Development, optimisation and characterisation of a radiation hard mixed-signal readout chip for LHCb

International Nuclear Information System (INIS)

Loechner, S.

2006-01-01

The Beetle chip is a radiation hard, 128 channel pipelined readout chip for silicon strip detectors. The front-end consists of a charge-sensitive preamplifier followed by a CR-RC pulse shaper. The analogue pipeline memory is implemented as a switched capacitor array with a maximum latency of 4us. The 128 analogue channels are multiplexed and transmitted off chip in 900ns via four current output drivers. Beside the pipelined readout path, the Beetle provides a fast discrimination of the front-end pulse. Within this doctoral thesis parts of the radiation hard Beetle readout chip for the LHCb experiment have been developed. The overall chip performances like noise, power consumption, input charge rates have been optimised as well as the elimination of failures so that the Beetle fulfils the requirements of the experiment. Furthermore the characterisation of the chip was a major part of this thesis. Beside the detailed measurement of the chip performance, several irradiation tests and an Single Event Upset (SEU) test were performed. A long-time measurement with a silicon strip detector was also part of this work as well as the development and test of a first mass production test setup. The Beetle chip showed no functional failure and only slight degradation in the analogue performance under irradiation of up to 130Mrad total dose. The Beetle chip fulfils all requirements of the vertex detector (VELO), the trigger tracker (TT) and the inner tracker (IT) and is ready for the start of LHCb end of 2007. (orig.)

A Low Mass On-Chip Readout Scheme for Double-Sided Silicon Strip Detectors

Energy Technology Data Exchange (ETDEWEB)

Irmler, C., E-mail: christian.irmler@oeaw.ac.at [HEPHY Vienna – Institute of High Energy Physics of the Austrian Academy of Sciences, Nikolsdorfer Gasse 18, A-1050 Vienna (Austria); Bergauer, T.; Frankenberger, A.; Friedl, M.; Gfall, I. [HEPHY Vienna – Institute of High Energy Physics of the Austrian Academy of Sciences, Nikolsdorfer Gasse 18, A-1050 Vienna (Austria); Higuchi, T. [University of Tokyo, Kavli Institute for Physics and Mathematics of the Universe, 5-1-5 Kashiwanoha, Kashiwa, Chiba 277-8583 (Japan); Ishikawa, A. [Tohoku University, Department of Physics, Aoba Aramaki Aoba-ku, Sendai 980-8578 (Japan); Joo, C. [Seoul National University, High Energy Physics Laboratory, 25-107 Shinlim-dong, Kwanak-gu, Seoul 151-742 (Korea, Republic of); Kah, D.H.; Kang, K.H. [Kyungpook National University, Department of Physics, 1370 Sankyuk Dong, Buk Gu, Daegu 702-701 (Korea, Republic of); Rao, K.K. [Tata Institute of Fundamental Research, Experimental High Energy Physics Group, Homi Bhabha Road, Mumbai 400 005 (India); Kato, E. [Tohoku University, Department of Physics, Aoba Aramaki Aoba-ku, Sendai 980-8578 (Japan); Mohanty, G.B. [Tata Institute of Fundamental Research, Experimental High Energy Physics Group, Homi Bhabha Road, Mumbai 400 005 (India); Negishi, K. [Tohoku University, Department of Physics, Aoba Aramaki Aoba-ku, Sendai 980-8578 (Japan); Onuki, Y.; Shimizu, N. [University of Tokyo, Department of Physics, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-0033 (Japan); Tsuboyama, T. [KEK, 1-1 Oho, Tsukuba, Ibaraki 305-0801 (Japan); Valentan, M. [HEPHY Vienna – Institute of High Energy Physics of the Austrian Academy of Sciences, Nikolsdorfer Gasse 18, A-1050 Vienna (Austria)

2013-12-21

B-factories like the KEKB in Tsukuba, Japan, operate at relatively low energies and thus require detectors with very low material budget in order to minimize multiple scattering. On the other hand, front-end chips with short shaping time like the APV25 have to be placed as close to the sensor strips as possible to reduce the capacitive load, which mainly determines the noise figure. In order to achieve both – minimal material budget and low noise – we developed a readout scheme for double-sided silicon detectors, where the APV25 chips are placed on a flexible circuit, which is glued onto the top side of the sensor. The bottom-side strips are connected by two flexible circuits, which are bent around the edge of the sensor. This so-called “Origami” design will be utilized to build the Silicon Vertex Detector of the Belle II experiment, which will consist of four layers made from ladders with up to five double-sided silicon strip sensors in a row. Each ladder will be supported by two ribs made of a carbon fiber and Airex foam core sandwich. The heat dissipated by the front-end chips will be removed by a highly efficient two-phase CO{sub 2} system. Thanks to the Origami concept, all APV25 chips are aligned in a row and thus can be cooled by a single thin cooling pipe per ladder. We present the concept and the assembly procedure of the Origami chip-on-sensor modules.

A Low Mass On-Chip Readout Scheme for Double-Sided Silicon Strip Detectors

International Nuclear Information System (INIS)

Irmler, C.; Bergauer, T.; Frankenberger, A.; Friedl, M.; Gfall, I.; Higuchi, T.; Ishikawa, A.; Joo, C.; Kah, D.H.; Kang, K.H.; Rao, K.K.; Kato, E.; Mohanty, G.B.; Negishi, K.; Onuki, Y.; Shimizu, N.; Tsuboyama, T.; Valentan, M.

2013-01-01

B-factories like the KEKB in Tsukuba, Japan, operate at relatively low energies and thus require detectors with very low material budget in order to minimize multiple scattering. On the other hand, front-end chips with short shaping time like the APV25 have to be placed as close to the sensor strips as possible to reduce the capacitive load, which mainly determines the noise figure. In order to achieve both – minimal material budget and low noise – we developed a readout scheme for double-sided silicon detectors, where the APV25 chips are placed on a flexible circuit, which is glued onto the top side of the sensor. The bottom-side strips are connected by two flexible circuits, which are bent around the edge of the sensor. This so-called “Origami” design will be utilized to build the Silicon Vertex Detector of the Belle II experiment, which will consist of four layers made from ladders with up to five double-sided silicon strip sensors in a row. Each ladder will be supported by two ribs made of a carbon fiber and Airex foam core sandwich. The heat dissipated by the front-end chips will be removed by a highly efficient two-phase CO 2 system. Thanks to the Origami concept, all APV25 chips are aligned in a row and thus can be cooled by a single thin cooling pipe per ladder. We present the concept and the assembly procedure of the Origami chip-on-sensor modules

Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

Directory of Open Access Journals (Sweden)

M. Elsobky

2017-09-01

Full Text Available Flexible electronics represents an emerging technology with features enabling several new applications such as wearable electronics and bendable displays. Precise and high-performance sensors readout chips are crucial for high quality flexible electronic products. In this work, the design of a CMOS readout circuit for an array of printed strain gauges is presented. The ultra-thin readout chip and the printed sensors are combined on a thin Benzocyclobutene/Polyimide (BCB/PI substrate to form a Hybrid System-in-Foil (HySiF, which is used as an electronic skin for robotic applications. Each strain gauge utilizes a Wheatstone bridge circuit, where four Aerosol Jet® printed meander-shaped resistors form a full-bridge topology. The readout chip amplifies the output voltage difference (about 5 mV full-scale swing of the strain gauge. One challenge during the sensor interface circuit design is to compensate for the relatively large dc offset (about 30 mV at 1 mA in the bridge output voltage so that the amplified signal span matches the input range of an analog-to-digital converter (ADC. The circuit design uses the 0. 5 µm mixed-signal GATEFORESTTM technology. In order to achieve the mechanical flexibility, the chip fabrication is based on either back thinned wafers or the ChipFilmTM technology, which enables the manufacturing of silicon chips with a thickness of about 20 µm. The implemented readout chip uses a supply of 5 V and includes a 5-bit digital-to-analog converter (DAC, a differential difference amplifier (DDA, and a 10-bit successive approximation register (SAR ADC. The circuit is simulated across process, supply and temperature corners and the simulation results indicate excellent performance in terms of circuit stability and linearity.

Test and improvement of readout system based on APV25 chip for GEM detector

International Nuclear Information System (INIS)

Hu Shouyang; Jian Siyu; Zhou Jing; Shan Chao; Li Xinglong; Li Xia; Li Xiaomei; Zhou Yi

2014-01-01

Gas electron multiplier (GEM) is the most promising position sensitive gas detector. The new generation of readout electronics system includes APV25 front-end card, multi-purpose digitizer (MPD), VME controller and Linux-based acquisition software DAQ. The construction and preliminary test of this readout system were finished, and the ideal data with the system working frequency of 40 MHz and 20 MHz were obtained. The long time running test shows that the system has a very good time-stable ability. Through optimizing the software configuration and improving hardware quality, the noise level was reduced, and the signal noise ratio was improved. (authors)

Radiation effects on the Viking-2 preamplifier-readout chip

International Nuclear Information System (INIS)

Fallot-Burghardt, W.; Hawblitzel, C.; Hofmann, W.; Knoepfle, K.T.; Seeger, M.; Brenner, R.; Nygaard, E.; Rudge, A.; Toker, O.; Weilhammer, P.; Yoshioka, K.

1994-01-01

We have studied the radiation sensitivity of the Viking-2 VLSI circuit which has been designed for the readout of silicon strip detectors and manufactured at Mietec in 1.5 μm CMOS technology. Both biased and unbiased chips have been irradiated with a 137 Cs γ source up to a total dose of 2 kGy (200 krad) after which all tested chips were still fully functional. We report the characteristic changes of device parameters with dose, including equivalent noise charge for different capacitive loads, and determine transistor threshold shifts and change of mobilities. ((orig.))

SEU tolerant memory design for the ATLAS pixel readout chip

International Nuclear Information System (INIS)

Menouni, M; Barbero, M; Breugnon, P; Fougeron, D; Gensolen, F; Arutinov, D; Backhaus, M; Gonella, L; Hemperek, T; Karagounis, M; Beccherle, R; Darbo, G; Caminada, L; Dube, S; Fleury, J; Garcia-Sciveres, M; Gnani, D; Jensen, F; Gromov, V; Kluit, R

2013-01-01

The FE-I4 chip for the B-layer upgrade is designed in a 130 nm CMOS process. For this design, configuration memories are based on the DICE latches where layout considerations are followed to improve the tolerance to SEU. Tests have shown that DICE latches for which layout approaches are adopted are 30 times more tolerant to SEU than the standard DICE latches. To prepare for the new pixel readout chip planned for the future upgrades, a prototype chip containing 512 pixels has been designed in a 65 nm CMOS process and a new approach is adopted for SEU tolerant latches. Results in terms of SEU and TID tolerance are presented.

A self-adjusting delay circuit for pixel read-out chips

International Nuclear Information System (INIS)

Raith, B.

1997-01-01

A simple concept for automatic adjustment of important VLSI-circuit properties was proposed in (Fischer and Joens, Nucl. Instr. and. Meth.). As an application, a self-adjusting monoflop is reviewed, and detailed measurements are discussed regarding a possible implementation in the LHC 1 read-out chip for the ATLAS experiment (ATLAS Internal Note, 1995). (orig.)

Integration of the Omega-3 readout chip into a high energy physics experimental data acquisition system

International Nuclear Information System (INIS)

Beker, H.; Chesi, E.; Martinengo, P.

1997-01-01

The Omega-3 readout chip is presented in detail elsewhere in the same proceedings. We here describe the integration of the chip into present and future experiments describing both hardware and software aspects. We cover preliminary tests in the laboratory and on the beam. The WA97 experiment has already used a pixel telescope in the past and intends to upgrade to the Omega-3 chip. A newly proposed experiment at CERN studying strangeness production in heavy ion collisions also plans to use a similar telescope. Finally, we give an outlook on the ongoing developments in the pixel readout architecture in the context of ALICE, the heavy ion experiment at the LHC collider. (orig.)

Fast readout of the COMPASS RICH CsI-MWPC chambers

CERN Document Server

Abbon, P; Deschampbs, H; Kunne, F; Gerasimov, S; Ketzer, B; Konorov, I; Kravtchuk, N; Magnon, A; Neyret, D; Panebianco, S; Paul, S; Rebourgeard, P; Tessaroto, F

2006-01-01

A new readout system for CsI-coated MWPCs, used in the COMPASS RICH detector, has been proposed and tested in nominal high-rate conditions. It is based on the APV25-S1 analog sampling chip, and will replace the Gassiplex chip readout used up to now. The APV chip, originally designed for silicon microstrip detectors, is shown to perform well even with “slow” signals from a MWPC, keeping a signal-to-noise ratio of 9. For every trigger the system reads three consecutive in-time samples, thus allowing to extract information on the signal shape and its timing. The effective time window is reduced from ∼3 μs for the Gassiplex to below 400 ns for the APV25-S1 chip, reducing pile-up events at high particle rate. A significant improvement of the signal-to-background ratio by a factor 5–6 with respect to the original readout has been measured in the central region of the RICH detector. Due to its pipelined architecture, the new readout system also considerably reduces the dead time per event, allowing efficien...

LSST camera readout chip ASPIC: test tools

Science.gov (United States)

Antilogus, P.; Bailly, Ph; Jeglot, J.; Juramy, C.; Lebbolo, H.; Martin, D.; Moniez, M.; Tocut, V.; Wicek, F.

2012-02-01

The LSST camera will have more than 3000 video-processing channels. The readout of this large focal plane requires a very compact readout chain. The correlated ''Double Sampling technique'', which is generally used for the signal readout of CCDs, is also adopted for this application and implemented with the so called ''Dual Slope integrator'' method. We have designed and implemented an ASIC for LSST: the Analog Signal Processing asIC (ASPIC). The goal is to amplify the signal close to the output, in order to maximize signal to noise ratio, and to send differential outputs to the digitization. Others requirements are that each chip should process the output of half a CCD, that is 8 channels and should operate at 173 K. A specific Back End board has been designed especially for lab test purposes. It manages the clock signals, digitizes the analog differentials outputs of ASPIC and stores data into a memory. It contains 8 ADCs (18 bits), 512 kwords memory and an USB interface. An FPGA manages all signals from/to all components on board and generates the timing sequence for ASPIC. Its firmware is written in Verilog and VHDL languages. Internals registers permit to define various tests parameters of the ASPIC. A Labview GUI allows to load or update these registers and to check a proper operation. Several series of tests, including linearity, noise and crosstalk, have been performed over the past year to characterize the ASPIC at room and cold temperature. At present, the ASPIC, Back-End board and CCD detectors are being integrated to perform a characterization of the whole readout chain.

LSST camera readout chip ASPIC: test tools

International Nuclear Information System (INIS)

Antilogus, P; Bailly, Ph; Juramy, C; Lebbolo, H; Martin, D; Jeglot, J; Moniez, M; Tocut, V; Wicek, F

2012-01-01

The LSST camera will have more than 3000 video-processing channels. The readout of this large focal plane requires a very compact readout chain. The correlated ''Double Sampling technique'', which is generally used for the signal readout of CCDs, is also adopted for this application and implemented with the so called ''Dual Slope integrator'' method. We have designed and implemented an ASIC for LSST: the Analog Signal Processing asIC (ASPIC). The goal is to amplify the signal close to the output, in order to maximize signal to noise ratio, and to send differential outputs to the digitization. Others requirements are that each chip should process the output of half a CCD, that is 8 channels and should operate at 173 K. A specific Back End board has been designed especially for lab test purposes. It manages the clock signals, digitizes the analog differentials outputs of ASPIC and stores data into a memory. It contains 8 ADCs (18 bits), 512 kwords memory and an USB interface. An FPGA manages all signals from/to all components on board and generates the timing sequence for ASPIC. Its firmware is written in Verilog and VHDL languages. Internals registers permit to define various tests parameters of the ASPIC. A Labview GUI allows to load or update these registers and to check a proper operation. Several series of tests, including linearity, noise and crosstalk, have been performed over the past year to characterize the ASPIC at room and cold temperature. At present, the ASPIC, Back-End board and CCD detectors are being integrated to perform a characterization of the whole readout chain.

Performance of the CAMEX64 silicon strip readout chip

International Nuclear Information System (INIS)

Yarema, R.J.

1989-06-01

The CAMEX64 is a 64 channel full custom CMOS chip designed specifically for the readout of silicon strip detectors. CAMEX which stands for CMOS Multichannel Analog MultiplEXer for Silicon Strip Detectors was designed by members of the Franhofer Institute for Microelectronic Circuits and Systems and the Max Planck Institute for Physics and Astrophysics. Each CAMEX channel has a switched capacitor charge sensitive amplifier with 4 sampling capacitors and a multiplexing scheme for reading out each of the channels on an analog bus. The device uses multiple sampling capacitors to filter and reduce input noise. Filtering is controlled through sampling techniques using external clocks. The device operates in a double correlated sampling mode and therefore cannot separate detector leakage current from a charge input. Normal operation of this device is similar to all other silicon readout chips designed and built thus far in that there is a data acquisition cycle during which charge is simultaneously accepted on all channels for a short period of time from a detector array, followed by a readout cycle where that charge or hit information is read out. This device works especially well for colliding beam experiments where the time of charge arrival is accurately known. However it can be used in fixed target or asynchronous mode where the time of charge arrival is not well known. In the asynchronous mode it appears that gain is somewhat dependent on the time interval required to decide whether or not to accept charge input information and thus the maximum signal to noise performance found with the synchronous mode may not be achieved in the asynchronous mode. 18 figs., 5 tabs

A prototype pixel readout chip for asynchronous detection applications

International Nuclear Information System (INIS)

Raymond, D.M.; Hall, G.; Lewis, A.J.; Sharp, P.H.

1991-01-01

A two-dimensional array of amplifier cells has been fabricated as a prototype readout system for a matching array of silicon diode detectors. Each cell contains a preamplifier, shaping amplifier, comparator and analogue signal storage in an area of 300 μmx320 μm using 3 μm CMOS technology. Full size chips will be bump bonded to pixel detector arrays. Low noise and asynchronous operation are novel design features. With noise levels of less than 250 rms electrons for input capacitances up to 600 fF, pixel detectors will be suitable for autoradiography, synchrotron X-ray and high energy particle detection applications. The design of the prototype chip is presented and future developments and prospects for applications are discussed. (orig.)

Fast readout of the COMPASS RICH CsI-MWPC photon chambers

International Nuclear Information System (INIS)

Abbon, P.; Delagnes, E.; Deschamps, H.; Kunne, F.; Gerasimov, S.; Ketzer, B.; Konorov, I.; Kravtchuk, N.; Magnon, A.; Neyret, D.; Panebianco, S.; Paul, S.; Rebourgeard, P.; Tessaroto, F.

2006-01-01

A new readout system for CsI-coated MWPCs, used in the COMPASS RICH detector, has been proposed and tested in nominal high-rate conditions. It is based on the APV25-S1 analog sampling chip, and will replace the Gassiplex chip readout used up to now. The APV chip, originally designed for silicon microstrip detectors, is shown to perform well even with 'slow' signals from a MWPC, keeping a signal-to-noise ratio of 9. For every trigger the system reads three consecutive in-time samples, thus allowing to extract information on the signal shape and its timing. The effective time window is reduced from ∼3 μs for the Gassiplex to below 400 ns for the APV25-S1 chip, reducing pile-up events at high particle rate. A significant improvement of the signal-to-background ratio by a factor 5-6 with respect to the original readout has been measured in the central region of the RICH detector. Due to its pipelined architecture, the new readout system also considerably reduces the dead time per event, allowing efficient data taking at higher trigger rate

arXiv Characterization and Verification Environment for the RD53A Pixel Readout Chip in 65 nm CMOS

CERN Document Server

Vogt, M.; Hemperek, T.; Janssen, J.; Pohl, D.L.; Daas, M.

2018-02-02

The RD53 collaboration is currently designing a large scale prototype pixel readout chip in 65 nm CMOS technology for the phase 2 upgrades at the HL-LHC. The RD53A chip will be available by the end of the year 2017 and will be extensively tested to confirm if the circuit and the architecture make a solid foundation for the final pixel readout chips for the experiments at the HL-LHC. A test and data acquisition system for the RD53A chip is currently under development to perform single-chip and multi-chip module measurements. In addition, the verification of the RD53A design is performed in a dedicated simulation environment. The concept and the implementation of the test and data acquisition system and the simulation environment, which are based on a modular data acquisition and system testing framework, are presented in this work.

A One-Dimensional Magnetic Chip with a Hybrid Magnetosensor and a Readout Circuit

Directory of Open Access Journals (Sweden)

Guo-Ming Sung

2018-01-01

Full Text Available This work presents a one-dimensional magnetic chip composed of a hybrid magnetosensor and a readout circuit, which were fabricated with 0.18 μm 1P6M CMOS technology. The proposed magnetosensor includes a polysilicon cross-shaped Hall plate and two separated metal-oxide semiconductor field-effect transistors (MOSFETs to sense the magnetic induction perpendicular to the chip surface. The readout circuit, which comprises a current-to-voltage converter, a low-pass filter, and an instrumentation amplifier, is designed to amplify the output Hall voltage with a gain of 43 dB. Furthermore, a SPICE macro model is proposed to predict the sensor’s performance in advance and to ensure sufficient comprehension of the magnetic mechanism of the proposed magnetosensor. Both simulated and measured results verify the correctness and flexibility of the proposed SPICE macro model. Measurements reveal that the maximum output Hall voltage VH, the optimum current-related magnetosensitivity SRI, the optimum voltage-related magnetosensitivity SRV, the averaged nonlinearity error NLE, and the relative bias current Ibias are 4.381 mV, 520.5 V/A·T, 40.04 V/V·T, 7.19%, and 200 μA, respectively, for the proposed 1-D magnetic chip with a readout circuit of 43 dB. The averaged NLE is small at high magnetic inductions of ±30 mT, whereas it is large at low magnetic inductions of ±30 G.

Radiation induced effects in the \\\\ATLAS Insertable B-Layer readout chip

CERN Document Server

The ATLAS collaboration

2017-01-01

The ATLAS Insertable B-Layer is the innermost pixel barrel layer of the ATLAS detector installed in 2014. During the first year of $pp$ collisions at $\\sqrt{s} = 13~{\\rm TeV}$ in 2015, an unusual increase was observed in the low voltage currents of the readout chips. This increase was found to be due to radiation damage to the chips. The dependence of the current on the total ionising dose and temperature has been studied using X-ray and proton beam sources, and will be presented in this note together with its possible parametrisation and operation guidelines for the detector.

Single event upset studies on the CMS tracker APV25 readout chip

International Nuclear Information System (INIS)

Noah, E.; Bauer, T.; Bisello, D.; Faccio, F.; Friedl, M.; Fulcher, J.R.; Hall, G.; Huhtinen, M.; Kaminsky, A.; Pernicka, M.; Raymond, M.; Wyss, J.

2002-01-01

The microstrip tracker for the CMS experiment at the CERN Large Hadron Collider will be read out using APV25 chips. During high luminosity running the tracker will be exposed to particle fluxes up to 10 7 cm -2 s -1 , which raises concerns that the APV25 could occasionally suffer Single Event Upsets (SEUs). The effect of SEU on the APV25 has been studied to investigate implications for CMS detector operation and from the viewpoint of detailed circuit operation, to improve the understanding of its origin and what factors affect its magnitude. Simulations were performed to reconstruct the effects created by highly ionising particles striking sensitive parts of the circuits, along with consideration of the underlying mechanisms of charge deposition, collection and the consequences. A model to predict the behaviour of the memory circuits in the APV25 has been developed and data collected from dedicated experiments using both heavy ions and hadrons have been shown to support it

MAROC, a generic photomultiplier readout chip

Science.gov (United States)

Blin, S.; Barrillon, P.; de La Taille, C.

2010-12-01

The MAROC ASICs family is dedicated to the readout of 64-channel Multi Anode PMT and similar detectors. Its main roles are to correct the gain spread of MAPMT channels thanks to an individual variable gain preamplifier and to discriminate the input signals (from 50fC i.e 1/3 photo-electron) in order to produce 64 trigger outputs. A multiplexed analog charge output is also available with a dynamic range around 10 pe ( ~ 1.6 pC) and a 12 bit Wilkinson ADC is embedded. Three versions of this chip have been submitted. MAROC 2 is the production version for the ATLAS luminometer and MAROC3 is a version with lower dissipation and significant improvements concerning the charge (30 pe: ~ 5 pC) and trigger (discrimination from 10fC). This third version showed very good characteristics that are presented here.

FE-I2 a front-end readout chip designed in a commercial 025- mu m process for the ATLAS pixel detector at LHC

CERN Document Server

Blanquart, L; Einsweiler, Kevin F; Fischer, P; Mandelli, E; Meddeler, G; Peric, I

2004-01-01

A new front-end chip (FE-I2) has been developed for the ATLAS pixel detector at the future Large Hadron Collider (LHC) accelerator facility of the European Laboratory for Particle Physics (CERN). This chip has been submitted in a commercial 0.25- mu m CMOS process using special layout techniques for radiation tolerance. It comprises 2880 pixels arranged into 18 columns of 160 channels. Each pixel element of dimension 50 mu m * 400 mu m is composed of a charge- sensitive amplifier followed by a fast discriminator with a detection threshold adjustable within a range of 0-6000 electrons and slow control logic incorporating a wired-hit-Or, preamplifier-kill, readout mask, and automatic threshold tuning circuitry. There are two single-event- upset (SEU)-tolerant DACs for reducing threshold (7-b) and recovery- time (3-b) mismatches from pixel to pixel along with digital hit emulation and a differential readout circuit aimed at transporting time-stamped data from each pixel to buffers at the bottom of the chip. In c...

MAROC, a generic photomultiplier readout chip

Energy Technology Data Exchange (ETDEWEB)

Blin, S; Barrillon, P; La Taille, C de, E-mail: blin@lal.in2p3.f [CNRS/IN2p3/LAL-OMEGA, Universite Paris Sud, Bat.200, 91898 Orsay (France)

2010-12-15

The MAROC ASICs family is dedicated to the readout of 64-channel Multi Anode PMT and similar detectors. Its main roles are to correct the gain spread of MAPMT channels thanks to an individual variable gain preamplifier and to discriminate the input signals (from 50fC i.e 1/3 photo-electron) in order to produce 64 trigger outputs. A multiplexed analog charge output is also available with a dynamic range around 10 pe ( {approx} 1.6 pC) and a 12 bit Wilkinson ADC is embedded. Three versions of this chip have been submitted. MAROC 2 is the production version for the ATLAS luminometer and MAROC3 is a version with lower dissipation and significant improvements concerning the charge (30 pe: {approx} 5 pC) and trigger (discrimination from 10fC). This third version showed very good characteristics that are presented here.

MAROC, a generic photomultiplier readout chip

International Nuclear Information System (INIS)

Blin, S; Barrillon, P; La Taille, C de

2010-01-01

The MAROC ASICs family is dedicated to the readout of 64-channel Multi Anode PMT and similar detectors. Its main roles are to correct the gain spread of MAPMT channels thanks to an individual variable gain preamplifier and to discriminate the input signals (from 50fC i.e 1/3 photo-electron) in order to produce 64 trigger outputs. A multiplexed analog charge output is also available with a dynamic range around 10 pe ( ∼ 1.6 pC) and a 12 bit Wilkinson ADC is embedded. Three versions of this chip have been submitted. MAROC 2 is the production version for the ATLAS luminometer and MAROC3 is a version with lower dissipation and significant improvements concerning the charge (30 pe: ∼ 5 pC) and trigger (discrimination from 10fC). This third version showed very good characteristics that are presented here.

Evaluation of the x-ray response of a position-sensitive microstrip detector with an integrated readout chip

International Nuclear Information System (INIS)

Rossington, C.; Jaklevic, J.; Haber, C.; Spieler, H.; Reid, J.

1990-08-01

The performance of an SVX silicon microstrip detector and its compatible integrated readout chip have been evaluated in response to Rh Kα x-rays (average energy 20.5 keV). The energy and spatial discrimination capabilities, efficient data management and fast readout rates make it an attractive alternative to the CCD and PDA detectors now being offered for x-ray position sensitive diffraction and EXAFS work. The SVX system was designed for high energy physics applications and thus further development of the existing system is required to optimize it for use in practical x-ray experiments. For optimum energy resolution the system noise must be decreased to its previously demonstrated low levels of 2 keV FWHM at 60 keV or less, and the data handling rate of the computer must be increased. New readout chips are now available that offer the potential of better performance. 15 refs., 7 figs

Readout electronic for multichannel detectors

CERN Document Server

Kulibaba, V I; Naumov, S V

2001-01-01

Readout electronics based on the 128-channel chip 'Viking' (IDE AS inc., Norway) is considered. The chip 'Viking' integrates 128 low noise charge-sensitive preamplifiers with tunable CR-(RC) sup 2 shapers,analog memory and multiplexed readout to one output. All modules of readout electronics were designed and produced in KIPT taking into account the published recommendations of IDE AS inc.

Readout electronic for multichannel detectors

International Nuclear Information System (INIS)

Kulibaba, V.I.; Maslov, N.I.; Naumov, S.V.

2001-01-01

Readout electronics based on the 128-channel chip 'Viking' (IDE AS inc., Norway) is considered. The chip 'Viking' integrates 128 low noise charge-sensitive preamplifiers with tunable CR-(RC) 2 shapers,analog memory and multiplexed readout to one output. All modules of readout electronics were designed and produced in KIPT taking into account the published recommendations of IDE AS inc

Development of Micromegas-like gaseous detectors using a pixel readout chip as collecting anode

International Nuclear Information System (INIS)

Chefdeville, M.

2009-01-01

This thesis reports on the fabrication and test of a new gaseous detector with a very large number of readout channels. This detector is intended for measuring the tracks of charged particles with an unprecedented sensitivity to single electrons of almost 100 %. It combines a metal grid for signal amplification called the Micromegas with a pixel readout chip as signal collecting anode and is dubbed GridPix. GridPix is a potential candidate for a sub-detector at a future electron linear collider (ILC) foreseen to work in parallel with the LHC around 2020--2030. The tracking capability of GridPix is best exploited if the Micromegas is integrated on the pixel chip. This integrated grid is called InGrid and is precisely fabricated by wafer post-processing. The various steps of the fabrication process and the measurements of its gain, energy resolution and ion back-flow property are reported in this document. Studies of the response of the complete detector formed by an InGrid and a TimePix pixel chip to X-rays and cosmic particles are also presented. In particular, the efficiency for detecting single electrons and the point resolution in the pixel plane are measured. Implications for a GridPix detector at ILC are discussed. (author)

Programmable System-on-Chip (PSoC) Embedded Readout Designs for Liquid Helium Level Sensors.

Science.gov (United States)

Parasakthi, C; Gireesan, K; Usha Rani, R; Sheela, O K; Janawadkar, M P

2014-08-01

This article reports the development of programmable system-on-chip (PSoC)-based embedded readout designs for liquid helium level sensors using resistive liquid vapor discriminators. The system has been built for the measurement of liquid helium level in a concave-bottomed, helmet-shaped, fiber-reinforced plastic cryostat for magnetoencephalography. This design incorporates three carbon resistors as cost-effective sensors, which are mounted at desired heights inside the cryostat and were used to infer the liquid helium level by measuring their temperature-dependent resistance. Localized electrical heating of the carbon resistors was used to discriminate whether the resistor is immersed in liquid helium or its vapor by exploiting the difference in the heat transfer rates in the two environments. This report describes a single PSoC chip for the design and development of a constant current source to drive the three carbon resistors, a multiplexer to route the sensor outputs to the analog-to-digital converter (ADC), a buffer to avoid loading of the sensors, an ADC for digitizing the data, and a display using liquid crystal display cum light-emitting diode modules. The level sensor readout designed with a single PSoC chip enables cost-effective and reliable measurement system design. © 2014 Society for Laboratory Automation and Screening.

Flip chip assembly of thinned chips for hybrid pixel detector applications

International Nuclear Information System (INIS)

Fritzsch, T; Zoschke, K; Rothermund, M; Oppermann, H; Woehrmann, M; Ehrmann, O; Lang, K D; Huegging, F

2014-01-01

There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump deposition process the glass-readout chip stack is diced in one step. Finally the glass carrier chip is released by laser illumination after flip chip assembly of the readout chip onto sensor tile. The results of the flip chip assembly process development for the ATLAS IBL upgrade are described more in detail. The new ATLAS FEI4B chip with a size of 20 × 19 mm 2 is flip chip bonded with a thickness of only 150 μm, but the capability of this technology has been demonstrated on hybrid modules with a reduced readout chip thickness of down to 50 μm which is a major step for ultra-thin electronic systems

Results of FE65-P2 Pixel Readout Test Chip for High Luminosity LHC Upgrades

CERN Document Server

AUTHOR|(SzGeCERN)394193

2016-01-01

A pixel readout test chip called FE65-P2 has been fabricated on 65 nm CMOS technology. FE65-P2 contains a matrix of 64 x 64 pixels on 50 micron by 50 micron pitch, designed to read out a bump bonded sensor. The goals of FE65-P2 are to demonstrate excellent analog performance isolated from digital activity well enough to achieve 500 electron stable threshold, be radiation hard to at least 500 Mrad, and prove the novel concept of isolated analog front ends embedded in a flat digital design, dubbed “analog islands in a digital sea”. Experience from FE65-P2 and hybrid assemblies will be applied to the design for a large format readout chip, called RD53A, to be produced in a wafer run in early 2017 by the RD53 collaboration. We review the case for 65 nm technology and report on threshold stability test results for the FE65-P2.

The readout system of the new H1 silicon detectors

International Nuclear Information System (INIS)

Buerger, J.; Hansen, K.; Lange, W.; Prell, S.; Zimmermann, W.; Henschel, H.; Haynes, W.J.; Noyes, G.W.; Joensson, L.; Gabathuler, K.; Horisberger, R.; Wagener, M.; Eichler, R.; Erdmann, W.; Niggli, H.; Pitzl, D.

1995-03-01

The H1 detector at HERA at DESY undergoes presently a major upgrade. In this context silicon strip detectors have been installed at beginning of 1995. The high bunch crossing frequency of HERA (10.4 MHz) demands a novel readout architecture which includes pipelining, signal processing and data reduction at a very early stage. The front end readout is hierarchically organized. The detector elements are read out by the APC chip which contains an analog pipeline and performs first background subtraction. Up to five readout chips are controlled by a Decoder Chip. The readout processor module (OnSiRoC) operates the detectors, controls the Decoder Chips and performs a first level data reduction. The paper describes the readout architecture of the H1 Silicon Detectors and performance data of the complete readout chain. (orig.)

Spectroscopy study of imaging devices based on silicon Pixel Array Detector coupled to VATAGP7 read-out chips

International Nuclear Information System (INIS)

Linhart, V; Lacasta, C; Llosa, G; Stankova, V; Burdette, D; Chessi, E; Cochran, E; Honscheid, K; Kagan, H; Weilhammer, P; Cindro, V; Grosicar, B; Mikuz, M; Studen, A; Zontar, D; Clinthorne, N H

2011-01-01

Spectroscopic and timing response studies have been conducted on a detector module consisting of a silicon Pixel Array Detector bonded on two VATAGP7 read-out chips manufactured by Gamma-Medica Ideas using laboratory gamma sources and the internal calibration facilities (the calibration system of the read-out chips). The performed tests have proven that the chips have (i) non-linear calibration curves which can be approximated by power functions, (ii) capability to measure the energy of photons with energy resolution better than 2 keV (exact range and resolution depend on experimental setup), (iii) the internal calibration facility which provides 6 out of 16 available internal calibration charges within our region of interest (spanning the Compton edge of 511 keV photons). The peaks induced by the internal calibration facility are suitable for a fit of the calibration curves. However, they are not suitable for measurements of equivalent noise charge because their full width at half maximum varies with their amplitude. These facts indicate that the VATAGP7 chips are useful and precise tools for a wide variety of spectroscopic devices. We have also explored time walk of the module and peaking time of the spectroscopy signals provided by the chips. We have observed that (iv) the time walk is caused partly by the peaking time of the signals provided by the fast shaper of the chips and partly by the timing uncertainty related to the varying position of the photon interaction, (v) the peaking time of the spectroscopy signals provided by the chips increases with increasing pulse height.

Characterisation of strip silicon detectors for the ATLAS Phase-II Upgrade with a micro-focused X-ray beam

Science.gov (United States)

Poley, L.; Blue, A.; Bates, R.; Bloch, I.; Díez, S.; Fernandez-Tejero, J.; Fleta, C.; Gallop, B.; Greenall, A.; Gregor, I.-M.; Hara, K.; Ikegami, Y.; Lacasta, C.; Lohwasser, K.; Maneuski, D.; Nagorski, S.; Pape, I.; Phillips, P. W.; Sperlich, D.; Sawhney, K.; Soldevila, U.; Ullan, M.; Unno, Y.; Warren, M.

2016-07-01

The planned HL-LHC (High Luminosity LHC) in 2025 is being designed to maximise the physics potential through a sizable increase in the luminosity up to 6·1034 cm-2s-1. A consequence of this increased luminosity is the expected radiation damage at 3000 fb-1 after ten years of operation, requiring the tracking detectors to withstand fluences to over 1·1016 1 MeV neq/cm2. In order to cope with the consequent increased readout rates, a complete re-design of the current ATLAS Inner Detector (ID) is being developed as the Inner Tracker (ITk). Two proposed detectors for the ATLAS strip tracker region of the ITk were characterized at the Diamond Light Source with a 3 μm FWHM 15 keV micro focused X-ray beam. The devices under test were a 320 μm thick silicon stereo (Barrel) ATLAS12 strip mini sensor wire bonded to a 130 nm CMOS binary readout chip (ABC130) and a 320 μm thick full size radial (end-cap) strip sensor - utilizing bi-metal readout layers - wire bonded to 250 nm CMOS binary readout chips (ABCN-25). A resolution better than the inter strip pitch of the 74.5 μm strips was achieved for both detectors. The effect of the p-stop diffusion layers between strips was investigated in detail for the wire bond pad regions. Inter strip charge collection measurements indicate that the effective width of the strip on the silicon sensors is determined by p-stop regions between the strips rather than the strip pitch.

Radiation and Temperature Effects on the APV25 Readout Chip for the CMS Tracker

CERN Document Server

Messomo, Etam Albert Noah

2002-01-01

The Compact Muon Solenoid (CMS) is one of four particle detectors designed for use at the Large Hadron Collider (LHC) currently under construction at CERN, the European Laboratory for Particle Physics in Geneva. The LHC will accelerate two counterrotating beams of protons to energies of 7 TeV and produce 109 proton-proton collisions per second at a bunch-crossing frequency of 40 MHz. These collisions occuring at the centre of CMS will generate a very hostile radiation environment. The CMS sub-detector system closest to the collision point is the highly segmented Tracker, consisting of a silicon pixel detector with 45 million channels and a silicon microstrip detector with 10 million channels. The microstrip detector will be read out by the APV25, a custom-made chip manufactured in a commercial 0.25 µm CMOS microelectronics process. Radiation and temperature studies are required to ensure that the APV25 can operate reliably in the CMS environment. The radiation effects to which the APV25 could be susceptible ...

Frequency multiplexing for readout of spin qubits

Energy Technology Data Exchange (ETDEWEB)

Hornibrook, J. M.; Colless, J. I.; Mahoney, A. C.; Croot, X. G.; Blanvillain, S.; Reilly, D. J., E-mail: david.reilly@sydney.edu.au [ARC Centre of Excellence for Engineered Quantum Systems, School of Physics, University of Sydney, Sydney, NSW 2006 (Australia); Lu, H.; Gossard, A. C. [Materials Department, University of California, Santa Barbara, California 93106 (United States)

2014-03-10

We demonstrate a low loss, chip-level frequency multiplexing scheme for readout of scaled-up spin qubit devices. By integrating separate bias tees and resonator circuits on-chip for each readout channel, we realise dispersive gate-sensing in combination with charge detection based on two radio frequency quantum point contacts. We apply this approach to perform multiplexed readout of a double quantum dot in the few-electron regime and further demonstrate operation of a 10-channel multiplexing device. Limitations for scaling spin qubit readout to large numbers of multiplexed channels are discussed.

Characterisation of capacitively coupled HV/HR-CMOS sensor chips for the CLIC vertex detector

Science.gov (United States)

Kremastiotis, I.

2017-12-01

The capacitive coupling between an active sensor and a readout ASIC has been considered in the framework of the CLIC vertex detector study. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is a High-Voltage CMOS sensor chip produced in a commercial 180 nm HV-CMOS process for this purpose. The sensor was designed to be connected to the CLICpix2 readout chip. It therefore matches the dimensions of the readout chip, featuring a matrix of 128×128 square pixels with 25μm pitch. The sensor chip has been produced with the standard value for the substrate resistivity (~20 Ωcm) and it has been characterised in standalone testing mode, before receiving and testing capacitively coupled assemblies. The standalone measurement results show a rise time of ~20 ns for a power consumption of 5μW/pixel. Production of the C3PD HV-CMOS sensor chip with higher substrate resistivity wafers (~20, 80, 200 and 1000 Ωcm) is foreseen. The expected benefits of the higher substrate resistivity will be studied using future assemblies with the readout chip.

Latest generation of ASICs for photodetector readout

Science.gov (United States)

Seguin-Moreau, N.

2013-08-01

The OMEGA microelectronics group has designed a new generation of multichannel integrated circuits, the "ROC" family, in AustrianMicroSystem (AMS) SiGe 0.35 μm technology to read out signals from various families of photodetectors. The chip named MAROC (standing for Multi Anode ReadOut Chip) has been designed to read out MultiAnode Photomultipliers (MAPMT), Photomultiplier ARray In SiGe ReadOut Chip (PARISROC) to read out Photomultipliers (PMTs) and SiPM Integrated ReadOut Chip (SPIROC) to readout Silicon PhotoMultiplier (SiPM) detectors and which was the first ASIC to do so. The three of them fulfill the stringent requirements of the future photodetectors, in particular in terms of low noise, radiation hardness, large dynamic range, high density and high speed while keeping low power thanks to the SiGe technology. These multi-channel ASICs are real System on Chip (SoC) as they provide charge, time and photon-counting information which are digitized internally. Their complexity and versatility enable innovative frontier detectors and also cover spin off of these detectors in adjacent fields such as medical or material imaging as well as smart detectors. In this presentation, the three ASIC architectures and test results will be described to give a general panorama of the "ROC" chips.

Latest generation of ASICs for photodetector readout

Energy Technology Data Exchange (ETDEWEB)

Seguin-Moreau, N., E-mail: seguin@lal.in2p3.fr [Laboratoire de l’Accélérateur Linéaire, IN2P3-CNRS, Université Paris-Sud, Bâtiment 200, 91898 Orsay Cedex (France)

2013-08-01

The OMEGA microelectronics group has designed a new generation of multichannel integrated circuits, the “ROC” family, in AustrianMicroSystem (AMS) SiGe 0.35 μm technology to read out signals from various families of photodetectors. The chip named MAROC (standing for Multi Anode ReadOut Chip) has been designed to read out MultiAnode Photomultipliers (MAPMT), Photomultiplier ARray In SiGe ReadOut Chip (PARISROC) to read out Photomultipliers (PMTs) and SiPM Integrated ReadOut Chip (SPIROC) to readout Silicon PhotoMultiplier (SiPM) detectors and which was the first ASIC to do so. The three of them fulfill the stringent requirements of the future photodetectors, in particular in terms of low noise, radiation hardness, large dynamic range, high density and high speed while keeping low power thanks to the SiGe technology. These multi-channel ASICs are real System on Chip (SoC) as they provide charge, time and photon-counting information which are digitized internally. Their complexity and versatility enable innovative frontier detectors and also cover spin off of these detectors in adjacent fields such as medical or material imaging as well as smart detectors. In this presentation, the three ASIC architectures and test results will be described to give a general panorama of the “ROC” chips.

Latest generation of ASICs for photodetector readout

International Nuclear Information System (INIS)

Seguin-Moreau, N.

2013-01-01

The OMEGA microelectronics group has designed a new generation of multichannel integrated circuits, the “ROC” family, in AustrianMicroSystem (AMS) SiGe 0.35 μm technology to read out signals from various families of photodetectors. The chip named MAROC (standing for Multi Anode ReadOut Chip) has been designed to read out MultiAnode Photomultipliers (MAPMT), Photomultiplier ARray In SiGe ReadOut Chip (PARISROC) to read out Photomultipliers (PMTs) and SiPM Integrated ReadOut Chip (SPIROC) to readout Silicon PhotoMultiplier (SiPM) detectors and which was the first ASIC to do so. The three of them fulfill the stringent requirements of the future photodetectors, in particular in terms of low noise, radiation hardness, large dynamic range, high density and high speed while keeping low power thanks to the SiGe technology. These multi-channel ASICs are real System on Chip (SoC) as they provide charge, time and photon-counting information which are digitized internally. Their complexity and versatility enable innovative frontier detectors and also cover spin off of these detectors in adjacent fields such as medical or material imaging as well as smart detectors. In this presentation, the three ASIC architectures and test results will be described to give a general panorama of the “ROC” chips

Analyses of test beam data for the ATLAS upgrade readout chip (ABC130)

Energy Technology Data Exchange (ETDEWEB)

Peschke, Richard [DESY, Hamburg (Germany); Collaboration: ATLAS-Collaboration

2015-07-01

As part of the ATLAS phase II upgrade it is planned to replace the current tracker with an all silicon tracker. The outer part of the new tracker will consist of silicon strip detectors. For the readout of the strip detector a new Analog to Binary Converter chip (ABC130) was designed. The chip is processed in the 130 nm technology. In laboratory measurements the preamplifier of the new ABC130 showed a significant lower gain than expected. From the measurements in the laboratory it was not possible to distinguish if the malfunction is in the preamplifier or in the test circuit. Therefore an unbiased test was mandatory. Among other measurements, one was a test beam campaign at the Stanford Linear Accelerator Collider (SLAC). The result of measurement is shown in the presentation.

A Zinc Oxide Nanorod Ammonia Microsensor Integrated with a Readout Circuit on-a-Chip

Directory of Open Access Journals (Sweden)

Chyan-Chyi Wu

2011-11-01

Full Text Available A zinc oxide nanorod ammonia microsensor integrated with a readout circuit on-a-chip fabricated using the commercial 0.35 mm complementary metal oxide semiconductor (CMOS process was investigated. The structure of the ammonia sensor is composed of a sensitive film and polysilicon electrodes. The ammonia sensor requires a post-process to etch the sacrificial layer, and to coat the sensitive film on the polysilicon electrodes. The sensitive film that is prepared by a hydrothermal method is made of zinc oxide. The sensor resistance changes when the sensitive film adsorbs or desorbs ammonia gas. The readout circuit is used to convert the sensor resistance into the voltage output. Experiments show that the ammonia sensor has a sensitivity of about 1.5 mV/ppm at room temperature.

Flip chip assembly of thinned chips for hybrid pixel detector applications

CERN Document Server

Fritzsch, T; Woehrmann, M; Rothermund, M; Huegging, F; Ehrmann, O; Oppermann, H; Lang, K.D

2014-01-01

There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning process. To minimize the risk of wafer breakage the thinned wafer needs to be handled by a carrier during the whole process chain of wafer bumping. Another key process is the flip chip assembly of thinned readout chips onto thin sensor tiles. Besides the prevention of silicon breakage the minimization of chip warpage is one additional task for a high yield and reliable flip chip process. A new technology using glass carrier wafer will be described in detail. The main advantage of this technology is the combination of a carrier support during wafer processing and the chip support during flip chip assembly. For that a glass wafer is glue-bonded onto the backside of the thinned readout chip wafer. After the bump depo...

A compact readout system for multi-pixel hybrid photodiodes

International Nuclear Information System (INIS)

Datema, C.P.; Meng, L.J.; Ramsden, D.

1999-01-01

Although the first Multi-pixel Hybrid Photodiode (M-HPD) was developed in the early 1990s by Delft Electronic Products, the main obstacle to its application has been the lack of availability of a compact read-out system. A fast, parallel readout system has been constructed for use with the earlier 25-pixel tube with High-energy Physics applications in mind. The excellent properties of the recently developed multi-pixel hybrid photodiodes (M-HPD) will be easier to exploit following the development of the new hybrid read-out circuits described in this paper. This system will enable all of the required read-out functions to be accommodate on a single board into which the M-HPD is plugged. The design and performance of a versatile system is described in which a trigger-signal, derived from the common-side of the silicon anode in the M-HPD, is used to trigger the readout of the 60-anode pixels in the M-HPD. The multi-channel amplifier section is based on the use of a new, commercial VLSI chip, whilst the read-out sequencer uses a chip of its own design. The common anode signal is processed by a fast amplifier and discriminator to provide a trigger signal when a single event is detected. In the prototype version, the serial analogue output data-stream is processed using a PC-mounted, high speed ADC. Results obtained using the new read-out system in a compact gamma-camera and with a small muon tracking-chamber demonstrate the low-noise performance of the system. The application of this read-out system in other position-sensitive or multi-anode photomultiplier tube applications are also described

Zero suppression logic of the ALICE muon forward tracker pixel chip prototype PIXAM and associated readout electronics development

International Nuclear Information System (INIS)

Flouzat, C.; Değerli, Y.; Guilloux, F.; Orsini, F.; Venault, P.

2015-01-01

In the framework of the ALICE experiment upgrade at HL-LHC, a new forward tracking detector, the Muon Forward Tracker (MFT), is foreseen to overcome the intrinsic limitations of the present Muon Spectrometer and will perform new measurements of general interest for the whole ALICE physics. To fulfill the new detector requirements, CMOS Monolithic Active Pixel Sensors (MAPS) provide an attractive trade-off between readout speed, spatial resolution, radiation hardness, granularity, power consumption and material budget. This technology has been chosen to equip the Muon Forward Tracker and also the vertex detector: the Inner Tracking System (ITS). Since few years, an intensive R and D program has been performed on the design of MAPS in the 0.18 μ m CMOS Image Sensor (CIS) process. In order to avoid pile up effects in the experiment, the classical rolling shutter readout system of MAPS has been improved to overcome the readout speed limitation. A zero suppression algorithm, based on a 3 by 3 cluster finding (position and data), has been chosen for the MFT. This algorithm allows adequate data compression for the sensor. This paper presents the large size prototype PIXAM, which represents 1/3 of the final chip, and will focus specially on the zero suppression block architecture. This chip is designed and under fabrication in the 0.18 μ m CIS process. Finally, the readout electronics principle to send out the compressed data flow is also presented taking into account the cluster occupancy per MFT plane for a single central Pb-Pb collision

Zero suppression logic of the ALICE muon forward tracker pixel chip prototype PIXAM and associated readout electronics development

Science.gov (United States)

Flouzat, C.; Değerli, Y.; Guilloux, F.; Orsini, F.; Venault, P.

2015-05-01

In the framework of the ALICE experiment upgrade at HL-LHC, a new forward tracking detector, the Muon Forward Tracker (MFT), is foreseen to overcome the intrinsic limitations of the present Muon Spectrometer and will perform new measurements of general interest for the whole ALICE physics. To fulfill the new detector requirements, CMOS Monolithic Active Pixel Sensors (MAPS) provide an attractive trade-off between readout speed, spatial resolution, radiation hardness, granularity, power consumption and material budget. This technology has been chosen to equip the Muon Forward Tracker and also the vertex detector: the Inner Tracking System (ITS). Since few years, an intensive R&D program has been performed on the design of MAPS in the 0.18 μ m CMOS Image Sensor (CIS) process. In order to avoid pile up effects in the experiment, the classical rolling shutter readout system of MAPS has been improved to overcome the readout speed limitation. A zero suppression algorithm, based on a 3 by 3 cluster finding (position and data), has been chosen for the MFT. This algorithm allows adequate data compression for the sensor. This paper presents the large size prototype PIXAM, which represents 1/3 of the final chip, and will focus specially on the zero suppression block architecture. This chip is designed and under fabrication in the 0.18 μ m CIS process. Finally, the readout electronics principle to send out the compressed data flow is also presented taking into account the cluster occupancy per MFT plane for a single central Pb-Pb collision.

Strip detectors read-out system user's guide

International Nuclear Information System (INIS)

Claus, G.; Dulinski, W.; Lounis, A.

1996-01-01

The Strip Detector Read-out System consists of two VME modules: SDR-Flash and SDR-seq completed by a fast logic SDR-Trig stand alone card. The system is a self-consistent, cost effective and easy use solution for the read-out of analog multiplexed signals coming from some of the front-end electronics chips (Viking/VA chips family, Premus 128 etc...) currently used together with solid (silicon) or gas microstrip detectors. (author)

Characterisation of capacitively coupled HV/HR-CMOS sensor chips for the CLIC vertex detector

CERN Document Server

AUTHOR|(SzGeCERN)756402

2017-01-01

The capacitive coupling between an active sensor and a readout ASIC has been considered in the framework of the CLIC vertex detector study. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is a High-Voltage CMOS sensor chip produced in a commercial 180 nm HV-CMOS process for this purpose. The sensor was designed to be connected to the CLICpix2 readout chip. It therefore matches the dimensions of the readout chip, featuring a matrix of 128 × 128 square pixels with 25 μm pitch. The sensor chip has been produced with the standard value for the substrate resistivity (∼ 20 Ωcm) and it has been characterised in standalone testing mode, before receiving and testing capacitively coupled assemblies. The standalone measurement results show a rise time of ∼ 20 ns for a power consumption of 5 μW/pixel. Production of the C3PD HV-CMOS sensor chip with higher substrate resistivity wafers (∼ 20, 80, 200 and 1000 Ωcm) is foreseen. The expected benefits of the higher substrate resistivity will be studied using...

Characterisation of silicon microstrip detectors for the ATLAS Phase-II Upgrade with a micro-focused X-ray beam

International Nuclear Information System (INIS)

Poley, Luise; Blue, Andrew; Bates, Richard

2016-03-01

The planned HL-LHC (High Luminosity LHC) in 2025 is being designed to maximise the physics potential through a sizable increase in the luminosity, totalling 1 x 10 35 cm -2 s -1 after 10 years of operation. A consequence of this increased luminosity is the expected radiation damage at 3000 fb -1 , requiring the tracking detectors to withstand hadron equivalences to over 1 x 10 16 1 MeV neutrons per cm 2 . With the addition of increased readout rates, a complete re-design of the current ATLAS Inner Detector (ID) is being developed as the Inner Tracker (ITk). Two proposed detectors for the ATLAS strip tracker region of the ITk were characterized at the Diamond Light Source with a 3 μm FWHM 15 keV micro focused X-ray beam. The devices under test were a 320 μm thick silicon stereo (Barrel) ATLAS12 strip mini sensor wire bonded to a 130 nm CMOS binary readout chip (ABC130) and a 320 μm thick full size radial (Endcap) strip sensor - utilizing bi-metal readout layers - wire bonded to 250 nm CMOS binary readout chips (ABCN-25). Sub-strip resolution of the 74.5 μm strips was achieved for both detectors. Investigation of the p-stop diffusion layers between strips is shown in detail for the wire bond pad regions. Inter strip charge collection measurements indicate that the effective width of the strip on the silicon sensors is determined by p-stops regions between the strips rather than the strip pitch. The collected signal allowed for the identification of operating thresholds for both devices, making it possible to compare signal response between different versions of silicon strip detector modules.

Characterisation of silicon microstrip detectors for the ATLAS Phase-II Upgrade with a micro-focused X-ray beam

Energy Technology Data Exchange (ETDEWEB)

Poley, Luise [DESY, Hamburg (Germany); Blue, Andrew; Bates, Richard [Glasgow Univ. (United Kingdom). SUPA School of Physics and Astronomy; and others

2016-03-15

The planned HL-LHC (High Luminosity LHC) in 2025 is being designed to maximise the physics potential through a sizable increase in the luminosity, totalling 1 x 10{sup 35} cm{sup -2}s{sup -1} after 10 years of operation. A consequence of this increased luminosity is the expected radiation damage at 3000 fb{sup -1}, requiring the tracking detectors to withstand hadron equivalences to over 1 x 10{sup 16} 1 MeV neutrons per cm{sup 2}. With the addition of increased readout rates, a complete re-design of the current ATLAS Inner Detector (ID) is being developed as the Inner Tracker (ITk). Two proposed detectors for the ATLAS strip tracker region of the ITk were characterized at the Diamond Light Source with a 3 μm FWHM 15 keV micro focused X-ray beam. The devices under test were a 320 μm thick silicon stereo (Barrel) ATLAS12 strip mini sensor wire bonded to a 130 nm CMOS binary readout chip (ABC130) and a 320 μm thick full size radial (Endcap) strip sensor - utilizing bi-metal readout layers - wire bonded to 250 nm CMOS binary readout chips (ABCN-25). Sub-strip resolution of the 74.5 μm strips was achieved for both detectors. Investigation of the p-stop diffusion layers between strips is shown in detail for the wire bond pad regions. Inter strip charge collection measurements indicate that the effective width of the strip on the silicon sensors is determined by p-stops regions between the strips rather than the strip pitch. The collected signal allowed for the identification of operating thresholds for both devices, making it possible to compare signal response between different versions of silicon strip detector modules.

LHC1: a semiconductor pixel detector readout chip with internal, tunable delay providing a binary pattern of selected events

International Nuclear Information System (INIS)

Heijne, E.H.M.; Antinori, F.; Barberis, D.

1996-01-01

The Omega3/LHC1 pixel detector readout chip comprises a matrix of 128 x 16 readout cells of 50 μm x 500 μm and peripheral functions with 4 distinct modes of initialization and operation, together more than 800 000 transistors. Each cell contains a complete chain of amplifier, discriminator with adjustable threshold and fast-OR output, a globally adjustable delay with local fine-tuning, coincidence logic and memory. Every cell can be individually addressed for electrical test and masking. First results have been obtained from electrical tests of a chip without detector as well as from source measurements. The electronic noise without detector is ∼100 e - rms. The lowest threshold setting is close to 2000 e - and non-uniformity has been measured to be better than 450 e - rms at 5000 e - threshold. A timewalk of <10 ns and a precision of <6 ns rms on a delay of 2 μs have been measured. The results may be improved by further optimization. (orig.)

Design of a current based readout chip and development of a DEPFET pixel prototype system for the ILC vertex detector

International Nuclear Information System (INIS)

Trimpl, M.

2005-12-01

The future TeV-scale linear collider ILC (International Linear Collider) offers a large variety of precision measurements complementary to the discovery potential of the LHC (Large Hadron Collider). To fully exploit its physics potential, a vertex detector with unprecedented performance is needed. One proposed technology for the ILC vertex detector is the DEPFET active pixel sensor. The DEPFET sensor offers particle detection with in-pixel amplification by incorporating a field effect transistor into a fully depleted high-ohmic silicon substrate. The device provides an excellent signal-to-noise ratio and a good spatial resolution at the same time. To establish a very fast readout of a DEPFET pixel matrix with row rates of 20 MHz and more, the 128 channel CURO II ASIC has been designed and fabricated. The architecture of the chip is completely based on current mode techniques (SI) perfectly adapted to the current signal of the sensor. For the ILC vertex detector a prototype system with a 64 x 128 DEPFET pixel matrix read out by the CURO II chip has been developed. The design issues and the standalone performance of the readout chip as well as first results with the prototype system will be presented. (orig.)

Design of a current based readout chip and development of a DEPFET pixel prototype system for the ILC vertex detector

Energy Technology Data Exchange (ETDEWEB)

Trimpl, M.

2005-12-15

The future TeV-scale linear collider ILC (International Linear Collider) offers a large variety of precision measurements complementary to the discovery potential of the LHC (Large Hadron Collider). To fully exploit its physics potential, a vertex detector with unprecedented performance is needed. One proposed technology for the ILC vertex detector is the DEPFET active pixel sensor. The DEPFET sensor offers particle detection with in-pixel amplification by incorporating a field effect transistor into a fully depleted high-ohmic silicon substrate. The device provides an excellent signal-to-noise ratio and a good spatial resolution at the same time. To establish a very fast readout of a DEPFET pixel matrix with row rates of 20 MHz and more, the 128 channel CURO II ASIC has been designed and fabricated. The architecture of the chip is completely based on current mode techniques (SI) perfectly adapted to the current signal of the sensor. For the ILC vertex detector a prototype system with a 64 x 128 DEPFET pixel matrix read out by the CURO II chip has been developed. The design issues and the standalone performance of the readout chip as well as first results with the prototype system will be presented. (orig.)

A fast and reliable readout method for quantitative analysis of surface-enhanced Raman scattering nanoprobes on chip surface

Energy Technology Data Exchange (ETDEWEB)

Chang, Hyejin; Jeong, Sinyoung; Ko, Eunbyeol; Jeong, Dae Hong, E-mail: yslee@snu.ac.kr, E-mail: debobkr@gmail.com, E-mail: jeongdh@snu.ac.kr [Department of Chemistry Education, Seoul National University, Seoul 151-742 (Korea, Republic of); Kang, Homan [Interdisciplinary Program in Nano-Science and Technology, Seoul National University, Seoul 151-742 (Korea, Republic of); Lee, Yoon-Sik, E-mail: yslee@snu.ac.kr, E-mail: debobkr@gmail.com, E-mail: jeongdh@snu.ac.kr [Interdisciplinary Program in Nano-Science and Technology, Seoul National University, Seoul 151-742 (Korea, Republic of); School of Chemical and Biological Engineering, Seoul National University, Seoul 151-742 (Korea, Republic of); Lee, Ho-Young, E-mail: yslee@snu.ac.kr, E-mail: debobkr@gmail.com, E-mail: jeongdh@snu.ac.kr [Department of Nuclear Medicine, Seoul National University Bundang Hospital, Seongnam 463-707 (Korea, Republic of)

2015-05-15

Surface-enhanced Raman scattering techniques have been widely used for bioanalysis due to its high sensitivity and multiplex capacity. However, the point-scanning method using a micro-Raman system, which is the most common method in the literature, has a disadvantage of extremely long measurement time for on-chip immunoassay adopting a large chip area of approximately 1-mm scale and confocal beam point of ca. 1-μm size. Alternative methods such as sampled spot scan with high confocality and large-area scan method with enlarged field of view and low confocality have been utilized in order to minimize the measurement time practically. In this study, we analyzed the two methods in respect of signal-to-noise ratio and sampling-led signal fluctuations to obtain insights into a fast and reliable readout strategy. On this basis, we proposed a methodology for fast and reliable quantitative measurement of the whole chip area. The proposed method adopted a raster scan covering a full area of 100 μm × 100 μm region as a proof-of-concept experiment while accumulating signals in the CCD detector for single spectrum per frame. One single scan with 10 s over 100 μm × 100 μm area yielded much higher sensitivity compared to sampled spot scanning measurements and no signal fluctuations attributed to sampled spot scan. This readout method is able to serve as one of key technologies that will bring quantitative multiplexed detection and analysis into practice.

Gossipo-3 A prototype of a Front-End Pixel Chip for Read-Out of Micro-Pattern Gas Detectors

CERN Document Server

Brezina, Christpoh; van der Graaf, Haryy; Gromov, Vladimir; Kluit, Ruud; Kruth, Andre; Zappon, Francesco

2009-01-01

In a joint effort of Nikhef (Amsterdam) and the University of Bonn, the Gossipo-3 integrated circuit (IC) has been developed. This circuit is a prototype of a chip dedicated for read-out of various types of position sensitive Micro-Pattern Gas detectors (MPGD). The Gossipo-3 is defined as a set of building blocks to be used in a future highly granulated (60 μm) chip. The pixel circuit can operate in two modes. In Time mode every readout pixel measures the hit arrival time and the charge deposit. For this purpose it has been equipped with a high resolution TDC (1.7 ns) covering dynamic range up to 102 μs. Charge collected by the pixel will be measured using Time-over- Threshold method in the range from 400 e- to 28000 e- with accuracy of 200 e- (standard deviation). In Counting mode every pixel operates as a 24-bit counter, counting the number of incoming hits. The circuit is also optimized to operate at low power consumption (100 mW/cm2) that is required to avoid the need for massive power transport and coo...

LHCb - SALT, a dedicated readout chip for strip detectors in the LHCb Upgrade experiment

CERN Multimedia

Swientek, Krzysztof Piotr

2015-01-01

Silicon strip detectors in the upgraded Tracker of LHCb experiment will require a new readout 128-channel ASIC called SALT. It will extract and digitise analogue signals from the sensor, perform digital processing and transmit serial output data. SALT is designed in CMOS 130 nm process and uses a novel architecture comprising of analogue front-end and ultra-low power ($<$0.5 mW) fast (40 MSps) sampling 6-bit ADC in each channel. A prototype of first 8-channel version of SALT chip, comprising all important functionalities, was submitted. Its design and possibly first tests results will be presented.

Effect of gamma irradiation on leakage current in CMOS read-out chips for the ATLAS upgrade silicon strip tracker at the HL-LHC

CERN Document Server

Stucci, Stefania Antonia; Lynn, Dave; Kierstead, James; Kuczewski, Philip; van Nieuwenhuizen, Gerrit J; Rosin, Guy; Tricoli, Alessandro

2017-01-01

The increase of the leakage current of NMOS transistors in detector readout chips in certain 130 nm CMOS technologies during exposure to ionising radiation needs special consideration in the design of detector systems, as this can result in a large increase of the supply current and power dissipation. As part of the R&D; program for the upgrade of the ATLAS inner detector tracker for the High Luminosity upgrade of the LHC at CERN, a dedicated set of irradiations have been carried out with the $^60$Co gamma-ray source at the Brookhaven National Laboratory. Measurements will be presented that characterise the increase in the digital leakage current in the 130 nm-technology ABC130 readout chips. The variation of the current as a function of time and total ionising dose has been studied under various conditions of dose rate, temperature and power applied to the chip. The range of variation of dose rates and temperatures has been set to be close to those expected at the High Luminosity LHC, i.e. in the range 0...

Study of multi-channel readout ASIC and its discrete module for particle detector

International Nuclear Information System (INIS)

Wang Ke; Fan Lei; Zhang Shengjun; Li Xian

2013-01-01

Recently, kinds of particle detectors have used Application Specific Integrated Circuits (ASIC) in their electronics readout systems, it is the key part for the whole system. This project designed a multi-channel readout ASIC for general detectors. The chip has Preamplifier, Shaper and Peak Detector embedded for easy readout. For each channel, signal which is preprocessed by a low-noise preamplifier is sent to the shaper to form a quasi-Gaussian pulse and keep its peak for readout. This chip and modules of individual Preamplifier, Shaper and Peak Detector have been manufactured and tested. The discrete modules work well, and the 6-channel chip NPRE 6 is ready for test in some particle detection system. (authors)

SPIROC (SiPM Integrated Read-Out Chip) Dedicated very front-end electronics for an ILC prototype hadronic calorimeter with SiPM read-out

CERN Document Server

Bouchel, Michel; Dulucq, Frédéric; Fleury, Julien; de La Taille, Christophe; Martin-Chassard, Gisèle; Raux, Ludovic

2009-01-01

The SPIROC chip is a dedicated very front-end electronics for an ILC prototype hadronic calorimeter with Silicon photomultiplier (or MPPC) readout. This ASIC is due to equip a 10,000-channel demonstrator in 2009. SPIROC is an evolution of FLC_SiPM used for the ILC AHCAL physics prototype [1]. SPIROC was submitted in June 2007 and will be tested in September 2007. It embeds cutting edge features that fulfil ILC final detector requirements. It has been realized in 0.35m SiGe technology. It has been developed to match the requirements of large dynamic range, low noise, low consumption, high precision and large number of readout channels needed. SPIROC is an auto-triggered, bi-gain, 36-channel ASIC which allows to measure on each channel the charge from one photoelectron to 2000 and the time with a 100ps accurate TDC. An analogue memory array with a depth of 16 for each channel is used to store the time information and the charge measurement. A 12-bit Wilkinson ADC has been embedded to digitize the analogue memor...

SPIROC (SiPM Integrated Read-Out Chip) Dedicated very front-end electronics for an ILC prototype hadronic calorimeter with SiPM read-out

CERN Document Server

Bouchel, Michel; Fleury, Julien; de La Taille, Christophe; Martin-Chassard, Gisèle; Raux, Ludovic

2007-01-01

The SPIROC chip is a dedicated very front-end electronics for an ILC prototype hadronic calorimeter with Silicon photomultiplier (or MPPC) readout. This ASIC is due to equip a 10,000-channel demonstrator in 2009. SPIROC is an evolution of FLC_SiPM used for the ILC AHCAL physics prototype [1]. SPIROC was submitted in June 2007 and will be tested in September 2007. It embeds cutting edge features that fulfil ILC final detector requirements. It has been realized in 0.35m SiGe technology. It has been developed to match the requirements of large dynamic range, low noise, low consumption, high precision and large number of readout channels needed. SPIROC is an auto-triggered, bi-gain, 36-channel ASIC which allows to measure on each channel the charge from one photoelectron to 2000 and the time with a 100ps accurate TDC. An analogue memory array with a depth of 16 for each channel is used to store the time information and the charge measurement. A 12-bit Wilkinson ADC has been embedded to digitize the analogue memor...

Readout of the upgraded ALICE-ITS

Science.gov (United States)

Szczepankiewicz, A.; ALICE Collaboration

2016-07-01

The ALICE experiment will undergo a major upgrade during the second long shutdown of the CERN LHC. As part of this program, the present Inner Tracking System (ITS), which employs different layers of hybrid pixels, silicon drift and strip detectors, will be replaced by a completely new tracker composed of seven layers of monolithic active pixel sensors. The upgraded ITS will have more than twelve billion pixels in total, producing 300 Gbit/s of data when tracking 50 kHz Pb-Pb events. Two families of pixel chips realized with the TowerJazz CMOS imaging process have been developed as candidate sensors: the ALPIDE, which uses a proprietary readout and sparsification mechanism and the MISTRAL-O, based on a proven rolling shutter architecture. Both chips can operate in continuous mode, with the ALPIDE also supporting triggered operations. As the communication IP blocks are shared among the two chip families, it has been possible to develop a common Readout Electronics. All the sensor components (analog stages, state machines, buffers, FIFOs, etc.) have been modelled in a system level simulation, which has been extensively used to optimize both the sensor and the whole readout chain design in an iterative process. This contribution covers the progress of the R&D efforts and the overall expected performance of the ALICE-ITS readout system.

Readout of the upgraded ALICE-ITS

International Nuclear Information System (INIS)

Szczepankiewicz, A.

2016-01-01

The ALICE experiment will undergo a major upgrade during the second long shutdown of the CERN LHC. As part of this program, the present Inner Tracking System (ITS), which employs different layers of hybrid pixels, silicon drift and strip detectors, will be replaced by a completely new tracker composed of seven layers of monolithic active pixel sensors. The upgraded ITS will have more than twelve billion pixels in total, producing 300 Gbit/s of data when tracking 50 kHz Pb–Pb events. Two families of pixel chips realized with the TowerJazz CMOS imaging process have been developed as candidate sensors: the ALPIDE, which uses a proprietary readout and sparsification mechanism and the MISTRAL-O, based on a proven rolling shutter architecture. Both chips can operate in continuous mode, with the ALPIDE also supporting triggered operations. As the communication IP blocks are shared among the two chip families, it has been possible to develop a common Readout Electronics. All the sensor components (analog stages, state machines, buffers, FIFOs, etc.) have been modelled in a system level simulation, which has been extensively used to optimize both the sensor and the whole readout chain design in an iterative process. This contribution covers the progress of the R&D efforts and the overall expected performance of the ALICE-ITS readout system.

Readout of the upgraded ALICE-ITS

Energy Technology Data Exchange (ETDEWEB)

Szczepankiewicz, A., E-mail: Adam.Szczepankiewicz@cern.ch [CERN, Geneva (Switzerland); Institute of Computer Science, Warsaw University of Technology, Warsaw (Poland)

2016-07-11

The ALICE experiment will undergo a major upgrade during the second long shutdown of the CERN LHC. As part of this program, the present Inner Tracking System (ITS), which employs different layers of hybrid pixels, silicon drift and strip detectors, will be replaced by a completely new tracker composed of seven layers of monolithic active pixel sensors. The upgraded ITS will have more than twelve billion pixels in total, producing 300 Gbit/s of data when tracking 50 kHz Pb–Pb events. Two families of pixel chips realized with the TowerJazz CMOS imaging process have been developed as candidate sensors: the ALPIDE, which uses a proprietary readout and sparsification mechanism and the MISTRAL-O, based on a proven rolling shutter architecture. Both chips can operate in continuous mode, with the ALPIDE also supporting triggered operations. As the communication IP blocks are shared among the two chip families, it has been possible to develop a common Readout Electronics. All the sensor components (analog stages, state machines, buffers, FIFOs, etc.) have been modelled in a system level simulation, which has been extensively used to optimize both the sensor and the whole readout chain design in an iterative process. This contribution covers the progress of the R&D efforts and the overall expected performance of the ALICE-ITS readout system.

FE-I4 pixel chip characterization with USBpix3 test system

Energy Technology Data Exchange (ETDEWEB)

Filimonov, Viacheslav; Gonella, Laura; Hemperek, Tomasz; Huegging, Fabian; Janssen, Jens; Krueger, Hans; Pohl, David-Leon; Wermes, Norbert [University of Bonn, Bonn (Germany)

2015-07-01

The USBpix readout system is a small and light weighting test system for the ATLAS pixel readout chips. It is widely used to operate and characterize FE-I4 pixel modules in lab and test beam environments. For multi-chip modules the resources on the Multi-IO board, that is the central control unit of the readout system, are coming to their limits, which makes the simultaneous readout of more than one chip at a time challenging. Therefore an upgrade of the current USBpix system has been developed. The upgraded system is called USBpix3 - the main focus of the talk. Characterization of single chip FE-I4 modules was performed with USBpix3 prototype (digital, analog, threshold and source scans; tuning). PyBAR (Bonn ATLAS Readout in Python scripting language) was used as readout software. PyBAR consists of FEI4 DAQ and Data Analysis Libraries in Python. The presentation describes the USBpix3 system, results of FE-I4 modules characterization and preparation for the multi-chip module and multi-module readout with USBpix3.

The RD53 Collaboration's SystemVerilog-UVM Simulation Framework and its General Applicability to Design of Advanced Pixel Readout Chips

CERN Document Server

Marconi, S.; Placidi, P.; Christiansen, J.; Hemperek, T.

2014-01-01

The foreseen Phase 2 pixel upgrades at the LHC have very challenging requirements for the design of hybrid pixel readout chips. A versatile pixel simulation platform is as an essential development tool for the design, verification and optimization of both the system architecture and the pixel chip building blocks (Intellectual Properties, IPs). This work is focused on the implemented simulation and verification environment named VEPIX53, built using the SystemVerilog language and the Universal Verification Methodology (UVM) class library in the framework of the RD53 Collaboration. The environment supports pixel chips at different levels of description: its reusable components feature the generation of different classes of parameterized input hits to the pixel matrix, monitoring of pixel chip inputs and outputs, conformity checks between predicted and actual outputs and collection of statistics on system performance. The environment has been tested performing a study of shared architectures of the trigger late...

The FE-I4 Pixel Readout Chip and the IBL Module

Energy Technology Data Exchange (ETDEWEB)

Barbero, Marlon; Arutinov, David; Backhaus, Malte; Fang, Xiao-Chao; Gonella, Laura; Hemperek, Tomasz; Karagounis, Michael; Hans, Kruger; Kruth, Andre; Wermes, Norbert; /Bonn U.; Breugnon, Patrick; Fougeron, Denis; Gensolen, Fabrice; Menouni, Mohsine; Rozanov, Alexander; /Marseille, CPPM; Beccherle, Roberto; Darbo, Giovanni; /INFN, Genoa; Caminada, Lea; Dube, Sourabh; Fleury, Julien; Gnani, Dario; /LBL, Berkeley /NIKHEF, Amsterdam /Gottingen U. /SLAC

2012-05-01

FE-I4 is the new ATLAS pixel readout chip for the upgraded ATLAS pixel detector. Designed in a CMOS 130 nm feature size process, the IC is able to withstand higher radiation levels compared to the present generation of ATLAS pixel Front-End FE-I3, and can also cope with higher hit rate. It is thus suitable for intermediate radii pixel detector layers in the High Luminosity LHC environment, but also for the inserted layer at 3.3 cm known as the 'Insertable B-Layer' project (IBL), at a shorter timescale. In this paper, an introduction to the FE-I4 will be given, focusing on test results from the first full size FE-I4A prototype which has been available since fall 2010. The IBL project will be introduced, with particular emphasis on the FE-I4-based module concept.

Design and realisation of integrated circuits for the readout of pixel sensors in high-energy physics and biomedical imaging

Energy Technology Data Exchange (ETDEWEB)

Peric, I.

2004-08-01

Radiation tolerant pixel-readout chip for the ATLAS pixel detector has been designed, implemented in a deep-submicron CMOS technology and successfully tested. The chip contains readout-channels with complex analog and digital circuits. Chip for steering of the DEPFET active-pixel matrix has been implemented in a high-voltage CMOS technology. The chip contains channels which generate fast sequences of high-voltage signals. Detector containing this chip has been successfully tested. Pixel-readout test chip for an X-ray imaging pixel sensor has been designed, implemented in a CMOS technology and tested. Pixel-readout channels are able to simultaneously count the signals generated by passage of individual photons and to sum the total charge generated during exposure time. (orig.)

Development of a Timepix3 readout system based on the Merlin readout system

International Nuclear Information System (INIS)

Crevatin, G.; Carrato, S.; Horswell, I.; Omar, D.; Tartoni, N.; Cautero, G.

2015-01-01

Timepix3 chip is a new ASIC specifically designed to readout hybrid pixel detectors. The main purpose of Timepix3 is to measure the time of arrival of events. This characteristic can be exploited very effectively to develop detectors for time resolved experiments at synchrotron radiation facilities. In order to investigate how the ASIC can be applied to synchrotron experiments the Merlin readout system, developed at Diamond for the Medipix3 ASIC, has been adapted to readout the Timepix3 ASIC. The first tests of the ASIC with pulse injection and with alpha particles show that its behaviour is consistent with its nominal characteristics

A Fastbus-based silicon strip readout system

International Nuclear Information System (INIS)

Neoustroev, P.; Stepanov, V.; Svoiski, M.; Uvarov, L.; Matthew, P.; Russ, J.; Cooper, P.

1995-01-01

The readout system we describe here is built specifically to work with the LBL-designed SVX chip. It is typical of systems using a master sequencer module to direct the trigger and readout cycles of the sparse data source and to push data into a digitization and storage module. (orig.)

A New ATLAS Muon CSC Readout System with System on Chip Technology on ATCA Platform

CERN Document Server

AUTHOR|(SzGeCERN)696050; Garelli, N.; Herbst, R.T.; Huffer, M.; Iakovidis, G.; Iordanidou, K.; Kwan, K.; Kocian, M.; Lankford, A.J.; Moschovakos, P.; Nelson, A.; Ntekas, K.; Ruckman, L.; Russell, J.; Schernau, M.; Schlenker, S.; Su, D.; Valderanis, C.; Wittgen, M.; Bartoldus, R.

2016-01-01

The ATLAS muon Cathode Strip Chamber (CSC) backend readout system has been upgraded during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfigurable Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the Advanced Telecommunication Computing Architecture (ATCA) platform. The RCE design is based on the new System on Chip XILINX ZYNQ series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the ZYNQ for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chambe...

A New ATLAS Muon CSC Readout System with System on Chip Technology on ATCA Platform

CERN Document Server

ATLAS CSC Collaboration; The ATLAS collaboration

2016-01-01

The ATLAS muon Cathode Strip Chamber (CSC) backend readout system has been upgrade during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfigurable Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the Advanced Telecommunication Computing Architecture (ATCA) platform. The RCE design is based on the new System on Chip XILINX ZYNQ series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the ZYNQ for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chamber...

A New ATLAS Muon CSC Readout System with System on Chip Technology on ATCA Platform

CERN Document Server

AUTHOR|(SzGeCERN)664042

2016-01-01

The ATLAS muon Cathode Strip Chamber (CSC) back-end readout system has been upgraded during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfiguration Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the ATCA platform. The RCE design is based on the new System on Chip Xilinx Zynq series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the Zynq for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chambers to be processed by 6 COBs in one ATCA shelf thr...

A New ATLAS Muon CSC Readout System with System on Chip Technology on ATCA Platform

CERN Document Server

Claus, Richard; The ATLAS collaboration

2015-01-01

The ATLAS muon Cathode Strip Chamber (CSC) backend readout system has been upgraded during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfiguration Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the ATCA platform. The RCE design is based on the new System on Chip XILINX ZYNQ series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the ZYNQ for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chambers to be processed by 6 COBs in one ATCA shelf thro...

Cobalt Oxide Nanosheet and CNT Micro Carbon Monoxide Sensor Integrated with Readout Circuit on Chip

Directory of Open Access Journals (Sweden)

Ching-Liang Dai

2010-03-01

Full Text Available The study presents a micro carbon monoxide (CO sensor integrated with a readout circuit-on-a-chip manufactured by the commercial 0.35 μm complementary metal oxide semiconductor (CMOS process and a post-process. The sensing film of the sensor is a composite cobalt oxide nanosheet and carbon nanotube (CoOOH/CNT film that is prepared by a precipitation-oxidation method. The structure of the CO sensor is composed of a polysilicon resistor and a sensing film. The sensor, which is of a resistive type, changes its resistance when the sensing film adsorbs or desorbs CO gas. The readout circuit is used to convert the sensor resistance into the voltage output. The post-processing of the sensor includes etching the sacrificial layers and coating the sensing film. The advantages of the sensor include room temperature operation, short response/recovery times and easy post-processing. Experimental results show that the sensitivity of the CO sensor is about 0.19 mV/ppm, and the response and recovery times are 23 s and 34 s for 200 ppm CO, respectively.

Optimised cantilever biosensor with piezoresistive read-out

DEFF Research Database (Denmark)

Rasmussen, Peter; Thaysen, J.; Hansen, Ole

2003-01-01

We present a cantilever-based biochemical sensor with piezoresistive read-out which has been optimised for measuring surface stress. The resistors and the electrical wiring on the chip are encapsulated in low-pressure chemical vapor deposition (LPCVD) silicon nitride, so that the chip is well sui...

A readout system for position sensitive measurements of X-ray using silicon strip detectors

CERN Document Server

Dabrowski, W; Grybos, P; Idzik, M; Kudlaty, J

2000-01-01

In this paper we describe the development of a readout system for X-ray measurements using silicon strip detectors. The limitation concerning the inherent spatial resolution of silicon strip detectors has been evaluated by Monte Carlo simulation and the results are discussed. The developed readout system is based on the binary readout architecture and consists of two ASICs: RX32 front-end chip comprising 32 channels of preamplifiers, shapers and discriminators, and COUNT32 counter chip comprising 32 20-bit asynchronous counters and the readout logic. This work focuses on the design and performance of the front-end chip. The RX32 chip has been optimised for a low detector capacitance, in the range of 1-3 pF, and high counting rate applications. It can be used with DC coupled detectors allowing the leakage current up to a few nA per strip. For the prototype chip manufactured in a CMOS process all basic parameters have been evaluated by electronic measurements. The noise below 140 el rms has been achieved for a ...

Development and characterisation of a radiation hard readout chip for the LHCb outer tracker detector

International Nuclear Information System (INIS)

Stange, U.

2005-01-01

The reconstruction of charged particle tracks in the Outer Tracker detector of the LHCb experiment requires to measure the drift times of the straw tubes. A Time to Digital Converter (TDC) chip has been developed for this task. The chip integrates into the LHCb data acquisition schema and fulfils the requirements of the detector. The OTIS chip is manufactured in a commercial 0.25 μm CMOS process. A 32-channel TDC core drives the drift time measurement (25 ns measurement range, 390 ps nominal resolution) without introducing dead times. The resulting drift times are buffered until a trigger decision arrives after the fixed latency of 4 μs. In case of a trigger accept signal, the digital control core processes and transmits the corresponding data to the following data acquisition stage. Drift time measurement and data processing are independent from the detector occupancy. The digital control core of the OTIS chip has been developed within this doctoral thesis. It has been integrated into the TDC chip together with other constituents of the chip. Several test chips and prototype versions of the TDC chip have been characterised. The present version of the chip OTIS1.2 fulfils all requirements and is ready for mass production. (Orig.)

Spectroscopic measurements with the ATLAS FE-I4 pixel readout chip

Energy Technology Data Exchange (ETDEWEB)

Pohl, David-Leon; Janssen, Jens; Hemperek, Tomasz; Huegging, Fabian; Wermes, Norbert [Physikalisches Institut der Univeristaet Bonn (Germany)

2015-07-01

The ATLAS FE-I4 pixel readout chip is a large (2 x 2 cm{sup 2}) state of the art ASIC used in high energy physics experiments as well as for research and development purposes. While the FE-I4 is optimized for high hit rates it provides very limited charge resolution. Therefore two methods were developed to obtain high resolution single pixel charge spectra with the ATLAS FE-I4. The first method relies on the ability to change the detection threshold in small steps while counting hits from a particle source and has a resolution limited by electronic noise only. The other method uses a FPGA based time-to-digital-converter to digitize the analog charge signal with high precision. The feasibility, performance and challenges of these methods are discussed. First results of sensor characterizations from radioactive sources and test beams with the ATLAS FE-I4 in view of the charge collection efficiency after irradiation are presented.

Study of preamplifier, shaper and peak detector in readout ASIC for particle detector

International Nuclear Information System (INIS)

Wang Ke; Zhang Shengjun; Fan Lei; Li Xian

2014-01-01

Recently, kinds of particle detectors have used Application Specific Integrated Circuits (ASIC) in their electronics readout system and ASICs have been designed in China now. This project designed a multi-channel readout ASIC for general detector. The chip has Preamplifier, Shaper and Peak Detector embedded for easy readout. For each channel, signal which is preprocessed by a low-noise preamplifier is sent to the shaper to form a quasi-Gaussian pulse and keep its peak for readout. This chip and modules of individual Preamplifier, Shaper and Peak Detector have been manufactured, results will be reported in time. (authors)

Initial beam test results from a silicon-strip detector with VLSI readout

International Nuclear Information System (INIS)

Adolphsen, C.; Litke, A.; Schwarz, A.

1986-01-01

Silicon detectors with 256 strips, having a pitch of 25 μm, and connected to two 128 channel NMOS VLSI chips each (Microplex), have been tested in relativistic charged particle beams at CERN and at the Stanford Linear Accelerator Center. The readout chips have an input channel pitch of 47.5 μm and a single multiplexed output which provides voltages proportional to the integrated charge from each strip. The most probable signal height from minimum ionizing tracks was 15 times the rms noise in any single channel. Two-track traversals with a separation of 100 μm were cleanly resolved

arXiv The MuPix System-on-Chip for the Mu3e Experiment

CERN Document Server

Augustin, Heiko

2017-02-11

Mu3e is a novel experiment searching for charged lepton flavor violation in the rare decay $\\mu^+ \\rightarrow e^+e^-e^+$. Decay vertex position, decay time and particle momenta have to be precisely measured in order to reject both accidental and physics background. A silicon pixel tracker based on $50\\,\\mu$m thin high voltage monolithic active pixel sensors (HV-MAPS) in a 1 T solenoidal magnetic field provides precise vertex and momentum information. The MuPix chip combines pixel sensor cells with integrated analog electronics and a periphery with a complete digital readout. The MuPix7 is the first HV-MAPS prototype implementing all functionalities of the final sensor including a readout state machine and high speed serialization with 1.25 Gbit/s data output, allowing for a streaming readout in parallel to the data taking. The observed efficiency of the MuPix7 chip including the full readout system is $\\geq99\\%$ in a high rate test beam.

Status of readout integrated circuits for radiation detector

International Nuclear Information System (INIS)

Moon, B. S.; Hong, S. B.; Cheng, J. E. and others

2001-09-01

In this report, we describe the current status of readout integrated circuits developed for radiation detectors, along with new technologies being applied to this field. The current status of ASCIC chip development related to the readout electronics is also included in this report. Major sources of this report are from product catalogs and web sites of the related industries. In the field of semiconductor process technology in Korea, the current status of the multi-project wafer(MPW) of IDEC, the multi-project chip(MPC) of ISRC and other domestic semiconductor process industries is described. In the case of other countries, the status of the MPW of MOSIS in USA and the MPW of EUROPRACTICE in Europe is studied. This report also describes the technologies and products of readout integrated circuits of industries worldwide

Data readout system utilizing photonic integrated circuit

Energy Technology Data Exchange (ETDEWEB)

Stopiński, S., E-mail: S.Stopinski@tue.nl [COBRA Research Institute, Eindhoven University of Technology (Netherlands); Institute of Microelectronics and Optoelectronics, Warsaw University of Technology (Poland); Malinowski, M.; Piramidowicz, R. [Institute of Microelectronics and Optoelectronics, Warsaw University of Technology (Poland); Smit, M.K.; Leijtens, X.J.M. [COBRA Research Institute, Eindhoven University of Technology (Netherlands)

2013-10-11

We describe a novel optical solution for data readout systems. The core of the system is an Indium-Phosphide photonic integrated circuit performing as a front-end readout unit. It functions as an optical serializer in which the serialization of the input signal is provided by means of on-chip optical delay lines. The circuit employs electro-optic phase shifters to build amplitude modulators, power splitters for signal distribution, semiconductor optical amplifiers for signal amplification as well as on-chip reflectors. We present the concept of the system, the design and first characterization results of the devices that were fabricated in a multi-project wafer run.

First results from a silicon-strip detector with VLSI readout

International Nuclear Information System (INIS)

Anzivino, G.; Horisberger, R.; Hubbeling, L.; Hyams, B.; Parker, S.; Breakstone, A.; Litke, A.M.; Walker, J.T.; Bingefors, N.

1986-01-01

A 256-strip silicon detector with 25 μm strip pitch, connected to two 128-channel NMOS VLSI chips (Microplex), has been tested using straight-through tracks from a ruthenium beta source. The readout channels have a pitch of 47.5 μm. A single multiplexed output provides voltages proportional to the integrated charge from each strip. The most probable signal height from the beta traversals is approximately 14 times the rms noise in any single channel. (orig.)

Prototype ATLAS IBL Modules using the FE-I4A Front-End Readout Chip

CERN Document Server

Albert, J; Alimonti, Gianluca; Allport, Phil; Altenheiner, Silke; Ancu, Lucian; Andreazza, Attilio; Arguin, Jean-Francois; Arutinov, David; Backhaus, Malte; Bagolini, Alvise; Ballansat, Jacques; Barbero, Marlon; Barbier, Gérard; Bates, Richard; Battistin, Michele; Baudin, Patrick; Beau, Tristan; Beccherle, Roberto; Beck, Hans Peter; Benoit, Mathieu; Bensinger, Jim; Bomben, Marco; Borri, Marcello; Boscardin, Maurizio; Botelho Direito, Jose Antonio; Bousson, Nicolas; Boyd, George Russell Jr; Breugnon, Patrick; Bruni, Graziano; Bruschi, Marco; Buchholz, Peter; Buttar, Craig; Cadoux, Franck; Calderini, Giovanni; Caminada, Leah; Capeans, Mar; Casse, Gianluigi; Catinaccio, Andrea; Cavalli-Sforza, Matteo; Chauveau, Jacques; Chu, Ming-Lee; Ciapetti, Marco; Cindro, Vladimir; Citterio, Mauro; Clark, Allan; Cobal, Marina; Coelli, Simone; Colijn, Auke-Pieter; Colin, Daly; Collot, Johann; Crespo-Lopez, Olivier; Dalla Betta, Gian-Franco; Darbo, Giovanni; DaVia, Cinzia; David, Pierre-Yves; Debieux, Stéphane; Delebecque, Pierre; Devetak, Erik; DeWilde, Burton; Di Girolamo, Beniamino; Dinu, Nicoleta; Dittus, Fridolin; Diyakov, Denis; Djama, Fares; Dobos, Daniel Adam; Doonan, Kate; Dopke, Jens; Dorholt, Ole; Dube, Sourabh; Dushkin, Andrey; Dzahini, Daniel; Egorov, Kirill; Ehrmann, Oswin; Elldge, David; Elles, Sabine; Elsing, Markus; Eraud, Ludovic; Ereditato, Antonio; Eyring, Andreas; Falchieri, Davide; Falou, Aboud; Fang, Xiaochao; Fausten, Camille; Favre, Yannick; Ferrere, Didier; Fleta, Celeste; Fleury, Julien; Flick, Tobias; Forshaw, Dean; Fougeron, Denis; Fritzsch, Thomas; Gabrielli, Alessandro; Gaglione, Renaud; Gallrapp, Christian; Gan, K; Garcia-Sciveres, Maurice; Gariano, Giuseppe; Gastaldi, Thibaut; Gemme, Claudia; Gensolen, Fabrice; George, Matthias; Ghislain, Patrick; Giacomini, Gabriele; Gibson, Stephen; Giordani, Mario Paolo; Giugni, Danilo; Gjersdal, Håvard; Glitza, Karl Walter; Gnani, Dario; Godlewski, Jan; Gonella, Laura; Gorelov, Igor; Gorišek, Andrej; Gössling, Claus; Grancagnolo, Sergio; Gray, Heather; Gregor, Ingrid-Maria; Grenier, Philippe; Grinstein, Sebastian; Gromov, Vladimir; Grondin, Denis; Grosse-Knetter, Jörn; Hansen, Thor-Erik; Hansson, Per; Harb, Ali; Hartman, Neal; Hasi, Jasmine; Hegner, Franziska; Heim, Timon; Heinemann, Beate; Hemperek, Tomasz; Hessey, Nigel; Hetmánek, Martin; Hoeferkamp, Martin; Hostachy, Jean-Yves; Hügging, Fabian; Husi, Coralie; Iacobucci, Giuseppe; Idarraga, John; Ikegami, Yoichi; Janoška, Zdenko; Jansen, Jens; Jansen, Luc; Jensen, Frank; Jentzsch, Jennifer; Joseph, John; Kagan, Harris; Karagounis, Michael; Kass, Richard; Kenney, Christopher J; Kersten, Susanne; Kind, Peter; Klingenberg, Reiner; Kluit, Ruud; Kocian, Martin; Koffeman, Els; Kok, Angela; Korchak, Oleksandr; Korolkov, Ilya; Kostyukhin, Vadim; Krieger, Nina; Krüger, Hans; Kruth, Andre; Kugel, Andreas; Kuykendall, William; La Rosa, Alessandro; Lai, Chung-Hang; Lantzsch, Kerstin; Laporte, Didier; Lapsien, Tobias; Lounis, abdenour; Lozano, Manuel; Lu, Yunpeng; Lubatti, Henry; Macchiolo, Anna; Mallik, Usha; Mandić, Igor; Marchand, Denis; Marchiori, Giovanni; Massol, Nicolas; Matthias, Wittgen; Mättig, Peter; Mekkaoui, Abderrazak; Menouni, Mohsine; Menu, Johann; Meroni, Chiara; Mesa, Javier; Micelli, Andrea; Michal, Sébastien; Miglioranzi, Silvia; Mikuž, Marko; Mitsui, Shingo; Monti, Mauro; Moore, J; Morettini, Paolo; Muenstermann, Daniel; Murray, Peyton; Nellist, Clara; Nelson, David J; Nessi, Marzio; Neumann, Manuel; Nisius, Richard; Nordberg, Markus; Nuiry, Francois-Xavier; Oppermann, Hermann; Oriunno, Marco; Padilla, Cristobal; Parker, Sherwood; Pellegrini, Giulio; Pelleriti, Gabriel; Pernegger, Heinz; Piacquadio, Nicola Giacinto; Picazio, Attilio; Pohl, David; Polini, Alessandro; Popule, Jiří; Portell Bueso, Xavier; Povoli, Marco; Puldon, David; Pylypchenko, Yuriy; Quadt, Arnulf; Quirion, David; Ragusa, Francesco; Rambure, Thibaut; Richards, Erik; Ristic, Branislav; Røhne, Ole; Rothermund, Mario; Rovani, Alessandro; Rozanov, Alexandre; Rubinskiy, Igor; Rudolph, Matthew Scott; Rummler, André; Ruscino, Ettore; Salek, David; Salzburger, Andreas; Sandaker, Heidi; Schipper, Jan-David; Schneider, Basil; Schorlemmer, Andre; Schroer, Nicolai; Schwemling, Philippe; Seidel, Sally; Seiden, Abraham; Šícho, Petr; Skubic, Patrick; Sloboda, Michal; Smith, D; Sood, Alex; Spencer, Edwin; Strang, Michael; Stugu, Bjarne; Stupak, John; Su, Dong; Takubo, Yosuke; Tassan, Jean; Teng, Ping-Kun; Terada, Susumu; Todorov, Theodore; Tomášek, Michal; Toms, Konstantin; Travaglini, Riccardo; Trischuk, William; Troncon, Clara; Troska, Georg; Tsiskaridze, Shota; Tsurin, Ilya; Tsybychev, Dmitri; Unno, Yoshinobu; Vacavant, Laurent; Verlaat, Bart; Vianello, Elisa; Vigeolas, Eric; von Kleist, Stephan; Vrba, Václav; Vuillermet, Raphaël; Wang, Rui; Watts, Stephen; Weber, Michele; Weber, Marteen; Weigell, Philipp; Weingarten, Jens; Welch, Steven David; Wenig, Siegfried; Wermes, Norbert; Wiese, Andreas; Wittig, Tobias; Yildizkaya, Tamer; Zeitnitz, Christian; Ziolkowski, Michal; Zivkovic, Vladimir; Zoccoli, Antonio; Zorzi, Nicola; Zwalinski, Lukasz

2012-01-01

The ATLAS Collaboration will upgrade its semiconductor pixel tracking detector with a new Insertable B-layer (IBL) between the existing pixel detector and the vacuum pipe of the Large Hadron Collider. The extreme operating conditions at this location have necessitated the development of new radiation hard pixel sensor technologies and a new front-end readout chip, called the FE-I4. Planar pixel sensors and 3D pixel sensors have been investigated to equip this new pixel layer, and prototype modules using the FE-I4A have been fabricated and characterized using 120 GeV pions at the CERN SPS and 4 GeV positrons at DESY, before and after module irradiation. Beam test results are presented, including charge collection efficiency, tracking efficiency and charge sharing.

Indium phosphide-based monolithically integrated PIN waveguide photodiode readout for resonant cantilever sensors

Energy Technology Data Exchange (ETDEWEB)

Siwak, N. P. [Department of Electrical and Computer Engineering, Institute for Systems Research, University of Maryland, College Park, Maryland 20742 (United States); Laboratory for the Physical Sciences, 8050 Greenmead Drive, College Park, Maryland 20740 (United States); Fan, X. Z.; Ghodssi, R. [Department of Electrical and Computer Engineering, Institute for Systems Research, University of Maryland, College Park, Maryland 20742 (United States); Kanakaraju, S.; Richardson, C. J. K. [Laboratory for the Physical Sciences, 8050 Greenmead Drive, College Park, Maryland 20740 (United States)

2014-10-06

An integrated photodiode displacement readout scheme for a microelectromechanical cantilever waveguide resonator sensing platform is presented. III-V semiconductors are used to enable the monolithic integration of passive waveguides with active optical components. This work builds upon previously demonstrated results by measuring the displacement of cantilever waveguide resonators with on-chip waveguide PIN photodiodes. The on-chip integration of the readout provides an additional 70% improvement in mass sensitivity compared to off-chip photodetector designs due to measurement stability and minimized coupling loss. In addition to increased measurement stability, reduced packaging complexity is achieved due to the simplicity of the readout design. We have fabricated cantilever waveguides with integrated photodetectors and experimentally characterized these cantilever sensors with monolithically integrated PIN photodiodes.

Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules

CERN Document Server

Karadzhinova, Aneliya; Härkönen, Jaakko; Luukka, Panja-riina; Mäenpää, Teppo; Tuominen, Eija; Haeggstrom, Edward; Kalliopuska, Juha; Vahanen, Sami; Kassamakov, Ivan

2014-01-01

In contemporary high energy physics experiments, silicon detectors are essential for recording the trajectory of new particles generated by multiple simultaneous collisions. Modern particle tracking systems may feature 100 million channels, or pixels, which need to be individually connected to read-out chains. Silicon pixel detectors are typically connected to readout chips by flip-chip bonding using solder bumps. High-quality electro-mechanical flip-chip interconnects minimizes the number of dead read-out channels in the particle tracking system. Furthermore, the detector modules must endure handling during installation and withstand heat generation and cooling during operation. Silicon pixel detector modules were constructed by flip-chip bonding 16 readout chips to a single sensor. Eutectic SnPb solder bumps were deposited on the readout chips and the sensor chips were coated with TiW/Pt thin film UBM (under bump metallization). The modules were assembled at Advacam Ltd, Finland. We studied the uniformity o...

The rad-hard readout system of the BaBar silicon vertex tracker

Science.gov (United States)

Re, V.; DeWitt, J.; Dow, S.; Frey, A.; Johnson, R. P.; Kroeger, W.; Kipnis, I.; Leona, A.; Luo, L.; Mandelli, E.; Manfredi, P. F.; Nyman, M.; Pedrali-Noy, M.; Poplevin, P.; Perazzo, A.; Roe, N.; Spencer, N.

1998-02-01

This paper discusses the behaviour of a prototype rad-hard version of the chip developed for the readout of the BaBar silicon vertex tracker. A previous version of the chip, implemented in the 0.8 μm HP rad-soft version has been thoroughly tested in the recent times. It featured outstanding noise characteristics and showed that the specifications assumed as target for the tracker readout were met to a very good extent. The next step was the realization of a chip prototype in the rad-hard process that will be employed in the actual chip production. Such a prototype is structurally and functionally identical to its rad-soft predecessor. However, the process parameters being different, and not fully mastered at the time of design, some deviations in the behaviour were to be expected. The reasons for such deviations have been identified and some of them were removed by acting on the points that were left accessible on the chip. Other required small circuit modifications that will not affect the production schedule. The tests done so far on the rad-hard chip have shown that the noise behaviour is very close to that of the rad-soft version, that is fully adequate for the vertex detector readout.

Origami chip-on-sensor design: progress and new developments

International Nuclear Information System (INIS)

Irmler, C; Bergauer, T; Frankenberger, A; Friedl, M; Gfall, I; Valentan, M; Ishikawa, A; Kato, E; Negishi, K; Kameswara, R; Mohanty, G; Onuki, Y; Shimizu, N; Tsuboyama, T

2013-01-01

The Belle II silicon vertex detector will consist of four layers of double-sided silicon strip detectors, arranged in ladders. Each sensor will be read out individually by utilizing the Origami chip-on-sensor concept, where the APV25 chips are placed on flexible circuits, glued on top of the sensors. Beside a best compromise between low material budget and sufficient SNR, this concept allows efficient CO 2 cooling of the readout chips by a single, thin cooling pipe per ladder. Recently, we assembled a module consisting of two consecutive 6'' double-sided silicon strip detectors, both read out by Origami flexes. Such a compound of Origami modules is required for the ladders of the outer Belle II SVD layers. Consequently, it is intended to verify the scalability of the assembly procedure, the performance of combined Origami flexes as well as the efficiency of the CO 2 cooling system for a higher number of APV25 chips.

Pad readout for gas detectors using 128-channel integrated preamplifiers

International Nuclear Information System (INIS)

Fischer, P.; Drees, A.; Glassel, P.

1988-01-01

A novel two-dimensional readout scheme for gas detectors is presented which uses small metal pads with 2.54 mm pitch as an anode. The pads are read out via 128-channel VLSI low-noise preamplifier/multiplexer chips. These chips are mounted on 2.8x2.8 cm/sup 2/ modules which are directly plugged onto the detector backplane, daisy-chained with jumpers and read out sequentially. The readout has been successfully tested with a low-pressure, two-step, TMAE-filled UV-RICH detector prototype. A single electron efficiently of >90% was observed at moderate chamber gains (<10/sup 6/). The method offers high electronic amplification, low noise, and high readout speed with a very flexible and compact design, suited for space-limited applications

Yarr: A PCIe based readout system for semiconductor tracking systems

Energy Technology Data Exchange (ETDEWEB)

Heim, Timon [Bergische Universitaet Wuppertal, Wuppertal (Germany); CERN, Geneva (Switzerland); Maettig, Peter [Bergische Universitaet Wuppertal, Wuppertal (Germany); Pernegger, Heinz [CERN, Geneva (Switzerland)

2015-07-01

The Yarr readout system is a novel DAQ concept, using an FPGA board connected via PCIe to a computer, to read out semiconductor tracking systems. The system uses the FPGA as a reconfigurable IO interface which, in conjunction with the very high speed of the PCIe bus, enables a focus of processing the data stream coming from the pixel detector in software. Modern computer system could potentially make the need of custom signal processing hardware in readout systems obsolete and the Yarr readout system showcases this for FE-I4 chips, which are state-of-the-art readout chips used in the ATLAS Pixel Insertable B-Layer and developed for tracking in high multiplicity environments. The underlying concept of the Yarr readout system tries to move intelligence from hardware into the software without the loss of performance, which is made possible by modern multi-core processors. The FPGA board firmware acts like a buffer and does no further processing of the data stream, enabling rapid integration of new hardware due to minimal firmware minimisation.

Emulation and Calibration of the SALT Read-out Chip for the Upstream Tracker for Modernised LHCb Detector

CERN Document Server

Dendek, Adam

2015-01-01

The LHCb is one of the four major experiments currently operating at CERN. The main reason for constructing the LHCb forward spectrometer was a precise measurement of the CP violation in heavy quarks section as well as search for a New Physics. To obtain interesting results, the LHCb is mainly focused on study of B meson decays. Unfortunately, due to the present data acquisition architecture, the LHCb experiment is statistically limited for collecting such events. This fact led the LHCb Collaboration to decide to perform far-reaching upgrade. Key part of this upgrade will be replacement of the TT detector. To perform this action, it was requited to design new tracking detector with entirely new front-end electronics. This detector will be called the Upstream Tracker (UT) and the read-out chip — SALT. This note presents an overall discussion on SALT chip. In particular, the emulation process of the SALT data preformed via the software written by the author.

Test of the CMS microstrip silicon tracker readout and control system

CERN Document Server

Zghiche, A

2001-01-01

The Microstrip Silicon tracker of the CMS detector is designed to provide robust particle tracking and vertex reconstruction within a strong magnetic field in the high luminosity environment of the LHC. The Tracker readout system employs Front-End Driver cards to digitize and buffer the analogue data arriving via optical links from on detector pipeline chips. The control chain of the front-end electronic is built to operate via optical fibers in order to shield the communications from the outside noise. Components close to the final design have been assembled to be tested in the X5 beam area at CERN where a dedicated 25 ns temporal structure beam has been made available by the SPS. This paper describes the hardware and the software developed for readout and control of data acquired by the front-end electronics operating at 40 MHz, Some preliminary results of the tests performed in the 25 ns beam are also given. (8 refs).

The RD53 collaboration's SystemVerilog-UVM simulation framework and its general applicability to design of advanced pixel readout chips

International Nuclear Information System (INIS)

Marconi, S; Christiansen, J; Conti, E; Placidi, P; Hemperek, T

2014-01-01

The foreseen Phase 2 pixel upgrades at the LHC have very challenging requirements for the design of hybrid pixel readout chips. A versatile pixel simulation platform is as an essential development tool for the design, verification and optimization of both the system architecture and the pixel chip building blocks (Intellectual Properties, IPs). This work is focused on the implemented simulation and verification environment named VEPIX53, built using the SystemVerilog language and the Universal Verification Methodology (UVM) class library in the framework of the RD53 Collaboration. The environment supports pixel chips at different levels of description: its reusable components feature the generation of different classes of parameterized input hits to the pixel matrix, monitoring of pixel chip inputs and outputs, conformity checks between predicted and actual outputs and collection of statistics on system performance. The environment has been tested performing a study of shared architectures of the trigger latency buffering section of pixel chips. A fully shared architecture and a distributed one have been described at behavioral level and simulated; the resulting memory occupancy statistics and hit loss rates have subsequently been compared

Simulation of digital pixel readout chip architectures with the RD53 SystemVerilog-UVM verification environment using Monte Carlo physics data

International Nuclear Information System (INIS)

Conti, E.; Marconi, S.; Christiansen, J.; Placidi, P.; Hemperek, T.

2016-01-01

The simulation and verification framework developed by the RD53 collaboration is a powerful tool for global architecture optimization and design verification of next generation hybrid pixel readout chips. In this paper the framework is used for studying digital pixel chip architectures at behavioral level. This is carried out by simulating a dedicated, highly parameterized pixel chip description, which makes it possible to investigate different grouping strategies between pixels and different latency buffering and arbitration schemes. The pixel hit information used as simulation input can be either generated internally in the framework or imported from external Monte Carlo detector simulation data. The latter have been provided by both the CMS and ATLAS experiments, featuring HL-LHC operating conditions and the specifications related to the Phase 2 upgrade. Pixel regions and double columns were simulated using such Monte Carlo data as inputs: the performance of different latency buffering architectures was compared and the compliance of different link speeds with the expected column data rate was verified

A novel integrated circuit for semiconductor radiation detectors with sparse readout

International Nuclear Information System (INIS)

Zhang Yacong; Chen Zhognjian; Lu Wengao; Zhao Baoying; Ji Lijiu

2008-01-01

A novel fully integrated CMOS readout circuit for semiconductor radiation detector with sparse readout is presented. The new sparse scheme is: when one channel is being read out, the trigger signal from other channels is delayed and then processed. Therefore, the dead time is reduced and so is the error rate. Besides sparse readout, sequential readout is also allowed, which means the analog voltages and addresses of all the channels are read out sequentially once there is a channel triggered. The circuit comprises Charge Sensitive Amplifier (CSA), pulse shaper, peak detect and hold circuit, and digital logic. A test chip of four channels designed in a 0.5 μ DPTM CMOS technology has been taped out. The results of post simulation indicate that the gain is 79.3 mV/fC with a linearity of 99.92%. The power dissipation is 4 mW per channel. Theory analysis and calculation shows that the error probability is approximately 2.5%, which means a reduction of about 37% is obtained compared with the traditional scanning scheme, assuming a 16-channel system with a particle rate of 100 k/s per channel. (authors)

Application specific integrated circuit (ASIC) readout technologies for future ion beam analytical instruments

Energy Technology Data Exchange (ETDEWEB)

Whitlow, Harry J. E-mail: harry_j.whitlow@nuclear.lu.se

2000-03-01

New possibilities for ion beam analysis (IBA) are afforded by recent developments in detector technology which facilitate the parallel collection of data from a large number of channels. Application specific integrated circuit (ASIC) technologies, which have been widely employed for multi-channel readout systems in nuclear and particle physics, are more net-cost effective (160/channel for 1000 channels) and a more rational solution for readout of a large number of channels than afforded by conventional electronics. Based on results from existing and on-going chip designs, the possibilities and issues of ASIC readout technology are considered from the IBA viewpoint. Consideration is given to readout chip architecture and how the stringent resolution, linearity and stability requirements for IBA may be met. In addition the implications of the restrictions imposed by ASIC technology are discussed.

Evaluation of mixed-signal noise effects in photon-counting X-ray image sensor readout circuits

International Nuclear Information System (INIS)

Lundgren, Jan; Abdalla, Suliman; O'Nils, Mattias; Oelmann, Bengt

2006-01-01

In readout electronics for photon-counting pixel detectors, the tight integration between analog and digital blocks causes the readout electronics to be sensitive to on-chip noise coupling. This noise coupling can result in faulty luminance values in grayscale X-ray images, or as color distortions in a color X-ray imaging system. An exploration of simulating noise coupling in readout circuits is presented which enables the discovery of sensitive blocks at as early a stage as possible, in order to avoid costly design iterations. The photon-counting readout system has been simulated for noise coupling in order to highlight the existing problems of noise coupling in X-ray imaging systems. The simulation results suggest that on-chip noise coupling should be considered and simulated in future readout electronics systems for X-ray detectors

A 240-channel thick film multi-chip module for readout of silicon drift detectors

International Nuclear Information System (INIS)

Lynn, D.; Bellwied, R.; Beuttenmueller, R.; Caines, H.; Chen, W.; DiMassimo, D.; Dyke, H.; Elliott, D.; Grau, M.; Hoffmann, G.W.; Humanic, T.; Jensen, P.; Kleinfelder, S.A.; Kotov, I.; Kraner, H.W.; Kuczewski, P.; Leonhardt, B.; Li, Z.; Liaw, C.J.; LoCurto, G.; Middelkamp, P.; Minor, R.; Mazeh, N.; Nehmeh, S.; O'Conner, P.; Ott, G.; Pandey, S.U.; Pruneau, C.; Pinelli, D.; Radeka, V.; Rescia, S.; Rykov, V.; Schambach, J.; Sedlmeir, J.; Sheen, J.; Soja, B.; Stephani, D.; Sugarbaker, E.; Takahashi, J.; Wilson, K.

2000-01-01

We have developed a thick film multi-chip module for readout of silicon drift (or low capacitance ∼200 fF) detectors. Main elements of the module include a custom 16-channel NPN-BJT preamplifier-shaper (PASA) and a custom 16-channel CMOS Switched Capacitor Array (SCA). The primary design criteria of the module were the minimizations of the power (12 mW/channel), noise (ENC=490 e - rms), size (20.5 mmx63 mm), and radiation length (1.4%). We will discuss various aspects of the PASA design, with emphasis on the preamplifier feedback network. The SCA is a modification of an integrated circuit that has been previously described [1]; its design features specific to its application in the SVT (Silicon Vertex Tracker in the STAR experiment at RHIC) will be discussed. The 240-channel multi-chip module is a circuit with five metal layers fabricated in thick film technology on a beryllia substrate and contains 35 custom and commercial integrated circuits. It has been recently integrated with silicon drift detectors in both a prototype system assembly for the SVT and a silicon drift array for the E896 experiment at the Alternating Gradient Synchrotron at the Brookhaven National Laboratory. We will discuss features of the module's design and fabrication, report the test results, and emphasize its performance both on the bench and under experimental conditions

Readout electronics development for the ATLAS silicon tracker

International Nuclear Information System (INIS)

Borer, K.; Beringer, J.; Anghinolfi, F.; Aspell, P.; Chilingarov, A.; Jarron, P.; Heijne, E.H.M.; Santiard, J.C.; Verweij, H.; Goessling, C.; Lisowski, B.; Reichold, A.; Bonino, R.; Clark, A.G.; Kambara, H.; La Marra, D.; Leger, A.; Wu, X.; Richeux, J.P.; Taylor, G.N.; Fedotov, M.; Kuper, E.; Velikzhanin, Yu.; Campbell, D.; Murray, P.; Seller, P.

1995-01-01

We present the status of the development of the readout electronics for the large area silicon tracker of the ATLAS experiment at the LHC, carried out by the CERN RD2 project. Our basic readout concept is to integrate a fast amplifier, analog memory, sparse data scan circuit and analog-to-digital convertor (ADC) on a single VLSI chip. This architecture will provide full analog information of charged particle hits associated unambiguously to one LHC beam crossing, which is expected to be at a frequency of 40 MHz. The expected low occupancy of the ATLAS inner silicon detectors allows us to use a low speed (5 MHz) on-chip ADC with a multiplexing scheme. The functionality of the fast amplifier and analog memory have been demonstrated with various prototype chips. Most recently we have successfully tested improved versions of the amplifier and the analog memory. A piecewise linear ADC has been fabricated and performed satisfactorily up to 5 MHz. A new chip including amplifier, analog memory, memory controller, ADC, and data buffer has been designed and submitted for fabrication and will be tested on a prototype of the ATLAS silicon tracker module with realistic electrical and mechanical constraints. (orig.)

Development of n+-in-p planar pixel quadsensor flip-chipped with FE-I4 readout ASICs

International Nuclear Information System (INIS)

Unno, Y.; Hanagaki, K.; Hori, R.; Ikegami, Y.; Nakamura, K.; Takubo, Y.; Kamada, S.; Yamamura, K.; Yamamoto, H.; Takashima, R.; Tojo, J.; Kono, T.; Nagai, R.; Saito, S.; Sugibayashi, K.; Hirose, M.; Jinnouchi, O.; Sato, S.; Sawai, H.; Hara, K.

2017-01-01

We have developed flip-chip modules applicable to the pixel detector for the HL-LHC. New radiation-tolerant n + -in-p planar pixel sensors of a size of four FE-I4 application-specific integrated circuits (ASICs) are laid out in a 6-in wafer. Variation in readout connection for the pixels at the boundary of ASICs is implemented in the design of quadsensors. Bump bonding technology is developed for four ASICs onto one quadsensor. Both sensors and ASICs are thinned to 150 μm before bump bonding, and are held flat with vacuum chucks. Using lead-free SnAg solder bumps, we encounter deficiency with large areas of disconnected bumps after thermal stress treatment, including irradiation. Surface oxidation of the solder bumps is identified as a critical source of this deficiency after bump bonding trials, using SnAg bumps with solder flux, indium bumps, and SnAg bumps with a newly-introduced hydrogen-reflow process. With hydrogen-reflow, we establish flux-less bump bonding technology with SnAg bumps, appropriate for mass production of the flip-chip modules with thin sensors and thin ASICs.

The PASTA chip. A free-running readout ASIC for silicon strip sensors in PANDA

Energy Technology Data Exchange (ETDEWEB)

Goerres, Andre; Stockmanns, Tobias; Ritman, James [Forschungszentrum Juelich GmbH, Juelich (Germany); Rivetti, Angelo [INFN Sezione di Torino, Torino (Italy); Collaboration: PANDA-Collaboration

2015-07-01

The PANDA experiment is a multi purpose detector, investigating hadron physics in the charm quark mass regime. It is one of the main experiments at the future FAIR accelerator facility, using anti pp annihilations from a 1.5-15 GeV/c anti-proton beam. Because of the broad physics spectrum and the similarity of event and background signals, PANDA does an event selection based on the complete raw data of the detector. The innermost of PANDA's sub-systems is the Micro Vertex Detector (MVD), consisting of silicon pixel and strip sensors. The latter will be read out by a specialized, free-running readout front-end called PANDA Strip ASIC (PASTA). It has to face a high event rate of up to 40 kHz/ch in an radiation-intense environment. To fulfill the MVD's requirements, it has to give accurate timing information to incoming events (<10 ns) and determine the collected charge with an 8-bit precision. All this has to be done with a very low power design (<4 mW/ch) on a small footprint with less than 21 mm{sup 2} and 60 μm input pitch for 64 channels per chip. Therefore, a simple, time-based readout approach with two independent thresholds is chosen. In this talk, the conceptual design of the full front-end and some aspects of the digital part are presented.

A new ATLAS muon CSC readout system with system on chip technology on ATCA platform

Science.gov (United States)

Claus, R.; ATLAS Collaboration

2016-07-01

The ATLAS muon Cathode Strip Chamber (CSC) back-end readout system has been upgraded during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfiguration Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the ATCA platform. The RCE design is based on the new System on Chip Xilinx Zynq series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the Zynq for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chambers to be processed by 6 COBs in one ATCA shelf through software waveform feature extraction to output 32 S-links. The full system was installed in Sept. 2014. We will present the RCE/COB design concept, the firmware and software processing architecture, and the experience from the intense commissioning towards LHC Run 2.

A new ATLAS muon CSC readout system with system on chip technology on ATCA platform

International Nuclear Information System (INIS)

Claus, R.

2016-01-01

The ATLAS muon Cathode Strip Chamber (CSC) back-end readout system has been upgraded during the LHC 2013–2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfiguration Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the ATCA platform. The RCE design is based on the new System on Chip Xilinx Zynq series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the Zynq for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chambers to be processed by 6 COBs in one ATCA shelf through software waveform feature extraction to output 32 S-links. The full system was installed in Sept. 2014. We will present the RCE/COB design concept, the firmware and software processing architecture, and the experience from the intense commissioning towards LHC Run 2.

A new ATLAS muon CSC readout system with system on chip technology on ATCA platform

Science.gov (United States)

Bartoldus, R.; Claus, R.; Garelli, N.; Herbst, R. T.; Huffer, M.; Iakovidis, G.; Iordanidou, K.; Kwan, K.; Kocian, M.; Lankford, A. J.; Moschovakos, P.; Nelson, A.; Ntekas, K.; Ruckman, L.; Russell, J.; Schernau, M.; Schlenker, S.; Su, D.; Valderanis, C.; Wittgen, M.; Yildiz, S. C.

2016-01-01

The ATLAS muon Cathode Strip Chamber (CSC) backend readout system has been upgraded during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run-2 luminosity. The readout design is based on the Reconfigurable Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the Advanced Telecommunication Computing Architecture (ATCA) platform. The RCE design is based on the new System on Chip XILINX ZYNQ series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources. Together with auxiliary memories, all these components form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the ZYNQ for high speed input and output fiberoptic links and TTC allowed the full system of 320 input links from the 32 chambers to be processed by 6 COBs in one ATCA shelf. The full system was installed in September 2014. We will present the RCE/COB design concept, the firmware and software processing architecture, and the experience from the intense commissioning for LHC Run 2.

A new ATLAS muon CSC readout system with system on chip technology on ATCA platform

International Nuclear Information System (INIS)

Bartoldus, R.; Claus, R.; Garelli, N.; Herbst, R.T.; Huffer, M.; Kocian, M.; Ruckman, L.; Russell, J.; Su, D.; Wittgen, M.; Iakovidis, G.; Iordanidou, K.; Moschovakos, P.; Ntekas, K.; Kwan, K.; Lankford, A.J.; Nelson, A.; Schernau, M.; Schlenker, S.; Valderanis, C.

2016-01-01

The ATLAS muon Cathode Strip Chamber (CSC) backend readout system has been upgraded during the LHC 2013-2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run-2 luminosity. The readout design is based on the Reconfigurable Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the Advanced Telecommunication Computing Architecture (ATCA) platform. The RCE design is based on the new System on Chip XILINX ZYNQ series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources. Together with auxiliary memories, all these components form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the ZYNQ for high speed input and output fiberoptic links and TTC allowed the full system of 320 input links from the 32 chambers to be processed by 6 COBs in one ATCA shelf. The full system was installed in September 2014. We will present the RCE/COB design concept, the firmware and software processing architecture, and the experience from the intense commissioning for LHC Run 2

A new ATLAS muon CSC readout system with system on chip technology on ATCA platform

Energy Technology Data Exchange (ETDEWEB)

Claus, R., E-mail: claus@slac.stanford.edu

2016-07-11

The ATLAS muon Cathode Strip Chamber (CSC) back-end readout system has been upgraded during the LHC 2013–2015 shutdown to be able to handle the higher Level-1 trigger rate of 100 kHz and the higher occupancy at Run 2 luminosity. The readout design is based on the Reconfiguration Cluster Element (RCE) concept for high bandwidth generic DAQ implemented on the ATCA platform. The RCE design is based on the new System on Chip Xilinx Zynq series with a processor-centric architecture with ARM processor embedded in FPGA fabric and high speed I/O resources together with auxiliary memories to form a versatile DAQ building block that can host applications tapping into both software and firmware resources. The Cluster on Board (COB) ATCA carrier hosts RCE mezzanines and an embedded Fulcrum network switch to form an online DAQ processing cluster. More compact firmware solutions on the Zynq for G-link, S-link and TTC allowed the full system of 320 G-links from the 32 chambers to be processed by 6 COBs in one ATCA shelf through software waveform feature extraction to output 32 S-links. The full system was installed in Sept. 2014. We will present the RCE/COB design concept, the firmware and software processing architecture, and the experience from the intense commissioning towards LHC Run 2.

Test beam results of the first CMS double-sided strip module prototypes using the CBC2 read-out chip

Energy Technology Data Exchange (ETDEWEB)

Harb, Ali, E-mail: ali.harb@desy.de; Mussgiller, Andreas; Hauk, Johannes

2017-02-11

The CMS Binary Chip (CBC) is a prototype version of the front-end read-out ASIC to be used in the silicon strip modules of the CMS outer tracking detector during the high luminosity phase of the LHC. The CBC is produced in 130 nm CMOS technology and bump-bonded to the hybrid of a double layer silicon strip module, the so-called 2S-p{sub T} module. It has 254 input channels and is designed to provide on-board trigger information to the first level trigger system of CMS, with the capability of cluster-width discrimination and high-p{sub T} track identification. In November 2013 the first 2S-p{sub T} module prototypes equipped with the CBC chips were put to test at the DESY-II test beam facility. Data were collected exploiting a beam of positrons with an energy ranging from 2 to 4 GeV. In this paper the test setup and the results are presented.

Design and standalone characterisation of a capacitively coupled HV-CMOS sensor chip for the CLIC vertex detector

Science.gov (United States)

Kremastiotis, I.; Ballabriga, R.; Campbell, M.; Dannheim, D.; Fiergolski, A.; Hynds, D.; Kulis, S.; Peric, I.

2017-09-01

The concept of capacitive coupling between sensors and readout chips is under study for the vertex detector at the proposed high-energy CLIC electron positron collider. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is an active High-Voltage CMOS sensor, designed to be capacitively coupled to the CLICpix2 readout chip. The chip is implemented in a commercial 180 nm HV-CMOS process and contains a matrix of 128×128 square pixels with 25μm pitch. First prototypes have been produced with a standard resistivity of ~20 Ωcm for the substrate and tested in standalone mode. The results show a rise time of ~20 ns, charge gain of 190 mV/ke- and ~40 e- RMS noise for a power consumption of 4.8μW/pixel. The main design aspects, as well as standalone measurement results, are presented.

MEMS capacitive pressure sensor monolithically integrated with CMOS readout circuit by using post CMOS processes

Science.gov (United States)

Jang, Munseon; Yun, Kwang-Seok

2017-12-01

In this paper, we presents a MEMS pressure sensor integrated with a readout circuit on a chip for an on-chip signal processing. The capacitive pressure sensor is formed on a CMOS chip by using a post-CMOS MEMS processes. The proposed device consists of a sensing capacitor that is square in shape, a reference capacitor and a readout circuitry based on a switched-capacitor scheme to detect capacitance change at various environmental pressures. The readout circuit was implemented by using a commercial 0.35 μm CMOS process with 2 polysilicon and 4 metal layers. Then, the pressure sensor was formed by wet etching of metal 2 layer through via hole structures. Experimental results show that the MEMS pressure sensor has a sensitivity of 11 mV/100 kPa at the pressure range of 100-400 kPa.

Readout scheme for the Baby-MIND detector

CERN Document Server

Noah, Etam; Cadoux, F; Favre, Y; Martinez, B; Nicola, L; Parsa, S; Rayner, M; Antonova, M; Fedotov, S; Izmaylov, A; Kleymenova, A; Khabibullin, M; Khotyantsev, A; Kudenko, Y; Likhacheva, V; Mefodiev, A; Mineev, O; Ovsiannikova, T; Shaykhiev, A; Suvorov, S; Yershov, N; Tsenov, R

2016-01-01

A readout scheme has been designed for the plastic scintillator bars of the Baby-MIND detector modules. This spectrometer will measure momentum and identify the charge of 1 GeV/c muons with magnetized iron plates interleaved with detector modules. One challenge the detector aims to address is that of keeping high charge identification efficiencies for momenta below 1 GeV/c where multiple scattering in the iron plates degrades momentum resolution. A front-end board has been developed, with 3 CITIROC readout chips per board and up to 96 channels. Hamamatsu MPPCs type S12571-025C photosensors were chosen for readout of wavelength shifting fibers embedded in plastic scintillators. Procurement of the MPPCs has been carried out to instrument 3000 channels in total. Design choices and first results of this readout scheme are presented.

SPIDR, a general-purpose readout system for pixel ASICs

International Nuclear Information System (INIS)

Heijden, B. van der; Visser, J.; Beuzekom, M. van; Boterenbrood, H.; Munneke, B.; Schreuder, F.; Kulis, S.

2017-01-01

The SPIDR (Speedy PIxel Detector Readout) system is a flexible general-purpose readout platform that can be easily adapted to test and characterize new and existing detector readout ASICs. It is originally designed for the readout of pixel ASICs from the Medipix/Timepix family, but other types of ASICs or front-end circuits can be read out as well. The SPIDR system consists of an FPGA board with memory and various communication interfaces, FPGA firmware, CPU subsystem and an API library on the PC . The FPGA firmware can be adapted to read out other ASICs by re-using IP blocks. The available IP blocks include a UDP packet builder, 1 and 10 Gigabit Ethernet MAC's and a 'soft core' CPU . Currently the firmware is targeted at the Xilinx VC707 development board and at a custom board called Compact-SPIDR . The firmware can easily be ported to other Xilinx 7 series and ultra scale FPGAs. The gap between an ASIC and the data acquisition back-end is bridged by the SPIDR system. Using the high pin count VITA 57 FPGA Mezzanine Card (FMC) connector only a simple chip carrier PCB is required. A 1 and a 10 Gigabit Ethernet interface handle the connection to the back-end. These can be used simultaneously for high-speed data and configuration over separate channels. In addition to the FMC connector, configurable inputs and outputs are available for synchronization with other detectors. A high resolution (≈ 27 ps bin size) Time to Digital converter is provided for time stamping events in the detector. The SPIDR system is frequently used as readout for the Medipix3 and Timepix3 ASICs. Using the 10 Gigabit Ethernet interface it is possible to read out a single chip at full bandwidth or up to 12 chips at a reduced rate. Another recent application is the test-bed for the VeloPix ASIC, which is developed for the Vertex Detector of the LHCb experiment. In this case the SPIDR system processes the 20 Gbps scrambled data stream from the VeloPix and distributes it over four

Implementation of the Timepix ASIC in the Scalable Readout System

Energy Technology Data Exchange (ETDEWEB)

Lupberger, M., E-mail: lupberger@physik.uni-bonn.de; Desch, K.; Kaminski, J.

2016-09-11

We report on the development of electronics hardware, FPGA firmware and software to provide a flexible multi-chip readout of the Timepix ASIC within the framework of the Scalable Readout System (SRS). The system features FPGA-based zero-suppression and the possibility to read out up to 4×8 chips with a single Front End Concentrator (FEC). By operating several FECs in parallel, in principle an arbitrary number of chips can be read out, exploiting the scaling features of SRS. Specifically, we tested the system with a setup consisting of 160 Timepix ASICs, operated as GridPix devices in a large TPC field cage in a 1 T magnetic field at a DESY test beam facility providing an electron beam of up to 6 GeV. We discuss the design choices, the dedicated hardware components, the FPGA firmware as well as the performance of the system in the test beam.

A novel readout integrated circuit for ferroelectric FPA detector

Science.gov (United States)

Bai, Piji; Li, Lihua; Ji, Yulong; Zhang, Jia; Li, Min; Liang, Yan; Hu, Yanbo; Li, Songying

2017-11-01

Uncooled infrared detectors haves some advantages such as low cost light weight low power consumption, and superior reliability, compared with cryogenically cooled ones Ferroelectric uncooled focal plane array(FPA) are being developed for its AC response and its high reliability As a key part of the ferroelectric assembly the ROIC determines the performance of the assembly. A top-down design model for uncooled ferroelectric readout integrated circuit(ROIC) has been developed. Based on the optical thermal and electrical properties of the ferroelectric detector the RTIA readout integrated circuit is designed. The noise bandwidth of RTIA readout circuit has been developed and analyzed. A novel high gain amplifier, a high pass filter and a low pass filter circuits are designed on the ROIC. In order to improve the ferroelectric FPA package performance and decrease of package cost a temperature sensor is designed on the ROIC chip At last the novel RTIA ROIC is implemented on 0.6μm 2P3M CMOS silicon techniques. According to the experimental chip test results the temporal root mean square(RMS)noise voltage is about 1.4mV the sensitivity of the on chip temperature sensor is 0.6 mV/K from -40°C to 60°C the linearity performance of the ROIC chip is better than 99% Based on the 320×240 RTIA ROIC, a 320×240 infrared ferroelectric FPA is fabricated and tested. Test results shows that the 320×240 RTIA ROIC meets the demand of infrared ferroelectric FPA.

The AMS silicon tracker readout, performance results with minimum ionizing particles

CERN Document Server

Alpat, B; Battiston, R; Bourquin, Maurice; Burger, W J; Extermann, Pierre; Chang, Y H; Hou, S R; Pauluzzi, M; Produit, N; Qiu, S; Rapin, D; Ribordy, R; Toker, O; Wu, S X

2000-01-01

First results for the AMS silicon tracker readout performance are presented. Small 20.0*20.0*0.300 mm/sup 3/ silicon microstrip detectors were installed in a 50 GeV electron beam at CERN. The detector readout consisted of prototypes of the tracker data reduction card equipped with a 12-bit ADC and the tracker frontend hybrid with VA_hdr readout chips. The system performance is assessed in terms of signal-to-noise, position resolution, and efficiency. (13 refs).

Medipix3 array high performance read-out board for synchrotron research

International Nuclear Information System (INIS)

Tartoni, N.; Horswell, I. C.; Marchal, J.; Gimenez, E. N.; Fearn, R. D.; Silfhout, R. G. van

2010-01-01

The Medipix3 ASIC is one of the most advanced chip that is presently available to build photon counting area detectors. The capabilities of the chip include adjacent pixels charge summing circuitry to sort out the distortion due to charge sharing, simultaneous counting and read-out that enables frames to be acquired without dead time, the colour mode of operation that enables up to eight energy bands to be acquired. In order to fully exploit the capabilities of the Medipix3 chip in synchrotron research, a high performance electronic board capable of driving large arrays of chips is necessary. We propose a parallel read-out board of Medipix3 chip arrays with a scalable architecture that allows driving the Medipix3 chip in all of its modes of operation. The board functions include the control of the chip arrays, data formatting and data compression, the management of the communications with the data storage devices, and operation in various trigger modes. In addition to this the board will have some 'intelligence' embedded. This will add some very important features to the final detector such as pattern recognition, capability of variable frame duration as a function of the photon flux, feedback to other equipment and real time calculations of data relevant to experiments such as the autocorrelation function.

A micromachined surface stress sensor with electronic readout

NARCIS (Netherlands)

Carlen, Edwin; Weinberg, M.S.; Zapata, A.M.; Borenstein, J.T.

2008-01-01

A micromachined surface stress sensor has been fabricated and integrated off chip with a low-noise, differential capacitance, electronic readout circuit. The differential capacitance signal is modulated with a high frequency carrier signal, and the output signal is synchronously demodulated and

Characterization of the CBC2 readout ASIC for the CMS strip-tracker high-luminosity upgrade

International Nuclear Information System (INIS)

Braga, D; Hall, G; Pesaresi, M; Raymond, M; Jones, L; Murray, P; Prydderch, M

2014-01-01

The CMS Binary Chip 2 (CBC2) is a full-scale prototype ASIC developed for the front-end readout of the high-luminosity upgrade of the CMS silicon strip tracker. The 254-channel, 130 nm CMOS ASIC is designed for the binary readout of double-layer modules, and features cluster-width discrimination and coincidence logic for detecting high-P T track candidates. The chip was delivered in January 2013 and has since been bump-bonded to a dual-chip hybrid and extensively tested. The CBC2 is fully functional and working to specification: we present the result of electrical characterization of the chip, including gain, noise, threshold scan and power consumption, together with the performance of the stub finding logic. Finally we will outline the plan for future developments towards the production version

Development of pixel readout integrated circuits for extreme rate and radiation

CERN Multimedia

Liberali, V; Rizzi, A; Re, V; Minuti, M; Pangaud, P; Barbero, M B; Pacher, L; Kluit, R; Hinchliffe, I; Manghisoni, M; Giubilato, P; Faccio, F; Pernegger, H; Krueger, H; Gensolen, F D; Bilei, G M; Da rocha rolo, M D; Prydderch, M L; Fanucci, L; Grillo, A A; Bellazzini, R; Palomo pinto, F R; Michelis, S; Huegging, F G; Kishishita, T; Marchiori, G; Christian, D C; Kaestli, H C; Meier, B; Andreazza, A; Key-charriere, M; Linssen, L; Dannheim, D; Conti, E; Hemperek, T; Menouni, M; Fougeron, D; Genat, J; Bomben, M; Marzocca, C; Demaria, N; Mazza, G; Van bakel, N A; Palla, F; Grippo, M T; Magazzu, G; Ratti, L; Abbaneo, D; Crescioli, F; Deptuch, G W; Neue, G; De robertis, G; Passeri, D; Placidi, P; Gromov, V; Morsani, F; Paccagnella, A; Christiansen, J; Dho, E; Wermes, N; Rymaszewski, P; Rozanov, A; Wang, A; Lipton, R J; Havranek, M; Neviani, A; Marconi, S; Karagounis, M; Godiot, S; Calderini, G; Seidel, S C; Horisberger, R P; Garcia-sciveres, M A; Stabile, A; Beccherle, R; Bacchetta, N

The present hybrid pixel detectors in operation at the LHC represent a major achievement. They deployed a new technology on an unprecedented scale and their success firmly established pixel tracking as indispensable for future HEP experiments. However, extrapolation of hybrid pixel technology to the HL-LHC presents major challenges on several fronts. We propose a new RD collaboration specifically focused on the development of pixel readout Integrated Circuits (IC). The IC challenges include: smaller pixels to resolve tracks in boosted jets, much higher hit rates (1-2 GHz/cm$^{2}$), unprecedented radiation tolerance (10 MGy), much higher output bandwidth, and large IC format with low power consumption in order to instrument large areas while keeping the material budget low. We propose a collaboration to design the next generation of hybrid pixel readout chips to enable the ATLAS and CMS Phase 2 pixel upgrades. This does not imply that ATLAS and CMS must use the same exact pixel readout chip, as most of the dev...

The universal read-out controller for CBM at FAIR

Energy Technology Data Exchange (ETDEWEB)

Manz, Sebastian; Abel, Norbert; Gebelein, Jano [Kirchhoff-Institut fuer Physik, Heidelberg (Germany); Collaboration: CBM-Collaboration

2011-07-01

Since 2007 we design and develop the firmware for the read-out controller (ROC) for data acquisition of the CBM detector at FAIR. While our first implementation solely focused on the nXYTER chip, today we are also designing and implementing readout logic for the GET4 chip which is supposed to be part of the time of flight (TOF) detector. Furthermore, we fully support both Ethernet and Optical transport as two transparent solutions. This addresses the different requirements of a laboratory setup and the final detector setup respectively. The usage of a strict modularization of the Read Out Controller firmware enables us to provide an Universal ROC where front-end specific logic and transport logic can be combined in a very flexible way. Fault tolerance techniques are only required for some of those modules and hence are only implemented there.

An asynchronous data-driven readout prototype for CEPC vertex detector

Science.gov (United States)

Yang, Ping; Sun, Xiangming; Huang, Guangming; Xiao, Le; Gao, Chaosong; Huang, Xing; Zhou, Wei; Ren, Weiping; Li, Yashu; Liu, Jianchao; You, Bihui; Zhang, Li

2017-12-01

The Circular Electron Positron Collider (CEPC) is proposed as a Higgs boson and/or Z boson factory for high-precision measurements on the Higgs boson. The precision of secondary vertex impact parameter plays an important role in such measurements which typically rely on flavor-tagging. Thus silicon CMOS Pixel Sensors (CPS) are the most promising technology candidate for a CEPC vertex detector, which can most likely feature a high position resolution, a low power consumption and a fast readout simultaneously. For the R&D of the CEPC vertex detector, we have developed a prototype MIC4 in the Towerjazz 180 nm CMOS Image Sensor (CIS) process. We have proposed and implemented a new architecture of asynchronous zero-suppression data-driven readout inside the matrix combined with a binary front-end inside the pixel. The matrix contains 128 rows and 64 columns with a small pixel pitch of 25 μm. The readout architecture has implemented the traditional OR-gate chain inside a super pixel combined with a priority arbiter tree between the super pixels, only reading out relevant pixels. The MIC4 architecture will be introduced in more detail in this paper. It will be taped out in May and will be characterized when the chip comes back.

OSL signal of IC chips from mobile phones for dose assessment in accidental dosimetry

International Nuclear Information System (INIS)

Mrozik, A.; Marczewska, B.; Bilski, P.; Książek, M.

2017-01-01

The rapid assessment of the radiation dose is very important for the prediction of biological effects after unintended exposition. The materials for use as dosimeters in accidental dosimetry should be everyday objects which are usually placed near the human body, for example mobile phones. IC (Integrated Circuit) chip is one of several electronic components of mobile phones which give a luminescent signal. The measurements of samples from different mobile phones and smartphones were conducted by optically stimulated luminescence (OSL) and thermoluminescence (TL) methods. The OSL measurement was performed in two ways: with readouts at room temperature and at 100 °C. This work is focused on determination of OSL dose response of IC chips, minimum detectable dose (MDD), OSL signal stability in the time after the exposition, its repeatability and sensitivity to light. Several tests of the assessment of unknown doses were also conducted. The readouts at 100 °C indicate the reducing of the fading of OSL signal in the first hours after irradiation in comparison with room temperature readouts. The obtained results showed relatively good dosimetric properties of IC chips: their high sensitivity to the ionizing radiation, linear dose response up to 10 Gy and a good reproducibility of OSL signal which can allow the dose recovery of doses less than 2 Gy in 14 days after an incident with the accuracy better than 25%. The fading is a drawback of IC chips and the fading factor should be considered when calculating the dose. - Highlights: • IC chips from smartphones demonstrated high potential for accidental dosimetry. • Minimum detectable dose was estimated as a value of 50 mGy. • Samples showed linear dose response for the dose range from 0.05 Gy up to 10 Gy.

A TDC integrated circuit for drift chamber readout

International Nuclear Information System (INIS)

Passaseo, M.; Petrolo, E.; Veneziano, S.

1995-01-01

A custom integrated circuit for the measurement of the signal drift-time coming from the KLOE chamber developed by INFN Sezione di Roma is presented. The circuit is a multichannel common start/stop TDC, with 32 channels per chip. The TDC integrated circuit will be developed as a full-custom device in 0.5 μm CMOS technology, with 1 ns LSB realized using a Gray counter working at the frequency of 1 GHz. The circuit is capable of detecting rising/falling edges, with a double edge resolution of 8 ns; the hits are recorded as 16 bit words, hits older than a programmable time window are discarded, if not confirmed by a stop signal. The chip has four event-buffers, which are used only if at least one hit is present in one of the 32 channels. The readout of the data passes through the I/O port at a speed of 33 MHz; empty channels are automatically skipped during the readout phase. (orig.)

A TDC integrated circuit for drift chamber readout

Energy Technology Data Exchange (ETDEWEB)

Passaseo, M. [Istituto Nazionale di Fisica Nucleare, Rome (Italy); Petrolo, E. [Istituto Nazionale di Fisica Nucleare, Rome (Italy); Veneziano, S. [Istituto Nazionale di Fisica Nucleare, Rome (Italy)

1995-12-11

A custom integrated circuit for the measurement of the signal drift-time coming from the KLOE chamber developed by INFN Sezione di Roma is presented. The circuit is a multichannel common start/stop TDC, with 32 channels per chip. The TDC integrated circuit will be developed as a full-custom device in 0.5 {mu}m CMOS technology, with 1 ns LSB realized using a Gray counter working at the frequency of 1 GHz. The circuit is capable of detecting rising/falling edges, with a double edge resolution of 8 ns; the hits are recorded as 16 bit words, hits older than a programmable time window are discarded, if not confirmed by a stop signal. The chip has four event-buffers, which are used only if at least one hit is present in one of the 32 channels. The readout of the data passes through the I/O port at a speed of 33 MHz; empty channels are automatically skipped during the readout phase. (orig.).

High-speed readout of high-Z pixel detectors with the LAMBDA detector

International Nuclear Information System (INIS)

Pennicard, D.; Smoljanin, S.; Sheviakov, I.; Xia, Q.; Rothkirch, A.; Yu, Y.; Struth, B.; Hirsemann, H.; Graafsma, H.

2014-01-01

High-frame-rate X-ray pixel detectors make it possible to perform time-resolved experiments at synchrotron beamlines, and to make better use of these sources by shortening experiment times. LAMBDA is a photon-counting hybrid pixel detector based on the Medipix3 chip, designed to combine a small pixel size of 55 μm, a large tileable module design, high speed, and compatibility with ''high-Z'' sensors for hard X-ray detection. This technical paper focuses on LAMBDA's high-speed-readout functionality, which allows a frame rate of 2000 frames per second with no deadtime between successive images. This takes advantage of the Medipix3 chip's ''continuous read-write'' function and highly parallelised readout. The readout electronics serialise this data and send it back to a server PC over two 10 Gigabit Ethernet links. The server PC controls the detector and receives, processes and stores the data using software designed for the Tango control system. As a demonstration of high-speed readout of a high-Z sensor, a GaAs LAMBDA detector was used to make a high-speed X-ray video of a computer fan

RD Collaboration Proposal: Development of pixel readout integrated circuits for extreme rate and radiation

CERN Document Server

Chistiansen, J (CERN)

2013-01-01

This proposal describes a new RD collaboration to develop the next genrration of hybrid pixel readout chips for use in ATLAS and CMS PHase 2 upgrades. extrapolation of hybrid pixel technology to the HL-LHC presents major challenges on several fronts. Challenges include: smaller pixels to resolve tracks in boosted jets, much higher hit rates (1-2 GHz/cm2 ), unprecedented radiation tolerance (10 MGy), much higher output bandwidth, and large IC format with low power consumption in order to instrument large areas while keeping the material budget low. This collaboration is specifically focused on design of hybrid pixel readout chips, and not on more general chip design or on other aspects of hybrid pixel technology. Participants include 7 institutes on ATLAS and 7 on CMS, plus 2 on both experiments.

Simulations of busy probabilities in the ALPIDE chip and the upgraded ALICE ITS detector

CERN Document Server

Nesbo, Simon Voigt; Bonora, Matthias; Giubilato, Piero; Helstrup, Haavard; Hristozkov, Svetlomir; Aglieri Rinella, Gianluca; Röhrich, Dieter; Schambach, Joachim; Shahoyan, Ruben; Ullaland, Kjetil

2017-01-01

For the Long Shutdown 2 (LS2) upgrade of the ITS detector in the ALICE experiment at the LHC, a novel pixel detector chip, the ALPIDE chip, has been developed. In the event of busy ALPIDE chips in the ITS detector, the readout electronics may need to take appropriate action to minimize loss of data. This paper presents a lightweight, statistical simulation model for the ALPIDE chip and the up- graded ITS detector, developed using the SystemC framework. The purpose of the model is to quantify the probability of a busy condition and the data taking efficiency of the ALPIDE chips under various conditions, and to apply this knowledge during the development of the readout electronics and firmware.

On-Chip Microwave Quantum Hall Circulator

Directory of Open Access Journals (Sweden)

A. C. Mahoney

2017-01-01

Full Text Available Circulators are nonreciprocal circuit elements that are integral to technologies including radar systems, microwave communication transceivers, and the readout of quantum information devices. Their nonreciprocity arises from the interference of microwaves over the centimeter scale of the signal wavelength, in the presence of bulky magnetic media that breaks time-reversal symmetry. Here, we realize a completely passive on-chip microwave circulator with size 1/1000th the wavelength by exploiting the chiral, “slow-light” response of a two-dimensional electron gas in the quantum Hall regime. For an integrated GaAs device with 330  μm diameter and about 1-GHz center frequency, a nonreciprocity of 25 dB is observed over a 50-MHz bandwidth. Furthermore, the nonreciprocity can be dynamically tuned by varying the voltage at the port, an aspect that may enable reconfigurable passive routing of microwave signals on chip.

Investigation of image distortion due to MCP electronic readout misalignment and correction via customized GUI application

Science.gov (United States)

Vitucci, G.; Minniti, T.; Tremsin, A. S.; Kockelmann, W.; Gorini, G.

2018-04-01

The MCP-based neutron counting detector is a novel device that allows high spatial resolution and time-resolved neutron radiography and tomography with epithermal, thermal and cold neutrons. Time resolution is possible by the high readout speeds of ~ 1200 frames/sec, allowing high resolution event counting with relatively high rates without spatial resolution degradation due to event overlaps. The electronic readout is based on a Timepix sensor, a CMOS pixel readout chip developed at CERN. Currently, a geometry of a quad Timepix detector is used with an active format of 28 × 28 mm2 limited by the size of the Timepix quad (2 × 2 chips) readout. Measurements of a set of high-precision micrometers test samples have been performed at the Imaging and Materials Science & Engineering (IMAT) beamline operating at the ISIS spallation neutron source (U.K.). The aim of these experiments was the full characterization of the chip misalignment and of the gaps between each pad in the quad Timepix sensor. Such misalignment causes distortions of the recorded shape of the sample analyzed. We present in this work a post-processing image procedure that considers and corrects these effects. Results of the correction will be discussed and the efficacy of this method evaluated.

Development of pixel readout integrated circuits for extreme rate and radiation

CERN Document Server

Garcia-Sciveres, M; CERN. Geneva. The LHC experiments Committee; LHCC

2013-01-01

Letter of Intent for RD Collaboration Proposal focused on development of a next generation pixel readout integrated circuits needed for high luminosity LHC detector upgrades. Brings together ATLAS and CMS pixel chip design communities.

First considerations for a readout system for the ILD TPC with the Timepix3

Energy Technology Data Exchange (ETDEWEB)

Schiffer, Tobias [Universitaet Bonn (Germany); Collaboration: LCTPC-Deutschland-Collaboration

2016-07-01

For the planned International Linear Collider (ILC) two detectors are proposed. One of them, the International Large Detector (ILD) uses a Time Projektion Chamber (TPC) as the main tracking device. As a readout system for this TPC, pixel chips are one of the considered options. An integrated Micromegas stage is foreseen as gas amplification stage, which is built directly on top of the chip. Since first tests of a Pixel-TPC with 160 Timepix ASICs showed promising results, one is interested in developing a detector using the Timepix3 ASIC. It has several advantages, first of all its feature to measure ToT and a ToA at the same time and its significantly increased readout rate. For this purpose a readout system needs to be developed which fulfils the requirements of the Timpix3 ASIC and also has a high scalability. The main challenges are the high speed readout with a clock of up to 640 MHz and the reliability of the system. Also, the data driven as well as the frame-based readout of the Timepix3 needs to be considered for the implementation. The main goal is to provide a fast and parallel readout of several million channels. An overview and the status of the planning is given. Also, the development challenges are discussed.

Study and optimization of the spatial resolution for detectors with binary readout

Energy Technology Data Exchange (ETDEWEB)

Yonamine, R., E-mail: ryo.yonamine@ulb.ac.be; Maerschalk, T.; Lentdecker, G. De

2016-09-11

Using simulations and analytical approaches, we have studied single hit resolutions obtained with a binary readout, which is often proposed for high granularity detectors to reduce the generated data volume. Our simulations considering several parameters (e.g. strip pitch) show that the detector geometry and an electronics parameter of the binary readout chips could be optimized for binary readout to offer an equivalent spatial resolution to the one with an analog readout. To understand the behavior as a function of simulation parameters, we developed analytical models that reproduce simulation results with a few parameters. The models can be used to optimize detector designs and operation conditions with regard to the spatial resolution.

An eight channel low-noise CMOS readout circuit for silicon detectors with on-chip front-end FET

International Nuclear Information System (INIS)

Fiorini, C.; Porro, M.

2006-01-01

We propose a CMOS readout circuit for the processing of signals from multi-channel silicon detectors to be used in X-ray spectroscopy and γ-ray imaging applications. The circuit is composed by eight channels, each one featuring a low-noise preamplifier, a 6th-order semigaussian shaping amplifier with four selectable peaking times, from 1.8 up to 6 μs, a peak stretcher and a discriminator. The circuit is conceived to be used with silicon detectors with a front-end FET integrated on the detector chips itself, like silicon drift detectors with JFET and pixel detectors with DEPMOS. The integrated time constants used for the shaping are implemented by means of an RC-cell, based on the technique of demagnification of the current flowing in a resistor R by means of the use of current mirrors. The eight analog channels of the chip are multiplexed to a single analog output. A suitable digital section provides self-resetting of each channel and trigger output and is able to set independent thresholds on the analog channels by means of a programmable serial register and 3-bit DACs. The circuit has been realized in the 0.35 μm CMOS AMS technology. In this work, the main features of the circuit are presented along with the experimental results of its characterization

The Front-End Readout as an Encoder IC for Magneto-Resistive Linear Scale Sensors

Directory of Open Access Journals (Sweden)

Trong-Hieu Tran

2016-09-01

Full Text Available This study proposes a front-end readout circuit as an encoder chip for magneto-resistance (MR linear scales. A typical MR sensor consists of two major parts: one is its base structure, also called the magnetic scale, which is embedded with multiple grid MR electrodes, while another is an “MR reader” stage with magnets inside and moving on the rails of the base. As the stage is in motion, the magnetic interaction between the moving stage and the base causes the variation of the magneto-resistances of the grid electrodes. In this study, a front-end readout IC chip is successfully designed and realized to acquire temporally-varying resistances in electrical signals as the stage is in motions. The acquired signals are in fact sinusoids and co-sinusoids, which are further deciphered by the front-end readout circuit via newly-designed programmable gain amplifiers (PGAs and analog-to-digital converters (ADCs. The PGA is particularly designed to amplify the signals up to full dynamic ranges and up to 1 MHz. A 12-bit successive approximation register (SAR ADC for analog-to-digital conversion is designed with linearity performance of ±1 in the least significant bit (LSB over the input range of 0.5–2.5 V from peak to peak. The chip was fabricated by the Taiwan Semiconductor Manufacturing Company (TSMC 0.35-micron complementary metal oxide semiconductor (CMOS technology for verification with a chip size of 6.61 mm2, while the power consumption is 56 mW from a 5-V power supply. The measured integral non-linearity (INL is −0.79–0.95 LSB while the differential non-linearity (DNL is −0.68–0.72 LSB. The effective number of bits (ENOB of the designed ADC is validated as 10.86 for converting the input analog signal to digital counterparts. Experimental validation was conducted. A digital decoder is orchestrated to decipher the harmonic outputs from the ADC via interpolation to the position of the moving stage. It was found that the displacement

Digital column readout architecture for the ATLAS pixel 025 mum front end IC

CERN Document Server

Mandelli, E; Blanquart, L; Comes, G; Denes, P; Einsweiler, Kevin F; Fischer, P; Marchesini, R; Meddeler, G; Peric, I

2002-01-01

A fast low noise, limited power, radiation-hard front-end chip was developed for reading out the Atlas Pixel Silicon Detector. As in the past prototypes, every chip is used to digitize and read out charge and time information from hits on each one of its 2880 inputs. The basic column readout architecture idea was adopted and modified to allow a safe transition to quarter micron technology. Each pixel cell, organized in a 160 multiplied by 18 matrix, can be independently enabled and configured in order to optimize the analog signal response and to prevent defective pixels from saturating the readout. The digital readout organizes hit data coming from each column, with respect to time, and output them on a low-level serial interface. A considerable effort was made to design state machines free of undefined states, where single-point defects and charge deposited by heavy ions in the silicon could have led to unpredicted forbidden states. 7 Refs.

A multi-chip data acquisition system based on a heterogeneous system-on-chip platform

CERN Document Server

Fiergolski, Adrian

2017-01-01

The Control and Readout Inner tracking BOard (CaRIBOu) is a versatile readout system targeting a multitude of detector prototypes. It profits from the heterogeneous platform of the Zynq System-on-Chip (SoC) and integrates in a monolithic device front-end FPGA resources with a back-end software running on a hard-core ARM-based processor. The user-friendly Linux terminal with the pre-installed DAQ software is combined with the efficiency and throughput of a system fully implemented in the FPGA fabric. The paper presents the design of the SoC-based DAQ system and its building blocks. It also shows examples of the achieved functionality for the CLICpix2 readout ASIC.

Development of radiation hard readout electronics for LHCb

CERN Document Server

Sexauer, Edgar; Lindenstruth, Volker

2001-01-01

The experiment LHCb is under development at CERN and aims to measure CP-violation in the B-Meson system at very high precision. The experiment makes use of a vertex detector that is equipped with silicon microstrip detectors. A chip suitable for the readout of this detector has been developed in a working group at the ASIC-laboratory Heidelberg. This readout chip 'Beetle-1.0' contains 128 analog input stages of a charge sensitive preamplifier, a pulse shaper and a buffer. The analog signal is fed into a comparator, from which a fast trigger signal can be derived. The following pipeline, realized as an array of gate capacitances, can be used to either store the analog output of the input amplifiers or to store the digital comparator output. External trigger signals mark events that have to be read out and the according pipeline location is stored in a derandomizing buffer. Pending events are read out from the pipeline via a charge-sensitive, resetable amplifier and an analog multiplexer, which serializes the s...

Evaluation of local radiation damage in silicon sensor via charge collection mapping with the Timepix read-out chip

International Nuclear Information System (INIS)

Platkevic, M; Jakubek, J; Jakubek, M; Pospisil, S; Zemlicka, J; Havranek, V; Semian, V

2013-01-01

Studies of radiation hardness of silicon sensors are standardly performed with single-pad detectors evaluating their global electrical properties. In this work we introduce a technique to visualize and determine the spatial distribution of radiation damage across the area of a semiconductor sensor. The sensor properties such as charge collection efficiency and charge diffusion were evaluated locally at many points of the sensor creating 2D maps. For this purpose we used a silicon sensor bump bonded to the pixelated Timepix read-out chip. This device, operated in Time-over-threshold (TOT) mode, allows for the direct energy measurement in each pixel. Selected regions of the sensor were intentionally damaged by defined doses (up to 10 12 particles/cm 2 ) of energetic protons (of 2.5 and 4 MeV). The extent of the damage was measured in terms of the detector response to the same ions. This procedure was performed either on-line during irradiation or off-line after it. The response of the detector to each single particle was analyzed determining the charge collection efficiency and lateral charge diffusion. We evaluated the changes of these parameters as a function of radiation dose. These features are related to the local properties such as the spatial homogeneity of the sensor. The effect of radiation damage was also independently investigated measuring local changes of signal response to γ, and X rays and alpha particles.

Investigation of the readout electronics of DELPHI surround muon chamber

International Nuclear Information System (INIS)

Khovanskij, N.; Krumshtejn, Z.; Ol'shevskij, A.; Sadovskij, A.; Sedykh, Yu.; Molnar, J.; Sicho, P.; Tomsa, Z.

1995-01-01

The characteristics of the readout electronics of the DELPHI surround muon chambers with various AMPLEX chips (AMPLEX 16 and AMPLEX-SICAL) are presented. This electronics is studied in a cosmic rays test of the real surround muon chamber model. 4 refs., 6 figs., 1 tab

Front-end electronics for the readout of CdZnTe sensors

CERN Document Server

Moraes, D; Rudge, A

2006-01-01

The CERN_DxCTA is a front-end ASIC optimized for the readout of CdZn Te sensors. The chip is implemented in 0.25 mum CMOS technology. The circuit consists of 128 channels equipped with a transimpedance amplifier followed by a gain-shaper stage with 20 ns peaking time and two discriminators, allowing two threshold settings. Each discriminator includes a 5-bit trim DAC and is followed by an 18-bit static ripple-counter. The channel architecture is optimized for the detector characteristics in order to achieve the best energy resolution at counting rates of up to 5 M counts/second. Complete evaluation of the circuit is presented using electronic pulses and Cd ZnTe pixel detectors.

Lab-on-a-Chip Device for Rapid Measurement of Vitamin D Levels.

Science.gov (United States)

Peter, Harald; Bistolas, Nikitas; Schumacher, Soeren; Laurisch, Cecilia; Guest, Paul C; Höller, Ulrich; Bier, Frank F

2018-01-01

Lab-on-a-chip assays allow rapid analysis of one or more molecular analytes on an automated user-friendly platform. Here we describe a fully automated assay and readout for measurement of vitamin D levels in less than 15 min using the Fraunhofer in vitro diagnostics platform. Vitamin D (25-hydroxyvitamin D 3 [25(OH)D 3 ]) dilution series in buffer were successfully tested down to 2 ng/mL. This could be applied in the future as an inexpensive point-of-care analysis for patients suffering from a variety of conditions marked by vitamin D deficiencies.

Development of an external readout electronics for a hybrid photon detector

CERN Document Server

Uyttenhove, Simon; Tichon, Jacques; Garcia, Salvador

The pixel hybrid photon detectors currently installed in the LHCb Cherenkov system encapsulate readout electronics in the vacuum tube envelope. The LHCb upgrade and the new trigger system will require their replacement with new photon detectors. The baseline photon detector candidate is the multi-anode photomultiplier. A hybrid photon detector with external readout electronics has been proposed as a backup option. This master thesis covers a R & D phase to investigate this latter concept. Extensive studies of the initial electronics system underlined the noise contributions from the Beetle chip used as front-end readout ASIC and from the ceramic carrier of the photon detector. New front-end electronic boards have been developed and made fully compatible with the existing LHCb-RICH infrastructure. With this compact readout system, Cherenkov photons have been successfully detected in a real particle beam environment. The proof-of-concept of a hybrid photon detector with external readout electronics was val...

Development of telescope readout system based on FELIX for testbeam experiments

CERN Document Server

Wu, Weihao; Chen, Hucheng; Chen, Kai; Lacobucci, Giuseppe; Lanni, Francessco; Liu, Hongbin; Barrero Pinto, Mateus Vicente; Xu, Lailin

2017-01-01

The High Voltage CMOS (HV-CMOS) sensors are extensively investigated by the ATLAS collaboration in the High-Luminosity LHC (HL-LHC) upgrade of the Inner Tracker (ITk) detector. A testbeam telescope, based on the ATLAS IBL (Insertable B-Layer) silicon pixel modules, has been built to characterize the HV-CMOS sensor prototypes. The Front-End LInk eXchange (FELIX) system is a new approach to function as the gateway between front-ends and the commodity switched network in the different detectors of the ATLAS upgrade. A FELIX based readout system has been developed for the readout of the testbeam telescope, which includes a Telescope Readout FMC Card as interface between the IBL DC (double-chip) modules and a Xilinx ZC706 evaluation board. The test results show that the FELIX based telescope readout system is capable of sensor calibration and readout of a high-density pixel detector in test beam experiments in an effective way.

Development of X-ray CCD camera system with high readout rate using ASIC

International Nuclear Information System (INIS)

Nakajima, Hiroshi; Matsuura, Daisuke; Anabuki, Naohisa; Miyata, Emi; Tsunemi, Hiroshi; Doty, John P.; Ikeda, Hirokazu; Katayama, Haruyoshi

2009-01-01

We report on the development of an X-ray charge-coupled device (CCD) camera system with high readout rate using application-specific integrated circuit (ASIC) and Camera Link standard. The distinctive ΔΣ type analog-to-digital converter is introduced into the chip to achieve effective noise shaping and to obtain a high resolution with relatively simple circuits. The unit test proved moderately low equivalent input noise of 70μV with a high readout pixel rate of 625 kHz, while the entire chip consumes only 100 mW. The Camera Link standard was applied for the connectivity between the camera system and frame grabbers. In the initial test of the whole system, we adopted a P-channel CCD with a thick depletion layer developed for X-ray CCD camera onboard the next Japanese X-ray astronomical satellite. The characteristic X-rays from 109 Cd were successfully read out resulting in the energy resolution of 379(±7)eV (FWHM) at 22.1 keV, that is, ΔE/E=1.7% with a readout rate of 44 kHz.

A fast integrated readout system for a cathode pad photon detector

Energy Technology Data Exchange (ETDEWEB)

French, M. (Rutherford Appleton Lab., Chilton (United Kingdom)); Lovell, M. (Rutherford Appleton Lab., Chilton (United Kingdom)); Chesi, E. (CERN, ECP Div., Geneva (Switzerland)); Racz, A. (CERN, ECP Div., Geneva (Switzerland)); Seguinot, J. (Coll. de France, Paris (France)); Ypsilantis, T. (Coll. de France, Paris (France)); Arnold, R. (CRN, Louis Pasteur Univ., Strasbourg (France)); Guyonnet, J.L. (CRN, Louis Pasteur Univ., Strasbourg (France)); Egger, J. (Paul Scherrer Inst., Villigen (Switzerland)); Gabathuler, K. (Paul Scherrer Inst., Villigen (Switzerland))

1994-04-01

A fast integrated electronic chain is presented to read out the cathode pad array of a multiwire photon detector for a fast RICH counter. Two VLSI circuits have been designed and produced. An analog eight channel, low noise, fast, bipolar, current preamplifier and discriminator chip serves as front-end electronics. It has an rms equivalent noise current of 10 nA (2000 e[sup -]), 50 MHz bandwidth with 10 mW of power consumption per channel. Two analogue chips are coupled to a digital 16 channels CMOS readout chip, operating at 20 MHz, that provides a pipelined delay of 1.3 [mu]s and zero suppression with a power consumption of about 6 mW per channel. Readout of a 4000 pad sector requires 3-4 [mu]s depending on the number of hit pads. The full RICH counter is made up of many of such sectors (the prototype has three fully equipped sectors), read out in parallel. The minimum time to separate successive hits on the same pad is about 70 ns. The time skew of the full chain is about 15 ns. (orig.)

Chip cleaning and regeneration for electrochemical sensor arrays

Energy Technology Data Exchange (ETDEWEB)

Bhalla, Vijayender [Biochemistry Department ' G.Moruzzi' , University of Bologna, Via Irnerio 48, 40126 Bologna (Italy); Carrara, Sandro, E-mail: sandro.carrara@epfl.c [Biochemistry Department ' G.Moruzzi' , University of Bologna, Via Irnerio 48, 40126 Bologna (Italy); Stagni, Claudio [Department DEIS, University of Bologna, viale Risorgimento 2, 40136 Bologna (Italy); Samori, Bruno [Biochemistry Department ' G.Moruzzi' , University of Bologna, Via Irnerio 48, 40126 Bologna (Italy)

2010-04-02

Sensing systems based on electrochemical detection have generated great interest because electronic readout may replace conventional optical readout in microarray. Moreover, they offer the possibility to avoid labelling for target molecules. A typical electrochemical array consists of many sensing sites. An ideal micro-fabricated sensor-chip should have the same measured values for all the equivalent sensing sites (or spots). To achieve high reliability in electrochemical measurements, high quality in functionalization of the electrodes surface is essential. Molecular probes are often immobilized by using alkanethiols onto gold electrodes. Applying effective cleaning methods on the chip is a fundamental requirement for the formation of densely-packed and stable self-assembly monolayers. However, the available well-known techniques for chip cleaning may not be so reliable. Furthermore, it could be necessary to recycle the chip for reuse. Also in this case, an effective recycling technique is required to re-obtain well cleaned sensing surfaces on the chip. This paper presents experimental results on the efficacy and efficiency of the available techniques for initial cleaning and further recycling of micro-fabricated chips. Piranha, plasma, reductive and oxidative cleaning methods were applied and the obtained results were critically compared. Some interesting results were attained by using commonly considered cleaning methodologies. This study outlines oxidative electrochemical cleaning and recycling as the more efficient cleaning procedure for electrochemical based sensor arrays.

Qualification method for a 1 MGy-tolerant front-end chip designed in 65 nm CMOS for the read-out of remotely operated sensors and actuators during maintenance in ITER

Energy Technology Data Exchange (ETDEWEB)

Verbeeck, Jens, E-mail: jens.verbeeck@esat.kuleuven.be [KU Leuven (KUL), Div. LRD-MAGyICS, Kasteelpark Arenberg 10, 3001 Heverlee (Belgium); Cao, Ying [KU Leuven (KUL), Div. LRD-MAGyICS, Kasteelpark Arenberg 10, 3001 Heverlee (Belgium); Van Uffelen, Marco; Casellas, Laura Mont; Damiani, Carlo; Morales, Emilio Ruiz; Santana, Roberto Ranz [Fusion for Energy (F4E), c/Josep, no. 2, Torres Diagonal Litoral, Ed. B3, 08019 Barcelona (Spain); Meek, Richard; Haist, Bernhard [Oxford Technologies Ltd. (OTL), 7 Nuffield Way, Abingdon OX14 1RL (United Kingdom); Hamilton, David [ITER Organisation (IO), Route de Vinon-sur-Verdon, CS 90 046, 13067 St. Paul les Durance Cedex (France); Steyaert, Michiel [KU Leuven, ESAT-MICAS, Kasteelpark Arenberg 10, 3001 Heverlee (Belgium); Leroux, Paul [KU Leuven, ESAT-MICAS, Kasteelpark Arenberg 10, 3001 Heverlee (Belgium); KU Leuven, ESAT, Advanced Integrated Sensing Lab (AdvISe), Kleinhoefstraat 4, 2440 Geel (Belgium)

2015-10-15

This paper describes the radiation qualification procedure for a 1 MGy-tolerant Application Specific Integrated Circuit (ASIC) developed in 65 nm CMOS technology. The chip is intended for the read-out of electrical signals of sensors and actuators during maintenance in ITER. First the general working principle of the ASIC is shown. The developed IC allows to read-out, condition and digitize multiple low bandwidth (<10 kHz) sensors. In addition the IC is able to multiplex the digitized sensor signals. To comply with ITER-relevant constraints an adapted radiation qualification procedure has been proposed. The radiation-qualification procedure describes the test criteria and test conditions of the developed ASICs, which are also compared with COTS alternatives, to meet the stringent qualification procedures for electronics exposed to radiation in ITER.

The Retinal Readout System: a status report A Status Report

CERN Document Server

Litke, A M

1999-01-01

The 'Retinal Readout System' is being developed to study the language the eye uses to send information about the visual world to the brain. Its architecture is based on that of silicon microstrip detectors. An array of 512 microscopic electrodes picks up the signals generated by the output neurons of live retinal tissue in response to a dynamic image focused on the input neurons. These signals are amplified, filtered and multiplexed by a set of eight custom-designed VLSI readout chips, and digitized and recorded by a data acquisition system. This report describes the goals, design, and status of the system. (author)

Electronics and readout of a large area silicon detector for LHC

International Nuclear Information System (INIS)

Borer, K.; Munday, D.J.; Parker, M.A.; Anghinolfi, F.; Aspell, P.; Campbell, M.; Chilingarov, A.; Jarron, P.; Heijne, E.H.M.; Santiard, J.C.; Scampoli, P.; Verweij, H.; Goessling, C.; Lisowski, B.; Reichold, A.; Spiwoks, R.; Tsesmelis, E.; Benslama, K.; Bonino, R.; Clark, A.G.; Couyoumtzelis, C.; Kambara, H.; Wu, X.; Fretwurst, E.; Lindstroem, G.; Schultz, T.; Bardos, R.A.; Gorfine, G.W.; Moorhead, G.F.; Taylor, G.N.; Tovey, S.N.; Bibby, J.H.; Hawkings, R.J.; Kundu, N.; Weidberg, A.; Campbell, D.; Murray, P.; Seller, P.; Teiger, J.

1994-01-01

The purpose of the RD2 project is to evaluate the feasibility of a silicon tracker and/or preshower detector for LHC. Irradiation studies with doses equivalent to those expected at LHC have been performed to determine the behavior of operational parameters such as leakage current, depletion voltage and charge collection during the life of the detector. The development of fast, dense, low power and low cost signal processing electronics is one of the major activities of the collaboration. We describe the first fully functional integrated analog memory chip with asynchronous read and write operations and level 1 trigger capture capabilities. A complete test beam system using this analog memory chip at 66 MHz has been successfully operated with RD2 prototype silicon detectors during various test runs. The flexibility of the electronics and readout have allowed us to easily interface our set-up to other data acquisition systems. Mechanical studies are in progress to design a silicon tracking detector with several million channels that may be operated at low (0-10 C) temperature, while maintaining the required geometrical precision. Prototype readout boards for such a detector are being developed and simulation studies are being performed to optimize the readout architecture. (orig.)

Low-power priority Address-Encoder and Reset-Decoder data-driven readout for Monolithic Active Pixel Sensors for tracker system

International Nuclear Information System (INIS)

Yang, P.; Aglieri, G.; Cavicchioli, C.; Chalmet, P.L.; Chanlek, N.; Collu, A.; Gao, C.; Hillemanns, H.; Junique, A.; Kofarago, M.; Keil, M.; Kugathasan, T.; Kim, D.; Kim, J.; Lattuca, A.; Marin Tobon, C.A.; Marras, D.; Mager, M.; Martinengo, P.; Mazza, G.

2015-01-01

Active Pixel Sensors used in High Energy Particle Physics require low power consumption to reduce the detector material budget, low integration time to reduce the possibilities of pile-up and fast readout to improve the detector data capability. To satisfy these requirements, a novel Address-Encoder and Reset-Decoder (AERD) asynchronous circuit for a fast readout of a pixel matrix has been developed. The AERD data-driven readout architecture operates the address encoding and reset decoding based on an arbitration tree, and allows us to readout only the hit pixels. Compared to the traditional readout structure of the rolling shutter scheme in Monolithic Active Pixel Sensors (MAPS), AERD can achieve a low readout time and a low power consumption especially for low hit occupancies. The readout is controlled at the chip periphery with a signal synchronous with the clock, allows a good digital and analogue signal separation in the matrix and a reduction of the power consumption. The AERD circuit has been implemented in the TowerJazz 180 nm CMOS Imaging Sensor (CIS) process with full complementary CMOS logic in the pixel. It works at 10 MHz with a matrix height of 15 mm. The energy consumed to read out one pixel is around 72 pJ. A scheme to boost the readout speed to 40 MHz is also discussed. The sensor chip equipped with AERD has been produced and characterised. Test results including electrical beam measurement are presented

Low-power priority Address-Encoder and Reset-Decoder data-driven readout for Monolithic Active Pixel Sensors for tracker system

Energy Technology Data Exchange (ETDEWEB)

Yang, P., E-mail: yangping0710@126.com [Central China Normal University, Wuhan (China); Aglieri, G.; Cavicchioli, C. [CERN, 1210 Geneva 23 (Switzerland); Chalmet, P.L. [MIND, Archamps (France); Chanlek, N. [Suranaree University of Technology, Nakhon Ratchasima (Thailand); Collu, A. [University of Cagliari, Cagliari (Italy); INFN (Italy); Gao, C. [Central China Normal University, Wuhan (China); Hillemanns, H.; Junique, A. [CERN, 1210 Geneva 23 (Switzerland); Kofarago, M. [CERN, 1210 Geneva 23 (Switzerland); University of Utrecht, Utrecht (Netherlands); Keil, M.; Kugathasan, T. [CERN, 1210 Geneva 23 (Switzerland); Kim, D. [Dongguk and Yonsei University, Seoul (Korea, Republic of); Kim, J. [Pusan National University, Busan (Korea, Republic of); Lattuca, A. [University of Torino, Torino (Italy); INFN (Italy); Marin Tobon, C.A. [CERN, 1210 Geneva 23 (Switzerland); Marras, D. [University of Cagliari, Cagliari (Italy); INFN (Italy); Mager, M.; Martinengo, P. [CERN, 1210 Geneva 23 (Switzerland); Mazza, G. [University of Torino, Torino (Italy); INFN (Italy); and others

2015-06-11

Active Pixel Sensors used in High Energy Particle Physics require low power consumption to reduce the detector material budget, low integration time to reduce the possibilities of pile-up and fast readout to improve the detector data capability. To satisfy these requirements, a novel Address-Encoder and Reset-Decoder (AERD) asynchronous circuit for a fast readout of a pixel matrix has been developed. The AERD data-driven readout architecture operates the address encoding and reset decoding based on an arbitration tree, and allows us to readout only the hit pixels. Compared to the traditional readout structure of the rolling shutter scheme in Monolithic Active Pixel Sensors (MAPS), AERD can achieve a low readout time and a low power consumption especially for low hit occupancies. The readout is controlled at the chip periphery with a signal synchronous with the clock, allows a good digital and analogue signal separation in the matrix and a reduction of the power consumption. The AERD circuit has been implemented in the TowerJazz 180 nm CMOS Imaging Sensor (CIS) process with full complementary CMOS logic in the pixel. It works at 10 MHz with a matrix height of 15 mm. The energy consumed to read out one pixel is around 72 pJ. A scheme to boost the readout speed to 40 MHz is also discussed. The sensor chip equipped with AERD has been produced and characterised. Test results including electrical beam measurement are presented.

Low-power priority Address-Encoder and Reset-Decoder data-driven readout for Monolithic Active Pixel Sensors for tracker system

Science.gov (United States)

Yang, P.; Aglieri, G.; Cavicchioli, C.; Chalmet, P. L.; Chanlek, N.; Collu, A.; Gao, C.; Hillemanns, H.; Junique, A.; Kofarago, M.; Keil, M.; Kugathasan, T.; Kim, D.; Kim, J.; Lattuca, A.; Marin Tobon, C. A.; Marras, D.; Mager, M.; Martinengo, P.; Mazza, G.; Mugnier, H.; Musa, L.; Puggioni, C.; Rousset, J.; Reidt, F.; Riedler, P.; Snoeys, W.; Siddhanta, S.; Usai, G.; van Hoorne, J. W.; Yi, J.

2015-06-01

Active Pixel Sensors used in High Energy Particle Physics require low power consumption to reduce the detector material budget, low integration time to reduce the possibilities of pile-up and fast readout to improve the detector data capability. To satisfy these requirements, a novel Address-Encoder and Reset-Decoder (AERD) asynchronous circuit for a fast readout of a pixel matrix has been developed. The AERD data-driven readout architecture operates the address encoding and reset decoding based on an arbitration tree, and allows us to readout only the hit pixels. Compared to the traditional readout structure of the rolling shutter scheme in Monolithic Active Pixel Sensors (MAPS), AERD can achieve a low readout time and a low power consumption especially for low hit occupancies. The readout is controlled at the chip periphery with a signal synchronous with the clock, allows a good digital and analogue signal separation in the matrix and a reduction of the power consumption. The AERD circuit has been implemented in the TowerJazz 180 nm CMOS Imaging Sensor (CIS) process with full complementary CMOS logic in the pixel. It works at 10 MHz with a matrix height of 15 mm. The energy consumed to read out one pixel is around 72 pJ. A scheme to boost the readout speed to 40 MHz is also discussed. The sensor chip equipped with AERD has been produced and characterised. Test results including electrical beam measurement are presented.

Development of high performance readout ASICs for silicon photomultipliers (SiPMs)

International Nuclear Information System (INIS)

Shen, Wei

2012-01-01

Silicon Photomultipliers (SiPMs) are novel kind of solid state photon detectors with extremely high photon detection resolution. They are composed of hundreds or thousands of avalanche photon diode pixels connected in parallel. These avalanche photon diodes are operated in Geiger Mode. SiPMs have the same magnitude of multiplication gain compared to the conventional photomultipliers (PMTs). Moreover, they have a lot of advantages such as compactness, relatively low bias voltage and magnetic field immunity etc. Special readout electronics are required to preserve the high performance of the detector. KLauS and STiC are two CMOS ASIC chips designed in particular for SiPMs. KLauS is used for SiPM charge readout applications. Since SiPMs have a much larger detector capacitance compared to other solid state photon detectors such as PIN diodes and APDs, a few special techniques are used inside the chip to make sure a descent signal to noise ratio for pixel charge signal can be obtained. STiC is a chip dedicated to SiPM time-of-flight applications. High bandwidth and low jitter design schemes are mandatory for such applications where time jitter less than tens of picoseconds is required. Design schemes and error analysis as well as measurement results are presented in the thesis.

On-chip nanofluidic integration of acoustic sensors towards high Q in liquid

Science.gov (United States)

Liang, Ji; Liu, Zifeng; Zhang, Hongxiang; Liu, Bohua; Zhang, Menglun; Zhang, Hao; Pang, Wei

2017-11-01

This paper reports an on-chip acoustic sensor comprising a piston-mode film bulk acoustic resonator and a monolithically integrated nanochannel. The resonator with the channel exhibits a resonance frequency (f) of 2.5 GHz and a quality (Q) factor of 436 in deionized water. The f × Q product is as high as 1.1 × 1012, which is the highest among all the acoustic wave sensors in the liquid phase. The sensor consumes 2 pl liquid volume and thus greatly saves the precious assays in biomedical testing. The Q factor is investigated, and real-time viscosity tests of glucose solution are demonstrated. The highly miniaturized and integrated sensor is capable to be arrayed with readout-circuitry, which opens an avenue for portable applications and lab-on-chip systems.

TARGET: A multi-channel digitizer chip for very-high-energy gamma-ray telescopes

Energy Technology Data Exchange (ETDEWEB)

Bechtol, K.; Funk, S.; /Stanford U., HEPL /KIPAC, Menlo Park; Okumura, A.; /JAXA, Sagamihara /Stanford U., HEPL /KIPAC, Menlo Park; Ruckman, L.; /Hawaii U.; Simons, A.; Tajima, H.; Vandenbroucke, J.; /Stanford U., HEPL /KIPAC, Menlo Park; Varner, G.; /Hawaii U.

2011-08-11

The next-generation very-high-energy (VHE) gamma-ray observatory, the Cherenkov Telescope Array, will feature dozens of imaging atmospheric Cherenkov telescopes (IACTs), each with thousands of pixels of photosensors. To be affordable and reliable, reading out such a mega-channel array requires event recording technology that is highly integrated and modular, with a low cost per channel. We present the design and performance of a chip targeted to this application: the TeV Array Readout with GSa/s sampling and Event Trigger (TARGET). This application-specific integrated circuit (ASIC) has 16 parallel input channels, a 4096-sample buffer for each channel, adjustable input termination, self-trigger functionality, and tight window-selected readout. We report the performance of TARGET in terms of sampling frequency, power consumption, dynamic range, current-mode gain, analog bandwidth, and cross talk. The large number of channels per chip allows a low cost per channel ($10 to $20 including front-end and back-end electronics but not including photosensors) to be achieved with a TARGET-based IACT readout system. In addition to basic performance parameters of the TARGET chip itself, we present a camera module prototype as well as a second-generation chip (TARGET 2), both of which have been produced.

Front-end electronics and readout system for the ILD TPC

CERN Document Server

Hedberg, V; Lundberg, B; Mjörnmark, U; Oskarsson, A; Österman, L; De Lentdecker, G; Yang, Y; Zhang, F

2015-01-01

A high resolution TPC is the main option for a central tracking detector at the future International Linear Collider (ILC). It is planned that the MPGD (Micro Pattern Gas Detector) technology will be used for the readout. A Large Prototype TPC at DESY has been used to test the performance of MPGDs in an electron beam of energies up to 6 GeV. The first step in the technology development was to demonstrate that the MPGDs are able to achieve the necessary performance set by the goals of ILC. For this ’proof of principle’ phase, the ALTRO front-end electronics from the ALICE TPC was used, modified to adapt to MPGD readout. The proof of principle has been verified and at present further improvement of the MPGD technology is going on, using the same readout electronics. The next step is the ’feasibility phase’, which aims at producing front-end electronics comparable in size (few mm2) to the readout pads of the TPC. This development work is based on the succeeding SALTRO16 chip, which combines the analogue ...

First operation of a hybrid photon detector prototype with electrostatic cross-focussing and integrated silicon pixel readout

International Nuclear Information System (INIS)

Alemi, M.; Campbell, M.; Gys, T.; Mikulec, B.; Piedigrossi, D.; Puertolas, D.; Rosso, E.; Schomaker, R.; Snoeys, W.; Wyllie, K.

2000-01-01

We report on the first operation of a hybrid photon detector prototype with integrated silicon pixel readout for the ring imaging Cherenkov detectors of the LHCb experiment. The photon detector is based on a cross-focussed image intensifier tube geometry where the image is de-magnified by a factor of 4. The anode consists of a silicon pixel array, bump-bonded to a binary readout chip with matching pixel electronics. The prototype has been characterized using a low-intensity light-emitting diode operated in pulsed mode. Its performance in terms of single-photoelectron detection efficiency and imaging properties is presented. A model of photoelectron detection is proposed, and is shown to be in good agreement with the experimental data. It includes an estimate of the charge signal generated in the silicon detector, and the combined effects of the comparator threshold spread of the pixel readout chip, charge sharing at the pixel boundaries and back-scattering of the photoelectrons at the silicon detector surface

First operation of a hybrid photon detector prototype with electrostatic cross-focussing and integrated silicon pixel readout

Energy Technology Data Exchange (ETDEWEB)

Alemi, M.; Campbell, M.; Gys, T. E-mail: thierry.gys@cern.ch; Mikulec, B.; Piedigrossi, D.; Puertolas, D.; Rosso, E.; Schomaker, R.; Snoeys, W.; Wyllie, K

2000-07-11

We report on the first operation of a hybrid photon detector prototype with integrated silicon pixel readout for the ring imaging Cherenkov detectors of the LHCb experiment. The photon detector is based on a cross-focussed image intensifier tube geometry where the image is de-magnified by a factor of 4. The anode consists of a silicon pixel array, bump-bonded to a binary readout chip with matching pixel electronics. The prototype has been characterized using a low-intensity light-emitting diode operated in pulsed mode. Its performance in terms of single-photoelectron detection efficiency and imaging properties is presented. A model of photoelectron detection is proposed, and is shown to be in good agreement with the experimental data. It includes an estimate of the charge signal generated in the silicon detector, and the combined effects of the comparator threshold spread of the pixel readout chip, charge sharing at the pixel boundaries and back-scattering of the photoelectrons at the silicon detector surface.

Silicon μ-strip detectors with SVX chip readout

International Nuclear Information System (INIS)

Brueckner, W.; Dropmann, F.; Godbersen, M.; Konorov, I.; Koenigsmann, K.; Newsom, C.; Paul, S.; Povh, B.; Russ, J.; Timm, S.; Vorwalter, K.; Werding, R.

1994-01-01

A new silicon strip detector has been designed and constructed for a fixed target experiment at CERN. The system of about 30 000 channels is equipped with SVX chips and read out via a double buffer into Fastbus memory. Construction and performance during the actual data taking run are discussed. ((orig.))

A Medipix3 readout system based on the National Instruments FlexRIO card and using the LabVIEW programming environment

Science.gov (United States)

Horswell, I.; Gimenez, E. N.; Marchal, J.; Tartoni, N.

2011-01-01

Hybrid silicon photon-counting detectors are becoming standard equipment for many synchrotron applications. The latest in the Medipix family of read-out chips designed as part of the Medipix Collaboration at CERN is the Medipix3, which while maintaining the same pixel size as its predecessor, offers increased functionality and operating modes. The active area of the Medipix3 chip is approx 14mm × 14mm (containing 256 × 256 pixels) which is not large enough for many detector applications, this results in the need to tile many sensors and chips. As a first step on the road to develop such a detector, it was decided to build a prototype single chip readout system to gain the necessary experience in operating a Medipix3 chip. To provide a flexible learning and development tool it was decided to build an interface based on the recently released FlexRIOTM system from National Instruments and to use the LabVIEWTM graphical programming environment. This system and the achieved performance are described in this paper.

Design and prototyping of a readout aggregation ASIC

Energy Technology Data Exchange (ETDEWEB)

Lemke, Frank; Schatral, Sven; Bruening, Ulrich [ZITI, Universitaet Heidelberg (Germany); Som, Indranil; Bhattacharyya, Tarun [Indian Institute of Technology, Kharagpur (India); Collaboration: CBM-Collaboration

2015-07-01

In close collaboration between the Indian Institute of Technology Kharagpur (IITKGP) and the Institute for Computer Engineering (ZITI) at the University of Heidelberg a readout aggregation ASIC was designed. This happened in the context of the Compressed Baryonic Matter (CBM) experiment at the Facility for Antiproton and Ion Research (FAIR). The ASIC is designed in 65nm TSMC technology. Its miniASIC tapeout to verify the analog and high-speed components is scheduled to the first quarter of 2015. This mixed-signal ASIC consists of a full-custom 5Gb/s serializer/deserializer, designed by the IITKGP including design elements such as phase-locked loop, bandgap reference, and clock data recovery, and a digital designed network communication and aggregation part designed by the ZITI. In addition, there are test structures and an I2C readout integrated to ease bring up and monitoring. A specialty of this test ASIC is the aggregation of links featuring different data rates, running with bundles of 500 MB/s LVDS. This enables flexible readout setups of mixed detectors respectively readout of various chips. As communication protocol, a unified link protocol is used including control messages, data messages, and synchronization messages on an identical lane. The design has been simulated, verified, and hardware emulated using Spartan 6 FPGAs.

The ALICE Time of Flight Readout System AFRO

CERN Document Server

Kluge, A

1999-01-01

The ALICE Time of Flight Detector system comprises more than 100.000 channels and covers an area of more than 100 m2. The timing resolution should be better than 150 ps. This combination of requirements poses a major challenge to the readout system. All detector timing measurements are referenced to a unique start signal t0. This signal is generated at the time an event occurs. Timing measurements are performed using a multichannel TDC chip which requires a 40 MHz reference clock signal. The general concept of the readout system is based on a modular architecture. Detector cells are combined to modules of 1024 channels. Each of these modules can be read out and calibrated independently from each other. By distributing a reference signal, a timing relationship between the modules is established. This reference signal can either be the start signal t0 or the TDC-reference clock. The readout architecture is divided into three steps; the TDC controller, the module controller, and the time of flight controller. Th...

FILTRES: a 128 channels VLSI mixed front-end readout electronic development for microstrip detectors

International Nuclear Information System (INIS)

Anstotz, F.; Hu, Y.; Michel, J.; Sohler, J.L.; Lachartre, D.

1998-01-01

We present a VLSI digital-analog readout electronic chain for silicon microstrip detectors. The characteristics of this circuit have been optimized for the high resolution tracker of the CERN CMS experiment. This chip consists of 128 channels at 50 μm pitch. Each channel is composed by a charge amplifier, a CR-RC shaper, an analog memory, an analog processor, an output FIFO read out serially by a multiplexer. This chip has been processed in the radiation hard technology DMILL. This paper describes the architecture of the circuit and presents test results of the 128 channel full chain chip. (orig.)

Design and Characterization of 64K Pixels Chips Working in Single Photon Processing Mode

CERN Document Server

Llopart Cudie, Xavier; Campbell, M

2007-01-01

Progress in CMOS technology and in fine pitch bump bonding has made possible the development of high granularity single photon counting detectors for X-ray imaging. This thesis studies the design and characterization of three pulse processing chips with 65536 square pixels of 55 µm x 55 µm designed in a commercial 0.25 µm 6-metal CMOS technology. The 3 chips share the same architecture and dimensions and are named Medipix2, Mpix2MXR20 and Timepix. The Medipix2 chip is a pixel detector readout chip consisting of 256 x 256 identical elements, each working in single photon counting mode for positive or negative input charge signals. The preamplifier feedback provides compensation for detector leakage current on a pixel by pixel basis. Two identical pulse height discriminators are used to define an energy window. Every event falling inside the energy window is counted with a 13 bit pseudo-random counter. The counter logic, based in a shift register, also behaves as the input/output register for the pixel. Each...

Performance of the new amplifier-shaper-discriminator chip for the ATLAS MDT chambers at the HL-LHC

CERN Document Server

INSPIRE-00218480

2016-01-01

The Phase-II Upgrade of the ATLAS Muon Detector requires new electronics for the readout of the MDT drift tubes. The first processing stage, the Amplifier-Shaper-Discriminator (ASD), determines the performance of the readout for crucial parameters like time resolution, gain uniformity, efficiency and noise rejection. An 8-channel ASD chip, using the IBM 130 nm CMOS 8RF-DM technology, has been designed, produced and tested. The area of the chip is 2.2 x 2.9 square mm size. We present results of detailed measurements as well as a comparision with simulation results of the chip behaviour at three different levels of detail.

A Zirconium Dioxide Ammonia Microsensor Integrated with a Readout Circuit Manufactured Using the 0.18 μm CMOS Process

Directory of Open Access Journals (Sweden)

Ming-Zhi Yang

2013-03-01

Full Text Available The study presents an ammonia microsensor integrated with a readout circuit on-a-chip fabricated using the commercial 0.18 μm complementary metal oxide semiconductor (CMOS process. The integrated sensor chip consists of a heater, an ammonia sensor and a readout circuit. The ammonia sensor is constructed by a sensitive film and the interdigitated electrodes. The sensitive film is zirconium dioxide that is coated on the interdigitated electrodes. The heater is used to provide a working temperature to the sensitive film. A post-process is employed to remove the sacrificial layer and to coat zirconium dioxide on the sensor. When the sensitive film adsorbs or desorbs ammonia gas, the sensor produces a change in resistance. The readout circuit converts the resistance variation of the sensor into the output voltage. The experiments show that the integrated ammonia sensor has a sensitivity of 4.1 mV/ppm.

Application of the DRS chip for fast waveform digitizing

Energy Technology Data Exchange (ETDEWEB)

Ritt, Stefan, E-mail: stefan.ritt@psi.c [PSI, CH-5232 Villigen (Switzerland); Dinapoli, Roberto; Hartmann, Ueli [PSI, CH-5232 Villigen (Switzerland)

2010-11-01

The high demands of modern experiments in fast waveform digitizing led to the development of a whole family of switched capacitor arrays (SCA), called the Domino Ring Sampler (DRS). The most recent version, DRS4, is produced in a radiation hard 0.25 {mu}m CMOS process, and is capable of digitizing 9 differential input channels at sampling rates of up to 6 Giga-samples per second (GSPS) with an analogue bandwidth of 950 MHz (-3 dB). The channel depth can be configured between 1024 and 8192 cells, and the signal-to-noise ratio allows a resolution equivalent to more than 11 bits. Using an interleaved sampling technique, sampling rates up to 48 GSPS are possible. Compared with the previous versions, the DRS4 chip contains several improvements such as an on-chip PLL for sampling-frequency stabilization and various mechanisms to reduce the read out dead-time. The high bandwidth, low power consumption and short readout time make this chip attractive for many experiments, replacing traditional ADCs and TDCs. This includes time-of-flight detectors, cosmic gamma ray observatories, PET scanners and industrial applications.

Pulseshape characteristics of a 300 $\\mu$m PR03 R-measuring VELO sensor read out with a Beetle1.3 chip

CERN Document Server

Palacios, A; Buytaert, J; Borel, J; Collins, P; Eckstein, D; Eklund, L; Ferro-Luzzi, M; Jans, E; Ketel, T; Petrie, D; Pivk, M; Tobin, M

2005-01-01

The signal-to-noise, overspill and undershoot characteristics of a VELO module equipped with Beetle1.3 read-out chips have been measured using 120 GeV pions from the SPS test beam facility at CERN. The module consists of a PR03 n-on-n 300 $\\mu$m R measuring prototype sensor and a fully populated K03 hybrid. Results are presented for a single Beetle1.3 chip with a variety of chip parameter settings controlling the pre-amplifier and shaper currents and feedback voltages, with the objective of establishing the performance of the module and understanding its dependence on the read-out chip settings.

General-purpose readout electronics for white neutron source at China Spallation Neutron Source.

Science.gov (United States)

Wang, Q; Cao, P; Qi, X; Yu, T; Ji, X; Xie, L; An, Q

2018-01-01

The under-construction White Neutron Source (WNS) at China Spallation Neutron Source is a facility for accurate measurements of neutron-induced cross section. Seven spectrometers are planned at WNS. As the physical objectives of each spectrometer are different, the requirements for readout electronics are not the same. In order to simplify the development of the readout electronics, this paper presents a general method for detector signal readout. This method has advantages of expansibility and flexibility, which makes it adaptable to most detectors at WNS. In the WNS general-purpose readout electronics, signals from any kinds of detectors are conditioned by a dedicated signal conditioning module corresponding to this detector, and then digitized by a common waveform digitizer with high speed and high precision (1 GSPS at 12-bit) to obtain the full waveform data. The waveform digitizer uses a field programmable gate array chip to process the data stream and trigger information in real time. PXI Express platform is used to support the functionalities of data readout, clock distribution, and trigger information exchange between digitizers and trigger modules. Test results show that the performance of the WNS general-purpose readout electronics can meet the requirements of the WNS spectrometers.

CERNDxCTA counting mode chip

International Nuclear Information System (INIS)

Moraes, D.; Kaplon, J.; Nygard, E.

2008-01-01

This ASIC is a counting mode front-end electronic optimized for the readout of CdZnTe/CdTe and silicon sensors, for possible use in applications where the flux of ionizing radiation is high. The chip is implemented in 0.25 μm CMOS technology. The circuit comprises 128 channels equipped with a transimpedance amplifier followed by a gain shaper stage with 21 ns peaking time, two discriminators and two 18-bit counters. The channel architecture is optimized for the detector characteristics in order to achieve the best energy resolution at counting rates of up to 5 M counts/second. The amplifier shows a linear sensitivity of 118 mV/fC and an equivalent noise charge of about 711 e - , for a detector capacitance of 5 pF. Complete evaluation of the circuit is presented using electronic pulses and pixel detectors

5A Zirconium Dioxide Ammonia Microsensor Integrated with a Readout Circuit Manufactured Using the 0.18 μm CMOS Process

Science.gov (United States)

Lin, Guan-Ming; Dai, Ching-Liang; Yang, Ming-Zhi

2013-01-01

The study presents an ammonia microsensor integrated with a readout circuit on-a-chip fabricated using the commercial 0.18 μm complementary metal oxide semiconductor (CMOS) process. The integrated sensor chip consists of a heater, an ammonia sensor and a readout circuit. The ammonia sensor is constructed by a sensitive film and the interdigitated electrodes. The sensitive film is zirconium dioxide that is coated on the interdigitated electrodes. The heater is used to provide a working temperature to the sensitive film. A post-process is employed to remove the sacrificial layer and to coat zirconium dioxide on the sensor. When the sensitive film adsorbs or desorbs ammonia gas, the sensor produces a change in resistance. The readout circuit converts the resistance variation of the sensor into the output voltage. The experiments show that the integrated ammonia sensor has a sensitivity of 4.1 mV/ppm. PMID:23503294

The Belle II SVD data readout system

Energy Technology Data Exchange (ETDEWEB)

Thalmeier, R., E-mail: Richard.Thalmeier@oeaw.ac.at [Institute of High Energy Physics, Austrian Academy of Sciences, 1050 Vienna (Austria); Adamczyk, K. [H. Niewodniczanski Institute of Nuclear Physics, Krakow 31-342 (Poland); Aihara, H. [Department of Physics, University of Tokyo, Tokyo 113-0033 (Japan); Angelini, C. [Dipartimento di Fisica, Universita’ di Pisa, I-56127 Pisa (Italy); INFN Sezione di Pisa, I-56127 Pisa (Italy); Aziz, T.; Babu, V. [Tata Institute of Fundamental Research, Mumbai 400005 (India); Bacher, S. [H. Niewodniczanski Institute of Nuclear Physics, Krakow 31-342 (Poland); Bahinipati, S. [Indian Institute of Technology Bhubaneswar, Satya Nagar (India); Barberio, E.; Baroncelli, Ti.; Baroncelli, To. [School of Physics, University of Melbourne, Melbourne, Victoria 3010 (Australia); Basith, A.K. [Indian Institute of Technology Madras, Chennai 600036 (India); Batignani, G. [Dipartimento di Fisica, Universita’ di Pisa, I-56127 Pisa (Italy); INFN Sezione di Pisa, I-56127 Pisa (Italy); Bauer, A. [Institute of High Energy Physics, Austrian Academy of Sciences, 1050 Vienna (Austria); Behera, P.K. [Indian Institute of Technology Madras, Chennai 600036 (India); Bergauer, T. [Institute of High Energy Physics, Austrian Academy of Sciences, 1050 Vienna (Austria); Bettarini, S. [Dipartimento di Fisica, Universita’ di Pisa, I-56127 Pisa (Italy); INFN Sezione di Pisa, I-56127 Pisa (Italy); Bhuyan, B. [Indian Institute of Technolog y Guwahati, Assam 781039 (India); Bilka, T. [Faculty of Mathematics and Physics, Charles University, 12116 Prague (Czech Republic); Bosi, F. [INFN Sezione di Pisa, I-56127 Pisa (Italy); and others

2017-02-11

The Belle II Experiment at the High Energy Accelerator Research Organization (KEK) in Tsukuba, Japan, will explore the asymmetry between matter and antimatter and search for new physics beyond the standard model. 172 double-sided silicon strip detectors are arranged cylindrically in four layers around the collision point to be part of a system which measures the tracks of the collision products of electrons and positrons. A total of 1748 radiation-hard APV25 chips read out 128 silicon strips each and send the analog signals by time-division multiplexing out of the radiation zone to 48 Flash Analog Digital Converter Modules (FADC). Each of them applies processing to the data; for example, it uses a digital finite impulse response filter to compensate line signal distortions, and it extracts the peak timing and amplitude from a set of several data points for each hit, using a neural network. We present an overview of the SVD data readout system, along with front-end electronics, cabling, power supplies and data processing.

Prototype readout system for a multi Mpixels UV single-photon imaging detector capable of space flight operation

Science.gov (United States)

Seljak, A.; Cumming, H. S.; Varner, G.; Vallerga, J.; Raffanti, R.; Virta, V.

2018-02-01

Our collaboration works on the development of a large aperture, high resolution, UV single-photon imaging detector, funded through NASA's Strategic Astrophysics Technology (SAT) program. The detector uses a microchannel plate for charge multiplication, and orthogonal cross strip (XS) anodes for charge readout. Our target is to make an advancement in the technology readiness level (TRL), which enables real scale prototypes to be tested for future NASA missions. The baseline detector has an aperture of 50×50 mm and requires 160 low-noise charge-sensitive channels, in order to extrapolate the incoming photon position with a spatial resolution of about 20 μm FWHM. Technologies involving space flight require highly integrated electronic systems operating at very low power. We have designed two ASICs which enable the construction of such readout system. First, a charge sensitive amplifier (CSAv3) ASIC provides an equivalent noise charge (ENC) of around 600 e-, and a baseline gain of 10 mV/fC. The second, a Giga Sample per Second (GSPS) ASIC, called HalfGRAPH, is a 12-bit analog to digital converter. Its architecture is based on waveform sampling capacitor arrays and has about 8 μs of analog storage memory per channel. Both chips encapsulate 16 measurement channels. Using these chips, a small scale prototype readout system has been constructed on a FPGA Mezzanine Board (FMC), equipped with 32 measurement channels for system evaluation. We describe the construction of HalfGRAPH ASIC, detector's readout system concept and obtained results from the prototype system. As part of the space flight qualification, these chips were irradiated with a Cobalt gamma-ray source, to verify functional operation under ionizing radiation exposure.

CdTe layer structures for X-ray and gamma-ray detection directly grown on the Medipix readout-chip by MBE

Science.gov (United States)

Vogt, A.; Schütt, S.; Frei, K.; Fiederle, M.

2017-11-01

This work investigates the potential of CdTe semiconducting layers used for radiation detection directly deposited on the Medipix readout-chip by MBE. Due to the high Z-number of CdTe and the low electron-hole pair creation energy a thin layer suffices for satisfying photon absorption. The deposition takes place in a modified MBE system enabling growth rates up to 10 μm/h while the UHV conditions allow the required high purity for detector applications. CdTe sensor layers deposited on silicon substrates show resistivities up to 5.8 × 108 Ω cm and a preferred (1 1 1) orientation. However, the resistivity increases with higher growth temperature and the orientation gets more random. Additionally, the deposition of a back contact layer sequence in one process simplifies the complex production of an efficient contact on CdTe with aligned work functions. UPS measurements verify a decrease of the work function of 0.62 eV induced by Te doping of the CdTe.

Test vehicles for CMS HGCAL readout ASIC

CERN Document Server

Thienpont, Damien

2017-01-01

This paper presents first measurement results of two test vehicles ASIC embedding some building blocks for the future CMS High Granularity CALorimeter (HGCAL) read-out ASIC. They were fabricated in CMOS 130 nm, in order to first design the Analog and Mixed-Signal blocks before going to a complete and complex chip. Such a circuit needs to achieve low noise high dynamic range charge measurement and 20 ps resolution timing capability. The results show good analog performance but with higher noise levels compared to simulations. We present the results of the preamplifiers, shapers and ADCs.

An optical fiber-based flexible readout system for micro-pattern gas detectors

Science.gov (United States)

Li, C.; Feng, C. Q.; Zhu, D. Y.; Liu, S. B.; An, Q.

2018-04-01

This paper presents an optical fiber-based readout system that is intended to provide a general purpose multi-channel readout solution for various Micro-Pattern Gas Detectors (MPGDs). The proposed readout system is composed of several front-end cards (FECs) and a data collection module (DCM). The FEC exploits the capability of an existing 64-channel generic TPC readout ASIC chip, named AGET, to implement 256 channels readout. AGET offers FEC a large flexibility in gain range (4 options from 120 fC to 10 pC), peaking time (16 options from 50 ns to 1 us) and sampling freqency (100 MHz max.). The DCM contains multiple 1 Gbps optical fiber serial link interfaces that allow the system scaling up to 1536 channels with 6 FECs and 1 DCM. Further scaling up is possible through cascading of multiple DCMs, by configuring one DCM as a master while other DCMs in slave mode. This design offers a rapid readout solution for different application senario. Tests indicate that the nonlinearity of each channel is less than 1%, and the equivalent input noise charge is typically around 0.7 fC in RMS (root mean square), with a noise slope of about 0.01 fC/pF. The system level trigger rate limit is about 700 Hz in all channel readout mode. When in hit channel readout mode, supposing that typically 10 percent of channels are fired, trigger rate can go up to about 7 kHz. This system has been tested with Micromegas detector and GEM detector, confirming its capability in MPGD readout. Details of hardware and FPGA firmware design, as well as system performances, are described in the paper.

First implementation of the MEPHISTO binary readout architecture for strip detectors

International Nuclear Information System (INIS)

Fischer, P.

2001-01-01

Today's front-end readout chips for multi-channel silicon strip detectors use pipeline-like structures for temporary storage of hit information until arrival of a trigger signal. This approach leads to large-area chips when long trigger latencies are necessary. The MEPHISTO architecture uses a different concept. Hit strips are identified in real time and only the relevant binary hit information is stored in FIFOs. For the typical occupancies in LHC detectors of ∼1 hit per clock cycle this architecture requires less than half the chip area of a typical binary pipeline. This reduces the system cost considerably. At a lower data rate, operation with very long trigger latencies or even without any trigger is possible due to the real-time data sparsification. The Mephisto II architecture is presented and the expected performance is discussed

CERN_DxCTA counting mode chip

CERN Document Server

Moraes, D; Nygård, E

2008-01-01

This ASIC is a counting mode front-end electronic optimized for the readout of CdZnTe/CdTe and silicon sensors, for possible use in applications where the flux of ionizing radiation is high. The chip is implemented in 0.25 μm CMOS technology. The circuit comprises 128 channels equipped with a transimpedance amplifier followed by a gain shaper stage with 21 ns peaking time, two discriminators and two 18-bit counters. The channel architecture is optimized for the detector characteristics in order to achieve the best energy resolution at counting rates of up to 5 M counts/second. The amplifier shows a linear sensitivity of 118 mV/fC and an equivalent noise charge of about 711 e−, for a detector capacitance of 5 pF. Complete evaluation of the circuit is presented using electronic pulses and pixel detectors.

Architecture of a modular, multichannel readout system for dense electrochemical biosensor microarrays

International Nuclear Information System (INIS)

Ramfos, Ioannis; Birbas, Alexios; Blionas, Spyridon

2015-01-01

The architecture of a modular, multichannel readout system for dense electrochemical microarrays, targeting Lab-on-a-Chip applications, is presented. This approach promotes efficient component reusability through a hybrid multiplexing methodology, maintaining high levels of sampling performance and accuracy. Two readout modes are offered, which can be dynamically interchanged following signal profiling, to cater for both rapid signal transitions and weak current responses. Additionally, functional extensions to the described architecture are discussed, which provide the system with multi-biasing capabilities. A prototype integrated circuit of the proposed architecture’s analog core and a supporting board were implemented to verify the working principles. The system was evaluated using standard loads, as well as electrochemical sensor arrays. Through a range of operating conditions and loads, the prototype exhibited a highly linear response and accurately delivered the readout of input signals with fast transitions and wide dynamic ranges. (paper)

Rework of flip chip bonded radiation pixel detectors

International Nuclear Information System (INIS)

Vaehaenen, S.; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S.

2008-01-01

In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process

Rework of flip chip bonded radiation pixel detectors

Energy Technology Data Exchange (ETDEWEB)

Vaehaenen, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)], E-mail: sami.vahanen@vtt.fi; Heikkinen, H.; Pohjonen, H.; Salonen, J.; Savolainen-Pulli, S. [VTT MEMS and Micropackaging, Espoo 02150 (Finland)

2008-06-11

In this paper, some practical aspects of reworking flip chip hybridized pixel detectors are discussed. As flip chip technology has been advancing in terms of placement accuracy and reliability, large-area hybrid pixel detectors have been developed. The area requirements are usually fulfilled by placing several readout chips (ROCs) on single sensor chip. However, as the number of ROCs increases, the probability of failure in the hybridization process and the ROC operation also increases. Because high accuracy flip chip bonding takes time, a significant part of the price of a pixel detector comes from the flip chip assembly process itself. As large-area detector substrates are expensive, and many flip chip placements are required, the price of an assembled detector can become very high. In a typical case, there is just one bad ROC (out of several) on a faulty detector to be replaced. Considering the high price of pixel detectors and the fact that reworking faulty ROCs does not take much longer than the original placement, it is worthwhile to investigate the feasibility of a rework process.

Performance of hybrid photon detector prototypes with encapsulated silicon pixel detector and readout for the RICH counters of LHCb

International Nuclear Information System (INIS)

Campbell, M.; George, K.A.; Girone, M.; Gys, T.; Jolly, S.; Piedigrossi, D.; Riedler, P.; Rozema, P.; Snoeys, W.; Wyllie, K.

2003-01-01

These proceedings report on the performance of the latest prototype pixel hybrid photon detector in preparation for the LHCb Ring Imaging Cherenkov detectors. The prototype encapsulates a silicon pixel detector bump-bonded to a binary read-out chip with short (25 ns) peaking time and low ( - ) detection threshold. A brief description of the prototype is given, followed by the preliminary results of the characterisation of the prototype behaviour when tested using a low intensity pulsed light emitting diode. The results obtained are in good agreement with those obtained using previous prototypes. The proceedings conclude with a summary of the current status and future plans

Progress in the development of the DTMROC time measurement chip for the ATLAS transition radiation tracker (TRT)

CERN Document Server

Alexander, C; Dressnandt, N; Ekenberg, T; Farthouat, Philippe; Keener, P T; Lam, N; La Marra, D; Mann, J; Newcomer, F M; Ryzhov, V; Söderberg, M; Szczygiel, R; Van Berg, R; Williams, H H

2001-01-01

A 16-channel digital time-measurement readout chip (DTMROC) has been fabricated in the TEMIC/DM1LL left bracket 1 right bracket BI- CMOS radiation-hard process for the Large Hadron Collider's (LHC) Transition Radiation Tracker (ATLAS/TRT) at CERN left bracket 2 right bracket . The chip receives discriminated straw-drift-tube signals from bipolar amplifier-shaper-discriminator chips (ASDBLR). measures the arrival time in 3.125 ns increments ( plus or minus 1 ns), and stores the data in a pipeline for 3.3mus. A trigger signal (L1A) causes the data to be tagged with a time stamp and stored for readout- Up to 13 events may be stored in an on-chip buffer while data is being clocked out in a 40 MHz serial stream. The chip has been designed to function after exposure to 1x10**1**4 protons/cm**2 and 1 Mrad total dose. System beam-tests have demonstrated measurement of track positions with a resolution of 165mum and 85% efficiency at rates up to 18MHz. 6 Refs.

Design of a readout ASIC for gas detectors with self-amplification

International Nuclear Information System (INIS)

Deng Zhi; Liu Yinong

2009-01-01

A readout ASIC has been designed for gas detectors with self-amplification such as GEM and RPC. It provides amplification and shaping of the detector signals and buffers them to the free running ADCs. The charge gain and the shaping time can be adjusted. The programmability of gain and shaping time is very convenient for studying detector performance under different gas gain and also expands the application range of the chip. The ENC increases as charge gain decreases below 10 mV/fC because the noise from the shaper becomes significant. The chip is designed in Chartered 0.35μm 2P4M CMOS process. Detailed design and simulation results are described in the paper. (authors)

Performance of 20:1 multiplexer for large area charge readouts in directional dark matter TPC detectors

Science.gov (United States)

Ezeribe, A. C.; Robinson, M.; Robinson, N.; Scarff, A.; Spooner, N. J. C.; Yuriev, L.

2018-02-01

More target mass is required in current TPC based directional dark matter detectors for improved detector sensitivity. This can be achieved by scaling up the detector volumes, but this results in the need for more analogue signal channels. A possible solution to reducing the overall cost of the charge readout electronics is to multiplex the signal readout channels. Here, we present a multiplexer system in expanded mode based on LMH6574 chips produced by Texas Instruments, originally designed for video processing. The setup has a capability of reducing the number of readouts in such TPC detectors by a factor of 20. Results indicate that the important charge distribution asymmetry along an ionization track is retained after multiplexed signals are demultiplexed.

An Automatic Baseline Regulation in a Highly Integrated Receiver Chip for JUNO

Science.gov (United States)

Muralidharan, P.; Zambanini, A.; Karagounis, M.; Grewing, C.; Liebau, D.; Nielinger, D.; Robens, M.; Kruth, A.; Peters, C.; Parkalian, N.; Yegin, U.; van Waasen, S.

2017-09-01

This paper describes the data processing unit and an automatic baseline regulation of a highly integrated readout chip (Vulcan) for JUNO. The chip collects data continuously at 1 Gsamples/sec. The Primary data processing which is performed in the integrated circuit can aid to reduce the memory and data processing efforts in the subsequent stages. In addition, a baseline regulator compensating a shift in the baseline is described.

60 GHz wireless data transfer for tracker readout systems—first studies and results

International Nuclear Information System (INIS)

Dittmeier, S.; Berger, N.; Schöning, A.; Soltveit, H.K.; Wiedner, D.

2014-01-01

To allow highly granular trackers to contribute to first level trigger decisions or event filtering, a fast readout system with very high bandwidth is required. Space, power and material constraints, however, pose severe limitations on the maximum available bandwidth of electrical or optical data transfers. A new approach for the implementation of a fast readout system is the application of a wireless data transfer at a carrier frequency of 60 GHz. The available bandwidth of several GHz allows for data rates of multiple Gbps per link. 60 GHz transceiver chips can be produced with a small form factor and a high integration level. A prototype transceiver currently under development at the University of Heidelberg is briefly described in this paper. To allow easy and fast future testing of the chip's functionality, a bit error rate test has been developed with a commercially available transceiver. Crosstalk might be a big issue for a wireless readout system with many links in a tracking detector. Direct crosstalk can be avoided by using directive antennas, linearly polarized waves and frequency channeling. Reflections from tracking modules can be reduced by applying an absorbing material like graphite foam. Properties of different materials typically used in tracking detectors and graphite foam in the 60 GHz frequency range are presented. For data transmission tests, links using commercially available 60 GHz transmitters and receivers are used. Studies regarding crosstalk and the applicability of graphite foam, Kapton horn antennas and polarized waves are shown

The GOTTHARD charge integrating readout detector: design and characterization

International Nuclear Information System (INIS)

Mozzanica, A; Bergamaschi, A; Dinapoli, R; Greiffenberg, D; Henrich, B; Johnson, I; Valeria, R; Schmitt, B; Xintian, S; Graafsma, H; Lohmann, M

2012-01-01

A charge integrating readout ASIC (Application Specific Integrated Circuit) for silicon strip sensors has been developed at PSI in collaboration with DESY. The goal of the project is to provide a charge integrating readout system able to cope with the pulsed beam of XFEL machines and at the same time to retain the high dynamic range and single photon resolution performances typical for photon counting systems. The ASIC, designed in IBM 130 nm CMOS technology, takes advantage of its three gain stages with automatic stage selection to achieve a dynamic range of 10000 12 keV photons and a noise better than 300 e.n.c.. The 4 analog outputs of the ASIC are optimized for speed, allowing frame rates higher than 1 MHz, without compromises on linearity and noise performances. This work presents the design features of the ASIC, and reports the characterization results of the chip itself.

A 32-channels, 025 mu m CMOS ASIC for the readout of the Silicon Drift Detectors of the ALICE experiment

CERN Document Server

Mazza, G; Anelli, G; Anghinolfi, F; Martínez, M I; Rotondo, F

2004-01-01

In this paper we present a 32 channel ASIC prototype for the readout of the Silicon Drift Detectors (SDDs) of the ALICE experiment. The ASIC integrates on the same chip 32 transimpedance amplifiers, a 32*256 cells analogue memory and 16 successive approximation 10 bit A /D converters. The circuit amplifies and samples at 40 MS/s the input signal in a continuous way; when an external trigger signal validates the acquisition, the sampling is stopped and the data are digitized at lower speed (0.5 MS/s). The chip has been designed and fabricated in a commercial. 0.25 mu m CMOS technology. It has been extensively tested both on a bench and connected with the detector in several beam tests. In this paper both design issues and test results are presented. The commercial technology used for the design has been yield radiation tolerant with special layout techniques. Total dose irradiation tests are also presented. (13 refs).

MEMS acceleration sensor with remote optical readout for continuous power generator monitoring

Directory of Open Access Journals (Sweden)

Tormen Maurizio

2015-01-01

Full Text Available Miniaturized accelerometers with remote optical readout are required devices for the continuous monitoring of vibrations inside power generators. In turbo and hydro generators, end-winding vibrations are present during operation causing in the long term undesirable out-of-service repairs. Continuous monitoring of these vibrations is therefore mandatory. The high electromagnetic fields in the generators impose the use of devices immune to electromagnetic interferences. In this paper a MEMS based accelerometer with remote optical readout is presented. Advantages of the proposed device are the use of a differential optical signal to reject the common mode signal and noise, the reduced number of steps for the MEMS chip fabrication and for the system assembly, and the reduced package volume.

Pixel readout chips in deep submicron CMOS for ALICE and LHCb tolerant to 10 Mrad and beyond

International Nuclear Information System (INIS)

Snoeys, W.; Burns, M.; Campbell, M.; Cantatore, E.; Cencelli, V.; Dinapoli, R.; Heijne, E.; Jarron, P.; Lamanna, P.; Minervini, D.; Morel, M.; O'Shea, V.; Quiquempoix, V.; Bello, D.S.S.D.San Segundo; Van Koningsveld, B.; Wyllie, K.

2001-01-01

The ALICE1LHCB chip is a mixed-mode integrated circuit designed to read out silicon pixel detectors for two different applications: particle tracking in the ALICE Silicon Pixel Detector and particle identification in the LHCb Ring Imaging Cherenkov detector. To satisfy the different needs for these two experiments, the chip can be operated in two different modes. In tracking mode all the 50 μmx425 μm pixel cells in the 256x32 array are read out individually, whilst in particle identification mode they are combined in groups of 8 to form a 32x32 array of 400 μmx425 μm cells. Radiation tolerance was enhanced through special circuit layout. Sensitivity to coupling of digital signals into the analog front end was minimized. System issues such as testability and uniformity further constrained the design. The circuit is currently being manufactured in a commercial 0.25 μm CMOS technology

FASTBUS readout system for the CDF DAQ upgrade

International Nuclear Information System (INIS)

Andresen, J.; Areti, H.; Black, D.

1993-11-01

The Data Acquisition System (DAQ) at the Collider Detector at Fermilab is currently being upgraded to handle a minimum of 100 events/sec for an aggregate bandwidth that is at least 25 Mbytes/sec. The DAQ System is based on a commercial switching network that has interfaces to VME bus. The modules that readout the front end crates (FASTBUS and RABBIT) have to deliver the data to the VME bus based host adapters of the switch. This paper describes a readout system that has the required bandwidth while keeping the experiment dead time due to the readout to a minimum

Experimental characterization of the 192 channel Clear-PEM frontend ASIC coupled to a multi-pixel APD readout of LYSO:Ce crystals

International Nuclear Information System (INIS)

Albuquerque, Edgar; Bexiga, Vasco; Bugalho, Ricardo; Carrico, Bruno; Ferreira, Claudia S.; Ferreira, Miguel; Godinho, Joaquim; Goncalves, Fernando; Leong, Carlos; Lousa, Pedro; Machado, Pedro; Moura, Rui; Neves, Pedro; Ortigao, Catarina; Piedade, Fernando; Pinheiro, Joao F.; Rego, Joel; Rivetti, Angelo; Rodrigues, Pedro; Silva, Jose C.

2009-01-01

In the framework of the Clear-PEM project for the construction of a high-resolution scanner for breast cancer imaging, a very compact and dense frontend electronics system has been developed for readout of multi-pixel S8550 Hamamatsu APDs. The frontend electronics are instrumented with a mixed-signal Application-Specific Integrated Circuit (ASIC), which incorporates 192 low-noise charge pre-amplifiers, shapers, analog memory cells and digital control blocks. Pulses are continuously stored in memory cells at clock frequency. Channels above a common threshold voltage are readout for digitization by off-chip free-sampling ADCs. The ASIC has a size of 7.3x9.8mm 2 and was implemented in a AMS 0.35μm CMOS technology. In this paper the experimental characterization of the Clear-PEM frontend ASIC, reading out multi-pixel APDs coupled to LYSO:Ce crystal matrices, is presented. The chips were mounted on a custom test board connected to six APD arrays and to the data acquisition system. Six 32-pixel LYSO:Ce crystal matrices coupled on both sides to APD arrays were readout by two test boards. All 384 channels were operational. The chip power consumption is 660 mW (3.4 mW per channel). A very stable behavior of the chip was observed, with an estimated ENC of 1200-1300e - at APD gain 100. The inter-channel noise dispersion and mean baseline variation is less than 8% and 0.5%, respectively. The spread in the gain between different channels is found to be 1.5%. Energy resolution of 16.5% at 511 keV and 12.8% at 662 keV has been measured. Timing measurements between the two APDs that readout the same crystal is extracted and compared with detailed Monte Carlo simulations. At 511 keV the measured single photon time RMS resolution is 1.30 ns, in very good agreement with the expected value of 1.34 ns.

GOSSIPO-4: Evaluation of a Novel PLL-Based TDC-Technique for the Readout of GridPix-Detectors

CERN Document Server

Brezina, C; Zappon, F; Van Beuzekom, M; Campbell, M; Desch, K; Van der Graaf, H; Gromov, V; Kluit, R; Llopart, X; Poikela, T; Zivkovic, V

2014-01-01

The direct readout of Micro-Pattern Gaseous Detectors (MPGDs) with bare pixel chips introduces the need for a new generation of readout electronics featuring a high spatial granularity as well as a highly accurate time measurement in each pixel. GOSSIPO-4, fabricated in a 130 nm CMOS technology, is a demonstrator ASIC investigating the potential of a new TDC-concept that is based on a chip-wide 40 MHz clock which is complemented by an additional 640 MHz clock. The latter is created upon demand by local oscillators distributed across the pixel matrix. PLL tuning of the local oscillators allows for automatic compensation of frequency fluctuations caused by process parameter, supply voltage and temperature variations. The developed PLL locks within s and achieves a duty cycle of 50.75% with a time interval error of only 23.4 ps. Mean DNL and INL of the TDC are less than 20% of the time bin size of 1.56 ns under all anticipated conditions.

Nanophotonic lab-on-a-chip platforms including novel bimodal interferometers, microfluidics and grating couplers.

Science.gov (United States)

Duval, Daphné; González-Guerrero, Ana Belén; Dante, Stefania; Osmond, Johann; Monge, Rosa; Fernández, Luis J; Zinoviev, Kirill E; Domínguez, Carlos; Lechuga, Laura M

2012-05-08

One of the main limitations for achieving truly lab-on-a-chip (LOC) devices for point-of-care diagnosis is the incorporation of the "on-chip" detection. Indeed, most of the state-of-the-art LOC devices usually require complex read-out instrumentation, losing the main advantages of portability and simplicity. In this context, we present our last advances towards the achievement of a portable and label-free LOC platform with highly sensitive "on-chip" detection by using nanophotonic biosensors. Bimodal waveguide interferometers fabricated by standard silicon processes have been integrated with sub-micronic grating couplers for efficient light in-coupling, showing a phase resolution of 6.6 × 10(-4)× 2π rad and a limit of detection of 3.3 × 10(-7) refractive index unit (RIU) in bulk. A 3D network of SU-8 polymer microfluidics monolithically assembled at the wafer-level was included, ensuring perfect sealing and compact packaging. To overcome some of the drawbacks inherent to interferometric read-outs, a novel all-optical wavelength modulation system has been implemented, providing a linear response and a direct read-out of the phase variation. Sensitivity, specificity and reproducibility of the wavelength modulated BiMW sensor has been demonstrated through the label-free immunodetection of the human hormone hTSH at picomolar level using a reliable biofunctionalization process.

Triroc: A Multi-Channel SiPM Read-Out ASIC for PET/PET-ToF Application

Science.gov (United States)

Ahmad, Salleh; Fleury, Julien; de la Taille, Christophe; Seguin-Moreau, Nathalie; Dulucq, Frederic; Martin-Chassard, Gisele; Callier, Stephane; Thienpont, Damien; Raux, Ludovic

2015-06-01

Triroc is the latest addition to SiPM readout ASICs family developed at Weeroc, a start-up company from the Omega microelectronics group of IN2P3/CNRS. This chip is developed under the framework TRIMAGE European project which is aimed for building a cost effective tri-modal PET/MR/EEG brain scan. To ensure the flexibility and compatibility with any SiPM in the market, the ASIC is designed to be capable of accepting negative and positive polarity input signals. This 64-channel ASIC, is suitable for SiPM readout which requires high accuracy timing and charge measurements. Targeted applications would be PET prototyping with time-of-flight capability. Main features of Triroc includes high dynamic range ADC up to 2500 photoelectrons and TDC fine time binning of 40 ps. Triroc requires very minimal external components which means it is a good contender for compact multichannel PET prototyping. Triroc is designed by using AMS 0.35 μm SiGe technology and it was submitted in March 2014. The detail design of this chip will be presented.

submitter Development of the readout for the IBL upgrade project of the ATLAS Pixel Detector

CERN Document Server

Krieger, Nina

The LHC luminosity is upgraded in several phases until 2022. The resulting higher occupancy degrades the detector performance of the current Pixel Detector. To provide a good performance during the LHC luminosity upgrade, a fourth pixel layer is inserted into the existing ATLAS Pixel Detector. A new FE-I4 readout chip and a new data acquisition chain are required to cope with the higher track rate and the resulting increased bandwidth. Among others, this includes a new readout board: the IBL ROD. One component of this board is the DSP which creates commands for the FE-I4 chip and has to be upgraded as well. In this thesis, the first tests of the IBL ROD prototype are presented. A correct communication of the DSP to its external memory is verified. Moreover, the implementations for an IBL DSP code are described and tested. This includes the first configuration of the FE-I4 with an IBL ROD. In addition, a working communication with the Histogrammer SDRAM and the Input FIFO on the IBL ROD are demonstrated.

Design and implementation of a nanosecond time-stamping readout system-on-chip for photo-detectors

International Nuclear Information System (INIS)

Anvar, Shebli; Château, Frédéric; Le Provost, Hervé; Louis, Frédéric; Manolopoulos, Konstantinos; Moudden, Yassir; Vallage, Bertrand; Zonca, Eric

2014-01-01

A readout system suitable for a large number of synchronized photo-detection units has been designed. Each unit embeds a specifically designed fully integrated communicating system based on Xilinx FPGA SoC technology. It runs the VxWorks real-time OS and a custom data acquisition software designed within the Ice middleware framework, resulting in a highly flexible, controllable and scalable distributed application. Clock distribution and delay calibration over customized fixed latency gigabit Ethernet links enable synchronous time-stamping of events with nanosecond precision. The implementation of this readout system on several data-collecting units as well as its performances are described

Transparent Nanopore Cavity Arrays Enable Highly Parallelized Optical Studies of Single Membrane Proteins on Chip.

Science.gov (United States)

Diederichs, Tim; Nguyen, Quoc Hung; Urban, Michael; Tampé, Robert; Tornow, Marc

2018-06-13

Membrane proteins involved in transport processes are key targets for pharmaceutical research and industry. Despite continuous improvements and new developments in the field of electrical readouts for the analysis of transport kinetics, a well-suited methodology for high-throughput characterization of single transporters with nonionic substrates and slow turnover rates is still lacking. Here, we report on a novel architecture of silicon chips with embedded nanopore microcavities, based on a silicon-on-insulator technology for high-throughput optical readouts. Arrays containing more than 14 000 inverted-pyramidal cavities of 50 femtoliter volumes and 80 nm circular pore openings were constructed via high-resolution electron-beam lithography in combination with reactive ion etching and anisotropic wet etching. These cavities feature both, an optically transparent bottom and top cap. Atomic force microscopy analysis reveals an overall extremely smooth chip surface, particularly in the vicinity of the nanopores, which exhibits well-defined edges. Our unprecedented transparent chip design provides parallel and independent fluorescent readout of both cavities and buffer reservoir for unbiased single-transporter recordings. Spreading of large unilamellar vesicles with efficiencies up to 96% created nanopore-supported lipid bilayers, which are stable for more than 1 day. A high lipid mobility in the supported membrane was determined by fluorescent recovery after photobleaching. Flux kinetics of α-hemolysin were characterized at single-pore resolution with a rate constant of 0.96 ± 0.06 × 10 -3 s -1 . Here, we deliver an ideal chip platform for pharmaceutical research, which features high parallelism and throughput, synergistically combined with single-transporter resolution.

Evaluation of 320x240 pixel LEC GaAs Schottky barrier X-ray imaging arrays, hybridized to CMOS readout circuit based on charge integration

CERN Document Server

Irsigler, R; Alverbro, J; Borglind, J; Froejdh, C; Helander, P; Manolopoulos, S; O'Shea, V; Smith, K

1999-01-01

320x240 pixels GaAs Schottky barrier detector arrays were fabricated, hybridized to silicon readout circuits, and subsequently evaluated. The detector chip was based on semi-insulating LEC GaAs material. The square shaped pixel detector elements were of the Schottky barrier type and had a pitch of 38 mu m. The GaAs wafers were thinned down prior to the fabrication of the ohmic back contact. After dicing, the chips were indium bump, flip-chip bonded to CMOS readout circuits based on charge integration, and finally evaluated. A bias voltage between 50 and 100 V was sufficient to operate the detector. Results on I-V characteristics, noise behaviour and response to X-ray radiation are presented. Images of various objects and slit patterns were acquired by using a standard dental imaging X-ray source. The work done was a part of the XIMAGE project financed by the European Community (Brite-Euram). (author)

Design of a CMOS integrated on-chip oscilloscope for spin wave characterization

Directory of Open Access Journals (Sweden)

Eugen Egel

2017-05-01

Full Text Available Spin waves can perform some optically-inspired computing algorithms, e.g. the Fourier transform, directly than it is done with the CMOS logic. This article describes a new approach for on-chip characterization of spin wave based devices. The readout circuitry for the spin waves is simulated with 65-nm CMOS technology models. Commonly used circuits for Radio Frequency (RF receivers are implemented to detect a sinusoidal ultra-wideband (5-50 GHz signal with an amplitude of at least 15 μV picked up by a loop antenna. First, the RF signal is amplified by a Low Noise Amplifier (LNA. Then, it is down-converted by a mixer to Intermediate Frequency (IF. Finally, an Operational Amplifier (OpAmp brings the IF signal to higher voltages (50-300 mV. The estimated power consumption and the required area of the readout circuit is approximately 55.5 mW and 0.168 mm2, respectively. The proposed On-Chip Oscilloscope (OCO is highly suitable for on-chip spin wave characterization regarding the frequency, amplitude change and phase information. It offers an integrated low power alternative to current spin wave detecting systems.

Design and Measurement of a Low-Noise 64-Channels Front-End Readout ASIC for CdZnTe Detectors

Energy Technology Data Exchange (ETDEWEB)

Gan, Bo; Wei, Tingcun; Gao, Wu; Liu, Hui; Hu, Yann [School of Computer Science and Technology, Northwestern Polytechnical University, Xi' an (China)

2015-07-01

Cadmium zinc telluride (CdZnTe) detectors, as one of the principal detectors for the next-generation X-ray and γ-ray imagers, have high energy resolution and supporting electrode patterning in the radiation environment at room-temperature. In the present, a number of internationally renowned research institutions and universities are actively using these detector systems to carry out researches of energy spectrum analysis, medical imaging, materials characterization, high-energy physics, nuclear plant monitoring, and astrophysics. As the most important part of the readout system for the CdZnTe detector, the front-end readout application specific integrated circuit (ASIC) would have an important impact on the performances of the whole detector system. In order to ensure the small signal to noise ratio (SNR) and sufficient range of the output signal, it is necessary to design a front-end readout ASIC with very low noise and very high dynamic range. In addition, radiation hardness should be considered when the detectors are utilized in the space applications and high energy physics experiments. In this paper, we present measurements and performances of a novel multi-channel radiation-hardness low-noise front-end readout ASIC for CdZnTe detectors. The readout circuits in each channel consist of charge sensitive amplifier, leakage current compensation circuit (LCC), CR-RC shaper, S-K filter, inverse proportional amplifier, peak detect and hold circuit (PDH), discriminator and trigger logic, time sequence control circuit and driving buffer. All of 64 readout channels' outputs enter corresponding inputs of a 64 channel multiplexer. The output of the mux goes directly out of the chip via the output buffer. The 64-channel readout ASIC is implemented using the TSMC 0.35 μm mixed-signal CMOS technology. The die size of the prototype chip is 2.7 mm x 8 mm. At room temperature, the equivalent noise level of a typical channel reaches 66 e{sup -} (rms) at zero farad for a

Perspective: Fabrication of integrated organ-on-a-chip via bioprinting.

Science.gov (United States)

Yang, Qingzhen; Lian, Qin; Xu, Feng

2017-05-01

Organ-on-a-chip has emerged as a powerful platform with widespread applications in biomedical engineering, such as pathology studies and drug screening. However, the fabrication of organ-on-a-chip is still a challenging task due to its complexity. For an integrated organ-on-a-chip, it may contain four key elements, i.e., a microfluidic chip, live cells/microtissues that are cultured in this chip, components for stimulus loading to mature the microtissues, and sensors for results readout. Recently, bioprinting has been used for fabricating organ-on-a-chip as it enables the printing of multiple materials, including biocompatible materials and even live cells in a programmable manner with a high spatial resolution. Besides, all four elements for organ-on-a-chip could be printed in a single continuous procedure on one printer; in other words, the fabrication process is assembly free. In this paper, we discuss the recent advances of organ-on-a-chip fabrication by bioprinting. Light is shed on the printing strategies, materials, and biocompatibility. In addition, some specific bioprinted organs-on-chips are analyzed in detail. Because the bioprinted organ-on-a-chip is still in its early stage, significant efforts are still needed. Thus, the challenges presented together with possible solutions and future trends are also discussed.

Microcontroller based four-channel current readout unit for beam slit monitor

International Nuclear Information System (INIS)

Holikatti, A.C.; Puntambekar, T.A.; Pithawa, C.K.

2009-01-01

This paper describes the design and development of a microcontroller based four-channel current readout unit for Beam Slit Monitor (BSM) installed in Transport Line-1 of Indus Accelerator Complex. BSM is a diagnostic device consisting of two horizontal and two vertical blades, which can be moved independently in to the beam pipe to cut the beam transversely. The readout unit employs switched integrators with reset, hold and select switches and timing and control unit. It integrates the current output of the four blades of BSM and produces an output corresponding to the beam charge intercepted by the blade. The integrator outputs are then multiplexed and digitized using 12-bit ADC. Acquired digital data from ADC is stored into on-chip RAM of the microcontroller. The readout sequence is synchronized with the Microtron beam-timing signal. The timing of integration, hold and reset cycles is controlled by the microcontroller. The unit is connected on a serial link to the host computer in main control room. This unit has been integrated with the BSM system and is being used to obtain the electron beam profile. (author)

Performance of the ALIBAVA portable readout system with irradiated and non-irradiated microstrip silicon sensors

International Nuclear Information System (INIS)

Marco-Hernadez, R.

2009-01-01

A readout system for microstrip silicon sensors has been developed as a result of collaboration among the University of Liverpool, the CNM of Barcelona and the IFIC of Valencia. The name of this collaboration is ALIBAVA and it is integrated in the RD50 Collaboration. This system is able to measure the collected charge in one or two microstrip silicon sensors by reading out all the channels of the sensor(s), up to 256, as an analogue measurement. The system uses two Beetle chips to read out the detector(s). The Beetle chip is an analogue pipelined readout chip used in the LHCb experiment. The system can operate either with non-irradiated and irradiated sensors as well as with n-type and p-type microstrip silicon sensors. Heavily irradiated sensors will be used at the SLHC, so this system is being to research the performance of microstrip silicon sensors in conditions as similar as possible to the SLHC operating conditions. The system has two main parts: a hardware part and a software part. The hardware part acquires the sensor signals either from external trigger inputs, in case of a radioactive source setup is used, or from a synchronised trigger output generated by the system, if a laser setup is used. This acquired data is sent by USB to be stored in a PC for a further processing. The hardware is a dual board based system. The daughterboard is a small board intended for containing two Beetle readout chips as well as fan-ins and detector support to interface the sensors. The motherboard is intended to process the data, to control the whole hardware and to communicate with the software by USB. The software controls the system and processes the data acquired from the sensors in order to store it in an adequate format file. The main characteristics of the system will be described. Results of measurements acquired with n-type and p-type irradiated and non-irradiated detectors using both the laser and the radioactive source setup will be also presented and discussed

Design of a 40-nm CMOS integrated on-chip oscilloscope for 5-50 GHz spin wave characterization

Science.gov (United States)

Egel, Eugen; Csaba, György; Dietz, Andreas; Breitkreutz-von Gamm, Stephan; Russer, Johannes; Russer, Peter; Kreupl, Franz; Becherer, Markus

2018-05-01

Spin wave (SW) devices are receiving growing attention in research as a strong candidate for low power applications in the beyond-CMOS era. All SW applications would require an efficient, low power, on-chip read-out circuitry. Thus, we provide a concept for an on-chip oscilloscope (OCO) allowing parallel detection of the SWs at different frequencies. The readout system is designed in 40-nm CMOS technology and is capable of SW device characterization. First, the SWs are picked up by near field loop antennas, placed below yttrium iron garnet (YIG) film, and amplified by a low noise amplifier (LNA). Second, a mixer down-converts the radio frequency (RF) signal of 5 - 50 GHz to lower intermediate frequencies (IF) around 10 - 50 MHz. Finally, the IF signal can be digitized and analyzed regarding the frequency, amplitude and phase variation of the SWs. The power consumption and chip area of the whole OCO are estimated to 166.4 mW and 1.31 mm2, respectively.

Merlin: a fast versatile readout system for Medipix3

International Nuclear Information System (INIS)

Plackett, R; Horswell, I; Gimenez, E N; Marchal, J; Omar, D; Tartoni, N

2013-01-01

This contribution reports on the development of a new high rate readout system for the Medipix3 hybrid pixel ASIC developed by the Detector Group at Diamond Light Source. It details the current functionality of the system and initial results from tests on Diamond's B16 beamline. The Merlin system is based on a National Instruments PXI/FlexRIO system running a Xilinx Virtex5 FPGA. It is capable of recording Medipix3 256 by 256 by 12 bit data frames at over 1 kHz in bursts of 1200 frames and running at over 100 Hz continuously to disk or over a TCP/IP link. It is compatible with the standard Medipix3 single chipboards developed at CERN and is capable of driving them over cable lengths of up to 10 m depending on the data rate required. In addition to a standalone graphical interface, a system of remote TCP/IP control and data transfer has been developed to allow easy integration with third party control systems and scripting languages. Two Merlin systems are being deployed on the B16 and I16 beamlines at Diamond and the system has been integrated with the EPICS/GDA control systems used. Results from trigger synchronisation, fast burst and high rate tests made on B16 in March are reported and demonstrate an encouraging reliability and timing accuracy. In addition to normal high resolution imaging applications of Medipix3, the results indicate the system could profitably be used in 'pump and probe' style experiments, where a very accurate, high frame rate is especially beneficial. In addition to these two systems, Merlin is being used by the Detector Group to test the Excalibur 16 chip hybrid modules, and by the LHCb VELO Pixel Upgrade group in their forthcoming testbeams. Additionally the contribution looks forward to further developments and improvements in the system, including full rate quad chip readout capability, multi-FPGA support, long distance optical communication and further functionality enhancements built on the capabilities of the Medipix3 chips.

Merlin: a fast versatile readout system for Medipix3

Science.gov (United States)

Plackett, R.; Horswell, I.; Gimenez, E. N.; Marchal, J.; Omar, D.; Tartoni, N.

2013-01-01

This contribution reports on the development of a new high rate readout system for the Medipix3 hybrid pixel ASIC developed by the Detector Group at Diamond Light Source. It details the current functionality of the system and initial results from tests on Diamond's B16 beamline. The Merlin system is based on a National Instruments PXI/FlexRIO system running a Xilinx Virtex5 FPGA. It is capable of recording Medipix3 256 by 256 by 12 bit data frames at over 1 kHz in bursts of 1200 frames and running at over 100 Hz continuously to disk or over a TCP/IP link. It is compatible with the standard Medipix3 single chipboards developed at CERN and is capable of driving them over cable lengths of up to 10 m depending on the data rate required. In addition to a standalone graphical interface, a system of remote TCP/IP control and data transfer has been developed to allow easy integration with third party control systems and scripting languages. Two Merlin systems are being deployed on the B16 and I16 beamlines at Diamond and the system has been integrated with the EPICS/GDA control systems used. Results from trigger synchronisation, fast burst and high rate tests made on B16 in March are reported and demonstrate an encouraging reliability and timing accuracy. In addition to normal high resolution imaging applications of Medipix3, the results indicate the system could profitably be used in `pump and probe' style experiments, where a very accurate, high frame rate is especially beneficial. In addition to these two systems, Merlin is being used by the Detector Group to test the Excalibur 16 chip hybrid modules, and by the LHCb VELO Pixel Upgrade group in their forthcoming testbeams. Additionally the contribution looks forward to further developments and improvements in the system, including full rate quad chip readout capability, multi-FPGA support, long distance optical communication and further functionality enhancements built on the capabilities of the Medipix3 chips.

Enhancements to a Superconducting Quantum Interference Device (SQUID) Multiplexer Readout and Control System

Science.gov (United States)

Forgione, J.; Benford, D. J.; Buchanan, E. D.; Moseley, S. H.; Rebar, J.; Shafer, R. A.

2004-01-01

Far-infrared detector arrays such as the 16x32 superconducting bolometer array for the SAFIRE instrument (flying on the SOFIA airborne observatory) require systems of readout and control electronics to provide translation between a user-driven, digital PC and the cold, analog world of the cryogenic detector. In 2001, the National Institute of Standards and Technology (NIST) developed their Mark III electronics for purposes of control and readout of their 1x32 SQUID Multiplexer chips. We at NASA s Goddard Space Flight Center acquired a Mark 111 system and subsequently designed upgrades to suit our and our collaborators purposes. We developed an arbitrary, programmable multiplexing system that allows the user to cycle through rows in a SQUID array in an infinite number of combinations. We provided hooks in the Mark III system to allow readout of signals from outside the Mark 111 system, such as telescope status information. Finally, we augmented the heart of the system with a new feedback algorithm implementation, flexible diagnostic tools, and informative telemetry.

The ALTRO Chip A 16-channel A/D Converter and Digital Processor for Gas Detectors

CERN Document Server

Esteve-Bosch, R; Mota, B; Musa, L

2003-01-01

The ALTRO (ALICE TPC Read Out) chip is a mixed-signal integrated circuit designed to be one of the building blocks of the readout electronics for gas detectors. Originally conceived and optimised for the Time Projection Chamber (TPC) of the ALICE experiment at the CERN LHC, its architecture and programmability makes it suitable for the readout of a wider class of gas detectors. In one single chip, the analogue signals from 16 channels are digitised, processed, compressed and stored in a multi-acquisition memory. The Analogue-to- Digital converters embedded in the chip have a 10-bit dynamic range and a maximum sampling rate in the range of 20 to 40MHz. After digitisation, a pipelined hardwired Processor is able to remove from the input signal a wide range of systematic and non-systematic perturbations, related to the non-ideal behaviour of the detector, temperature variation of the electronics, environmental noise, etc. Moreover, the Processor is able to suppress the signal tail within 1mus after the pulse pea...

CERN{sub D}xCTA counting mode chip

Energy Technology Data Exchange (ETDEWEB)

Moraes, D. [CERN, CH-1211 Geneva 23 (Switzerland)], E-mail: danielle.moraes@cern.ch; Kaplon, J. [CERN, CH-1211 Geneva 23 (Switzerland); Nygard, E. [Interon AS, Asker, Norway and DX-ray Inc., Northridge, CA (United States)

2008-06-11

This ASIC is a counting mode front-end electronic optimized for the readout of CdZnTe/CdTe and silicon sensors, for possible use in applications where the flux of ionizing radiation is high. The chip is implemented in 0.25 {mu}m CMOS technology. The circuit comprises 128 channels equipped with a transimpedance amplifier followed by a gain shaper stage with 21 ns peaking time, two discriminators and two 18-bit counters. The channel architecture is optimized for the detector characteristics in order to achieve the best energy resolution at counting rates of up to 5 M counts/second. The amplifier shows a linear sensitivity of 118 mV/fC and an equivalent noise charge of about 711 e{sup -}, for a detector capacitance of 5 pF. Complete evaluation of the circuit is presented using electronic pulses and pixel detectors.

Readout of micromechanical cantilever sensor arrays by Fabry-Perot interferometry

International Nuclear Information System (INIS)

Wehrmeister, Jana; Fuss, Achim; Saurenbach, Frank; Berger, Ruediger; Helm, Mark

2007-01-01

The increasing use of micromechanical cantilevers in sensing applications causes a need for reliable readout techniques of micromechanical cantilever sensor (MCS) bending. Current optical beam deflection techniques suffer from drawbacks such as artifacts due to changes in the refraction index upon exchange of media. Here, an adaptation of the Fabry-Perot interferometer is presented that allows simultaneous determination of MCS bending and changes in the refraction index of media. Calibration of the instrument with liquids of known refraction index provides an avenue to direct measurement of bending with nanometer precision. Versatile construction of flow cells in combination with alignment features for substrate chips allows simultaneous measurement of two MCS situated either on the same, or on two different support chips. The performance of the instrument is demonstrate in several sensing applications, including adsorption experiments of alkanethioles on MCS gold surfaces, and measurement of humidity changes in air

Noise evaluation of silicon strip super-module with ABCN250 readout chips for the ATLAS detector upgrade at the High Luminosity LHC

Energy Technology Data Exchange (ETDEWEB)

Todome, K., E-mail: todome@hep.phys.titech.ac.jp [Department of Physics, Tokyo Institute of Technology, Ookayama 2-12-1, Meguro-ku, Tokyo 152-8551 (Japan); Solid State Div., Hamamatsu Photonics K.K., 1126-1, Ichino-cho, Higashi-ku, Hamamatsu-shi, Shizuoka 435-8558 (Japan); Jinnouchi, O. [Department of Physics, Tokyo Institute of Technology, Ookayama 2-12-1, Meguro-ku, Tokyo 152-8551 (Japan); Solid State Div., Hamamatsu Photonics K.K., 1126-1, Ichino-cho, Higashi-ku, Hamamatsu-shi, Shizuoka 435-8558 (Japan); Clark, A.; Barbier, G.; Cadoux, F.; Favre, Y.; Ferrere, D.; Gonzalez-Sevilla, S.; Iacobucci, G.; La Marra, D.; Perrin, E.; Weber, M. [DPNC, University of Geneva, CH-1211 Geneva 4 (Switzerland); Solid State Div., Hamamatsu Photonics K.K., 1126-1, Ichino-cho, Higashi-ku, Hamamatsu-shi, Shizuoka 435-8558 (Japan); Ikegami, Y.; Nakamura, K.; Takubo, Y.; Unno, Y. [Institute of Particle and Nuclear Study, KEK, Oho 1-1, Tsukuba, Ibaraki 305-0801 (Japan); Solid State Div., Hamamatsu Photonics K.K., 1126-1, Ichino-cho, Higashi-ku, Hamamatsu-shi, Shizuoka 435-8558 (Japan); Takashima, R. [Department of Science Education, Kyoto University of Education, Kyoto 612-8522 (Japan); Solid State Div., Hamamatsu Photonics K.K., 1126-1, Ichino-cho, Higashi-ku, Hamamatsu-shi, Shizuoka 435-8558 (Japan); Tojo, J. [Department of Physics, Faculty of Science, Kyushu University, 744 Motooka, Nishi-ku, Fukuoka 819-0395 (Japan); Solid State Div., Hamamatsu Photonics K.K., 1126-1, Ichino-cho, Higashi-ku, Hamamatsu-shi, Shizuoka 435-8558 (Japan); Kono, T. [Ochadai Academic Production, Ochanomizu University, 2-1-1, Otsuka, Bunkyo-ku, Tokyo 112-8610 (Japan); Solid State Div., Hamamatsu Photonics K.K., 1126-1, Ichino-cho, Higashi-ku, Hamamatsu-shi, Shizuoka 435-8558 (Japan); and others

2016-09-21

Toward High Luminosity LHC (HL-LHC), the whole ATLAS inner tracker will be replaced, including the semiconductor tracker (SCT) which is the silicon micro strip detector for tracking charged particles. In development of the SCT, integration of the detector is the important issue. One of the concepts of integration is the “super-module” in which individual modules are assembled to produce the SCT ladder. A super-module prototype has been developed to demonstrate its functionality. One of the concerns in integrating the super-modules is the electrical coupling between each module, because it may increase intrinsic noise of the system. To investigate the electrical performance of the prototype, the new Data Acquisition (DAQ) system has been developed by using SEABAS. The electric performance of the super-module prototype, especially the input noise and random noise hit rate, was investigated by using SEABAS system.

Readout ASIC of pair-monitor for international linear collider

International Nuclear Information System (INIS)

Sato, Yutaro; Ikeda, Hirokazu; Ito, Kazutoshi; Miyamoto, Akiya; Nagamine, Tadashi; Sasaki, Rei; Takubo, Yosuke; Tauchi, Toshiaki; Yamamoto, Hitoshi

2010-01-01

The pair-monitor is a beam profile monitor at the interaction point of the international linear collider. A prototype of the readout ASIC for the pair-monitor has been designed and tested. Since the pair-monitor uses the hit distribution of electrons and positrons generated by the beam-crossing to measure the beam profile, the readout ASIC is designed to count the number of hits. In a prototype ASIC, 36 readout cells were implemented by TSMC 0.25-μm CMOS process. Each readout cell is equipped with an amplifier, comparator, 8-bit counter and 16 count-registers. By the operation test, all the ASIC component were confirmed to work correctly. As the next step, we develop the prototype ASIC with the silicon on insulator technology. It is produced with OKI 0.2-μm FD-SOI CMOS process.

The front-end chip of the SuperB SVT detector

International Nuclear Information System (INIS)

Giorgi, F.; Comotti, D.; Manghisoni, M.; Re, V.; Traversi, G.; Fabbri, L.; Gabrielli, A.; Pellegrini, G.; Sbarra, C.; Semprini-Cesari, N.; Valentinetti, S.; Villa, M.; Zoccoli, A.; Berra, A.; Lietti, D.; Prest, M.; Bevan, A.; Wilson, F.; Beck, G.; Morris, J.

2013-01-01

The asymmetric e + e − collider SuperB is designed to deliver a high luminosity, greater than 10 36 cm −2 s −1 , with moderate beam currents and a reduced center of mass boost with respect to earlier B-Factories. The innermost detector is the Silicon Vertex Tracker which is made of 5 layers of double sided silicon strip sensors plus a layer 0, that can be equipped with short striplets detectors in a first phase of the experiment. In order to achieve an overall track reconstruction efficiency above 98% it is crucial to optimize both analog and digital readout circuits. The readout architecture being developed for the front-end chips will be able to cope with the very high rates expected in the first layer. The digital readout will be optimized to be fully efficient for hit rates up to 2 MHz/strip, including large margins on the maximum expected background rates, but can potentially accommodate higher rates with a proper tuning of the buffer depth. The readout is based on a triggered architecture where each of the 128 strip channel is provided with a dedicated digital buffer. Each buffer collects the digitized charge information by means of a 4-bit TOT, storing it in conjunction with the related time stamp. The depth of buffers was dimensioned considering the expected trigger latency and hit rate including suitable safety margins. Every buffer is connected to a highly parallelized circuit handling the trigger logic, rejecting expired data in the buffers and channeling the parallel stream of triggered hits to the common output of the chip. The presented architecture has been modeled by HDL language and investigated with a Monte Carlo hit generator emulating the analog front-end behavior. The simulations showed that even applying the highest stressing conditions, about 2 MHz per strip, the efficiency of the digital readout remained above 99.8%

A custom readout electronics for the BESIII CGEM detector

International Nuclear Information System (INIS)

Rolo, M. Da Rocha; Alexeev, M.; Amoroso, A.; Bianchi, F.; Cossio, F.; Mori, F. De; Destefanis, M.; Ferroli, R. Baldini; Chai, J.Y.; Bertani, M.; Calcaterra, A.; Capodiferro, M.; Cerioni, S.; Bettoni, D.; Canale, N.; Carassiti, V.; Chiozzi, S.; Cibinetto, G.; Ramusino, A. Cotta; Bugalho, R.

2017-01-01

readout, and reviewing the first silicon results of the chip prototype.

A custom readout electronics for the BESIII CGEM detector

Science.gov (United States)

Da Rocha Rolo, M.; Alexeev, M.; Amoroso, A.; Baldini Ferroli, R.; Bertani, M.; Bettoni, D.; Bianchi, F.; Bugalho, R.; Calcaterra, A.; Canale, N.; Capodiferro, M.; Carassiti, V.; Cerioni, S.; Chai, J. Y.; Chiozzi, S.; Cibinetto, G.; Cossio, F.; Cotta Ramusino, A.; De Mori, F.; Destefanis, M.; Di Francesco, A.; Dong, J.; Evangelisti, F.; Farinelli, R.; Fava, L.; Felici, G.; Fioravanti, E.; Garzia, I.; Gatta, M.; Greco, M.; Lavezzi, L.; Leng, C. Y.; Li, H.; Maggiora, M.; Malaguti, R.; Marcello, S.; Marciniewski, P.; Melchiorri, M.; Mezzadri, G.; Mignone, M.; Morello, G.; Pacetti, S.; Patteri, P.; Pellegrino, J.; Pelosi, A.; Rivetti, A.; Savrié, M.; Scodeggio, M.; Soldani, E.; Sosio, S.; Spataro, S.; Tskhadadze, E.; Varela, J.; Verma, S.; Wheadon, R.; Yan, L.

2017-07-01

For the upgrade of the inner tracker of the BESIII spectrometer, planned for 2018, a lightweight tracker based on an innovative Cylindrical Gas Electron Multiplier (CGEM) detector is now under development. The analogue readout of the CGEM enables the use of a charge centroid algorithm to improve the spatial resolution to better than 130 μm while loosening the pitch strip to 650 μm, which allows to reduce the total number of channels to about 10 000. The channels are readout by 160 dedicated integrated 64-channel front-end ASICs, providing a time and charge measurement and featuring a fully-digital output. The energy measurement is extracted either from the time-over-threshold (ToT) or the 10-bit digitisation of the peak amplitude of the signal. The time of the event is generated by quad-buffered low-power TDCs, allowing for rates in excess of 60 kHz per channel. The TDCs are based on analogue interpolation techniques and produce a time stamp (or two, if working in ToT mode) of the event with a time resolution better than 50 ps. The front-end noise, based on a CSA and a two-stage complex conjugated pole shapers, dominate the channel intrinsic time jitter, which is less than 5 ns r.m.s. The time information of the hit can be used to reconstruct the track path, operating the detector as a small TPC and hence improving the position resolution when the distribution of the cloud, due to large incident angle or magnetic field, is very broad. Event data is collected by an off-detector motherboard, where each GEM-ROC readout card handles 4 ASIC carrier FEBs (512 channels). Configuration upload and data readout between the off-detector electronics and the VME-based data collector cards are managed by bi-directional fibre optical links. This paper covers the design of a custom front-end electronics for the readout of the new inner tracker of the BESIII experiment, addressing the relevant design aspects of the detector electronics and the front-end ASIC for the CGEM readout

Image processing system design for microcantilever-based optical readout infrared arrays

Science.gov (United States)

Tong, Qiang; Dong, Liquan; Zhao, Yuejin; Gong, Cheng; Liu, Xiaohua; Yu, Xiaomei; Yang, Lei; Liu, Weiyu

2012-12-01

Compared with the traditional infrared imaging technology, the new type of optical-readout uncooled infrared imaging technology based on MEMS has many advantages, such as low cost, small size, producing simple. In addition, the theory proves that the technology's high thermal detection sensitivity. So it has a very broad application prospects in the field of high performance infrared detection. The paper mainly focuses on an image capturing and processing system in the new type of optical-readout uncooled infrared imaging technology based on MEMS. The image capturing and processing system consists of software and hardware. We build our image processing core hardware platform based on TI's high performance DSP chip which is the TMS320DM642, and then design our image capturing board based on the MT9P031. MT9P031 is Micron's company high frame rate, low power consumption CMOS chip. Last we use Intel's company network transceiver devices-LXT971A to design the network output board. The software system is built on the real-time operating system DSP/BIOS. We design our video capture driver program based on TI's class-mini driver and network output program based on the NDK kit for image capturing and processing and transmitting. The experiment shows that the system has the advantages of high capturing resolution and fast processing speed. The speed of the network transmission is up to 100Mbps.

The NA62 Gigatracker: Detector properties and pixel read-out architectures

International Nuclear Information System (INIS)

Fiorini, M.; Carassiti, V.; Ceccucci, A.; Cortina, E.; Cotta Ramusino, A.; Dellacasa, G.; Jarron, P.; Kaplon, J.; Kluge, A.; Marchetto, F.; Martin, E.; Martoiu, S.; Mazza, G.; Noy, M.; Petrucci, F.; Riedler, P.; Rivetti, A.; Tiuraniemi, S.

2010-01-01

The beam spectrometer of the NA62 experiment, named Gigatracker, has to perform single track reconstruction with unprecedented time resolution (150 ps rms) in a harsh radiation environment. To meet these requirements, and in order to reduce material budget to a minimum, three hybrid silicon pixel detector stations will be installed in vacuum. An adequate strategy to compensate for the discriminator time-walk must be implemented and R and D investigating two different options is ongoing. Two read-out chip prototypes have been designed in order to compare their performance: one approach is based on the use of a constant-fraction discriminator followed by an on-pixel TDC, while the other one is based on the use of a time-over-threshold circuit followed by a TDC shared by a group of pixels. This paper describes the Gigatracker system, presents the global architectures of both read-out ASICs and reviews the current status of the R and D project.

Power distribution and substrate noise coupling investigations on the behavioral level for photon counting imaging readout circuits

International Nuclear Information System (INIS)

Lundgren, Jan; Abdalla, Suliman; O'Nils, Mattias; Oelmann, Bengt

2007-01-01

In modern mixed-signal system design, there are increasing problems associated with noise coupling caused by switching digital parts to sensitive analog parts. As a consequence, there is a growing necessity to understand these problems. In order to avoid costly design iterations, noise coupling simulations should be initiated as early as possible in the design chain. The problems associated with on-chip noise coupling have been discovered in photon counting pixel detector readout systems, where the level of integration of analog and digital circuits is very high on a very small area, and it would appear that these problems will continue to increase for future system designs in this field. This paper deals with the functionality of utilizing behavioral level models for simulating noise coupling in these readout systems. The methods and models are described and simulation results are shown for a photon counting pixel detector readout system

The CMS silicon strip tracker and its electronic readout

International Nuclear Information System (INIS)

Friedl, M.

2001-05-01

The Large Hadron Collider (LHC) at CERN (Geneva, CH) will be the world's biggest accelerator machine when operation starts in 2006. One of its four detector experiments is the Compact Muon Solenoid (CMS), consisting of a large-scale silicon tracker and electromagnetic and hadron calorimeters, all embedded in a solenoidal magnetic field of 4 T, and a muon system surrounding the magnet coil. The Silicon Strip Tracker has a sensitive area of 206m 2 with 10 million analog channels which are read out at the collider frequency of 40 MHz. The building blocks of the CMS Tracker are the silicon sensors, APV amplifier ASICs, supporting front-end ASICs, analog and digital optical links as well as data processors and control units in the back-end. Radiation tolerance, readout speed and the huge data volume are challenging requirements. The charge collection in silicon detectors was modeled, which is discussed as well as the concepts of readout amplifiers with respect to the LHC requirements, including the deconvolution method of fast pulse shaping, electronic noise constraints and radiation effects. Moreover, extensive measurements on prototype components of the CMS Tracker and different versions of the APV chip in particular were performed. There was a significant contribution to the construction of several detector modules, characterized them in particle beam tests and quantified radiation induced effects on the APV chip and on silicon detectors. In addition, a prototype of the analog optical link and the analog performance of the back-end digitization unit were evaluated. The results are very encouraging, demonstrating the feasibility of the CMS Silicon Strip Tracker system and motivating progress towards the construction phase. (author)

ADVANCED READOUT ELECTRONICS FOR MULTIELEMENT CdZnTe SENSORS

International Nuclear Information System (INIS)

DE GERONIMO, G.; O CONNOR, P.; KANDASAMY, A.; GROSHOLZ, J.

2002-01-01

A generation of high performance front-end and read-out ASICs customized for highly segmented CdZnTe sensors is presented. The ASICs, developed in a multi-year effort at Brookhaven National Laboratory, are targeted to a wide range of applications including medical, safeguards/security, industrial, research, and spectroscopy. The front-end multichannel ASICs provide high accuracy low noise preamplification and filtering of signals, with versions for small and large area CdZnTe elements. They implement a high order unipolar or bipolar shaper, an innovative low noise continuous reset system with self-adapting capability to the wide range of detector leakage currents, a new system for stabilizing the output baseline and high output driving capability. The general-purpose versions include programmable gain and peaking time. The read-out multichannel ASICs provide fully data driven high accuracy amplitude and time measurements, multiplexing and time domain derandomization of the shaped pulses. They implement a fast arbitration scheme and an array of innovative two-phase offset-free rail-to-rail analog peak detectors for buffering and absorption of input rate fluctuations, thus greatly relaxing the rate requirement on the external ADC. Pulse amplitude, hit timing, pulse risetime, and channel address per processed pulse are available at the output in correspondence of an external readout request. Prototype chips have been fabricated in 0.5 and 0.35 (micro)m CMOS and tested. Design concepts and experimental results are discussed

Intensity-based readout of resonant-waveguide grating biosensors: Systems and nanostructures

Science.gov (United States)

Paulsen, Moritz; Jahns, Sabrina; Gerken, Martina

2017-09-01

Resonant waveguide gratings (RWG) - also called photonic crystal slabs (PCS) - have been established as reliable optical transducers for label-free biochemical assays as well as for cell-based assays. Current readout systems are based on mechanical scanning and spectrometric measurements with system sizes suitable for laboratory equipment. Here, we review recent progress in compact intensity-based readout systems for point-of-care (POC) applications. We briefly introduce PCSs as sensitive optical transducers and introduce different approaches for intensity-based readout systems. Photometric measurements have been realized with a simple combination of a light source and a photodetector. Recently a 96-channel, intensity-based readout system for both biochemical interaction analyses as well as cellular assays was presented employing the intensity change of a near cut-off mode. As an alternative for multiparametric detection, a camera system for imaging detection has been implemented. A portable, camera-based system of size 13 cm × 4.9 cm × 3.5 cm with six detection areas on an RWG surface area of 11 mm × 7 mm has been demonstrated for the parallel detection of six protein binding kinetics. The signal-to-noise ratio of this system corresponds to a limit of detection of 168 M (24 ng/ml). To further improve the signal-to-noise ratio advanced nanostructure designs are investigated for RWGs. Here, results on multiperiodic and deterministic aperiodic nanostructures are presented. These advanced nanostructures allow for the design of the number and wavelengths of the RWG resonances. In the context of intensity-based readout systems they are particularly interesting for the realization of multi-LED systems. These recent trends suggest that compact point-of-care systems employing disposable test chips with RWG functional areas may reach market in the near future.

Progress on TSV technology for Medipix3RX chip

Science.gov (United States)

Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.

2017-12-01

The progress of Through Silicon Via (TSV) technology for Medipix3RX chip done at DESY is presented here. The goal of this development is to replace the wire bonds in X-ray detectors with TSVs, in order to reduce the dead area between detectors. We obtained the first working chips assembled together with Si based sensors for X-ray detection. The 3D integration technology, including TSV, Re-distribution layer deposition, bump bonding to the Si sensor and bump bonding to the carrier PCB, was done by Fraunhofer Institute IZM in Berlin. After assembly, the module was successfully tested by recording background radiation and making X-ray images of small objects. The active area of the Medipix3RX chip is 14.1 mm×14.1 mm or 256×256 pixels. During TSV processing, the Medipix3RX chip was thinned from 775 μm original thickness, to 130 μm. The diameter of the vias is 40 μm, and the pitch between the vias is 120 μm. A liner filling approach was used to contact the TSV with the RDL on the backside of the Medipix3RX readout chip.

A 10 MHz micropower CMOS front end for direct readout of pixel detectors

International Nuclear Information System (INIS)

Campbell, M.; Heijne, E.H.M.; Jarron, P.; Krummenacher, F.; Enz, C.C.; Declercq, M.; Vittoz, E.; Viertel, G.

1990-01-01

In the framework of the CERN-LAA project for detector R and D, a micropower circuit of 200 μmx200 μm with a current amplifier, a latched comparator and a digital memory element has been tested electrically and operated in connection with linear silicon detector arrays. The experimental direct-readout (DRO) chip comprises a matrix of 9x12 circuit cells and has been manufactured in a 3 μm CMOS technology. Particles and X-ray photons below 22 keV were detected, and thresholds can be set between 2000 and 20000 e - . The noise is less than 4 keV FWHM or 500 e - rms and the power dissipation per pixel element is 30 μW. The chip can be coupled to a detector matrix using bump bonding. (orig.)

The SVX3D integrated circuit for dead-timeless silicon strip readout

Energy Technology Data Exchange (ETDEWEB)

Garcia-Sciveres, M. E-mail: mgs@lbl.gov; Milgrome, O.; Zimmerman, T.; Volobouev, I.; Ely, R.P.; Connolly, A.; Fish, D.; Affolder, T.; Sill, A

1999-10-01

The revision D of the SVX3 readout IC has been fabricated in the Honeywell radiation-hard 0.8 {mu}m bulk CMOS process, for instrumenting 712,704 silicon strips in the upgrade to the Collider Detector at Fermilab. This final revision incorporates new features and changes to the original architecture that were added to meet the goal of dead-timeless operation. This paper describes the features central to dead-timeless operation, and presents test data for un-irradiated and irradiated SVX3D chips. (author)

A Low-Power Integrated Humidity CMOS Sensor by Printing-on-Chip Technology

Directory of Open Access Journals (Sweden)

Chang-Hung Lee

2014-05-01

Full Text Available A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

A low-power integrated humidity CMOS sensor by printing-on-chip technology.

Science.gov (United States)

Lee, Chang-Hung; Chuang, Wen-Yu; Cowan, Melissa A; Wu, Wen-Jung; Lin, Chih-Ting

2014-05-23

A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene)/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

Prototype detection unit for the CHIPS experiment

Science.gov (United States)

Pfützner, Maciej M.

2017-09-01

CHIPS (CHerenkov detectors In mine PitS) is an R&D project aiming to develop novel cost-effective neutrino detectors, focused on measuring the CP-violating neutrino mixing phase (δ CP). A single detector module, containing an enclosed volume of purified water, would be submerged in an existing lake, located in a neutrino beam. A staged approach is proposed with first detectors deployed in a flooded mine pit in Northern Minnesota, 7 mrad off-axis from the existing NuMI beam. A small proof-of-principle model (CHIPS-M) has already been tested and the first stage of a fully functional 10 kt module (CHIPS-10) is planned for 2018. One of the instruments submerged on board of CHIPS-M in autumn 2015 was a prototype detection unit, constructed at Nikhef. The unit contains hardware borrowed from the KM3NeT experiment, including 16 3 inch photomultiplier tubes and readout electronics. In addition to testing the mechanical design and data acquisition, the detector was used to record a large sample of cosmic ray muon events. The collected data is valuable for characterising the cosmic muon background and validating a Monte Carlo simulation used to optimise future designs. This paper introduces the CHIPS project, describes the design of the prototype unit, and presents the results of a preliminary data analysis.

Development of a cylindrical tracking detector with multichannel scintillation fibers and pixelated photon detector readout

Energy Technology Data Exchange (ETDEWEB)

Akazawa, Y.; Miwa, K.; Honda, R.; Shiozaki, T.; Chiga, N.

2015-07-01

We are developing a cylindrical tracking detector for a Σp scattering experiment in J-PARC with scintillation fibers and the Pixelated Photon Detector (PPD) readout, which is called as cylindrical fiber tracker (CFT), in order to reconstruct trajectories of charged particles emitted inside CFT. CFT works not only as a tracking detector but also a particle identification detector from energy deposits. A prototype CFT consisting of two straight layers and one spiral layer was constructed. About 1100 scintillation fibers with a diameter of 0.75 mm (Kuraray SCSF-78 M) were used. Each fiber signal was read by Multi-Pixel Photon Counter (MPPC, HPK S10362-11-050P, 1×1 mm{sup 2}, 400 pixels) fiber by fiber. MPPCs were handled with Extended Analogue Silicon Photomultipliers Integrated ReadOut Chip (EASIROC) boards, which were developed for the readout of a large number of MPPCs. The energy resolution of one layer was 28% for a 70 MeV proton where the energy deposit in fibers was 0.7 MeV.

Progress on DC-DC Converters for a Silicon Tracker for the sLHC Upgrade

CERN Document Server

Dhawan, S; Chen, H; Khanna, R; Kierstead, J; Lanni, F; Lynn, D; Musso, C; Rescia, S; Smith, H; Tipton, P; M. Weber, M

2009-01-01

There is a need for DC-DC converters which can operate in the extremely harsh environment of the sLHC Si Tracker. The environment requires radiation qualification to a total ionizing radiation dose of 50 Mrad and a displacement damage fluence of 5 x 1014 /cm2 of 1 MeV equivalent neutrons. In addition a static magnetic field of 2 Tesla or greater prevents the use of any magnetic components or materials. In February 2007 an Enpirion EN5360 was qualified for the sLHC radiation dosage but the converter has an input voltage limited to a maximum of 5.5V. From a systems point of view this input voltage was not sufficient for the application. Commercial LDMOS FETs have developed using a 0.25 μm process which provided a 12 volt input and were still radiation hard. These results are reported here and in previous papers. Plug in power cards with ×10 voltage ratio are being developed for testing the hybrids with ABCN chips. These plug-in cards have air coils but use commercial chips that are not designed to be radiatio...

CBC3: a CMS microstrip readout ASIC with logic for track-trigger modules at HL-LHC

CERN Document Server

Prydderch, Mark Lyndon; Bell, Stephen Jean-marc; Key-Charriere, M; Jones, Lawrence; Auzinger, Georg; Borg, Johan; Hall, Geoffrey; Pesaresi, Mark Franco; Raymond, David Mark; Uchida, Kirika; Goldstein, Joel; Seif El Nasr, Sarah

2018-01-01

The CBC3 is the latest version of the CMS Binary Chip ASIC for readout of the outer radial region of the upgraded CMS Tracker at HL-LHC. This 254-channel, 130nm CMOS ASIC is designed to be bump-bonded to a substrate to which sensors will be wire-bonded. It will instrument double-layer 2S-modules, consisting of two overlaid silicon microstrip sensors with aligned microstrips. On-chip logic identifies first level trigger primitives from high transverse-momentum tracks by selecting correlated hits in the two sensors. Delivered in late 2016, the CBC3 has been under test for several months, including X-ray irradiations and SEU testing. Results and performance are reported.

PADI ASIC for straw tube read-out

Energy Technology Data Exchange (ETDEWEB)

Pietraszko, Jerzy; Traeger, Michael; Fruehauf, Jochen; Schmidt, Christian [GSI, Darmstadt (Germany); Ciobanu, Mircea [ISS, Bucharest (Romania); Collaboration: CBM-Collaboration

2016-07-01

A prototype of the CBM MUCH straw tube detector consisting of six individual straws of 6mm inner diameter and 220 mm length filled with Ar/CO{sub 2} gas mixture has been tested at the COSY accelerator in Juelich. The straw tubes were connected to the FEET-PADI6-HDa PCB equipped with PADI-6 fast amplifier/discriminator ASIC. As a reference counter in this measurement the scCVD diamond detector has been used delivering excellent timing, time resolution below 100 ps (sigma), and very precise position information, below 50 μm. The demonstrated position resolution of about 160 μm of the straw tube read out with PADI-6 ASIC confirms the capability of the PADI chip and puts this development as a very attractive readout option for straw tubes and wire chambers.

Measurement of extremely low level dose with LiF(Mg,Cu,P) TL chips

International Nuclear Information System (INIS)

Zha Ziying; Wang Shoushan; Wu Fang; Chen Guolong; Li Yuanfang; Zhu Jianhuan

1986-01-01

This paper presents some of the dosimetric characteristics of newly developed LiF(Mg,Cu,P) TL chips with high signal-to-noise ratio for measurement at the 10 -7 to 10 -4 Gy dose level. Measuring techniques and optimum procedures for annealing and readout are also presented. (author)

A pixel read-out architecture implementing a two-stage token ring, zero suppression and compression

International Nuclear Information System (INIS)

Heuvelmans, S; Boerrigter, M

2011-01-01

Increasing luminosity in high energy physics experiments leads to new challenges in the design of data acquisition systems for pixel detectors. With the upgrade of the LHCb experiment, the data processing will be changed; hit data from every collision will be transported off the pixel chip, without any trigger selection. A read-out architecture is proposed which is able to obtain low hit data loss on limited silicon area by using the logic beneath the pixels as a data buffer. Zero suppression and redundancy reduction ensure that the data rate off chip is minimized. A C++ model has been created for simulation of functionality and data loss, and for system development. A VHDL implementation has been derived from this model.

A pixel read-out architecture implementing a two-stage token ring, zero suppression and compression

Energy Technology Data Exchange (ETDEWEB)

Heuvelmans, S; Boerrigter, M, E-mail: sander.heuvelmans@bruco.nl [Bruco integrated circuits BV, Oostermaat 2, 7623 CS (Netherlands)

2011-01-15

Increasing luminosity in high energy physics experiments leads to new challenges in the design of data acquisition systems for pixel detectors. With the upgrade of the LHCb experiment, the data processing will be changed; hit data from every collision will be transported off the pixel chip, without any trigger selection. A read-out architecture is proposed which is able to obtain low hit data loss on limited silicon area by using the logic beneath the pixels as a data buffer. Zero suppression and redundancy reduction ensure that the data rate off chip is minimized. A C++ model has been created for simulation of functionality and data loss, and for system development. A VHDL implementation has been derived from this model.

A TPC-like readout method for high precision muon-tracking using GEM-detectors

Energy Technology Data Exchange (ETDEWEB)

Flierl, Bernhard; Biebel, Otmar; Bortfeldt, Jonathan; Hertenberger, Ralf; Klitzner, Felix; Loesel, Philipp; Mueller, Ralph [Ludwig-Maximilians-Universitaet Muenchen (Germany); Zibell, Andre [Julius-Maximilians-Universitaet Wuerzburg (Germany)

2016-07-01

Gaseous electron multiplier (GEM) detectors are well suited for tracking of charged particles. Three dimensional tracking in a single layer can be achieved by application of a time-projection-chamber like readout mode (μTPC), if the drift time of the electrons is measured and the position dependence of the arrival time is used to calculate the inclination angle of the track. To optimize the tracking capabilities for ion tracks drift gas mixtures with low drift velocity have been investigated by measuring tracks of cosmic muons in a compact setup of four GEM-detectors of 100 x 100 x 6 mm{sup 3} active volume each and an angular acceptance of -25 to 25 . The setup consists of three detectors with two-dimensional strip readout layers of 0.4 mm pitch and one detector with a single strip readout layer of 0.25 mm pitch. All strips are readout by APV25 frontend boards and the amplification stage in the detectors consists of three GEM-foils. Tracks are reconstructed by the μTPC-method in one of the detectors and are then compared to the prediction from the other three detectors defined by the center of charge in every detector. We report our study of Argon and Helium based noble gas mixtures with carbon-dioxide as quencher.

Monitoring the CMS strip tracker readout system

International Nuclear Information System (INIS)

Mersi, S; Bainbridge, R; Cripps, N; Fulcher, J; Wingham, M; Baulieu, G; Bel, S; Delaere, C; Drouhin, F; Mirabito, L; Cole, J; Giassi, A; Gross, L; Hahn, K; Nikolic, M; Tkaczyk, S

2008-01-01

The CMS Silicon Strip Tracker at the LHC comprises a sensitive area of approximately 200 m 2 and 10 million readout channels. Its data acquisition system is based around a custom analogue front-end chip. Both the control and the readout of the front-end electronics are performed by off-detector VME boards in the counting room, which digitise the raw event data and perform zero-suppression and formatting. The data acquisition system uses the CMS online software framework to configure, control and monitor the hardware components and steer the data acquisition. The first data analysis is performed online within the official CMS reconstruction framework, which provides many services, such as distributed analysis, access to geometry and conditions data, and a Data Quality Monitoring tool based on the online physics reconstruction. The data acquisition monitoring of the Strip Tracker uses both the data acquisition and the reconstruction software frameworks in order to provide real-time feedback to shifters on the operational state of the detector, archiving for later analysis and possibly trigger automatic recovery actions in case of errors. Here we review the proposed architecture of the monitoring system and we describe its software components, which are already in place, the various monitoring streams available, and our experiences of operating and monitoring a large-scale system

High-Tc dc-SQUID gradiometers in flip-chip configuration

International Nuclear Information System (INIS)

Peiselt, K; Schmidl, F; Linzen, S; Anton, A S; Huebner, U; Seidel, P

2003-01-01

We describe a new design of a gradiometric flip-chip antenna, which is inductively coupled to a dc-SQUID gradiometer. Both components are patterned out of thin films of the high-T c superconductor YBa 2 Cu 3 O 7-x (YBCO). For the flip-chip antenna, a 40 mm x 10 mm SrTiO 3 single crystalline substrate is used, while the gradiometer sensors are prepared on 10 mm x 10 mm SrTiO 3 bicrystal substrates. Special attention is paid to the inductive coupling between the flip-chip antenna and the read-out gradiometer antenna. We investigate different designs of coupling loops in order to optimize the coupling inductance between both components of the sensor. With optimized coupling the sensor achieves a field-gradient resolution of 12 fT cm -1 Hz -1/2 in the white noise region and of 310 fT cm -1 Hz -1/2 at 1 Hz in the unshielded laboratory environment

High-Tc dc-SQUID gradiometers in flip-chip configuration

Science.gov (United States)

Peiselt, K.; Schmidl, F.; Linzen, S.; Anton, A. S.; Hübner, U.; Seidel, P.

2003-12-01

We describe a new design of a gradiometric flip-chip antenna, which is inductively coupled to a dc-SQUID gradiometer. Both components are patterned out of thin films of the high-Tc superconductor YBa2Cu3O7-x (YBCO). For the flip-chip antenna, a 40 mm × 10 mm SrTiO3 single crystalline substrate is used, while the gradiometer sensors are prepared on 10 mm × 10 mm SrTiO3 bicrystal substrates. Special attention is paid to the inductive coupling between the flip-chip antenna and the read-out gradiometer antenna. We investigate different designs of coupling loops in order to optimize the coupling inductance between both components of the sensor. With optimized coupling the sensor achieves a field-gradient resolution of 12 fT cm-1 Hz-1/2 in the white noise region and of 310 fT cm-1 Hz-1/2 at 1 Hz in the unshielded laboratory environment.

EIGER: Next generation single photon counting detector for X-ray applications

Energy Technology Data Exchange (ETDEWEB)

Dinapoli, Roberto, E-mail: roberto.dinapoli@psi.ch [Paul Scherrer Institut, 5232 Villigen PSI (Switzerland); Bergamaschi, Anna; Henrich, Beat; Horisberger, Roland; Johnson, Ian; Mozzanica, Aldo; Schmid, Elmar; Schmitt, Bernd; Schreiber, Akos; Shi, Xintian; Theidel, Gerd [Paul Scherrer Institut, 5232 Villigen PSI (Switzerland)

2011-09-11

EIGER is an advanced family of single photon counting hybrid pixel detectors, primarily aimed at diffraction experiments at synchrotrons. Optimization of maximal functionality and minimal pixel size (using a 0.25{mu}m process and conserving the radiation tolerant design) has resulted in 75x75{mu}m{sup 2} pixels. Every pixel comprises a preamplifier, shaper, discriminator (with a 6 bit DAC for threshold trimming), a configurable 4/8/12 bit counter with double buffering, as well as readout, control and test circuitry. A novel feature of this chip is its double buffered counter, meaning a next frame can be acquired while the previous one is being readout. An array of 256x256 pixels fits on a {approx}2x2cm{sup 2} chip and a sensor of {approx}8x4cm{sup 2} will be equipped with eight readout chips to form a module containing 0.5 Mpixel. Several modules can then be tiled to form larger area detectors. Detectors up to 4x8 modules (16 Mpixel) are planned. To achieve frame rates of up to 24 kHz the readout architecture is highly parallel, and the chip readout happens in parallel on 32 readout lines with a 100 MHz Double Data Rate clock. Several chips and singles (i.e. a single chip bump-bonded to a single chip silicon sensor) were tested both with a lab X-ray source and at Swiss Light Source (SLS) beamlines. These tests demonstrate the full functionality of the chip and provide a first assessment of its performance. High resolution X-ray images and 'high speed movies' were produced, even without threshold trimming, at the target system frame rates (up to {approx}24kHz in 4 bit mode). In parallel, dedicated hardware, firmware and software had to be developed to comply with the enormous data rate the chip is capable of delivering. Details of the chip design and tests will be given, as well as highlights of both test and final readout systems.

Pixel detector readout electronics with two-level discriminator scheme

International Nuclear Information System (INIS)

Pengg, F.

1998-01-01

In preparation for a silicon pixel detector with more than 3,000 readout channels per chip for operation at the future large hadron collider (LHC) at CERN the analog front end of the readout electronics has been designed and measured on several test-arrays with 16 by 4 cells. They are implemented in the HP 0.8 microm process but compatible with the design rules of the radiation hard Honeywell 0.8 microm bulk process. Each cell contains bump bonding pad, preamplifier, discriminator and control logic for masking and testing within a layout area of only 50 microm by 140 microm. A new two-level discriminator scheme has been implemented to cope with the problems of time-walk and interpixel cross-coupling. The measured gain of the preamplifier is 900 mV for a minimum ionizing particle (MIP, about 24,000 e - for a 300 microm thick Si-detector) with a return to baseline within 750 ns for a 1 MIP input signal. The full readout chain (without detector) shows an equivalent noise charge to 60e - r.m.s. The time-walk, a function of the separation between the two threshold levels, is measured to be 22 ns at a separation of 1,500 e - , which is adequate for the 40 MHz beam-crossing frequency at the LHC. The interpixel cross-coupling, measured with a 40fF coupling capacitance, is less than 3%. A single cell consumes 35 microW at 3.5 V supply voltage

Studies for an upgrade of ALICE Inner Tracking System: Pixel chip characterization

Directory of Open Access Journals (Sweden)

Park Jonghan

2017-01-01

Full Text Available Inner Tracking System (ITS of ALICE is used for vertex determination and tracking. Future heavy-ion program at the LHC aims to run with high luminosity. To address this challenge, upgrade program of ITS is underway, which aims at better position resolution (factor of 3, high detection efficiency (>99%, high-rate readout capabilities (100 kHz for Pb-Pb and moderate radiation hardness (> 700 krad. The new ITS will be composed with 7 layers of silicon pixel chip based on Monolithic Active Pixel Sensor (MAPS technology. The characterization test of various version of prototype chips at different phases of development has been performed. This contribution will provide the main characterization results obtained from the measurements performed at laboratories and using test beam for finalizing the pixel chip specification.

A Low Noise CMOS Readout Based on a Polymer-Coated SAW Array for Miniature Electronic Nose

Directory of Open Access Journals (Sweden)

Cheng-Chun Wu

2016-10-01

Full Text Available An electronic nose (E-Nose is one of the applications for surface acoustic wave (SAW sensors. In this paper, we present a low-noise complementary metal–oxide–semiconductor (CMOS readout application-specific integrated circuit (ASIC based on an SAW sensor array for achieving a miniature E-Nose. The center frequency of the SAW sensors was measured to be approximately 114 MHz. Because of interference between the sensors, we designed a low-noise CMOS frequency readout circuit to enable the SAW sensor to obtain frequency variation. The proposed circuit was fabricated in Taiwan Semiconductor Manufacturing Company (TSMC 0.18 μm 1P6M CMOS process technology. The total chip size was nearly 1203 × 1203 μm2. The chip was operated at a supply voltage of 1 V for a digital circuit and 1.8 V for an analog circuit. The least measurable difference between frequencies was 4 Hz. The detection limit of the system, when estimated using methanol and ethanol, was 0.1 ppm. Their linearity was in the range of 0.1 to 26,000 ppm. The power consumption levels of the analog and digital circuits were 1.742 mW and 761 μW, respectively.

A reconfigurable image tube using an external electronic image readout

Science.gov (United States)

Lapington, J. S.; Howorth, J. R.; Milnes, J. S.

2005-08-01

We have designed and built a sealed tube microchannel plate (MCP) intensifier for optical/NUV photon counting applications suitable for 18, 25 and 40 mm diameter formats. The intensifier uses an electronic image readout to provide direct conversion of event position into electronic signals, without the drawbacks associated with phosphor screens and subsequent optical detection. The Image Charge technique is used to remove the readout from the intensifier vacuum enclosure, obviating the requirement for additional electrical vacuum feedthroughs and for the readout pattern to be UHV compatible. The charge signal from an MCP intensifier is capacitively coupled via a thin dielectric vacuum window to the electronic image readout, which is external to the sealed intensifier tube. The readout pattern is a separate item held in proximity to the dielectric window and can be easily detached, making the system easily reconfigurable. Since the readout pattern detects induced charge and is external to the tube, it can be constructed as a multilayer, eliminating the requirement for narrow insulator gaps and allowing it to be constructed using standard PCB manufacturing tolerances. We describe two readout patterns, the tetra wedge anode (TWA), an optimized 4 electrode device similar to the wedge and strip anode (WSA) but with a factor 2 improvement in resolution, and an 8 channel high speed 50 ohm device, both manufactured as multilayer PCBs. We present results of the detector imaging performance, image resolution, linearity and stability, and discuss the development of an integrated readout and electronics device based on these designs.

Temporal Noise Analysis of Charge-Domain Sampling Readout Circuits for CMOS Image Sensors

Directory of Open Access Journals (Sweden)

Xiaoliang Ge

2018-02-01

Full Text Available This paper presents a temporal noise analysis of charge-domain sampling readout circuits for Complementary Metal-Oxide Semiconductor (CMOS image sensors. In order to address the trade-off between the low input-referred noise and high dynamic range, a Gm-cell-based pixel together with a charge-domain correlated-double sampling (CDS technique has been proposed to provide a way to efficiently embed a tunable conversion gain along the read-out path. Such readout topology, however, operates in a non-stationery large-signal behavior, and the statistical properties of its temporal noise are a function of time. Conventional noise analysis methods for CMOS image sensors are based on steady-state signal models, and therefore cannot be readily applied for Gm-cell-based pixels. In this paper, we develop analysis models for both thermal noise and flicker noise in Gm-cell-based pixels by employing the time-domain linear analysis approach and the non-stationary noise analysis theory, which help to quantitatively evaluate the temporal noise characteristic of Gm-cell-based pixels. Both models were numerically computed in MATLAB using design parameters of a prototype chip, and compared with both simulation and experimental results. The good agreement between the theoretical and measurement results verifies the effectiveness of the proposed noise analysis models.

The PASTA chip - A free-running readout ASIC for silicon strip sensors in PANDA

Energy Technology Data Exchange (ETDEWEB)

Goerres, Andre; Stockmanns, Tobias; Ritman, James [Institut fuer Kernphysik, Forschungszentrum Juelich, Juelich (Germany); Rivetti, Angelo [INFN Sezione di Torino, Torino (Italy); Collaboration: PANDA-Collaboration

2014-07-01

The PANDA experiment is a multi purpose detector, investigating hadron physics in the charm quark mass regime. It is one of the main experiments at the future FAIR accelerator facility, using pp annihilations from a 1.5-15 GeV/c anti-proton beam. Because of the broad physics spectrum and the similarity of event and background signals, PANDA does not rely on a hardware-level trigger decision. The innermost of PANDA's sub-systems is the Micro Vertex Detector (MVD), consisting of silicon pixel and strip sensors. The latter will be read out by a specialized, free-running readout front-end called PANDA Strip ASIC (PASTA). It has to face a high event rate of up to 40 kHz/ch in an radiation-intense environment. To fulfill the MVD's requirements, it has to give accurate timing information to incoming events (<10 ns) and determine the collected charge with an 8-bit precision. The design has to meet cooling and placing restrictions, leading to a very low power consumption (<4 mW/ch) and limited dimensions. Therefore, a simple, time-based readout approach is chosen. In this talk, the conceptual design of the front-end is presented.

Development and performance of double sided silicon strip detectors

International Nuclear Information System (INIS)

Batignani, G.; Forti, F.; Moneta, L.; Triggiani, G.; Bosisio, L.; Focardi, E.; Giorgi, M.A.; Parrini, G.; Tonelli, G.

1991-01-01

Microstrip silicon detectors with orthogonal readout on opposite sides have been designed and fabricated. The active area of each device is 25 cm 2 and the strip pitch is 25 μm on the junction side and 50 μm on the opposite ohmic side. A space resolution of 15 μm on the junction side (100 μm readout pitch) and 24 μm on the ohmic side (200 μm readout pitch) has been measured. We also report on AC-coupling chips, designed and fabricated in order to allow AC connection of the strips to the amplifiers. These chips are 6.4x5.0 mm 2 and have 100 μm pitch. Both AC-couplers and detectors have been installed as part of the ALEPH minivertex. (orig.)

Miniature silicon electronic biological assay chip and applications for rapid battlefield diagnostics

Science.gov (United States)

Cunningham, Brian T.; Regan, Robert A.; Clapp, Christopher; Hildebrant, Eric; Weinberg, Marc S.; Williams, John

1999-07-01

Assessing the medical condition of battlefield personnel requires the development of rapid, portable biological diagnostic assays for a wide variety of antigens and enzymes. Ideally, such an assay would be inexpensive, small, and require no added reagents while maintaining the sensitivity and accuracy of laboratory-based assays. In this work, a microelectromechanical (MEMS) based biological assay sensor is presented which is expected to meet the above requirements. The sensor is a thin silicon membrane resonator (SMR) which registers a decrease in resonant frequency when mass is adsorbed onto its surface. By coating the sensor surface with a monolayer of antibody, for example, we have detected the corresponding antigen with a detection resolution of 0.25 ng/ml in phosphate buffer solution. Micromachining techniques are being used to integrate many (64 elements on the first test chip) identical SMR sensors into a single silicon chip which would be capable of simultaneously performing a wide variety of biomedical assays. The sensors require only a small printed circuit board and 8V power supply to operate and provide a readout. The presentation will describe the operation of the SMR sensor, the fabrication of the sensor array, and initial test results using commercially available animal immunoglobulins in laboratory-prepared test solutions.

Further studies of the stability of LiF:Mg,Cu,P (GR-200) at maximum readout temperatures between 240oC and 280oC

International Nuclear Information System (INIS)

Oster, L.; Horowitz, Y.S.; Horowitz, A.

1996-01-01

It has recently been shown that LiF:Mg,Cu,P (GR-200) can be read out to temperatures as high as 270 o C for 12 s with negligible loss in sensitivity. In the present work the long-term sensitivity of GR-200 was studied at readout temperatures between 240 o C and 280 o C. The idea was that the readout temperatures above 240 o C might initiate reaction processes which influence the sensitivity only after long-term storage. No difference was found in the behaviour of GR-200 chips with 80 accumulated readouts to 240 o C or 270 o C and after storage of up to four months. Slight losses in sensitivity of 4% for 240 o C and 10% for 270 o C are observed after 80 readouts during four months storage. However, at a maximum readout temperature of 280 o C, a 33% loss in sensitivity after 80 cycles is observed. In conclusion it is found that GR-200 can be read out at temperatures as high as 270 o C with negligible loss in sensitivity (less than 0.1% per readout following an initialisation procedure of 1 readout) and acceptable residual signal (0.6%). (author)

Beam test performance of the APV5 chip

International Nuclear Information System (INIS)

De Fez-Laso, M.D.M.; Gill, K.; MacEvoy, B.; Millmore, M.; Potts, A.; Raymond, M.

1996-01-01

The performance of the latest prototype of the radiation hard front end chip to be used by the CMS collaboration for analogue readout of the microstrip tracker has been evaluated with a silicon microstrip detector in a beam at CERN. The circuit, developed by the RD20 collaboration, consists of 128 channels of amplifier, pipeline memory, analogue signal processor and a serial multiplexer. As a result of these studies improvements in the circuit design have been devised which will be implemented in the next version. (orig.)

Timing and Readout Contorl in the LHCb Upgraded Readout System

CERN Document Server

Alessio, Federico

2016-01-01

In 2019, the LHCb experiment at CERN will undergo a major upgrade where its detectors electronics and entire readout system will be changed to read-out events at the full LHC rate of 40 MHz. In this paper, the new timing, trigger and readout control system for such upgrade is reviewed. Particular attention is given to the distribution of the clock, timing and synchronization information across the entire readout system using generic FTTH technology like Passive Optical Networks. Moreover the system will be responsible to generically control the Front-End electronics by transmitting configuration data and receiving monitoring data, offloading the software control system from the heavy task of manipulating complex protocols of thousands of Front-End electronics devices. The way in which this was implemented is here reviewed with a description of results from first implementations of the system, including usages in test-benches, implementation of techniques for timing distribution and latency control."

[Evaluation of Image Quality of Readout Segmented EPI with Readout Partial Fourier Technique].

Science.gov (United States)

Yoshimura, Yuuki; Suzuki, Daisuke; Miyahara, Kanae

Readout segmented EPI (readout segmentation of long variable echo-trains: RESOLVE) segmented k-space in the readout direction. By using the partial Fourier method in the readout direction, the imaging time was shortened. However, the influence on image quality due to insufficient data sampling is concerned. The setting of the partial Fourier method in the readout direction in each segment was changed. Then, we examined signal-to-noise ratio (SNR), contrast-to-noise ratio (CNR), and distortion ratio for changes in image quality due to differences in data sampling. As the number of sampling segments decreased, SNR and CNR showed a low value. In addition, the distortion ratio did not change. The image quality of minimum sampling segments is greatly different from full data sampling, and caution is required when using it.

Dedicated multichannel readout ASIC coupled with single crystal diamond for dosimeter application

International Nuclear Information System (INIS)

Fabbri, A; Notaristefani, F De; Galasso, M; Cencelli, V Orsolini; Falco, M D; Marinelli, M; Tortora, L; Verona, C; Rinati, G Verona

2013-01-01

This paper reports on the tests of a low-noise, multi-channel readout integrated circuit used as a readout electronic front-end for a diamond multi-pixel dosimeter. The system is developed for dose distribution measurement in radiotherapy applications. The first 10-channel prototype chip was designed and fabricated in a 0.18 um CMOS process. Every channel includes a charge integrator with a 10 pF capacitor and a double slope A/D converter. The diamond multi-pixel detector, based on CVD synthetic single crystal diamond Schottky diodes, is made by a 3 × 3 sensor matrix. The overall device has been tested under irradiation with 6 MeV radio therapeutic photon beams at the Policlinico ''Tor Vergata'' (PTV) hospital. Measurements show a 20 fA RMS leakage current from the front-end input stage and a negligible dark current from the diamond detector, a stable temporal response and a good linear behaviour as a function of both dose and dose rate. These characteristics were common to each tested channel.

A CMOS 130nm Evaluation digitzer chip for silicon strips readout

CERN Document Server

Da Silva, W; Dhellot, M; Fougeron, D; Genat, J F; Hermel, R; Huppert, J f; Kapusta, F; Lebbolo, H; Pham, T H; Rossel, F; Savoy-navarro, A; Sefri, R; Vilalte

2007-01-01

A CMOS 130nm evaluation chip intended to read Silicon strip detectors at the ILC has been designed and successfully tested. Optimized for a detector capacitance of 10 pF, it includes four channels of charge integration, pulse shaping, a 16-deep analogue sampler triggered on input analogue sums, and parallel analogue to digital conversion. Tests results of the full chain are reported, demonstrating the behaviour and performance of the full sampling process and analogue to digital conversion. Each channel dissipates less than one milli-Watt static power.

An inverter-based capacitive trans-impedance amplifier readout with offset cancellation and temporal noise reduction for IR focal plane array

Science.gov (United States)

Chen, Hsin-Han; Hsieh, Chih-Cheng

2013-09-01

This paper presents a readout integrated circuit (ROIC) with inverter-based capacitive trans-impedance amplifier (CTIA) and pseudo-multiple sampling technique for infrared focal plane array (IRFPA). The proposed inverter-based CTIA with a coupling capacitor [1], executing auto-zeroing technique to cancel out the varied offset voltage from process variation, is used to substitute differential amplifier in conventional CTIA. The tunable detector bias is applied from a global external bias before exposure. This scheme not only retains stable detector bias voltage and signal injection efficiency, but also reduces the pixel area as well. Pseudo-multiple sampling technique [2] is adopted to reduce the temporal noise of readout circuit. The noise reduction performance is comparable to the conventional multiple sampling operation without need of longer readout time proportional to the number of samples. A CMOS image sensor chip with 55×65 pixel array has been fabricated in 0.18um CMOS technology. It achieves a 12um×12um pixel size, a frame rate of 72 fps, a power-per-pixel of 0.66uW/pixel, and a readout temporal noise of 1.06mVrms (16 times of pseudo-multiple sampling), respectively.

A High-Speed, Event-Driven, Active Pixel Sensor Readout for Photon-Counting Microchannel Plate Detectors

Science.gov (United States)

Kimble, Randy A.; Pain, Bedabrata; Norton, Timothy J.; Haas, J. Patrick; Oegerle, William R. (Technical Monitor)

2002-01-01

Silicon array readouts for microchannel plate intensifiers offer several attractive features. In this class of detector, the electron cloud output of the MCP intensifier is converted to visible light by a phosphor; that light is then fiber-optically coupled to the silicon array. In photon-counting mode, the resulting light splashes on the silicon array are recognized and centroided to fractional pixel accuracy by off-chip electronics. This process can result in very high (MCP-limited) spatial resolution while operating at a modest MCP gain (desirable for dynamic range and long term stability). The principal limitation of intensified CCD systems of this type is their severely limited local dynamic range, as accurate photon counting is achieved only if there are not overlapping event splashes within the frame time of the device. This problem can be ameliorated somewhat by processing events only in pre-selected windows of interest of by using an addressable charge injection device (CID) for the readout array. We are currently pursuing the development of an intriguing alternative readout concept based on using an event-driven CMOS Active Pixel Sensor. APS technology permits the incorporation of discriminator circuitry within each pixel. When coupled with suitable CMOS logic outside the array area, the discriminator circuitry can be used to trigger the readout of small sub-array windows only when and where an event splash has been detected, completely eliminating the local dynamic range problem, while achieving a high global count rate capability and maintaining high spatial resolution. We elaborate on this concept and present our progress toward implementing an event-driven APS readout.

Laser Power Measurement Using Commercial MEMS Pressure Sensor along with PSoC Embedded Read-out

Directory of Open Access Journals (Sweden)

J. Jayapandian

2011-06-01

Full Text Available Solid-state, gas, semiconductor and other types of lasers are extensively employed in industry for producing laser beams used in such wide ranging fields as machining, medicine and communications. In such applications, it is necessary to be able to accurately measure the power of the laser beam that is emitted by the laser. This paper describes a novel design technique which uses the diaphragm of a commercial MEMS pressure sensor as a target surface on which laser beam impinge, transfer heat and causes change in piezo resistance. The measured change in resistance was proportional to the intensity of laser beam in the range of 0 to 300 mW. The ratio metric embedded read-out design using a single chip programmable system on chip (PSoC has been used to acquire the resistance.

Developing an optimum protocol for thermoluminescence dosimetry with gr-200 chips using Taguchi method

International Nuclear Information System (INIS)

Sadeghi, Maryam; Faghihi, Reza; Sina, Sedigheh

2017-01-01

Thermoluminescence dosimetry (TLD) is a powerful technique with wide applications in personal, environmental and clinical dosimetry. The optimum annealing, storage and reading protocols are very effective in accuracy of TLD response. The purpose of this study is to obtain an optimum protocol for GR-200; LiF: Mg, Cu, P, by optimizing the effective parameters, to increase the reliability of the TLD response using Taguchi method. Taguchi method has been used in this study for optimization of annealing, storage and reading protocols of the TLDs. A number of 108 GR-200 chips were divided into 27 groups, each containing four chips. The TLDs were exposed to three different doses, and stored, annealed and read out by different procedures as suggested by Taguchi Method. By comparing the signal-to-noise ratios the optimum dosimetry procedure was obtained. According to the results, the optimum values for annealing temperature (de.C), Annealing Time (s), Annealing to Exposure time (d), Exposure to Readout time (d), Pre-heat Temperature (de.C), Pre-heat Time (s), Heating Rate (de.C/s), Maximum Temperature of Readout (de.C), readout time (s) and Storage Temperature (de.C) are 240, 90, 1, 2, 50, 0, 15, 240, 13 and -20, respectively. Using the optimum protocol, an efficient glow curve with low residual signals can be achieved. Using optimum protocol obtained by Taguchi method, the dosimetry can be effectively performed with great accuracy. (authors)

A two-dimensional detector with delay line readout for slow neutron fields measurements

International Nuclear Information System (INIS)

Cheremukhina, G.A.; Chernenko, S.P.; Ivanov, A.B.

1992-01-01

This article presents the description of a two-dimensional detector of slow neutrons together with its readout and data acquisition electronics based on a PC/AT> The detector with a sensitive area of 260x140 mm 2 is based on a high pressure multiwire proportional chamber with delay line readout and gas filling of 3.0 atm. 3 He + propane. 25 refs.; 10 figs.; 2 tabs

A radiation tolerance study of the ALICE TPC Readout Control Unit 2

CERN Document Server

Zhao, Chengxin; Balk, Helge; Alme, Johan

2017-11-17

ALICE is a general-purpose detector that is designed to study the physics of quark-gluon plasma. The Time Projection Chamber (TPC) is one of the major detectors of ALICE. The TPC electronics consists of 4356 Front-end cards (FECs), which are controlled by 216 Readout Control Units (RCU). Each RCU connects to between 18 and 25 FECs using a multi-drop bus. In LHC Run1, the Readout Control Unit 1 (RCU1) performed even better than specification. However, in Run2 the energy of colliding beams is increased from 8 TeV to 14 TeV (maximum value) and higher luminosity, which leads to larger event size and higher radiation load on the electronics. As a solution, the Readout Control Unit 2 (RCU2) is designed to provide faster readout speed and improved radiation tolerance with respect to the RCU1. The RCU2 is conceptually similar to the RCU1 and it reuses the existing infrastructure and readout architecture of the TPC electronics. However, the multi-drop bus is split into four branches from the two branches and the bandw...

GOSSIP: A vertex detector combining a thin gas layer as signal generator with a CMOS readout pixel array

Energy Technology Data Exchange (ETDEWEB)

Campbell, M. [CERN/MediPix Consortium, Geneva (Switzerland); Heijne, E.H.M. [CERN/MediPix Consortium, Geneva (Switzerland); Llopart, X. [CERN/MediPix Consortium, Geneva (Switzerland); Colas, P. [DAPNIA, CEA Saclay, 91191 Gif sur Yvette Cedex (France); Giganon, A. [DAPNIA, CEA Saclay, 91191 Gif sur Yvette Cedex (France); Giomataris, Y. [DAPNIA, CEA Saclay, 91191 Gif sur Yvette Cedex (France); Chefdeville, M. [NIKHEF, Amsterdam (Netherlands); Colijn, A.P. [NIKHEF, Amsterdam (Netherlands); Fornaini, A. [NIKHEF, Amsterdam (Netherlands); Graaf, H. van der [NIKHEF, Amsterdam (Netherlands)]. E-mail: vdgraaf@nikhef.nl; Kluit, P. [NIKHEF, Amsterdam (Netherlands); Timmermans, J. [NIKHEF, Amsterdam (Netherlands); Visschers, J.L. [NIKHEF, Amsterdam (Netherlands); Schmitz, J. [University of Twente/MESA (Netherlands)

2006-05-01

A small TPC has been read out by means of a Medipix2 chip as direct anode. A Micromegas foil was placed 50{mu}m above the chip, and electron multiplication occurred in the gap. With a He/isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. With this new readout technology for gas-filled detectors we recorded many image frames containing 2D images with tracks from cosmic muons. Along these tracks, electron clusters were observed, as well as {delta}-rays. With a gas layer thickness of only 1mm, the device could be applied as vertex detector, outperforming all Si-based detectors.

GOSSIP: A vertex detector combining a thin gas layer as signal generator with a CMOS readout pixel array

International Nuclear Information System (INIS)

Campbell, M.; Heijne, E.H.M.; Llopart, X.; Colas, P.; Giganon, A.; Giomataris, Y.; Chefdeville, M.; Colijn, A.P.; Fornaini, A.; Graaf, H. van der; Kluit, P.; Timmermans, J.; Visschers, J.L.; Schmitz, J.

2006-01-01

A small TPC has been read out by means of a Medipix2 chip as direct anode. A Micromegas foil was placed 50μm above the chip, and electron multiplication occurred in the gap. With a He/isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. With this new readout technology for gas-filled detectors we recorded many image frames containing 2D images with tracks from cosmic muons. Along these tracks, electron clusters were observed, as well as δ-rays. With a gas layer thickness of only 1mm, the device could be applied as vertex detector, outperforming all Si-based detectors

GOSSIP: A vertex detector combining a thin gas layer as signal generator with a CMOS readout pixel array

Science.gov (United States)

Campbell, M.; Heijne, E. H. M.; Llopart, X.; Colas, P.; Giganon, A.; Giomataris, Y.; Chefdeville, M.; Colijn, A. P.; Fornaini, A.; van der Graaf, H.; Kluit, P.; Timmermans, J.; Visschers, J. L.; Schmitz, J.

2006-05-01

A small TPC has been read out by means of a Medipix2 chip as direct anode. A Micromegas foil was placed 50 μm above the chip, and electron multiplication occurred in the gap. With a He/isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. With this new readout technology for gas-filled detectors we recorded many image frames containing 2D images with tracks from cosmic muons. Along these tracks, electron clusters were observed, as well as δ-rays. With a gas layer thickness of only 1 mm, the device could be applied as vertex detector, outperforming all Si-based detectors.

A CMOS micromachined capacitive tactile sensor with integrated readout circuits and compensation of process variations.

Science.gov (United States)

Tsai, Tsung-Heng; Tsai, Hao-Cheng; Wu, Tien-Keng

2014-10-01

This paper presents a capacitive tactile sensor fabricated in a standard CMOS process. Both of the sensor and readout circuits are integrated on a single chip by a TSMC 0.35 μm CMOS MEMS technology. In order to improve the sensitivity, a T-shaped protrusion is proposed and implemented. This sensor comprises the metal layer and the dielectric layer without extra thin film deposition, and can be completed with few post-processing steps. By a nano-indenter, the measured spring constant of the T-shaped structure is 2.19 kNewton/m. Fully differential correlated double sampling capacitor-to-voltage converter (CDS-CVC) and reference capacitor correction are utilized to compensate process variations and improve the accuracy of the readout circuits. The measured displacement-to-voltage transductance is 7.15 mV/nm, and the sensitivity is 3.26 mV/μNewton. The overall power dissipation is 132.8 μW.

A low-power CMOS readout IC design for bolometer applications

Science.gov (United States)

Galioglu, Arman; Abbasi, Shahbaz; Shafique, Atia; Ceylan, Ömer; Yazici, Melik; Kaynak, Mehmet; Durmaz, Emre C.; Arsoy, Elif Gul; Gurbuz, Yasar

2017-02-01

A prototype of a readout IC (ROIC) designed for use in high temperature coefficient of resistance (TCR) SiGe microbolometers is presented. The prototype ROIC architecture implemented is based on a bridge with active and blind bolometer pixels with a capacitive transimpedance amplifier (CTIA) input stage and column parallel integration with serial readout. The ROIC is designed for use in high (>= 4 %/K) TCR and high detector resistance Si/SiGe microbolometers with 17x17 μm2 pixel sizes in development. The prototype has been designed and fabricated in 0.25- μm SiGe:C BiCMOS process.

CBC2: A CMS microstrip readout ASIC with logic for track-trigger modules at HL-LHC

Energy Technology Data Exchange (ETDEWEB)

Hall, G., E-mail: g.hall@imperial.ac.uk [Blackett Laboratory, Imperial College, London SW7 2AZ (United Kingdom); Pesaresi, M.; Raymond, M. [Blackett Laboratory, Imperial College, London SW7 2AZ (United Kingdom); Braga, D.; Jones, L.; Murray, P.; Prydderch, M. [Rutherford Appleton Laboratory, Chilton, Didcot, Oxon OX11 OQX (United Kingdom); Abbaneo, D.; Blanchot, G.; Honma, A.; Kovacs, M.; Vasey, F. [CERN, CH-1211, Geneva (Switzerland)

2014-11-21

The CBC2 is the latest version of the CMS Binary Chip ASIC for readout of the upgraded CMS Tracker at the High Luminosity LHC. It is designed in 130 nm CMOS with 254 input channels and will be bump-bonded to a substrate to which sensors will be wire-bonded. The CBC2 is designed to instrument double layer modules, consisting of two overlaid silicon microstrip sensors with aligned microstrips, in the outer tracker. It incorporates logic to identify L1 trigger primitives in the form of “stubs”: high transverse-momentum track candidates which are identified within the low momentum background by selecting correlated hits between two closely separated microstrip sensors. The first prototype modules have been assembled. The performance of the chip in recent laboratory tests is briefly reported and the status of module construction described.

A 32-channel, 025 mum CMOS ASIC for the readout of the silicon drift detectors of the ALICE experiment

CERN Document Server

Mazza, G; Anghinolfi, F; Martínez, M I; Rivetti, A; Rotondo, F

2004-01-01

In this paper we present a 32 channel ASIC prototype for the readout of the silicon drift detectors (SDDs) of the ALICE experiment. The ASIC integrates on the same substrate 32 transimpedance amplifiers, a 32 x 256 cell analogue memory and 16 successive approximation 10 bit A/D converters. The circuit amplifies and samples at 40 MS/s the input signal in a continuous way. When an external trigger signal validates the acquisition, the sampling is stopped and the data are digitized at lower speed (0.5 MS/s). The chip has been designed and fabricated in a commercial 0.25 mum CMOS technology. It has been extensively tested both on a bench and connected with a detector in several beam tests. In this paper both design issues and test results are presented. The radiation tolerance of the design has been increased by special layout techniques. Total dose irradiation tests are also presented.

A study of SEU-tolerant latches for the RD53A chip

CERN Document Server

Fougeron, Denis

2018-01-01

The RD53 collaboration was established to develop the next generation of pixel readout chips needed by ATLAS and CMS at the HL-LHC and requiring extreme rate and radiation tolerance. The 65 nm CMOS process has been adopted in order to satisfy the high level of integration requirement. However, the SEU immunity should be carefully considered for a deep submicron process like the 65 nm. Indeed, the device dimensions are small and the capacitance of the storage nodes becomes very low. A chip prototype including different SEU tolerant structures was designed in a 65 nm technology. Several proton irradiation tests were carried out in order to estimate the SEU tolerance of the proposed structures and the level of improvement comparing with a standard architecture.

Design and Verification of Digital Architecture of 65K Pixel Readout Chip for High-Energy Physics

CERN Document Server

Poikela, Tuomas; Paakkulainen, J

2010-01-01

The feasibility to design and implement a front-end ASIC for the upgrade of the VELO detector of LHCb experiment at CERN using IBM’s 130nm standard CMOS process and a standard cell library is studied in this thesis. The proposed architecture is a design to cope with high data rates and continuous data taking. The architecture is designed to operate without any external trigger to record every hit signal the ASIC receives from a sensor chip, and then to transmit the information to the next level of electronics, for example to FPGAs. This thesis focuses on design, implementation and functional verification of the digital electronics of the active pixel area. The area requirements are dictated by the geometry of pixels (55$mu$m x 55$mu$m), power requirements (20W/module) by restricted cooling capabilities of the module consisting of 10 chips and output bandwidth requirements by data rate (< 10 Gbit/s) produced by a particle flux passing through the chip. The design work was carried out using transaction...

Tests of UFXC32k chip with CdTe pixel detector

Science.gov (United States)

Maj, P.; Taguchi, T.; Nakaye, Y.

2018-02-01

The paper presents the performance of the UFXC32K—a hybrid pixel detector readout chip working with CdTe detectors. The UFXC32K has a pixel pitch of 75 μm and can cope with both input signal polarities. This functionality allows operating with widely used silicon sensors collecting holes and CdTe sensors collecting electrons. This article describes the chip focusing on solving the issues connected to high-Z sensor material, namely high leakage currents, slow charge collection time and thick material resulting in increased charge-sharring effects. The measurements were conducted with higher X-ray energies including 17.4 keV from molybdenum. Conclusions drawn inside the paper show the UFXC32K's usability for CdTe sensors in high X-ray energy applications.

Developing an Optimum Protocol for Thermoluminescence Dosimetry with GR-200 Chips using Taguchi Method.

Science.gov (United States)

Sadeghi, Maryam; Faghihi, Reza; Sina, Sedigheh

2017-06-15

Thermoluminescence dosimetry (TLD) is a powerful technique with wide applications in personal, environmental and clinical dosimetry. The optimum annealing, storage and reading protocols are very effective in accuracy of TLD response. The purpose of this study is to obtain an optimum protocol for GR-200; LiF: Mg, Cu, P, by optimizing the effective parameters, to increase the reliability of the TLD response using Taguchi method. Taguchi method has been used in this study for optimization of annealing, storage and reading protocols of the TLDs. A number of 108 GR-200 chips were divided into 27 groups, each containing four chips. The TLDs were exposed to three different doses, and stored, annealed and read out by different procedures as suggested by Taguchi Method. By comparing the signal-to-noise ratios the optimum dosimetry procedure was obtained. According to the results, the optimum values for annealing temperature (°C), Annealing Time (s), Annealing to Exposure time (d), Exposure to Readout time (d), Pre-heat Temperature (°C), Pre-heat Time (s), Heating Rate (°C/s), Maximum Temperature of Readout (°C), readout time (s) and Storage Temperature (°C) are 240, 90, 1, 2, 50, 0, 15, 240, 13 and -20, respectively. Using the optimum protocol, an efficient glow curve with low residual signals can be achieved. Using optimum protocol obtained by Taguchi method, the dosimetry can be effectively performed with great accuracy. © The Author 2016. Published by Oxford University Press. All rights reserved. For Permissions, please email: journals.permissions@oup.com.

Development of a versatile readout and test system and characterization of a capacitively coupled active pixel sensor

Energy Technology Data Exchange (ETDEWEB)

Janssen, Jens; Gonella, Laura; Hemperek, Tomasz; Hirono, Toko; Huegging, Fabian; Krueger, Hans; Wermes, Norbert [Institute of Physics, University of Bonn, Bonn (Germany); Peric, Ivan [Karlsruher Institut fuer Technologie, Karlsruhe (Germany); Collaboration: ATLAS-Collaboration

2015-07-01

With the availability of high voltage and high resistivity CMOS processes, active pixel sensors are becoming increasingly interesting for radiation detection in high energy physics experiments. Although the pixel signal-to-noise ratio and the sensor radiation tolerance were improved, active pixel sensors cannot yet compete with state-of-the-art hybrid pixel detector in a high radiation environment. Hence, active pixel sensors are possible candidates for the outer tracking detector in HEP experiments where production cost plays a role. The investigation of numerous prototyping steps and different technologies is still ongoing and requires a versatile test and readout system, which will be presented in this talk. A capacitively coupled active pixel sensor fabricated in AMS 180 nm high voltage CMOS process is investigated. The sensor is designed to be glued to existing front-end pixel readout chips. Results from the characterization are presented in this talk.

Wideband pulse amplifiers for the NECTAr chip

International Nuclear Information System (INIS)

Sanuy, A.; Delagnes, E.; Gascon, D.; Sieiro, X.; Bolmont, J.; Corona, P.; Feinstein, F.; Glicenstein, J-F.; Naumann, C.L.; Nayman, P.; Ribó, M.

2012-01-01

The NECTAr collaboration's FE option for the camera of the CTA is a 16 bits and 1–3 GS/s sampling chip based on analog memories including most of the readout functions. This works describes the input amplifiers of the NECTAr ASIC. A fully differential wideband amplifier, with voltage gain up to 20 V/V and a BW of 400 MHz. As it is impossible to design a fully differential OpAmp with an 8 GHz GBW product in a 0.35 CMOS technology, an alternative implementation based on HF linearized transconductors is explored. The output buffer is a class AB miller operational amplifier, with special non-linear current boost.

Wideband pulse amplifiers for the NECTAr chip

Science.gov (United States)

Sanuy, A.; Delagnes, E.; Gascon, D.; Sieiro, X.; Bolmont, J.; Corona, P.; Feinstein, F.; Glicenstein, J.-F.; Naumann, C. L.; Nayman, P.; Ribó, M.; Tavernet, J.-P.; Toussenel, F.; Vincent, P.; Vorobiov, S.

2012-12-01

The NECTAr collaboration's FE option for the camera of the CTA is a 16 bits and 1-3 GS/s sampling chip based on analog memories including most of the readout functions. This works describes the input amplifiers of the NECTAr ASIC. A fully differential wideband amplifier, with voltage gain up to 20 V/V and a BW of 400 MHz. As it is impossible to design a fully differential OpAmp with an 8 GHz GBW product in a 0.35 CMOS technology, an alternative implementation based on HF linearized transconductors is explored. The output buffer is a class AB miller operational amplifier, with special non-linear current boost.

Depleted fully monolithic CMOS pixel detectors using a column based readout architecture for the ATLAS Inner Tracker upgrade

Science.gov (United States)

Wang, T.; Barbero, M.; Berdalovic, I.; Bespin, C.; Bhat, S.; Breugnon, P.; Caicedo, I.; Cardella, R.; Chen, Z.; Degerli, Y.; Egidos, N.; Godiot, S.; Guilloux, F.; Hemperek, T.; Hirono, T.; Krüger, H.; Kugathasan, T.; Hügging, F.; Marin Tobon, C. A.; Moustakas, K.; Pangaud, P.; Schwemling, P.; Pernegger, H.; Pohl, D.-L.; Rozanov, A.; Rymaszewski, P.; Snoeys, W.; Wermes, N.

2018-03-01

Depleted monolithic active pixel sensors (DMAPS), which exploit high voltage and/or high resistivity add-ons of modern CMOS technologies to achieve substantial depletion in the sensing volume, have proven to have high radiation tolerance towards the requirements of ATLAS in the high-luminosity LHC era. DMAPS integrating fast readout architectures are currently being developed as promising candidates for the outer pixel layers of the future ATLAS Inner Tracker, which will be installed during the phase II upgrade of ATLAS around year 2025. In this work, two DMAPS prototype designs, named LF-Monopix and TJ-Monopix, are presented. LF-Monopix was fabricated in the LFoundry 150 nm CMOS technology, and TJ-Monopix has been designed in the TowerJazz 180 nm CMOS technology. Both chips employ the same readout architecture, i.e. the column drain architecture, whereas different sensor implementation concepts are pursued. The paper makes a joint description of the two prototypes, so that their technical differences and challenges can be addressed in direct comparison. First measurement results for LF-Monopix will also be shown, demonstrating for the first time a fully functional fast readout DMAPS prototype implemented in the LFoundry technology.

Multi-path interferometric Josephson directional amplifier for qubit readout

Science.gov (United States)

Abdo, Baleegh; Bronn, Nicholas T.; Jinka, Oblesh; Olivadese, Salvatore; Brink, Markus; Chow, Jerry M.

2018-04-01

We realize and characterize a quantum-limited, directional Josephson amplifier suitable for qubit readout. The device consists of two nondegenerate, three-wave-mixing amplifiers that are coupled together in an interferometric scheme, embedded in a printed circuit board. Nonreciprocity is generated by applying a phase gradient between the same-frequency pumps feeding the device, which plays the role of the magnetic field in a Faraday medium. Directional amplification and reflection-gain elimination are induced via wave interference between multiple paths in the system. We measure and discuss the main figures of merit of the device and show that the experimental results are in good agreement with theory. An improved version of this directional amplifier is expected to eliminate the need for bulky, off-chip isolation stages that generally separate quantum systems and preamplifiers in high-fidelity, quantum-nondemolition measurement setups.

BiCMOS amplifier-discriminator integrated circuit for gas-filled detector readout

International Nuclear Information System (INIS)

Herve, C.; Dzahini, D.; Le Caer, T.; Richer, J.-P.; Torki, K.

2005-01-01

The paper presents a 16-channel amplifier-discriminator designed in BiCMOS technology. It will be used for the binary parallel readout of gas-filled detectors being designed at the European Synchrotron Radiation Facility. The circuit (named AMS211) has been manufactured. The measured transimpedance gain (400 KΩ), bandwidth (25 MHz) and noise (1570 e - +95 e - /pF ENC) well match the simulated results. The discriminator thresholds are individually controlled by built-in Digital to Analogue Converter. The experience gained with a first prototype of readout electronics indicates that the AMS211 should meet our requirements

BiCMOS amplifier-discriminator integrated circuit for gas-filled detector readout

Energy Technology Data Exchange (ETDEWEB)

Herve, C. [European Synchrotron Radiation Facility, BP 220, 38043 Grenoble Cedex (France)]. E-mail: herve@esrf.fr; Dzahini, D. [Laboratoire de Physique Subatomique et de Cosmologie, Grenoble (France); Le Caer, T. [European Synchrotron Radiation Facility, BP 220, 38043 Grenoble Cedex (France); Richer, J.-P. [Laboratoire de Physique Subatomique et de Cosmologie, Grenoble (France); Torki, K. [Laboratoire TIMA, Grenoble (France)

2005-03-21

The paper presents a 16-channel amplifier-discriminator designed in BiCMOS technology. It will be used for the binary parallel readout of gas-filled detectors being designed at the European Synchrotron Radiation Facility. The circuit (named AMS211) has been manufactured. The measured transimpedance gain (400 K{omega}), bandwidth (25 MHz) and noise (1570 e{sup -}+95 e{sup -}/pF ENC) well match the simulated results. The discriminator thresholds are individually controlled by built-in Digital to Analogue Converter. The experience gained with a first prototype of readout electronics indicates that the AMS211 should meet our requirements.

The IBL Readout System

CERN Document Server

Dopke, J; The ATLAS collaboration; Flick, T; Gabrielli, A; Kugel, A; Maettig, P; Morettini, P; Polini, A; Schroer, N

2010-01-01

The first upgrade for the ATLAS pixel detector will be an additional layer, which is called IBL (Insertable B-Layer). To readout this new layer having new electronics assembled an update of the readout electronics is necessary. The aim is to develop a system which is capable to read out at a higher bandwidth and also compatible with the existing system to be integrated into it. The talk will describe the necessary development to reach a new readout system, concentrating on the requirements of a newly designed Back of Crate card as the optical interface in the counting room.

The IBL Readout System

CERN Document Server

Dopke, J; Flick, T; Gabrielli, A; Kugel, A; Maettig, P; Morettini, P; Polini, A; Schroer, N

2011-01-01

The first upgrade for the ATLAS Pixel Detector will be an additional layer, which is called IBL (Insertable B-Layer). To readout this new layer, having new electronics, an update of the readout electronics is necessary. The aim is to develop a system which is capable to read out at a higher bandwidth, but also compatible with the existing system to be integrated into it. This paper will describe the necessary development to reach a new readout system, concentrating on the requirements of a newly designed Back of Crate card as the optical interface in the counting room.

Experiment list: SRX112178 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available line=OS25 ES cells || chip antibody=8WG16 (MMS-126R, Covance) || chip antibody manufacturer=Covance || chromatin=Fixed || beads...=Magnetic beads http://dbarchive.biosciencedbc.jp/kyushu-u/mm

On-chip integration of a superconducting microwave circulator and a Josephson parametric amplifier

Science.gov (United States)

Rosenthal, Eric I.; Chapman, Benjamin J.; Moores, Bradley A.; Kerckhoff, Joseph; Malnou, Maxime; Palken, D. A.; Mates, J. A. B.; Hilton, G. C.; Vale, L. R.; Ullom, J. N.; Lehnert, K. W.

Recent progress in microwave amplification based on parametric processes in superconducting circuits has revolutionized the measurement of feeble microwave signals. These devices, which operate near the quantum limit, are routinely used in ultralow temperature cryostats to: readout superconducting qubits, search for axionic dark matter, and characterize astrophysical sensors. However, these amplifiers often require ferrite circulators to separate incoming and outgoing traveling waves. For this reason, measurement efficiency and scalability are limited. In order to facilitate the routing of quantum signals we have created a superconducting, on-chip microwave circulator without permanent magnets. We integrate our circulator on-chip with a Josephson parametric amplifier for the purpose of near quantum-limited directional amplification. In this talk I will present a design overview and preliminary measurements.

Experiment list: SRX112184 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available line=OS25 ES cells || chip antibody=CTD4H8 (MMS-128P, Covance) || chip antibody manufacturer=Covance || chromatin=Fixed || beads...=Sepharose beads http://dbarchive.biosciencedbc.jp/kyushu-u/m

LHCb: Fast Readout Control for the upgraded readout architecture of the LHCb experiment at CERN

CERN Multimedia

Alessio, F

2013-01-01

The LHCb experiment at CERN has proposed an upgrade towards a full 40 MHz readout system in order to run between five and ten times its initial design luminosity with an upgraded LHCb detector. As a consequence, the various LHCb sub-systems in the readout architecture will be upgraded to cope with higher sub-detector occupancies, higher rate, and higher readout load. The new architecture, new functionalities, and the first hardware implementation of a new LHCb Readout Control system (commonly referred to as S-TFC) for the upgraded LHCb experiment is here presented. Our attention is focused in describing solutions for the distribution of clock and timing information to control the entire upgraded readout architecture by profiting of a bidirectional optical network and powerful FPGAs, including a real-time mechanism to synchronize the entire system. Solutions and implementations are presented, together with first results on the simulation and the validation of the system.

Development of a small-scale protope of the GOSSIPO-2 chip in 0.13 um CMOS technology

CERN Document Server

Kluit, R; Gromov, V

2007-01-01

The GOSSIP (Gas On Slimmed Silicon Pixel) detector is a proposed alternative for silicon based pixel detectors. The Gossip Prototype (GOSSIPO) chip is being developed to serve as a prototype read-out chip for such a gas-filled detector. Thanks to the very low capacitance at the preamplifier input, the front-end of the chip demonstrates low-noise performance in combination with a fast peaking time and low analog power dissipation. Measurement of the drift time of every primary electron in the gas volume enables 3D reconstruction of the particle tracks. For this purpose a Time-to- Digital converter must be placed in each pixel. A small-scale prototype of the GOSSIP chip has been developed in the 0.13 μm CMOS technology. The prototype includes a 16 by 16 pixel array where each pixel is equipped with a front-end circuit, threshold DAC, and a 4-bit TDC. The chip is available for testing in May 2007 and after initial tests it will be postprocessed to build a prototype detector. This paper describes the detector de...

Microfluidics on liquid handling stations (μF-on-LHS): an industry compatible chip interface between microfluidics and automated liquid handling stations.

Science.gov (United States)

Waldbaur, Ansgar; Kittelmann, Jörg; Radtke, Carsten P; Hubbuch, Jürgen; Rapp, Bastian E

2013-06-21

We describe a generic microfluidic interface design that allows the connection of microfluidic chips to established industrial liquid handling stations (LHS). A molding tool has been designed that allows fabrication of low-cost disposable polydimethylsiloxane (PDMS) chips with interfaces that provide convenient and reversible connection of the microfluidic chip to industrial LHS. The concept allows complete freedom of design for the microfluidic chip itself. In this setup all peripheral fluidic components (such as valves and pumps) usually required for microfluidic experiments are provided by the LHS. Experiments (including readout) can be carried out fully automated using the hardware and software provided by LHS manufacturer. Our approach uses a chip interface that is compatible with widely used and industrially established LHS which is a significant advancement towards near-industrial experimental design in microfluidics and will greatly facilitate the acceptance and translation of microfluidics technology in industry.

Readout ASIC for ILC-FPCCD vertex detector

International Nuclear Information System (INIS)

Takubo, Yosuke; Miyamoto, Akiya; Ikeda, Hirokazu; Yamamoto, Hitoshi; Itagaki, Kennosuke; Nagamine, Tadashi; Sugimoto, Yasuhiro

2010-01-01

The concept of FPCCD (Fine Pixel CCD) whose pixel size is 5x5μm 2 has been proposed as vertex detector at ILC. Since FPCCD has 128 x20,000 pixels in one readout channel, its readout poses a considerable challenge. We have developed a prototype of readout ASIC to readout the large number of pixels during the inter-train gap of the ILC beam. In this paper, we report the design and performance of the readout ASIC.

Experiment list: SRX112179 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available =OS25 ES cells || chip antibody=H5 (MMS-129R, Covance) || chip antibody manufacturer=Covance || chromatin=Fixed || beads=Magnetic bea...ds http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/eachDa

A volumetric meter chip for point-of-care quantitative detection of bovine catalase for food safety control

International Nuclear Information System (INIS)

Cui, Xingye; Hu, Jie; Choi, Jane Ru; Huang, Yalin; Wang, Xuemin; Lu, Tian Jian; Xu, Feng

2016-01-01

A volumetric meter chip was developed for quantitative point-of-care (POC) analysis of bovine catalase, a bioindicator of bovine mastitis, in milk samples. The meter chip displays multiplexed quantitative results by presenting the distance of ink bar advancement that is detectable by the naked eye. The meter chip comprises a poly(methyl methacrylate) (PMMA) layer, a double-sided adhesive (DSA) layer and a glass slide layer fabricated by the laser-etching method, which is typically simple, rapid (∼3 min per chip), and cost effective (∼$0.2 per chip). Specially designed “U shape” reaction cells are covered by an adhesive tape that serves as an on-off switch, enabling the simple operation of the assay. As a proof of concept, we employed the developed meter chip for the quantification of bovine catalase in raw milk samples to detect catalase concentrations as low as 20 μg/mL. The meter chip has great potential to detect various target analytes for a wide range of POC applications. - Highlights: • The meter chip is a standalone point-of-care diagnostic tool with visible readouts of quantification results. • A fast and low cost fabrication protocol (~3 min and ~$0.2 per chip) of meter chip was proposed. • The chip may hold the potential for rapid scaning of bovine mastitis in cattle farms for food safety control.

A volumetric meter chip for point-of-care quantitative detection of bovine catalase for food safety control

Energy Technology Data Exchange (ETDEWEB)

Cui, Xingye; Hu, Jie; Choi, Jane Ru; Huang, Yalin; Wang, Xuemin [The Key Laboratory of Biomedical Information Engineering of Ministry of Education, School of Life Science and Technology, Xi' an Jiaotong University, Xi' an, 710049 (China); Bioinspired Engineering and Biomechanics Center (BEBC), Xi' an Jiaotong University, Xi' an, 710049 (China); Lu, Tian Jian, E-mail: tjlu@mail.xjtu.edu.cn [Bioinspired Engineering and Biomechanics Center (BEBC), Xi' an Jiaotong University, Xi' an, 710049 (China); Xu, Feng, E-mail: fengxu@mail.xjtu.edu.cn [The Key Laboratory of Biomedical Information Engineering of Ministry of Education, School of Life Science and Technology, Xi' an Jiaotong University, Xi' an, 710049 (China); Bioinspired Engineering and Biomechanics Center (BEBC), Xi' an Jiaotong University, Xi' an, 710049 (China)

2016-09-07

A volumetric meter chip was developed for quantitative point-of-care (POC) analysis of bovine catalase, a bioindicator of bovine mastitis, in milk samples. The meter chip displays multiplexed quantitative results by presenting the distance of ink bar advancement that is detectable by the naked eye. The meter chip comprises a poly(methyl methacrylate) (PMMA) layer, a double-sided adhesive (DSA) layer and a glass slide layer fabricated by the laser-etching method, which is typically simple, rapid (∼3 min per chip), and cost effective (∼$0.2 per chip). Specially designed “U shape” reaction cells are covered by an adhesive tape that serves as an on-off switch, enabling the simple operation of the assay. As a proof of concept, we employed the developed meter chip for the quantification of bovine catalase in raw milk samples to detect catalase concentrations as low as 20 μg/mL. The meter chip has great potential to detect various target analytes for a wide range of POC applications. - Highlights: • The meter chip is a standalone point-of-care diagnostic tool with visible readouts of quantification results. • A fast and low cost fabrication protocol (~3 min and ~$0.2 per chip) of meter chip was proposed. • The chip may hold the potential for rapid scaning of bovine mastitis in cattle farms for food safety control.

Manufacture of a Polyaniline Nanofiber Ammonia Sensor Integrated with a Readout Circuit Using the CMOS-MEMS Technique

Directory of Open Access Journals (Sweden)

Chyan-Chyi Wu

2009-02-01

Full Text Available This study presents the fabrication of a polyaniline nanofiber ammonia sensor integrated with a readout circuit on a chip using the commercial 0.35 mm complementary metal oxide semiconductor (CMOS process and a post-process. The micro ammonia sensor consists of a sensing resistor and an ammonia sensing film. Polyaniline prepared by a chemical polymerization method was adopted as the ammonia sensing film. The fabrication of the ammonia sensor needs a post-process to etch the sacrificial layers and to expose the sensing resistor, and then the ammonia sensing film is coated on the sensing resistor. The ammonia sensor, which is of resistive type, changes its resistance when the sensing film adsorbs or desorbs ammonia gas. A readout circuit is employed to convert the resistance of the ammonia sensor into the voltage output. Experimental results show that the sensitivity of the ammonia sensor is about 0.88 mV/ppm at room temperature

Design of fundamental building blocks for fast binary readout CMOS sensors used in high-energy physics experiments

Energy Technology Data Exchange (ETDEWEB)

Degerli, Yavuz [CEA Saclay, IRFU/SEDI, 91191 Gif-sur-Yvette Cedex (France)], E-mail: degerli@cea.fr

2009-04-21

In this paper, design details of key building blocks for fast binary readout CMOS monolithic active pixel sensors developed for charged particle detection are presented. Firstly, an all-NMOS pixel architecture with in-pixel amplification and reset noise suppression which allows fast readout is presented. This pixel achieves high charge-to-voltage conversion factors (CVF) using a few number of transistors inside the pixel. It uses a pre-amplifying stage close to the detector and a simple double sampling (DS) circuitry to store the reset level of the detector. The DS removes the offset mismatches of amplifiers and the reset noise of the detector. Offset mismatches of the source follower are also corrected by a second column-level DS stage. The second important building block of these sensors, a low-power auto-zeroed column-level discriminator, is also presented. These two blocks transform the charge of the impinging particle into binary data. Finally, some experimental results obtained on CMOS chips designed using these blocks are presented.

Four-channel readout ASIC for silicon pad detectors

International Nuclear Information System (INIS)

Baturitsky, M.A.; Zamiatin, N.I.

2000-01-01

A custom front-end readout ASIC has been designed for silicon calorimeters supposed to be used in high-energy physics experiments. The ASIC was produced using BJT-JFET technology. It contains four channels of a fast low-noise charge-sensitive preamplifier (CSP) with inverting outputs summed by a linear adder (LA) followed by an RC-CR shaping amplifier (SA) with 30 ns peaking time. Availability of separate outputs of the CSPs and the LA makes it possible to join any number of silicon detector layers to obtain the longitudinal and transversal resolution required using only this ASIC in any silicon calorimeter minitower configuration. Noise performance is ENC=1800e - +18e - /pF at 30 ns peaking time for detector capacitance up to C d =400 pF. Rise time is 8 ns at input capacitance C d =100 pF. Power dissipation is less than 50 mW/ chip at voltage supply 5 V

Experiment list: SRX112176 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available e=OS25 ES cells || chip antibody=CTD4H8 (MMS-128P, Covance) || chip antibody manufacturer=Covance || chromatin=Fixed || beads...=Magnetic beads http://dbarchive.biosciencedbc.jp/kyushu-u/mm9/e

The Design of High Performance, Low Power Triple-Track Magnetic Sensor Chip

Directory of Open Access Journals (Sweden)

Junning Chen

2013-07-01

Full Text Available This paper presents a design of a high performance and low power consumption triple-track magnetic sensor chip which was fabricated in TSMC 0.35 μm CMOS process. This chip is able to simultaneously sense, decode and read out the information stored in triple-track magnetic cards. A reference voltage generating circuit, a low-cost filter circuit, a power-on reset circuit, an RC oscillator, and a pre-decoding circuit are utilized as the basic modules. The triple-track magnetic sensor chip has four states, i.e., reset, sleep, swiping card and data read-out. In sleep state, the internal RC oscillator is closed, which means that the digital part does not operate to optimize energy consumption. In order to improve decoding accuracy and expand the sensing range of the signal, two kinds of circuit are put forward, naming offset correction circuit, and tracking circuit. With these two circuits, the sensing function of this chip can be more efficiently and accurately. We simulated these circuit modules with TSMC technology library. The results showed that these modules worked well within wide range input signal. Based on these results, the layout and tape-out were carried out. The measurement results showed that the chip do function well within a wide swipe speed range, which achieved the design target.

Progress with the single-sided module prototypes for the ATLAS tracker upgrade stave

CERN Document Server

Allport, P P; Wiik, L; Dressnandt, N; Matheson, J; Li, Z; Viehhauser, G; Gallop, B; Jones, T J; Dwuznik, M; Greenall, A; Eklund, L; Maddock, P; Pernecker, S; Wright, J; Puldon, D; Jakobs, K; Holt, R; Sevilla, S G; Koffeman, E; Dabrowski, W; Gilchriese, M; Wastie, R; Gibson, M; Robinson, D; Fadeyev, V; Gerling, M; Betancourt, C; Dawson, N; Bates, R; French, R; Kierstead, J; Anghinolfi, F; Weidberg, A; Martinez-McKinney, F; Paganis, S; Sutcliffe, P; Maunu, R; Newcomer, M; Weber, M; Parzefall, U; Clark, A; Colijn, A P; Xu, D; la Marra, D; Buttar, C; Grillo, A A; Schamberger, D; DeWilde, B; Poltorak, K; Affolder, A A; Tsionou, D; Hessey, N P; Casse, G; Fox, H; Ferrere, D; Villani, E G; Seiden, A; Tyndel, M; Sadrozinski, H F W; Wiimut, I; Carter, J R; Lacasta, C; Chilingarov, A; Santoyo, D; Lynn, D; Garcia, C; Haber, C H; Hommels, L B A; Dhawan, S; Lindgren, S; Farthouat, P; Nickerson, R; Chen, H; Kohler, M; Sattari, S; Civera, J V; McCarthy, R; Phillips, P; Unno, Y; Kaplon, J; Swientek, K; Wormald, M; Goodrick, M; Von Wilpert, J; Mahboubi, K

2011-01-01

The ATLAS experiment is preparing for the planned luminosity upgrade of the LHC (the super-luminous LHC or sLHC) with a programme of development for tracking able to withstand an order of greater magnitude radiation fluence and much greater hit occupancy rates than the current detector. This has led to the concept of an all-silicon tracker with an enhanced performance pixel-based inner region and short-strips for much of the higher radii. Both sub-systems employ many common technologies, including the proposed ``stave{''} concept for integrated cooling and support. For the short-strip region, use of this integrated stave concept requires single-sided modules mounted on either side of a thin central lightweight support. Each sensor is divided into four rows of 23.82 mm length strips; within each row, there are 1280 strips of 74.5 mu m pitch. Well over a hundred prototype sensors are being delivered by Hamamatsu Photonics (HPK) to Japan, Europe and the US. We present results of the first 20 chip ABCN25 ASIC hyb...

18k Channels single photon counting readout circuit for hybrid pixel detector

International Nuclear Information System (INIS)

Maj, P.; Grybos, P.; Szczygiel, R.; Zoladz, M.; Sakumura, T.; Tsuji, Y.

2013-01-01

We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm×20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96×192 pixels with 100 μm×100 μm pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 μW/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 μV/e − and the equivalent noise charge is 168 e − rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

18k Channels single photon counting readout circuit for hybrid pixel detector

Energy Technology Data Exchange (ETDEWEB)

Maj, P., E-mail: piotr.maj@agh.edu.pl [AGH University of Science and Technology, Department of Measurements and Electronics, Al. Mickiewicza 30, 30-059 Krakow (Poland); Grybos, P.; Szczygiel, R.; Zoladz, M. [AGH University of Science and Technology, Department of Measurements and Electronics, Al. Mickiewicza 30, 30-059 Krakow (Poland); Sakumura, T.; Tsuji, Y. [X-ray Analysis Division, Rigaku Corporation, Matsubara, Akishima, Tokyo 196-8666 (Japan)

2013-01-01

We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm Multiplication-Sign 20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96 Multiplication-Sign 192 pixels with 100 {mu}m Multiplication-Sign 100 {mu}m pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 {mu}W/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 {mu}V/e{sup -} and the equivalent noise charge is 168 e{sup -} rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

Wideband pulse amplifiers for the NECTAr chip

Energy Technology Data Exchange (ETDEWEB)

Sanuy, A., E-mail: asanuy@ecm.ub.es [Dept. AM i Dept. ECM, Institut de Ciencies del Cosmos (ICC), Universitat de Barcelona. Marti i Franques 1, E08028, Barcelona (Spain); Delagnes, E. [IRFU/DSM/CEA, CE-Saclay, Bat. 141 SEN Saclay, F-91191, Gif-sur-Yvette (France); Gascon, D. [Dept. AM i Dept. ECM, Institut de Ciencies del Cosmos (ICC), Universitat de Barcelona. Marti i Franques 1, E08028, Barcelona (Spain); Sieiro, X. [Departament d' Electronica, Universitat de Barcelona. Marti i Franques 1, E08028, Barcelona (Spain); Bolmont, J.; Corona, P. [LPNHE, Universite Paris VI and Universite Paris VII and IN2P3/CNRS, Barre 12-22, 1er etage, 4 place Jussieu, 75252 Paris (France); Feinstein, F. [LUPM, Universite Montpellier II and IN2P3/CNRS, CC072, bat. 13, place Eugene Bataillon, 34095 Montpellier (France); Glicenstein, J-F. [IRFU/DSM/CEA, CE-Saclay, Bat. 141 SEN Saclay, F-91191, Gif-sur-Yvette (France); Naumann, C.L.; Nayman, P. [LPNHE, Universite Paris VI and Universite Paris VII and IN2P3/CNRS, Barre 12-22, 1er etage, 4 place Jussieu, 75252 Paris (France); Ribo, M. [Dept. AM i Dept. ECM, Institut de Ciencies del Cosmos (ICC), Universitat de Barcelona. Marti i Franques 1, E08028, Barcelona (Spain); and others

2012-12-11

The NECTAr collaboration's FE option for the camera of the CTA is a 16 bits and 1-3 GS/s sampling chip based on analog memories including most of the readout functions. This works describes the input amplifiers of the NECTAr ASIC. A fully differential wideband amplifier, with voltage gain up to 20 V/V and a BW of 400 MHz. As it is impossible to design a fully differential OpAmp with an 8 GHz GBW product in a 0.35 CMOS technology, an alternative implementation based on HF linearized transconductors is explored. The output buffer is a class AB miller operational amplifier, with special non-linear current boost.

A Sol-gel Integrated Dual-readout Microarray Platform for Quantification and Identification of Prostate-specific Antigen.

Science.gov (United States)

Lee, SangWook; Lee, Jong Hyun; Kwon, Hyuck Gi; Laurell, Thomas; Jeong, Ok Chan; Kim, Soyoun

2018-01-01

Here, we report a sol-gel integrated affinity microarray for on-chip matrix-assisted laser desorption/ionization time-of-flight mass spectrometry (MALDI-TOF-MS) that enables capture and identification of prostate?specific antigen (PSA) in samples. An anti-PSA antibody (H117) was mixed with a sol?gel, and the mixture was spotted onto a porous silicon (pSi) surface without additional surface modifications. The antibody easily penetrates the sol-gel macropore fluidic network structure, making possible high affinities. To assess the capture affinity of the platform, we performed a direct assay using fluorescein isothiocyanate-labeled PSA. Pure PSA was subjected to on-chip MALDI-TOF-MS analysis, yielding three clear mass peptide peaks (m/z = 1272, 1407, and 1872). The sol-gel microarray platform enables dual readout of PSA both fluorometric and MALDI-TOF MS analysis in biological samples. Here we report a useful method for a means for discovery of biomarkers in complex body fluids.

Transmission-Line Readout with Good Time and Space Resolutions for Planacon MCP-PMTs

CERN Document Server

Tang, F; Byrum, K; Drake, G; Ertley, C; Frisch, H; Genat, J-F; May, E

2008-01-01

With commercially-available multi-anode microchannel plate photomultiplier tubes (MCP-PMT) and electronics, resolutions significantly better than 10 psec have been achieved in small systems with a few readout channels[1,2]. For large-scale time-of-flight systems used in particle physics, which may cover tens of square meters, a solution must be found with a manageable number of electronics channels and low total power consumption on the readout electronics without degrading the system timing resolution. We present here the design of a transmission-line readout for a Photonis Planacon MCP-PMT that has these characteristics. The tube, which is 5 cm square, is characterized by signal pulse rise times in the order of 200 psec and transit time spreads (TTS) in the order of 25 psec[1, 2]. The model 85011-011 MCP has 1024 anode pads laid out in an array of 32 by 32 on the back of the tube. The proposed readout is implemented on a Rogers 4350B printed circuit board with 32 parallel 50-ohm transmission lines on 1.6 mm...

A Distance Detector with a Strip Magnetic MOSFET and Readout Circuit.

Science.gov (United States)

Sung, Guo-Ming; Lin, Wen-Sheng; Wang, Hsing-Kuang

2017-01-10

This paper presents a distance detector composed of two separated metal-oxide semiconductor field-effect transistors (MOSFETs), a differential polysilicon cross-shaped Hall plate (CSHP), and a readout circuit. The distance detector was fabricated using 0.18 μm 1P6M Complementary Metal-Oxide Semiconductor (CMOS) technology to sense the magnetic induction perpendicular to the chip surface. The differential polysilicon CSHP enabled the magnetic device to not only increase the magnetosensitivity but also eliminate the offset voltage generated because of device mismatch and Lorentz force. Two MOSFETs generated two drain currents with a quadratic function of the differential Hall voltages at CSHP. A readout circuit-composed of a current-to-voltage converter, a low-pass filter, and a difference amplifier-was designed to amplify the current difference between two drains of MOSFETs. Measurements revealed that the electrostatic discharge (ESD) could be eliminated from the distance sensor by grounding it to earth; however, the sensor could be desensitized by ESD in the absence of grounding. The magnetic influence can be ignored if the magnetic body (human) stays far from the magnetic sensor, and the measuring system is grounded to earth by using the ESD wrist strap (Strap E-GND). Both 'no grounding' and 'grounding to power supply' conditions were unsuitable for measuring the induced Hall voltage.

Dedicated very front-end electronics for an ILC prototype hadronic calorimeter with SiPM read-out

CERN Document Server

de La Taille, C

2008-01-01

The SPIROC chip is a dedicated very front-end electronics for an ILC prototype hadronic calorimeter with Silicon photomultiplier (or MPPC) readout. This ASIC is due to equip a 10,000-channel demonstrator in 2009. SPIROC is an evolution of FLC_SiPM used for the ILC AHCAL physics prototype [1]. SPIROC was submitted in June 2007 and will be tested in September 2007. It embeds cutting edge features that fulfil ILC final detector requirements. It has been realized in 0.35m SiGe technology. It has been developed to match the requirements of large dynamic range, low noise, low consumption, high precision and large number of readout channels needed. SPIROC is an auto-triggered, bi-gain, 36-channel ASIC which allows to measure on each channel the charge from one photoelectron to 2000 and the time with a 100ps accurate TDC. An analogue memory array with a depth of 16 for each channel is used to store the time information and the charge measurement. A 12-bit Wilkinson ADC has been embedded to digitize the analogue memor...

Single-Readout High-Density Memristor Crossbar

KAUST Repository

Zidan, M. A.

2016-01-07

High-density memristor-crossbar architecture is a very promising technology for future computing systems. The simplicity of the gateless-crossbar structure is both its principal advantage and the source of undesired sneak-paths of current. This parasitic current could consume an enormous amount of energy and ruin the readout process. We introduce new adaptive-threshold readout techniques that utilize the locality and hierarchy properties of the computer-memory system to address the sneak-paths problem. The proposed methods require a single memory access per pixel for an array readout. Besides, the memristive crossbar consumes an order of magnitude less power than state-of-the-art readout techniques.

Single-Readout High-Density Memristor Crossbar

KAUST Repository

Zidan, M. A.; Omran, Hesham; Naous, Rawan; Salem, Ahmed Sultan; Fahmy, H. A. H.; Lu, W. D.; Salama, Khaled N.

2016-01-01

High-density memristor-crossbar architecture is a very promising technology for future computing systems. The simplicity of the gateless-crossbar structure is both its principal advantage and the source of undesired sneak-paths of current. This parasitic current could consume an enormous amount of energy and ruin the readout process. We introduce new adaptive-threshold readout techniques that utilize the locality and hierarchy properties of the computer-memory system to address the sneak-paths problem. The proposed methods require a single memory access per pixel for an array readout. Besides, the memristive crossbar consumes an order of magnitude less power than state-of-the-art readout techniques.

A CMOS smart temperature and humidity sensor with combined readout.

Science.gov (United States)

Eder, Clemens; Valente, Virgilio; Donaldson, Nick; Demosthenous, Andreas

2014-09-16

A fully-integrated complementary metal-oxide semiconductor (CMOS) sensor for combined temperature and humidity measurements is presented. The main purpose of the device is to monitor the hermeticity of micro-packages for implanted integrated circuits and to ensure their safe operation by monitoring the operating temperature and humidity on-chip. The smart sensor has two modes of operation, in which either the temperature or humidity is converted into a digital code representing a frequency ratio between two oscillators. This ratio is determined by the ratios of the timing capacitances and bias currents in both oscillators. The reference oscillator is biased by a current whose temperature dependency is complementary to the proportional to absolute temperature (PTAT) current. For the temperature measurement, this results in an exceptional normalized sensitivity of about 0.77%/°C at the accepted expense of reduced linearity. The humidity sensor is a capacitor, whose value varies linearly with relative humidity (RH) with a normalized sensitivity of 0.055%/% RH. For comparison, two versions of the humidity sensor with an area of either 0.2 mm2 or 1.2 mm2 were fabricated in a commercial 0.18 μm CMOS process. The on-chip readout electronics operate from a 5 V power supply and consume a current of approximately 85 µA.

Experiment list: SRX150586 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available -Barr Virus 33195472,90.4,25.9,15633 GSM935507: Harvard ChipSeq GM12878 NF-YB IgG-mus source_name=GM12878 ||...?PgId=165&q=GM12878 || lab=Harvard || lab description=Struhl - Harvard University || datatype=ChipSeq || dat

The GLUEchip: A custom VLSI chip for detectors readout and associative memories circuits

International Nuclear Information System (INIS)

Amendolia, S.R.; Galeotti, S.; Morsani, F.; Passuello, D.; Ristori, L.; Turini, N.

1993-01-01

An associative memory full-custom VLSI chip for pattern recognition has been designed and tested in the past years. It's the AMchip, that contains 128 patterns of 60 bits each. To expand the pattern capacity of an Associative Memory bank, the custom VLSI GLUEchip has been developed. The GLUEchip allows the interconnection of up to 16 AMchips or up to 16 GLUEchips: the resulting tree-like structure works like a single AMchip with an output pipelined structure and a pattern capacity increased by a factor 16 for each GLUEchip used

Conditional Dispersive Readout of a CMOS Single-Electron Memory Cell

Science.gov (United States)

Schaal, S.; Barraud, S.; Morton, J. J. L.; Gonzalez-Zalba, M. F.

2018-05-01

Quantum computers require interfaces with classical electronics for efficient qubit control, measurement, and fast data processing. Fabricating the qubit and the classical control layer using the same technology is appealing because it will facilitate the integration process, improving feedback speeds and offering potential solutions to wiring and layout challenges. Integrating classical and quantum devices monolithically, using complementary metal-oxide-semiconductor (CMOS) processes, enables the processor to profit from the most mature industrial technology for the fabrication of large-scale circuits. We demonstrate a CMOS single-electron memory cell composed of a single quantum dot and a transistor that locks charge on the quantum-dot gate. The single-electron memory cell is conditionally read out by gate-based dispersive sensing using a lumped-element L C resonator. The control field-effect transistor (FET) and quantum dot are fabricated on the same chip using fully depleted silicon-on-insulator technology. We obtain a charge sensitivity of δ q =95 ×10-6e Hz-1 /2 when the quantum-dot readout is enabled by the control FET, comparable to results without the control FET. Additionally, we observe a single-electron retention time on the order of a second when storing a single-electron charge on the quantum dot at millikelvin temperatures. These results demonstrate first steps towards time-based multiplexing of gate-based dispersive readout in CMOS quantum devices opening the path for the development of an all-silicon quantum-classical processor.

A front end ASIC for the readout of the PMT in the KM3NeT detector

International Nuclear Information System (INIS)

Gajanana, D; Gromov, V; Timmer, P; Heine, E; Kluit, R

2010-01-01

In this work, we describe the front end ASIC to readout the Photo-Multiplier-Tube of the KM3NeT detector, in detail. Stringent power budgeting, area constraints and lowering cost motivate us to design a custom front-end ASIC for reading the PMT. The ASIC amplifies the PMT signal and discriminates it against a threshold level and delivers the information via low voltage differential signals (LVDS). These LVDS signals carry highly accurate timing information of the photons . The length of the LVDS signals or Time over Threshold (ToT) gives information on the number of detected photons. A one-time programmable read-only memory (PROM) block provides unique identification to the chip. The chip communicates with the data acquisition electronics via an I 2 C bus. The data is transmitted to shore via fiber optics, where processing is done. The ASIC was fabricated in 0.35u CMOS process from AustriaMicroSystems (AMS).

Combined readout of a triple-GEM detector

Science.gov (United States)

Antochi, V. C.; Baracchini, E.; Cavoto, G.; Di Marco, E.; Marafini, M.; Mazzitelli, G.; Pinci, D.; Renga, F.; Tomassini, S.; Voena, C.

2018-05-01

Optical readout of GEM based devices by means of high granularity and low noise CMOS sensors allows to obtain very interesting tracking performance. Space resolution of the order of tens of μm were measured on the GEM plane along with an energy resolution of 20%÷30%. The main limitation of CMOS sensors is represented by their poor information about time structure of the event. In this paper, the use of a concurrent light readout by means of a suitable photomultiplier and the acquisition of the electric signal induced on the GEM electrode are exploited to provide the necessary timing informations. The analysis of the PMT waveform allows a 3D reconstruction of each single clusters with a resolution on z of 100 μm. Moreover, from the PMT signals it is possible to obtain a fast reconstruction of the energy released within the detector with a resolution of the order of 25% even in the tens of keV range useful, for example, for triggering purpose.

On-chip RF-to-optical transducer

DEFF Research Database (Denmark)

Simonsen, Anders; Tsaturyan, Yeghishe; Seis, Yannick

2016-01-01

these diverse systems, plus technologies that utilize them, and the mature toolbox of optical techniques that routinely operates at the quantum limit. In a previous work [1], we demonstrated such a bridge by realizing simultaneous coupling between an electronic LC circuit and a quantum-noise limited optical...... noise temperatures far below the actual temperature of the mechanical element. On-chip integration of the electrical, mechanical and optical elements is necessary for an implementation of the transduction scheme that is viable for commercial applications. Reliable assembly of a strongly coupled...... electromechanical device, and inclusion of an optical cavity for enhanced optical readout, are key features of the new platform. Both can be achieved with standard cleanroom fabrication techniques. We will furthermore present ongoing work to couple our transducer to an RF or microwave antenna, for low...

A two-dimensional position sensitive gas chamber with scanned charge transfer readout

Energy Technology Data Exchange (ETDEWEB)

Gomez, F. E-mail: faustgr@usc.es; Iglesias, A.; Lobato, R.; Mosquera, J.; Pardo, J.; Pena, J.; Pazos, A.; Pombar, M.; Rodriguez, A

2003-10-21

We have constructed and tested a two-dimensional position sensitive parallel-plate gas ionization chamber with scanned charge transfer readout. The scan readout method described here is based on the development of a new position-dependent charge transfer technique. It has been implemented by using gate strips perpendicularly oriented to the collector strips. This solution reduces considerably the number of electronic readout channels needed to cover large detector areas. The use of a 25 {mu}m thick kapton etched circuit allows high charge transfer efficiency with a low gating voltage, consequently needing a very simple commutating circuit. The present prototype covers 8x8 cm{sup 2} with a pixel size of 1.27x1.27 mm{sup 2}. Depending on the intended use and beam characteristics a smaller effective pixel is feasible and larger active areas are possible. This detector can be used for X-ray or other continuous beam intensity profile monitoring.

A two-dimensional position sensitive gas chamber with scanned charge transfer readout

International Nuclear Information System (INIS)

Gomez, F.; Iglesias, A.; Lobato, R.; Mosquera, J.; Pardo, J.; Pena, J.; Pazos, A.; Pombar, M.; Rodriguez, A.

2003-01-01

We have constructed and tested a two-dimensional position sensitive parallel-plate gas ionization chamber with scanned charge transfer readout. The scan readout method described here is based on the development of a new position-dependent charge transfer technique. It has been implemented by using gate strips perpendicularly oriented to the collector strips. This solution reduces considerably the number of electronic readout channels needed to cover large detector areas. The use of a 25 μm thick kapton etched circuit allows high charge transfer efficiency with a low gating voltage, consequently needing a very simple commutating circuit. The present prototype covers 8x8 cm 2 with a pixel size of 1.27x1.27 mm 2 . Depending on the intended use and beam characteristics a smaller effective pixel is feasible and larger active areas are possible. This detector can be used for X-ray or other continuous beam intensity profile monitoring

Optical readout and control interface for the BTeV pixel vertex detector

CERN Document Server

Vergara-Limon, S; Sheaff, M; Vargas, M A

2002-01-01

Optical links will be used for sending data back and forth from the counting room to the detector in the data acquisition systems for future high energy physics experiments, including ATLAS and CMS in the LHC at CERN (Switzerland) and BTeV at Fermilab (USA). This is because they can be ultra-high speed and are relatively immune to electro-magnetic interference (EMI). The baseline design for the BTeV Pixel Vertex Detector includes two types of optical link, one to control and monitor and the other to read out the hit data from the multi-chip modules on each half-plane of the detector. The design and performance of the first prototype of the Optical Readout and Control Interface for the BTeV Pixel Vertex Detector is described.

Progress on the development of a detector mounted analog and digital readout system for the ATLAS TRT

CERN Document Server

Baxter, C; Dressnandt, N; Gay, C; Lundberg, B; Munar, A; Mayers, G; Newcomer, M; Van Berg, R; Williams, H H

2004-01-01

The 430,000 element ATLAS Transition Radiation straw tube Tracker (TRT) is divided into a central barrel tracker consisting of 104,000 axially mounted straws and two radially arranged end caps on either side of the barrel with 160,000 straws each. To achieve a track position resolution of 140 mu m, the front end electronics must operate at a low (2fC) threshold with a time marking capability of ~1ns. Two ASICs, the ASDBLR and DTMROC provide the complete pipelined readout chain. Custom designed FBGA packages for the ASICs provide a small enough outline to be detector mounted and the extensive use of low level differential signals make mounting the analog packages on printed circuit boards directly opposite the 40 MHz digital chips feasible. The readout electronics for the barrel occupies a potentially important part of the active tracker volume and an aggressive effort has been made to make it as compact as possible. Utilizing a single board for both analog and digital ASICS a 0.1 cm /sup 3/ per channel volume...

Power-aware transceiver design for half-duplex bidirectional chip-to-chip optical interconnects

International Nuclear Information System (INIS)

Sangirov Jamshid; Ukaegbu Ikechi Augustine; Lee Tae-Woo; Park Hyo-Hoon; Sangirov Gulomjon

2013-01-01

A power-aware transceiver for half-duplex bidirectional chip-to-chip optical interconnects has been designed and fabricated in a 0.13 μm complementary metal–oxide–semiconductor (CMOS) technology. The transceiver can detect the presence and absence of received signals and saves 55% power in Rx enabled mode and 45% in Tx enabled mode. The chip occupies an area of 1.034 mm 2 and achieves a 3-dB bandwidth of 6 GHz and 7 GHz in Tx and Rx modes, respectively. The disabled outputs for the Tx and Rx modes are isolated with 180 dB and 139 dB, respectively, from the enabled outputs. Clear eye diagrams are obtained at 4.25 Gbps for both the Tx and Rx modes. (semiconductor integrated circuits)

Characterisation of the ATLAS ITK strips front-end chip and development of EUDAQ 2.0 for the EUDET-style pixel telescopes

Energy Technology Data Exchange (ETDEWEB)

Peschke, Richard

2017-03-15

As part of the ATLAS phase-II upgrade a new, all-silicon tracker will be built. The new tracker will consist of silicon pixel sensors and silicon microstrip sensors. For the readout of the microstrip sensor a new readout chip was designed; the so called ATLAS Binary Converter 130 (ABC130) which is based on a 130 nm CMOS technology. The chip consists of an analog Front End built up of 256 channels, each with a preamplifier and a discriminator for converting the analog sensor readout into a binary response. The preamplifier of the ABC130 was designed to have a gain of 90-95 (mV)/(fC). First laboratory measurements with the built-in control circuits have shown a gain of <75 (mV)/(fC). In the course of this thesis a test beam campaign was undertaken to measure the gain in an unbiased system under realistic conditions. The obtained gain varied from ∼90 (mV)/(fC) to ∼100 (mV)/(fC). With this, the values obtained by the test beam campaign are within the specifications. In order to perform the test beam campaign with optimal efficiency, a complete overhaul of the data acquisition framework used for the EUDET type test beam telescopes was necessary. The new version is called EUDAQ 2.0. It is designed to accommodate devices with different integration times such as LHC-type devices with an integration time of only 25 ns, and devices with long integration times such as the MIMOSA26 with an integration time of 114.5 μs. To accomplish this a new synchronization algorithm has been developed. It gives the user full flexibility on the means of synchronizing their own data stream with the system. Beyond this, EUDAQ 2.0 also allows user specific encoding and decoding of data packets. This enables the user to minimize the data overhead and to shift more computation time to the offline stage. To reduce the network overhead EUDAQ 2.0 allows the user to store data locally. The merging is then postponed to the offline stage.

Characterisation of the ATLAS ITK strips front-end chip and development of EUDAQ 2.0 for the EUDET-style pixel telescopes

International Nuclear Information System (INIS)

Peschke, Richard

2017-03-01

As part of the ATLAS phase-II upgrade a new, all-silicon tracker will be built. The new tracker will consist of silicon pixel sensors and silicon microstrip sensors. For the readout of the microstrip sensor a new readout chip was designed; the so called ATLAS Binary Converter 130 (ABC130) which is based on a 130 nm CMOS technology. The chip consists of an analog Front End built up of 256 channels, each with a preamplifier and a discriminator for converting the analog sensor readout into a binary response. The preamplifier of the ABC130 was designed to have a gain of 90-95 (mV)/(fC). First laboratory measurements with the built-in control circuits have shown a gain of <75 (mV)/(fC). In the course of this thesis a test beam campaign was undertaken to measure the gain in an unbiased system under realistic conditions. The obtained gain varied from ∼90 (mV)/(fC) to ∼100 (mV)/(fC). With this, the values obtained by the test beam campaign are within the specifications. In order to perform the test beam campaign with optimal efficiency, a complete overhaul of the data acquisition framework used for the EUDET type test beam telescopes was necessary. The new version is called EUDAQ 2.0. It is designed to accommodate devices with different integration times such as LHC-type devices with an integration time of only 25 ns, and devices with long integration times such as the MIMOSA26 with an integration time of 114.5 μs. To accomplish this a new synchronization algorithm has been developed. It gives the user full flexibility on the means of synchronizing their own data stream with the system. Beyond this, EUDAQ 2.0 also allows user specific encoding and decoding of data packets. This enables the user to minimize the data overhead and to shift more computation time to the offline stage. To reduce the network overhead EUDAQ 2.0 allows the user to store data locally. The merging is then postponed to the offline stage.

A multi-channel time-to-digital converter chip for drift chamber readout

International Nuclear Information System (INIS)

Santos, D.M.; Chau, A.; DeBusshere, D.; Dow, S.; Flasck, J.; Levi, M.; Kirsten, F.; Su, E.

1995-12-01

A complete, multi-channel, timing and amplitude measurement IC for use in drift chamber applications is described. By targeting specific resolutions, i.e. 6-bits of resolution for both time and amplitude, area and power can be minimized while achieving the proper level of measurement accuracy. Time is digitized using one eight channel TDC comprised of a delay locked loop and eight sets of latches and encoders. Amplitude (for dE/dx) is digitized using a dual-range FADC for each channel. Eight bits of dynamic range with six bits of accuracy are achieved with the dual-range. The timing and amplitude information is multiplexed into one DRAM (Dynamic Random Access Memory) trigger latency buffer. Interesting events are then transferred into an SRAM (Static Random Access Memory) readout buffer before the latency time has expired. The design has been optimized to achieve the requisite resolution using the smallest area and lowest power. The circuit has been implemented in a 0.8μ triple metal CMOS process. The TDC sub-element has been measured to have better than 135 ps time resolution and 35 ps jitter. The DRAM has a measured cycle time of 80 MHz

The TDCpix readout ASIC: A 75ps resolution timing front-end for the NA62 Gigatracker hybrid pixel detector

CERN Document Server

Kluge, A; Bonacini, S; Jarron, P; Kaplon, J; Morel, M; Noy, M; Perktold, L; Poltorak, K

2013-01-01

The TDCpix is a novel pixel readout ASIC for the NA62 Gigatracker detector. NA62 is a new experiment being installed at the CERN Super Proton Synchrotron. Its Gigatracker detector shall provide on-beam tracking and time stamping of individual particles with a time resolution of 150 ps rms. It will consist of three tracking stations, each with one hybrid pixel sensor. The peak fl ow of particles crossing the detector modules reaches 1.27 MHz/mm 2 for a total rate of about 0.75 GHz. Ten TDCpix chips will be bump-bonded to every silicon pixel sensor. Each chip shall perform time stamping of 100 M particle hits per second with a detection ef fi ciency above 99% and a timing accuracy better than 200 ps rms for an overall three-station-setup time resolution of better than 150 ps. The TDCpix chip has been designed in a 130 nm CMOS technology. It will feature 45 40 square pixels of 300 300 μ m 2 and a complex End of Column peripheral region including an array of TDCs based on DLLs, four high speed serializers, a low...

Test of a PCIe based readout option for PANDA

Energy Technology Data Exchange (ETDEWEB)

Reiter, Simon; Lange, Soeren; Kuehn, Wolfgang [Justus-Liebig-Universitaet Giessen (Germany); Engel, Heiko [Goethe-Universitaet Frankfurt (Germany); Collaboration: PANDA-Collaboration

2016-07-01

The future PANDA detector will achieve an event rate at about 20 MHz resulting in a high data load of up to 200 GB/s. The data acquisition system will be based on a triggerless readout concept, leading to the requirement of large data bandwidths. The data reduction will be guaranteed on the first level by an array of FPGAs running a full on-line reconstruction followed by the second level of a CPU/GPU cluster to achieve a reduction factor more than 1000. The C-RORC (Common Readout Receiver Card), originally developed for ALICE, provides on the one hand 12 optical links with 6.25 Gbps each, and on the other hand a PCIe interface with up to 40 Gbps. The receiver card has been installed and tested, and the firmware has been adjusted for the Panda data format. Test results are presented.

Characterization of imaging pixel detectors of Si and CdTe read out with the counting X-ray chip MPEC 2.3

International Nuclear Information System (INIS)

Loecker, M.

2007-04-01

Single photon counting detectors with Si- and CdTe-sensors have been constructed and characterized. As readout chip the MPEC 2.3 is used which consists of 32 x 32 pixels with 200 x 200 μm 2 pixel size and which has a high count rate cabability (1 MHz per pixel) as well as a low noise performance (55 e - ). Measurements and simulations of the detector homogeneity are presented. It could be shown that the theoretical maximum of the homogeneity is reached (quantum limit). By means of the double threshold of the MPEC chip the image contrast can be enhanced which is demonstrated by measurement and simulation. Also, multi-chip-modules consisting of 4 MPEC chips and a single Si- or CdTe-sensor have been constructed and successfully operated. With these modules modulation-transfer-function measurements have been done showing a good spatial resolution of the detectors. In addition, multi-chip-modules according to the Sparse-CMOS concept have been built and tests characterizing the interconnection technologies have been performed

A radiation-hard dual-channel 12-bit 40 MS/s ADC prototype for the ATLAS liquid argon calorimeter readout electronics upgrade at the CERN LHC

Energy Technology Data Exchange (ETDEWEB)

Kuppambatti, J. [Columbia University, Dept. of Electrical Engineering, New York, NY (United States); Ban, J. [Columbia University, Nevis Laboratories, Irvington, NY (United States); Andeen, T., E-mail: tandeen@utexas.edu [Columbia University, Nevis Laboratories, Irvington, NY (United States); Brown, R.; Carbone, R. [Columbia University, Nevis Laboratories, Irvington, NY (United States); Kinget, P. [Columbia University, Dept. of Electrical Engineering, New York, NY (United States); Brooijmans, G.; Sippach, W. [Columbia University, Nevis Laboratories, Irvington, NY (United States)

2017-05-21

The readout electronics upgrade for the ATLAS Liquid Argon Calorimeters at the CERN Large Hadron Collider requires a radiation-hard ADC. The design of a radiation-hard dual-channel 12-bit 40 MS/s pipeline ADC for this use is presented. The design consists of two pipeline A/D channels each with four Multiplying Digital-to-Analog Converters followed by 8-bit Successive-Approximation-Register analog-to-digital converters. The custom design, fabricated in a commercial 130 nm CMOS process, shows a performance of 67.9 dB SNDR at 10 MHz for a single channel at 40 MS/s, with a latency of 87.5 ns (to first bit read out), while its total power consumption is 50 mW/channel. The chip uses two power supply voltages: 1.2 and 2.5 V. The sensitivity to single event effects during irradiation is measured and determined to meet the system requirements.

Study of Charge Diffusion in a Silicon Detector Using an Energy Sensitive Pixel Readout Chip

CERN Document Server

Schioppa, E. J.; van Beuzekom, M.; Visser, J.; Koffeman, E.; Heijne, E.; Engel, K. J.; Uher, J.

2015-01-01

A 300 μm thick thin p-on-n silicon sensor was connected to an energy sensitive pixel readout ASIC and exposed to a beam of highly energetic charged particles. By exploiting the spectral information and the fine segmentation of the detector, we were able to measure the evolution of the transverse profile of the charge carriers cloud in the sensor as a function of the drift distance from the point of generation. The result does not rely on model assumptions or electric field calculations. The data are also used to validate numerical simulations and to predict the detector spectral response to an X-ray fluorescence spectrum for applications in X-ray imaging.

Study of the spatial resolution for binary readout detectors

Energy Technology Data Exchange (ETDEWEB)

Yonamine, R., E-mail: ryo.yonamine@ulb.ac.be; Maerschalk, T.; Lentdecker, G. De

2016-07-11

Often the binary readout is proposed for high granularity detectors to reduce the generated data volume to be readout at the price of a somewhat reduced spatial resolution compared to an analogue readout. We have been studying single hit resolutions obtained with a binary readout using simulations as well as analytical approaches. In this note we show that the detector geometry could be optimized to offer an equivalent spatial resolution than with an analogue readout.

Performance study of large area encoding readout MRPC

Science.gov (United States)

Chen, X. L.; Wang, Y.; Chen, G.; Han, D.; Wang, X.; Zeng, M.; Zeng, Z.; Zhao, Z.; Guo, B.

2018-02-01

Muon tomography system built by the 2-D readout high spatial resolution Multi-gap Resistive Plate Chamber (MRPC) detector is a project of Tsinghua University. An encoding readout method based on the fine-fine configuration has been used to minimize the number of the readout electronic channels resulting in reducing the complexity and the cost of the system. In this paper, we provide a systematic comparison of the MRPC detector performance with and without fine-fine encoding readout. Our results suggest that the application of the fine-fine encoding readout leads us to achieve a detecting system with slightly worse spatial resolution but dramatically reduce the number of electronic channels.

A multichannel front end ASIC for PMT readout in LHAASO WCDA

Science.gov (United States)

Liang, Y.; Zhao, L.; Guo, Y.; Qin, J.; Yang, Y.; Cheng, B.; Liu, S.; An, Q.

2018-01-01

Time and charge measurements over a large dynamic range from 1 Photo Electron (P.E.) to 4000 P.E. are required for the Water Cherenkov Detector Array (WCDA), which is one of the key components in the Large High Altitude Air Shower Observatory (LHAASO). To simplify the circuit structure of the readout electronics, a front end ASIC was designed. Based on the charge-to-time conversion method, the output pulse width of the ASIC corresponds to the input signal charge information while time information of the input signal is picked off through a discriminator, and thus the time and charge information can be digitized simultaneously using this ASIC and a following Time-to-Digital Converter (TDC). To address the challenge of mismatch among the channels observed in the previous prototype version, this work presents approaches for analyzing the problem and optimizing the circuits. A new version of the ASIC was designed and fabricated in the GLOBALFOUNDRIES 0.35 μm CMOS technology, which integrates 6 channels (corresponding to the readout of the 3 PMTs) in each chip. The test results indicate that the mismatch between the channels is significantly reduced to less than 20% using the proposed approach. The time measurement resolution better than 300 ps is achieved, and the charge measurement resolution is better than 10% at 1 P.E., and 1% at 4000 P.E., which meets the application requirements.

A Radiation Hardened by Design CMOS ASIC for Thermopile Readouts

Science.gov (United States)

Quilligan, G.; Aslam, S.; DuMonthier, J.

2012-01-01

A radiation hardened by design (RHBD) mixed-signal application specific integrated circuit (ASIC) has been designed for a thermopile readout for operation in the harsh Jovian orbital environment. The multi-channel digitizer (MCD) ASIC includes 18 low noise amplifier channels which have tunable gain/filtering coefficients, a 16-bit sigma-delta analog-digital converter (SDADC) and an on-chip controller. The 18 channels, SDADC and controller were designed to operate with immunity to single event latchup (SEL) and to at least 10 Mrad total ionizing dose (TID). The ASIC also contains a radiation tolerant 16-bit 20 MHz Nyquist ADC for general purpose instrumentation digitizer needs. The ASIC is currently undergoing fabrication in a commercial 180 nm CMOS process. Although this ASIC was designed specifically for the harsh radiation environment of the NASA led JEO mission it is suitable for integration into instrumentation payloads 011 the ESA JUICE mission where the radiation hardness requirements are slightly less stringent.

Characterization of Medipix3 with the MARS readout and software

CERN Document Server

Ronaldson, J P; van Leeuwen, D; Doesburg, R M N; Ballabriga, R; Butler, A P H; Donaldson, J; Walsh, M; Nik, S J; Clyne, M N

2011-01-01

The Medipix3 x-ray imaging detector has been characterized using the MARS camera. This x-ray camera comprises custom built readout electronics and software libraries designed for the Medipix family of detectors. The performance of the Medipix3 and MARS camera system is being studied prior to use in real-world applications such as the recently developed MARS-CT3 spectroscopic micro-CT scanner. We present the results of characterization measurements, describe methods for optimizing performance and give examples of spectroscopic images acquired with Medipix3 and the MARS camera system. A limited number of operating modes of the Medipix3 chip have been characterized and single-pixel mode has been found to give acceptable performance in terms of energy response, image quality and stability over time. Spectroscopic performance is significantly better in charge-summing mode than single-pixel mode however image quality and stability over time are compromised. There are more modes of operation to be tested and further...

Feasibility study to use an SRAM-based FPGA in the readout electronics of the upgraded LHCb outer tracker detector

International Nuclear Information System (INIS)

Faerber, Christian

2014-01-01

This thesis presents a study of the feasibility to use SRAM-based FPGAs as central component of the upgraded LHCb Outer Tracker readout electronics. The FPGA should contain the functionality of a TDC and should provide fast data links using multi-GBit/s transceivers. The TDC core that was developed provides 5 bit time measurements for 32 channels with a bin size of 780 ps. The TDC has the required time resolution of better than 1 ns. This was achieved by manually placing every logic element of the TDC channels and with an iterative procedure feeding timing measurements back to the Place and Route step of the router software. A transceiver and TDC card, and an adapter board for the existing readout electronics was developed. Both boards were used successfully to read out drift times from an Outer Tracker straw-tube module in a cosmic setup. To qualify the proposed electronics for the expected radiation levels an irradiation test with 22 MeV protons and two FPGA boards was performed up to a total ionization dose of 30 Mrad. Both chips sustained the irradiation expected for the full life time of the upgraded LHCb detector of up to 30 krad. After an irradiation dose of 150 krad the first deteriorations of the performance of the chips were observed. The proton cross section for configuration bit flips was determined to be 1.6.10 16 cm 2 per bit. The measured error rate scaled to the upgrade environment would correspond to a manageable firmware error rate.

Development and simulation results of a sparsification and readout circuit for wide pixel matrices

International Nuclear Information System (INIS)

Gabrielli, A.; Giorgi, F.; Morsani, F.; Villa, M.

2011-01-01

In future collider experiments, the increasing luminosity and centre of mass energy are rising challenging problems in the design of new inner tracking systems. In this context we develop high-efficiency readout architectures for large binary pixel matrices that are meant to cope with the high-stressing conditions foreseen in the innermost layers of a tracker [The SuperB Conceptual Design Report, INFN/AE-07/02, SLAC-R-856, LAL 07-15, Available online at: (http://www.pi.infn.it/SuperB)]. We model and design digital readout circuits to be integrated on VLSI ASICs. These architectures can be realized with different technology processes and sensors: they can be implemented on the same silicon sensor substrate of a CMOS MAPS devices (Monolithic Active Pixel Sensor), on the CMOS tier of a hybrid pixel sensor or in a 3D chip where the digital layer is stacked on the sensor and the analog layers [V. Re et al., Nuc. Instr. and Meth. in Phys. Res. A, (doi:10.1016/j.nima.2010.05.039)]. In the presented work, we consider a data-push architecture designed for a sensor matrix of an area of about 1.3 cm 2 with a pitch of 50 microns. The readout circuit tries to take great advantage of the high density of in-pixel digital logic allowed by vertical integration. We aim at sustaining a rate density of 100 Mtrack . s -1 . cm -2 with a temporal resolution below 1 μs. We show how this architecture can cope with these stressing conditions presenting the results of Monte Carlo simulations.

Development and simulation results of a sparsification and readout circuit for wide pixel matrices

Energy Technology Data Exchange (ETDEWEB)

Gabrielli, A.; Giorgi, F. [University and INFN of Bologna (Italy); Morsani, F. [University and INFN of Pisa (Italy); Villa, M. [University and INFN of Bologna (Italy)

2011-06-15

In future collider experiments, the increasing luminosity and centre of mass energy are rising challenging problems in the design of new inner tracking systems. In this context we develop high-efficiency readout architectures for large binary pixel matrices that are meant to cope with the high-stressing conditions foreseen in the innermost layers of a tracker [The SuperB Conceptual Design Report, INFN/AE-07/02, SLAC-R-856, LAL 07-15, Available online at: (http://www.pi.infn.it/SuperB)]. We model and design digital readout circuits to be integrated on VLSI ASICs. These architectures can be realized with different technology processes and sensors: they can be implemented on the same silicon sensor substrate of a CMOS MAPS devices (Monolithic Active Pixel Sensor), on the CMOS tier of a hybrid pixel sensor or in a 3D chip where the digital layer is stacked on the sensor and the analog layers [V. Re et al., Nuc. Instr. and Meth. in Phys. Res. A, (doi:10.1016/j.nima.2010.05.039)]. In the presented work, we consider a data-push architecture designed for a sensor matrix of an area of about 1.3 cm{sup 2} with a pitch of 50 microns. The readout circuit tries to take great advantage of the high density of in-pixel digital logic allowed by vertical integration. We aim at sustaining a rate density of 100 Mtrack . s{sup -1} . cm{sup -2} with a temporal resolution below 1 {mu}s. We show how this architecture can cope with these stressing conditions presenting the results of Monte Carlo simulations.

The TDCpix readout ASIC: A 75 ps resolution timing front-end for the NA62 Gigatracker hybrid pixel detector

Energy Technology Data Exchange (ETDEWEB)

Kluge, A., E-mail: alexander.kluge@cern.ch; Aglieri Rinella, G.; Bonacini, S.; Jarron, P.; Kaplon, J.; Morel, M.; Noy, M.; Perktold, L.; Poltorak, K.

2013-12-21

The TDCpix is a novel pixel readout ASIC for the NA62 Gigatracker detector. NA62 is a new experiment being installed at the CERN Super Proton Synchrotron. Its Gigatracker detector shall provide on-beam tracking and time stamping of individual particles with a time resolution of 150 ps rms. It will consist of three tracking stations, each with one hybrid pixel sensor. The peak flow of particles crossing the detector modules reaches 1.27 MHz/mm{sup 2} for a total rate of about 0.75 GHz. Ten TDCpix chips will be bump-bonded to every silicon pixel sensor. Each chip shall perform time stamping of 100 M particle hits per second with a detection efficiency above 99% and a timing accuracy better than 200 ps rms for an overall three-station-setup time resolution of better than 150 ps. The TDCpix chip has been designed in a 130 nm CMOS technology. It will feature 45×40 square pixels of 300×300μm{sup 2} and a complex End of Column peripheral region including an array of TDCs based on DLLs, four high speed serializers, a low-jitter PLL, readout and control circuits. This contribution will describe the complete design of the final TDCpix ASIC. It will discuss design choices, the challenges faced and some of the lessons learned. Furthermore, experimental results from the testing of circuit prototypes will be presented. These demonstrate the achievement of key performance figures such as a time resolution of the processing chain of 75 ps rms with a laser sent to the center of the pixel and the capability of time stamping charged particles with an overall resolution below 200 ps rms. -- Highlights: • Feasibility demonstration of a silicon pixel detector with sub-ns time tagging capability. • Demonstrator detector assembly with a time resolution of 75 ps RMS with laser charge injection; 170 ps RMS with particle beam. • Design of trigger-less TDCpix ASIC with 1800 pixels, 720 TDC channels and 4 3.2 Gbit/s serializers.

Performance of the gamma-ray camera based on GSO(Ce) scintillator array and PSPMT with the ASIC readout system

International Nuclear Information System (INIS)

Ueno, Kazuki; Hattori, Kaori; Ida, Chihiro; Iwaki, Satoru; Kabuki, Shigeto; Kubo, Hidetoshi; Kurosawa, Shunsuke; Miuchi, Kentaro; Nagayoshi, Tsutomu; Nishimura, Hironobu; Orito, Reiko; Takada, Atsushi; Tanimori, Toru

2008-01-01

We have studied the performance of a readout system with ASIC chips for a gamma-ray camera based on a 64-channel multi-anode PSPMT (Hamamatsu flat-panel H8500) coupled to a GSO(Ce) scintillator array. The GSO array consists of 8x8 pixels of 6x6x13 mm 3 with the same pixel pitch as the anode of the H8500. This camera is intended to serve as an absorber of an electron tracking Compton gamma-ray camera that measures gamma rays up to ∼1 MeV. Because we need a readout system with low power consumption for a balloon-borne experiment, we adopted a 32-channel ASIC chip, IDEAS VA32 H DR11, which has one of the widest dynamic range among commercial chips. However, in the case of using a GSO(Ce) crystal and the H8500, the dynamic range of VA32 H DR11 is narrow, and therefore the H8500 has to be operated with a low gain of about 10 5 . If the H8500 is operated with a low gain, the camera has a narrow incident-energy dynamic range from 100 to 700 keV, and a bad energy resolution of 13.0% (FWHM) at 662 keV. We have therefore developed an attenuator board in order to operate the H8500 with the typical gain of 10 6 , which can measure up to ∼1 MeV gamma ray. The board makes the variation of the anode gain uniform and widens the dynamic range of the H8500. The system using the new attenuator board has a good uniformity of min:max∼1:1.6, an incident-energy dynamic range from 30 to 900 keV, a position resolution of less than 6 mm, and a typical energy resolution of 10.6% (FWHM) at 662 keV with a low power consumption of about 1.7 W/64ch

A multi-channel time-to-digital converter chip for drift chamber readout

International Nuclear Information System (INIS)

Chau, A.; DeBusschere, D.; Dow, S.F.; Flasck, J.; Levi, M.E.; Kirsten, F.; Su, E.; Santos, D.M.

1996-01-01

A complete, multi-channel, timing and amplitude measurement IC for use in drift chamber applications is described. By targeting specific resolutions, i.e., 6-bits of resolution for both time and amplitude, area and power can be minimized while achieving the proper level of measurement accuracy. Time is digitized using an TDC comprised of a delay locked loop, latch and encoder. Amplitude (for dE/dx) is digitized using a dual-range FADC for each channel. Eight bits of dynamic range with six bits of accuracy are achieved with the dual-range. Eight complete channels of timing and amplitude information are multiplexed into one DRAM (Dynamic Random Access Memory) trigger latency buffer. Interesting events are subsequently transferred into an SRAM (Static Random Access Memory) readout buffer before the latency time has expired. The design has been optimized to achieve the requisite resolution using the smallest area and lowest power. The circuit has been implemented in an 0.8 microm triple metal CMOS process. The measured results indicate that the differential non-linearities of the TDC and the FADC are 200 ps and 10 mV, respectively. The integral nonlinearities of the TDC and the FADC are 230 ps and 9 mV, respectively

BATS, the readout control of UA1

Energy Technology Data Exchange (ETDEWEB)

Botlo, M.; Dorenbosch, J.; Jimack, M.; Szoncso, F.; Taurok, A.; Walzel, G. (European Organization for Nuclear Research, Geneva (Switzerland))

1991-04-15

A steadily rising luminosity and different readout architectures for the various detector systems of UA1 required a new data flow control to minimize the dead time. BATS, a finite state machine conceived around two microprocessors in a single VME crate, improved flexibility and reliability. Compatibility with BATS streamlined all readout branches. BATS also proved to be a valuable asset in spotting readout problems and previously undetected data flow bottlenecks. (orig.).

Results from CHIPIX-FE0, a Small-Scale Prototype of a New Generation Pixel Readout ASIC in 65 nm CMOS for HL-LHC

CERN Document Server

Pacher, L.; Demaria, N.; Rivetti, A.; Da Rocha Rolo, M.; Dellacasa, G.; Mazza, G.; Rotondo, F.; Wheadon, R.; Paternò, A.; Panati, S.; Loddo, F.; Licciulli, F.; Ciciriello, F.; Marzocca, C.; Gaioni, L.; Traversi, G.; Re, V.; De Canio, F.; Ratti, L.; Marconi, S.; Placidi, P.; Magazzù, G.; Stabile, A.; Mattiazzo, S.

2018-01-01

A prototype of a new-generation readout ASIC targeting High-Luminosity (HL) LHC pixel detector upgrades has been designed and fabricated as part of the Italian INFN CHIPIX65 project using a commercial 65 nm CMOS technology. This demonstrator, hereinafter referred to as CHIPIX-FE0, is composed of a matrix of 64 × 64 pixels with 50 μm × 50 μm pixel size embedding two different architectures of analog front-ends working in parallel. The final layout of the chip was submitted and accepted for fabrication on July 2016. Chips were received back from the foundry on October 2016 and successfully characterized before irradiation. Several irra- diation campaigns with X-rays have been accomplished during 2017 at Padova INFN and CERN EP/ESE facilities under different uniformity and temperature conditions up to 630 Mrad Total Ionizing Dose (TID). These studies corfirmed negligible degradation of analog front-ends per- formance after irradiation. First sample chips have been also bump-bonded to 50 μm × 50 μm and sin...

Evolution of the dual-readout calorimeter

Indian Academy of Sciences (India)

... a calorimeter system of a relatively simple construction and moderate costs, however with excellent properties, built upon experience gained with the extensively beam-tested DREAM (Dual REAdout. Module) prototype. The main idea of multiple readout calorimetry is to indepen- dently measure for each hadronic shower ...

Toward a reduced-wire readout system for ultrasound imaging.

Science.gov (United States)

Lim, Jaemyung; Arkan, Evren F; Degertekin, F Levent; Ghovanloo, Maysam

2014-01-01

We present a system-on-a-chip (SoC) for use in high-frequency capacitive micromachined ultrasonic transducer (CMUT) imaging systems. This SoC consists of trans-impedance amplifiers (TIA), delay locked loop (DLL) based clock multiplier, quadrature sampler, and pulse width modulator (PWM). The SoC down converts RF echo signal to baseband by quadrature sampling which facilitates modulation. To send data through a 1.6 m wire in the catheter which has limited bandwidth and is vulnerable to noise, the SoC creates a pseudo-digital PWM signal which can be used for back telemetry or wireless readout of the RF data. In this implementation, using a 0.35-μm std. CMOS process, the TIA and single-to-differential (STD) converter had 45 MHz bandwidth, the quadrature sampler had 10.1 dB conversion gain, and the PWM had 5-bit ENoB. Preliminary results verified front-end functionality, and the power consumption of a TIA, STD, quadrature sampler, PWM, and clock multiplier was 26 mW from a 3 V supply.

How good is better? A comparison between the Medipix1 and the Medipix2 chip using mammographic phantoms

International Nuclear Information System (INIS)

Pfeiffer, K.F.G.

2003-01-01

Full text: The Mixed-up chip is the successor to the Medipix 1 chip and was also developed within the framework of the Medipix Colaboration. Both chips are pixel detector readout chips working in single photon counting mode and are designed for direct conversion X-ray imaging, for which they are bump-bonded to a pixelated semiconductor sensor layer. Both assemblies used in this comparison have a 300 μm thick sensor layer made of silicon. The main changes realized in the second chip generation are the smaller pixel size of 55 μm x 55 μm, the larger number of pixels (256 x 256) and a second adjustable energy threshold which facilitates energy windowing. For comparing the two detector generations, mammographic phantoms and a suitable X-ray tube have been used. By imaging selected parts of the phantoms with both detectors under the same conditions it is possible to make a direct comparison between the imaging properties of both chips. Main aspects of the experiments were the resolution of high-contrast details and low-contrast imaging. To provide a reference point for image quality the phantoms were also imaged using standard clinical equipment. Since these measurements have been made without an anti-scatter grid, additional simulations have been performed to estimate the influence of scattered photons on the image quality

FPGA-based upgrade of the read-out electronics for the low energy polarimeter at the cooler synchrotron

Energy Technology Data Exchange (ETDEWEB)

Hempelmann, Nils [Institut fuer Kernphysik, Forschungszentrum Juelich (Germany); Collaboration: JEDI-Collaboration

2015-07-01

The Cooler Synchrotron (COSY) is a storage ring used for experiments with polarized proton and deuteron beams. The low energy polarimeter is used to determine the vector and tensor polarization of the beam before injection at kinetic energies up to 45 MeV for protons and 75 MeV for deuterons. The polarimeter uses scintillators to measure the energy of both outgoing particles of a scattering reaction and the time between their detection. The present read-out electronics consists of analog NIM modules and is limited in terms of time resolution and the capability for online data analysis. The read-out electronics will be replaced with a a new system based on analog pulse sampling and an FPGA chip for logic operations. The new system will be able to measure the time at which particles arrive to a precision better than 50 ps, facilitating better background reduction using coincidence measurement. In addition to measuring the beam polarization, the system will be used to precisely determine the vector and tensor analyzing powers for deuteron scattering off carbon at a kinetic energy of 75 MeV.

Zero Suppression with Scalable Readout System (SRS) and APV25 FE Chip

CERN Document Server

Goentoro, Steven Lukas

2015-01-01

Zero suppression is a very useful algorithm in data acquisition and transfer. In this report, I would like to present the basic procedures of the application of Zero Suppression in the ordinary DAQ system that we have ( Date and Amore)

arXiv Planar n-in-n quad module prototypes for the ATLAS ITk upgrade at HL-LHC

CERN Document Server

Gisen, A.; Burmeister, I.; Gößling, C.; Klingenberg, R.; Kröninger, K.; Lönker, J.; Weers, M.; Wizemann, F.

2017-12-15

In order to meet the requirements of the High Luminosity LHC (HL-LHC), it will be necessary to replace the current tracker of the ATLAS experiment. Therefore, a new all-silicon tracking detector is being developed, the so-called Inner Tracker (ITk). The use of quad chip modules is intended in its pixel region. These modules consist of a silicon sensor that forms a unit along with four read-out chips. The current ATLAS pixel detector consists of planar n-in-n silicon pixel sensors. Similar sensors and four FE-I4 read-out chips were assembled to first prototypes of planar n-in-n quad modules. The main focus of the investigation of these modules was the region between the read-out chips, especially the central area between all four read-out chips. There are special pixel cells placed on the sensor which cover the gap between the read-out chips. This contribution focuses on the characterization of a non-irradiated device, including important sensor characteristics, charge collection determined with radioactive so...

A 130 nm ASIC prototype for the NA62 Gigatracker readout

Energy Technology Data Exchange (ETDEWEB)

Dellacasa, G., E-mail: gdellaca@to.infn.it [I.N.F.N. sez. Torino, via Giuria 1, 10125 Torino (Italy); Garbolino, S. [Universita degli Studi di Torino, Dip. Fisica Sperimentale, via Giuria 1, 10125 Torino (Italy); Marchetto, F. [I.N.F.N. sez. Torino, via Giuria 1, 10125 Torino (Italy); Martoiu, S. [I.N.F.N. sez. Torino, via Giuria 1, 10125 Torino (Italy); CERN CH-1211, Geneve 23 (Switzerland); Mazza, G.; Rivetti, A.; Wheadon, R. [I.N.F.N. sez. Torino, via Giuria 1, 10125 Torino (Italy)

2011-09-11

One of the most challenging detectors of the NA62 experiment is the silicon tracker, called Gigatracker. It consists of three hybrid silicon pixel stations, each one covering an area of 27 mmx60 mm. While the maximum pixel size is fairly large, 300{mu}mx300{mu}m the system has to sustain a very high particle rate, 1.5 MHz/mm{sup 2}, which corresponds to 800 MHz for each station. To obtain an efficient tracking with such a high rate the required track timing resolution is 150 ps (rms). Therefore the front-end ASIC should provide for each pixel a 200 ps time measurement capability, thus leading to the requirement of time walk compensation and very compact TDCs. Moreover, Single Event Upset protection has to be implemented in order to protect the digital circuitry. An ASIC prototype has been realized in CMOS 130 nm technology, containing three pixel columns. The chip performs the time walk compensation by a Constant Fraction Discriminator circuit, while the time measurement is performed by a Time to Amplitude Converter based TDC, both of them implemented on each pixel cell. The End of Column circuit containing only digital logic is responsible for the data readout from the pixel cell. The whole chip works with a system clock of 160 MHz and the digital logic is SEU protected by the use of Hamming codes. The detailed architecture of the ASIC prototype and test results are presented.

The ALPIDE pixel sensor chip for the upgrade of the ALICE Inner Tracking System

CERN Document Server

Aglieri Rinella, Gianluca

2017-01-01

The ALPIDE chip is a CMOS Monolithic Active Pixel Sensor being developed for the Upgrade of the ITS of the ALICE experiment at the CERN Large Hadron Collider. The ALPIDE chip is implemented with a 180 nm CMOS Imaging Process and fabricated on substrates with a high-resistivity epitaxial layer. It measures 15 mm×30 mm and contains a matrix of 512×1024 pixels with in-pixel amplification, shaping, discrimination and multi-event buffering. The readout of the sensitive matrix is hit driven. There is no signaling activity over the matrix if there are no hits to read out and power consumption is proportional to the occupancy. The sensor meets the experimental requirements of detection efficiency above 99%, fake-hit probability below 10−5 and a spatial resolution of 5 μm. The capability to read out Pb–Pb interactions at 100 kHz is provided. The power density of the ALPIDE chip is projected to be less than 35 mW/cm2 for the application in the Inner Barrel Layers and below 20 mW/cm2 for the Outer Barrel Layers, ...

Firmware development and testing of the ATLAS IBL Readout Driver card

CERN Document Server

Chen, S; The ATLAS collaboration

2014-01-01

The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector is inserting an additional inner layer called Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL’s off-detector DAQ system. The strategy for IBLROD firmware development focused on migrating and tailoring HDL code blocks from PixelROD to ensure modular compatibility in future ROD upgrades, in which a unified code version will interface with IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBLDAQ testbench using realistic frontend chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBLROD data path implementation, tested in testbench and on ROD prototypes, will be report...

Fully Automated On-Chip Imaging Flow Cytometry System with Disposable Contamination-Free Plastic Re-Cultivation Chip

Directory of Open Access Journals (Sweden)

Tomoyuki Kaneko

2011-06-01

Full Text Available We have developed a novel imaging cytometry system using a poly(methyl methacrylate (PMMA based microfluidic chip. The system was contamination-free, because sample suspensions contacted only with a flammable PMMA chip and no other component of the system. The transparency and low-fluorescence of PMMA was suitable for microscopic imaging of cells flowing through microchannels on the chip. Sample particles flowing through microchannels on the chip were discriminated by an image-recognition unit with a high-speed camera in real time at the rate of 200 event/s, e.g., microparticles 2.5 μm and 3.0 μm in diameter were differentiated with an error rate of less than 2%. Desired cells were separated automatically from other cells by electrophoretic or dielectrophoretic force one by one with a separation efficiency of 90%. Cells in suspension with fluorescent dye were separated using the same kind of microfluidic chip. Sample of 5 μL with 1 × 106 particle/mL was processed within 40 min. Separated cells could be cultured on the microfluidic chip without contamination. The whole operation of sample handling was automated using 3D micropipetting system. These results showed that the novel imaging flow cytometry system is practically applicable for biological research and clinical diagnostics.

Design of analog front-ends for the RD53 demonstrator chip

CERN Document Server

Gaioni, L; Nodari, B; Manghisoni, M; Re, V; Traversi, G; Barbero, M B; Fougeron, D; Gensolen, F; Godiot, S; Menouni, M; Pangaud, P; Rozanov, A; Wang, A; Bomben, M; Calderini, G; Crescioli, F; Le Dortz, O; Marchiori, G; Dzahini, D; Rarbi, F E; Gaglione, R; Gonella, L; Hemperek, T; Huegging, F; Karagounis, M; Kishishita, T; Krueger, H; Rymaszewski, P; Wermes, N; Ciciriello, F; Corsi, F; Marzocca, C; De Robertis, G; Loddo, F; Licciulli, F; Andreazza, A; Liberali, V; Shojaii, S; Stabile, A; Bagatin, M; Bisello, D; Mattiazzo, S; Ding, L; Gerardin, S; Giubilato, P; Neviani, A; Paccagnella, A; Vogrig, D; Wyss, J; Bacchetta, N; Della Casa, G; Demaria, N; Mazza, G; Rivetti, A; Da Rocha Rolo, M D; Comotti, D; Ratti, L; Vacchi, C; Beccherle, R; Bellazzini, R; Magazzu, G; Minuti, M; Morsani, F; Palla, F; Poulios, S; Fanucci, L; Rizzi, A; Saponara, S; Androsov, K; Bilei, G M; Menichelli, M; Conti, E; Marconi, S; Passeri, D; Placidi, P; Monteil, E; Pacher, L; Paternò, A; Gajanana, D; Gromov, V; Hessey, N; Kluit, R; Zivkovic, V; Havranek, M; Janoska, Z; Marcisovsky, M; Neue, G; Tomasek, L; Kafka, V; Sicho, P; Vrba, V; Vila, I; Lopez-Morillo, E; Aguirre, M A; Palomo, F R; Muñoz, F; Abbaneo, D; Christiansen, J; Dannheim, D; Dobos, D; Linssen, L; Pernegger, H; Valerio, P; Alipour Tehrani, N; Bell, S; Prydderch, M L; Thomas, S; Christian, D C; Fahim, F; Hoff, J; Lipton, R; Liu, T; Zimmerman, T; Garcia-Sciveres, M; Gnani, D; Mekkaoui, A; Gorelov, I; Hoeferkamp, M; Seidel, S; Toms, K; De Witt, J N; Grillo, A

2017-01-01

The RD53 collaboration is developing a large scale pixel front-end chip, which will be a tool to evaluate the performance of 65 nm CMOS technology in view of its application to the readout of the innermost detector layers of ATLAS and CMS at the HL-LHC. Experimental results of the characterization of small prototypes will be discussed in the frame of the design work that is currently leading to the development of the large scale demonstrator chip RD53A to be submitted in early 2017. The paper is focused on the analog processors developed in the framework of the RD53 collaboration, including three time over threshold front-ends, designed by INFN Torino and Pavia, University of Bergamo and LBNL and a zero dead time front-end based on flash ADC designed by a joint collaboration between the Fermilab and INFN. The paper will also discuss the radiation tolerance features of the front-end channels, which were exposed to up to 800 Mrad of total ionizing dose to reproduce the system operation in the actual experiment.

SENSROC4: An Multichannel Low-Noise Front-End Readout ASIC Dedicated to CZT Detectors for PET Imaging

International Nuclear Information System (INIS)

Gao, W.; Liu, H.; Gao, D.; Gan, B.; Wei, T.; Hu, Y.

2013-06-01

In this paper, we present the design of a novel low-noise front-end readout application-specific integrated circuit (ASIC) for our small animal PET systems which objective is to achieve the following performances, the spatial resolution of 1 mm 3 , the detection efficiency of 15 % and the time resolution of 1 ns. A cascade amplifier based on the PMOS input transistor is selected to realize the charge-sensitive amplifier (CSA) for the sake of good noise performances. The output of the CSA is split into two branches. One is connected to a slow shaper for energy measurements. The other is connected to a fast shaper for time acquisition. A novel monostable circuit is designed to adjust the time delay of the trigger signals so that the peak value of the shaped voltages can be sampled and stored. Based on the above techniques, an eight-channel front-end readout prototype chip is designed and implemented in 0.35 μm CMOS process. The die size is 2.286 mm x 2.282 mm. The input range of the ASIC is from 2000 e- to 180000 e-, reflecting to the energy of the gamma ray from 11.2 keV to 1 MeV. The gain of the readout channel is 65 V/pC. The best test result of ENC is 86.5 e- at zero farad plus 9.3 e- per pico-farad. The nonlinearity is less than 3 %. The crosstalk is less than 2 %. The power dissipation is about 9 mW/channel (authors)

A fast one-chip event-preprocessor and sequencer for the Simbol-X Low Energy Detector

Science.gov (United States)

Schanz, T.; Tenzer, C.; Maier, D.; Kendziorra, E.; Santangelo, A.

2010-12-01

We present an FPGA-based digital camera electronics consisting of an Event-Preprocessor (EPP) for on-board data preprocessing and a related Sequencer (SEQ) to generate the necessary signals to control the readout of the detector. The device has been originally designed for the Simbol-X low energy detector (LED). The EPP operates on 64×64 pixel images and has a real-time processing capability of more than 8000 frames per second. The already working releases of the EPP and the SEQ are now combined into one Digital-Camera-Controller-Chip (D3C).

A fast one-chip event-preprocessor and sequencer for the Simbol-X Low Energy Detector

Energy Technology Data Exchange (ETDEWEB)

Schanz, T., E-mail: schanz@astro.uni-tuebingen.d [Kepler Center for Astro- and Particlephysics, Institut fuer Astronomie und Astrophysik Tuebingen, Sand 1, 72076 Tuebingen (Germany); Tenzer, C., E-mail: tenzer@astro.uni-tuebingen.d [Kepler Center for Astro- and Particlephysics, Institut fuer Astronomie und Astrophysik Tuebingen, Sand 1, 72076 Tuebingen (Germany); Maier, D.; Kendziorra, E.; Santangelo, A. [Kepler Center for Astro- and Particlephysics, Institut fuer Astronomie und Astrophysik Tuebingen, Sand 1, 72076 Tuebingen (Germany)

2010-12-11

We present an FPGA-based digital camera electronics consisting of an Event-Preprocessor (EPP) for on-board data preprocessing and a related Sequencer (SEQ) to generate the necessary signals to control the readout of the detector. The device has been originally designed for the Simbol-X low energy detector (LED). The EPP operates on 64x64 pixel images and has a real-time processing capability of more than 8000 frames per second. The already working releases of the EPP and the SEQ are now combined into one Digital-Camera-Controller-Chip (D3C).

A fast one-chip event-preprocessor and sequencer for the Simbol-X Low Energy Detector

International Nuclear Information System (INIS)

Schanz, T.; Tenzer, C.; Maier, D.; Kendziorra, E.; Santangelo, A.

2010-01-01

We present an FPGA-based digital camera electronics consisting of an Event-Preprocessor (EPP) for on-board data preprocessing and a related Sequencer (SEQ) to generate the necessary signals to control the readout of the detector. The device has been originally designed for the Simbol-X low energy detector (LED). The EPP operates on 64x64 pixel images and has a real-time processing capability of more than 8000 frames per second. The already working releases of the EPP and the SEQ are now combined into one Digital-Camera-Controller-Chip (D3C).

Search for second generation leptoquarks in $\\sqrt{s}$ = 1.8-TeV $p^-$ pbar at CDF and silicon detector readout electronics development with ATLAS

Energy Technology Data Exchange (ETDEWEB)

Kambara, Hisanori [Geneva U.

1998-02-01

In this thesis, a search for second generation leptoquark is presented. It is based on the data collected at the Collider Detector at Fermilab with the Tevatron proton-antiproton collisions of $\\sqrt{s}$ = 1.8 TeV. A total integrated luminosity of 110 pb-1 collected during runs in 1992-1995 is used. The search was performed on the charged dimuon plus dijet channel. No evidence for existence of leptoquark was found, and a new production cross section limit is set as a result of this analysis. Using the most recent theoretical calculation of pair leptoquark production [1], a new lower mass limit for second generation scalar leptoquark is extracted. The new limit excludes M(LQ2)< 202 GeV/c2. The Large Hadron Collider (LHC), a proton-proton collider with a center of mass energy ($\\sqrt{s}$) of 14 TeV, is currently under the construction at CERN. It will be utilised to extend the searches for the leptoquarks to higher mass regions. As in CDF, tracking detectors are essential to identify charged leptons decaying from leptoquarks. A silicon strip tracking detector is being developed for the ATLAS experiment. A dense and fast readout system with a good signal to noise ratio and low power consumption are required with high luminosity and short event collision interval (25 ns) expected at the LHC. A description of a prototype front-end micro-electronic chip, the ADAM, for silicon strip detector readout application is presented. Results from a complete laboratory test as well as its performance on a test beam at CERN are reported.

The PAUCam readout electronics system

Science.gov (United States)

Jiménez, Jorge; Illa, José M.; Cardiel-Sas, Laia; de Vicente, Juan; Castilla, Javier; Casas, Ricard

2016-08-01

The PAUCam is an optical camera with a wide field of view of 1 deg x 1 deg and up to 46 narrow and broad band filters. The camera is already installed on the William Herschel Telescope (WHT) in the Canary Islands, Spain and successfully commissioned during the first period of 2015. The paper presents the main results from the readout electronics commissioning tests and include an overview of the whole readout electronics system, its configuration and current performance.

Experiment list: SRX212457 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available apiens; ChIP-Seq source_name=CD4+CD25+CD45RA- expanded memory regulatory T cells || donor=C || cell type=CD4...+CD25+CD45RA- expanded memory regulatory T cells || chip antibody=H3K27ac (abcam

Experiment list: SRX212463 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available sapiens; ChIP-Seq source_name=CD4+CD25-CD45RA- expanded memory conventional T cells || donor=C || cell type...=CD4+CD25-CD45RA- expanded memory conventional T cells || chip antibody=H3K4me1 (

Rutherford X-ray spectrometer readout

International Nuclear Information System (INIS)

Bateman, J.E.

1978-07-01

Rutherford electronic X-ray spectrometer readout is based on the combination of two established techniques (a) the detection and location of soft X-rays by means of multichannel electron multiplier arrays (MCP's), and (b) the electronic readout of charge distributions (generally in multi-wire proportional counters) by means of the delay line techniques. In order for the latter device to function well a charge signal of approximately 10 6 electrons must be available to the delay line wand. This is achieved in the present device by means of two cascaded MCP's which can produce electron gains up to approximately 10 8 , and so operate the delay line from the single electron pulses generated at the front face of an MCP by a soft X-ray. The delay line readout technique was chosen because of its simplicity (both in terms of the necessary hardware and the associated electronics), robustness, and ease of implementation. In order to achieve the target spatial resolution of 50 μm (fwhm) or 20 μm (standard deviation) it was necessary to adapt the charge collection system so that the readout takes place from a length of delay line 200 mm long. The general layout of the system and the functions of the electronic circuits are described. Performance testing, setting up procedures and trouble shooting of the system are discussed. (U.K.)

D-Zero muon readout electronics design

International Nuclear Information System (INIS)

Baldin, B.; Hansen, S.; Los, S.; Matveev, M.; Vaniev, V.

1996-11-01

The readout electronics designed for the D null Muon Upgrade are described. These electronics serve three detector subsystems and one trigger system. The front-ends and readout hardware are synchronized by means of timing signals broadcast from the D null Trigger Framework. The front-end electronics have continuously running digitizers and two levels of buffering resulting in nearly deadtimeless operation. The raw data is corrected and formatted by 16- bit fixed point DSP processors. These processors also perform control of the data buffering. The data transfer from the front-end electronics located on the detector platform is performed by serial links running at 160 Mbit/s. The design and test results of the subsystem readout electronics and system interface are discussed

Flexible high-speed FASTBUS master for data read-out and preprocessing

International Nuclear Information System (INIS)

Wurz, A.; Manner, R.

1990-01-01

This paper describes a single slot FASTBUS master module. It can be used for read-out and preprocessing of data that are read out from FASTBUS modules, e.g., and ADC system. The module consists of a 25 MHz, 32-bit processor MC 68030 with cache memory and memory management, a floating point coprocessor MC68882, 4 MBytes of main memory, and FASTBUS master and slave interfaces. In addition, a DMA controller for read-out of FASTBUS data is provided. The processor allows I/O via serial ports, a 16-bit parallel port, and a transputer link. Additional interfaces are planned. The main memory is multi-ported and can be accessed directly by the CPU, the FASTBUS, and external masters via the high-speed local bus that is accessible by way of a connector. The FASTBUS interface supports most of the standard operations in master and slave mode

Experiment list: SRX212459 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available o sapiens; ChIP-Seq source_name=CD4+CD25-CD45RA- expanded memory conventional T cells || donor=C || cell typ...e=CD4+CD25-CD45RA- expanded memory conventional T cells || chip antibody=H3K27ac

Experiment list: SRX212458 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available sapiens; ChIP-Seq source_name=CD4+CD25+CD45RA- expanded memory regulatory T cells || donor=D || cell type=C...D4+CD25+CD45RA- expanded memory regulatory T cells || chip antibody=H3K27ac (abca

Experiment list: SRX212464 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available o sapiens; ChIP-Seq source_name=CD4+CD25-CD45RA- expanded memory conventional T cells || donor=D || cell typ...e=CD4+CD25-CD45RA- expanded memory conventional T cells || chip antibody=H3K4me1

Experiment list: SRX212460 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available o sapiens; ChIP-Seq source_name=CD4+CD25-CD45RA- expanded memory conventional T cells || donor=D || cell typ...e=CD4+CD25-CD45RA- expanded memory conventional T cells || chip antibody=H3K27ac

Experiment list: SRX212462 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available sapiens; ChIP-Seq source_name=CD4+CD25+CD45RA- expanded memory regulatory T cells || donor=D || cell type=C...D4+CD25+CD45RA- expanded memory regulatory T cells || chip antibody=H3K4me1 (abca

Position readout by charge division in large two-dimensional detectors

International Nuclear Information System (INIS)

Alberi, J.L.

1976-10-01

The improvement in readout spatial resolution for charge division systems with subdivided readout electrodes has been analyzed. This readout forms the position and sum signals by a linear, unambiguous analogue summation technique. It is shown that the readout resolution is a function of only electrode capacitance and shaping parameters. The line width improves as 1/N/sup 1 / 2 /, where N is the number of electrode subdivisions

Planar n-in-n quad module prototypes for the ATLAS ITk upgrade at HL-LHC

Science.gov (United States)

Gisen, A.; Altenheiner, S.; Burmeister, I.; Gößling, C.; Klingenberg, R.; Kröninger, K.; Lönker, J.; Weers, M.; Wizemann, F.

2017-12-01

In order to meet the requirements of the High Luminosity LHC (HL-LHC), it will be necessary to replace the current tracker of the ATLAS experiment. Therefore, a new all-silicon tracking detector is being developed, the so-called Inner Tracker (ITk). The use of quad chip modules is intended in its pixel region. These modules consist of a silicon sensor that forms a unit along with four read-out chips. The current ATLAS pixel detector consists of planar n-in-n silicon pixel sensors. Similar sensors and four FE-I4 read-out chips were assembled to first prototypes of planar n-in-n quad modules. The main focus of the investigation of these modules was the region between the read-out chips, especially the central area between all four read-out chips. There are special pixel cells placed on the sensor which cover the gap between the read-out chips. This contribution focuses on the characterization of a non-irradiated device, including important sensor characteristics, charge collection determined with radioactive sources as well as hit efficiency measurements, performed in the laboratory and at testbeams. In addition, first laboratory results of an irradiated device are presented.

Offset correction system for 128-channel self-triggering readout chip with in-channel 5-bit energy measurement functionality

Energy Technology Data Exchange (ETDEWEB)

Otfinowski, P., E-mail: potfin@agh.edu.pl; Grybos, P.; Szczygiel, R.; Kasinski, K.

2015-04-21

We report on a novel, two-stage 8-bit trimming solution dedicated for multichannel systems with reduced trim DAC area occupancy. The presented design was used for comparator offset correction in a 128-channel particle tracking, self-triggering readout system and manufactured in 180 nm CMOS process. The 8-bit trim DAC has a range of ±165 mV, current consumption of 3.2 µA and occupies an area of 37 µm×17 µm in each channel, which corresponds to a 6-bit conventional current steering DAC with similar linearity.

Hybrid amplifier for calorimetry with photodiode readout

Energy Technology Data Exchange (ETDEWEB)

Sushkov, V V

1994-12-31

A hybrid surface mounted amplifier for the photodiode readout of the EM calorimeter has been developed. The main technical characteristics of the design are presented. The design able to math readout constraints for a high luminosity collider experiment is discussed. 10 refs., 2 tabs., 8 figs.

Experiment list: SRX212461 [Chip-atlas[Archive

Lifescience Database Archive (English)

Full Text Available iens; ChIP-Seq source_name=CD4+CD25+CD45RA- expanded memory regulatory T cells || donor=C || cell type=CD4+CD25+CD45RA- expanded memo...ry regulatory T cells || chip antibody=H3K4me1 (abcam ab

Linearity enhancement design of a 16-channel low-noise front-end readout ASIC for CdZnTe detectors

International Nuclear Information System (INIS)

Zeng, Huiming; Wei, Tingcun; Wang, Jia

2017-01-01

A 16-channel front-end readout application-specific integrated circuit (ASIC) with linearity enhancement design for cadmium zinc telluride (CdZnTe) detectors is presented in this paper. The resistors in the slow shaper are realized using a high-Z circuit to obtain constant resistance value instead of using only a metal–oxide–semiconductor (MOS) transistor, thus the shaping time of the slow shaper can be kept constant for different amounts of input energies. As a result, the linearity of conversion gain is improved significantly. The ASIC was designed and fabricated in a 0.35 µm CMOS process with a die size of 2.60 mm×3.53 mm. The tested results show that a typical channel provides an equivalent noise charge (ENC) of 109.7e − +16.3e − /pF with a power consumption of 4 mW and achieves a conversion gain of 87 mV/fC with a nonlinearity of <0.4%. The linearity of conversion gain is improved by at least 86.6% as compared with the traditional approaches using the same front-end readout architecture and manufacture process. Moreover, the inconsistency among channels is <0.3%. An energy resolution of 2.975 keV (FWHM) for gamma rays of 59.5 keV was measured by connecting the ASIC to a 5 mm×5 mm ×2 mm CdZnTe detector at room temperature. The front-end readout ASIC presented in this paper achieves an outstanding linearity performance without compromising the noise, power consumption, and chip size performances.

Linearity enhancement design of a 16-channel low-noise front-end readout ASIC for CdZnTe detectors

Energy Technology Data Exchange (ETDEWEB)

Zeng, Huiming; Wei, Tingcun, E-mail: weitc@nwpu.edu.cn; Wang, Jia

2017-03-01

A 16-channel front-end readout application-specific integrated circuit (ASIC) with linearity enhancement design for cadmium zinc telluride (CdZnTe) detectors is presented in this paper. The resistors in the slow shaper are realized using a high-Z circuit to obtain constant resistance value instead of using only a metal–oxide–semiconductor (MOS) transistor, thus the shaping time of the slow shaper can be kept constant for different amounts of input energies. As a result, the linearity of conversion gain is improved significantly. The ASIC was designed and fabricated in a 0.35 µm CMOS process with a die size of 2.60 mm×3.53 mm. The tested results show that a typical channel provides an equivalent noise charge (ENC) of 109.7e{sup −}+16.3e{sup −}/pF with a power consumption of 4 mW and achieves a conversion gain of 87 mV/fC with a nonlinearity of <0.4%. The linearity of conversion gain is improved by at least 86.6% as compared with the traditional approaches using the same front-end readout architecture and manufacture process. Moreover, the inconsistency among channels is <0.3%. An energy resolution of 2.975 keV (FWHM) for gamma rays of 59.5 keV was measured by connecting the ASIC to a 5 mm×5 mm ×2 mm CdZnTe detector at room temperature. The front-end readout ASIC presented in this paper achieves an outstanding linearity performance without compromising the noise, power consumption, and chip size performances.

Characterisation of the NA62 GigaTracker end of column readout ASIC

International Nuclear Information System (INIS)

Noy, M; Rinella, G Aglieri; Fiorini, M; Jarron, P; Kaplon, J; Kluge, A; Morel, M; Perktold, L; Riedler, P; Martin, E

2011-01-01

The architecture and characterisation of the End Of Column demonstrator readout ASIC for the NA62 GigaTracker hybrid pixel detector is presented. This ASIC serves as a proof of principle for a pixel chip with 1800 pixels which must perform time stamping to better than 200 ps (RMS), provide 300 μm pitch position information and operate with a dead-time of 1% or less for 800 MHz-1 GHz beam rate. The demonstrator ASIC comprises a full test column with 45 pixels alongside other test structures. The timewalk correction mechanism employed is measurement of the time-over-threshold, coupled with an off-detector look-up table. The time to digital converter is a delay locked loop with 32 contributing delay cells fed with a 320 MHz to yield a nominal bin size of 97 ps. Recently, P-in-N sensors have been bump-bonded to the ASIC and characterisation of these assemblies has begun.

Firmware development and testing of the ATLAS IBL Read-Out Driver card

CERN Document Server

Chen, S-P; The ATLAS collaboration; Falchieri, D; Gabrielli, A; Hauck, S; Hsu, S-C; Kretz, M; Kugel, A; Travaglini, R; Wensing, M

2014-01-01

The ATLAS Experiment is reworking and upgrading systems during the current LHC shutdown. In particular, the Pixel detector is inserting an additional inner layer called Insertable B-Layer (IBL). The Read-Out Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL’s off-detector DAQ system. The strategy for IBL ROD firmware development focused on migrating and tailoring HDL code blocks from Pixel ROD to ensure modular compatibility in future ROD upgrades, in which a unified code version will interface with IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBL DAQ testbench using a realistic frontend chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBL ROD data path implementation, tested in testbench and on ROD prototypes, will be ...

IDeF-X ECLAIRs: A CMOS ASIC for the Readout of CdTe and CdZnTe Detectors for High Resolution Spectroscopy

International Nuclear Information System (INIS)

Gevin, O.; Baron, P.; Coppolani, X.; Delagnes, E.; Lugiez, F.; Daly, F.; Limousin, O.; Meuris, A.; Pinsard, F.; Renaud, D.

2009-01-01

The very last member of the IDeF-X ASIC family is presented: IDeF-X ECLAIRs is a 32-channel front end ASIC designed for the readout of Cadmium Telluride (CdTe) and Cadmium Zinc Telluride (CdZnTe) Detectors. Thanks to its noise performance (Equivalent Noise Charge floor of 33 e - rms) and to its radiation hardened design (Single Event Latch-up Linear Energy Transfer threshold of 56 MeV.cm 2 .mg -1 ), the chip is well suited for soft X-rays energy discrimination and high energy resolution, 'space proof', hard X-ray spectroscopy. We measured an energy low threshold of less than 4 keV with a 10 pF input capacitor and a minimal reachable sensitivity of the Equivalent Noise Charge (ENC) to input capacitance of less than 7e - /pF obtained with a 6 μs peak time. IDeF-X ECLAIRs will be used for the readout of 6400 CdTe Schottky mono-pixel detectors of the 2D coded mask imaging telescope ECLAIRs aboard the SVOM satellite. IDeF-X ECLAIRs (or IDeF-X V2) has also been designed for the readout of a pixelated CdTe detector in the miniature spectro-imager prototype Caliste 256 that is currently foreseen for the high energy detector module of the Simbol-X mission. (authors)

IDeF-X ECLAIRs: A CMOS ASIC for the Readout of CdTe and CdZnTe Detectors for High Resolution Spectroscopy

Science.gov (United States)

Gevin, Olivier; Baron, Pascal; Coppolani, Xavier; Daly, FranÇois; Delagnes, Eric; Limousin, Olivier; Lugiez, Francis; Meuris, Aline; Pinsard, FrÉdÉric; Renaud, Diana

2009-08-01

The very last member of the IDeF-X ASIC family is presented: IDeF-X ECLAIRs is a 32-channel front end ASIC designed for the readout of Cadmium Telluride (CdTe) and Cadmium Zinc Telluride (CdZnTe) Detectors. Thanks to its noise performance (Equivalent Noise Charge floor of 33 e- rms) and to its radiation hardened design (Single Event Latchup Linear Energy Transfer threshold of 56 MeV.cm2.mg-1), the chip is well suited for soft X-rays energy discrimination and high energy resolution, ldquospace proof,rdquo hard X-ray spectroscopy. We measured an energy low threshold of less than 4 keV with a 10 pF input capacitor and a minimal reachable sensitivity of the Equivalent Noise Charge (ENC) to input capacitance of less than 7 e-/pF obtained with a 6 mus peak time. IDeF-X ECLAIRs will be used for the readout of 6400 CdTe Schottky monopixel detectors of the 2D coded mask imaging telescope ECLAIRs aboard the SVOM satellite. IDeF-X ECLAIRs (or IDeF-X V2) has also been designed for the readout of a pixelated CdTe detector in the miniature spectro-imager prototype Caliste 256 that is currently foreseen for the high energy detector module of the Simbol-X mission.

100 Gbps PCI-Express readout for the LHCb upgrade

International Nuclear Information System (INIS)

Durante, P.; Neufeld, N.; Schwemmer, R.; Balbi, G.; Marconi, U.

2015-01-01

We present a new data acquisition system under development for the next upgrade of the LHCb experiment at CERN. We focus in particular on the design of a new generation of readout boards, the PCIe40, and on the viability of PCI-Express as an interconnect technology for high speed readout. We show throughput measurements across the PCI-Express bus, on Altera Stratix 5 devices, using a DMA mechanism and different synchronization schemes between the FPGA and the readout unit. Finally we discuss hardware and software design considerations necessary to achieve a data throughput of 100 Gbps in the final readout board

Evaluation of Irradiated Barrel Detector Modules for the Upgrade of the CMS Pixel Detector

CERN Document Server

Sibille, Jennifer Ann

2013-01-01

Prototype detector modules comprising sensors and the new readout chips were assembled and irradiated with protons at the CERN PS, and readout chips without sensors have been irradiated with protons at the Karls...

Implementation of the ASDBLR straw tube readout ASIC in DMILL technology

CERN Document Server

Dressnandt, N; Newcomer, F M; Van Berg, R; Williams, H H

2001-01-01

The ASDBLR ASIC provides eight channels of low noise, low power, high rate on-detector readout suitable for the ATLAS Transition Radiation Tracker (TRT) at the LHC. The TRT's unprecedented wire chamber readout requirements of a maximum hit rate per wire of 20MHz and double pulse resolution of similar to 25ns with position resolution of better than 150mum in a high radiation environment have been addressed in the design of the ASDBLR. A carefully tuned ion tail cancellation stage followed by an output sensing baseline restorer implemented in differential structures provides robust signal processing combination compatible with the realities of ASIC design. Two comparators track the output of the signal processing stage to provide Tracking information from charged particles and evidence of higher energy Transition Radiation (TR) photons; their outputs are summed as current steps to form a differential ternary output. The ten year total dose requirement for neutrons of 10**1**4 n/cm**2 and 1.5 MRad of ionizing ra...

ReseqChip: Automated integration of multiple local context probe data from the MitoChip array in mitochondrial DNA sequence assembly

Directory of Open Access Journals (Sweden)

Spang Rainer

2009-12-01

Full Text Available Abstract Background The Affymetrix MitoChip v2.0 is an oligonucleotide tiling array for the resequencing of the human mitochondrial (mt genome. For each of 16,569 nucleotide positions of the mt genome it holds two sets of four 25-mer probes each that match the heavy and the light strand of a reference mt genome and vary only at their central position to interrogate all four possible alleles. In addition, the MitoChip v2.0 carries alternative local context probes to account for known mtDNA variants. These probes have been neglected in most studies due to the lack of software for their automated analysis. Results We provide ReseqChip, a free software that automates the process of resequencing mtDNA using multiple local context probes on the MitoChip v2.0. ReseqChip significantly improves base call rate and sequence accuracy. ReseqChip is available at http://code.open-bio.org/svnweb/index.cgi/bioperl/browse/bioperl-live/trunk/Bio/Microarray/Tools/. Conclusions ReseqChip allows for the automated consolidation of base calls from alternative local mt genome context probes. It thereby improves the accuracy of resequencing, while reducing the number of non-called bases.

Chip development in 65 nm CMOS technology for the high luminosity upgrade of the ATLAS pixel detector

Energy Technology Data Exchange (ETDEWEB)

Germic, Leonard; Hemperek, Tomasz; Kishishita, Tetsuichi; Krueger, Hans; Rymaszewski, Piotr; Wermes, Norbert [University of Bonn, Bonn (Germany)

2016-07-01

The LHC High Luminosity upgrade will result in a significant change of environment in which particle detectors are going to operate, especially for devices very close to the interaction point like pixel detector electronics. Challenges arising from the increased hit rate will have to be solved by designing faster and more complex readout electronics that will also have to withstand unprecedented radiation doses. Developing such integrated circuit requires a significant R and D effort and resources, therefore a joint development project between several institutes (including ours) was started. This collaboration, named RD53, aims to develop a pixel readout chip suitable for ATLAS' and CMS' upgrades using a 65nm CMOS technology. During this presentation motivations and benefits of using this very deep-submicron technology are discussed. Most of the talk is allocated to presenting some of the circuits designed by our group (focusing on developments connected to RD53 collaboration), along with their performance measurement results.

The ALPIDE pixel sensor chip for the upgrade of the ALICE Inner Tracking System

Energy Technology Data Exchange (ETDEWEB)

Aglieri Rinella, Gianluca, E-mail: gianluca.aglieri.rinella@cern.ch

2017-02-11

The ALPIDE chip is a CMOS Monolithic Active Pixel Sensor being developed for the Upgrade of the ITS of the ALICE experiment at the CERN Large Hadron Collider. The ALPIDE chip is implemented with a 180 nm CMOS Imaging Process and fabricated on substrates with a high-resistivity epitaxial layer. It measures 15 mm×30 mm and contains a matrix of 512×1024 pixels with in-pixel amplification, shaping, discrimination and multi-event buffering. The readout of the sensitive matrix is hit driven. There is no signaling activity over the matrix if there are no hits to read out and power consumption is proportional to the occupancy. The sensor meets the experimental requirements of detection efficiency above 99%, fake-hit probability below 10{sup −5} and a spatial resolution of 5 μm. The capability to read out Pb–Pb interactions at 100 kHz is provided. The power density of the ALPIDE chip is projected to be less than 35 mW/cm{sup 2} for the application in the Inner Barrel Layers and below 20 mW/cm{sup 2} for the Outer Barrel Layers, where the occupancy is lower. This contribution describes the architecture and the main features of the final ALPIDE chip, planned for submission at the beginning of 2016. Early results from the experimental qualification of full scale prototype predecessors are also reported. - Highlights: • The ALPIDE chip, an innovative CMOS pixel particle detector is described. • It achieves excellent detection performance figures and very low power consumption. • The characterization of prototypes confirms the achievement of the specifications.

Design of the ANTARES LCM-DAQ board test bench using a FPGA-based system-on-chip approach

Energy Technology Data Exchange (ETDEWEB)

Anvar, S. [CEA Saclay, DAPNIA/SEDI, 91191 Gif-sur-Yvette Cedex (France); Kestener, P. [CEA Saclay, DAPNIA/SEDI, 91191 Gif-sur-Yvette Cedex (France)]. E-mail: pierre.kestener@cea.fr; Le Provost, H. [CEA Saclay, DAPNIA/SEDI, 91191 Gif-sur-Yvette Cedex (France)

2006-11-15

The System-on-Chip (SoC) approach consists in using state-of-the-art FPGA devices with embedded RISC processor cores, high-speed differential LVDS links and ready-to-use multi-gigabit transceivers allowing development of compact systems with substantial number of IO channels. Required performances are obtained through a subtle separation of tasks between closely cooperating programmable hardware logic and user-friendly software environment. We report about our experience in using the SoC approach for designing the production test bench of the off-shore readout system for the ANTARES neutrino experiment.

Frequency-chirped readout of spatial-spectral absorption features

International Nuclear Information System (INIS)

Chang, Tiejun; Mohan, R. Krishna; Harris, Todd L.; Merkel, Kristian D.; Tian Mingzhen; Babbitt, Wm. Randall

2004-01-01

This paper examines the physical mechanisms of reading out spatial-spectral absorption features in an inhomogeneously broadened medium using linear frequency-chirped electric fields. A Maxwell-Bloch model using numerical calculation for angled beams with arbitrary phase modulation is used to simulate the chirped field readout process. The simulation results indicate that any spatial-spectral absorption feature can be read out with a chirped field with the appropriate bandwidth, duration, and intensity. Mapping spectral absorption features into temporal intensity modulations depends on the chirp rate of the field. However, when probing a spatial-spectral grating with a chirped field, a beat signal representing the grating period can be created by interfering the emitted photon echo chirped field with a reference chirped field, regardless of the chirp rate. Comparisons are made between collinear and angled readout configurations. Readout signal strength and spurious signal distortions are investigated as functions of the grating strength and the Rabi frequency of the readout pulse. Using a collinear readout geometry, distortions from optical nutation on the transmitted field and higher-order harmonics are observed, both of which are avoided in an angled beam geometry

FERMI multi-chip module

CERN Multimedia

This FERMI multi-chip module contains five million transistors. 25 000 of these modules will handle the flood of information through parts of the ATLAS and CMS detectors at the LHC. To select interesting events for recording, crucial decisions are taken before the data leaves the detector. FERMI modules are being developed at CERN in partnership with European industry.

chipPCR: an R package to pre-process raw data of amplification curves.

Science.gov (United States)

Rödiger, Stefan; Burdukiewicz, Michał; Schierack, Peter

2015-09-01

Both the quantitative real-time polymerase chain reaction (qPCR) and quantitative isothermal amplification (qIA) are standard methods for nucleic acid quantification. Numerous real-time read-out technologies have been developed. Despite the continuous interest in amplification-based techniques, there are only few tools for pre-processing of amplification data. However, a transparent tool for precise control of raw data is indispensable in several scenarios, for example, during the development of new instruments. chipPCR is an R: package for the pre-processing and quality analysis of raw data of amplification curves. The package takes advantage of R: 's S4 object model and offers an extensible environment. chipPCR contains tools for raw data exploration: normalization, baselining, imputation of missing values, a powerful wrapper for amplification curve smoothing and a function to detect the start and end of an amplification curve. The capabilities of the software are enhanced by the implementation of algorithms unavailable in R: , such as a 5-point stencil for derivative interpolation. Simulation tools, statistical tests, plots for data quality management, amplification efficiency/quantification cycle calculation, and datasets from qPCR and qIA experiments are part of the package. Core functionalities are integrated in GUIs (web-based and standalone shiny applications), thus streamlining analysis and report generation. http://cran.r-project.org/web/packages/chipPCR. Source code: https://github.com/michbur/chipPCR. stefan.roediger@b-tu.de Supplementary data are available at Bioinformatics online. © The Author 2015. Published by Oxford University Press. All rights reserved. For Permissions, please e-mail: journals.permissions@oup.com.

FASTBUS Readout Controller card for high speed data acquisition

International Nuclear Information System (INIS)

Zimmermann, S.

1991-10-01

This article describes a FASTBUS Readout Controller (FRC) for high speed data acquisition in FASTBUS based systems. The controller has two main interfaces: to FASTBUS and to a Readout Port. The FASTBUS interface performs FASTBUS master and slave operations at a maximum transfer rate exceeding 40 MBytes/s. The Readout Port can be adapted for a variety of protocols. Currently, it will be interfaced to a VME bus based processor with a VSB port. The on-board LR33000 embedded processor controls the readout, executing a list of operations download into its memory. It scans the FASTBUS modules and stores the data in a triple port DRAM (TPDRAM), through one of the Serial Access Memory (SAM) ports of the (TPDRAM). Later, it transfers this data to the readout port using the other SAM. The FRC also supports serial communication via RS232 and Ethernet interfaces. This device is intended for use in the data acquisition system at the Collider Detector at Fermilab. 5 refs., 3 figs

MT3825BA: a 384×288-25µm ROIC for uncooled microbolometer FPAs

Science.gov (United States)

Eminoglu, Selim; Gulden, M. Ali; Bayhan, Nusret; Incedere, O. Samet; Soyer, S. Tuncer; Ustundag, Cem M. B.; Isikhan, Murat; Kocak, Serhat; Turan, Ozge; Yalcin, Cem; Akin, Tayfun

2014-06-01

This paper reports the development of a new microbolometer Readout Integrated Circuit (ROIC) called MT3825BA. It has a format of 384 × 288 and a pixel pitch of 25μm. MT3825BA is Mikro-Tasarim's second microbolometer ROIC product, which is developed specifically for resistive surface micro-machined microbolometer detector arrays using high-TCR pixel materials, such as VOx and a-Si. MT3825BA has a system-on-chip architecture, where all the timing, biasing, and pixel non-uniformity correction (NUC) operations in the ROIC are applied using on-chip circuitry simplifying the use and system integration of this ROIC. The ROIC is designed to support pixel resistance values ranging from 30 KΩ to 100 KΩ. MT3825BA is operated using conventional row based readout method, where pixels in the array are read out in a row-by-row basis, where the applied bias for each pixel in a given row is updated at the beginning of each line period according to the applied line based NUC data. The NUC data is applied continuously in a row-by-row basis using the serial programming interface, which is also used to program user configurable features of the ROIC, such as readout gain, integration time, and number of analog video outputs. MT3825BA has a total of 4 analog video outputs and 2 analog reference outputs, placed at the top and bottom of the ROIC, which can be programmed to operate in the 1, 2, and 4-output modes, supporting frames rates well above 60 fps at a 3 MHz pixel output rate. The pixels in the array are read out with respect to reference pixels implemented above and below actual array pixels. The bias voltage of the pixels can be programmed over a 1.0 V range to compensate for the changes in the detector resistance values due to the variations coming from the manufacturing process or changes in the operating temperature. The ROIC has an on-chip integrated temperature sensor with a sensitivity of better than 5 mV / K, and the output of the temperature sensor can be read out the

A 64-channel integrated circuit for signal readout from coordinate detectors

International Nuclear Information System (INIS)

Aulchenko, V.; Shekhtman, L.; Zhulanov, V.

2017-01-01

A specialized integrated circuit was developed for the readout of signal from coordinate detectors of different types, including gas micro-pattern detectors and silicon microstrip detectors. The ASIC includes 64 channels, each containing a low-noise charge-sensitive amplifier with a connectable feedback capacitor and resistor, and fast reset of the feedback capacitor. Each channel of the ASIC also contains 100 cells of analogue memory where the signal can be stored at a rate of 10 MHz. The pitch of input pads is 50 μm and the chip size is 5× 5 mm 2 . The equivalent noise charge of the ASIC channel is about 2000 electrons with 10 pF capacitance at the input and maximal signal before saturation corresponds to 2× 10 6 electrons. The first application for this ASIC is the detector for imaging of explosions at a synchrotron radiation beam (DIMEX), where it has to substitute the old and slower APC128 ASIC. The full-size electronics including 8 ASICs for 512 channels was assembled and tested.

Studies and development of a readout ASIC for pixelated CdTe detectors for space applications

International Nuclear Information System (INIS)

Michalowska, A.

2013-01-01

designed two ASICs. The first one, Caterpylar, is a test-chip, which enables the characterization of differently dimensioned CSA circuits to choose the most suitable one for the final application. It is optimized for readout of the target CdTe detector with 300 μm pixel pitch and the corresponding input parameters. With this circuit I have also analyzed possible filtering methods, in particular the semi-Gaussian shaping and the Multi-Correlated Double Sampling (MCDS). Their comparison is preceded by the theoretical analysis of these shapers. The second ASIC D 2 R 1 is a complete readout circuit, containing 256 channels to readout CdTe detector with the same number of pixels, arranged in 16 *16 array. Each channel fits into a layout area of 300 μm - 300 μm. It is based on the MCDS processing with self-triggering capabilities. The mean electronic noise measured over all channels is 29 electrons rms when characterized without the detector. The corresponding power consumption is 315 μW/channel. With these results the future measurements with the detector give prospects for reaching an FWHM spectral resolution in the order of 600 eV at 60 keV. (author) [fr

A Readout Integrated Circuit (ROIC) employing self-adaptive background current compensation technique for Infrared Focal Plane Array (IRFPA)

Science.gov (United States)

Zhou, Tong; Zhao, Jian; He, Yong; Jiang, Bo; Su, Yan

2018-05-01

A novel self-adaptive background current compensation circuit applied to infrared focal plane array is proposed in this paper, which can compensate the background current generated in different conditions. Designed double-threshold detection strategy is to estimate and eliminate the background currents, which could significantly reduce the hardware overhead and improve the uniformity among different pixels. In addition, the circuit is well compatible to various categories of infrared thermo-sensitive materials. The testing results of a 4 × 4 experimental chip showed that the proposed circuit achieves high precision, wide application and high intelligence. Tape-out of the 320 × 240 readout circuit, as well as the bonding, encapsulation and imaging verification of uncooled infrared focal plane array, have also been completed.

Resistive Plate Chambers for hadron calorimetry: Tests with analog readout

Energy Technology Data Exchange (ETDEWEB)

Drake, Gary [Argonne National Laboratory, 9700 S. Cass Avenue, Argonne, IL 60439 (United States); Repond, Jose [Argonne National Laboratory, 9700 S. Cass Avenue, Argonne, IL 60439 (United States)]. E-mail: repond@hep.anl.gov; Underwood, David [Argonne National Laboratory, 9700 S. Cass Avenue, Argonne, IL 60439 (United States); Xia, Lei [Argonne National Laboratory, 9700 S. Cass Avenue, Argonne, IL 60439 (United States)

2007-07-21

Resistive Plate Chambers (RPCs) are being developed for use in a hadron calorimeter with very fine segmentation of the readout. The design of the chambers and various tests with cosmic rays are described. This paper reports on the measurements with multi-bit (or analog) readout of either a single larger or multiple smaller readout pads.

Radiation hardness and timing studies of a monolithic TowerJazz pixel design for the new ATLAS Inner Tracker

Science.gov (United States)

Riegel, C.; Backhaus, M.; Van Hoorne, J. W.; Kugathasan, T.; Musa, L.; Pernegger, H.; Riedler, P.; Schaefer, D.; Snoeys, W.; Wagner, W.

2017-01-01

A part of the upcoming HL-LHC upgrade of the ATLAS Detector is the construction of a new Inner Tracker. This upgrade opens new possibilities, but also presents challenges in terms of occupancy and radiation tolerance. For the pixel detector inside the inner tracker, hybrid modules containing passive silicon sensors and connected readout chips are presently used, but require expensive assembly techniques like fine-pitch bump bonding. Silicon devices fabricated in standard commercial CMOS technologies, which include part or all of the readout chain, are also investigated offering a reduced cost as they are cheaper per unit area than traditional silicon detectors. If they contain the full readout chain, as for a fully monolithic approach, there is no need for the expensive flip-chip assembly, resulting in a further cost reduction and material savings. In the outer pixel layers of the ATLAS Inner Tracker, the pixel sensors must withstand non-ionising energy losses of up to 1015 n/cm2 and offer a timing resolution of 25 ns or less. This paper presents test results obtained on a monolithic test chip, the TowerJazz 180nm Investigator, towards these specifications. The presented program of radiation hardness and timing studies has been launched to investigate this technology's potential for the new ATLAS Inner Tracker.

The FE-I4 pixel readout integrated circuit

Energy Technology Data Exchange (ETDEWEB)

Garcia-Sciveres, M., E-mail: mgarcia-sciveres@bl.gov [Lawrence Berkeley National Laboratory, Berkeley, CA (United States); Arutinov, D.; Barbero, M. [University of Bonn, Bonn (Germany); Beccherle, R. [Istituto Nazionale di Fisica Nucleare Sezione di Genova, Genova (Italy); Dube, S.; Elledge, D. [Lawrence Berkeley National Laboratory, Berkeley, CA (United States); Fleury, J. [Laboratoire de l' Accelerateur Lineaire, Orsay (France); Fougeron, D.; Gensolen, F. [Centre de Physique des Particules de Marseille, Marseille (France); Gnani, D. [Lawrence Berkeley National Laboratory, Berkeley, CA (United States); Gromov, V. [Nationaal Instituut voor Subatomaire Fysica, Amsterdam (Netherlands); Hemperek, T.; Karagounis, M. [University of Bonn, Bonn (Germany); Kluit, R. [Nationaal Instituut voor Subatomaire Fysica, Amsterdam (Netherlands); Kruth, A. [University of Bonn, Bonn (Germany); Mekkaoui, A. [Lawrence Berkeley National Laboratory, Berkeley, CA (United States); Menouni, M. [Centre de Physique des Particules de Marseille, Marseille (France); Schipper, J.-D. [Nationaal Instituut voor Subatomaire Fysica, Amsterdam (Netherlands)

2011-04-21

A new pixel readout integrated circuit denominated FE-I4 is being designed to meet the requirements of ATLAS experiment upgrades. It will be the largest readout IC produced to date for particle physics applications, filling the maximum allowed reticle area. This will significantly reduce the cost of future hybrid pixel detectors. In addition, FE-I4 will have smaller pixels and higher rate capability than the present generation of LHC pixel detectors. Design features are described along with simulation and test results, including low power and high rate readout architecture, mixed signal design strategy, and yield hardening.

FAIR: A new fast trigger and readout bus system

International Nuclear Information System (INIS)

Ordine, A.; Boiano, A.; Zaghi, A.

1998-01-01

FAIR (FAst Intercrate Readout) is a synchronous ECL bus system dedicated to readout. It is based on a new trigger and readout hardware level protocol and on a new control system that learns how to setup and control modules. The hardware protocol along with the data structure allow both readout and event building at the same time at the rate of 22 ns/longword (1.44 Gbit/s) without the need of CPUs. It performs trigger management and full pipelining by using a multilevel FIFO structure. FAIR provides for a multi-crate front-end environment and uses an embedded serial network to accomplish front-end control and setup. The data transfer measured performances and the control system are presented in some detail

Imaging achievements with the Vernier readout

CERN Document Server

Lapington, J S; Worth, L B C; Tandy, J A

2002-01-01

We describe the Vernier anode, a high resolution and charge division image readout for microchannel plate detectors. It comprises a planar structure of insulated electrodes deposited on an insulating substrate. The charge cloud from an event is divided amongst all nine electrodes and the charge ratio uniquely determines the two-dimensional position coordinate of the charge centroid. We discuss the design of the anode pattern and describe the advantages offered by this readout. The cyclic variation of the electrode structure allows the image resolution to exceed the charge measurement resolution and enables the entire active area of the readout to be utilized. In addition, fixed pattern noise is greatly reduced. We present results demonstrating the position resolution and image linearity. A position resolution of 10 mu m FWHM is demonstrated and the overall imaging performance is shown to be limited by the microchannel plate pore spacing. We present measurements of the image distortions and describe techniques...

The NA60 experiment readout architecture

CERN Document Server

Floris, M; Usai, G L; David, A; Rosinsky, P; Ohnishi, H

2004-01-01

The NA60 experiment was designed to identify signatures of a new state of matter, the Quark Gluon Plasma, in heavy-ion collisions at the CERN Super Proton Synchroton. The apparatus is composed of four main detectors: a muon spectrometer (MS), a zero degree calorimeter (ZDC), a silicon vertex telescope (VT), and a silicon microstrip beam tracker (BT). The readout of the whole experiment is based on a PCI architecture. The basic unit is a general purpose PCI card, interfaced to the different subdetectors via custom mezzanine cards. This allowed us to successfully implement several completely different readout protocols (from the VME like protocol of the MS to the custom protocol of the pixel telescope). The system was fully tested with proton and ion beams, and several million events were collected in 2002 and 2003. This paper presents the readout architecture of NA60, with particular emphasis on the PCI layer common to all the subdetectors. (16 refs).

LHCb: A new Readout Control system for the LHCb Upgrade

CERN Multimedia

Alessio, F

2012-01-01

The LHCb experiment has proposed an upgrade towards a full 40 MHz readout system in order to run between five and ten times its initial design luminosity. The entire readout architecture will be upgraded in order to cope with higher sub-detector occupancies, higher rate and higher network load. In this paper, we describe the architecture, functionalities and the first hardware implementation of a new Readout Control system for the LHCb upgrade. The system is based on FPGAs and bi-directional links for the control of the entire readout architecture. First results on the validation of the system are also given.

Multi-Anode Photomultplier (MAPMT) readout for High Granularity Calorimeters

CERN Document Server

Mkrtchyan, Tigran; The ATLAS collaboration

2017-01-01

Hadron calorimeter high performance in jet sub-structure measurements can be achieved for objects with $p_{T}$ greater than 1 TeV if the readout geometry is finely segmented in $\\Delta\\eta \\times \\Delta\\phi$. A feasibility study to increase the readout granularity of TileCal, the central hadron calorimeter of the ATLAS detector, is presented. We show a preliminary study exploring the possibility to increase by a factor 4 the present readout granularity of the inner layer cells of TileCal (0.1->0.025 in $\\Delta\\eta$) and to split into two layers the intermediate section of TileCal. The proposed solution is designed to cope with mechanical and readout bandwidth and power constraints. Assuming that the mechanics of the Tile modules cannot be changed, Multi-Anode PMTs with same boundary geometry of the present single-anode PMTs are considered to readout WLS bers, ideally one per pixel, carrying the signals from the individual scintillating tiles of each detector cells. The discussed challenges of the design are: ...

A readout buffer prototype for ATLAS high-level triggers

CERN Document Server

Calvet, D; Huet, M; Le Dû, P; Mandjavidze, I D; Mur, M

2001-01-01

Readout buffers are critical components in the dataflow chain of the ATLAS trigger/data-acquisition system. At up to 75 kHz, after each Level-1 trigger accept signal, these devices receive and store digitized data from groups of front-end electronic channels. Several readout buffers are grouped to form a readout buffer complex that acts as a data server for the high-level trigger selection algorithms and for the final data-collection system. This paper describes a functional prototype of a readout buffer based on a custom-made PCI mezzanine card that is designed to accept input data at up to 160 MB /s, to store up to 8 MB of data, and to distribute data chunks at the desired request rate. We describe the hardware of the card that is based on an Intel 1960 processor and complex programmable logic devices. We present the integration of several of these cards in a readout buffer complex. We measure various performance figures and discuss to which extent these can fulfil ATLAS needs. (5 refs).

Study for the LHCb upgrade read-out board

CERN Document Server

Cachemiche, J P; Hachon, F; Le Gac, R; Marin, F; 10.1088/1748-0221/5/12/C12036

2010-01-01

The LHCb experiment envisages to upgrade its readout electronics in order to increase the readout rate from 1 MHz to 40 MHz. This electronics upgrade is very challenging, since readout boards will have to handle a higher number of serial links with an increased bandwidth. In addition, the new communication protocol (GBT) developed by the CERN micro-electronics group mixes data acquisition, slow control and clock distribution on the same link. To explore the feasibility of such a readout system, elementary building blocks have been studied. Their goals are multiple: understand signal integrity when using highly integrated high speed serial links running at 8 - 10 Gbits/s; test the implementation of the GBT protocol within FPGAs; understand advantages and limitations of commercial standard with a predefined interconnection topology; validate ideas on how to control easily such a system. We designed two boards compliant with the xTCA standard which meets an increasing interest in the physics community. The first...

Design of a trigger layout and the corresponding implementation of a 200 GB/s readout network for the ALICE transition radiation detector

International Nuclear Information System (INIS)

Schneider, Rolf

2008-01-01

Through the use of modern information technology, intelligent trigger systems are gaining more and more importance in high-energy physics. Particularly in heavy ion experiments, the large number of generated particles results in an enormous amount of data. By filtering the data at an early stage and discarding irrelevant events, the efficiency of the entire system can be raised significantly. The ALICE experiment at CERN breaks new ground in this respect. With the Transition Radiation Detector, the acquired signals are processed parallel right on the detector using more than 65 000 multi-chip modules. Via a readout network, the preprocessed data arrives at a global track reconstruction unit, which contributes to the decision whether an event is discarded or further processed. In this thesis, a trigger concept for the Transition Radiation Detector is developed and the readout network is implemented. A special challenge is to achieve an efficient interaction of the above processing stages. By means of simulations and analyses, the entire system is optimized in this regard. It turns out that the read-out process plays a decisive role. In this context, a design flow for the used ASIC is developed. The analyses show that through optimizations the extremely high demands made on this complex system can be met. During a beam time, first prototypes have successfully been tested. The entire system is currently being assembled and will be brought on line in 2008. (orig.)

Silicon Chip-to-Chip Mode-Division Multiplexing

DEFF Research Database (Denmark)

Baumann, Jan Markus; Porto da Silva, Edson; Ding, Yunhong

2018-01-01

A chip-to-chip mode-division multiplexing connection is demonstrated using a pair of multiplexers/demultiplexers fabricated on the silicon-on-insulator platform. Successful mode multiplexing and demultiplexing is experimentally demonstrated, using the LP01, LP11a and LP11b modes.......A chip-to-chip mode-division multiplexing connection is demonstrated using a pair of multiplexers/demultiplexers fabricated on the silicon-on-insulator platform. Successful mode multiplexing and demultiplexing is experimentally demonstrated, using the LP01, LP11a and LP11b modes....

Study on two-dimensional induced signal readout of MRPC

International Nuclear Information System (INIS)

Wu Yucheng; Yue Qian; Li Yuanjing; Ye Jin; Cheng Jianping; Wang Yi; Li Jin

2012-01-01

A kind of two-dimensional readout electrode structure for the induced signal readout of MRPC has been studied in both simulation and experiments. Several MRPC prototypes are produced and a series of test experiments have been done to compare with the result of simulation, in order to verify the simulation model. The experiment results are in good agreement with those of simulation. This method will be used to design the two-dimensional signal readout mode of MRPC in the future work.

Pixelized M-pi-n CdTe detector coupled to Medipix2 readout chip

CERN Document Server

Kalliopuska, J; Penttila, R; Andersson, H; Nenonen, S; Gadda, A; Pohjonen, H; Vanttajac, I; Laaksoc, P; Likonen, J

2011-01-01

We have realized a simple method for patterning an M-pi-n CdTe diode with a deeply diffused pn-junction, such as indium anode on CdTe. The method relies on removing the semiconductor material on the anode-side of the diode until the physical junction has been reached. The pixelization of the p-type CdTe diode with an indium anode has been demonstrated by patterning perpendicular trenches with a high precision diamond blade and pulsed laser. Pixelization or microstrip pattering can be done on both sides of the diode, also on the cathode-side to realize double sided detector configuration. The article compares the patterning quality of the diamond blade process, pulsed pico-second and femto-second lasers processes. Leakage currents and inter-strip resistance have been measured and are used as the basis of the comparison. Secondary ion mass spectrometry (SIMS) characterization has been done for a diode to define the pn-junction depth and to see the effect of the thermal loads of the flip-chip bonding process. Th...

An intelligent readout controller for Fastbus, the Fermilab FSCC

International Nuclear Information System (INIS)

Bowden, M.; Kwarciany, R.; Urish, J.

1990-01-01

This paper reports on the Fermilab FASTBUS Smart Crate Controller which is intended as a fast, versatile, and cost effective solution for the readout of FASTBUS crates. The on-board 68020 provides intelligence and a programmable microsequencer controls the main readout path. The FSCC supports communication via serial RS 232, Ethernet, and FASTBUS. The main readout path may be programmed for a variety of protocols. Currently, RS 422, VDAS, ECL line, and fiber-optic interfaces are being developed. Hardware interfacing is via the FASTBUS auxiliary connector using a personality card. Provision is made for some on-board formatting and processing of data. The 68020 may sample the data, also headers and word counts may be inserted into the data stream. Data is buffered by FIFOs to allow asynchronous readout

First performance results of the ALICE TPC Readout Control Unit 2

OpenAIRE

Zhao, Chengxin; Alme, Johan; Alt, Torsten; Appelshäuser, Harald; Bratrud, Lars Karlot Stubberud; Castro, Andrew; Costa, Filippo; David, Ernö; Gunji, Tako; Kirsch, S; Kiss, Tivadar; Langøy, Rune; Lien, Jørgen; Lippmann, C; Oskarsson, Anders

2016-01-01

- This paper presents the first performance results of the ALICE TPC Readout Control Unit 2 (RCU2). With the upgraded hardware typology and the new readout scheme in FPGA design, the RCU2 is designed to achieve twice the readout speed of the present Readout Control Unit. Design choices such as using the flash-based Microsemi Smartfusion2 FPGA and applying mitigation techniques in interfaces and FPGA design ensure a high degree of radiation tolerance. This paper presents the system level ir...

Real-time and time-integrated PM2.5 and CO from prescribed burns in chipped and non-chipped plots: firefighter and community exposure and health implications

Science.gov (United States)

Luke P. Naeher; Gary L. Achtemeier; Jeff S. Glitzenstein; Donna R. Streng; David Macintosh

2006-01-01

In this study, smoke data were collected from two plots located on the Francis Marion National Forest in South Carolina during prescribed burns on 12 February 2003. One of the plots had been subjected to mechanical chipping, the other was not. This study is part of a larger investigation of fire behavior related to mechanical chipping, parts of which are presented...

Electrical and functional characterisation with single chips and module prototypes of the 1.2 Gb/s serial data link of the monolithic active pixel sensor for the upgrade of the ALICE Inner Tracking System

CERN Document Server

Bonora, Matthias; Aglieri Rinella, Gianluca; Hillemanns, Hartmut; Kim, Daehyeok; Kugathasan, Thanushan; Lattuca, Alessandra; Mazza, Giovanni; Sielewicz, Krzysztof Marek; Snoeys, Walter

2017-01-01

The upgrade of the ALICE Inner Tracking System uses a newly developed monolithic active pixel sensor (ALPIDE) which will populate seven tracking layers surrounding the interaction point. Chips communicate with the readout electronics using a 1.2 Gb/s data link and a 40 Mb/s bidirectional control link. Event data are transmitted to the readout electronics over microstrips on a Flexible Printed Circuit and a 6 m long twinaxial cable. This paper outlines the characterisation effort for assessing the Data Transmission Unit performance of single sensors and prototypes of the detector modules. It describes the different prototypes used, the test system and procedures, and results of laboratory and irradiation tests.

Prototyping of Silicon Strip Detectors for the Inner Tracker of the ALICE Experiment

CERN Document Server

Sokolov, Oleksiy

2006-01-01

The ALICE experiment at CERN will study heavy ion collisions at a center-of-mass energy 5.5∼TeV per nucleon. Particle tracking around the interaction region at radii r<45 cm is done by the Inner Tracking System (ITS), consisting of six cylindrical layers of silicon detectors. The outer two layers of the ITS use double-sided silicon strip detectors. This thesis focuses on testing of these detectors and performance studies of the detector module prototypes at the beam test. Silicon strip detector layers will require about 20 thousand HAL25 front-end readout chips and about 3.5 thousand hybrids each containing 6 HAL25 chips. During the assembly procedure, chips are bonded on a patterned TAB aluminium microcables which connect to all the chip input and output pads, and then the chips are assembled on the hybrids. Bonding failures at the chip or hybrid level may either render the component non-functional or deteriorate its the performance such that it can not be used for the module production. After each bond...

A simple method to increase the current range of the TERA chip in charged particle therapy applications

Energy Technology Data Exchange (ETDEWEB)

Cirio, R. [Istituto Nazionale di Fisica Nucleare, sez. di Torino, via P. Giuria,1, 10125 Torino (Italy); Dipartimento di Fisica dell' Università di Torino, via P. Giuria,1, 10125 Torino (Italy); Fausti, F. [Istituto Nazionale di Fisica Nucleare, sez. di Torino, via P. Giuria,1, 10125 Torino (Italy); Dipartimento di Elettronica e Telecomunicazioni del Politecnico di Torino, Corso Duca degli Abruzzi, 24, 10129 Torino (Italy); Fanola Guarachi, L. [Istituto Nazionale di Fisica Nucleare, sez. di Torino, via P. Giuria,1, 10125 Torino (Italy); Dipartimento di Fisica dell' Università di Torino, via P. Giuria,1, 10125 Torino (Italy); Giordanengo, S., E-mail: Simona.Giordanengo@to.infn.it [Istituto Nazionale di Fisica Nucleare, sez. di Torino, via P. Giuria,1, 10125 Torino (Italy); Marchetto, F.; Mazza, G. [Istituto Nazionale di Fisica Nucleare, sez. di Torino, via P. Giuria,1, 10125 Torino (Italy); Monaco, V.; Sacchi, R. [Istituto Nazionale di Fisica Nucleare, sez. di Torino, via P. Giuria,1, 10125 Torino (Italy); Dipartimento di Fisica dell' Università di Torino, via P. Giuria,1, 10125 Torino (Italy); Talpacci, E. [Dipartimento di Fisica dell' Università di Torino, via P. Giuria,1, 10125 Torino (Italy); Varasteh Anvar, M. [Istituto Nazionale di Fisica Nucleare, sez. di Torino, via P. Giuria,1, 10125 Torino (Italy); Dipartimento di Fisica dell' Università di Torino, via P. Giuria,1, 10125 Torino (Italy); Vignati, A. [Istituto Nazionale di Fisica Nucleare, sez. di Torino, via P. Giuria,1, 10125 Torino (Italy)

2015-10-21

The development of the next generation of accelerators for charged particle radiotherapy aims to reduce dimensions and operational complexity of the machines by engineering pulsed beams accelerators. The drawback is the increased difficulty to monitor the beam delivery. Within each pulse, instantaneous currents larger by two to three orders of magnitude than present applications are expected, which would saturate the readout of the monitor chambers. In this paper, we report of a simple method to increase by almost two orders of magnitude the current range of an Application Specific Integrated Circuit chip previously developed by our group to read out monitor ionization chambers.

A 12-bit SAR ADC integrated on a multichannel silicon drift detector readout IC

Energy Technology Data Exchange (ETDEWEB)

Schembari, F., E-mail: filippo.schembari@polimi.it [Politecnico di Milano, Dipartimento di Elettronica, Informazione e Bioingegneria, via Golgi 40, 20133 Milano (Italy); INFN, Sezione di Milano, via Celoria 16, 20133 Milano (Italy); Bellotti, G.; Fiorini, C. [Politecnico di Milano, Dipartimento di Elettronica, Informazione e Bioingegneria, via Golgi 40, 20133 Milano (Italy); INFN, Sezione di Milano, via Celoria 16, 20133 Milano (Italy)

2016-07-11

A 12-bit analog-to-digital converter (ADC) addressed to Silicon-Drift Detectors (SDDs) multichannel readout ASICs for X- and gamma-ray applications is presented. Aiming at digitizing output multiplexed data from the upstream analog filters banks, the converter must ensure 11-bit accuracy and a sampling frequency of about 5 MS/s. The ADC architecture is the charge-redistribution (CR) successive-approximation register (SAR). A fully differential topology has also been chosen for better rejection of common-mode noise and disturbances. The internal DAC is made of binary-scaled capacitors, whose bottom plates are switched by the SAR logic to perform the binary search of the analog input value by means of the monotonic switching scheme. The A/D converter is integrated on SFERA, a multichannel ASIC fabricated in a standard CMOS 0.35 μm 3.3 V technology and it occupies an area of 0.42 mm{sup 2}. Simulated static performance shows monotonicity over the whole input–output characteristic. The description of the circuit topology and of inner blocks architectures together with the experimental characterization is here presented. - Highlights: • X- and γ-ray spectroscopy front-ends need to readout a high number of detectors. • Design efforts are increasingly oriented to compact and low-power ASICs. • A possible solution is the on-chip integration of the analog-to-digital converter. • A 12-bit CR successive-approximation-register ADC has been developed. • It is a suitable candidate as the digitizer to be integrated in multichannel ASICs.

A radiation-tolerant electronic readout system for portal imaging

Science.gov (United States)

Östling, J.; Brahme, A.; Danielsson, M.; Iacobaeus, C.; Peskov, V.

2004-06-01

A new electronic portal imaging device, EPID, is under development at the Karolinska Institutet and the Royal Institute of Technology. Due to considerable demands on radiation tolerance in the radiotherapy environment, a dedicated electronic readout system has been designed. The most interesting aspect of the readout system is that it allows to read out ˜1000 pixels in parallel, with all electronics placed outside the radiation beam—making the detector more radiation resistant. In this work we are presenting the function of a small prototype (6×100 pixels) of the electronic readout board that has been tested. Tests were made with continuous X-rays (10-60 keV) and with α particles. The results show that, without using an optimised gas mixture and with an early prototype only, the electronic readout system still works very well.

Read-out and calibration of a tile calorimeter for ATLAS

International Nuclear Information System (INIS)

Tardell, S.

1997-06-01

The read-out and calibration of scintillating tiles hadronic calorimeter for ATLAS is discussed. Tests with prototypes of FERMI, a system of read-out electronics based on a dynamic range compressor reducing the dynamic range from 16 to 10 bits and a 40 MHz 10 bits sampling ADC, are presented. In comparison with a standard charge integrating read-out improvements in the resolution of 1% in the constant term are obtained

100 Gbps PCI-Express Readout for the LHCb Upgrade

CERN Document Server

Durante, Paolo; Schwemmer, Rainer; Marconi, Umberto; Balbi, Gabriele; Lax, Ignazio

2015-01-01

We present a new data acquisition system under development for the next upgrade of the LHCb experiment at CERN. We focus in particular on the design of a new common readout board, the PCIe40, and on the viability of PCI-Express as an interconnect technology for high speed readout. We describe a new high-performance DMA controller for data acquisition, implemented on an FPGA, coupled with a custom software module for the Linux kernel. Lastly, we describe how these components can be leveraged to achieve a throughput of 100 Gbit/s per readout board.

Comparison between two possible CMS Barrel Muon Readout Architectures

International Nuclear Information System (INIS)

Aguayo, P.; Barcala, J.M.; Molinero, A.; Pablos, J.L.; Willmott, C.; Alberdi, J.; Marin, J.; Navarrete, J.; Romero, L.

1997-01-01

A comparison between two possible readout arquitectures for the CMS muon barrel readout electronics is presented, including various aspects like costs, reliability, installation, staging and maintenance. A review of the present baseline architecture is given in the appendix. (Author)

The Readout Control Unit of the ALICE TPC

CERN Document Server

Lien, J A; Musa, L

2004-01-01

The ALICE Time Projection Chamber (TPC) is the main tracking detector of the central barrel of the ALICE (A Large Ion Collider) Experiment at the Large Hadron Collider (LHC), being constructed at CERN, Geneva. It is a 88 m$^{3}$ cylinder filled with gas and divided into two drift regions by the central electrode located at its axial center. The readout chambers of the TPC are multi-wire proportional chambers with cathode pad readout. About 570 000 pads are read-out by an electronics chain of amplification, digitalization and pre-processing. One of the challenges in designing the TPC for ALICE is the design of Front End Electronics (FEE) to cope with the data rates and the channel occupancy. The Readout Control Unit (RCU), which is presented in this work, is designed to control and monitor the Front End Electronics, and to collect and ship data to the High Level Trigger and the Data Acquisition System, via the Detector Data Link (DDL - optical fibre). The RCU must be capable of reading out up to 200 Mbytes/s f...

Comparing interferometry techniques for multi-degree of freedom test mass readout

International Nuclear Information System (INIS)

Isleif, Katharina-Sophie; Gerberding, Oliver; Mehmet, Moritz; Schwarze, Thomas S; Heinzel, Gerhard; Danzmann, Karsten

2016-01-01

Laser interferometric readout systems with 1pm/Hz precision over long time scales have successfully been developed for LISA and LISA Pathfinder. Future gravitational physics experiments, for example in the fields of gravitational wave detection and geodesy, will potentially require similar levels of displacement and tilt readouts of multiple test masses in multiple degrees of freedom. In this article we compare currently available classic interferometry schemes with new techniques using phase modulations and complex readout algorithms. Based on a simple example we show that the new techniques have great potential to simplify interferometric readouts. (paper)

Towards autonomous lab-on-a-chip devices for cell phone biosensing.

Science.gov (United States)

Comina, Germán; Suska, Anke; Filippini, Daniel

2016-03-15

Modern cell phones are a ubiquitous resource with a residual capacity to accommodate chemical sensing and biosensing capabilities. From the different approaches explored to capitalize on such resource, the use of autonomous disposable lab-on-a-chip (LOC) devices-conceived as only accessories to complement cell phones-underscores the possibility to entirely retain cell phones' ubiquity for distributed biosensing. The technology and principles exploited for autonomous LOC devices are here selected and reviewed focusing on their potential to serve cell phone readout configurations. Together with this requirement, the central aspects of cell phones' resources that determine their potential for analytical detection are examined. The conversion of these LOC concepts into universal architectures that are readable on unaccessorized phones is discussed within this context. Copyright © 2015 Elsevier B.V. All rights reserved.

Online readout and control unit for high-speed/high resolution readout of silicon tracking detectors

International Nuclear Information System (INIS)

Buerger, J.; Hansen, K.; Lange, W.; Nowak, T.; Prell, S.; Zimmermann, W.

1997-01-01

We are describing a high speed VME readout and control module developed and presently working at the H1 experiment at DESY in Hamburg. It has the capability to read out 4 x 2048 analogue data channels at sampling rates up to 10 MHz with a dynamic input range of 1 V. The nominal resolution of the A/D converters can be adjusted between 8 and 12 bit. At the latter resolution we obtain signal-to-noise ratio better than 61.4 dB at a conversion rate of 5 MSps. At this data rate all 8192 detector channels can be read out to the internal raw data memory and VME interface within about 410 μs and 510 μs, respectively. The pedestal subtracted signals can be analyzed on-line. At a raw data hit occupation of 10%, the VME readout time is 50 μs per module. Each module provides four complementary CMOS signals to control the front-end electronics and four independent sets of power supplies for analogue and digital voltages (10 V, 100 mA) to drive the front-end electronics and for the bias voltage (100 V, 1.2 mA) to assure the full functionality of the detectors and the readout. (orig.)

Online readout and control unit for high-speed/high resolution readout of silicon tracking detectors

Science.gov (United States)

Bürger, J.; Hansen, K.; Lange, W.; Nowak, T.; Prell, S.; Zimmermann, W.

1997-02-01

We are describing a high speed VME readout and control module developed and presently working at the H1 experiment at DESY in Hamburg. It has the capability to read out 4 × 2048 analogue data channels at sampling rates up to 10 MHz with a dynamic input range of 1 V. The nominal resolution of the A/D converters can be adjusted between 8 and 12 bit. At the latter resolution we obtain signal-to-noise ratio better than 61.4 dB at a conversion rate of 5 MSps. At this data rate all 8192 detector channels can be read out to the internal raw data memory and VME interface within about 410 μs and 510 μs, respectively. The pedestal subtracted signals can be analyzed on-line. At a raw data hit occupation of 10%, the VME readout time is 50 μs per module. Each module provides four complementary CMOS signals to control the front-end electronics and four independent sets of power supplies for analogue and digital voltages (10 V, 100 mA) to drive the front-end electronics and for the bias voltage (100 V, 1.2 mA) to assure the full functionality of the detectors and the readout.

Online readout and control unit for high-speed / high resolution readout of silicon tracking detectors

International Nuclear Information System (INIS)

Buerger, J.; Hansen, K.; Lange, W.; Nowak, T.; Prell, S.; Zimmermann, W.

1996-09-01

We are describing a high speed VME readout and control module developed and presently working at the H1 experiment at DESY in Hamburg. It has the capability to read out 4 x 2048 analogue data channels at sampling rates up to 10 MHz with a dynamic input range of 1 V. The nominal resolution of the A/D converters can be adjusted between 8 and 12 bit. At the latter resolution we obtain signal-to-noise ratio better than 61.4 dB at a conversion rate of 5 MSps. At this data rate all 8192 detector channels can be read out to the internal raw data memory and VME interface within about 410 μs and 510 μs, respectively. The pedestal subtracted signals can be analyzed on-line. At a raw data hit occupation of 10%, the VME readout time is 50 μs per module. Each module provides four complementary CMOS signals to control the front-end electronics and four independent sets of power supplies for analogue and digital voltages (10 V, 100 mA) to drive the front-end electronics and for the bias voltage (100 V, 1.2 mA) to assure the full functionality of the detectors and the readout. (orig.)

On-chip microwave circulators using quantum Hall plasmonics

Science.gov (United States)

Mahoney, Alice; Colless, James; Pauka, Sebastian; Hornibrook, John; Doherty, Andrew; Reilly, David; Peeters, Lucas; Fox, Eli; Goldhaber-Gordon, David; Kou, Xuefeng; Pan, Lei; Wang, Kang; Watson, John; Gardner, Geoffrey; Manfra, Michael

Circulators are directional circuit elements integral to technologies including radar systems, microwave communication transceivers and the readout of quantum information devices. Their non-reciprocity commonly arises from the interference of microwaves over the centimetre-scale of the signal wavelength in the presence of bulky magnetic media that breaks time-reversal symmetry. We present a completely passive on-chip microwave circulator with size 1/1000th the wavelength by exploiting the chiral, `slow-light' response of a GaAs/AlGaAs 2-dimensional electron gas in the quantum Hall regime. Further, by implementing this circulator design on a thin film of a magnetic topological insulator (Cr0.12(Bi0.26Sb0.62)2Te3), we show that similar non-reciprocity can be achieved at zero magnetic field. This additional mode of operation serves as a non-invasive probe of edge states in the quantum anomalous Hall effect, while also extending the possibility for integration with superconducting devices.

Microwave multiplex readout for superconducting sensors

Energy Technology Data Exchange (ETDEWEB)

Ferri, E., E-mail: elena.ferri@mib.infn.it [Università Milano-Bicocca, Milan (Italy); INFN Sez. di Milano-Bicocca, Milan (Italy); Becker, D.; Bennett, D. [NIST, Boulder, CO (United States); Faverzani, M. [Università Milano-Bicocca, Milan (Italy); INFN Sez. di Milano-Bicocca, Milan (Italy); Fowler, J.; Gard, J. [NIST, Boulder, CO (United States); Giachero, A. [Università Milano-Bicocca, Milan (Italy); INFN Sez. di Milano-Bicocca, Milan (Italy); Hays-Wehle, J.; Hilton, G. [NIST, Boulder, CO (United States); Maino, M. [Università Milano-Bicocca, Milan (Italy); INFN Sez. di Milano-Bicocca, Milan (Italy); Mates, J. [NIST, Boulder, CO (United States); Puiu, A.; Nucciotti, A. [Università Milano-Bicocca, Milan (Italy); INFN Sez. di Milano-Bicocca, Milan (Italy); Reintsema, C.; Schmidt, D.; Swetz, D.; Ullom, J.; Vale, L. [NIST, Boulder, CO (United States)

2016-07-11

The absolute neutrino mass scale is still an outstanding challenge in both particle physics and cosmology. The calorimetric measurement of the energy released in a nuclear beta decay is a powerful tool to determine the effective electron-neutrino mass. In the last years, the progress on low temperature detector technologies has allowed to design large scale experiments aiming at pushing down the sensitivity on the neutrino mass below 1 eV. Even with outstanding performances in both energy (~ eV on keV) and time resolution (~ 1 μs) on the single channel, a large number of detectors working in parallel is required to reach a sub-eV sensitivity. Microwave frequency domain readout is the best available technique to readout large array of low temperature detectors, such as Transition Edge Sensors (TESs) or Microwave Kinetic Inductance Detectors (MKIDs). In this way a multiplex factor of the order of thousands can be reached, limited only by the bandwidth of the available commercial fast digitizers. This microwave multiplexing system will be used to readout the HOLMES detectors, an array of 1000 microcalorimeters based on TES sensors in which the {sup 163}Ho will be implanted. HOLMES is a new experiment for measuring the electron neutrino mass by means of the electron capture (EC) decay of {sup 163}Ho. We present here the microwave frequency multiplex which will be used in the HOLMES experiment and the microwave frequency multiplex used to readout the MKID detectors developed in Milan as well.

A new readout control system for the LHCb upgrade at CERN

International Nuclear Information System (INIS)

Alessio, F; Jacobsson, R

2012-01-01

The LHCb experiment has proposed an upgrade towards a full 40 MHz readout system in order to run between five and ten times its initial design luminosity. The entire readout architecture will be upgraded in order to cope with higher sub-detector occupancies, higher rate and higher network load. In this paper, we describe the architecture, functionalities and a first hardware implementation of a new fast Readout Control system for the LHCb upgrade, which will be entirely based on FPGAs and bi-directional links. We also outline the real-time implementations of the new Readout Control system, together with solutions on how to handle the synchronous distribution of timing and synchronous information to the complex upgraded LHCb readout architecture. One section will also be dedicated to the control and usage of the newly developed CERN GBT chipset to transmit fast and slow control commands to the upgraded LHCb Front-End electronics. At the end, we outline the plans for the deployment of the system in the global LHCb upgrade readout architecture.

Biostability of an implantable glucose sensor chip

Science.gov (United States)

Fröhlich, M.; Birkholz, M.; Ehwald, K. E.; Kulse, P.; Fursenko, O.; Katzer, J.

2012-12-01

Surface materials of an implantable microelectronic chip intended for medical applications were evaluated with respect to their long-term stability in bio-environments. The sensor chip shall apply in a glucose monitor by operating as a microviscosimeter according to the principle of affinity viscosimetry. A monolithic integration of a microelectromechanical system (MEMS) into the sensor chip was successfully performed in a combined 0.25 μm CMOS/BiCMOS technology. In order to study material durability and biostability of the surfaces, sensor chips were exposed to various in vitro and in vivo tests. Corrosional damage of SiON, SiO2 and TiN surfaces was investigated by optical microscopy, ellipsometry and AFM. The results served for optimizing the Back-end-of-Line (BEoL) stack, from which the MEMS was prepared. Corrosion of metal lines could significantly be reduced by improving the topmost passivation layer. The experiments revealed no visible damage of the actuator or other functionally important MEMS elements. Sensor chips were also exposed to human body fluid for three month by implantation into the abdomen of a volunteer. Only small effects were observed for layer thickness and Ra roughness after explantation. In particular, TiN as used for the actuator beam showed no degradation by biocorrosion. The highest degradation rate of about 50 nm per month was revealed for the SiON passivation layer. These results suggest that the sensor chip may safely operate in subcutaneous tissue for a period of several months.

Biostability of an implantable glucose sensor chip

International Nuclear Information System (INIS)

Fröhlich, M; Ehwald, K E; Kulse, P; Fursenko, O; Katzer, J; Birkholz, M

2012-01-01

Surface materials of an implantable microelectronic chip intended for medical applications were evaluated with respect to their long-term stability in bio-environments. The sensor chip shall apply in a glucose monitor by operating as a microviscosimeter according to the principle of affinity viscosimetry. A monolithic integration of a microelectromechanical system (MEMS) into the sensor chip was successfully performed in a combined 0.25 μm CMOS/BiCMOS technology. In order to study material durability and biostability of the surfaces, sensor chips were exposed to various in vitro and in vivo tests. Corrosional damage of SiON, SiO 2 and TiN surfaces was investigated by optical microscopy, ellipsometry and AFM. The results served for optimizing the Back-end-of-Line (BEoL) stack, from which the MEMS was prepared. Corrosion of metal lines could significantly be reduced by improving the topmost passivation layer. The experiments revealed no visible damage of the actuator or other functionally important MEMS elements. Sensor chips were also exposed to human body fluid for three month by implantation into the abdomen of a volunteer. Only small effects were observed for layer thickness and R a roughness after explantation. In particular, TiN as used for the actuator beam showed no degradation by biocorrosion. The highest degradation rate of about 50 nm per month was revealed for the SiON passivation layer. These results suggest that the sensor chip may safely operate in subcutaneous tissue for a period of several months.

Performance of hybrid photon detector prototypes with 80% active area for the rich counters of LHCB

International Nuclear Information System (INIS)

Albrecht, E.; Alemi, M.; Barber, G.; Bibby, J.; Campbell, M.; Duane, A.; Gys, T.; Montenegro, J.; Piedigrossi, D.; Schomaker, R.; Snoeys, W.; Wotton, S.; Wyllie, K.

2000-01-01

We report on the ongoing work towards a hybrid photon detector with integrated silicon pixel readout for the ring imaging Cherenkov detectors of the LHCb experiment at the Large Hadron Collider at CERN. The photon detector is based on an electrostatically focussed image intensifier tube geometry where the image is de-magnified by a factor of ∼5. The anode consists of a silicon pixel array, bump-bonded to a binary readout chip with matching pixel electronics. The performance of full-scale prototypes equipped with 61-pixel anodes and external analogue readout is presented. The average signal-to-noise ratio is ∼11 with a peaking time of 1.2 μs. The tube active-to-total surface ratio is 81.7%, which meets the LHCb requirements. The spatial precision is measured to be better than 90 μm. A cluster of three such tubes has been installed in the LHCb RICH 1 prototype where Cherenkov gas rings have been successfully detected. Progress towards the encapsulation of new pixel electronics into a tube is also reported. In particular, the status of the development of a binary readout chip with a peaking time of 25 ns and a low and uniform detection threshold is summarized

Performance of hybrid photon detector prototypes with 80% active area for the rich counters of LHCB

Energy Technology Data Exchange (ETDEWEB)

Albrecht, E.; Alemi, M.; Barber, G.; Bibby, J.; Campbell, M.; Duane, A.; Gys, T. E-mail: thierry.gys@cern.ch; Montenegro, J.; Piedigrossi, D.; Schomaker, R.; Snoeys, W.; Wotton, S.; Wyllie, K

2000-03-11

We report on the ongoing work towards a hybrid photon detector with integrated silicon pixel readout for the ring imaging Cherenkov detectors of the LHCb experiment at the Large Hadron Collider at CERN. The photon detector is based on an electrostatically focussed image intensifier tube geometry where the image is de-magnified by a factor of {approx}5. The anode consists of a silicon pixel array, bump-bonded to a binary readout chip with matching pixel electronics. The performance of full-scale prototypes equipped with 61-pixel anodes and external analogue readout is presented. The average signal-to-noise ratio is {approx}11 with a peaking time of 1.2 {mu}s. The tube active-to-total surface ratio is 81.7%, which meets the LHCb requirements. The spatial precision is measured to be better than 90 {mu}m. A cluster of three such tubes has been installed in the LHCb RICH 1 prototype where Cherenkov gas rings have been successfully detected. Progress towards the encapsulation of new pixel electronics into a tube is also reported. In particular, the status of the development of a binary readout chip with a peaking time of 25 ns and a low and uniform detection threshold is summarized.

Highly efficient router-based readout algorithm for single-photon-avalanche-diode imagers for time-correlated experiments

Science.gov (United States)

Cominelli, A.; Acconcia, G.; Caldi, F.; Peronio, P.; Ghioni, M.; Rech, I.

2018-02-01

Time-Correlated Single Photon Counting (TCSPC) is a powerful tool that permits to record extremely fast optical signals with a precision down to few picoseconds. On the other hand, it is recognized as a relatively slow technique, especially when a large time-resolved image is acquired exploiting a single acquisition channel and a scanning system. During the last years, much effort has been made towards the parallelization of many acquisition and conversion chains. In particular, the exploitation of Single-Photon Avalanche Diodes in standard CMOS technology has paved the way to the integration of thousands of independent channels on the same chip. Unfortunately, the presence of a large number of detectors can give rise to a huge rate of events, which can easily lead to the saturation of the transfer rate toward the elaboration unit. As a result, a smart readout approach is needed to guarantee an efficient exploitation of the limited transfer bandwidth. We recently introduced a novel readout architecture, aimed at maximizing the counting efficiency of the system in typical TCSPC measurements. It features a limited number of high-performance converters, which are shared with a much larger array, while a smart routing logic provides a dynamic multiplexing between the two parts. Here we propose a novel routing algorithm, which exploits standard digital gates distributed among a large 32x32 array to ensure a dynamic connection between detectors and external time-measurement circuits.

Evaluation of silicon micro strip detectors with large read-out pitch

International Nuclear Information System (INIS)

Senyo, K.; Yamamura, K.; Tsuboyama, T.; Avrillon, S.; Asano, Y.; Bozek, A.; Natkaniec, Z.; Palka, H.; Rozanska, M.; Rybicki, K.

1996-01-01

For the development of the silicon micro-strip detector with the pitch of the readout strips as large as 250 μm on the ohmic side, we made samples with different structures. Charge collection was evaluated to optimize the width of implant strips, aluminum read-out strips, and/or the read-out scheme among strips. (orig.)

Finite-element simulations of coupling capacitances in capacitively coupled pixel detectors

CERN Document Server

AUTHOR|(SzGeCERN)755510

2017-01-01

Capacitively coupled hybrid silicon pixel-detector assemblies are under study for the vertex detector at the proposed future CLIC linear electron-positron collider. The assemblies consist of active CCPDv3 sensors, with 25 μm pixel pitch implemented in a 180 nm High- Voltage CMOS process, which are glued to the CLICpix readout ASIC, with the same pixel pitch and processed in a commercial 65 nm CMOS technology. The signal created in the silicon bulk of the active sensors passes a two-stage amplifier, in each pixel, and gets transferred as a voltage pulse to metal pads facing the readout chip (ROC). The coupling of the signal to the metal pads on the ROC side proceeds through the capacitors formed between the two chips by a thin layer of epoxy glue. The coupling strength and the amount of unwanted cross coupling to neighbouring pixels depends critically on the uniformity of the glue layer, its thickness and on the alignment precision during the flip-chip assembly process. Finite-element calculations of the coup...

Embedded Adaptive Optics for Ubiquitous Lab-on-a-Chip Readout on Intact Cell Phones

Directory of Open Access Journals (Sweden)

Pakorn Preechaburana

2012-06-01

Full Text Available The evaluation of disposable lab-on-a-chip (LOC devices on cell phones is an attractive alternative to migrate the analytical strength of LOC solutions to decentralized sensing applications. Imaging the micrometric detection areas of LOCs in contact with intact phone cameras is central to provide such capability. This work demonstrates a disposable and morphing liquid lens concept that can be integrated in LOC devices and refocuses micrometric features in the range necessary for LOC evaluation using diverse cell phone cameras. During natural evaporation, the lens focus varies adapting to different type of cameras. Standard software in the phone commands a time-lapse acquisition for best focal selection that is sufficient to capture and resolve, under ambient illumination, 50 μm features in regions larger than 500 × 500 μm². In this way, the present concept introduces a generic solution compatible with the use of diverse and unmodified cell phone cameras to evaluate disposable LOC devices.

Gain calibration of n-XYTER 1.0 - a prototype readout ASIC for the silicon tracking system of the CBM experiment

Energy Technology Data Exchange (ETDEWEB)

Sorokin, Iurii [Goethe Univ. Frankfurt am Main (Germany); Kiev Institute for Nuclear Research (Ukraine); Collaboration: CBM-Collaboration

2013-07-01

n-XYTER is a 128-channel readout ASIC which measures both the integral signal charge and the time of occurance. Due to its self-triggering design, high gain, high rate capability and bipolar front-end, the chip has found a use as a prototype readout for the Silicon Tracking System, Muon and Cherenkov detectors of the CBM experiment. It is also going to be applied in other projects in Darmstadt, Heidelberg and Dubna. To perform gain calibration of n-XYTER, reference charge pulses of a very small (down to 3000 e{sup -}), yet precisely known amplitude had to be generated. This was achieved by attenuating a voltage step to a sub-millivolt level and passing it through a tiny (1 pF) capacitor. Special care had to be taken to check for possible systematic errors in the measurements of the attenuation factor and of the coupling capacitance. In addition, the system had to be well shielded against RF pickup, the parasitic capacitances had to be minimized and ensured to stay invariable. Correct estimate of the systematic error was confirmed by performing a measurement with a different signal source - a planar silicon detector, exposed to γ-radiation of {sup 241}Am. Finally, the dominating error came from the channel-to-channel gain variation.

Novel concept of TDI readout circuit for LWIR detector

Science.gov (United States)

Kim, Byunghyuck; Yoon, Nanyoung; Lee, Hee Chul; Kim, Choong-Ki

2000-07-01

Noise property is the prime consideration in readout circuit design. The output noise caused by the photon noise, which dominates total noise in BLIP detectors, is limited by the integration time that an element looks at a specific point in the scene. Large integration time leads to a low noise performance. Time-delay integration (TDI) is used to effectively increase the integration time and reduce the photon noise. However, it increases the number of dead pixels and requires large integration capacitors and low noise output stage of the readout circuit. In this paper, to solve these problems, we propose a new concept of readout circuit, which performs background suppression, cell-to-cell background current non-uniformity compensation, and dead pixel correction using memory, ADC, DAC, and current copier cell. In simulation results, comparing with the conventional TDI readout circuit, the integration capacitor size can be reduced to 1/5 and trans-impedance gain can be increased by five times. Therefore, the new TDI readout circuit does not require large area and low noise output stage. And the error of skimming current is less than 2%, and the fixed pattern noise induced by cell-to-cell background current variation is reduced to less than 1%.

A read-out buffer prototype for ATLAS high level triggers

CERN Document Server

Calvet, D; Huet, M; Le Dû, P; Mandjavidze, I D; Mur, M

2000-01-01

Read-Out Buffers are critical components in the dataflow chain of the ATLAS Trigger/DAQ system. At up to 75 kHz, after each Level-1 trigger accept signal, these devices receive and store digitized data from groups of front-end electronic channels. Several Read-Out Buffers are grouped to form a Read-Out Buffer Complex that acts as a data server for the High Level Triggers selection algorithms and for the final data collection system. This paper describes a functional prototype of a Read-Out Buffer based on a custom made PCI mezzanine card that is designed to accept input data at up to 160 MB/s, to store up to 8 MB of data and to distribute data chunks at the desired request rate. We describe the hardware of the card that is based on an Intel I960 processor and CPLDs. We present the integration of several of these cards in a Read-Out Buffer Complex. We measure various performance figures and we discuss to which extent these can fulfill ATLAS needs. 5 Refs.

Digital radiography using amorphous selenium: photoconductively activated switch (PAS) readout system.

Science.gov (United States)

Reznik, Nikita; Komljenovic, Philip T; Germann, Stephen; Rowlands, John A

2008-03-01

A new amorphous selenium (a-Se) digital radiography detector is introduced. The proposed detector generates a charge image in the a-Se layer in a conventional manner, which is stored on electrode pixels at the surface of the a-Se layer. A novel method, called photoconductively activated switch (PAS), is used to read out the latent x-ray charge image. The PAS readout method uses lateral photoconduction at the a-Se surface which is a revolutionary modification of the bulk photoinduced discharge (PID) methods. The PAS method addresses and eliminates the fundamental weaknesses of the PID methods--long readout times and high readout noise--while maintaining the structural simplicity and high resolution for which PID optical readout systems are noted. The photoconduction properties of the a-Se surface were investigated and the geometrical design for the electrode pixels for a PAS radiography system was determined. This design was implemented in a single pixel PAS evaluation system. The results show that the PAS x-ray induced output charge signal was reproducible and depended linearly on the x-ray exposure in the diagnostic exposure range. Furthermore, the readout was reasonably rapid (10 ms for pixel discharge). The proposed detector allows readout of half a pixel row at a time (odd pixels followed by even pixels), thus permitting the readout of a complete image in 30 s for a 40 cm x 40 cm detector with the potential of reducing that time by using greater readout light intensity. This demonstrates that a-Se based x-ray detectors using photoconductively activated switches could form a basis for a practical integrated digital radiography system.

A Triggerless readout system for the ANDA electromagnetic calorimeter

NARCIS (Netherlands)

Tiemens, M.

2015-01-01

One of the physics goals of the future ANDA experiment at FAIR is to research newly discovered exotic states. Because the detector response created by these particles is very similar to the background channels, a new type of data readout had to be developed, called "triggerless" readout. In this

Optimal CCD readout by digital correlated double sampling

Science.gov (United States)

Alessandri, C.; Abusleme, A.; Guzman, D.; Passalacqua, I.; Alvarez-Fontecilla, E.; Guarini, M.

2016-01-01

Digital correlated double sampling (DCDS), a readout technique for charge-coupled devices (CCD), is gaining popularity in astronomical applications. By using an oversampling ADC and a digital filter, a DCDS system can achieve a better performance than traditional analogue readout techniques at the expense of a more complex system analysis. Several attempts to analyse and optimize a DCDS system have been reported, but most of the work presented in the literature has been experimental. Some approximate analytical tools have been presented for independent parameters of the system, but the overall performance and trade-offs have not been yet modelled. Furthermore, there is disagreement among experimental results that cannot be explained by the analytical tools available. In this work, a theoretical analysis of a generic DCDS readout system is presented, including key aspects such as the signal conditioning stage, the ADC resolution, the sampling frequency and the digital filter implementation. By using a time-domain noise model, the effect of the digital filter is properly modelled as a discrete-time process, thus avoiding the imprecision of continuous-time approximations that have been used so far. As a result, an accurate, closed-form expression for the signal-to-noise ratio at the output of the readout system is reached. This expression can be easily optimized in order to meet a set of specifications for a given CCD, thus providing a systematic design methodology for an optimal readout system. Simulated results are presented to validate the theory, obtained with both time- and frequency-domain noise generation models for completeness.

Superresolution near-field readout in phase-change optical disk data storage

International Nuclear Information System (INIS)

Peng Chubing

2001-01-01

Readout of a phase-change optical disk with a superresolution (SR) near-field structure (Super-RENS) is theoretically examined on the basis of three-dimensional, full-wave vector diffraction theory. Calculations have demonstrated that Super-RENS has a high spatial resolution beyond the diffraction limit in readout. The read signal is dependent on the nature of SR, the layer structure of the disk, and the state of polarization of the incident laser beam. For the Super-RENS in which antimony is used for SR readout, the readout signal is quite small, and the estimated carrier-to-noise ratio (CNR) is only ∼30 dB for marks of 300 nm. For the Super-RENS in which a metallic region is formed during readout, the read signal is large, and the CNR can be as high as 50 dB in reading 300-nm marks

Optical readout method for solid-state dosemeters

International Nuclear Information System (INIS)

McDonald, J.C.; Eichner, F.N.; Stahl, K.A.; Miller, S.D.

1986-07-01

The readout of solid-state dosemeters is usually accomplished by heating to produce thermoluminescence. This technique has several disadvantages including stressing the dosemeter crystals, melting Teflon enclosures, and destroying the thin dosemeters designed for beta particle measurements. An optical readout method is being developed to avoid these difficulties. Standard dosemeters were irradiated to a dose of approximately 0.02 Sv with 137 Cs gamma rays. The dosemeters were then irradiated with light produced by a high-intensity xenon lamp. Various wavelength bands, from the ultraviolet through the visible and to the near-infrared, were used. The degree of trap emptying was found to be proportional to the total optical power incident. With the intensities used in the preliminary experiments, over 90% trap emptying was achieved. This new technique will prove useful for dosemeters that are encased in plastic for automatic processing. The details of this optical readout method, along with some possible applications in neutron and beta dosimetry are described. 7 refs., 3 figs

STiC — a mixed mode silicon photomultiplier readout ASIC for time-of-flight applications

International Nuclear Information System (INIS)

Harion, T; Briggl, K; Chen, H; Gil, A; Kiworra, V; Schultz-Coulon, H-C; Shen, W; Stankova, V; Fischer, P; Ritzert, M

2014-01-01

STiC is an application specific integrated circuit (ASIC) for the readout of silicon photomultipliers. The chip has been designed to provide a very high timing resolution for time-of-flight applications in medical imaging and particle physics. It is dedicated in particular to the EndoToFPET-US project, which is developing an endoscopic PET detector combined with ultrasound imaging for early pancreas and prostate cancer detection. This PET system aims to provide a spatial resolution of 1 mm and a time-of-flight resolution of 200 ps FWHM. The analog frontend of STiC can use either a differential or single ended connection to the SiPM. The time and energy information of the detector signal is encoded into two time stamps. A special linearized time-over-threshold method is used to obtain a linear relation between the signal charge and the measured signal width, improving the energy resolution. The trigger signals are digitized by an integrated TDC module with a resolution of less than 20 ps. The TDC data is stored in an internal memory and transfered over a 160 MBit/s serial link using 8/10 bit encoding. First coincidence measurements using a 3.1 × 3.1 × 15 mm 3 LYSO crystal and a S10362-33-50 Hamamtsu MPPC show a coincidence time resolution of less than 285 ps. We present details on the chip design as well as first characterization measurements

Radiation hardness and timing studies of a monolithic TowerJazz pixel design for the new ATLAS Inner Tracker

International Nuclear Information System (INIS)

Riegel, C.; Backhaus, M.; Hoorne, J.W. Van; Kugathasan, T.; Musa, L.; Pernegger, H.; Riedler, P.; Schaefer, D.; Snoeys, W.; Wagner, W.

2017-01-01

A part of the upcoming HL-LHC upgrade of the ATLAS Detector is the construction of a new Inner Tracker. This upgrade opens new possibilities, but also presents challenges in terms of occupancy and radiation tolerance. For the pixel detector inside the inner tracker, hybrid modules containing passive silicon sensors and connected readout chips are presently used, but require expensive assembly techniques like fine-pitch bump bonding. Silicon devices fabricated in standard commercial CMOS technologies, which include part or all of the readout chain, are also investigated offering a reduced cost as they are cheaper per unit area than traditional silicon detectors. If they contain the full readout chain, as for a fully monolithic approach, there is no need for the expensive flip-chip assembly, resulting in a further cost reduction and material savings. In the outer pixel layers of the ATLAS Inner Tracker, the pixel sensors must withstand non-ionising energy losses of up to 10 15 n/cm 2 and offer a timing resolution of 25 ns or less. This paper presents test results obtained on a monolithic test chip, the TowerJazz 180nm Investigator, towards these specifications. The presented program of radiation hardness and timing studies has been launched to investigate this technology's potential for the new ATLAS Inner Tracker.

A silicon pixel detector prototype for the CLIC vertex detector

CERN Multimedia

AUTHOR|(INSPIRE)INSPIRE-00714258

2017-01-01

A silicon pixel detector prototype for CLIC, currently under study for the innermost detector surrounding the collision point. The detector is made of a High-Voltage CMOS sensor (top) and a CLICpix2 readout chip (bottom) that are glued to each other. Both parts have a size of 3.3 x 4.0 $mm^2$ and consist of an array of 128 x 128 pixels of 25 x 25 $\\micro m^2$ size.

Characterization of the Photon Counting CHASE Jr., Chip Built in a 40-nm CMOS Process With a Charge Sharing Correction Algorithm Using a Collimated X-Ray Beam

Energy Technology Data Exchange (ETDEWEB)

Krzyżanowska, A. [AGH-UST, Cracow; Deptuch, G. W. [Fermilab; Maj, P. [AGH-UST, Cracow; Gryboś, P. [AGH-UST, Cracow; Szczygieł, R. [AGH-UST, Cracow

2017-08-01

This paper presents the detailed characterization of a single photon counting chip, named CHASE Jr., built in a CMOS 40-nm process, operating with synchrotron radiation. The chip utilizes an on-chip implementation of the C8P1 algorithm. The algorithm eliminates the charge sharing related uncertainties, namely, the dependence of the number of registered photons on the discriminator’s threshold, set for monochromatic irradiation, and errors in the assignment of an event to a certain pixel. The article presents a short description of the algorithm as well as the architecture of the CHASE Jr., chip. The analog and digital functionalities, allowing for proper operation of the C8P1 algorithm are described, namely, an offset correction for two discriminators independently, two-stage gain correction, and different operation modes of the digital blocks. The results of tests of the C8P1 operation are presented for the chip bump bonded to a silicon sensor and exposed to the 3.5- μm -wide pencil beam of 8-keV photons of synchrotron radiation. It was studied how sensitive the algorithm performance is to the chip settings, as well as the uniformity of parameters of the analog front-end blocks. Presented results prove that the C8P1 algorithm enables counting all photons hitting the detector in between readout channels and retrieving the actual photon energy.

A Serializer ASIC at 5 Gbps for Detector Front-end Electronics Readout

CERN Document Server

Gong, D; The ATLAS collaboration; Liu, T; Xiang, A; Ye, J

2010-01-01

High speed and ultra low power serial data transmission over fiber optics plays an essential roll in detector front-end electronics readout for experiments at the LHC. The ATLAS Liquid Argon Calorimeter front-end readout upgrade for the sLHC calls for an optical link system with a data bandwidth of 100 Gbps per each front-end board (FEB), a factor of 62 increase compared with the present optical link system. The transmitter of this optical link will have to withstand the radiation environment where the front-end crates are situated, and stay within the current power dissipation budget limited by the present FEB cooling capacity. To meet these challenges, we developed a 16:1 serializer based on a commercial 0.25 μm silicon-on-sapphire (SOS) CMOS technology. This serializer, designed to work at 5 Gbps, is a key component in an optical link system. Test results of this ASIC will be reported. A system design for the 100 Gbps optical link system will also be presented, with discussions about key components identi...

Multi-anode photon-multiplier readout electronics for the LHCb ring imaging Cherenkov detectors

CERN Document Server

Smale, N J

2004-01-01

A readout system for the Ring Imaging CHerenkov (RICH) detectors of the LHCb experiment has been developed. Two detector technologies for the measurement of Cherenkov photons are considered, the Multi-Anode Photo-Multiplier Tube (MAPMT) and the Hybrid Photon Detector (HPD), both of which meet the RICH requirements. The properties of the MAPMT are evaluated using a controlled single-photon source; a pixel-to-pixel gain variation of ~3 and a typical signal to noise of ~20 is measured. The relative tube efficiency is found to be reduced by ~26 % due to the detailed focusing structure of the MAPMT device. A radiation hard application-specific integrated circuit (ASIC) chip, the Beetle1.2MA0, has been developed to capture and store signals from a pair of MAPMTs. The Beetle1.2MA0 is built on the architecture of the Beetle family that was designed for silicon strip detectors, the difference being a modified front-end amplifier. The 128 input-channels of the Beetle1.2MA0 have a charge-sensitive pre-amplifier followed...

Lab-on-a-disc agglutination assay for protein detection by optomagnetic readout and optical imaging using nano- and micro-sized magnetic beads

DEFF Research Database (Denmark)

Uddin, Rokon; Burger, Robert; Donolato, Marco

2016-01-01

of manual steps involved. The detection of the target protein was achieved in two ways: (1) optomagnetic readout using magnetic nanobeads (MNBs); (2) optical imaging using magnetic microbeads (MMBs). The optomagnetic readout of agglutination is based on optical measurement of the dynamics of MNB aggregates...... whereas the imaging method is based on direct visualization and quantification of the average size of MMB aggregates. By enhancing magnetic particle agglutination via application of strong magnetic field pulses, we obtained identical limits of detection of 25 pM with the same sample-to-answer time (15 min...

Sub-10ps monolithic and low-power photodetector readout

International Nuclear Information System (INIS)

Varner, Gary S.; Ruckman, Larry L.

2009-01-01

Recent advances in photon detectors have resulted in high-density imaging arrays that offer many performance and cost advantages. In particular, the excellent transit time spread of certain devices show promise to provide tangible benefits in applications such as Positron Emission Tomography (PET). Meanwhile, high-density, high-performance readout techniques have not kept on pace for exploiting these developments. Photodetector readout for next generation high event rate particle identification and time-resolved PET requires a highly-integrated, low-power, and cost-effective readout technique. We propose fast waveform sampling as a method that meets these criteria and demonstrate that sub-10ps resolution can be obtained for an existing device

Sub-10ps monolithic and low-power photodetector readout

Energy Technology Data Exchange (ETDEWEB)

Varner, Gary S.; Ruckman, Larry L.

2009-02-20

Recent advances in photon detectors have resulted in high-density imaging arrays that offer many performance and cost advantages. In particular, the excellent transit time spread of certain devices show promise to provide tangible benefits in applications such as Positron Emission Tomography (PET). Meanwhile, high-density, high-performance readout techniques have not kept on pace for exploiting these developments. Photodetector readout for next generation high event rate particle identification and time-resolved PET requires a highly-integrated, low-power, and cost-effective readout technique. We propose fast waveform sampling as a method that meets these criteria and demonstrate that sub-10ps resolution can be obtained for an existing device.

Auxiliary controller for time-to-digital converter module readout

International Nuclear Information System (INIS)

Ermolin, Yu.V.

1992-01-01

The KD-225 auxiliary controller for time-to-digital converter module readout in the SUMMA crate is described. After readout and preliminary processing the data are written in the P-140 buffer memory module. The controller is used in the FODS-2 experimental setup data acquisition system. 12 refs.; 1 fig

Optimization of MKID noise performance via readout technique for astronomical applications

Science.gov (United States)

Czakon, Nicole G.; Schlaerth, James A.; Day, Peter K.; Downes, Thomas P.; Duan, Ran P.; Gao, Jiansong; Glenn, Jason; Golwala, Sunil R.; Hollister, Matt I.; LeDuc, Henry G.; Mazin, Benjamin A.; Maloney, Philip R.; Noroozian, Omid; Nguyen, Hien T.; Sayers, Jack; Siegel, Seth; Vaillancourt, John E.; Vayonakis, Anastasios; Wilson, Philip R.; Zmuidzinas, Jonas

2010-07-01

Detectors employing superconducting microwave kinetic inductance detectors (MKIDs) can be read out by measuring changes in either the resonator frequency or dissipation. We will discuss the pros and cons of both methods, in particular, the readout method strategies being explored for the Multiwavelength Sub/millimeter Inductance Camera (MUSIC) to be commissioned at the CSO in 2010. As predicted theoretically and observed experimentally, the frequency responsivity is larger than the dissipation responsivity, by a factor of 2-4 under typical conditions. In the absence of any other noise contributions, it should be easier to overcome amplifier noise by simply using frequency readout. The resonators, however, exhibit excess frequency noise which has been ascribed to a surface distribution of two-level fluctuators sensitive to specific device geometries and fabrication techniques. Impressive dark noise performance has been achieved using modified resonator geometries employing interdigitated capacitors (IDCs). To date, our noise measurement and modeling efforts have assumed an onresonance readout, with the carrier power set well below the nonlinear regime. Several experimental indicators suggested to us that the optimal readout technique may in fact require a higher readout power, with the carrier tuned somewhat off resonance, and that a careful systematic study of the optimal readout conditions was needed. We will present the results of such a study, and discuss the optimum readout conditions as well as the performance that can be achieved relative to BLIP.

Infrared readout electronics; Proceedings of the Meeting, Orlando, FL, Apr. 21, 22, 1992

Science.gov (United States)

Fossum, Eric R.

The present volume on IR readout electronics discusses cryogenic readout using silicon devices, cryogenic readout using III-V and LTS devices, multiplexers for higher temperatures, and focal-plane signal processing electronics. Attention is given to the optimization of cryogenic CMOS processes for sub-10-K applications, cryogenic measurements of aerojet GaAs n-JFETs, inP-based heterostructure device technology for ultracold readout applications, and a three-terminal semiconductor-superconductor transimpedance amplifier. Topics addressed include unfulfilled needs in IR astronomy focal-plane readout electronics, IR readout integrated circuit technology for tactical missile systems, and radiation-hardened 10-bit A/D for FPA signal processing. Also discussed are the implementation of a noise reduction circuit for spaceflight IR spectrometers, a real-time processor for staring receivers, and a fiber-optic link design for INMOS transputers.

A digital Front-End and Readout MIcrosystem for calorimetry at LHC

CERN Multimedia

2002-01-01

% RD-16 A Digital Front-End and Readout Microsystem for Calorimetry at LHC \\\\ \\\\Front-end signal processing for calorimetric detectors is essential in order to achieve adequate selectivity in the trigger function of an LHC experiment, with data identification and compaction before readout being required in the harsh, high rate environment of a high luminosity hadron machine. Other crucial considerations are the extremely wide dynamic range and bandwidth requirements, as well as the volume of data to be transferred to following stages of the trigger and readout system. These requirements are best met by an early digitalization of the detector information, followed by integrated digital signal processing and buffering functions covering the trigger latencies.\\\\ \\\\The FERMI (Front-End Readout MIcrosystem) is a digital implementation of the front-end and readout electronic chain for calorimeters. It is based on dynamic range compression, high speed A to D converters, a fully programmable pipeline/digital filter c...

Layout techniques to enhance the radiation tolerance of standard CMOS technologies demonstrated on a pixel detector readout chip

CERN Document Server

Snoeys, W; Burns, M; Campbell, M; Cantatore, E; Carrer, N; Casagrande, L; Cavagnoli, A; Dachs, C; Di Liberto, S; Formenti, F; Giraldo, A; Heijne, Erik H M; Jarron, Pierre; Letheren, M F; Marchioro, A; Martinengo, P; Meddi, F; Mikulec, B; Morando, M; Morel, M; Noah, E; Paccagnella, A; Ropotar, I; Saladino, S; Sansen, Willy; Santopietro, F; Scarlassara, F; Segato, G F; Signe, P M; Soramel, F; Vannucci, Luigi; Vleugels, K

2000-01-01

A new pixel readout prototype has been developed at CERN for high- energy physics applications. This full mixed mode circuit has been implemented in a commercial 0.5 mu m CMOS technology. Its radiation tolerance has been enhanced by designing all NMOS transistors in enclosed geometry and introducing guardrings wherever necessary. The technique is explained and its effectiveness demonstrated on various irradiation measurements on individual transistors and on the prototype. Circuit performance started to degrade only after a total dose of 600 krad-1.7 Mrad depending on the type of radiation. 10 keV X-rays, /sup 60/Co gamma-rays, 6.5 MeV protons, and minimum ionizing particles were used. Implications of this layout approach on the circuit design and perspectives for even deeper submicron technologies are discussed. (20 refs).

Dry-film polymer waveguide for silicon photonics chip packaging.

Science.gov (United States)

Hsu, Hsiang-Han; Nakagawa, Shigeru

2014-09-22

Polymer waveguide made by dry film process is demonstrated for silicon photonics chip packaging. With 8 μm × 11.5 μm core waveguide, little penalty is observed up to 25 Gbps before or after the light propagate through a 10-km long single-mode fiber (SMF). Coupling loss to SMF is 0.24 dB and 1.31 dB at the polymer waveguide input and output ends, respectively. Alignment tolerance for 0.5 dB loss increase is +/- 1.0 μm along both vertical and horizontal directions for the coupling from the polymer waveguide to SMF. The dry-film polymer waveguide demonstrates promising performance for silicon photonics chip packaging used in next generation optical multi-chip module.

CMOS Active-Pixel Image Sensor With Intensity-Driven Readout