean: 36.7 +/- 11.8 MPa) was significantly higher than group 4 (mean: 26.6 +/- 8.9 MPa; P 0.05). Compared with conventional acid etching, SEPs significantly decreased the SBS of ceramic orthodontic brackets.

  13. Parametric study on the solderability of etched PWB copper

    Hosking, F.M.; Stevenson, J.O.; Hernandez, C.L.

    1996-10-01

    The rapid advancement of interconnect technology has resulted in a more engineered approach to designing and fabricating printed wiring board (PWB) surface features. Recent research at Sandia National Laboratories has demonstrated the importance of surface roughness on solder flow. This paper describes how chemical etching was used to enhance the solderability of surfaces that were normally difficult to wet. The effects of circuit geometry, etch concentration, and etching time on solder flow are discussed. Surface roughness and solder flow data are presented. The results clearly demonstrate the importance of surface roughness on the solderability of fine PWB surface mount features.

  14. Fabrication of Pure Silica Core Multimode Ultraviolet Optical Fibre Probes by Tube Etching

    HUO Xin; PAN Shi; WU Shi-Fa

    2007-01-01

    As a light wave-guide component for transmitting ultraviolet (UV) laser pulses, pure silica core UV fibre probes have attracted a great deal of attention in the near-field optical data storage and bio-medical studies. We fabricate UV fibre probes with tips in dimension of about 2-5μm and taper angle 16° by the tube etching method, using 40% HF acid as etching solution and xylene as overlayer. Probes produced have curvy configuration with smooth surface. The yield of fine probes is rather high and etching operation greatly simplified. With higher damage threshold, pure silica core multimode UV fibre probes can be coupled into more laser power. In addition, using UV light reduces the cutoff wavelength of the fibre probes, which is in favour of increasing the transmission efficiency of the probe. Furthermore, the larger tip dimension helps to enhance the light throughput either. The advances of fabrication technique of UV optical fibre probe may further support the studies of UV light data storage, pulsed laser biosurgery and UV photolithography.

  15. Silicon solar cells textured by reactive ion etching and processed with screen printing

    Burgers, A.R.; Tool, C.J.J.; Hylton, J.D.; Weeber, A.W. [ECN Solar and Wind, Netherlands Energy Research Foundation ECN, Petten (Netherlands); Verholen, A.G.B.J.; Gardeniers, J.G.E.; De Boer, M.J.; Elwenspoek, M.C. [MESA Research Institute for Micro Electronics, Materials- and Molecular Engineering, and Sensors and Actuators, University of Twente, Enschede (Netherlands)

    1998-07-01

    Reactive Ion Etching (RIE) can texture multicrystalline silicon wafers very well. RIE has the advantage over alkaline etches that it is not sensitive to the crystallographic orientation. RIE has the advantage over acid etches that it can be controlled much better. This work describes multicrystalline silicon solar cells textured by RIE and processed with an industrial process sequence consisting of mainly screen-printing steps. We also made mini-modules of the RIE textured cells. The RIE texturing parameters can be varied to give different textures. Care must be taken that the texture is sufficiently rough to give a low encapsulated reflectance but not so rough that carriers generated by light absorbed in the texture recombine at the surface and cannot be collected at the p-n junction. The screen printing on RIE textured cells was successful. We were able to make cells with both low reflectance and good quantum efficiency. Due to encapsulation problems we were not able to demonstrate an efficiency gain yet. 10 refs.

  16. Ultrasensitive Visual Sensing of Molybdate Based on Enzymatic-like Etching of Gold Nanorods.

    Zhang, Zhiyang; Chen, Zhaopeng; Chen, Lingxin

    2015-08-25

    Here, we have developed a novel approach to the visual detection of molybdate with high sensitivity and selectivity in aqueous media based on the combination of catalytic formation of iodine and iodine-mediated etching of gold nanorods. In weak acid solution, like peroxidase, molybdate can catalyze the reaction between H2O2 and I(-) to produce I2, a moderate oxidant, which then etches gold nanorods preferentially along the longitudinal direction in the presence of hexadecyltrimethylammonium bromide. The etching results in the longitudinal localized surface plasmon resonance extinction peak shifts to short wavelength, accompanied by a color change from blue to red. Under optimal conditions, this sensor exhibits good sensitivity with a detection limit of 1.0 nM. The approach is highlighted by its high selectivity and tolerance to interference, which enables the sensor to detect molybdate directly in real samples, such as tap water, drinking water, and seawater. In addition, perhaps the proposed sensing strategy can be also used for other targets that can selectively regulate the formation of I2 under given conditions.

  17. Nanoporous Gallium Nitride Through Anisotropic Metal-Assisted Electroless Photochemical Wet Etching Technique

    Perumal, R.; Hassan, Z.

    2016-12-01

    Nanoporous gallium nitride (GaN) has many potential applications in light-emitting diodes (LEDs), photovoltaics, templates and chemical sensors. This article reports the porosification of GaN through UV enhanced metal-assisted electroless photochemical wet etching technique using three different acid-based etchants and platinum served as catalyst for porosification. The etching process was conducted at room temperature for a duration of 90min. The morphological, structural, spectral and optical features of the developed porous GaN were studied with appropriate characterization techniques and the obtained results were presented. Field emission scanning electron micrographs exhibited the porosity nature along with excellent porous network of the etched samples. Structural studies confirmed the mono crystalline quality of the porous nanostructures. Raman spectral analyzes inferred the presenting phonon modes such as E2 (TO) and A1 (LO) in fabricated nanoporous structures. The resulted porous nanostructures hold the substantially enhanced photoluminescence intensity compared with the pristine GaN epitaxial film that is interesting and desirable for several advances in the applications of Nano-optoelectronic devices.

  18. Investigation of electrochemical etch differences in AlGaAs heterostructures using Cl{sub 2} ion beam assisted etching

    Anglin, Kevin, E-mail: kevin.r.anglin@gmail.com; Goodhue, William D. [Massachusetts Institute of Technology Lincoln Laboratory, 244 Wood St., Lexington, Massachusetts 02420 and Department of Physics and Applied Physics, University of Massachusetts Lowell, 1 University Ave., Lowell, Massachusetts 01854 (United States); Swint, Reuel B.; Porter, Jeanne [Massachusetts Institute of Technology Lincoln Laboratory, 244 Wood St., Lexington, Massachusetts 02420 (United States)

    2015-03-15

    A deeply etched, anisotropic 45° and 90° mirror technology is developed for Al{sub x}Ga{sub 1−x}As heterostructures using a Cl{sub 2} ion beam assisted etching system. When etching vertically, using a conductive low-erosion Ni mask, electrochemical etch differences between layers with various Al mole fractions caused nonuniform sidewall profiles not seen in semi-insulating GaAs test samples. These variations, based on alloy composition, were found to be negligible when etching at a 45°. A Si{sub 3}N{sub 4}-Ni etch mask is designed in order to electrically isolate charge buildup caused by the incoming Ar{sup +} ion beam to the Ni layer, preventing conduction to the underlying epitaxial layers. This modification produced smoothly etched facets, up to 8 μm in depth, enabling fabrication of substrate–surface-emitting slab-coupled optical waveguide lasers and other optoelectronic devices.

  19. Effectiveness of immediate bonding of etch-and-rinse adhesives to simplified ethanol-saturated dentin

    Leandro Afonso Guimarães

    2012-04-01

    Full Text Available This study examined the immediate bond strength of etch-and-rinse adhesives to demineralized dentin saturated with either water or absolute ethanol. The research hypothesis was that there would be no difference in bond strength to dentin between water or ethanol wet-bonding techniques. The medium dentin of 20 third molars was exposed (n = 5. The dentin surface was then acid-etched, left moist and randomly assigned to be saturated via either water wet-bonding (WBT or absolute ethanol wet-bonding (EBT. The specimens were then treated with one of the following etch-and-rinse adhesive systems: a 3-step, water-based system (Adper Scotchbond Multipurpose, or SBMP or a 2-step, ethanol/water-based system (Adper Single Bond 2, or SB. Resin composite build-ups were then incrementally constructed. After water storage for 24 h at 37°C, the tensile strength of the specimens was tested in a universal testing machine (0.5 mm/min. Data were analyzed by two-way ANOVA and Tukey's test (a = 5%. The failure modes were verified using a stereomicroscope (40'. For both adhesives, no significant difference in bond strength was observed between WBT and EBT (p > 0.05. The highest bond strength was observed for SB, regardless of the bonding technique (p < 0.05. No significant interaction between adhesives and bonding techniques was noticed (p = 0.597. There was a predominance of adhesive failures for all tested groups. The EBT and WBT displayed similar immediate bond strength means for both adhesives. The SB adhesive exhibited higher means for all conditions tested. Further investigations are needed to evaluate long-term bonding to dentin mediated by commercial etch-and-rinse adhesives using the EBT approach.

  20. Light-Cured Self-Etch Adhesives Undergo Hydroxyapatite-Triggered Self-Cure.

    Liu, Y; Bai, X; Liu, Y W; Wang, Y

    2016-03-01

    Light cure is a popular mode of curing for dental adhesives. However, it suffers from inadequate light delivery when the restoration site is less accessible, in which case a self-cure mechanism is desirable to salvage any compromised polymerization. We previously reported a novel self-cure system mediated by ethyl 4-(dimethylamino)-benzoate (4E) and hydroxyapatite (HAp). The present work aims to investigate if such self-cure phenomenon takes place in adhesives that underwent prior inadequate light cure and to elucidate if HAp released from the dental etching process is sufficient to trigger it. Model self-etch adhesives were formulated with various components, including bis[2-methacryloyloxy)ethyl]-phosphate (2MP) as acidic monomer and trimethylbenzoyl-diphenylphosphine oxide (TPO) as photoinitiator. In vitro evolution of degree of conversion (DC) of HAp-incorporated adhesives was monitored by infrared spectroscopy during light irradiation and dark storage. Selected adhesives were allowed to etch and extract HAp from enamel, light-cured in situ, and stored in the dark, after which Raman line mapping was used to obtain spatially resolved DC across the enamel-resin interface. Results showed that TPO+4E adhesives reached DC similar to TPO-only counterparts upon completion of light irradiation but underwent another round of initiation that boosted DC to ~100% regardless of HAp level or prior light exposure. When applied to enamel, TPO-only adhesives had ~80% DC in resin, which gradually descended to ~50% in enamel, whereas TPO+4E adhesives consistently scored ~80% DC across the enamel-resin interface. These observations suggest that polymerization of adhesives that underwent insufficient light cure is salvaged by the novel self-cure mechanism, and such salvaging effect can be triggered by HAp released from dental substrate during the etching process.

  1. Galvanic corrosion of Cu coupled to Au on a print circuit board; Effects of pretreatment solution and etchant concentration in organic solderability preservatives soft etching solution

    Oh, SeKwon; Kim, YoungJun; Shon, MinYoung; Kwon, HyukSang

    2016-09-01

    In present study, we quantitatively define the galvanic corrosion phenomenon of Cu electrically coupled to Au on Print Circuit Board in Organic Solderability Preservatives (OSP) pretreatment (pickling and soft etching) solutions. As a result of polarization and ZRA test, galvanic corrosion rate of Cu in soft etching solution was about 3000 times higher than that of pickling solution. The oxone in OSP soft etching solution was acted as strong oxidant for Cu on PCB substrate. And the galvanic corrosion of Cu in OSP soft etching solution was examined with the change of etchants (oxone (KHSO5), sulfuric acid (H2SO4)) concentration. The galvanic corrosion rate of Cu was increased by the increase of the oxone and sulfuric acid concentrations, which lead to the increase of cathodic reactant such as HSO 5 - and H+ ions. And the degree of galvanic corrosion rate of Cu (Δisoft etching = icouple, (Cu-Au) - icorr, Cu) decreased with the decrease of the oxone and sulfuric acid concentrations.

  2. Erbium doped stain etched porous silicon

    Gonzalez-Diaz, B. [Departamento de Fisica Basica, Universidad de La Laguna, Avda. Astrofisico Francisco Sanchez, 38204 La Laguna, S/C de Tenerife (Spain); Diaz-Herrera, B. [Departamento de Energia Fotovoltaica, Instituto Tecnologico de Energias Renovables (ITER), Poligono Industrial de Granadilla, 38611 S/C Tenerife (Spain); Guerrero-Lemus, R. [Departamento de Fisica Basica, Universidad de La Laguna, Avda. Astrofisico Francisco Sanchez, 38204 La Laguna, S/C de Tenerife (Spain)], E-mail: rglemus@ull.es; Mendez-Ramos, J.; Rodriguez, V.D. [Departamento de Fisica Fundamental, Experimental Electronica y Sistemas, Universidad de La Laguna, Avda. Astrofisico Francisco Sanchez, 38204 La Laguna, S/C de Tenerife (Spain); Hernandez-Rodriguez, C. [Departamento de Fisica Basica, Universidad de La Laguna, Avda. Astrofisico Francisco Sanchez, 38204 La Laguna, S/C de Tenerife (Spain); Martinez-Duart, J.M. [Departamento de Fisica Aplicada, C-XII, Universidad Autonoma de Madrid, 28049 Cantoblanco, Madrid (Spain)

    2008-01-15

    In this work a simple erbium doping process applied to stain etched porous silicon layers (PSLs) is proposed. This doping process has been developed for application in porous silicon solar cells, where conventional erbium doping processes are not affordable because of the high processing cost and technical difficulties. The PSLs were formed by immersion in a HF/HNO{sub 3} solution to properly adjust the porosity and pore thickness to an optimal doping of the porous structure. After the formation of the porous structure, the PSLs were analyzed by means of nitrogen BET (Brunauer, Emmett and Teller) area measurements and scanning electron microscopy. Subsequently, the PSLs were immersed in a saturated erbium nitrate solution in order to cover the porous surface. Then, the samples were subjected to a thermal process to activate the Er{sup 3+} ions. Different temperatures and annealing times were used in this process. The photoluminescence of the PSLs was evaluated before and after the doping processes and the composition was analyzed by Fourier transform IR spectroscopy.

  3. Effect of postoperative bleaching on microleakage of etch-and-rinse and self-etch adhesives

    Vajihesadat Mortazavi

    2011-01-01

    Full Text Available Background: Bleaching the discoloured teeth may affect the tooth/composite interface. The aim of this in vitro experimental study was to evaluate the effect of vital tooth bleaching on microleakage of existent class V composite resin restorations bonded with three dental bonding agents. Methods : Class V cavities were prepared on buccal surfaces of 72 intact, extracted human anterior teeth with gingival margins in dentin and occlusal margins in enamel, and randomly divided into 3 groups. Cavities in the three groups were treated with Scotch bond Multi-Purpose, a total etch system and Prompt L-Pop and iBond, two self-etch adhesives. All teeth were restored with Z250 resin composite material and thermo-cycled. Each group was equally divided into the control and the bleached subgroups (n = 12. The bleached subgroups were bleached with 15% carbamide peroxide gel for 8 hours a day for 15 days. Microleakage scores were evaluated on the incisal and cervical walls. Data were analyzed using Kruskal-Wallis, Mann-Whitney and Bonferroni post-hoc tests (α = 0.05. Results: Bleaching with carbamide peroxide gel significantly increased the microleakage of composite restorations in Prompt L-Pop group at dentinal walls (P = 0.001. Bleaching had no effect on microleakage of restorations in the Scotch bond Multi-Purpose and iBond groups. Conclusion: Vital tooth bleaching with carbamide peroxide gel has an adverse effect on marginal seal of dentinal walls of existent composite resin restorations bonded with prompt L-Pop self-etch adhesive.

  4. Marginal permeability of self-etch and total-etch adhesive systems.

    Owens, Barry M; Johnson, William W; Harris, Edward F

    2006-01-01

    This study evaluated microleakage in vitro of self-etch and multi-step, total-etch adhesive systems. Ninety-six extracted non-carious human molars were randomly assigned to eight groups (n=12) and restored with different adhesive systems: Optibond Solo Plus, iBond, Adper Prompt L-Pop, Xeno III, Simplicity, Nano-Bond, Adper Scotchbond Multi-Purpose and Touch & Bond. Each group was treated following the manufacturer's instructions. Class V cavities were prepared on the facial or lingual surfaces of each tooth with coronal margins in enamel and apical margins in cementum (dentin). The teeth were restored with Z-100 resin composite. After polishing with Sof-Lex disks, the teeth were thermocycled for 1000 cycles and coated with nail varnish to within 1.0 mm of the restoration. The teeth were stained in 1% methylene blue dye for 24 hours and sectioned from the facial to lingual surface. Dye penetration (microleakage) was examined with a 20x binocular microscope. Enamel and dentin margin leakage was scored on a 0 to 3 ordinal scale. Data were analyzed using Kruskal-Wallis Analysis of Variance and Mann-Whitney U tests. Comparison of the adhesive groups at the enamel margin revealed: 1) Adper Scotchbond Multi-Purpose exhibited significantly less leakage than the other adhesive groups (except iBond); 2) among the self-etch adhesive groups, iBond exhibited significantly less leakage than Nano-Bond and 3) the other adhesive groups clustered intermediately. In contrast, there were no significant differences among the adhesive groups when the dentin margin was evaluated. A Wilcoxin signed rank test showed significantly less leakage at the enamel margins compared to the dentin margins of the eight adhesive systems tested. All data were submitted to statistical analysis at p<0.05 level of significance.

  5. Summary of Chalcogenide Glass Processing: Wet-Etching and Photolithography

    Riley, Brian J.; Sundaram, S. K.; Johnson, Bradley R.; Saraf, Laxmikant V.

    2006-12-01

    This report describes a study designed to explore the different properties of two different chalcogenide materials, As2S3 and As24S38Se38, when subjected to photolithographic wet-etching techniques. Chalcogenide glasses are made by combining chalcogen elements S, Se, and Te with Group IV and/or V elements. The etchant was selected from the literature and was composed of sodium hydroxide, isopropyl alcohol, and deionized water and the types of chalcogenide glass for study were As2S3 and As24S38Se38. The main goals here were to obtain a single variable etch rate curve of etch depth per time versus NaOH overall solution concentration in M and to see the difference in etch rate between a given etchant when used on the different chalcogenide stoichiometries. Upon completion of these two goals, future studies will begin to explore creating complex, integrated photonic devices via these methods.

  6. GaN Nanowires Synthesized by Electroless Etching Method

    Najar, Adel

    2012-01-01

    Ultra-long Gallium Nitride Nanowires is synthesized via metal-electroless etching method. The morphologies and optical properties of GaN NWs show a single crystal GaN with hexagonal Wurtzite structure and high luminescence properties.

  7. Cryogenic rf test of the first plasma etched SRF cavity

    Upadhyay, J; Popović, S; Valente-Feliciano, A -M; Im, D; Phillips, L; Vušković, L

    2016-01-01

    Plasma etching has a potential to be an alternative processing technology for superconducting radio frequency (SRF) cavities. An apparatus and a method are developed for plasma etching of the inner surfaces of SRF cavities. To test the effect of the plasma etching on the cavity rf performance, a 1497 MHz single cell SRF cavity is used. The single cell cavity is mechanically polished, buffer chemically etched afterwards and rf tested at cryogenic temperatures for a baseline test. This cavity is then plasma processed. The processing was accomplished by moving axially the inner electrode and the gas flow inlet in a step-wise manner to establish segmented plasma processing. The cavity is rf tested afterwards at cryogenic temperatures. The rf test and surface condition results are presented.

  8. Polishing of quartz by rapid etching in ammonium bifluoride.

    Vallin, Orjan; Danielsson, Rolf; Lindberg, Ulf; Thornell, Greger

    2007-07-01

    The etch rate and surface roughness of polished and lapped AT-cut quartz subjected to hot (90, 110, and 130 degrees C), concentrated (50, 65, 80 wt %) ammonium bi-fluoride have been investigated. Having used principal component analysis to verify experimental solidity and analyze data, we claim with confidence that this parameter space does not, as elsewhere stated, allow for a polishing effect or even a preserving setting. Etch rates were found to correlate well, and possibly logarithmically, with temperature except for the hottest etching applied to lapped material. Roughness as a function of temperature and concentration behaved well for the lapped material, but lacked systematic variation in the case of the polished material. At the lowest temperature, concentration had no effect on etch rate or roughness. Future efforts are targeted at temperatures and concentrations closer to the solubility limit.

  9. Effect of Etching Time and Preparation on Push-Out Bond Strength of Composite to Intracanal Dentin of Primary Anterior Teeth

    Shahram Mosharrafian

    2016-12-01

    Full Text Available Objectives: This in-vitro study aimed to compare the push-out bond strength of composite to prepared and unprepared intracanal dentin using a 5th generation bonding agent in primary anterior teeth after etching for seven and 15 seconds.Materials and Methods: Sixty primary anterior teeth were randomly divided into four groups. In groups one and two, intracanal dentin remained intact while in groups three and four it was prepared using a #5 round bur and low-speed handpiece. Single Bond 2 was used in groups one and three after 15 seconds and in groups two and four after seven seconds of etching with phosphoric acid. After restoring with composite resin and incubation, the specimens were subjected to push-out bond strength test. Data were analyzed using two-way ANOVA and Kaplan Meier curves.Results: The mean bond strength was not significantly different between seven and 15 seconds etching times (P=0.198. Dentin preparation had no significant effect on the mean bond strength (P=0.838. The interaction effect of etching time and dentin preparation was not significant either (P=0.680.Conclusions: Decreasing the etching time from 15 to seven seconds and preparation of intracanal dentin had no significant effect on push-out bond strength of composite to intracanal dentin of primary anterior teeth. Keywords: Dental Etching; Composite Resins; Dentin; Tooth, Deciduous

  10. Hydrothermal Etching Treatment to Rutile TiO2 Nanorod Arrays for Improving the Efficiency of CdS-Sensitized TiO2 Solar Cells.

    Wan, Jingshu; Liu, Rong; Tong, Yuzhu; Chen, Shuhuang; Hu, Yunxia; Wang, Baoyuan; Xu, Yang; Wang, Hao

    2016-12-01

    Highly ordered TiO2 nanorod arrays (NRAs) were directly grown on an F:SnO2 (FTO) substrate without any seed layer by hydrothermal route. For a larger surface area, the second-step hydrothermal treatment in hydrochloric acid was carried out to the as-prepared TiO2 NRAs. The results showed that the center portion of the TiO2 nanorods were dissolved in the etching solution to form a nanocave at the initial etching process. As the etching time extended, the tip parts of the nanocave wall split into lots of nanowires with a reduced diameter, giving rise to a remarkable increase of specific surface area for the TiO2 NRAs. The TiO2 films after etching treatment were sensitized by CdS quantum dots (QDs) to fabricate quantum dot-sensitized solar cells (QDSSCs), which exhibited a significant improvement in the photocurrent density in comparison with that of the un-treated device, this mainly attributed to the enhancement of QD loading and diffused reflectance ability. Through modifying the etching TiO2 films with TiCl4, a relatively high power conversion efficiency (PCE) of 3.14 % was obtained after optimizing the etching time.

  11. Surface modification with alumina blasting and H2SO4-HCl etching for bonding two resin-composite veneers to titanium.

    Taira, Yohsuke; Egoshi, Takafumi; Kamada, Kohji; Sawase, Takashi

    2014-02-01

    The purpose of this study was to investigate the effect of an experimental surface treatment with alumina blasting and acid etching on the bond strengths between each of two resin composites and commercially pure titanium. The titanium surface was blasted with alumina and then etched with 45wt% H2SO4 and 15wt% HCl (H2SO4-HCl). A light- and heat-curing resin composite (Estenia) and a light-curing resin composite (Ceramage) were used with adjunctive metal primers. Veneered specimens were subjected to thermal cycling between 4 and 60°C for 50,000 cycles, and the shear bond strengths were determined. The highest bond strengths were obtained for Blasting/H2SO4-HCl/Estenia (30.2 ± 4.5 MPa) and Blasting/Etching/Ceramage (26.0 ± 4.5 MPa), the values of which were not statistically different, followed by Blasting/No etching/Estenia (20.4 ± 2.4 MPa) and Blasting/No etching/Ceramage (0.8 ± 0.3 MPa). Scanning electron microscopy observations revealed that alumina blasting and H2SO4-HCl etching creates a number of micro- and nanoscale cavities on the titanium surface, which contribute to adhesive bonding.

  12. Bond efficacy and interface morphology of self-etching adhesives to ground enamel

    Abdalla, A.I.; El Zohairy, A.A.; Mohsen, M.M.A.; Feilzer, A.J.

    2010-01-01

    Purpose: This study compared the microshear bond strengths to ground enamel of three one-step self-etching adhesive systems, a self-etching primer system and an etch-and-rinse adhesive system. Materials and Methods: Three self-etching adhesives, Futurabond DC (Voco), Clearfil S Tri Bond (Kuraray) an

  13. Dry etching of single crystal PMN-PT piezoelectric material.

    Agnus, Joël; Alexandru Ivan, Ioan; Queste, Samuel

    2011-01-01

    International audience; During the last decade, the applications of PMN-PT spread significantly. Unlike PZT, the appropriate microtechnologies for PMN-PT Piezo-MEMS aren't fully documented in the literature. This paper deals with the PMN-PT etching by inductively coupled plasma (ICP) technique, also known as DRIE. The paper quantitatively presents the etching parameters of PMN-PT by the Ar/C4F8 gas combination and reports some related useful experience.

  14. Quantum-size-controlled photoelectrochemical etching of semiconductor nanostructures

    Fischer, Arthur J.; Tsao, Jeffrey Y.; Wierer, Jr., Jonathan J.; Xiao, Xiaoyin; Wang, George T.

    2016-03-01

    Quantum-size-controlled photoelectrochemical (QSC-PEC) etching provides a new route to the precision fabrication of epitaxial semiconductor nanostructures in the sub-10-nm size regime. For example, quantum dots (QDs) can be QSC-PEC-etched from epitaxial InGaN thin films using narrowband laser photoexcitation, and the QD sizes (and hence bandgaps and photoluminescence wavelengths) are determined by the photoexcitation wavelength.

  15. Etching zircon age standards for fission-track analysis

    Garver, J.I. E-mail: garverj@union.edu

    2003-02-01

    Nineteen laboratories that routinely measure fission-track ages in zircon were surveyed as to their principal methodology used for track revelation using chemical attack and counting procedures. The survey results show the following: (a) researchers in most labs count fission tracks with a optical microscope using at a total magnification between 1250x and 1600x ({approx}80%) with about an equal number using either a dry or oil objective (b) the majority of laboratories etch zircon with a KOH:NaOH eutectic heated in an oven between temperatures of 210 deg. C and 230 deg. C; (c) ag standards in zircon analysis do not have uniformly accepted etch times. Etching times for the widely used 28 Ma Fish Canyon Tuff (FCT) (4-60 h) and the lesser-used 16 Ma Buluk Tuff (13-55 h) vary significantly from lab to lab. Between {approx}220 deg. C and 230 deg. C, the principal range fo etching times for the FCT is between 20 and 30 h, and the mode for the Buluk Tuff is between 30 and 55 h. Three or fewer labs report etching times for the Tardee Rhyolite (22-40 h), the Bishop Tuff (10-46 h), and the Mt. Dromedary Banite (5-24 h). Variation in etching times may result in a bias in U-content which affects counting statistics. If etching is successful, strict criteria must be followed to ensure that the analyst only counts well-etched grains and that all tracks are successfully identified.

  16. Influence of copper foil polycrystalline structure on graphene anisotropic etching

    Sharma, Kamal P.; Mahyavanshi, Rakesh D.; Kalita, Golap; Tanemura, Masaki

    2017-01-01

    Anisotropic etching of graphene and other two dimensional materials is an important tool to understand the growth process as well as enabling fabrication of various well-defined structures. Here, we reveal the influence of copper foil polycrystalline structure on anisotropic etching process of as-synthesized graphene. Graphene crystals were synthesized on the polycrystalline Cu foil by a low-pressure chemical vapor deposition (LPCVD) system. Microscopic analysis shows difference in shape, size and stripes alignment of graphene crystals with dissimilar nucleation within closure vicinity of neighboring Cu grains. Post-growth etching of such graphene crystals also significantly affected by the crystallographic nature of Cu grains as observed by the field emission scanning electron microscope (FE-SEM) and electron back scattered diffraction (EBSD) analysis. Hexagonal hole formation with anisotropic etching is observed to be independent of the stripes and wrinkles in the synthesized graphene. We also observed variation in etched pattern of the graphene depending on the base Cu grain orientations, attributing to difference in nucleation and growth process. The findings can facilitate to understand the nature of microscopic etched pattern depending on metal catalyst crystallographic structure.

  17. Etching of germanium-tin using ammonia peroxide mixture

    Dong, Yuan; Ong, Bin Leong; Wang, Wei; Gong, Xiao; Liang, Gengchiau; Yeo, Yee-Chia, E-mail: yeo@ieee.org [Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117576 (Singapore); Zhang, Zheng; Pan, Jisheng [Institute of Material Research and Engineering, A*STAR (Agency for Science, Technology and Research), 2 Fusionopolis Way, #08-03, Innovis, Singapore 138634 (Singapore); Tok, Eng-Soon [Department of Physics, National University of Singapore, Singapore 117551 (Singapore)

    2015-12-28

    The wet etching of germanium-tin (Ge{sub 1-x}Sn{sub x}) alloys (4.2% < x < 16.0%) in ammonia peroxide mixture (APM) is investigated. Empirical fitting of the data points indicates that the etch depth of Ge{sub 1-x}Sn{sub x} is proportional to the square root of the etch time t and decreases exponentially with increasing x for a given t. In addition, X-ray photoelectron spectroscopy results show that increasing t increases the intensity of the Sn oxide peak, whereas no obvious change is observed for the Ge oxide peak. This indicates that an accumulation of Sn oxide on the Ge{sub 1-x}Sn{sub x} surface decreases the amount of Ge atoms exposed to the etchant, which accounts for the decrease in etch rate with increasing etch time. Atomic force microscopy was used to examine the surface morphologies of the Ge{sub 0.918}Sn{sub 0.082} samples. Both root-mean-square roughness and undulation periods of the Ge{sub 1-x}Sn{sub x} surface were observed to increase with increasing t. This work provides further understanding of the wet etching of Ge{sub 1-x}Sn{sub x} using APM and may be used for the fabrication of Ge{sub 1-x}Sn{sub x}-based electronic and photonic devices.

  18. Etching Rate of Silicon Dioxide Using Chlorine Trifluoride Gas

    Miura, Yutaka; Kasahara, Yu; Habuka, Hitoshi; Takechi, Naoto; Fukae, Katsuya

    2009-02-01

    The etching rate behavior of silicon dioxide (SiO2, fused silica) using chlorine trifluoride (ClF3) gas is studied at substrate temperatures between 573 and 1273 K at atmospheric pressure in a horizontal cold-wall reactor. The etching rate increases with the ClF3 gas concentration, and the overall reaction is recognized to be of the first order. The change of the etching rate with increasing substrate temperature is nonlinear, and the etching rate tends to approach a constant value at temperatures exceeding 1173 K. The overall rate constant is estimated by numerical calculation, taking into account the transport phenomena in the reactor, including the chemical reaction at the substrate surface. The activation energy obtained in this study is 45.8 kJ mol-1, and the rate constant is consistent with the measured etching rate behavior. A reactor system in which there is minimum etching of the fused silica chamber by ClF3 gas can be achieved using an IR lamp heating unit and a chamber cooling unit to maintain a sufficiently low temperature of the chamber wall.

  19. Methods of removal of defects arising at liquid etching of polycrystalline silicon

    Ivanchykou A. E.

    2008-02-01

    Full Text Available The paper presents a model of generation of defects having the form of spots on the surface of the polycrystalline silicon during processing of semiconductor wafers with hydrofluoric acid based etchant, and a model of removal of such defects in chemical solutions. The authors investigate how the centrifuge speed during drying and the relief of structures, produced on the plate, effect the number of defects. It is shown that there is a possibility to remove defects by chemical treatment in the peroxide-ammonia solutions (PAS and also by sequence of chemical cleaning in Karo mixture, SiO2 etching and treatment in PAS.

  20. Etched glass self-assembles into micron-size hollow platonic solids

    Boukhalfa, Sofiane

    2012-10-03

    The interaction between the spreading of a hydrofluoric acid-based drop on a glass surface and its etching rate gives rise to hollow crystals of various shapes, including cubes, triangles, and icosahedra. These geometries are dependent on their position with respect to the contact line, where a rim forms by agglutination, similar to the formation of a coffee stain. Atomic force microscopy indentation and transmission electron microscopy observations revealed that these crystals are hollow ammonium-fluosilicate-based cryptohalite shells. © 2012 American Chemical Society.

  1. Effect of Etching Parameter on Pore Size and Porosity of Electrochemically Formed Nanoporous Silicon

    Pushpendra Kumar

    2007-01-01

    Full Text Available The most common fabrication technique of porous silicon (PS is electrochemical etching of a crystalline silicon wafer in a hydrofluoric (HF acid-based solution. The electrochemical process allows for precise control of the properties of PS such as thickness of the porous layer, porosity, and average pore diameter. The control of these properties of PS was shown to depend on the HF concentration in the used electrolyte, the applied current density, and the thickness of PS. The change in pore diameter, porosity, and specific surface area of PS was investigated by measuring nitrogen sorption isotherms.

  2. Comparison of the Schaake and Benson Etches to Delineate Dislocations in HgCdTe Layers

    Farrell, S.; Rao, Mulpuri V.; Brill, G.; Chen, Y.; Wijewarnasuriya, P.; Dhar, N.; Benson, J. D.; Harris, K.

    2013-11-01

    The morphology and classification of etch pits in molecular beam epitaxy-grown (211) HgCdTe/CdTe/Si layers were investigated using the Schaake and Benson etch pit density (EPD) etches. The two EPD etches were compared and shown to have a 1:1 correlation in the etch pits that were produced. Close examination of the shape of the etch pits via scanning electron microscopy shows that several distinguishable classifications of etch pits are revealed using both etches. Samples subjected to thermal cycle annealing (TCA) treatment show a nonuniform reduction in etch pit populations according to the classification defined in this study. In particular, a class of etch pits called "fish shaped" are completely absent after TCA and can account for up to one-third of the total reduction in EPD.

  3. Micro-textures and in situ sulfur isotopic analysis of spheroidal and zonal sulfides in the giant Jinding Zn-Pb deposit, Yunnan, China: Implications for biogenic processes

    Xue, Chunji; Chi, Guoxiang; Fayek, Mostafa

    2015-05-01

    The Jinding deposit in Yunnan, southwest China, is the largest sandstone- and conglomerate-hosted Zn-Pb deposit in the world. In this paper, we report various micro-textures of spheroidal and zonal sulfides, such as pellet-shaped and colloform aggregates of pyrite and sphalerite, from the deposit and interpret them to be possibly related to micro-colonies of sulfate reducing bacteria, probably supporting an in situ BSR hypothesis. Micro-scale sulfur isotope analysis in different parts of the spheroidal and zonal sulfide aggregates, using secondary ion mass spectrometry (SIMS), revealed δ34S (VCDT) values as low as -48.4‰ for sulfides formed in the early-main stage disseminated ores in the western part of the deposit, possibly suggesting maximum sulfur isotopic fractionation through BSR. Relatively elevated δ34S (VCDT) values (-7.7‰ to -34.8‰, mainly from -10‰ to -20‰) for the late-stage, cavity-filling ores in the eastern part of the deposit, are interpreted to be possibly related to elevated temperatures close to the hydrothermal conduit and elevated δ34S values of the remaining sulfates resulting from the preceding BSR processes. The apparent discrepancy between the low temperatures required for BSR and the high temperatures indicated by fluid inclusions (>120 °C) may be reconciled through invoking episodic influx of ore-forming hydrothermal fluids into a shallow, relatively cool environment. It is proposed that the host rocks of the Jinding deposit have not been buried to great depths (⩽1 km), which, combined with the availability of hydrocarbons in the Jinding dome (a paleo-oil and gas reservoir), provides an ideal environment for BSR. Episodic influx of metal-carrying hydrothermal fluids temporarily and locally suppressed BSR and promoted thermo-chemical sulfate reduction (TSR), resulting in deposit- and micro-scale variations of δ34S.

  4. Microleakage after Thermocycling of Three Self-Etch Adhesives under Resin-Modified Glass-Ionomer Cement Restorations

    Sabine O. Geerts

    2010-01-01

    Full Text Available This study was designed to evaluate microleakage that appeared on Resin-Modified Glass-Ionomer Cement (RMGIC restorations. Sixty class V cavities (h×w×l=2mm×2mm×3mm were cut on thirty extracted third molars, which were randomly allocated to three experimental groups. All the buccal cavities were pretreated with polyacrylic acid, whereas the lingual cavities were treated with three one-step Self-Etch adhesives, respectively, Xeno III (Dentsply Detrey GmbH, Konstanz, Germany, iBond exp (Heraeus Kulzer gmbH & Co. KG, Hanau, Germany, and Adper Prompt-L-Pop (3M ESPE AG, Dental products Seefeld, Germany. All cavities were completely filled with RMGIC, teeth were thermocycled for 800 cycles, and leakage was evaluated. Results were expressed as means ± standard deviations (SDs. Microleakage scores were analysed by means of generalized linear mixed models (GLMMs assuming an ordinal logistic link function. All results were considered to be significant at the 5% critical level (<.05. The results showed that bonding RMGIC to dentin with a Self-Etch adhesive rather than using polyacrylic acid did not influence microleakage scores (=.091, except for one tested Self-Etch adhesive, namely, Xeno III (<.0001. Nevertheless, our results did not show any significant difference between the three tested Self-Etch adhesive systems. In conclusion, the pretreatment of dentin with Self-Etch adhesive system, before RMGIC filling, seems to be an alternative to the conventional Dentin Conditioner for the clinicians as suggested by our results (thermocycling and others (microtensile tests.

  5. The influence of H2O2 concentration to the structure of silicon nanowire growth by metal-assisted chemical etching

    Omar, Hafsa; Jani, Abdul Mutalib Md.; Rusop, Mohamad; Abdullah, Saifollah

    2016-07-01

    A simple and low cost method to produce well aligned silicon nanowires at large areas using Ag-assisted chemical etching at room temperature were presented. The structure of silicon nanowires growth by metal-assisted chemical etching was observed. Prior to the etching, the silicon nanowires were prepared by electroless metal deposited (EMD) in solution containing hydrofluoric acid and hydrogen peroxide in Teflon vessel. The silver particle was deposited on substrate by immersion in hydrofluoric acid and silver nitrate solution for sixty second. The silicon nanowires were growth in different hydrogen peroxide concentration which are 0.3M, 0.4M, 0.5M and 0.6M and 0.7M.The influence of hydrogen peroxide concentration to the formation of silicon nanowires was studied. The morphological properties of silicon nanowires were investigated using field emission scanning electron microscopy (FESEM) and Energy Dispersive X-Ray Spectroscopy (EDS).

  6. Efficient visible luminescence of nanocrystalline silicon prepared from amorphous silicon films by thermal annealing and stain etching

    Nikulin Valery

    2011-01-01

    Full Text Available Abstract Films of nanocrystalline silicon (nc-Si were prepared from hydrogenated amorphous silicon (a-Si:H by using rapid thermal annealing. The formed nc-Si films were subjected to stain etching in hydrofluoric acid solutions in order to passivate surfaces of nc-Si. The optical reflectance spectroscopy revealed the nc-Si formation as well as the high optical quality of the formed films. The Raman scattering spectroscopy was used to estimate the mean size and volume fraction of nc-Si in the annealed films, which were about 4 to 8 nm and 44 to 90%, respectively, depending on the annealing regime. In contrast to as-deposited a-Si:H films, the nc-Si films after stain etching exhibited efficient photoluminescence in the spectral range of 600 to 950 nm at room temperature. The photoluminescence intensity and lifetimes of the stain etched nc-Si films were similar to those for conventional porous Si formed by electrochemical etching. The obtained results indicate new possibilities to prepare luminescent thin films for Si-based optoelectronics.

  7. Method for Fabricating Textured High-Haze ZnO:Al Transparent Conduction Oxide Films on Chemically Etched Glass Substrates.

    Park, Hyeongsik; Nam, Sang-Hun; Shin, Myunghun; Ju, Minkyu; Lee, Youn-Jung; Yu, Jung-Hoon; Jung, Junhee; Kim, Sunbo; Ahn, Shihyun; Boo, Jin-Hyo; Yi, Junsin

    2016-05-01

    We developed a technique for forming textured aluminum-doped zinc oxide (ZnO:Al) transparent conductive oxide (TCO) films on glass substrates, which were etched using a mixture of hydrofluoric (HF) and hydrochloric (HCl) acids. The etching depth and surface roughness increased with an increase in the HF content and the etching time. The HF-based residues produced insoluble hexafluorosilicate anion- and oxide impurity-based semipermeable films, which reduced the etching rate. Using a small amount of HCl dissolved the Ca compounds, helping to fragment the semipermeable film. This formed random, complex structures on the glass substrates. The angled deposition of three layers of ZnO:Al led to the synthesis of multiscaled ZnO:Al textures on the glass substrates. The proposed approach resulted in textured ZnO:Al TCO films that exhibited high transmittance (-80%) and high haze (> 40%) values over wavelengths of 400-1000 nm, as well as low sheet resistances (ZnO:Al textured TCO films exhibited photocurrents and cell efficiencies that were 40% higher than those of cells with conventional TCO films.

  8. Effects of etching time on the bottom surface morphology of ultrathin porous alumina membranes for use as masks

    Yang, Sun A.; Choi, Yong Chan; Bu, Sang Don

    2012-11-01

    We investigated the effect of etching time on the bottom surface morphologies of ultrathin porous alumina membranes (UT-PAMs) anodized in oxalic and phosphoric acid. The morphology of the bottom surface clearly changed and a unique surface undulation was observed during the etching process. Such an undulation regarding the bottom surface is attributed to the different etching rates between the dome-shaped barrier layer and the hexagonal cell walls. The results suggest that the bottom morphology of UT-PAMs formed after the barrier layer is opened significantly affects the contact area of the bottom side with the substrate. During the initial stage of the opening process for the barrier layer, the porous section will contact the substrate rather than the walls. However, as the etching time increases, the height of the porous section becomes considerably lower than that of the walls, which means that the walls will contact the substrate with a gap between the pores and the substrate. Based on our experimental results, we propose a possible schematic diagram describing the effects of UT-PAMs with differently-shaped bottom surfaces on the shapes of fabricated nanodots when the UT-PAMs are used as masks.

  9. Comparison of acidulated phosphate fluoride gel and hydrofluoric acid etchants for porcelain-composite repair.

    Tylka, D F; Stewart, G P

    1994-08-01

    Hydrofluoric acid etches porcelain to produce a porous surface visible under scanning electron microscopy when compared to an acidulated phosphate fluoride gel. Some investigators have suggested the greater porosity of the hydrofluoric acid etch produces a greater composite-to-porcelain bond. This investigation tested that assumption with two common fluoride etchants. The etched surfaces were first viewed under scanning electron microscopy to ensure that a characteristic etch was achieved. Both etchants yielded bond strengths that produced cohesive failure of all samples. This suggested that the intraoral use of hydrofluoric acid is no more effective than the less dangerous acidulated phosphate fluoride gel.

  10. A high efficiency industrial polysilicon solar cell with a honeycomb-like surface fabricated by wet etching using a photoresist mask

    Zhang, Hong; Ding, Bin; Chen, Tianhang

    2016-11-01

    In this paper, an effective and low cost method of texturization was introduced into the fabrication process for industrial multicrystalline silicon solar cell production. The purpose of the method was to reduce reflectance by creating a honeycomb-like textured surface using a masked wet etching process. A negative photoresist film was selected as an etching mask. Although large surface roughness of wafer was considered to affect the adhesion and acid resistance of etching mask, a honeycomb-like textured surface with a pitch of 18 μm was fabricated successfully. The etched pits had a nearly smooth spherical segment surface, an average aperture of 15.1 μm, and a depth of 6.5 μm. This regular textured surface had a low light reflectivity of approximately 20.5% and greatly increased the carrier lifetime. Compared with multicrystalline silicon solar cells textured by conventional acid etching, the average short circuit current increased by 2.2% and the average efficiency increased from 17.41% to 17.75%, a net gain of 0.34%. And a high throughput above 2400 pieces per hour was obtained. This texturing technique is expected to promote the application of diamond-wire cut multicrystalline silicon wafers with the low saw-damage in the future.

  11. Range and etching behaviour of swift heavy ions in polymers

    Singh, Lakhwant; Singh, Mohan; Samra, Kawaljeet Singh; Singh, Ravinder

    Aliphatic (CR-39) and aromatic (Lexan polycarbonate) polymers have been irradiated with a variety of heavy ions such as 58Ni, 93Nb, 132Xe, 139La, 197Au, 208Pb, 209Bi, and 238U having energy ranges of 5.60-8.00 MeV/n in order to study the range and etching kinetics of heavy ion tracksE The ion fluence (range ˜104-105 ions/cm2) was kept low to avoid the overlapping of etched tracks. The measured values of maximum etched track length were corrected due to bulk etching and over etching to obtain the actual range. The experimental results of range profiles were compared with those obtained by the most used procedures employed in obtaining range and stopping power. The range values of present ions have been computed using the semiempirical codes (SRIM-98, SRIM-2003.26, and LISE++:0-[Hub90]) in order to check their accuracy. The merits and demerits of the adopted formulations have been highlighted in the present work. It is observed that the range of heavy ions is greater in aromatic polymers (Lexan polycarbonate) as compared to the aliphatic polymers (CR-39) irradiated with similar ions having same incident energies. The SRIM-98 and SRIM2003.26 codes don't show any significant trend in deviations, however, LISE++:0-[Hub90] code provides overall good agreement with the experimental values. The ratio of track etch rate (along projectile trajectory) to the bulk etch rate has also been studied as a function of energy loss of heavy ions in these polymers.

  12. Chemical etching to dissolve dislocation cores in multicrystalline silicon

    Gregori, N.J. [Department of Materials, University of Oxford, 16 Parks Road, Oxford OX1 3PH (United Kingdom); Murphy, J.D., E-mail: john.murphy@materials.ox.ac.uk [Department of Materials, University of Oxford, 16 Parks Road, Oxford OX1 3PH (United Kingdom); Sykes, J.M.; Wilshaw, P.R. [Department of Materials, University of Oxford, 16 Parks Road, Oxford OX1 3PH (United Kingdom)

    2012-08-01

    Multicrystalline silicon wafers are used for approximately half of all solar cells produced at present. These wafers typically have dislocation densities of up to {approx}10{sup 6} cm{sup -2}. Dislocations and associated impurities act as strong recombination centres for electron-hole pairs and are one of the major limiting factors in multicrystalline silicon substrate performance. In this work we have explored the possibility of using chemical methods to etch out the cores of dislocations from mc-Si wafers. We aim to maximise the aspect ratio of the depth of the etched structure to its diameter. We first investigate the Secco etch (1K{sub 2}Cr{sub 2}O{sub 7} (0.15 M): 2HF (49%)) as a function of time and temperature. This etch removes material from dislocation cores much faster than grain boundaries or the bulk, and produces tubular holes at dislocations. Aspect ratios of up to {approx}7:1 are achieved for {approx}15 {mu}m deep tubes. The aspect ratio decreases with tube depth and for {approx}40 {mu}m deep tubes is just {approx}2:1, which is not suitable for use in bulk multicrystalline silicon photovoltaics. We have also investigated a range of etches based on weaker oxidising agents. An etch comprising 1I{sub 2} (0.01 M): 2HF (49%) attacked dislocation cores, but its etching behaviour was extremely slow (<0.1 {mu}m/h) and the pits produced had a low aspect ratio (<2:1).

  13. Anisotropic fluorocarbon plasma etching of silicon/silicon germanide heterostructures and plasma etching-induced sidewall damage

    Ding, Ruhang

    Plasma etching is a critical tool in the fabrication of Si/SiGe heterostructure quantum devices, but with challenges addressed herein, including (1) control of etch profiles and (2) damage to etched feature sidewalls that affects device performance. (1) Fluorocarbon-based plasma etching often results in device profiles with undercuts due to preferential etching of SiGe over silicon. A C4F8/N2/Ar etch plasma gas mixture introduced here has been successfully used to achieve straight sidewalls through heterostructure layers by formation of a fluorocarbon inhibitor film on feature sidewalls to prevent undercutting. (2) Chemical and structural changes in the semiconductor at feature sidewalls associated with plasma-surface interactions are considered damage, as they affect band structure and electrical conduction in the active region of the device, known as the 2-dimensional electron gas (2DEG). In experiments designed to better understand the mechanisms of plasma-induced sidewall damage, damage to straight wires was characterized both by the width of a non-conductive "sidewall depletion" region at the device sidewall, and by the noise level factor, gamma H/N, determined from spectra of low frequency noise. Observed increases in sidewall depletion width with increasing etch depth are tentatively attributed to the increase in total number of defects with increased plasma exposure time. Excess negative charge incorporated into the fluorocarbon inhibitor film could be another contributing factor. Other factors considered, including defects at the bottom of etched features as well as leakage current bypassing the wire, are ruled out as their contribution is expected to diminish as the distance between the 2DEG and feature bottom increases. The noise level factor, gammaH /N, shows a maximum with increasing etch depth, possibly the result of two competing effects: increasing ion dose and decreasing leakage current. The noise level shows a minimum at an ion bombardment energy

  14. Characterization of electric discharge machining, subsequent etching and shot-peening as a surface treatment for orthopedic implants

    Stráský, Josef, E-mail: josef.strasky@gmail.com [Charles University, Department of Physics of Materials (Czech Republic); Havlíková, Jana; Bačáková, Lucie [Institute of Physiology, Academy of Sciences of the Czech Republic (Czech Republic); Harcuba, Petr [Charles University, Department of Physics of Materials (Czech Republic); Mhaede, Mansour [Clausthal University of Technology, Institute of Materials Science and Engineering (Germany); Faculty of Engineering, Zagazig University (Egypt); Janeček, Miloš [Charles University, Department of Physics of Materials (Czech Republic)

    2013-09-15

    Presented work aims at multi-method characterization of combined surface treatment of Ti–6Al–4V alloy for biomedical use. Surface treatment consists of consequent use of electric discharge machining (EDM), acid etching and shot peening. Surface layers are analyzed employing scanning electron microscopy and energy dispersive X-ray spectroscopy. Acid etching by strong Kroll's reagent is capable of removing surface layer of transformed material created by EDM. Acid etching also creates partly nanostructured surface and significantly contributes to the enhanced proliferation of the bone cells. The cell growth could be positively affected by the superimposed bone-inspired structure of the surface with the morphological features in macro-, micro- and nano-range. Shot peening significantly improves poor fatigue performance after EDM. Final fatigue performance is comparable to benchmark electropolished material without any adverse surface effect. The proposed three-step surface treatment is a low-cost process capable of producing material that is applicable in orthopedics.

  15. Performance of a universal adhesive on etched and non-etched surfaces: Do the results match the expectations?

    Grégoire, Geneviève, E-mail: genevieve.gregoire@univ-tlse3.fr [Department of Biomaterials, Faculty of Odontology, University Toulouse III, 31062 Toulouse (France); Sharrock, Patrick, E-mail: patrick.sharrock@gmail.com [CNRS UMR 5302, University Toulouse III, Mines-Albi, 81013 Albi (France); Prigent, Yann, E-mail: prigent@chimie.ups-tlse.fr [Institut de Chimie de Toulouse (ICT) – FR 2599, Faculté des Sciences et de l' Ingénierie, University Toulouse III, 31062 Toulouse (France)

    2016-09-01

    A universal adhesive was applied to human dentin in both the etched and rinsed state and the normal non etched state, to compare the resulting properties and detect any significant differences. The study focused on observations of the hybrid layer by scanning electron microscopy and on fluid permeation measurements as a function of time. Spectroscopic characterizations included infrared and differential calorimetric curves of the samples. The results obtained show non-statistically significant fluid permeability between the two sample types. Both the etched and rinsed samples and the non-etched ones showed similar homogeneous hybrid layers that reduced the fluid flow, and corresponded to well spread polymer coatings. The infrared results illustrated the spectra obtained on going from the outside adhesive layer to the inside portion of the dentin-polymer interface and did not reveal any intermediate zone resembling demineralized collagen that would be water saturated and not infiltrated with adhesive. The Differential Scanning Calorimetry (DSC) curves corresponded to the curves obtained with ethanol wet bonding in that free water (melting at 0 °C) was removed by the universal adhesive, and that no collagen melting was observed for the non-etched samples. The Diffusion-Ordered Spectroscopy Nuclear Magnetic Resonance (DOSY NMR) spectrum of the virgin adhesive showed the presence of water and ethanol solvents and indicated that several monomer or prepolymer molecules were present with multiple acrylic functional groups with diffusion coefficients related to molecular weights. Overall, the results show that universal adhesive can be used in the milder self-etch mode and that more aggressive etch and rinse procedure can be reserved for the occasions with sclerotic dentin or enamel regions more difficult to treat.

  16. A novel restricted-flow etching method for glass

    Hai-bo XIE; Yi ZHENG; Yu-run FAN; Xin FU; Hua-yong YANG

    2009-01-01

    This paper presents a novel micro fabrication method based on the laminar characteristics of micro-scale flows. Therein the separator and etchant are alternatively arranged in micro channels to form multiple laminar streams, and the etchant is located at the site where the reaction is supposed to occur. This new micro fabrication process can be used for the high aspect ratio etching inside a microchannel on glass substrates. Furthermore, the topography of microstructure patterned by this method can be controlled by changing the flow parameters of the separator and etchant. Experiments on the effects of flow parameters on the aspect ratio, side wall profile and etching rate were carried out on a glass substrate. The effect of flow rates on the etching rate and the micro topography was analyzed, in addition, experiments with dynamical changes of the flow rate ratio of the separator and etchant showed that the verticality of the side walls of microstructures can be significantly improved. The restricted flowing etching technique not only abates the isotropic effect in the traditional wet etching but also significantly reduces the dependence on expensive photolithographic equipment.

  17. Singular Sheet Etching of Graphene with Oxygen Plasma

    Haider Al-Mumen; Fubo Rao; Wen Li; Lixin Dong

    2014-01-01

    This paper reports a simple and controllable post-synthesis method for engineering the number of graphene layers based on oxygen plasma etching. Singular sheet etching (SSE) of graphene was achieved with the optimum process duration of 38 seconds. As a demonstration of this SSE process, monolayer graphene films were produced from bilayer graphenes. Experimental investigations verified that the oxygen plasma etching removes a single layer graphene sheet in an anisotropic fashion rather than anisotropic mode. In addition, etching via the oxygen plasma at the ground electrodes introduced fewer defects to the bottom graphene layer compared with the conventional oxygen reactive ion etching using the powered electrodes. Such defects can further be reduced with an effective annealing treatment in an argon environment at 900-1000◦C. These results demonstrate that our developed SSE method has enabled a microelectronics manufacturing compatible way for single sheet precision subtraction of graphene layers and a potential technique for producing large size graphenes with high yield from multilayer graphite materials.

  18. Innovative, Inexpensive Etching Technique Developed for Polymer Electro- Optical Structures

    Nguyen, Hung D.

    1999-01-01

    Electro-optic, polymer-based integrated optic devices for high-speed communication and computing applications offer potentially significant advantages over conventional inorganic electro-optic crystals. One key area of integrated optical technology--primary processing and fabrication--may particularly benefit from the use of polymer materials. However, as efforts concentrate on the miniaturization of electro-integrated circuit pattern geometries, the ability to etch fine features and smoothly sloped sidewalls is essential to make polymers useful for electro-integrated circuit applications. There are many existing processes available to etch polymer materials, but they all yield nearly vertical sidewalls. Vertical sidewalls are too difficult to reliably cover with a metal layer, and incomplete metalization degrades microwave performance, particularly at high frequency. However, obtaining a very sloped sidewall greatly improves the deposition of metal on the sidewall, leading to low-loss characteristics, which are essential to integrating these devices in highspeed electro-optic modulators. The NASA Lewis Research Center has developed in-house an inexpensive etching technique that uses a photolithography method followed by a simple, wet chemical etching process to etch through polymer layers. In addition to being simpler and inexpensive, this process can be used to fabricate smoothly sloped sidewalls by using a commercial none rodible mask: Spin-On-Glass. A commercial transparent material, Spin-On-Glass, uses processes and equipment similar to that for photoresist techniques.

  19. Environmental photostability of SF6-etched silicon nanocrystals

    Liptak, R. W.; Yang, J.; Kramer, N. J.; Kortshagen, U.; Campbell, S. A.

    2012-10-01

    We report on the long-term environmental stability of the photoluminescent (PL) properties of silicon nanocrystals (SiNCs). We prepared sulfur hexafluoride (SF6) etched SiNCs in a two-stage plasma reactor and investigated their PL stability against UV irradiation in air. Unlike SiNCs with hydrogen-passivated surfaces, the SF6-etched SiNCs exhibit no photobleaching upon extended UV irradiation despite surface oxidation. Furthermore, the PL quantum yield also remains stable upon heating the SF6-etched SiNCs up to 160 °C. The observed thermal and UV stability of SF6-etched SiNCs combined with their PL quantum yields of up to ˜50% make them attractive candidates for UV downshifting to enhance the efficiency of solar cells. Electron paramagnetic spin resonance indicates that the SF6-etched SiNCs have a lowered density of defect states, both as-formed and after room temperature oxidation in air.

  20. Atomistic simulations of surface coverage effects in anisotropic wet chemical etching of crystalline silicon

    Gosalvez, M.A.; Foster, A.S.; Nieminen, R.M

    2002-12-30

    Atomistic simulations of anisotropic wet chemical etching of crystalline silicon have been performed in order to determine the dependence of the etch rates of different crystallographic orientations on surface coverage and clustering of OH radicals. We show that the etch rate is a non-monotonic function of OH coverage and that there always exists a coverage value at which the etch rate reaches a maximum. The dependence of the anisotropy of the etching process on coverage, including the dependence of the fastest-etched plane orientation, is implicitly contained in the model and predictions of convex corner under-etching structures are made. We show that the whole etching process is controlled by only a few surface configurations involving a particular type of next-nearest neighbours. The relative value of the removal probabilities of these confitions determines the balance in the occurrence of step propagation and etch pitting for all surface orientations.

  1. INFLUENCE OF FLAKE-LIKE GRAPHITE ON THE MICROTEXTURE OF MESOC ARBON MICROBEADS%鳞片石墨对中间相炭微球织构的影响(英文)

    李同起; 王成扬; 刘秀军; 郑嘉明; 王慧

    2002-01-01

    Mesocarbon microbeads (MCMBs) were prepared from a coaltar pitch without or with flake-like graphite at 410℃ for 7h. The a s-received MCMBs were named MCB1 and MCB2 respectively and the MCB2 was divided into MCB2L and MCB2S according to the size of the flakes of graphite added. The surface and cross-section of MCMBs were studied using SEM and the microtexture was analyzed by XRD. The surface of the MCMBs was rough with some particles att ached and the beads are almost round. The microtexture of MCB1 (without graphite) was mainly of the parallel layer type, whereas the microtexture of MCB2 (with graphite) was complex. The large flakes of graphite added in the coal tar pitch were regarded as the centers of nucleation of MCMBs, resulting in hamburger type MCMBs (MCB2L), but the small ones could not act in this way in the reaction sys tem, resulting in a distorted microtexture (MCB2S). It was proposed that when th e nucleation occurred the large graphite flakes accumulated to form seed crystal sin which the pitch components with low molecular weight were enwrapped and the shape and size of the flakes and their aggregations decided the microtexure of MCMBs, while the small graphite flakes served only to disorder the microtexture. The XRD spectra show that the addition of graphite decreased the graphitization degree and crystal sizes.%以煤焦油沥青为原料,鳞片石墨为添加剂,在410℃温度下反应7h制得了中间相炭微球(MCMBs).在扫描电子显微镜下对它们的表面和断面进行了分析,并用X射线衍射对其结构进行了研究.结果表明:MCMBs的表面被接近球形的小颗粒所覆盖而呈现出粗糙不平.MCB1(未加石墨)的织构主要是平行层型,而MCB2(加石墨)的织构却是复杂的.加入煤焦油沥青中的大片石墨存在于MCMBs的中心而被认为是它们的核,而小片石墨却不能象大片石墨那样在反应体系内充当核的作用.认为在成核过程中,大片石墨聚集到一起而形成

  2. Selective Plasma Etching of Polymeric Substrates for Advanced Applications

    Harinarayanan Puliyalil

    2016-06-01

    Full Text Available In today’s nanoworld, there is a strong need to manipulate and process materials on an atom-by-atom scale with new tools such as reactive plasma, which in some states enables high selectivity of interaction between plasma species and materials. These interactions first involve preferential interactions with precise bonds in materials and later cause etching. This typically occurs based on material stability, which leads to preferential etching of one material over other. This process is especially interesting for polymeric substrates with increasing complexity and a “zoo” of bonds, which are used in numerous applications. In this comprehensive summary, we encompass the complete selective etching of polymers and polymer matrix micro-/nanocomposites with plasma and unravel the mechanisms behind the scenes, which ultimately leads to the enhancement of surface properties and device performance.

  3. Surface Modification of Nitinol by Chemical and Electrochemical Etching

    Yang, Zhendi; Wei, Xiaojin; Cao, Peng; Gao, Wei

    2013-07-01

    In this paper, Nitinol, an equiatomic binary alloy of nickel and titanium, was surface modified for its potential biomedical applications by chemical and electrochemical etching. The main objective of the surface modification is to reduce the nickel content on the surface of Nitinol and simultaneously to a rough surface microstructure. As a result, better biocompatibility and better cell attachment would be achieved. The effect of the etching parameters was investigated, using scanning electron microscopy (SEM) equipped with energy dispersive X-ray spectrometry (EDX) and X-ray photoelectron spectrometry (XPS). The corrosion property of modified Nitinol surfaces was investigated by electrochemical work station. After etching, the Ni content in the surface layer has been reduced and the oxidation of Ti has been enhanced.

  4. Etched track radiometers in radon measurements: a review

    Nikolaev, V A

    1999-01-01

    Passive radon radiometers, based on alpha particle etched track detectors, are very attractive for the assessment of radon exposure. The present review considers various devices used for measurement of the volume activity of radon isotopes and their daughters and determination of equilibrium coefficients. Such devices can be classified into 8 groups: (i) open or 'bare' detectors, (ii) open chambers, (iii) sup 2 sup 2 sup 2 Rn chambers with an inlet filter, (iv) advanced sup 2 sup 2 sup 2 Rn radiometers, (v) multipurpose radiometers, (vi) radiometers based on a combination of etched track detectors and an electrostatic field, (vii) radiometers based on etched track detectors and activated charcoal and (viii) devices for the measurement of radon isotopes and/or radon daughters by means of track parameter measurements. Some of them such as the open detector and the chamber with an inlet filter have a variety of modifications and are applied widely both in geophysical research and radon dosimetric surveys. At the...

  5. Novel diamantane polymer platform for enhanced etch resistance

    Padmanaban, Munirathna; Chakrapani, Srinivasan; Lin, Guanyang; Kudo, Takanori; Parthasarathy, Deepa; Rahman, Dalil; Anyadiegwu, Clement; Antonio, Charito; Dammel, Ralph R.; Liu, Shenggao; Lam, Frederick; Waitz, Anthony; Yamagchi, Masao; Maehara, Takayuki

    2007-03-01

    The dominant current 193 nm photoresist platform is based on adamantane derivatives. This paper reports on the use of derivatives of diamantane, the next higher homolog of adamantane, in the diamondoid series, as monomers in photoresists. Due to their low Ohnishi number and incremental structural parameter (ISP), such molecules are expected to enhance dry etch stability when incorporated into polymers for resist applications. Starting from the diamantane parent, cleavable and non-cleavable acrylate/methacrylate derivatives of diamantane were obtained using similar chemical steps as for adamantane derivatization. This paper reports on the lithographic and etch performance obtained with a number of diamantane-containing monomers, such as 9-hydroxy-4-diamantyl methacrylate (HDiMA), 2-ethyl-2- diamantyl methacrylate (EDiMA), and 2-methyl-2-diamantyl methacrylate (MDiMA). The etch advantage, dry and wet lithographic performance of some of the polymers obtained from these diamantane-containing polymers are discussed.

  6. Profile etching for prefiguring X-ray mirrors.

    Liu, Chian; Qian, Jun; Assoufid, Lahsen

    2015-03-01

    A method to pre-shape mirror substrates through etching with a broad-beam ion source and a contoured mask is presented. A 100 mm-long elliptical cylinder substrate was obtained from a super-polished flat Si substrate with a 48 nm root-mean-square (r.m.s.) figure error and a 1.5 Å r.m.s. roughness after one profile-etching process at a beam voltage of 600 V without iteration. A follow-up profile coating can be used to achieve a final mirror. Profile etching and profile coating combined provide an economic way to make X-ray optics, such as nested Kirkpatrick-Baez mirrors.

  7. Effect of thermocycling on the durability of etch-and-rinse and self-etch adhesives on dentin.

    Sangwichit, Ketkamon; Kingkaew, Ruksaphon; Pongprueksa, Pong; Senawongse, Pisol

    2016-01-01

    The objective was to compare bond strengths of adhesives with/without thermocycling and to analyze the micromorphology of resindentin interfaces. Flat dentin surfaces were prepared and divided into eight groups to bond with four etch-and-rinse adhesives (Optibond FL, Adper Scotchbond Multi-Purpose, Optibond Solo Plus, and Single Bond 2) and four self-etch adhesives (Clearfil SE Bond, Adper SE Plus, Clearfil S(3) Bond and Adper Easy Bond). Specimens were further divided into two subgroups subjected for with/without thermocycling and then subjected to both micro-tensile test and resin-dentin interface evaluation. The results revealed that there were significant differences in bond strength between the groups with and without thermocycling for all etch-and-rinse groups and for the Adper Easy Bond self-etch group (pBond demonstrated highly durable bond strengths. Furthermore, more silver ion uptake was observed at the resin-dentin interfaces for all etch-and-rinse adhesives and Adper SE Plus and Adper Easy Bond after thermocycling.

  8. Release etch modeling analysis and the use of laser scanning microscopy for etch time prediction of micromachined structures

    Matamis, George; Gogoi, Bishnu P.; Monk, David J.; McNeil, Andrew; Burrows, Veronica A.

    2000-08-01

    An alternative non-destructive analysis method using laser scanning microscopy (LSM) was used to study etch release distances in MEMS pressure sensor. The LSM method eliminates samples preparation and is easy to implement in a MEMS manufacturing environment. In this study, various diaphragm structures were etched using a highly concentrated HF based solution. Experimental etch data were obtained for both SiO2 and PSG films under these various structures. Both the height and the width of the sacrificial layer port/channel had a significant effect on etch rate for both films. As expected, a non-linear etch rate was obtained for both SiO2 and PSG films. Since the HF concentration changes over time in a manufacturing bath process, careful selection of processing time is required in order to fully release MEMS structures. Future theoretical modeling with the assistance of experimental data obtained in this study is being pursued to strengthen past work done by Eaton et al, Monk et al, and Liu et al.

  9. Optimization of nanopores obtained by chemical etching on swift-ion irradiated lithium niobate

    Crespillo, M.L.; Otto, M.; Munoz-Martin, A. [Centro de Microanalisis de Materiales (CMAM), Universidad Autonoma de Madrid (UAM), Cantoblanco, E-28049 Madrid (Spain); Olivares, J. [Centro de Microanalisis de Materiales (CMAM), Universidad Autonoma de Madrid (UAM), Cantoblanco, E-28049 Madrid (Spain); Instituto de Optica, CSIC, C/Serrano 121, E-28006 Madrid (Spain)], E-mail: j.olivares@io.cfmac.csic.es; Agullo-Lopez, F. [Centro de Microanalisis de Materiales (CMAM), Universidad Autonoma de Madrid (UAM), Cantoblanco, E-28049 Madrid (Spain); Departamento de Fisica de Materiales, Universidad Autonoma de Madrid (UAM) Cantoblanco, 28049 Madrid (Spain); Seibt, M. [IV. Physikalisches Institut, Universitaet Goettingen, Institut fuer Halbleiterphysik, Tammannstr. 1, D-37077 Goettingen (Germany); Toulemonde, M. [Centre Interdisciplinaire de Recherche Ions-Lasers, UMR 11 CEA-CNRS, 14040 Caen Cedex (France); Trautmann, C. [Gesellschaft fuer Schwerionenforschung (GSI), Materialforschung, Planckstrasse 1, 64291 Darmstadt (Germany)

    2009-03-15

    The morphology of the nanopores obtained by chemical etching on ion-beam irradiated LiNbO{sub 3} has been investigated for a variety of ions (F, Br, Kr, Cu, Pb), energies (up to 2300 MeV), and stopping powers (up to 35 keV/nm) in the electronic energy loss regime. The role of etching time and etching agent on the pore morphology, diameter, depth, and shape has also been studied. The transversal and depth profiles of the pore have been found to be quite sensitive to both irradiation and etching parameters. Moreover, two etching regimes with different morphologies and etching rates have been identified.

  10. [Study on retention of veneering materials to the facing crown made of hard-type resin. Application etching to Ni-Cr alloys].

    Ichikawa, M

    1989-01-01

    In order to enhance adhesiveness between the resin and the metal in the facing crown made of hard-type resin, the bead application method has been widely utilized. A short-coming of this method is that the metal part of the facing must be made thicker for bead application. If, however, a retention is made beneath the surface of the metal part, the facing metal can be made thinner. The author studied the adhesiveness of metal to resin by producing pitting corrosion on the surface of four different kinds of Ni-Cr alloys, etching the surface with strong acid under various conditions, and compared the adhesiveness and failure conditions with those of the beaded specimens. The results were as follows: 1) The degree of corrosion of the surface of specimens was positively correlated with the duration of etching. However, the degree of corrosion differed depending on the kinds of etching solutions and specimen alloys. 2) In terms of adhesiveness, some of the etching groups were stronger than the beaded groups and some were weaker, depending on the kinds of alloys and etching conditions. 3) Condition of failure at the joint surface: in the beaded groups cohesive failure was the most prevalent type. In the etching groups, compound failure was the most prevalent. There was a positive correlation between adhesive strength and the amount of residual resin: the more residual resin, the greater the adhesive strength. 1) Electron microscopic observations: on the surface of specimens of the etching groups pitted roughness was observed, and the resin material was tightly attached to the metal surface. However, reciprocal diffusion of the elements from both materials was not indicated, nor was there any evidence of chemical bonding.

  11. Channeling and diffusion in dry-etch damage

    Rahman, M.

    1997-09-01

    At present channeling is accepted to be the primary mechanism causing defects deep within dry-etched material, with diffusion possibly modifying the final defect distribution. In this article detailed analytic expressions are presented incorporating both these mechanisms. The dominant parameter affecting damage depth is found to be the mean channeling length. We show how enhanced diffusion, e.g., by illumination, may increase the observed damage. We also study the effect of damage on depletion depths and suggest how the channeling length may be inferred from the etch-depth dependence of conductance or Raman spectroscopy measurements.

  12. Study of reactive ion etching for reverse tone nanoimprint process

    Tsuji, Y; Yanagisawa, M; Yoshinaga, H; Hiratsuka, K, E-mail: tsuji-yukihiro@sei.co.j [Fiber-optics Core Devices R and D Department, Transmission Devices R and D Laboratories, Sumitomo Electric Industries, LTD. 1, Taya-cho, Sakae-ku, Yokohama, Kanagawa, 244-8588 (Japan)

    2009-11-15

    We have used reverse nanoimprint for fabricating diffraction gratings of distributed feedback laser diodes. Generation of residues in the etching process of resin is a serious issue leading to poor line edge roughness of the grating patterns. We have found that the residues are composed of oxide products from Si-containing resin. We have successfully suppressed the generation of the residues by optimizing oxygen partial pressure of reactive ion etching (RIE). We have also succeeded in effectively removing the residues by utilizing sputtering effect of RIE.

  13. Study on fast neutron dosimetry using electrochemical etching

    Lin, J.T. (National Tsing-Hua Univ., Hsin-Chu, Taiwan); Su, S.J.

    1981-03-01

    Registration of fast-neutron-induced-recoil tracks by electrochemical etching technique as applied to polycarbonate foils has provided a simple, sensitive, and inexpensive means of fast neutron personnel dosimetry. Etching parameters are carefully discussed and it was discovered a new method of stirring in KOH aqueous solution offered considerable improvement over previous procedures. Applied frequency can be decreased from 2kHz to regular 60Hz. The sensitivity of fast neutrons is 0.12-0.18 tracks/cm/sup 2/ per mrem with standard deviation of +/- 20.2%.

  14. Synthesis and chemical etching of Te/C nanocables

    Guang Sheng Cao; Yong Gang Liu; Wen Wu Yang; Chang Tan; Hui Li; Xiao Juan Zhang

    2011-10-01

    In this paper, Te/C nanocables were fabricated by a hydrothermal method in the presence of cetyltrimethylammonium bromide (CTAB). The products were characterized in detail by multiform techniques: transmission electron microscopy, X-ray diffraction, energy-dispersive X-ray analysis and Fourier transform infrared (FTIR) spectroscopy. The results showed that the products were nanocables with lengths of several microns, core about 20 nm in diameter, and a surrounding sheath of about 60–80 nm in thickness. Te/C nanocables were tailored freely by chemical etching. Carbonaceous nanotubes and Te/C nanocables with fragmentary Te core were obtained by adjusting time of chemical etching.

  15. Improvement of Porous GaAs (100 Structure through Electrochemical Etching Based on DMF Solution

    Muhamad Ikram Md Taib

    2014-01-01

    Full Text Available We report on the fabrication of porous GaAs (100 using three different acids, H2SO4, HF, and HCl, diluted in DMF based solutions. The mixture of H2SO4 with DMF showed the best porous structures in comparison to other acids. The concentration of the DMF solution was then varied for a fixed concentration of H2SO4. It was apparent that the different concentration of the DMF solvent gave different types of morphology of the porous GaAs. Furthermore, a higher current density improved the uniformity of the pores distribution. The best porous GaAs exhibited well-defined circular shaped pores with high uniformity. To the best of our knowledge, such structure produced in such manner has never been reported so far. Finally, the optimum etching conditions of the pores were proposed.

  16. A tobacco etch virus protease with increased substrate tolerance at the P1' position.

    Renicke, Christian; Spadaccini, Roberta; Taxis, Christof

    2013-01-01

    Site-specific proteases are important tools for in vitro and in vivo cleavage of proteins. They are widely used for diverse applications, like protein purification, assessment of protein-protein interactions or regulation of protein localization, abundance or activity. Here, we report the development of a procedure to select protease variants with altered specificity based on the well-established Saccharomyces cerevisiae adenine auxotrophy-dependent red/white colony assay. We applied this method on the tobacco etch virus (TEV) protease to obtain a protease variant with altered substrate specificity at the P1' Position. In vivo experiments with tester substrates showed that the mutated TEV protease still efficiently recognizes the sequence ENLYFQ, but has almost lost all bias for the amino acid at the P1' Position. Thus, we generated a site-specific protease for synthetic approaches requiring in vivo generation of proteins or peptides with a specific N-terminal amino acid.

  17. The study of FTO surface texturing fabrication using Argon plasma etching technique for DSSC applications

    Jayanti, Lindha; Kusumandari; Sujitno, Tjipto; Suryana, Risa

    2016-02-01

    This paper is aimed to investigate the fabrication of the fluorine-doped tin oxide (FTO) texturing by using Argon (Ar) plasma etching. The pressure and temperature of Ar gas during plasma etching were 1.6 mbar and 240-285oC, respectively. The plasma etching time was varied from 3 and 10 min. We also prepared without etching samples as reference. UV-Vis spectrophotometer showed that the transmittances of etching samples are higher than the without etching samples. The root mean square roughness (Rq) of etching samples are lower than the without etching samples. It is considered that the Ar ions bombardment can modify the FTO surfaces. However, the etching time does not significantly affect the FTO surfaces for 3 min and 10 min. The Rq of the without etching sample, the etching sample for 3 min, and the etching sample for 10 min are 11.697 nm, 9.859 nm, and 9.777 nm, respectively. These results are good agreement with the four point probe measurement that indicated that the sheet resistance (RS) for each the without sample, the etching sample for 3 min, and the etching sample for 10 min are 16.817 Ωsq, 16.067 Ω/sq, and 15.990 Ω/sq. In addition, the optical transmittance of the etching sample for 3 min and the etching sample for 10 min at wavelengths of 350 - 850 nm are almost similar. This is evidence that the etching time below 10 min cannot significantly change the morphology, optical and electrical properties.

  18. Realization of Ultraflat Plastic Film Using Dressed-Photon-Phonon-Assisted Selective Etching of Nanoscale Structures

    Takashi Yatsui

    2015-01-01

    Full Text Available We compared dressed-photon-phonon (DPP etching to conventional photochemical etching and, using a numerical analysis of topographic images of the resultant etched polymethyl methacrylate (PMMA substrate, we determined that the DPP etching resulted in the selective etching of smaller scale structures in comparison with the conventional photochemical etching. We investigated the wavelength dependence of the PMMA substrate etching using an O2 gas. As the dissociation energy of O2 is 5.12 eV, we applied a continuous-wave (CW He-Cd laser (λ= 325 nm, 3.81 eV for the DPP etching and a 5th-harmonic Nd:YAG laser (λ= 213 nm, 5.82 eV for the conventional photochemical etching. From the obtained atomic force microscope images, we confirmed a reduction in surface roughness, Ra, in both cases. However, based on calculations involving the standard deviation of the height difference function, we confirmed that the conventional photochemical etching method etched the larger scale structures only, while the DPP etching process selectively etched the smaller scale features.

  19. Cradle-to-gate life cycle assessment of the dry etching step in the manufacturing of photovoltaic cells

    Otto Andersen

    2014-11-01

    Full Text Available A new photovoltaic silicon crystalline solar cell dry chemical etching process (DCEP is developed. It is an alternative to the current State-of-the-Art (SoA wet chemical etching process (WCEP, associated with relatively large environmental loadings in the form of high water consumption and emissions of greenhouse gases with high Global Warming Potential (GWP. In order to compare the environmental impacts of DCEP to the corresponding impacts from WCEP, a comparative attributional life cycle assessment (LCA is conducted. From the LCA it can be concluded that the DCEP will lead to 86% reduction in water consumption compared to WCEP (acidic, and 89% reduction compared to WCEP (alkaline. The emissions of greenhouse gases, as expressed by the GWP100 indicator of the etching step, are also reduced with 63% and 20% respectively, when compared with current SoA acidic and alkaline WCEP. The toxicity impacts are also assessed to be lower for the DCEP compared to WCEP technologies, although the uncertainty is relatively high for the applied toxicity indicators. All in all, DCEP can reduce the CO2eq emissions of solar photovoltaic systems production by 5-10%.

  20. Effect of Saliva Contamination on Shear Bond Strength of Orthodontic Brackets When Using a Self-Etch Primer

    MAO Jing; QI Juan

    2005-01-01

    The effect of saliva contamination on the shear bond strength of orthodontic brackets, at various stages of the bonding procedure using a new self-etch primer was studied. The samples were divided into 4 groups according to 4 different enamel surface conditions: Group A: dry; Group B: saliva contamination before priming; Group C: saliva contamination after priming, and Group D: saliva contamination before and after priming. Stainless steel brackets were bonded in each test group with a light-cured composite resin (TransbondXT 3M). The shear bond strength was determined in the first 30 min after bonding. The analysis of variance indicated that the shear bond strengths of the 4 groups were significantly different (F= 11.89, P<0.05). Tukey HSD tests indicated that contamination both before and after the application of the acid-etch primer resulted in a significantly lower (=4.6± 1.7 MPa) shear bond strength than either the control group (= 8.8±1.9 MPa) or the groups where contamination occurred either before ( = 7.9± 2.0 MPa) or after (=6.9±1.5 MPa) the application of the primer. It was concluded that the new acid-etch primer could maintain adequate shear bond strength if contamination occurred either before or after the application of the primer. On the other hand, contamination both before and after the application of the primer could significantly reduce the shear bond strength of orthodontic brackets.

  1. Functionalized Nanoporous Track-Etched b-PVDF Membrane Electrodes for Heavy Metal Determination by Square-Wave Anodic Stripping Voltammetry

    Bessbousse H.

    2013-04-01

    Full Text Available Track-etched functionalized nanoporous β-PVDF membrane electrodes, or functionalized membrane electrodes (FMEs, are electrodes made from track-etched, poly(acrylic acid (PAA functionalized nanoporous β-poly(vinylidene fluoride (β-PVDF membranes with thin porous Au films sputtered on each side as electrodes. To form the β-PVDF nanoporous membranes, β-PVDF films are irradiated by swift heavy ions. After irradiation, radical tracks are stable in the membranes. Chemical etching removes some of the radical tracks revealing nanopores. Radicals, remaining in the pores, initiate radio grafting of PAA from the pore walls of the nanoporous β-PVDF. PAA is a cation exchange polymer that adsorbs metal ions, such as Pb2+, from aqueous solutions thus concentrating the ions into the membrane. After a calibrated time the FME is transferred to an electrochemical cell for square-wave anodic stripping voltammetry analysis.

  2. Cross-Sectional Conductive Atomic Force Microscopy of CdTe/CdS Solar Cells: Effects of Etching and Back-Contact Processes; Preprint

    Moutinho, H. R.; Dhere, R. G.; Jiang, C.-S.; Gessert, T. A.; Duda, A. M.; Young, M.; Metzger, W. K.; Li, X.; Al-Jassim, M. M.

    2006-05-01

    We investigated the effects of the etching processes using bromine and nitric-phosphoric acid solutions, as well as of Cu, in the bulk electrical conductivity of CdTe/CdS solar cells using conductive atomic force microscopy (C-AFM). Although the etching process can create a conductive layer on the surface of the CdTe, the layer is very shallow. In contrast, the addition of a thin layer of Cu to the surface creates a conductive layer inside the CdTe that is not uniform in depth, is concentrated at grains boundaries, and may short circuit the device if the CdTe is too thin. The etching process facilitates the Cu diffusion and results in thicker conductive layers. The existence of this inhomogeneous conductive layer directly affects the current transport and is probably the reason for needing thick CdTe in these devices.

  3. Aspects of native oxides etching on n-GaSb(1 0 0) surface

    Cotirlan, C., E-mail: cotirlan@infim.ro; Ghita, R.V.; Negrila, C.C.; Logofatu, C.; Frumosu, F.; Lungu, G.A.

    2016-02-15

    Graphical abstract: - Highlights: • A technology for GaSb surface cleaning is proposed. • The technology combines ion sputtering, chemical etching, annealing for oxide removal. • The ARXPS studies on GaSb surfaces are presented in a detailed manner. • The surface stoichiometry is restored after recommended technology for contacting. - Abstract: Gallium antimonide (GaSb) is the basis of the most photovoltaic and thermophotovoltaic (TPV) systems and its innovative technological aspects based on modern ultra-high vacuum techniques are in trend for device achievement. The real surface of GaSb is modified by technological processes that can conduce to problems related to the reproducible control of its surface properties. The GaSb surface is reactive in atmosphere due to oxygen presence and exhibits a native oxide layer. The evolution of native oxides during the ion sputtering, chemical etching and thermal annealing processes for preparing the surface is presented in detailed way. Ratios of surface constituents are obtained by Angle Resolved X-ray Photoelectron Spectroscopy (ARXPS). Moreover, Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDS), Atomic Force Microscopy (AFM) and Low-Energy Electron Diffraction (LEED) are used for characterization. The surface stoichiometry is changed using a specific etchant (e.g. citric acid) at different etching time and is analyzed by ARXPS, SEM, EDS and AFM methods. The experimental results provide useful information regarding surface native oxides characteristics on n-GaSb(1 0 0) to be taken into account for development of low resistance contacts for TPV devices based on GaSb alloy.

  4. Effect of Etching Time and Preparation on Push-Out Bond Strength of Composite to Intracanal Dentin of Primary Anterior Teeth

    Mosharrafian, Shahram; Afshar, Hossein; Farbod, Maryam; Baniameri, Zahra

    2016-01-01

    Objectives: This in-vitro study aimed to compare the push-out bond strength of composite to prepared and unprepared intracanal dentin using a 5th generation bonding agent in primary anterior teeth after etching for seven and 15 seconds. Materials and Methods: Sixty primary anterior teeth were randomly divided into four groups. In groups one and two, intracanal dentin remained intact while in groups three and four it was prepared using a #5 round bur and low-speed handpiece. Single Bond 2 was used in groups one and three after 15 seconds and in groups two and four after seven seconds of etching with phosphoric acid. After restoring with composite resin and incubation, the specimens were subjected to push-out bond strength test. Data were analyzed using two-way ANOVA and Kaplan Meier curves. Results: The mean bond strength was not significantly different between seven and 15 seconds etching times (P=0.198). Dentin preparation had no significant effect on the mean bond strength (P=0.838). The interaction effect of etching time and dentin preparation was not significant either (P=0.680). Conclusions: Decreasing the etching time from 15 to seven seconds and preparation of intracanal dentin had no significant effect on push-out bond strength of composite to intracanal dentin of primary anterior teeth. PMID:28127329

  5. A Comparative Evaluation of the Efficacy of Etching by the Total Etch and Self-etch Dentin Bonding Systems in the Primary Teeth: An in vitro Study

    Chaugule, Vishwas; Katge, Farhin; Poojari, Manohar; Pujari, Prashant; Pammi, Thejokrishna

    2015-01-01

    ABSTRACT Objective: Early childhood caries is now affecting the children in dangerous proportions. There is a wide spread loss of the tooth material irrespective of the type of the carious lesion. Restoration of such lesions with a strong permanent bond between the dental tissues and the restorative dental materials would be a highly desirable requisite. Ultramorphological characterizations show that the interfacial morphology and the chemical characterization of the bonding systems appear to be strongly associated with each other and, therefore, observing and understanding the interfacial phenomenon and its quality would be of great importance in the selection of a dental adhesive for its use in pediatric restorative dentistry. Study design: Human primary molars, which were indicated for extraction, for an array of reasons like caries, normal exfoliation, pathological root resorption, over-retained and serial extraction, were collected for the study purpose. Total number of teeth was then equally distributed into two subgroups, each namely A1 (Prime and Bond NT) and A2 (Xeno III). Results: The type of etching pattern that was observed in group A1 (Prime and Bond NT) of Silverstone’s type II compared to the Silverstone’s type III observed in group A2 (Xeno III). Conclusion: Results of this study indicate that the use of an etchant separately followed by the application of the bonding system–Prime and Bond NT–would provide a better quality of adhesion thus improving the quality and longevity of the restoration done within the limits of enamel in primary dentition. How to cite this article: Mithiborwala SH, Chaugule V, Katge F, Poojari M, Pujari P, Pammi T. A Comparative Evaluation of the Efficacy of Etching by the Total Etch and Self-etch Dentin Bonding Systems in the Primary Teeth: An in vitro Study. Int J Clin Pediatr Dent 2015;8(1):30-36. PMID:26124578

  6. Reduction of Residual Stresses in Sapphire Cover Glass Induced by Mechanical Polishing and Laser Chamfering Through Etching

    Shih-Jeh Wu

    2016-10-01

    Full Text Available Sapphire is a hard and anti-scratch material commonly used as cover glass of mobile devices such as watches and mobile phones. A mechanical polishing using diamond slurry is usually necessary to create mirror surface. Additional chamfering at the edge is sometimes needed by mechanical grinding. These processes induce residual stresses and the mechanical strength of the sapphire work piece is impaired. In this study wet etching by phosphate acid process is applied to relief the induced stress in a 1” diameter sapphire cover glass. The sapphire is polished before the edge is chamfered by a picosecond laser. Residual stresses are measured by laser curvature method at different stages of machining. The results show that the wet etching process effectively relief the stress and the laser machining does not incur serious residual stress.

  7. Influence of the anodic etching current density on the morphology of the porous SiC layer

    Anh Tuan Cao

    2014-03-01

    Full Text Available In this report, we fabricated a porous layer in amorphous SiC thin films by using constant-current anodic etching in an electrolyte of aqueous diluted hydrofluoric acid. The morphology of the porous amorphous SiC layer changed as the anodic current density changed: At low current density, the porous layer had a low pore density and consisted of small pores that branched downward. At moderate current density, the pore size and depth increased, and the pores grew perpendicular to the surface, creating a columnar pore structure. At high current density, the porous structure remained perpendicular, the pore size increased, and the pore depth decreased. We explained the changes in pore size and depth at high current density by the growth of a silicon oxide layer during etching at the tips of the pores.

  8. Growth, etching, and stability of sputtered ZnO:Al for thin-film silicon solar cells

    Owen, Jorj Ian

    2011-07-01

    Aluminum-doped zinc oxide (ZnO:Al) can fulfill many requirements in thin-film solar cells, acting as (1) a transparent contact through which the incident light is transmitted, (2) part of the back reflector, and (3) a source of light scattering. Magnetron sputtered ZnO:Al thin-films are highly transparent, conductive, and are typically texturized by post-deposition etching in a dilute hydrochloric acid (HCl) solution to achieve light scattering. The ZnO:Al thin-film electronic and optical properties, as well as the surface texture after etching, depend on the deposition conditions and the post-deposition treatments. Despite having been used in thin-film solar cells for more than a decade, many aspects regarding the growth, effects of heat treatments, environmental stability, and etching of sputtered ZnO:Al are not fully understood. This work endeavors to further the understanding of ZnO:Al for the purpose improving silicon thin-film solar cell efficiency and reducing ZnO:Al production costs. With regard to the growth of ZnO:Al, the influence of various deposition conditions on the resultant electrical and structural properties and their evolution with film thickness were studied. The surface electrical properties extracted from a multilayer model show that while carrier concentration of the surface layer saturates already at film thickness of 100 nm, the surface mobility continues to increases with film thickness, and it is concluded that electronic transport across grain boundaries limits mobility in ZnO:Al thin films. ZnO:Al deposited onto a previously etched ZnO:Al surface grows epitaxially, preserving both the original orientation and grain structure. Further, it is determined that a typical ZnO:Al used in thin-film silicon solar cells grows Zn-terminated on glass substrates. Concerning the affects of heat treatments and stability, it is demonstrated that a layer of amorphous silicon can protect ZnO:Al from degradation during annealing, and the mobility of Zn

  9. Deep and vertical silicon bulk micromachining using metal assisted chemical etching

    Zahedinejad, Mohammad; Delaram Farimani, Saeed; Khaje, Mahdi; Mehrara, Hamed; Erfanian, Alireza; Zeinali, Firooz

    2013-05-01

    In this paper, a newfound and simple silicon bulk micromachining process based on metal-assisted chemical etching (MaCE) is proposed which opens a whole new field of research in MEMS technology. This method is anisotropic and by controlling the etching parameters, deep vertical etching, relative to substrate surface, can be achieved in micrometer size for oriented Si wafer. By utilizing gold as a catalyst and a photoresist layer as the single mask layer for etching, 60 µm deep gyroscope micromachined structures have been fabricated for 2 µm features. The results indicate that MaCE could be the only wet etching method comparable to conventional dry etching recipes in terms of achievable etch rate, aspect ratio, verticality and side wall roughness. It also does not need a vacuum chamber and the other costly instruments associated with dry etching techniques.

  10. Correlation between the cytotoxicity of self-etching resin cements and the degree of conversion

    Luís FSA Morgan

    2015-01-01

    Conclusion: These results indicate that photopolymerization of dual cure self-etching resin cements decrease toxic effects on cell culture. Adequate photopolymerization should be considered during cementation when using dual polymerization self-etching resin cements.

  11. Shear Bond Strength of Saliva Contaminated and Re-etched All-in-One Adhesive to Enamel

    M. Khoroushi

    2008-12-01

    Full Text Available Objective: The aim of this study was to investigate the effect of phosphoric acid re-etching of an enamel surface treated via a one-bottle adhesive system on shear bond strength between resin composite and the enamelsurface in different stages of adhesive application.Materials and Methods: Extracted intact premolars (n=84 were divided into sevengroups (n=12. In the control group 1, the adhesive i-Bond was used according to the manufacturer's instructions, with nocontamination. In groups 2 to 4, the conditioned and saliva, contaminated enamel was blot dried only, rinsed,and blot dried, rinsed blot dried and re-etched, respectively. In groups 5, 6and 7 cured adhesive was contaminated with saliva and then rinsed and blot-dried, blot dried only and rinsed, blot-dried and re-etched respectively. In groups 3, 4, 6 and 7 the adhesive was reapplied. Afterward, Z100 compos-ite cylinders were bonded to the enamel surfaces. The samples were thermocycled (5°C and 55°C, 30 s, dwelling time: 10 s, 500 cycles. Finally, the samples were sheared using Dartec testing machine and shear bond strength data were subjected to one-way ANOVA analysis and Tukey's HSD test.Results: There were statistically significant differences among groups 1 and 5-7. The samples in groups 1 and 4 demonstrated higher bond strengths than those in the other groups.Conclusion: Using phosphoric acid etching may be effective, only where contamination occurs prior to curing of the adhesive. After curing of the adhesive, none of the methods in this study would be preferred.

  12. Electron microscopy analysis of structural changes within white etching areas

    Diederichs, Annika Martina; Schwedt, A.; Mayer, J.

    2016-01-01

    In the present work, crack networks with white etching areas (WEAs) in cross-sections of bearings were investigated by a complementary use of SEM and TEM with the focus on the use of orientation contrast imaging and electron backscatter diffraction (EBSD). Orientation contrast imaging was used...

  13. Alcatel Vacuum Technology A Recognized Leader in Deep Plasma Etching

    阿尔卡特真空技术(上海)有限公司

    2005-01-01

    @@ Its first equipment based on a Alcatel patented Inductive Coupled Plasma (ICP) source, with independent source power and substrate bias control for deep etching of silicon was launched in 1993. The exponential growth potential of the MEMS (Micro Electro Mechanical Systems) industry gave birth to the Micro Machining Systems business group (MMS) in 1994.

  14. Surface characterization after subaperture reactive ion beam etching

    Miessler, Andre; Arnold, Thomas; Rauschenbach, Bernd [Leibniz-Institut fuer Oberflaechenmodifizierung (IOM), Leipzig (Germany)

    2010-07-01

    In usual ion beam etching processes using inert gas (Ar, Xe, Kr..) the material removal is determined by physical sputtering effects on the surface. The admixture of suitable gases (CF{sub 4}+O{sub 2}) into the glow discharge of the ion beam source leads to the generation of reactive particles, which are accelerated towards the substrate where they enhance the sputtering process by formation of volatile chemical reaction products. During the last two decades research in Reactive Ion Beam Etching (RIBE) has been done using a broad beam ion source which allows the treatment of smaller samples (diameter sample < diameter beam). Our goal was to apply a sub-aperture Kaufman-type ion source in combination with an applicative movement of the sample with respect to the source, which enables us to etch areas larger than the typical lateral dimensions of the ion beam. Concerning this matter, the etching behavior in the beam periphery plays a decisive role and has to be investigated. We use interferometry to characterize the final surface topography and XPS measurements to analyze the chemical composition of the samples after RIBE.

  15. Cryo-Etched Black Silicon for Use as Optical Black

    Yee, Karl Y.; White, Victor E.; Mouroulis, Pantazis; Eastwood, Michael L.

    2011-01-01

    Stray light reflected from the surface of imaging spectrometer components in particular, the spectrometer slit degrade the image quality. A technique has been developed for rapid, uniform, and cost-effective black silicon formation based on inductively coupled plasma (ICP) etching at cryogenic temperatures. Recent measurements show less than 1-percent total reflectance from 350 2,500 nm of doped black silicon formed in this way, making it an excellent option for texturing of component surfaces for reduction of stray light. Oxygen combines with SF6 + Si etch byproducts to form a passivation layer atop the Si when the etch is performed at cryogenic temperatures. Excess flow of oxygen results in micromasking and the formation of black silicon. The process is repeatable and reliable, and provides control over etch depth and sidewall profile. Density of the needles can be controlled to some extent. Regions to be textured can be patterned lithographically. Adhesion is not an issue as the nanotips are part of the underlying substrate. This is in contrast to surface growth/deposition techniques such as carbon nanotubes (CNTs). The black Si surface is compatible with wet processing, including processing with solvents, the textured surface is completely inorganic, and it does not outgas. In radiometry applications, optical absorbers are often constructed using gold black or CNTs. This black silicon technology is an improvement for these types of applications.

  16. Plasma Etching for Failure Analysis of Integrated Circuit Packages

    Tang, J.; Schelen, J.B.J.; Beenakker, C.I.M.

    2011-01-01

    Plastic integrated circuit packages with copper wire bonds are decapsulated by a Microwave Induced Plasma system. Improvements on microwave coupling of the system are achieved by frequency tuning and antenna modification. Plasmas with a mixture of O2 and CF4 showed a high etching rate around 2 mm3/m

  17. Non-Lithographic Silicon Micromachining Using Inkjet and Chemical Etching

    Sasha Hoshian

    2016-12-01

    Full Text Available We introduce a non-lithographical and vacuum-free method to pattern silicon. The method combines inkjet printing and metal assisted chemical etching (MaCE; we call this method “INKMAC”. A commercial silver ink is printed on top of a silicon surface to create the catalytic patterns for MaCE. The MaCE process leaves behind a set of silicon nanowires in the shape of the inkjet printed micrometer scale pattern. We further show how a potassium hydroxide (KOH wet etching process can be used to rapidly etch away the nanowires, producing fully opened cavities and channels in the shape of the original printed pattern. We show how the printed lines (width 50–100 µm can be etched into functional silicon microfluidic channels with different depths (10–40 µm with aspect ratios close to one. We also used individual droplets (minimum diameter 30 µm to produce cavities with a depth of 60 µm and an aspect ratio of two. Further, we discuss using the structured silicon substrate as a template for polymer replication to produce superhydrophobic surfaces.

  18. Sacrificial wafer bonding for planarization after very deep etching

    Spiering, Vincent L.; Berenschot, J.W.; Elwenspoek, Miko; Fluitman, Jan H.J

    1995-01-01

    A new technique is presented that provides planarization after a very deep etching step in silicon. This offers the possibility for resist spinning and layer patterning as well as realization of bridges or cantilevers across deep holes or grooves. The sacrificial wafer bonding technique contains a w

  19. Plasma-etched nanostructures for optical applications (Presentation Recording)

    Schulz, Ulrike; Rickelt, Friedrich; Munzert, Peter; Kaiser, Norbert

    2015-08-01

    A basic requirement for many optical applications is the reduction of Fresnel-reflections. Besides of interference coatings, nanostructures with sub-wavelength size as known from the eye of the night-flying moth can provide antireflective (AR) properties. The basic principle is to mix a material with air on a sub-wavelength scale to decrease the effective refractive index. To realize AR nanostructures on polymers, the self-organized formation of stochastically arranged antireflective structures using a low-pressure plasma etching process was studied. An advanced procedure involves the use of additional deposition of a thin oxide layer prior etching. A broad range of different structure morphologies exhibiting antireflective properties can be generated on almost all types of polymeric materials. For applications on glass, organic films are used as a transfer medium. Organic layers as thin film materials were evaluated to identify compounds suitable for forming nanostructures by plasma etching. The vapor deposition and etching of organic layers on glass offers a new possibility to achieve antireflective properties in a broad spectral range and for a wide range of light incidence.

  20. Roughness kinetic and multiaffinity of anisotropic etched silicon

    Hosseinabadi, S.; Rajabi, M.

    2017-02-01

    The effect of etching time (20-200 min) on surface roughness, statistical and fractal properties of silicon wafers during anisotropic chemical etching by KOH is investigated experimentally and theoretically. The evolution of surface morphology of silicon wafers during an anisotropic chemical etching is investigated by using field emission scanning electron microscopy (FESEM), atomic force microscopy (AFM) and statistical methods. FESEM investigation shows the formation of pyramid like silicon micro structures that disappear in large time scales. The surface roughness increases and decreases periodically in time with a decreasing exponentially trend. The statistical analysis were performed by calculating the roughness and correlation length, distribution of height fluctuations and two-dimensional multifractal detrending moving average (MFDMA). The fractal nature of silicon wafer changes from mono fractal to multi fractal scaling by etching process and formation of pyramid like silicon nanostructures on it. The strength of multi-fractallity has not an increasing monotonic behavior. The enhancement of irregularities could be a reason for reduction of surface roughness and structure downfall.

  1. Actin-myosin interactions visualized by the quick-freeze, deep-etch replica technique.

    Heuser, J E; Cooke, R

    1983-09-05

    A new method of preparing biological samples for electron microscopy has been used to re-examine the structure of actin filaments, actin filaments decorated by myosin subfragment-1 (S1), and insect flight muscles. Samples were quick-frozen by contact with a block of copper cooled to approximately 4 K; then were freeze-fractured, deep-etched, rotary-replicated with platinum, and viewed in a transmission electron microscope. By this approach, actin filaments display prominent transverse bands whose repeat (approximately 5.5 nm) and pitch (approximately 15 to 20 degrees) fit with the expected left-handed "genetic" helix. Freeze-etched actin filaments do not, however, display the usual two-start helix as prominently as is seen after negative staining, and they also appear substantially thicker than after negative staining (9 to 10 nm versus 8 nm). The latter two-start helix appears very clearly after S1 decoration. Nevertheless, freeze-etched acto-S1 does not display the "arrowheads" that are seen after negative staining. Instead it displays the outer envelope of the helically deployed S1, and as would be expected from current models derived from optical reconstruction of negatively stained samples, this surface view looks only slightly polarized. Finally, the quick-freeze, deep-etch approach provides particularly distinct images of the crossbridges in insect flight muscles. These are plentiful and regularly arranged in rigor muscles, but rare in muscles relaxed with ATP before freezing. In rigor muscles fixed with aldehydes, these crossbridges assume a broad distribution of inclination, ranging from 45 degrees to 90 degrees with a mean of approximately 80 degrees, which is less tilt than has been seen before in thin-sectioned muscles. However, when aldehyde fixation is followed by exposure to tannic acid with or without uranyl acetate block-staining, crossbridges assume a more acute angle with respect to the fiber axis, centering around 45 degrees. This is associated

  2. Surface changes of biopolymers PHB and PLLA induced by Ar+ plasma treatment and wet etching

    Slepičková Kasálková, N.; Slepička, P.; Sajdl, P.; Švorčík, V.

    2014-08-01

    Polymers, especially group of biopolymers find potential application in a wide range of disciplines due to their biodegradability. In biomedical applications these materials can be used as a scaffold or matrix. In this work, the influence of the Ar+ plasma treatment and subsequent wet etching (acetone/water) on the surface properties of polymers were studied. Two biopolymers - polyhydroxybutyrate with 8% polyhydroxyvalerate (PHB) and poly-L-lactic acid (PLLA) were used in these experiments. Modified surface layers were analyzed by different methods. Surface wettability was characterized by determination of water contact angle. Changes in elemental composition of modified surfaces were performed by X-ray Photoelectron Spectroscopy (XPS). Surface morphology and roughness was examined using Atomic Force Microscopy (AFM). Gravimetry method was used to study the mass loss. It was found that the modification from both with plasma and wet etching leads to dramatic changes of surface properties (surface chemistry, morphology and roughness). Rate of changes of these features strongly depends on the modification parameters.

  3. Scalable shape-controlled fabrication of curved microstructures using a femtosecond laser wet-etching process

    Bian, Hao; Yang, Qing; Chen, Feng, E-mail: chenfeng@mail.xjtu.edu.cn; Liu, Hewei; Du, Guangqing; Deng, Zefang; Si, Jinhai; Yun, Feng; Hou, Xun

    2013-07-01

    Materials with curvilinear surface microstructures are highly desirable for micro-optical and biomedical devices. However, realization of such devices efficiently remains technically challenging. This paper demonstrates a facile and flexible method to fabricate curvilinear microstructures with controllable shapes and dimensions. The method composes of femtosecond laser exposures and chemical etching process with the hydrofluoric acid solutions. By fixed-point and step-in laser irradiations followed by the chemical treatments, concave microstructures with different profiles such as spherical, conical, bell-like and parabola were fabricated on silica glasses. The convex structures were replicated on polymers by the casting replication process. In this work, we used this technique to fabricate high-quality microlens arrays and high-aspect-ratio microwells which can be used in 3D cell culture. This approach offers several advantages such as high-efficient, scalable shape-controllable and easy manipulations. - Highlights: • We demonstrate a flexible method to fabricate curvilinear microstructures. • This method composes of femtosecond laser exposures and chemical etching process. • Concave microstructures with different profiles were fabricated on silica glasses. • High-quality microlens arrays and high-aspect-ratio microwells were fabricated.

  4. Influence of photoresist feature geometry on ECR plasma-etched HgCdTe trenches

    Benson, J. David; Stoltz, Andrew J., Jr.; Kaleczyc, Andrew W.; Martinka, Mike; Almeida, Leo A.; Boyd, Phillip R.; Dinan, John H.

    2002-12-01

    Factors that affect width and aspect ratio in electron cyclotron resonance (ECR) etched HgCdTe trenches are investigated. The ECR etch bias and anisotropy are determined by photoresist feature erosion rate. The physical characteristics of the trenches are attributed to ECR plasma etch chemistry.

  5. Experimental investigation of photoresist etching by kHz AC atmospheric pressure plasma jet

    Wang, Lijun; Zheng, Yashuang; Wu, Chen; Jia, Shenli

    2016-11-01

    In this study, the mechanism of the photoresist (PR) etching by means of a kHz AC atmospheric pressure plasma jet (APPJ) is investigated. The scanning electron (SEM) and the polarizing microscope are used to perform the surface analysis, and the mechanical profilometry is applied to diagnose the etch rate. The results show that granulated structure with numerous microparticles appears at the substrate surface after APPJ treatment, and the etch rate in the etch center is the fastest and gradually slows down to the edge of etch region. In addition, the pin-ring electrode APPJ has the highest etch rate at but easy to damage the Si wafer, the double-ring APPJ is the most stable but requires long time to achieve the ideal etch result, and the etch rate and the etch result of the multi-electrode APPJ fall in between. Ar APPJ had much higher PR etch rate and more irregular etch trace than He APPJ. It is speculated that Ar APPJ is more energetic and effective in transferring reactive species to the PR surface. It is also observed that the effective etch area initially increases and then decreases as plasma jet outlet to the PR surface distance increases.

  6. Bouncing transitions on microtextured materials

    Reyssat, M.; Pépin, A.; Marty, F.; Chen, Y.; Quéré, D.

    2006-04-01

    A drop of water thrown on a super-hydrophobic solid will often bounce off. Here we discuss the conditions to be fulfilled on the surface design (which provides super-hydrophobicity) to observe such a behavior. This allows us to precise how a material can be made water-repellent. We show in particular how the reduction of the scale of the microstructure provides a robust water repellency, and describe some peculiarities of violent shocks on such surfaces.

  7. Inductive couple plasma reactive ion etching characteristics of TiO{sub 2} thin films

    Garay, Adrian Adalberto; Hwang, Su Min; Chung, Chee Won, E-mail: cwchung@inha.ac.kr

    2015-07-31

    Changes in the inductively coupled plasma reactive ion etching characteristics of TiO{sub 2} thin films in response to the addition of HBr, Cl{sub 2} and C{sub 2}F{sub 6} to Ar gas were investigated. As the HBr, Cl{sub 2} and C{sub 2}F{sub 6} concentration increased, the etch rate increased; however, the etch profile degree of anisotropy followed a different trend. As HBr concentration increased, the greatest anisotropic etch profile was obtained at 100% HBr, while the greatest anisotropic etch profile was obtained at concentrations of 25% when etching was conducted under C{sub 2}F{sub 6} and Cl{sub 2}. Field emission scanning electron microscopy revealed that 25% C{sub 2}F{sub 6} generated the greatest vertical etch profile; hence, etch parameters were varied at this concentration. The effects of rf power, dc-bias voltage and gas pressure on the etch rate and etch profile were also investigated. The etch rate and degree of anisotropy in the etch profile increased with increasing rf power and dc-bias voltage and decreasing gas pressure. X-ray photoelectron spectroscopy analysis of the films etched under a C{sub 2}F{sub 6}/Ar gas mixture revealed the existence of etch byproducts containing F (i.e. TiF{sub x}) over the film. C{sub x}F{sub y} compounds were not detected on the film surface, probably due to contamination with atmospheric carbon. - Highlights: • Reactive ion etching of TiO{sub 2} films under HBr, C{sub 2}F{sub 6}, and Cl{sub 2} gases was studied. • Etch rate and etch profile of TiO{sub 2} films were investigated under each gas chemistry. • The highest degree of anisotropy was achieved at 25% C{sub 2}F{sub 6}/Ar. • Strong etch conditions at 25% C{sub 2}F{sub 6}/Ar increased etch rate and degree of anisotropy. • X-ray photoelectron spectroscopy revealed the existence of F-containing etch residues.

  8. Plasma etching of cavities into diamond anvils for experiments at high pressures and high temperatures

    Weir, S.T.; Cynn, H.; Falabella, S.; Evans, W.J.; Aracne-Ruddle, C.; Farber, D.; Vohra, Y.K. (LLNL); (UAB)

    2012-10-23

    We describe a method for precisely etching small cavities into the culets of diamond anvils for the purpose of providing thermal insulation for samples in experiments at high pressures and high temperatures. The cavities were fabricated using highly directional oxygen plasma to reactively etch into the diamond surface. The lateral extent of the etch was precisely controlled to micron accuracy by etching the diamond through a lithographically fabricated tungsten mask. The performance of the etched cavities in high-temperature experiments in which the samples were either laser heated or electrically heated is discussed.

  9. Simultaneous strain and temperature measurement with enhanced intrinsic sensitivity using etched polymer fibre Bragg gratings

    Bhowmik, Kishore; Peng, Gang-Ding; Luo, Yanhua; Ambikairajah, Eliathamby; Rajan, Ginu

    2015-09-01

    A PMMA based single-mode polymer optical fibre is etched to different diameter and it is observed that etching can lead to change in the material properties of the fibre such as Young's modulus and thermal expansion coefficient. This can play a vital role in improving the intrinsic sensing capabilities based on etched polymer optical fibre. Thus, exploiting the different strain and temperature sensitivities exhibited by the etched and un-etched polymer FBGs and by using an FBG array, strain and temperature can be measured simultaneously and also with very high sensitivity.

  10. Effect of temperature and silicon resistivity on the elaboration of silicon nanowires by electroless etching

    Fellahi, Ouarda, E-mail: fellahi_warda@yahoo.fr [Silicon Technology Development Unit, 02 Bd Frantz Fanon, BP 140 Alger-7 Merveilles, Algiers (Algeria); Hadjersi, Toufik [Silicon Technology Development Unit, 02 Bd Frantz Fanon, BP 140 Alger-7 Merveilles, Algiers (Algeria); Maamache, Mustapha [Laboratoire de Physique Quantique et Systemes Dynamiques, Universite Ferhat Abbas de Setif (Algeria); Bouanik, Sihem; Manseri, Amar [Silicon Technology Development Unit, 02 Bd Frantz Fanon, BP 140 Alger-7 Merveilles, Algiers (Algeria)

    2010-11-01

    The morphology of silicon nanowire (SiNW) layers formed by Ag-assisted electroless etching in HF/H{sub 2}O{sub 2} solution was studied. Prior to the etching, the Ag nanoparticles were deposited on p-type Si(1 0 0) wafers by electroless metal deposition (EMD) in HF/AgNO{sub 3} solution at room temperature. The effect of etching temperature and silicon resistivity on the formation process of nanowires was studied. The secondary ion mass spectra (SIMS) technique is used to study the penetration of silver in the etched layers. The morphology of etched layers was investigated by scanning electron microscope (SEM).

  11. Influence of etching parameters on optoelectronic properties of c-Si/porous silicon heterojunction - application to solar cells

    Bechiri, Fatiha; Zerdali, Mokhtar; Rahmoun, Ilham; Hamzaoui, Saad; Adnane, Mohamed; Sahraoui, Taoufik

    2013-03-01

    Thin layers of nanoporous silicon PS were synthesized by anodic etching, in order to develop photovoltaic cells. We proposed a diluted concentration of hydrofluoric acid with different etching current densities (1, 3, 5 mA/cm2) on a fairly short time anodization. Observations by scanning electron microscope, electrical measurements and optical measurements revealed that the structural properties of PS layers depended on strong conditions of prints. The reverse and forward component of the I-V characteristics showed an appropriate method to explore and extract the parameters of the diode ideality factor n. The optimum conditions of formation of PS were: HF concentration of 1% and an etching current density of mA/cm2. Unlike silicon, which has a low absorption of short visible wavelengths, it was shown that the PS had wide energy gap of ≈ 2 eV, and a marked improvement in the absorption between 400 and 600 nm. This property has been used to optimize the response of the solar cell Ni/PS/c-Si. Efficiency performance close to 4.2% was obtained with a Voc of 400 mV, and fill factor of 46%. The solar cell exhibited better response than the reference cell Ni/c-Si. These results show that PS/c-Si heterojunction has a potential for photovoltaic applications.

  12. Effect of dimethyl sulfoxide on bond durability of fiber posts cemented with etch-and-rinse adhesives

    Shafiei, Fereshteh; Sarafraz, Zahra

    2016-01-01

    PURPOSE This study was undertaken to investigate whether use of an adhesive penetration enhancer, dimethyl sulfoxide (DMSO), improves bond stability of fiber posts to root dentin using two two-step etch-and-rinse resin cements. MATERIALS AND METHODS Forty human maxillary central incisor roots were randomly divided into 4 groups after endodontic treatment and post space preparation, based on the fiber post/cement used with and without DMSO pretreatment. Acid-etched root dentin was treated with 5% DMSO aqueous solution for 60 seconds or with distilled water (control) prior to the application of Excite DSC/Variolink II or One-Step Plus/Duo-link for post cementation. After micro-slicing the bonded root dentin, push-out bond strength (P-OBS) test was performed immediately or after 1-year of water storage in each group. Data were analyzed using three-way ANOVA and Student's t-test (α=.05). RESULTS A significant effect of time, DMSO treatment, and treatment × time interaction were observed (P.05). CONCLUSION DMSO-wet bonding might be a beneficial method in preserving the stability of resin-dentin bond strength over time when fiber post is cemented with the tested etch-and-rinse adhesive cements. PMID:27555893

  13. Large area fabrication of vertical silicon nanowire arrays by silver-assisted single-step chemical etching and their formation kinetics

    Srivastava, Sanjay K.; Kumar, Dinesh; Schmitt, S. W.; Sood, K. N.; Christiansen, S. H.; Singh, P. K.

    2014-05-01

    Vertically aligned silicon nanowire (SiNW) arrays have been fabricated over a large area using a silver-assisted single-step electroless wet chemical etching (EWCE) method, which involves the etching of silicon wafers in aqueous hydrofluoric acid (HF) and silver nitrate (AgNO3) solution. A comprehensive systematic investigation on the influence of different parameters, such as the etching time (up to 15 h), solution temperature (10-80 °C), AgNO3 (5-200 mM) and HF (2-22 M) concentrations, and properties of the multi-crystalline silicon (mc-Si) wafers, is presented to establish a relationship of these parameters with the SiNW morphology. A linear dependence of the NW length on the etch time is obtained even at higher temperature (10-50 °C). The activation energy for the formation of SiNWs on Si(100) has been found to be equal to ˜0.51 eV . It has been shown for the first time that the surface area of the Si wafer exposed to the etching solution is an important parameter in determining the etching kinetics in the single-step process. Our results establish that single-step EWCE offers a wide range of parameters by means of which high quality vertical SiNWs can be produced in a very simple and controlled manner. A mechanism for explaining the influence of various parameters on the evolution of the NW structure is discussed. Furthermore, the SiNW arrays have extremely low reflectance (as low as <3% for Si(100) NWs and <12% for mc-Si NWs) compared to ˜35% for the polished surface in the 350-1000 nm wavelength range. The remarkably low reflection surface of SiNW arrays has great potential for use as an effective light absorber material in novel photovoltaic architectures, and other optoelectronic and photonic devices.

  14. High density plasma reactive ion etching of Ru thin films using non-corrosive gas mixture

    Hwang, Su Min; Garay, Adrian Adalberto; Lee, Wan In; Chung, Chee Won, E-mail: cwchung@inha.ac.kr

    2015-07-31

    Inductively coupled plasma reactive ion etching (ICPRIE) of Ru thin films patterned with TiN hard masks was investigated using a CH{sub 3}OH/Ar gas mixture. As the CH{sub 3}OH concentration in CH{sub 3}OH/Ar increased, the etch rates of Ru thin films and TiN hard masks decreased. However, the etch selectivity of Ru films on TiN hard masks increased and the etch slope of Ru film improved at 25% CH{sub 3}OH/Ar. With increasing ICP radiofrequency power and direct current bias voltage and decreasing process pressure, the etch rates of Ru films increased, and the etch profiles were enhanced without redeposition on the sidewall. Optical emission spectroscopy and X-ray photoelectron spectroscopy were employed to analyze the plasma and surface chemistry. Based on these results, Ru thin films were oxidized to RuO{sub 2} and RuO{sub 3} compounds that were removed by sputtering of ions and the etching of Ru thin films followed a physical sputtering with the assistance of chemical reaction. - Highlights: • Etching of Ru films in CH{sub 3}OH/Ar was investigated. • High selectivity and etch profile with high degree of anisotropy were obtained. • XPS analysis was examined to identify the etch chemistry. • During etching Ru was oxidized to RuO{sub 2} and RuO{sub 3} can be easily sputtered off.

  15. Origins of etch pits in β-Ga2O3(010) single crystals

    Hanada, Kenji; Moribayashi, Tomoya; Koshi, Kimiyoshi; Sasaki, Kohei; Kuramata, Akito; Ueda, Osamu; Kasu, Makoto

    2016-12-01

    Etch pits of various shapes were observed on etched β-Ga2O3(010) single crystals and classified into types A-F according to shape. Type-A etch pits changed in shape in the order of types B, C, and D by etching. Groove-shaped pits observed on as-grown β-Ga2O3(010) single crystal surfaces [K. Hanada et al., Jpn. J. Appl. Phys. 55, 030303 (2016)] were classified into type G. Type-G pits, which were determined to be void defects because of three-dimentional spaces in single crystals, existed before etching and changed to type A after etching. Therefore, after etching, void defects must change in shape as follows: Type G → A → B → C → D. The exposed facets change with etching time. Types-E and -F etch pits were observed to be parallelograms and hexagons, respectively. Types-E and -F etch pits must include dislocations along the [010] direction because they did not change in shape after etching.

  16. Development of deep silicon plasma etching for 3D integration technology

    Golishnikov А. А.

    2014-02-01

    Full Text Available Plasma etch process for thought-silicon via (TSV formation is one of the most important technological operations in the field of metal connections creation between stacked circuits in 3D assemble technology. TSV formation strongly depends on parameters such as Si-wafer thickness, aspect ratio, type of metallization material, etc. The authors investigate deep silicon plasma etch process for formation of TSV with controllable profile. The influence of process parameters on plasma etch rate, silicon etch selectivity to photoresist and the structure profile are researched in this paper. Technology with etch and passivation steps alternation was used as a method of deep silicon plasma etching. Experimental tool «Platrane-100» with high-density plasma reactor based on high-frequency ion source with transformer coupled plasma was used for deep silicon plasma etching. As actuation gases for deep silicon etching were chosen the following gases: SF6 was used for the etch stage and CHF3 was applied on the polymerization stage. As a result of research, the deep plasma etch process has been developed with the following parameters: silicon etch rate 6 µm/min, selectivity to photoresist 60 and structure profile 90±2°. This process provides formation of TSV 370 µm deep and about 120 µm in diameter.

  17. A new etch-aware after development inspection (ADI) technique for OPC modeling

    Xue, Jing; Huang, Jason; Kazarian, Aram; Falch, Brad

    2010-04-01

    This paper presents a new etch-aware after development inspection (ADI) model with an inverse etch bias filter. We model the etch bias as a function of pattern geometry parameters, and we introduce it to the ADI model by means of an inverse bias matrix that works in conjunction with an ADI specification related matrix. The inverse bias filter tunes the ADI model to be highly correlated to the etch effects and provides simplified and designable inputs to the after etch inspection (AEI) model and hence improves its performance over the staged modeling flow. In addition, the inverse bias filter creates a model based rule table for design retargeting. Some of the etch effects are corrected by the inverse bias filter as the lithography model is calibrated, thus speeding up and simplifying the etch AEI model, while maintaining lithography ADI model with a good accuracy.

  18. EUV stochastic noise analysis and LCDU mitigation by etching on dense contact-hole array patterns

    Kim, Seo Min; Koo, Sunyoung; Park, Jun-Taek; Lim, Chang-Moon; Kim, Myoungsoo; Ahn, Chang-Nam; Fumar-Pici, Anita; Chen, Alek C.

    2014-04-01

    Experimental local CD uniformity (LCDU) of the dense contact-hole (CH) array pattern is statistically decomposed into stochastic noise, mask component, and metrology factor. Each component are compared quantitatively, and traced after etching to find how much improvement can be achieved by smoothing. Etch CDU gain factor is defined as the differential of etch CD by resist CD, and used to estimate etch CDU on resist CDU. Stochastic noise has influenced on not only LCDU but also local placement error (LPE) of each contact-hole. This LPE is also decomposed into its constituents in the same statistical way. As a result, stochastic noise is found to be the most dominant factor on LCDU and LPE. Etch LCDU is well expected by Etch Gain factor, but LPE seems to be kept same after etching. Fingerprints are derived from the repeating component and the boundary size for excluding proximity effect in analysis is investigated.

  19. Nanoporous SiO2 thin films made by atomic layer deposition and atomic etching

    Ghazaryan, Lilit; Kley, E.-Bernhard; Tünnermann, Andreas; Szeghalmi, Adriana

    2016-06-01

    A new route to prepare nanoporous SiO2 films by mixing atomic-layer-deposited alumina and silica in an Å-scale is presented. The selective removal of Al2O3 from the composites using wet chemical etching with phosphoric acid resulted in nanoporous thin SiO2 layers. A diffusion-controlled dissolution mechanism is identified whereby an interesting reorganization of the residual SiO2 is observed. The atomic scale oxide mixing is decisive in attaining and tailoring the film porosity. The porosity and the refractive index of nanoporous silica films were tailored from 9% to 69% and from 1.40 to 1.13, respectively. The nanoporous silica was successfully employed as antireflection coatings and as diffusion membranes to encapsulate nanostructures.

  20. Preparation of Electrode Array by Electrochemical Etching Based on FEM

    Minghuan WANG; Di ZHU; Lei WANG

    2008-01-01

    Process technology of multiple cylindrical micro-pins by wire-electrical discharge machining (wire-EDM) and electrochemical etching was presented.A row of rectangular micro-columns were machined by wire-EDM and then machined into cylindrical shape by electrochemical etching.However,the shape of the multiple electrodes and the consistent sizes of the electrodes row are not easy to be controlled.In the electrochemical process,the shape of the cathode electrode determines the current density distribution on the anode and so the forming of multiple electrodes.This paper proposes a finite element method (FEM) to accurately optimize the electrode profile.The microelectrodes row with uniformity diameters with size from hundreds micrometers to several decades could be fabricated,and mathematical model controlling the shape and diameter of multiple microelectrodes was provided.Furthermore,a good agreement between experimental and theoretical results was confirmed.

  1. Selective laser etching or ablation for fabrication of devices

    Buttner, Ulrich

    2017-01-12

    Methods of fabricating devices vial selective laser etching are provided. The methods can include selective laser etching of a portion of a metal layer, e.g. using a laser light source having a wavelength of 1,000 nm to 1,500 nm. The methods can be used to fabricate a variety of features, including an electrode, an interconnect, a channel, a reservoir, a contact hole, a trench, a pad, or a combination thereof. A variety of devices fabricated according to the methods are also provided. In some aspects, capacitive humidity sensors are provided that can be fabricated according to the provided methods. The capacitive humidity sensors can be fabricated with intricate electrodes, e.g. having a fractal pattern such as a Peano curve, a Hilbert curve, a Moore curve, or a combination thereof.

  2. Analysis of etching at a solid-solid interface

    Alves, Washington S.; Rodrigues, Evandro A.; Fernandes, Henrique A.; Mello, Bernardo A.; Oliveira, Fernando A.; Costa, Ismael V. L.

    2016-10-01

    We present a method to derive an analytical expression for the roughness of an eroded surface whose dynamics are ruled by cellular automaton. Starting from the automaton, we obtain the time evolution of the height average and height variance (roughness). We apply this method to the etching model in 1 +1 dimensions, and then we obtain the roughness exponent. Using this in conjunction with the Galilean invariance we obtain the other exponents, which perfectly match the numerical results obtained from simulations. These exponents are exact, and they are the same as those exhibited by the Kardar-Parisi-Zhang (KPZ) model for this dimension. Therefore, our results provide proof for the conjecture that the etching and KPZ models belong to the same universality class. Moreover, the method is general, and it can be applied to other cellular automata models.

  3. Tobacco Etch Virus protease: A shortcut across biotechnologies.

    Cesaratto, Francesca; Burrone, Oscar R; Petris, Gianluca

    2016-08-10

    About thirty years ago, studies on the RNA genome of Tobacco Etch Virus revealed the presence of an efficient and specific protease, called Tobacco Etch Virus protease (TEVp), that was part of the Nuclear Inclusion a (NIa) enzyme. TEVp is an efficient and specific protease of 27kDa that has become a valuable biotechnological tool. Nowadays TEVp is a unique endopeptidase largely exploited in biotechnology from industrial applications to in vitro and in vivo cellular studies. A number of TEVp mutants with different rate of cleavage, stability and specificity have been reported. Similarly, a panel of different target cleavage sites, derived from the canonical ENLYFQ-G/S site, has been established. In this review we describe these aspects of TEVp and some of its multiple applications. A particular focus is on the use and molecular biology of TEVp in living cells and organisms.

  4. Continuous flow ink etching for direct micropattern of silicon dioxide

    Xing, Jiyao; Rong, Weibin; Wang, Lefeng; Sun, Lining

    2016-07-01

    A continuous flow ink etching (CFIE) method is presented to directly create micropatterns on a 60 nm thick silicon dioxide (SiO2) layer. This technique employs a micropipette filled with potassium bifluoride (KHF2) aqueous solution to localize SiO2 dissolution in the vicinity of the micropipette tip. Both dot and line features with well-defined edges were fabricated and used as hardmasks for silicon etching. The linear density of etchant ink deposited on the SiO2 can be used to regulate the depth, width and 2D morphology of the line pattern. The characterization of CFIE including the resolution (about 4 μm), reproducibility and capability to form complex structures are reported. This technique provides a simple and flexible alternative to generate the SiO2 hardmask for silicon microstructure fabrication.

  5. Etch rate modeling for ion-irradiated nitrocellulose

    Merhari, L.; Belorgeot, C.; Moliton, J.P. (Laboratoire d' electronique des Polymeres sous Faisceaux Ioniques, 123, Avenue Albert Thomas, 87060 Limoges Cedex (France))

    1990-12-24

    The self-developing mechanism of nitrocellulose when used as an ion beam resist is described by a model predicting the evolution of the etch rate versus irradiation time. Fundamentals of the model based on ion energy deposition dependent ablative development along with related mathematical derivations are given and briefly discussed. Comparison between theoretical results and experimental data available for protons at 20 keV and Ne{sup +}, Ar{sup +}, Kr{sup +} ions at 150 keV is made and shows a good agreement. This result clearly does not conflict with our assumption that the nitrocellulose etch rate is dependent on the total ion deposited energy no matter how the energy is deposited.

  6. Random and Uniform Reactive Ion Etching Texturing of Si

    Zaidi, S.H.

    1999-04-01

    The performance of a solar cell is critically dependent on absorption of incident photons and their conversion into electrical current. This report describes research efforts that have been directed toward the use of nanoscale surface texturing techniques to enhance light absorption in Si. This effort has been divided into two approaches. The first is to use plasma-etching to produce random texturization on multicrystalline Si cells for terrestrial use, since multicrystalline Si cannot be economically textured in any other way. The second approach is to use interference lithography and plasma-etching to produce gettering structures on Si cells for use in space, so that long-wavelength light can be absorbed close to the junction and make the cells more resistant to cosmic radiation damage.

  7. Microelectrode array fabrication by electrical discharge machining and chemical etching.

    Fofonoff, Timothy A; Martel, Sylvain M; Hatsopoulos, Nicholas G; Donoghue, John P; Hunter, Ian W

    2004-06-01

    Wire electrical discharge machining (EDM), with a complementary chemical etching process, is explored and assessed as a method for developing microelectrode array assemblies for intracortically recording brain activity. Assembly processes based on these methods are highlighted, and results showing neural activity successfully recorded from the brain of a mouse using an EDM-based device are presented. Several structures relevant to the fabrication of microelectrode arrays are also offered in order to demonstrate the capabilities of EDM.

  8. Production of Porous ZnSe by Electrochemical Etching Method

    А.F. Dyadenchuk

    2013-10-01

    Full Text Available Here we describe the production features of a porous layer on the surface of n-type single-crystalline zinc selenide. The surface structure is investigated and the photomicrographs of porous layers of the treated ZnSe crystal are represented. Process of the mosaic structure formation depending on the etching time is considered. The value of the flat-band potential with respect to the used electrolyte is calculated.

  9. Overview of atomic layer etching in the semiconductor industry

    Kanarik, Keren J., E-mail: keren.kanarik@lamresearch.com; Lill, Thorsten; Hudson, Eric A.; Sriraman, Saravanapriyan; Tan, Samantha; Marks, Jeffrey; Vahedi, Vahid; Gottscho, Richard A. [Lam Research Corporation, 4400 Cushing Parkway, Fremont, California 94538 (United States)

    2015-03-15

    Atomic layer etching (ALE) is a technique for removing thin layers of material using sequential reaction steps that are self-limiting. ALE has been studied in the laboratory for more than 25 years. Today, it is being driven by the semiconductor industry as an alternative to continuous etching and is viewed as an essential counterpart to atomic layer deposition. As we enter the era of atomic-scale dimensions, there is need to unify the ALE field through increased effectiveness of collaboration between academia and industry, and to help enable the transition from lab to fab. With this in mind, this article provides defining criteria for ALE, along with clarification of some of the terminology and assumptions of this field. To increase understanding of the process, the mechanistic understanding is described for the silicon ALE case study, including the advantages of plasma-assisted processing. A historical overview spanning more than 25 years is provided for silicon, as well as ALE studies on oxides, III–V compounds, and other materials. Together, these processes encompass a variety of implementations, all following the same ALE principles. While the focus is on directional etching, isotropic ALE is also included. As part of this review, the authors also address the role of power pulsing as a predecessor to ALE and examine the outlook of ALE in the manufacturing of advanced semiconductor devices.

  10. Etching and Chemical Control of the Silicon Nitride Surface.

    Brunet, Marine; Aureau, Damien; Chantraine, Paul; Guillemot, François; Etcheberry, Arnaud; Gouget-Laemmel, Anne Chantal; Ozanam, François

    2017-01-25

    Silicon nitride is used for many technological applications, but a quantitative knowledge of its surface chemistry is still lacking. Native oxynitride at the surface is generally removed using fluorinated etchants, but the chemical composition of surfaces still needs to be determined. In this work, the thinning (etching efficiency) of the layers after treatments in HF and NH4F solutions has been followed by using spectroscopic ellipsometry. A quantitative estimation of the chemical bonds found on the surface is obtained by a combination of infrared absorption spectroscopy in ATR mode, X-ray photoelectron spectroscopy, and colorimetry. Si-F bonds are the majority species present at the surface after silicon nitride etching; some Si-OH and a few Si-NHx bonds are also present. No Si-H bonds are present, an unfavorable feature for surface functionalization in view of the interest of such mildly reactive groups for achieving stable covalent grafting. Mechanisms are described to support the experimental results, and two methods are proposed for generating surface SiH species: enriching the material in silicon, or submitting the etched surface to a H2 plasma treatment.

  11. Geopolymerisation of fly ashes with waste aluminium anodising etching solutions.

    Ogundiran, M B; Nugteren, H W; Witkamp, G J

    2016-10-01

    Combined management of coal combustion fly ash and waste aluminium anodising etching solutions using geopolymerisation presents economic and environmental benefits. The possibility of using waste aluminium anodising etching solution (AES) as activator to produce fly ash geopolymers in place of the commonly used silicate solutions was explored in this study. Geopolymerisation capacities of five European fly ashes with AES and the leaching of elements from their corresponding geopolymers were studied. Conventional commercial potassium silicate activator-based geopolymers were used as a reference. The geopolymers produced were subjected to physical, mechanical and leaching tests. The leaching of elements was tested on 28 days cured and crushed geopolymers using NEN 12457-4, NEN 7375, SPLP and TCLP leaching tests. After 28 days ambient curing, the geopolymers based on the etching solution activator showed compressive strength values between 51 and 84 MPa, whereas the commercial potassium silicate based geopolymers gave compressive strength values between 89 and 115 MPa. Based on the regulatory limits currently associated with the used leaching tests, all except one of the produced geopolymers (with above threshold leaching of As and Se) passed the recommended limits. The AES-geopolymer geopolymers demonstrated excellent compressive strength, although less than geopolymers made from commercial activator. Additionally, they demonstrated low element leaching potentials and therefore can be suitable for use in construction works.

  12. Giacomo Quarenghi engraver. An etching representing the Salara in Rome

    Piervaleriano Angelini

    2014-12-01

    Full Text Available In 2007, the Rijksmuseum in Amsterdam acquired an engraving of the Italian architect and draftsman Giacomo Quarenghi (1744-1817 for its collection. This etching, mentioned by G.K. Nagler in his Neues Allgemeines Kunstler-Lexicon ... (twelfth volume, 1842, pp. 150-151, had gone missing and no copy of it had been found in modern times. It is presented with the title A view of Porta Salaria, in accordance with the subject that has been recognized in the drawing by Quarenghi in Album I-22 of the Public Library of Bergamo, and which can be considered the origin of the engraved image. The analysis of the etching, now in Amsterdam, has stimulated a careful evaluation of the subject of the view (both designed and engraved, allowing us to recognize it not as Porta Salaria, but The Salara in Rome, the ancient salt repository which once existed near S. Maria in Cosmedin. The study of the engraving of the Rijksmuseum, apart from the iconographic clarification, invites us to explore the little known topic concerning the direct, personal experience, albeit episodic, of Quarenghi with the medium of etching, and the meaning of this artistic practice for its author, and in the context of the culture of his time.

  13. Kinetics of faceting of crystals in growth, etching, and equilibrium

    Vlachos, D. G.; Schmidt, L. D.; Aris, R.

    1993-03-01

    The faceting of crystals in equilibrium with the gas phase and also during crystal growth and etching conditions is studied using the Monte Carlo method. The dynamics of the transformation of unstable crystallographic orientations into hill and valley structures and the spatial patterns that develop are examined as functions of surface temperature, crystallographic orientation, and strength of interatomic potential for two transport processes: adsorption-desorption and surface diffusion. The results are compared with the continuum theory for facet formation. Thermodynamically unstable orientations break into hill and valley structures, and faceting exhibits three time regimes: disordering, facet nucleation, and coarsening of small facets to large facets. Faceting is accelerated as temperature increases, but thermal roughening can occur at high temperatures. Surface diffusion is the dominant mechanism at short times and small facets but adsorption-desorption becomes important at long times and large facets. Growth and etching promote faceting for conditions close to equilibrium but induce kinetic roughening for conditions far from equilibrium. Simultaneous irreversible growth and etching conditions with fast surface diffusion result in enhanced faceting.

  14. Selective recovery of pure copper nanopowder from indium-tin-oxide etching wastewater by various wet chemical reduction process: Understanding their chemistry and comparisons of sustainable valorization processes.

    Swain, Basudev; Mishra, Chinmayee; Hong, Hyun Seon; Cho, Sung-Soo

    2016-05-01

    Sustainable valorization processes for selective recovery of pure copper nanopowder from Indium-Tin-Oxide (ITO) etching wastewater by various wet chemical reduction processes, their chemistry has been investigated and compared. After the indium recovery by solvent extraction from ITO etching wastewater, the same is also an environmental challenge, needs to be treated before disposal. After the indium recovery, ITO etching wastewater contains 6.11kg/m(3) of copper and 1.35kg/m(3) of aluminum, pH of the solution is very low converging to 0 and contain a significant amount of chlorine in the media. In this study, pure copper nanopowder was recovered using various reducing reagents by wet chemical reduction and characterized. Different reducing agents like a metallic, an inorganic acid and an organic acid were used to understand reduction behavior of copper in the presence of aluminum in a strong chloride medium of the ITO etching wastewater. The effect of a polymer surfactant Polyvinylpyrrolidone (PVP), which was included to prevent aggregation, to provide dispersion stability and control the size of copper nanopowder was investigated and compared. The developed copper nanopowder recovery techniques are techno-economical feasible processes for commercial production of copper nanopowder in the range of 100-500nm size from the reported facilities through a one-pot synthesis. By all the process reported pure copper nanopowder can be recovered with>99% efficiency. After the copper recovery, copper concentration in the wastewater reduced to acceptable limit recommended by WHO for wastewater disposal. The process is not only beneficial for recycling of copper, but also helps to address environment challenged posed by ITO etching wastewater. From a complex wastewater, synthesis of pure copper nanopowder using various wet chemical reduction route and their comparison is the novelty of this recovery process.

  15. Laser etching of transparent materials at a backside surface adsorbed layer

    Boehme, R. [Leibniz-Institut fuer Oberflaechenmodifizierung e.V., Permoserstr. 15, 04318 Leipzig (Germany); Hirsch, D. [Leibniz-Institut fuer Oberflaechenmodifizierung e.V., Permoserstr. 15, 04318 Leipzig (Germany); Zimmer, K. [Leibniz-Institut fuer Oberflaechenmodifizierung e.V., Permoserstr. 15, 04318 Leipzig (Germany)]. E-mail: klaus.zimmer@iom-leipzig.de

    2006-04-30

    The laser etching using a surface adsorbed layer (LESAL) is a new method for precise etching of transparent materials with pulsed UV-laser beams. The influence of the processing parameters to the etch rate and the surface roughness for etching of fused silica, quartz, sapphire, and magnesium fluoride (MgF{sub 2}) is investigated. Low etch rates of 1 nm/pulse and low roughness of about 1 nm rms were found for fused silica and quartz. This is an indication that different structural modifications of the material do not affect the etching significantly as long as the physical properties are not changed. MgF{sub 2} and sapphire feature a principal different etch behavior with a higher etch rate and a higher roughness. Both incubation effects as well as the temperature dependence of the etch rate can be interpreted by the formation of a modified near surface region due to the laser irradiation. At repetition rates up to 100 Hz, no changes of the etch rate have been observed at moderate laser fluences.

  16. Macro-loading Effects in Inductively Coupled Plasma Etched Mercury Cadmium Telluride

    Apte, Palash; Rybnicek, Kimon; Stoltz, Andrew

    2016-09-01

    This paper reports the effect of macro-loading on mercury cadmium telluride (Hg1- x Cd x Te) and Photoresist (PR) etched in an inductively coupled plasma (ICP). A significant macro-loading effect is observed, which affects the etch rates of both PR and Hg1- x Cd x Te. It is observed that the exposed silicon area has a significant effect on the PR etch rate, but not on the Hg1- x Cd x Te etch rate. It is also observed that the exposed Hg1- x Cd x Te area has a significant effect on the etch rate of the PR, but the exposed PR area does not seem to have an effect on the Hg1- x Cd x Te etch rate. Further, the exposed Hg1- x Cd x Te area is shown to affect the etch rate of the Hg1- x Cd x Te, but there does not seem to be a similar effect for the exposed PR area on the etch rate of the PR. Since the macro-loading affects the selectivity significantly, this effect can cause significant problems in the etching of deep trenches. A few techniques to reduce the effect of macro-loading on the etch rates of the PR and Hg1- x Cd x Te are listed, herein.

  17. Dynamic etching of soluble surface layers with on-line inductively coupled plasma mass spectrometry detection - a novel approach for determination of complex metal oxide surface cation stoichiometry

    Limbeck, A; Rupp, GM; M. Kubicek; Tellez, H.; Druce, J; Ishihara, T.; Kilner, JA; Fleig, J.

    2016-01-01

    In this work, an innovative approach for determining the surface stoichiometry of complex metal oxide (CMO) thin films is presented. The procedure is based on treatment of the sample surface with different etching solutions, followed by on-line analysis of the derived eluates using inductively coupled plasma ? mass spectrometry (ICP-MS). Via consecutive treatment of the sample surface with water and diluted HCl, a differentiation between water soluble and acid soluble parts of near surface re...

  18. Low-Roughness Plasma Etching of HgCdTe Masked with Patterned Silicon Dioxide

    Ye, Z. H.; Hu, W. D.; Yin, W. T.; Huang, J.; Lin, C.; Hu, X. N.; Ding, R. J.; Chen, X. S.; Lu, W.; He, L.

    2011-08-01

    A novel mask technique utilizing patterned silicon dioxide films has been exploited to perform mesa etching for device delineation and electrical isolation of HgCdTe third-generation infrared focal-plane arrays (IRFPAs). High-density silicon dioxide films were deposited at temperature of 80°C, and a procedure for patterning and etching of HgCdTe was developed by standard photolithography and wet chemical etching. Scanning electron microscopy (SEM) showed that the surfaces of inductively coupled plasma (ICP) etched samples were quite clean and smooth. Root-mean-square (RMS) roughness characterized by atomic force microscopy (AFM) was less than 1.5 nm. The etching selectivity between a silicon dioxide film and HgCdTe in the samples masked with patterned silicon dioxide films was greater than 30:1. These results show that the new masking technique is readily available and promising for HgCdTe mesa etching.

  19. Understanding anisotropic plasma etching of two-dimensional polystyrene opals for advanced materials fabrication.

    Akinoglu, Eser M; Morfa, Anthony J; Giersig, Michael

    2014-10-21

    Anisotropic deformation of polystyrene particles in an oxygenated (O2/Ar) plasma is observed for radio frequency (rf) plasma and inductively coupled plasma (ICP). A facile model based on a ratio of completely isotropic and completely anisotropic etching is presented to describe the anisotropy of the etching process and is implemented to determine the height of the spheroid-shaped polystyrene particles. In our systems, we find the plasma etching to be 54% isotropic in the rf plasma and 79% isotropic in the ICP. With this model, the maximum material deposition thickness for nanofabrication with plasma-etched nanosphere lithography or colloid lithography can be predicted. Moreover, the etching of polystyrene particles in an oxygenated plasma is investigated versus the etching time, gas flow, gas composition, temperature, substrate material, and particle size. The results of this study allow precise shape tuning during the fabrication of nanostructured surfaces with size-dependent properties for bionic, medical, and photonic applications.

  20. A novel oxidation-based wet etching method for AlGaN/GaN heterostructures

    Cai Jinbao; Wang Jinyan; Liu Yang; Xu Zhe; Wang Maojun; Yu Min; Xie Bing

    2013-01-01

    A novel wet etching method for AlGaN/GaN heterojunction structures is proposed using thermal oxidation followed by wet etching in KOH solution.It is found that an AlGaN/GaN heterostructure after high temperature oxidation above 700 ℃ could be etched off in a homothermal (70 ℃) KOH solution while the KOH solution had no etching effects on the region of the A1GaN/GaN heterostructure protected by a SiO2 layer during the oxidation process.A groove structure with 150 nm step depth on an AlGaN/GaN heterostructure was formed after 8 h thermal oxidation at 900 ℃ followed by 30 min treatment in 70 ℃ KOH solution.As the oxidation time increases,the etching depth approaches saturation and the roughness of the etched surface becomes much better.The physical mechanism of this phenomenon is also discussed.

  1. Formation of aligned silicon nanowire on silicon by electroless etching in HF solution

    Megouda, N.; Douani, R. [Faculte des Sciences, Universite Mouloud Mammeri, Tizi-Ouzou (Algeria); Hadjersi, T., E-mail: hadjersi@yahoo.co [Unite de Developpement de la Technologie du Silicium (UDTS), 2, Bd. Frantz Fanon, B.P. 140 Alger-7 merveilles, Alger (Algeria); Boukherroub, R. [Institut de Recherche Interdisciplinaire (IRI, FRE 2963), Institut d' Electronique, de Microelectronique et de Nanotechnologie (IEMN, CNRS-8520), Cite Scientifique, Avenue Poincare-B.P. 60069, 59652 Villeneuve d' Ascq (France)

    2009-12-15

    It was demonstrated that the etching in HF-based aqueous solution containing AgNO{sub 3} and Na{sub 2}S{sub 2}O{sub 8} as oxidizing agents or by Au-assisted electroless etching in HF/H{sub 2}O{sub 2} solution at 50 deg. C yields films composed of aligned Si nanowire (SiNW). SiNW of diameters {approx}10 nm were formed. The morphology and the photoluminescence (PL) of the etched layer as a function of etching solution composition were studied. The SiNW layers formed on silicon were investigated by scanning electron microscopy (SEM), energy-dispersive X-ray (EDX) and photoluminescence. It was demonstrated that the morphology and the photoluminescence of the etched layers strongly depends on the type of etching solution. Finally, a discussion on the formation process of the silicon nanowires is presented.

  2. Aerosol chemistry in Titan's ionosphere: simultaneous growth and etching processes

    Carrasco, Nathalie; Cernogora, Guy; Jomard, François; Etcheberry, Arnaud; Vigneron, Jackie

    2016-10-01

    Since the Cassini-CAPS measurements, organic aerosols are known to be present and formed at high altitudes in the diluted and partially ionized medium that is Titan's ionosphere [1]. This unexpected chemistry can be further investigated in the laboratory with plasma experiments simulating the complex ion-neutral chemistry starting from N2-CH4 [2]. Two sorts of solid organic samples can be produced in laboratory experiments simulating Titan's atmospheric reactivity: grains in the volume and thin films on the reactor walls. We expect that grains are more representative of Titan's atmospheric aerosols, but films are used to provide optical indices for radiative models of Titan's atmosphere.The aim of the present study is to address if these two sorts of analogues are chemically equivalent or not, when produced in the same N2-CH4 plasma discharge. The chemical compositions of both these materials are measured by using elemental analysis, XPS analysis and Secondary Ion Mass Spectrometry. We find that films are homogeneous but significantly less rich in nitrogen and hydrogen than grains produced in the same experimental conditions. This surprising difference in their chemical compositions is explained by the efficient etching occurring on the films, which stay in the discharge during the whole plasma duration, whereas the grains are ejected after a few minutes [3]. The impact for our understanding of Titan's aerosols chemical composition is important. Our study shows that chemical growth and etching process are simultaneously at stake in Titan's ionosphere. The more the aerosols stay in the ionosphere, the more graphitized they get through etching process. In order to infer Titan's aerosols composition, our work highlights a need for constraints on the residence time of aerosols in Titan's ionosphere. [1] Waite et al. (2009) Science , 316, p. 870[2] Szopa et al. (2006) PSS, 54, p. 394[3] Carrasco et al. (2016) PSS, 128, p. 52

  3. Comparison of silanization/hydrosilation and organosilanization modification procedures on etched capillaries for electrokinetic chromatography.

    Matyska, Maria T; Pesek, Joseph J

    2005-06-24

    Etched capillaries for use in open tubular electrochromatography are modified by silanization/hydrosilation and organosilanization. The migration behavior of both types of capillaries is evaluated with small basic molecules, peptides and proteins. Comparisons of peak symmetry and efficiency are used to measure the effectiveness of the two methods for modifying the etched surface. From this information, the suitability of each method for use with etched capillaries can be determined.

  4. Fountain pen nanochemistry: Atomic force control of chrome etching

    Lewis, Aaron; Kheifetz, Yuri; Shambrodt, Efim; Radko, Anna; Khatchatryan, Edward; Sukenik, Chaim

    1999-10-01

    In this report we demonstrate a general method for affecting chemical reactions with a high degree of spatial control that has potentially wide applicability in science and technology. Our technique is based on complexing the delivery of liquid or gaseous materials through a cantilevered micropipette with an atomic force microscope that is totally integrated into a conventional optical microscope. Controlled etching of chrome is demonstrated without detectable effects on the underlying glass substrate. This simple combination allows for the nanometric spatial control of the whole world of chemical reactions in defined regions of surfaces. Applications of the technique in critical areas such as mask repair are likely.

  5. Analysis of Etched CdZnTe Substrates

    Benson, J. D.; Bubulac, L. O.; Jaime-Vasquez, M.; Lennon, C. M.; Arias, J. M.; Smith, P. J.; Jacobs, R. N.; Markunas, J. K.; Almeida, L. A.; Stoltz, A.; Wijewarnasuriya, P. S.; Peterson, J.; Reddy, M.; Jones, K.; Johnson, S. M.; Lofgreen, D. D.

    2016-09-01

    State-of-the-art as-received (112)B CdZnTe substrates have been examined for surface impurity contamination and polishing residue. Two 4 cm × 4 cm and one 6 cm × 6 cm (112)B state-of-the-art as-received CdZnTe wafers were analyzed. A maximum surface impurity concentration of Al = 1.7 × 1015 atoms cm-2, Si = 3.7 × 1013 atoms cm-2, Cl = 3.12 × 1015 atoms cm-2, S = 1.7 × 1014 atoms cm-2, P = 1.1 × 1014 atoms cm-2, Fe = 1.0 × 1013 atoms cm-2, Br = 1.2 × 1014 atoms cm-2, and Cu = 4 × 1012 atoms cm-2 was observed on the as-received CdZnTe wafers. CdZnTe particulates and residual SiO2 polishing grit were observed on the surface of the as-received (112)B CdZnTe substrates. The polishing grit/CdZnTe particulate density on CdZnTe wafers was observed to vary across a 6 cm × 6 cm wafer from ˜4 × 107 cm-2 to 2.5 × 108 cm-2. The surface impurity and damage layer of the (112)B CdZnTe wafers dictate that a molecular beam epitaxy (MBE) preparation etch is required. The contamination for one 4 cm × 4 cm and one 6 cm × 6 cm CdZnTe wafer after a standard MBE Br:methanol preparation etch procedure was also analyzed. A maximum surface impurity concentration of Al = 2.4 × 1015 atoms cm-2, Si = 4.0 × 1013 atoms cm-2, Cl = 7.5 × 1013 atoms cm-2, S = 4.4 × 1013 atoms cm-2, P = 9.8 × 1013 atoms cm-2, Fe = 1.0 × 1013 atoms cm-2, Br = 2.9 × 1014 atoms cm-2, and Cu = 5.2 × 1012 atoms cm-2 was observed on the MBE preparation-etched CdZnTe wafers. The MBE preparation-etched surface contamination consists of Cd(Zn)Te particles/flakes. No residual SiO2 polishing grit was observed on the (112)B surface.

  6. Electrochemical etching of sharp tips for STM reveals singularity

    Quaade, Ulrich; Oddershede, Lene

    2002-01-01

    Electrochemical etching of metal wires is widely used to produce atomically sharp tips for use in scanning tunneling microscopy (STM). In this letter we uncover the existence of a finite-time singularity in the process: Several of the physical parameters describing the system exhibit scaling...... towards and away from a particular singular point in time, exactly the time at which the wire breaks. The obtained scaling exponents coincide with exponents reported from other singular dynamical systems. The results also provide knowledge of how to control STM tip properties on the nano-scale....

  7. Study of etching processes in the GEM detectors

    Zavazieva, Darina

    2016-01-01

    Gaseous Electron Multiplier (GEM) detectors are known to operate stably at high gains and high particle fluxes. Though, at very high gains and fluxes it was observed that the insulating polyimide layer between the GEM electrodes gets etched, changing the original shape of the hole, and therefore varying the gain and the energy resolution of the detector. The idea of the project to observe degradation effect of the GEM foils during the Triple GEM detector operation in extreme conditions under X-ray radiation.

  8. Comparative evaluation of tensile bond strengths of total-etch adhesives and self-etch adhesives with single and multiple consecutive applications: An in vitro study

    Mandava Deepthi

    2009-01-01

    Full Text Available Aim: This study evaluates the effect of single and multiple consecutive applications of adhesives on the tensile bond strength. The currently available adhesives follow either the total-etch or the self-etch concept. However, in both techniques the uniformity and thickness of the adhesive layer plays a significant role in the development of a good bond. Materials and Methods: Sixty composite-dentin bonded specimens were prepared using a total-etch adhesive (Gluma and another 60 using a self-etch adhesive (AdheSE. Each group was further divided into six subgroups based on the number of applications, i.e., single application and multiple (2, 3, 4, 6, and 8 applications. The tensile bond strength was tested with the Instron universal testing machine. The values were analyzed with one-way ANOVA and multiple range tests by Tukey′s HSD procedure to identify those subgroups that had significantly higher bond strength. Results: The results indicate that with total-etch adhesive the bond strength increases significantly as the number of applications are increased from one to two or from two to three", for self-etch adhesive the bond strength obtained with two applications is significantly higher than that with one application. However, for both adhesive systems, there was a decrease in the tensile bond strength values with further applications. Conclusion: We conclude that, in the clinical setting, the application of multiple coats of total etch adhesive improves bonding.

  9. A DLVO model for catalyst motion in metal-assisted chemical etching based upon controlled out-of-plane rotational etching and force-displacement measurements.

    Hildreth, Owen J; Rykaczewski, Konrad; Fedorov, Andrei G; Wong, Ching P

    2013-02-07

    Metal-assisted Chemical Etching of silicon has recently emerged as a powerful technique to fabricate 1D, 2D, and 3D nanostructures in silicon with high feature fidelity. This work demonstrates that out-of-plane rotational catalysts utilizing polymer pinning structures can be designed with excellent control over rotation angle. A plastic deformation model was developed establishing that the catalyst is driven into the silicon substrate with a minimum pressure differential across the catalyst thickness of 0.4-0.6 MPa. Force-displacement curves were gathered between an Au tip and Si or SiO(2) substrates under acidic conditions to show that Derjaguin and Landau, Verwey and Overbeek (DLVO) based forces are capable of providing restorative forces on the order of 0.2-0.3 nN with a calculated 11-18 MPa pressure differential across the catalyst. This work illustrates that out-of-plane rotational structures can be designed with controllable rotation and also suggests a new model for the driving force for catalyst motion based on DLVO theory. This process enables the facile fabrication of vertically aligned thin-film metallic structures and scalloped nanostructures in silicon for applications in 3D micro/nano-electromechanical systems, photonic devices, nanofluidics, etc.

  10. Structural and light-emission modification in chemically-etched porous silicon

    Navarro-Urrios, D.; Oton, C.J. [Departamento de Fisica Basica, University of La Laguna, Avda. Astrofisico Fco. Sanchez, La Laguna (Spain); INFM and Dipartimento di Fisica, University of Trento, Via Sommarive 14, Povo, Trento (Italy); Perez-Padron, C.; Lorenzo, E.; Capuj, N.E. [Departamento de Fisica Basica, University of La Laguna, Avda. Astrofisico Fco. Sanchez, La Laguna (Spain); Gaburro, Z.; Pavesi, L. [INFM and Dipartimento di Fisica, University of Trento, Via Sommarive 14, Povo, Trento (Italy)

    2005-06-01

    After electrochemical etching, we have made a study of the effects generated on p{sup +}-type porous silicon layers when they are left in presence of the electrolyte for different post-etching times. Using an interferometric technique, we have monitored the change of its porosity during the post-etch process due to a chemical dissolution mechanism. These data are complemented with a study of photoluminescence and transmission electron microscopy measurements for different post-etching times. (copyright 2005 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)

  11. Compositional and photoluminescent properties of anodically and stain etched porous silicon

    Guerrero-Lemus, R.; Hernandez-Rodriguez, C. [Laboratorio de Optica, Departamento de Fisica Basica, Universidad de La Laguna, 38204 S/C de Tenerife (Spain); Ben-Hander, F.A.; Martinez-Duart, J.M. [Departamento de Fisica Aplicada C-XII, Universidad Autonoma de Madrid, 28049 Madrid (Spain); Fierro, J.L.G. [Instituto de Catalisis y Petroleoquimica, Consejo Superior de Investigaciones Cientificas (CSIC), Cantoblanco, 28049 Madrid (Spain)

    2003-05-01

    A comparison of the compositional and photoluminescent properties of stain etched (SE) and anodically etched (AE) porous silicon (PS) samples has been carried out. The silicon substrates used and the laboratory conditions are the same for both types of etching processes. The study is carried out varying the PS surface properties by means of different cleaning procedures and post-etching ambient conditions. The results demonstrate that the evolution of the photoluminescence and the composition are related for both types of PS (AE and SE). Thus, it seems highly likely that the photoluminescence mechanisms involved in both cases are similar. (Abstract Copyright [2003], Wiley Periodicals, Inc.)

  12. Numerical and experimental studies of the carbon etching in EUV-induced plasma

    Astakhov, D I; Lee, C J; Ivanov, V V; Krivtsun, V M; Yakushev, O; Koshelev, K N; Lopaev, D V; Bijkerk, F

    2015-01-01

    We have used a combination of numerical modeling and experiments to study carbon etching in the presence of a hydrogen plasma. We model the evolution of a low density EUV-induced plasma during and after the EUV pulse to obtain the energy resolved ion fluxes from the plasma to the surface. By relating the computed ion fluxes to the experimentally observed etching rate at various pressures and ion energies, we show that at low pressure and energy, carbon etching is due to chemical sputtering, while at high pressure and energy a reactive ion etching process is likely to dominate.

  13. Study of the roughness in a photoresist masked, isotropic, SF6-based ICP silicon etch

    Larsen, Kristian Pontoppidan; Petersen, Dirch Hjorth; Hansen, Ole

    2006-01-01

    In this paper we study the etching behavior and the resulting roughness in photoresist-masked isotropic silicon plasma etch performed in an inductively coupled plasma (ICP) etcher using SF6. We report detailed observations of the resulting roughness for various etching parameters, covering......: pressure from 2.5 to 70 mTorr, SF6 flow rate from 50 to 300 sccm, platen power from 0 to 16 W, and ICP power from 1000 to 3000 W. Etch processes with a normalized roughness below 0.005 were found at low pressure, p = 10 mTorr, while larger normalized roughness, above 0.02, occurred at higher pressures, p...

  14. Study of surfactant-added TMAH for applications in DRIE and wet etching-based micromachining

    Tang, B.; Shikida, M.; Sato, K.; Pal, P.; Amakawa, H.; Hida, H.; Fukuzawa, K.

    2010-06-01

    In this paper, etching anisotropy is evaluated for a number of different crystallographic orientations of silicon in a 0.1 vol% Triton-X-100 added 25 wt% tetramethylammonium hydroxide (TMAH) solution using a silicon hemisphere. The research is primarily aimed at developing advanced applications of wet etching in microelectromechanical systems (MEMS). The etching process is carried out at different temperatures in the range of 61-81 °C. The etching results of silicon hemisphere and different shapes of three-dimensional structures in {1 0 0}- and {1 1 0}-Si surfaces are analyzed. Significantly important anisotropy, different from a traditional etchant (e.g. pure KOH and TMAH), is investigated to extend the applications of the wet etching process in silicon bulk micromachining. The similar etching behavior of exact and vicinal {1 1 0} and {1 1 1} planes in TMAH + Triton is utilized selectively to remove the scalloping from deep reactive-ion etching (DRIE) etched profiles. The direct application of the present research is demonstrated by fabricating a cylindrical lens with highly smooth etched surface finish. The smoothness of a micro-lens at different locations is measured qualitatively by a scanning electron microscope and quantitatively by an atomic force microscope. The present paper provides a simple and effective fabrication method of the silicon micro-lens for optical MEMS applications.

  15. Etching high aspect ratio structures in silicon using sulfur hexafluoride/oxygen plasma

    Belen, Rodolfo Jun

    Plasma etching of high aspect ratio structures in Si is an important step in manufacturing capacitors for memory devices and integrated components of microelectromechanical systems. In these applications, the goal is to etch deep features anisotropically with high etch rates and selectivities to the mask while maintaining good uniformity and reproducibility. This study investigates the etching of deep sub-half-micron diameter holes in Si using SF6/O 2 plasma. Etching experiments and plasma diagnostics are combined with modeling to gain a fundamental understanding of the etching and passivation kinetics and mechanism necessary in developing and scaling-up processes. Etching experiments are conducted in an inductively coupled plasma reactor with a planar coil. The substrate electrode is biased with a separate rf power supply to achieve independent control of the ion flux and energy. The effects of pressure, rf-bias and SF6-to-O2 ratio in the feed gas on the etch rate, selectivity and feature profile shape are studied using Si wafers patterned with 0.35 mum-diameter holes in a SiO2 mask. Visualization of profiles using scanning electron microscopy is complemented by plasma diagnostics such as mass spectrometry and actinometry. Simultaneous with experiments, reactor-scale and feature-scale models are developed to quantify the etching and passivation kinetics and identify the important kinetic parameters that affect feature profile evolution. Information from plasma diagnostics and previously published data are used to reduce the degrees of freedom in the model. Experiments are designed to directly measure kinetic parameters such as the chemical etch rate constant and the incidence angle dependence of the etching yield. Experimentally inaccessible parameters such as the sticking coefficients, etching yield and ion scattering parameters are determined through feature profile simulation. The key internal plasma parameters that affect profile evolution are the F-to-O and F

  16. Direct determination of bulk etching rate for LR-115-II solid state nuclear track detectors

    T A Salama; U Seddik; T M Heggazy; A Ahmed Morsy

    2006-09-01

    The thickness of the removed layer of the LR-115-II solid state nuclear track detector during etching is measured directly with a rather precise instrument. Dependence of bulk etching rate on temperature of the etching solution is investigated. It has been found that the bulk etching rate is 3.2 m/h at 60°C in 2.5 N NaOH of water solution. It is also found that the track density in detectors exposed to soil samples increases linearly with the removed layer.

  17. Fabrication of 3D structure by combining AFM and chemical etching on crystalline silicon surface

    2006-01-01

    AFM is used for forming silicon dioxide as a layer (nask) on the silicon wafer surface (100) during the cutting process in ambient atmosphere. The silicon dioxide is made through reaction of silicon and oxygen in the atmosphere. As a result of the anisotropic behavior of single crystalline silicon, the etching rates in alkaline solution depend greatly on the various crystal orientations. The anisotropic etching behaviors in KOH solution and reasons of crystalline silicon are described. Effect of etching conditions such as etching temperature and KOH concentration of the alkaline solution on height of the micro-protuberances has been described.

  18. Reduced threshold all-optical bistability in etched quantum well microresonators

    Rivera, T.; Ladan, F. R.; Izrael, A.; Azoulay, R.; Kuszelewicz, R.; Oudar, J. L.

    1994-02-01

    Etched vertical microresonators made of GaAs/AlGaAs multiple quantum wells produced by reactive ion etching was investigated to study the optical bistability phenomena. Reactive ion etching was preferred because of smooth vertical and minimization of density of surface recombination centers. A high cavity finesse was observed in the microresonators producing an optical bistability with wide hysteresis loops. A low threshold power of 70 microwatts was measured due to carrier confinement and vertical walls. The low bistability threshold power was attributed to self passivation happening during etching process, which produced a small surface recombination rate.

  19. ECE laboratory in the Vinča institute: Its basic characteristics and fundamentals of electrochemic etching on polycarbonate

    Žunić Zora S.

    2003-01-01

    Full Text Available This paper deals with the introductory aspects of the Electrochemical Etching Laboratory installed at the VINČA Institute in the year 2003. The main purpose of the laboratory is its field application for radon and thoron large-scale survey using passive radon/thoron UFO type detectors. Since the etching techniques together with the laboratory equipment were transferred from the National Institute of Radiological Sciences, Chiba, Japan, it was necessary for both etching conditions to be confirmed and to be checked up^ i. e., bulk etching speeds of chemical etching and electrochemical etching in the VINCA Electrochemical Etching Laboratory itself. Beside this initial step, other concerns were taken into consideration in this preliminary experimental phase such as the following: the measurable energy range of the polycarbonate film, background etch pit density of the film and its standard deviation and reproducibility of the response to alpha particles for different sets of etchings.

  20. Crystallographic dependence of the lateral undercut wet etch rate of Al0.5In0.5P in diluted HCl for III-V sacrificial release

    Ansbæk, Thor; Semenova, Elizaveta; Yvind, Kresten;

    2013-01-01

    The authors investigated the use of InAlP as a sacrificial layer lattice-matched to GaAs when diluted hydrochloric acid is used for sacrificial etching. They show that InAlP can be used to fabricate submicrometer air gaps in micro-opto-electro-mechanical systems and that a selectivity toward Ga...

  1. High-Performance Black Multicrystalline Silicon Solar Cells by a Highly Simplified Metal-Catalyzed Chemical Etching Method

    Ying, Zhiqin

    2016-05-20

    A wet-chemical surface texturing technique, including a two-step metal-catalyzed chemical etching (MCCE) and an extra alkaline treatment, has been proven as an efficient way to fabricate high-efficiency black multicrystalline (mc) silicon solar cells, whereas it is limited by the production capacity and the cost cutting due to the complicated process. Here, we demonstrated that with careful control of the composition in etching solution, low-aspect-ratio bowl-like nanostructures with atomically smooth surfaces could be directly achieved by improved one-step MCCE and with no posttreatment, like alkali solution. The doublet surface texture of implementing this nanobowl structure upon the industrialized acidic-textured surface showed concurrent improvement in optical and electrical properties for realizing 18.23% efficiency mc-Si solar cells (156 mm × 156 mm), which is sufficiently higher than 17.7% of the solely acidic-textured cells in the same batch. The one-step MCCE method demonstrated in this study may provide a cost-effective way to manufacture high-performance mc-Si solar cells for the present photovoltaic industry. © 2016 IEEE.

  2. The role of MDP in a bonding resin of a two-step self-etching adhesive system.

    Matsui, Naoko; Takagaki, Tomohiro; Sadr, Alireza; Ikeda, Masaomi; Ichinose, Shizuko; Nikaido, Toru; Tagami, Junji

    2015-01-01

    The purpose of this study was to evaluate the role of 10-methacryloyloxydecyl dihydrogen phosphate (MDP) contained in the bonding resin of a two-step self-etch adhesive system. An experimental adhesive (M0) containing MDP only in the primer, but not in the bonding resin was prepared. Clearfil SE Bond (MM) and M0 were compared in terms of microtensile bond strength to dentin, ultimate tensile strength of the bonding resin, and dentin-resin bonding interface morphology under SEM and TEM. The immediate µTBS values of MM significantly decreased after thermal cycles while M0 were stable even after 10,000 cycles. In the SEM observations, formation of erosion was observed beneath the acid-base resistant zone only in M0. The results suggested that MDP in the bonding resin of the two-step self-etching system; 1) improved the immediate bond strength, but caused reduction in long-term bond durability; 2) offered the advantages of acid-base resistance at the ABRZ forefront area.

  3. Effect of collagen fibrils removal on shear bond strength of total etch and self etch adhesive systems

    Pishevar L.

    2009-12-01

    Full Text Available "nBackground and Aim: Sodium hypochlorite can remove the organic phase of the demineralized dentin and it produces direct resin bonding with hydroxyapatite crystals. Therefore, the hydrolytic degradation of collagen fibrils which might affect the bonding durability is removed. The aim of this study was to evaluate the effect of collagen fibrils removal by 10% NaOCl on dentin shear bond strength of two total etch and self etch adhesive systems."nMaterials and Methods: Sixty extracted human premolar teeth were used in this study. Buccal surface of teeth were grounded until dentin was exposed. Then teeth were divided into four groups. According to dentin surface treatment, experimental groups were as follows: Group I: Single Bond (3M according to manufacture instruction, Group II: 10% NaOCl+Single bond (3M, Group III: Clearfil SE Bond (Kuraray according to manufacture instruction, and Group IV: Clearfil SE Bond primer. After that, the specimens were immersed in 50% acetone solution for removing extra monomer. Then the specimens were rinsed and dried. 10% NaOCl was applied and finally adhesive was used. Then composite was bonded to the treated surfaces using a 4 2 mm cylindrical plastic mold. Specimens were thermocycled for 500 cycles (5-55ºC. A shear load was employed by a universal testing machine with a cross head speed of 1mm/min. The data were analyzed for statistical significance with One-way ANOVA, Two-way ANOVA and Tukey HSD post-hoc tests."nResults: The mean shear bond strengths of groups were as follows: Single Bond=16.8±4.2, Clearfil SE Bond=23.7±4.07, Single Bond+NaOCl=10.5±4.34, Clearfil SE Bond+NaOCl=23.3±3.65 MPa. Statistical analysis revealed that using 10% NaOCl significantly decreased the shear bond strength in Single Bond group (P=0.00, but caused no significant difference in the shear bond strength in Clearfil SE Bond group (P=0.99."nConclusion: Based on the results of this study, NaOCl treatment did not improve the bond

  4. Towards refractive index sensitivity of long-period gratings at level of tens of µm per refractive index unit: fiber cladding etching and nano-coating deposition.

    Śmietana, Mateusz; Koba, Marcin; Mikulic, Predrag; Bock, Wojtek J

    2016-05-30

    In this work we report experimental results on optimizing the refractive index (RI) sensitivity of long-period gratings (LPGs) by fiber cladding etching and thin aluminum oxide (Al2O3) overlay deposition. The presented LPG takes advantage of work in the dispersion turning point (DTP) regime as well as the mode transition (MT) effect for higher-order cladding modes (LP09 and LP010). The MT was obtained by depositing Al2O3 overlays with single-nanometer precision using the Atomic Layer Deposition method (ALD). Etching of both the overlay and the fiber cladding was performed using hydrofluoric acid (HF). For shallow etching of the cladding, i.e., DTP observed at next = 1.429 and 1.439 RIU for an LPG with no overlay, followed by deposition of an overlay of up to 167 nm in thickness, HF etching allowed for post-deposition fine-tuning of the overlay thickness resulting in a significant increase in RI sensitivity mainly at the DTP of the LP09 cladding mode. However, at an external RI (next) above 1.39 RIU, the DTP of LP010 was noticed, and its RI sensitivity exceeded 9,000 nm/RIU. Deeper etching of the cladding, i.e., DTP observed for next above 1.45 RIU, followed by the deposition of thicker overlays (up to 201 nm in thickness) allowed the sensitivity to reach values of over 40,000 nm/RIU in a narrow RI range. Sensitivity exceeding 20,000 nm/RIU was obtained in an RI range suitable for label-free biosensing applications.

  5. Hydrolytic stability of self-etch adhesives bonded to dentin.

    Inoue, S; Koshiro, K; Yoshida, Y; De Munck, J; Nagakane, K; Suzuki, K; Sano, H; Van Meerbeek, B

    2005-12-01

    Functional monomers chemically interact with hydroxyapatite that remains within submicron hybrid layers produced by mild self-etch adhesives. The functional monomer 10-MDP interacts most intensively with hydroxyapatite, and its calcium salt appeared most hydrolytically stable, as compared with 4-MET and phenyl-P. We investigated the hypothesis that additional chemical interaction of self-etch adhesives improves bond stability. The micro-tensile bond strength (muTBS) of the 10-MDP-based adhesive did not decrease significantly after 100,000 cycles, but did after 50,000 and 30,000 cycles, respectively, for the 4-MET-based and the phenyl-P-based adhesives. Likewise, the interfacial ultrastructure was unchanged after 100,000 thermocycles for the 10-MDP-based adhesive, while that of both the 4-MET- and phenyl-P-based adhesives contained voids and less-defined collagen. The findings of this study support the concept that long-term durability of adhesive-dentin bonds depends on the chemical bonding potential of the functional monomer.

  6. Formation of a-Si:H and a-Si{sub 1-x}C{sub x} :H nanowires by Ag-assisted electroless etching in aqueous HF/AgNO{sub 3} solution

    Douani, Rachida [Faculte des Sciences, Universite Mouloud Mammeri, Tizi-Ouzou (Algeria); Piret, Gaelle, E-mail: gaelle.offranc@polytechnique.edu [Physique de la Matiere Condensee, Ecole Polytechnique, CNRS, 91128 Palaiseau (France); Hadjersi, Toufik [Unite de Developpement de la Technologie du Silicium (UDTS), 2, Bd. Frantz Fanon, B.P. 140 Alger-7 merveilles, Algiers (Algeria); Chazalviel, Jean-Noel; Solomon, Ionel [Physique de la Matiere Condensee, Ecole Polytechnique, CNRS, 91128 Palaiseau (France)

    2011-06-01

    The formation of hydrogenated amorphous silicon-carbon alloy (a-Si{sub 1-x}C{sub x}:H) nanowires is studied for different carbon concentrations (0-7%) by using Ag-assisted electroless etching of the thin a-Si{sub 1-x}C{sub x}:H films deposited by plasma-enhanced chemical vapour deposition from silane/methane gas mixtures. The nanowires morphologies (length, density, ...), studied by scanning electron microscopy, strongly depend on the concentration of the etchant (aqueous solution of hydrofluoric acid and silver nitrate), the etching time, and the carbon concentration of the deposited layer.

  7. Detection of HEMA in self-etching adhesive systems with high performance liquid chromatography

    Panduric, V.; Tarle, Z.; Hameršak, Z.; Stipetić, I.; Matosevic, D.; Negovetić-Mandić, V.; Prskalo, K.

    2009-04-01

    One of the factors that can decrease hydrolytic stability of self-etching adhesive systems (SEAS) is 2-hydroxymethylmethacrylate (HEMA). Due to hydrolytic instability of acidic methacrylate monomers in SEAS, HEMA can be present even if the manufacturer did not include it in original composition. The aim of the study was to determine the presence of HEMA because of decomposition by hydrolysis of methacrylates during storage, resulting with loss of adhesion strength to hard dental tissues of the tooth crown. Three most commonly used SEAS were tested: AdheSE ONE, G-Bond and iBond under different storage conditions. High performance liquid chromatography analysis was performed on a Nucleosil C 18-100 5 μm (250 × 4.6 mm) column, Knauer K-501 pumps and Wellchrom DAD K-2700 detector at 215 nm. Data were collected and processed by EuroCrom 2000 HPLC software. Calibration curves were made related eluted peak area to known concentrations of HEMA (purchased from Fluka). The elution time for HEMA is 12.25 min at flow rate 1.0 ml/min. Obtained results indicate that no HEMA was present in AdheSE ONE because methacrylates are substituted with methacrylamides that seem to be more stable under acidic aqueous conditions. In all other adhesive systems HEMA was detected.

  8. Comparative study of the bond strength of self-etch adhesive systems with different pHs applied to enamel and dentine

    Rubens Côrte Real de Carvalho

    2008-01-01

    Full Text Available Objective: To evaluate whether the pH of the primer is capable of influencing the bond strength of three self-etching adhesive systems to enamel and dentin. Methods: Forty enamel surfaces and 40 dentin surfaces were used, divided into eight groups (n=10 according to the adhesive system (Single Bond, ClearfilSE, AdheSE, Adper Prompt L-Pop. A 3 mm matrix was used to delimit the area restored with composite resin Z250. The test specimens were stored in distilled water at 37ºC for 24 hours and submitted to mechanical shear testing.Results: The ANOVA and Tukey statistical tests showed that there was no statistical difference among the groups in which the adhesivesystems Single Bond (control and Clearfil SE Bond were used and among the groups in which the AdheSE and Adper Prompt L-Pop systemswere used, both with statistical difference when compared with the Single Bond and Clearfil SE Bond groups. There was no statisticallysignificant difference between the bond strength values obtained, when the same adhesive systems were compared with regard to thesubstrates (enamel and dentin. The increased acidity of the self-etch adhesive systems was not capable of increasing the bond strengthvalues. Conclusion: The increasing of self-etch acidity of adhesive systems was not capable to increase the band strenght values. In the comparison between the same adhesive system in enamel or dentin, all adhesive presented similar performance, irrespective of the substrate used.

  9. A 7-year randomized prospective study of a one-step self-etching adhesive in non-carious cervical lesions. The effect of curing modes and restorative material

    van Dijken, Jan W V; Pallesen, Ulla

    2012-01-01

    Objective: The aim of this study was to evaluate the clinical retention of a one-step self-etching adhesive system (Xeno III) in Class V non-carious cervical lesions and the effect of restorative material and curing techniques on longevity of the restorations. Material and methods: A total of 139...... Class V restorations were placed with the self-etching primer Xeno III and a resin composite (Tetric Ceram) or a poly-acid modified resin composite (Dyract AP) in non-carious cervical lesions without intentional enamel involvement. The materials were cured with a conventional continuous light, a soft...... be evaluated. No post-operative sensitivity was reported by the participants. Overall relative cumulative loss rate frequencies for the adhesive system at 6, 18 and 7 years, independent of curing technique and restorative material, were 0.8%, 6.9% and 23.0%, respectively. The self-etching adhesive fulfilled...

  10. Focused helium and neon ion beam induced etching for advanced extreme ultraviolet lithography mask repair

    Gonzalez, Carlos M.; Timilsina, Rajendra; Li, Guoliang; Duscher, Gerd; Rack, Philip D.; Slingenbergh, Winand; van Dorp, Willem F.; De Hosson, Jeff T. M.; Klein, Kate L.; Wu, Huimeng M.; Stern, Lewis A.

    2014-01-01

    The gas field ion microscope was used to investigate helium and neon ion beam induced etching of nickel as a candidate technique for extreme ultraviolet (EUV) lithography mask editing. No discernable nickel etching was observed for room temperature helium exposures at 16 and 30 keV in the dose range

  11. Preparation of Chemically Etched Tips for Ambient Instructional Scanning Tunneling Microscopy

    Zaccardi, Margot J.; Winkelmann, Kurt; Olson, Joel A.

    2010-01-01

    A first-year laboratory experiment that utilizes concepts of electrochemical tip etching for scanning tunneling microscopy (STM) is described. This experiment can be used in conjunction with any STM experiment. Students electrochemically etch gold STM tips using a time-efficient method, which can then be used in an instructional grade STM that…

  12. One-step Fabrication of Nanoporous Black Silicon Surfaces for Solar Cells using Modified Etching Solution

    Ye-hua Tang; Chun-lan Zhou; Su Zhou; Yan Zhao; Wen-jing Wang; Jian-ming Fei; Hong-bin Cao

    2013-01-01

    Currently,a conventional two-step method has been used to generate black silicon (BS)surfaces on silicon substrates for solar cell manufacturing.However,the performances of the solar cell made with such surface generation method are poor,because of the high surface recombination caused by deep etching in the conventional surface generation method for BS.In this work,a modified wet chemical etching solution with additives was developed.A zhomogeneous BS layer with random porous structure was obtained from the modified solution in only one step at room temperature.The BS layer had low reflectivity and shallow etching depth.The additive in the etch solution performs the function of pH-modulation.After 16-min etching,the etching depth in the samples was approximately 200 nm,and the spectrum-weighted-reflectivity in the range from 300 nm to 1200 nm was below 5%,BS solar cells were fabricated in the production line.The decreased etching depth can improve the electrical performance of solar cells because of the decrease in surface recombination.An efficiency of 15,63% for the modified etching BS solar cells was achieved on a large area,ptype single crystalline silicon substrate with a 624.32-mV open circuit voltage and a 77.88%fill factor.

  13. Texture-Etched SnO2 Glasses Applied to Silicon Thin-Film Solar Cells

    Bing-Rui Wu

    2014-01-01

    Full Text Available Transparent electrodes of tin dioxide (SnO2 on glasses were further wet-etched in the diluted HCl:Cr solution to obtain larger surface roughness and better light-scattering characteristic for thin-film solar cell applications. The process parameters in terms of HCl/Cr mixture ratio, etching temperature, and etching time have been investigated. After etching process, the surface roughness, transmission haze, and sheet resistance of SnO2 glasses were measured. It was found that the etching rate was increased with the additions in etchant concentration of Cr and etching temperature. The optimum texture-etching parameters were 0.15 wt.% Cr in 49% HCl, temperature of 90°C, and time of 30 sec. Moreover, silicon thin-film solar cells with the p-i-n structure were fabricated on the textured SnO2 glasses using hot-wire chemical vapor deposition. By optimizing the texture-etching process, the cell efficiency was increased from 4.04% to 4.39%, resulting from the increment of short-circuit current density from 14.14 to 15.58 mA/cm2. This improvement in cell performances can be ascribed to the light-scattering effect induced by surface texturization of SnO2.

  14. Direct, etching of GaAs Crystal Excited by a Vacuum Ultraviolet Lamp

    韩正甫; 廖艳林; 周红军; 蒋作宏; 张国斌; 曹卓良

    2003-01-01

    A successful direct, etching system excited by a vacuum ultraviolet hollow-cathode lamp is reported. The result shows that the facility can transfer a mesh pattern exactly and directly to n-type GaAs wafer, which is the same as that direct, etched by synchrotron radiation.

  15. Effect of evaporation of solvents from one-step, self-etching adhesives

    Furuse, Adilson Yoshio; Peutzfeldt, Anne; Asmussen, Erik

    2008-01-01

    PURPOSE: To investigate whether and to what extent the bonding capacity of one-step, self-etching adhesives is influenced by the degree to which solvent is evaporated. MATERIALS AND METHODS: Seven one-step, self-etching adhesives were tested (Adper Prompt L-Pop, Clearfil S3 Bond, Futurabond NR, G...

  16. Fabrication Characteristics of Silicon Nanowires via the Electrochemical Electroless Etching Method.

    Kang, ByeongSu; Jeong, Chae Hwan; Kim, Changheon; Kim, Min-Young; Choi, Bum Ho; Lee, Moo Sung; Kim, Ho-Sung

    2015-07-01

    A silicon nanowire structure was fabricated using the electrochemical electroless etching method, involving electroless plating and the electrochemical etching process. The reflection of the absorption layer with the nanowires' structure was about 5%, which is better than a bulk-type solar cell (10%).

  17. Applied-voltage dependence on conductometric track etching of poly(vinylidene fluoride) films

    Nuryanthi, N. [Department of Nuclear Engineering and Management, School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656 (Japan); Quantum Beam Science Directorate, Japan Atomic Energy Agency, 1233 Watanuki, Takasaki, Gunma 370-1292 (Japan); Yamaki, T., E-mail: yamaki.tetsuya@jaea.go.jp [Quantum Beam Science Directorate, Japan Atomic Energy Agency, 1233 Watanuki, Takasaki, Gunma 370-1292 (Japan); Koshikawa, H.; Asano, M.; Sawada, S.; Hasegawa, S.; Maekawa, Y. [Quantum Beam Science Directorate, Japan Atomic Energy Agency, 1233 Watanuki, Takasaki, Gunma 370-1292 (Japan); Katsumura, Y. [Department of Nuclear Engineering and Management, School of Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656 (Japan)

    2013-11-01

    We investigated the conductometric etching of heavy-ion-irradiated poly(vinylidene fluoride) (PVDF) films to study their pore growth behavior, which was estimated from radial etch rates under the application of different voltages. The plateau of the pore diameter seen in a bulk etching region was constant at an applied voltage ranging from 0.1 to 3.0 V, while the breakthrough time varied considerably. Employing the first derivative of the conductometric curve, corresponding to the radial etch rate, R, enabled us to clearly analyze parameters reflecting the track structures (i.e., the maximum radial etch rate, R{sub max}, and the time for the diameter to reach the final plateau, T{sub E}). Interestingly, these two parameters were significantly influenced by the applied voltage. There was a trend toward increasing values of R{sub max} and, in contrast, decreasing levels of T{sub E} as the applied voltage was increased. These promotional effects of the etching process can be rationalized by considering the electrophoretic migration of dissolved species in and out of each pore. Thus, conductometric etching under different voltage conditions offers the ability to control pore geometries by optimizing the etching process in the transverse direction as well as in the thickness direction.

  18. Revealing of defects in CdTe crystals by DSL etching

    Bissoli, F.; Weyher, J.L.; Zappettini, A.; Zha, M.; Zanotti, L.

    2005-01-01

    The effect of DS(L) (Diluited Sirtl with or without Light) solution on CadmiumTelluride crystals has been studied in comparison with the actions due to Inoue and Nakagawa etching solutions. The use of chemical etching to reveal extended defects is a fast and useful technique for characterizing the c

  19. Five-year clinical evaluation of 300 teeth restored with porcelain laminate veneers using total-etch and a modified self-etch adhesive system.

    Aykor, Arzu; Ozel, Emre

    2009-01-01

    This study evaluated the long-term clinical performance of porcelain laminate veneers luted with hybrid composite in combination with total-etch and self-etch adhesive systems. The study was performed on 30 patients ranging in age between 28 and 54 years. Ten veneers were performed per patient in the maxillary arch. In Group 1, 150 teeth were treated with porcelain veneers, using a total-etch adhesive system (Scotchbond Multi-Purpose Plus, 3M ESPE). In Group 2, 150 teeth were bonded with a self-etch adhesive system (AdheSE, Ivoclar-Vivadent). All the veneers were luted with a light-cured hybrid composite (Z100, 3M ESPE). The patients were recalled after 1, 2 and 5 years. Modified United States Public Health Service (USPHS) criteria were utilized to evaluate the porcelain laminate veneers in terms of marginal adaptation, cavo-surface marginal discoloration, secondary caries, postoperative sensitivity, satisfaction with restoration shade and gingival tissue response. Data were analyzed using the Chi-Square test (p 0.05). Porcelain veneers exhibited successful clinical performance with both total-etch and two-step self-etch adhesives at the end of five-years.

  20. Highly efficient metal-free growth of nitrogen-doped single-walled carbon nanotubes on plasma-etched substrates for oxygen reduction.

    Yu, Dingshan; Zhang, Qiang; Dai, Liming

    2010-11-03

    We have for the first time developed a simple plasma-etching technology to effectively generate metal-free particle catalysts for efficient metal-free growth of undoped and/or nitrogen-doped single-walled carbon nanotubes (CNTs). Compared with undoped CNTs, the newly produced metal-free nitrogen-containing CNTs were demonstrated to show relatively good electrocatalytic activity and long-term stability toward oxygen reduction reaction (ORR) in an acidic medium. Owing to the highly generic nature of the plasma etching technique, the methodology developed in this study can be applied to many other substrates for efficient growth of metal-free CNTs for various applications, ranging from energy related to electronic and to biomedical systems.

  1. Two-step controllable electrochemical etching of tungsten scanning probe microscopy tips

    Khan, Yasser

    2012-01-01

    Dynamic electrochemical etching technique is optimized to produce tungsten tips with controllable shape and radius of curvature of less than 10 nm. Nascent features such as dynamic electrochemical etching and reverse biasing after drop-off are utilized, and two-step dynamic electrochemical etching is introduced to produce extremely sharp tips with controllable aspect ratio. Electronic current shut-off time for conventional dc drop-off technique is reduced to ?36 ns using high speed analog electronics. Undesirable variability in tip shape, which is innate to static dc electrochemical etching, is mitigated with novel dynamic electrochemical etching. Overall, we present a facile and robust approach, whereby using a novel etchant level adjustment mechanism, 30° variability in cone angle and 1.5 mm controllability in cone length were achieved, while routinely producing ultra-sharp probes. © 2012 American Institute of Physics.

  2. Thermal compression chip interconnection using organic solderability preservative etched substrate by plasma processing.

    Cho, Sung-Won; Choi, JoonYoung; Chung, Chin-Wook

    2014-12-01

    The solderability of copper organic solderbility preservative (CuOSP) finished substrate was enhanced by the plasma etching. To improve the solderability of TC interconnection with the CuOSP finished substrate, the plasma etching process is used. An Oxygen-Hydrogen plasma treatment process is performed to remove OSP material. To prevent the oxidation by oxygen plasma treatment, hydrogen reducing process is also performed before TC interconnection process. The thickness of OSP material after plasma etching is measured by optical reflection method and the component analysis by Auger Electron Spectroscopy is performed. From the lowered thickness, the bonding force of TC interconnection after OSP etching process is lowered. Also the electrical open/short test was performed after assembling the completed semiconductor packaging. The improved yield due to the plasma etching process is achieved.

  3. Etching mechanism of niobium in coaxial Ar/Cl2 radio frequency plasma

    Upadhyay, Janardan [Old Dominion Univ., Norfolk, VA (United States); Im, Do [Old Dominion Univ., Norfolk, VA (United States); Popovic, Svetozar [Old Dominion Univ., Norfolk, VA (United States); Valente-Feliciano, Anne -Marie [Thomas Jefferson National Accelerator Facility (TJNAF), Newport News, VA (United States); Phillips, H. Larry [Thomas Jefferson National Accelerator Facility (TJNAF), Newport News, VA (United States); Vuskovic, Leposova [Old Dominion Univ., Norfolk, VA (United States)

    2015-03-18

    The understanding of the Ar/Cl2 plasma etching mechanism is crucial for the desired modification of inner surface of the three dimensional niobium (Nb) superconductive radio frequency cavities. Uniform mass removal in cylindrical shaped structures is a challenging task because the etch rate varies along the direction of gas flow. The study is performed in the asymmetric coaxial radio-frequency (rf) discharge with two identical Nb rings acting as a part of the outer electrode. The dependence of etch rate uniformity on pressure, rf power, dc bias, Cl2 concentration, diameter of the inner electrode, temperature of the outer cylinder, and position of the samples in the structure is determined. Furthermore, to understand the plasma etching mechanisms, we have studied several factors that have important influence on the etch rate and uniformity, which include the plasma sheath potential, Nb surface temperature, and the gas flow rate.

  4. Etching Mechanism of Niobium in Coaxial Ar/Cl2 RF Plasma

    Upadhyay, J; Popović, S; Valente-Feliciano, A -M; Phillips, L; Vušković, L

    2014-01-01

    The understanding of the Ar/Cl2 plasma etching mechanism is crucial for the desired modification of inner surface of the three dimensional niobium (Nb) superconductive radio frequency cavities. Uniform mass removal in cylindrical shaped structures is a challenging task, because the etch rate varies along the direction of gas flow. The study is performed in the asymmetric coaxial RF discharge with two identical Nb rings acting as a part of the outer electrode. The dependence of etch rate uniformity on pressure, RF power, DC bias, Cl2 concentration, diameter of the inner electrode, temperature of the outer cylinder and position of the samples in the structure is determined. To understand the plasma etching mechanisms, we have studied several factors that have important influence on the etch rate and uniformity, which include the plasma sheath potential, Nb surface temperature, and the gas flow rate.

  5. Advanced simulation technology for etching process design for CMOS device applications

    Kuboi, Nobuyuki; Fukasawa, Masanaga; Tatsumi, Tetsuya

    2016-07-01

    Plasma etching is a critical process for the realization of high performance in the next generation of CMOS devices. To predict and control fluctuations in the etching properties accurately during mass production, it is essential that etching process simulation technology considers fluctuations in the plasma chamber wall conditions, the effects of by-products on the critical dimensions, the Si recess dependence on the wafer open area ratio and local pattern structure, and the time-dependent plasma-induced damage distribution associated with the three-dimensional feature scale profile at the 100 nm level. This consideration can overcome the issues with conventional simulations performed under the assumed ideal conditions, which are not accurate enough for practical process design. In this article, these advanced process simulation technologies are reviewed, and, from the results of suitable process simulations, a new etching system that automatically controls the etching properties is proposed to enable stable CMOS device fabrication with high yields.

  6. Focused electron beam induced etching of titanium with XeF{sub 2}

    Schoenaker, F J; Cordoba, R; Fernandez-Pacheco, R; Magen, C; Zuriaga-Monroy, C; Ibarra, M R [Instituto de Nanociencia de Aragon, Universidad de Zaragoza, E-50018 Zaragoza (Spain); Stephan, O [Laboratoire de Physique des Solides, CNRS UMR 8502, Universite Paris Sud XI, Batiment 510, F-91405 Orsay (France); De Teresa, J M, E-mail: deteresa@unizar.es [Departamento de Fisica de la Materia Condensada, Universidad de Zaragoza, E-50009 Zaragoza (Spain)

    2011-07-01

    Titanium is a relevant technological material due to its extraordinary mechanical and biocompatible properties, its nanopatterning being an increasingly important requirement in many applications. We report the successful nanopatterning of titanium by means of focused electron beam induced etching using XeF{sub 2} as a precursor gas. Etch rates up to 1.25 x 10{sup -3} {mu}m{sup 3} s{sup -1} and minimum pattern sizes of 80 nm were obtained. Different etching parameters such as beam current, beam energy, dwell time and pixel spacing are systematically investigated, the etching process being optimized by decreasing both the beam current and the beam energy. The etching mechanism is investigated by transmission electron microscopy. Potential applications in nanotechnology are discussed.

  7. Quantum dots and etch-induced depletion of a silicon two-dimensional electron gas

    Klein, L. J.; Lewis, K. L. M.; Slinker, K. A.; Goswami, Srijit; van der Weide, D. W.; Blick, R. H.; Mooney, P. M.; Chu, J. O.; Coppersmith, S. N.; Friesen, Mark; Eriksson, M. A.

    2006-01-01

    The controlled depletion of electrons in semiconductors is the basis for numerous devices. Reactive-ion etching provides an effective technique for fabricating both classical and quantum devices. However, Fermi-level pinning must be carefully considered in the development of small devices, such as quantum dots. Because of depletion, the electrical size of the device is reduced in comparison with its physical dimension. To investigate this issue in modulation-doped silicon single-electron transistors, we fabricate several types of devices in silicon-germanium heterostructures using two different etches, CF4 and SF6. We estimate the depletion width associated with each etch by two methods: (i) conductance measurements in etched wires of decreasing thickness (to determine the onset of depletion), and (ii) capacitance measurements of quantum dots (to estimate the size of the active region). We find that the SF6 etch causes a much smaller depletion width, making it more suitable for device fabrication.

  8. Dopant type and/or concentration selective dry photochemical etching of semiconductor materials

    Ashby, C.I.H.; Dishman, J.L.

    1987-03-10

    A method is described of selectively photochemically dry etching a first semiconductor material of a given composition in the presence of a second semiconductor material which is of a composition different from the first material. The second material is not substantially etched during the method which comprises: subjecting both materials to the same photon flux of an energy greater than their respective direct bandgaps and to the same gaseous chemical etchant under conditions where the etchant would be ineffective for chemical etching of either material where the photons not present, the conditions also being such that the resultant electronic structure of the first semiconductor material under the photon flux is sufficient for the first material to undergo substantial photochemical etching under the conditions. The conditions also are such that the resultant electronic structure of the second semiconductor material under the photon flux is not sufficient for the second material to undergo substantial photochemical etching under the conditions.

  9. Inductively coupled plasma etching of hafnium-indium-zinc oxide using chlorine based gas mixtures

    Choi, Yong-Hee; Jang, Ho-Kyun; Jin, Jun-Eon; Joo, Min-Kyu; Piao, Mingxing; Shin, Jong Mok; Kim, Jae-Sung; Na, Junhong; Kim, Gyu Tae

    2014-04-01

    We report the etching characteristics of a stacked hafnium-indium-zinc oxide (HIZO) with a photoresist using the gas mixture of chlorine and argon (Cl2/Ar). The etching behaviors of HIZO have been investigated in terms of a source power, a bias power and a chamber pressure. As the concentration of Cl2 was increased compared to pure Ar, the etch rate of HIZO film was found slightly different from that of indium-zinc oxide (IZO) film. Moreover, to investigate the etching mechanism systematically, various inspections were carried out such as atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS) depending on the portion of Cl2. Additionally, we compared the etching mechanism of HIZO film with IZO film to confirm the difference of chemical bonds caused by the influence of hafnium doping.

  10. Fast patterning and dry-etch of SiNχ for high resolution nanoimprint templates

    Shu Zhen; Wan Jing; Lu Bingrui; Xie Shenqi; Chen Yifang; Qu Xinping; Liu Ran

    2009-01-01

    We developed a simplified nanofabrication process for imprint templates by fast speed electron beam lithography (EBL) and a dry etch technique on a SiNx substrate, intended for large area manufacturing. To this end,the highly sensitive chemically amplified resist (CAR), NEB-22, with negative tone was used. The EBL process first defines the template pattern in NEB-22, which is then directly used as an etching mask in the subsequent reactive ion etching (RIE) on the SiNx to form the desired templates. The properties of both e-beam lithography and dry etch of NEB-22 were carefully studied, indicating significant advantages of this process with some drawbacks compared to when Cr was used as an etching mask. Nevertheless, our results open up a good opportunity to fabricate high resolution imprint templates with the prospect of wafer scale manufacturing.

  11. Influence of plasma etching in a multi chamber system on a-Si solar cell performance

    Kausche, H.; Moeller, M.; Plaettner, R.

    The plasma-CVD deposition system consisting of two chambers and developed at Siemens can deposit 9 pin solar cells of 100 sq cm simultaneously. Cleaning of the internal surfaces coated with a-Si is performed by plasma etching. The etch gases CF4+O2, SF6 and NF3 were investigated with respect to their etch rates, their efficacy in cleaning 'hidden' parts in the chamber, and with respect to the etching reaction products affecting the performance of the subsequently deposited cells. Mass spectrometric cell performance measurements were therefore taken. The sequence of etching with CF4+O2 or NF3, glow discharge in Ar+H2, pre-deposition of a-Si and cell deposition proved to be a suitable method for achieving high cell performance.

  12. Marginal microleakage in vitro study of occlusal fissures sealing prepared and etched or not with Er: YAG laser; Avaliacao in vitro da microinfiltracao marginal em selamentos oclusais preparados e condicionados ou nao pelo laser de Er:YAG

    Youssef, Fernanda de Almeida

    2004-07-01

    The aim of this in vitro study was to evaluate the degree of marginal microleakage in occlusal sealing by invasive techniques, after preparation with Er:YAG laser followed or not by Er:YAG laser etching and compared to the conventional technique. Thirty human premolars were divided into three groups: A (control group) - cavities were prepared with high speed and etched with 37% orthophosphoric acid; group B - cavities were prepared with Er:YAG (350 mJ, 4 Hz and 112 J /cm{sup 2}) and etched with 37% orthophosphoric acid; group C - cavities were prepared with Er:YAG laser (350 mJ, 4 Hz and 112 J/cm{sup 2}), and etched with Er:YAG laser (80 mJ, 4 Hz and 25 m/cm{sup 2}). All cavities were treated with the same adhesive system and restored with flow composite according to manufacturer instructions. Teeth were submitted to thermal cycling procedures and immersed in 50% Silver Nitrate Solutions for 8 hours in total darkness. Teeth were sectioned longitudinally in the bucco-lingual direction, in slices of 1 mm thick. Each slice was immersed into photo developing solution under 16 hours of fluorescent light. Slices were photographed and microleakage was scored from 0 to 7 J by three standard examiners. Results showed statistically significant differences for group C (Er:YAG laser preparation and etching). We concluded that Er:YAG laser can be used for cavity preparation of occlusal sealing, like the conventional high speed method. However, this laser, used as enamel etching agent, could not promote an adequate surface for adhesive procedures. (author)

  13. Inductively-coupled-plasma reactive ion etching of single-crystal β-Ga2O3

    Zhang, Liheng; Verma, Amit; (Grace Xing, Huili; Jena, Debdeep

    2017-03-01

    Dry etching behavior of unintentionally-doped (\\bar{2}01) β-Ga2O3 has been studied in a BCl3/Ar chemistry using inductively-coupled-plasma reactive ion etching (ICP-RIE). The effects of various etch parameters like ICP and RIE powers, BCl3/Ar gas ratio and chamber pressure on etch rate are studied systematically. Higher ICP, RIE powers and lower pressure conditions are found to enhance the etch rate. A synergic etching mechanism between chemical and physical components is proposed and used to obtain fast Ga2O3 etch rates more than 160 nm/min, nearly-vertical sidewalls and smooth etched surfaces. The findings of this work will enable Ga2O3 vertical devices for power electronics.

  14. Agile dry etching of compound semiconductors for science-based manufacturing using in-situ process control

    ASHBY,CAROL I.; VAWTER,GREGORY A.; BREILAND,WILLIAM G.; BRUSKAS,LARRY A.; WOODWORTH,JOSEPH R.; HEBNER,GREGORY A.

    2000-02-01

    In-situ optical diagnostics and ion beam diagnostics for plasma-etch and reactive-ion-beam etch (RIBE) tools have been developed and implemented on etch tools in the Compound Semiconductor Research Laboratory (CSRL). The optical diagnostics provide real-time end-point detection during plasma etching of complex thin-film layered structures that require precision etching to stop on a particular layer in the structure. The Monoetch real-time display and analysis program developed with this LDRD displays raw and filtered reflectance signals that enable an etch system operator to stop an etch at the desired depth within the desired layer. The ion beam diagnostics developed with this LDRD will permit routine analysis of critical ion-beam profile characteristics that determine etch uniformity and reproducibility on the RIBE tool.

  15. Solar Noble Gases from ACFER 111 Metal Etched in Vacuo

    Pedroni, A.; Begemann, F.

    1992-07-01

    Regolith grains dissolved by stepwise etching release a mixture of near-surface implanted Solar Wind gases (SW) and a deeper- sited, isotopically heavier component attributed to Solar Energetic Particles (SEP) (1,2,3). In all regolith materials examined so far the elemental abundance ratios in both components are distinctly different from the canonical solar values (4). The differences are generally explained to be owing to diffusive elemental fractionation although there is no strong evidence that upon their implantation the composition of the gases was indeed solar. In contrast, the solar noble gases present in the H3-H6 chondritic regolith breccia Acfer 111 appear to be nearly unfractionated and thus offer a unique chance for more accurate analyses. A magnetic fraction of Acfer 111 matrix, consisting of approx. 80% metal and 20% silicates, was etched with a 60 g/mol aqueous solution of HNO3 in a high-vacuum extraction line similar to that in (1). The gases released were drawn off in steps and analyzed; the experiment was stopped when ~97% of the metal and ~50% of the silicates were dissolved. As etching proceeds, the isotopic composition of the released gases changes in a pattern similar to that observed previously in other regolithic materials. The isotopic composition of solar neon decreases from ^20Ne/^22Ne=13.1 in the first step to ^20Ne/^22Ne=11.6, which can be interpreted as a change of the mixing ratio of SW (^20Ne/^22Ne=13.7) and SEP (^20Ne/^22Ne=11.3) neon. The isotopic compositions of solar He, Ar, and Kr are consistent with their also being mixtures of SW and SEP having compositions reported previously (2,3), although our data are compromised to some extent by the presence of planetary gases extracted from the silicates and, in the first steps, by atmospheric contamination probably present in terrestrial weathering products (mostly rust). The elemental composition of noble gases released from Acfer 111 was distinct from previous experiments: The (^4He

  16. Gate oxide punching thru mechanism in plasma dry etching

    2008-01-01

    The punching thru mechanism of gate oxide (thickness about 15A) was investi- gated. Because of the thin thickness of gate oxide, gate oxide punching thru may easily happen during the plasma process. It was found that what caused the punching thru was not only the selectivity of poly-silicon/oxide but also the pattern topography. We used the basic SRAM pattern to check this topography effect, and found that gate oxide located at the narrow spacing of two parallel serpentine lines was the most easily punched thru. What caused the topography effect was the starvation of oxygen in these places which were induced by the residue of poly-silicon and enhanced by electron shading effect. So, to solve the issue of gate oxide punching thru, firstly the selectivity should be enough, secondly we should pay attention to the etching pattern topography.

  17. Black Silicon formation using dry etching for solar cells applications

    Murias, D. [Instituto Nacional de Astrofisica, Optica y Electronica, INAOE, Puebla (Mexico); Reyes-Betanzo, C., E-mail: creyes@inaoep.mx [Instituto Nacional de Astrofisica, Optica y Electronica, INAOE, Puebla (Mexico); Moreno, M.; Torres, A.; Itzmoyotl, A. [Instituto Nacional de Astrofisica, Optica y Electronica, INAOE, Puebla (Mexico); Ambrosio, R.; Soriano, M. [Universidad Autonoma de Ciudad Juarez, Chihuahua (Mexico); Lucas, J. [Instituto Tecnologico de Tehuacan, Puebla (Mexico); Cabarrocas, P. Roca i [Laboratoire de Physique des Interfaces et des Couches Minces, Ecole Polytechnique, CNRS, Palaiseau (France)

    2012-09-20

    A study on the formation of Black Silicon on crystalline silicon surface using SF{sub 6}/O{sub 2} and SF{sub 6}/O{sub 2}/CH{sub 4} based plasmas in a reactive ion etching (RIE) system is presented. The effect of the RF power, chamber pressure, process time, gas flow rates, and gas mixtures on the texture of silicon surface has been analyzed. Completely Black Silicon surfaces containing pyramid like structures have been obtained, using an optimized mask-free plasma process. Moreover, the Black Silicon surfaces have demonstrated average values of 1% and 4% for specular and diffuse reflectance respectively, feature that is suitable for the fabrication of low cost solar cells.

  18. Laser etching of austenitic stainless steels for micro-structural evaluation

    Baghra, Chetan; Kumar, Aniruddha; Sathe, D. B.; Bhatt, R. B.; Behere, P. G.; Afzal, Mohd

    2015-06-01

    Etching is a key step in metallography to reveal microstructure of polished specimen under an optical microscope. A conventional technique for producing micro-structural contrast is chemical etching. As an alternate, laser etching is investigated since it does not involve use of corrosive reagents and it can be carried out without any physical contact with sample. Laser induced etching technique will be beneficial especially in nuclear industry where materials, being radioactive in nature, are handled inside a glove box. In this paper, experimental results of pulsed Nd-YAG laser based etching of few austenitic stainless steels such as SS 304, SS 316 LN and SS alloy D9 which are chosen as structural material for fabrication of various components of upcoming Prototype Fast Breeder Reactor (PFBR) at Kalpakkam India were reported. Laser etching was done by irradiating samples using nanosecond pulsed Nd-YAG laser beam which was transported into glass paneled glove box using optics. Experiments were carried out to understand effect of laser beam parameters such as wavelength, fluence, pulse repetition rate and number of exposures required for etching of austenitic stainless steel samples. Laser etching of PFBR fuel tube and plug welded joint was also carried to evaluate base metal grain size, depth of fusion at welded joint and heat affected zone in the base metal. Experimental results demonstrated that pulsed Nd-YAG laser etching is a fast and effortless technique which can be effectively employed for non-contact remote etching of austenitic stainless steels for micro-structural evaluation.

  19. Research Progress in Wet Chemical Etching of Silicate Glass%硅酸盐玻璃的化学处理研究进展

    成惠峰; 李要辉; 吴云龙; 傅国英; 纪毅璞

    2011-01-01

    氢氟酸溶液常用于硅酸盐玻璃的表面处理,其化学反应机理一直备受关注.本文从氢氟酸电离反应出发,全面归纳氢氟酸稀溶液电离机理、平衡常数以及各电离产物的作用,重点总结了HF-SiO2反应动力学、各研究理论模型、反应速率公式和反应机理.针对目前硅酸盐玻璃的化学处理研究现状,认为硅酸盐玻璃在高浓度氢氟酸溶液和氢氟酸/强酸混合溶液中化学处理的应用将是未来的研究方向.%The reaction mechanism of wet chemical etching of silicate glass in hydrofluoric acid has attracted extensive attention over many years. Ionization reaction in dilute HF solution was introduced. The ionization equation and equilibrium constants and the function of components in dilute HF solution were reviewed. And the reaction kinetics, model, reaction rate formula and etching mechanism of HF-SiO2 reaction were summarized. In the future the application of wet chemical etching in concentrated HF solution and HF-strong acid mixture of wet chemical etching of silicate glass would be studied.

  20. One-day bonding effectiveness of new self-etch adhesives to bur-cut enamel and dentin.

    De Munck, Jan; Vargas, Marcos; Iracki, Jacek; Van Landuyt, Kristen; Poitevin, André; Lambrechts, Paul; Van Meerbeek, Bart

    2005-01-01

    Self-etch adhesives try to solve difficulties commonly associated with the clinical application of etch-and-rinse adhesives. Their application procedure is considered less time-consuming and, more importantly, less technique-sensitive. The main objective of this study was to determine the bonding effectiveness to and the interaction with enamel/dentin of three contemporary one- and two-step self-etch adhesives by microtensile bond strength testing (microTBS), Fe-SEM and TEM when compared to a control two-step self-etch and a three-step etch-and-rinse adhesive. The one-step self-etch adhesive, Adper Prompt (3M ESPE), scored the lowest microTBS of all experimental and control adhesives tested. Conversely, the two-step self-etch adhesives Clearfil SE (Kuraray) and OptiBond Solo Plus Self-Etch (Kerr) approached the values obtained by the three-step etch-and-rinse control (OptiBond FL, Kerr) when bonded to enamel and dentin. Ultramorphological characterization showed that interfacial morphology and the pH of the self-etch primer/adhesive are strongly associated. The interaction with dentin varied from the formation of a submicron, hydroxyapatite-containing hybrid layer for the "mild" self-etch adhesive Clearfil SE to a 3-5 microm thick, hydroxyapatite-depleted hybrid layer for the "strong" self-etch adhesive Adper Prompt. The two-step self-etch adhesives AdheSE and OptiBond Solo Plus Self-Etch presented with a hybrid layer with a hydroxyapatite-depleted top part and a hydroxyapatite-containing base part and were therefore classified into a new group of self-etch adhesives, namely "intermediary strong" self-etch adhesives.

  1. Effect of EDTA Conditioning and Carbodiimide Pretreatment on the Bonding Performance of All-in-One Self-Etch Adhesives

    Shipra Singh

    2015-01-01

    Full Text Available Objective. This study evaluated the effect of ethylenediaminetetraacetic acid (EDTA conditioning and carbodiimide (EDC pretreatment on the shear bond strength of two all-in-one self-etch adhesives to dentin. Methods. Flat coronal dentin surfaces were prepared on one hundred and sixty extracted human molars. Teeth were randomly divided into eight groups according to two different self-etch adhesives used [G-Bond and OptiBond-All-In-One] and four different surface pretreatments: (a adhesive applied following manufacturer’s instructions; (b dentin conditioning with 24% EDTA gel prior to application of adhesive; (c EDC pretreatment followed by application of adhesive; (d application of EDC on EDTA conditioned dentin surface followed by application of adhesive. Composite restorations were placed in all the samples. Ten samples from each group were subjected to immediate and delayed (6-month storage in artificial saliva shear bond strength evaluation. Data collected was subjected to statistical analysis using three-way ANOVA and post hoc Tukey’s test at a significance level of p<0.05.  Results and Conclusion. EDTA preconditioning as well as EDC pretreatment alone had no significant effect on the immediate and delayed bond strengths of either of the adhesives. However, EDC pretreatment on EDTA conditioned dentin surface resulted in preservation of resin-dentin bond strength of both adhesives with no significant fall over six months.

  2. Surface changes of biopolymers PHB and PLLA induced by Ar{sup +} plasma treatment and wet etching

    Slepičková Kasálková, N. [Department of Solid State Engineering, Institute of Chemical Technology, 166 28 Prague (Czech Republic); Slepička, P., E-mail: petr.slepicka@vscht.cz [Department of Solid State Engineering, Institute of Chemical Technology, 166 28 Prague (Czech Republic); Sajdl, P. [Department of Power Engineering, Institute of Chemical Technology, 166 28 Prague (Czech Republic); Švorčík, V. [Department of Solid State Engineering, Institute of Chemical Technology, 166 28 Prague (Czech Republic)

    2014-08-01

    Polymers, especially group of biopolymers find potential application in a wide range of disciplines due to their biodegradability. In biomedical applications these materials can be used as a scaffold or matrix. In this work, the influence of the Ar{sup +} plasma treatment and subsequent wet etching (acetone/water) on the surface properties of polymers were studied. Two biopolymers – polyhydroxybutyrate with 8% polyhydroxyvalerate (PHB) and poly-L-lactic acid (PLLA) were used in these experiments. Modified surface layers were analyzed by different methods. Surface wettability was characterized by determination of water contact angle. Changes in elemental composition of modified surfaces were performed by X-ray Photoelectron Spectroscopy (XPS). Surface morphology and roughness was examined using Atomic Force Microscopy (AFM). Gravimetry method was used to study the mass loss. It was found that the modification from both with plasma and wet etching leads to dramatic changes of surface properties (surface chemistry, morphology and roughness). Rate of changes of these features strongly depends on the modification parameters.

  3. Direct fabrication of compound-eye microlens array on curved surfaces by a facile femtosecond laser enhanced wet etching process

    Bian, Hao; Wei, Yang; Yang, Qing; Chen, Feng; Zhang, Fan; Du, Guangqing; Yong, Jiale; Hou, Xun

    2016-11-01

    We report a direct fabrication of an omnidirectional negative microlens array on a curved substrate by a femtosecond laser enhanced chemical etching process, which is utilized as a molding template for duplicating bioinspired compound eyes. The femtosecond laser treatment of the curved glass substrate employs a common x-y-z stage without rotating the sample surface perpendicular to the laser beam, and uniform, omnidirectional-aligned negative microlenses are generated after a hydrofluoric acid etching. Using the negative microlens array on the concave glass substrate as a molding template, we fabricate an artificial compound eye with 3000 positive microlenses of 95-μm diameter close-packed on a 5-mm polymer hemisphere. Compared to the transferring process, the negative microlenses directly fabricated on the curved mold by our method are distortion-free, and the duplicated artificial eye presents clear and uniform imaging capabilities. This work provides a facile and efficient route to the fabrication of microlenses on any curved substrates without complicated alignment and motion control processes, which has the potential for the development of new microlens-based devices and systems.

  4. Fabrication of Meso-Porous Sintered Metal Thin Films by Selective Etching of Silica Based Sacrificial Template

    Ludovic F. Dumee

    2014-08-01

    Full Text Available Meso-porous metal materials have enhanced surface energies offering unique surface properties with potential applications in chemical catalysis, molecular sensing and selective separation. In this paper, commercial 20 nm diameter metal nano-particles, including silver and copper were blended with 7 nm silica nano-particles by shear mixing. The resulted powders were cold-sintered to form dense, hybrid thin films. The sacrificial silica template was then removed by selective etching in 12 wt% hydrofluoric acid solutions for 15 min to reveal a purely metallic meso-porous thin film material. The impact of the initial silica nano-particle diameter (7–20 nm as well as the sintering pressure (5–20 ton·m−2 and etching conditions on the morphology and properties of the final nano-porous thin films were investigated by porometry, pyknometery, gas and liquid permeation and electron microscopy. Furthermore, the morphology of the pores and particle aggregation during shear mixing were assessed through cross-sectioning by focus ion beam milling. It is demonstrated that meso-pores ranging between 50 and 320 nm in average diameter and porosities up to 47% can be successfully formed for the range of materials tested.

  5. Influence of hydrofluoric acid concentration on the flexural strength of a feldspathic ceramic.

    Venturini, Andressa B; Prochnow, Catina; May, Liliana G; Bottino, Marco C; Felipe Valandro, Luiz

    2015-08-01

    This study evaluated the effects of etching with increasing hydrofluoric (HF) acid concentrations on the roughness and flexural strength of a feldspathic ceramic. One hundred and fifty ceramic specimens (14×4×1.2 mm(2)) were produced from ceramic blocks (VitaBlocks Mark II). All specimens were polished, chamfered and sonically cleaned in isopropyl alcohol. Specimens were randomly divided into 5 groups (n=30): SC (control) no ceramic surface etching; HF1, HF3, HF5 and HF10 ceramic surface etching for 60s with 1%, 3%, 5% and 10% HF acid concentrations, respectively. Profilometry was performed in all specimens to evaluate roughness prior to flexural strength testing. Data were analyzed using one-way ANOVA and Tukey׳s test (α=0.05). Weibull module (m) and characteristic stress (σc) were also determined. HF acid etching, regardless of the concentration used, led to significantly rougher surfaces than the control (pAcid etching significantly reduced the mean flexural strength when compared with the control (143.3 MPa). Weibull modulus of the groups was similar, except for the HF5 group that was higher compared to HF3. Flexural strength was similarly affected by the different HF acid concentrations tested, but roughness increased higher the acid concentration. Ceramic etching led to a significant reduction in strength when compared to the untreated ceramic, regardless of its concentration.

  6. Silicon Nanostructures Produced by Modified MacEtch Method for Antireflective Si Surface.

    Nichkalo, Stepan; Druzhinin, Anatoly; Evtukh, Anatoliy; Bratus', Oleg; Steblova, Olga

    2017-12-01

    This work pertains to the method for modification of silicon (Si) wafer morphology by metal-assisted chemical etching (MacEtch) technique suitable for fabrication of antireflective Si surfaces. For this purpose, we made different Au catalyst patterns on the surface of Si substrate. This modification allowed to obtain the close-packed Au nanodrop (ND) pattern that generates the nanowires (NWs) and the well-separated Au NDs, which induce the nanopore (NP) formation. The antireflective properties of these structures in comparison with NWs produced by the conventional Ag-MacEtch method were analysed. The total surface reflectance of 1~7% for SiNWs and ~17% for SiNPs was observed over the entire Si-absorbing region. Moreover, SiNWs prepared by Au-MacEtch demonstrate better antireflective properties in contrast to those formed by conventional Ag-assisted chemical etching. So, the use of SiNWs produced by the modified Au-MacEtch method as the antireflective material is favored over those prepared by Ag-MacEtch due to their higher light absorption and lower reflectance. The possible reason of these findings is discussed.

  7. Chemical etching behaviors of semipolar (11̄22) and nonpolar (11̄20) gallium nitride films.

    Jung, Younghun; Baik, Kwang Hyeon; Mastro, Michael A; Hite, Jennifer K; Eddy, Charles R; Kim, Jihyun

    2014-08-14

    Wet chemical etching using hot KOH and H3PO4 solutions was performed on semipolar (11̄22) and nonpolar (11̄20) GaN films grown on sapphire substrates. An alternating KOH/H3PO4/KOH etch process was developed to control the orientation of the facets on the thin-film surface. The initial etch step in KOH produced c- and m-plane facets on the surface of both semipolar (11̄22) and nonpolar (11̄20) GaN thin-films. A second etch step in H3PO4 solution additionally exposed a (̄1̄12̄2) plane, which is chemically stable in H3PO4 solution. By repeating the chemical etch with KOH solution, the m-plane facets as seen in the original KOH etch step were recovered. The etching methods developed in our work can be used to control the surface morphologies of nonpolar and semipolar GaN-based optoelectronic devices such as light-emitting diodes and solar cells.

  8. Structural and optical characteristics of porous InAlGaN prepared by photoelectrochemical etching

    Radzali, R., E-mail: rosfariza074@ppinang.uitm.edu.my [Nano-Optoelectronics Research and Technology Laboratory, School of Physics, Universiti Sains Malaysia, 11800 Penang (Malaysia); Faculty of Electrical Engineering, Universiti Teknologi MARA, Jalan Permatang Pauh, 13500 Permatang Pauh, Pulau Pinang (Malaysia); Hassan, Z., E-mail: zai@usm.my [Nano-Optoelectronics Research and Technology Laboratory, School of Physics, Universiti Sains Malaysia, 11800 Penang (Malaysia); Zainal, N., E-mail: norzaini@usm.my [Nano-Optoelectronics Research and Technology Laboratory, School of Physics, Universiti Sains Malaysia, 11800 Penang (Malaysia); Yam, F.K., E-mail: yamfk@usm.my [Nano-Optoelectronics Research and Technology Laboratory, School of Physics, Universiti Sains Malaysia, 11800 Penang (Malaysia)

    2015-02-15

    Highlights: • Porous InAlGaN was successfully fabricated by photoelectrochemical etching for the first time. • Etching time influenced the pore density and surface roughness of the sample. • Reduction of dislocation density and strain were observed in the porous samples. - Abstract: The effect of etching duration on the porous structure of quaternary III-nitride alloy, InAlGaN prepared using the photoelectrochemical etching technique was evaluated in this study. Field emission scanning electron microscopy (FE-SEM) revealed that the pore density of the sample increased with increased etching duration, as did the root mean square (RMS) roughness, as measured by atomic force microscopy (AFM). The high resolution X-ray diffraction (HR-XRD) rocking curve measurement showed that dislocation density was reduced in samples etched for 15 and 20 min. In the Raman spectra, the InGaN-like E{sub 2}(high) phonon mode of porous InAlGaN samples exhibited red shift characteristic relative to the non-porous sample due to relaxation of compressive stress of the porous sample. These results illustrate that etching duration affects the structural and optical properties of the InAlGaN sample.

  9. Fabrication of porous silicon by metal-assisted etching using highly ordered gold nanoparticle arrays

    Scheeler, Sebastian P.; Ullrich, Simon; Kudera, Stefan; Pacholski, Claudia

    2012-08-01

    A simple method for the fabrication of porous silicon (Si) by metal-assisted etching was developed using gold nanoparticles as catalytic sites. The etching masks were prepared by spin-coating of colloidal gold nanoparticles onto Si. An appropriate functionalization of the gold nanoparticle surface prior to the deposition step enabled the formation of quasi-hexagonally ordered arrays by self-assembly which were translated into an array of pores by subsequent etching in HF solution containing H2O2. The quality of the pattern transfer depended on the chosen preparation conditions for the gold nanoparticle etching mask. The influence of the Si surface properties was investigated by using either hydrophilic or hydrophobic Si substrates resulting from piranha solution or HF treatment, respectively. The polymer-coated gold nanoparticles had to be thermally treated in order to provide a direct contact at the metal/Si interface which is required for the following metal-assisted etching. Plasma treatment as well as flame annealing was successfully applied. The best results were obtained for Si substrates which were flame annealed in order to remove the polymer matrix - independent of the substrate surface properties prior to spin-coating (hydrophilic or hydrophobic). The presented method opens up new resources for the fabrication of porous silicon by metal-assisted etching. Here, a vast variety of metal nanoparticles accessible by well-established wet-chemical synthesis can be employed for the fabrication of the etching masks.

  10. Localized etching of polymer films using an atmospheric pressure air microplasma jet

    Guo, Honglei; Liu, Jingquan; Yang, Bin; Chen, Xiang; Yang, Chunsheng

    2015-01-01

    A direct-write process device based on the atmospheric pressure air microplasma jet (AμPJ) has been developed for the localized etching of polymer films. The plasma was generated by the air discharge ejected out through a tip-nozzle (inner diameter of 100 μm), forming the microplasma jet. The AμPJ was capable of reacting with the polymer surface since it contains a high concentration of oxygen reactive species and thus resulted in the selective removal of polymer films. The experimental results demonstrated that the AμPJ could fabricate different microstructures on a parylene-C film without using any masks or causing any heat damage. The etch rate of parylene-C reached 5.1 μm min-1 and microstructures of different depth and width could also be realized by controlling two process parameters, namely, the etching time and the distance between the nozzle and the substrate. In addition, combining XPS analysis and oxygen-induced chemical etching principles, the potential etching mechanism of parylene-C by the AμPJ was investigated. Aside from the etching of parylene-C, micro-holes on the photoresist and polyimide film were successfully created by the AμPJ. In summary, maskless pattern etching of polymer films could be achieved using this AμPJ.

  11. Multi-layer VEB modeling: capturing interlayer etch process effects for multi-patterning process

    Hu, Lin; Jung, Sunwook; Li, Jianliang; Kim, Young; Bar, Yuval; Lobb, Granger; Liang, Jim; Ogino, Atsushi; Sturtevant, John; Bailey, Todd

    2016-03-01

    Self-Aligned Via (SAV) process is commonly used in back end of line (BEOL) patterning. As the technology node advances, tightening CD and overlay specs require continuous improvement in model accuracy of the SAV process. Traditional single layer Variable Etch Bias (VEB) model is capable of describing the micro-loading and aperture effects associated with the reactive ion etch (RIE), but it does not include effects from under layers. For the SAV etch, a multi-layer VEB model is needed to account for the etch restriction from metal trenches. In this study, we characterize via post-etch dimensions through pitch and through metal trench widths, and show that VEB model prediction accuracy for SAV CDs after SAV formation can be significantly improved by applying a multi-layer scheme. Using a multi-layer VEB, it is demonstrated that the output via size changes with varying trench dimensions, which matches the silicon results. The model also reports via shape post-etch as a function of trench environment, where elliptical vias are correctly produced. The multi-layer VEB model can be applied both multi-layer correction and verification in full chip flow. This paper will also suggest that the multi-layer VEB model can be used in other FEOL layers with interlayer etch process effects, such as gate cut, to support the robustness of new model.

  12. Optical Characterization of Plasma Generated in a Commercial Grade Plasma Etching System

    Hardy, Ashley; Drake, Dereth

    2015-11-01

    The use of plasma for etching and cleaning of many types of metal surfaces is becoming more prominent in industry. This is primarily due to the fact that plasma etching can reduce the amount of time necessary to clean/etch the surface and does not require large amounts of environmentally hazardous chemicals. Most plasma etching systems are designed and built in academic institutions. These systems provide reasonable etching rates and easy accessibility for monitoring plasma parameters. The downside is that the cost is typically high. Recently a number of commercial grade plasma etchers have been introduced on the market. These etching systems cost near a fraction of the price, making them a more economical choice for researchers in the field. However, very few academics use these devices because their effectiveness has not yet been adequately verified in the current literature. We will present the results from experiments performed in a commercial grade plasma etching system, including analysis of the pulse characteristics observed by a photo diode and the plasma parameters obtained with optical emission spectroscopy.

  13. Using an energized oxygen micro-jet for improved graphene etching by focused electron beam

    Kim, Songkil; Henry, Mathias [George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332 (United States); Fedorov, Andrei G., E-mail: agf@gatech.edu [George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332 (United States); Parker H. Petit Institute for Bioengineering and Bioscience, Georgia Institute of Technology, Atlanta, Georgia 30332 (United States)

    2015-12-07

    We report on an improved Focused Electron Beam Induced Etching (FEBIE) process, which exploits heated oxygen delivery via a continuous supersonic micro-jet resulting in faster graphene patterning and better etch feature definition. Positioning a micro-jet in close proximity to a graphene surface with minimal jet spreading due to a continuous regime of gas flow at the exit of the 10 μm inner diameter capillary allows for focused exposure of the surface to reactive oxygen at high mass flux and impingement energy of a supersonic gas stream localized to a small etching area exposed to electron beam. These unique benefits of focused supersonic oxygen delivery to the surface enable a dramatic increase in the etch rate of graphene with no parasitic carbon “halo” deposition due to secondary electrons from backscattered electrons (BSE) in the area surrounding the etched regions. Increase of jet temperature via local nozzle heating provides means for enhancing kinetic energy of impinging oxygen molecules, which further speed up the etch, thus minimizing the beam exposure time and required electron dose, before parasitic carbon film deposition due to BSE mediated decomposition of adsorbed hydrocarbon contaminants has a measurable impact on quality of graphene etched features. Interplay of different physical mechanisms underlying an oxygen micro-jet assisted FEBIE process is discussed with support from experimental observations.

  14. Dopant type and/or concentration selective dry photochemical etching of semiconductor materials

    Ashby, C.R.H.; Dishman, J.L.

    1985-10-11

    Disclosed is a method of selectively photochemically dry etching a first semiconductor material of a given composition in the presence of a second semiconductor material which is of a composition different from said first material, said second material substantially not being etched during said method. The method comprises subjecting both materials to the same photon flux of an energy greater than their respective direct bandgaps and to the same gaseous chemical etchant under conditions where said etchant would be ineffective for chemical etching of either material were the photons not present, said conditions also being such that the resultant electronic structure of the first semiconductor material under said photon flux is sufficient for the first material to undergo substantial photochemical etching under said conditions and being such that the resultant electronic structure of the second semiconductor material under said photon flux is not sufficient for the second material to undergo substantial photochemical etching under said conditions. In a preferred mode, the materials are subjected to a bias voltage which suppresses etching in n- or p-type material but not in p- or n-type material, respectively; or suppresses etching in the more heavily doped of two n-type or two p-type materials.

  15. Dopant type and/or concentration selective dry photochemical etching of semiconductor materials

    Ashby, Carol I. H. (Edgewood, NM); Dishman, James L. (Albuquerque, NM)

    1987-01-01

    A method of selectively photochemically dry etching a first semiconductor material of a given composition in the presence of a second semiconductor material which is of a composition different from said first material, said second material substantially not being etched during said method, comprises subjecting both materials to the same photon flux of an energy greater than their respective direct bandgaps and to the same gaseous chemical etchant under conditions where said etchant would be ineffective for chemical etching of either material were the photons not present, said conditions also being such that the resultant electronic structure of the first semiconductor material under said photon flux is sufficient for the first material to undergo substantial photochemical etching under said conditions and being such that the resultant electronic structure of the second semiconductor material under said photon flux is not sufficient for the second material to undergo substantial photochemical etching under said conditions. In a preferred mode, the materials are subjected to a bias voltage which suppresses etching in n- or p- type material but not in p- or n-type material, respectively; or suppresses etching in the more heavily doped of two n-type or two p-type materials.

  16. Optical Characterization of Chemically Etched Nanoporous Silicon Embedded in Sol-Gel Matrix

    A. S. Al Dwayyan

    2012-01-01

    Full Text Available Nanoporous (NPs silicon fabricated by chemical etching process in HF acid was first separated in tetrahydrofuran (THF solvent and then incorporated into SiO2 matrix. The matrix was prepared by sol gel process in which dimethylformamide (DMF was used as drying chemical control additive (DCCA to form crack-free dried sample. We examined the optical properties of NPs in three medium which are solvent, sol, and dried sol gel. Our observations reveal that absorption spectra of NPs silicon in THF are modified with respect to the spectra in sol gel. Significant stability in PL of NPs silicon in the sol gel is observed. Influence of matrix environment on peaks of NPs is also discussed. Surface morphology is characterized by field emission scanning electron microscopy (FESEM which shows that the NPs silicon in THF is similar to the sol gel but becomes aggregation particle to particle. Presence of Si nanoparticles in THF and sol is confirmed by Transmission electron microscopy (TEM. The NPs silicons have mono dispersive and high crystalline nature with spherical shape of around 5 nm in sizes.

  17. Etching, micro hardness and laser damage threshold studies of a nonlinear optical material L-valine

    Anbuchezhiyan, M.; Ponnusamy, S.; Muthamizhchelvan, C.; Kanakam, C. C.; Singh, S. P.; Pal, P. K.; Datta, P. K.

    2012-04-01

    A nonlinear optical crystal of L-valine was grown from an aqueous solution containing a small amount of phosphoric acid by the slow evaporation method. The grown crystal was characterized by a single crystal X-ray diffraction to determine the unit cell parameters. The powder X-ray diffraction analysis also confirmed the lattice parameters to be a = 9.6687(7) Å, b = 5.2709(4) Å, c = 12.0371(10) Å and β = 90.805(4)°. The results of the Inductively Coupled Plasma Optical Emission Spectrometry (ICPOES) indicate the presence of a small amount of phosphorus in the grown crystal. The Vickers micro hardness test was performed to study the mechanical strength of the crystals. Chemical etching studies were carried out to analyze the dislocation structure. The laser damaged threshold of the grown crystal was measured to be 11.11 GW/cm2 for 10 ns pulse at 1064 nm, which is higher than that of the standard nonlinear optical crystals like KDP. Second harmonic generation of the grown crystals was also 1.44 times that of KDP.

  18. Etch-Tuning and Design of Silicon Nitride Photonic Crystal Reflectors

    Bernard, Simon; Dumont, Vincent; Peter, Yves-Alain; Sankey, Jack C

    2016-01-01

    By patterning a freestanding dielectric membrane into a photonic crystal reflector (PCR), it is possible to resonantly enhance its normal-incidence reflectivity, thereby realizing a thin, single-material mirror. In many PCR applications, the operating wavelength (e.g. that of a low-noise laser or emitter) is not tunable, imposing tolerances on crystal geometry that are not reliably achieved with standard nanolithography. Here we present a gentle technique to finely tune the resonant wavelength of a \\SiN PCR using iterative hydrofluoric acid etches. With little optimization, we achieve a 57-nm-thin photonic crystal having an operating wavelength within 0.15 nm (0.04 resonance linewidths) of our target (1550 nm). Our thin structure exhibits a broader and less pronounced transmission dip than is predicted by plane wave simulations, and we identify two effects leading to these discrepancies, both related to the divergence angle of a collimated laser beam. To overcome this limitation in future devices, we distill ...

  19. Facile and cost-effective fabrication of patternable superhydrophobic surfaces via salt dissolution assisted etching

    Choi, Dongwhi; Yoo, Jaewon; Park, Sang Min; Kim, Dong Sung

    2017-01-01

    Superhydrophobic surfaces with extremely low wettability have attracted attention globally along with their remarkable characteristics such as anti-icing, anti-sticking, and self-cleaning. In this study, a facile and cost-effective approach of fabricating patternable superhydrophobic surfaces, which can be applied on various substrates (including large area and 3D curvilinear substrates), is proposed with a salt-dissolution-assisted etching process. This novel proposal is environmentally benign (entirely water-based and fluorine-free process). The only required ingredients to realize superhydrophobic surfaces are commercially available salt particles, polydimethylsiloxane (PDMS), and water. No expensive equipment or complex process control is needed. The fabricated superhydrophobic surface shows high static contact angle (∼151°) and a low sliding angle (∼6°), which correspond to the standards of superhydrophobicity. This surface also shows corrosive liquids (acid/alkali)-resistant characteristics. Moreover, the self-cleaning ability of the fabricated surfaces is explored. As a proof-of-concept application of the present approach, the spatially controllable superhydrophobic patterns on flat/curvilinear substrates are directly drawn with a minimum feature size of 500 μm without the use of expensive tooling, dies, or lithographic masks.

  20. Effective Light Absorptive Layer Using Mezo-Porous Silicon by Electrochemical Etching

    Kwon, Jae‑Hong; Lee, Soo‑Hong; Ju, Byeong‑Kwon

    2006-04-01

    Porous silicon (PS), an excellent light diffuser, can be used as an antireflective layer that does not need to be coated with other antireflection coating (ARC) materials. PS layers were obtained by electrochemical etching (ECE) anodization of silicon wafers in hydrofluoric acid/ethanol/deionized (DI) water solution (HF/EtOH/H2O). This technique selectively removes Si atoms from the sample surface, forming a PS layer with adjustable optical, electrical, and mechanical properties. A PS layer with optimal antireflection characteristics was obtained for a charge density (Q) of 5.2 C/cm2. The weighted reflectance was reduced from 24 to 4% in the wavelength range from 400 to 1000 nm. The weighted reflectance with optimized PS layers is much less than that with a commercial SiNX ARC on a potassium hydroxide (KOH) pretextured multicrystalline silicon (mc-Si) surface. Therefore, it can be successfully used as an alternative way for the preparation of a PS antireflective layer for a silicon solar cell.