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Sample records for 3d microsystem packages

  1. Low temperature wafer-level bonding for hermetic packaging of 3D microsystems

    Metallic copper–copper (Cu–Cu) thermo-compression bonding, oxide–oxide (SiO2–SiO2) fusion bonding and silicon–silicon (Si–Si) direct bonding are investigated for potential application as hermetic seal in 3D microsystem packaging. Cavities are etched to a volume of 1.4 × 10−3 cm3 in accordance with the MIL-STD-883E standard prescribed for microelectronics packaging. In the case of metal bonding, a clean Cu layer with a thickness of 300 nm and a Ti barrier layer with an underlying thickness of 50 nm are used. The wafer pair is bonded at 300 °C under the application of a bonding force of 5500 N for 1 h. On the other hand, Si–Si bonding and SiO2–SiO2 bonding are initiated at room ambient after surface activation, followed by annealing in inert ambient at 300 °C for 1 h. The bonded cavities are stored in a helium bomb chamber and the leak rate is measured with a mass spectrometer. An excellent helium leak rate below 5 × 10−9 atm cm3 s−1 is detected for all cases and this is at least ten times better than the reject limit

  2. Laser Sealed Packaging for Microsystems

    Seigneur, Frank; JACOT, Jacques

    2006-01-01

    Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages and drawbacks, and the choice should be driven by the functionality of the microsystem. The advantage of gluing is that it is quite an easy production process. The drawback is that glue, like all polymers, is not hermetic on the long te...

  3. Evaluation of the thermal and hydraulic performances of a very thin sintered copper flat heat pipe for 3D microsystem packages

    Tzanova, S; Avenas, Y; Schaeffer, Ch

    2008-01-01

    The reported research work presents numerical studies validated by experimental results of a flat micro heat pipe with sintered copper wick structure. The objectives of this project are to produce and demonstrate the efficiency of the passive cooling technology (heat pipe) integrated in a very thin electronic substrate that is a part of a multifunctional 3-D electronic package. The enhanced technology is dedicated to the thermal management of high dissipative microsystems having heat densities of more than 10W/cm2. Future applications are envisaged in the avionics sector. In this research 2D numerical hydraulic model has been developed to investigate the performance of a very thin flat micro heat pipe with sintered copper wick structure, using water as a refrigerant. Finite difference method has been used to develop the model. The model has been used to determine the mass transfer and fluid flow in order to evaluate the limits of heat transport capacity as functions of the dimensions of the wick and the vapou...

  4. Development of packaging technologies for microsystems

    JIN Yu-feng; WANG Zhen-feng; WEI Jun

    2003-01-01

    It is well known that packaging plays a very important role in developing microsystems. Packaging accounts for about 60%~80% of cost and function of a microsystem. Package is required to provide mechanical protection, media separation or coupling, signal conditioning, etc.

  5. Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliability

    Low-temperature wafer-level Cu-to-Cu thermo-compression bonding and its reliability for hermetic sealing application have been investigated in this work. The volume of the encapsulated cavities is about 1.4×10−3 cm3 in accordance with the MIL-STD-883E standard prescribed for microelectronics packaging hermeticity measurement. The samples under test are bonded at 300 °C under a bonding force of 5500 N for 1 h in vacuum (∼2.5 × 10−4 mbar) with a 300 nm thick Cu diffusion layer and 50 nm thick Ti barrier layer which are deposited in an e-beam evaporator. The reliability test is accomplished through a temperature cycling test (TCT) from −40 to 125 °C up to 1000 cycles and a humidity test based on IPC/JEDEC J-STD-020 standard. In addition, an immersion in acid/base solution is applied to verify the corrosion resistance of the Cu frame for hermetic application. Excellent helium leak rate which is smaller than the reject limit defined by the MIL-STD-883E standard (method 1014.10) is detected for all the samples. These excellent helium leak rates show an outstanding bonding quality against harsh environment for hermetic encapsulation in 3D integration applications. (paper)

  6. Microsystem reliability: Polymer adhesive and coating materials for packaging

    Janting, Jakob

    design approach to development of reliable microsystem packaging mandatory. Diffusion of water is identified as the most important parameter or physical mechanism lowering microsystem reliability due to corrosion, delamination etc. This topic is therefore treated thoroughly by mathematical modeling......Polymer microsystem packaging materials have been characterized and failure analysis methods have been developed with the aim of gaining higher microsystem reliability. The importance of this work stems from the fact that microsystem sensors due to small size are very sensitive to the often very...

  7. Microsystem technologies for safety in automotive applications - SIFA MST. Partial projects: short time airbag igniters, packaging - MID and 3D-assembly, sensor integration. Final report; Technologien der Mikrosystemtechnik fuer die Sicherheit im Fahrzeug - SIFA-MST. Teilprojekte: Schneller Anzuender, Packaging, Sensorintegration. Abschlussbericht

    Tiederle, V.; Mahrle, J.

    1998-12-17

    Technologies of the microsystem technique for the safety in automobiles with the partial projects: - short time airbag igniters - packaging - MID and 3D-assembly - sensor integration. Development goals for a new generation of airbag igniters based on microsystems technologies (1st partial project) are derived from market- and technical requirements. Short time and low energy for the ignition of the pyrotechniques as well as the potential for monolithical integration to the future decentralized initiator electronics are identified as the main design goals. For the manufacturing of microelectronic components for automotive application (2nd partial project) it is necessary to introduce high quality, low cost processes. The reliability features are to be evaluated, before setting into series production. The knowledge about the behaviour of these componentes and about the handling during the manufacturing is every low. With this motivation the work packages of this part of project has been defined as follows: Single and multi-axial accelerometers are the key elements for the airbag control unit. Micromechanical sensors are becoming increasingly important due to their cost efficient manufacturability. A resonant sensor principle with thermal actuation and signal amplifications by a lever system was investigated (3rd partial project). The sensitivity of the demonstrator sensors was found to be 70 Hz/g at a basic frequency of 400 kHz. A Q-factor beyond 10000 was obtained. This sensor principle allows the minimization of the chip area and a subsequent cost optimization. Multi-axial sensors on a monolithic basis are under increasing demand for the central control unit. A new principle was worked out and tested. For a tire pressure control unit for example a strongly miniaturized pressure sensor with optimizid positioning of piezoresistors on a rectangular membrane was devised. (orig./AKF) [German] Technologien der Mikrosystemtechnik fuer die Sicherheit im Fahrzeug mit den

  8. Reliability of industrial packaging for microsystems

    Reus, Roger De; Christensen, Carsten; Weichel, Steen;

    1998-01-01

    Packaging concepts for silicon-based micromachined sensors exposed to harsh environments are explored. By exposing the sensors directly to the media and applying protection at the wafer level the packaging and assembly will be simplified as compared to conventional methods of fabrication...

  9. Determination of packaging induced 3D stress utilizing a piezocoefficient mapping device

    Richter, Jacob; Hyldgård, A.; Birkelund, Karen;

    2007-01-01

    This paper presents a novel method to determine 3D stress in microsystem packaging. The stress components sigmaxx, sigmayy, sigmazz, and sigmaxy are found in an epoxy package using a piezocoefficient mapping device as stress sensor. We spin the current 360deg in a circular n-type (001) Si...... same concept as in [1] used for chip packaging for fisheries research. We investigate the EpoTek 305 epoxy and find stress values of sigmaxx ap -23 MPa, sigmayy ap -1 MPa, sigmaxy = 0.3 MPa, and sigmazz = 40 MPa. The presented method can be used for 3D stress measurements of various packaging concepts....... piezoresistor by contacts located near the perimeter of the resistor and do high impedance voltage measurements on contacts located near the centre of the resistor. By measuring the potential drops in these contacts we can determine the stress in the chip. The epoxy is potted in a polystyrene tube using the...

  10. Realtime 3D stress measurement in curing epoxy packaging

    Richter, Jacob; Hyldgård, A.; Birkelund, Karen;

    2007-01-01

    This paper presents a novel method to characterize stress in microsystem packaging. A circular p-type piezoresistor is implemented on a (001) silicon chip. We use the circular stress sensor to determine the packaging induced stress in a polystyrene tube filled with epoxy. The epoxy curing process...... is monitored by stress measurements. From the stress measurements we conclude that the epoxy cures in 8 hours at room temperature. We find the difference in in-plane normal stresses to be sigmaxx-sigmayy=6.7 MPa and (sigmaxx+sigmayy-0.4sigmazz)=232 MPa....

  11. 3-D Packaging: A Technology Review

    Strickland, Mark; Johnson, R. Wayne; Gerke, David

    2005-01-01

    Traditional electronics are assembled as a planar arrangement of components on a printed circuit board (PCB) or other type of substrate. These planar assemblies may then be plugged into a motherboard or card cage creating a volume of electronics. This architecture is common in many military and space electronic systems as well as large computer and telecommunications systems and industrial electronics. The individual PCB assemblies can be replaced if defective or for system upgrade. Some applications are constrained by the volume or the shape of the system and are not compatible with the motherboard or card cage architecture. Examples include missiles, camcorders, and digital cameras. In these systems, planar rigid-flex substrates are folded to create complex 3-D shapes. The flex circuit serves the role of motherboard, providing interconnection between the rigid boards. An example of a planar rigid - flex assembly prior to folding is shown. In both architectures, the interconnection is effectively 2-D.

  12. Benchmark for a 3D Monte Carlo boiling water reactor fluence computational package - MF3D

    A detailed three dimensional model of a quadrant of an operating BWR has been developed using MCNP to calculate flux spectrum and fluence levels at various locations in the reactor system. The calculational package, MF3D, was benchmarked against test data obtained over a complete fuel cycle of the host BWR. The test package included activation wires sensitive in both the fast and thermal ranges. Comparisons between the calculational results and test data are good to within ten percent, making the MF3D package an accurate tool for neutron and gamma fluence computation in BWR pressure vessel internals. (orig.)

  13. Assuring ultra-clean environments in microsystem packages : irreversible and reversible getters.

    Zifer, Thomas; Whinnery, LeRoy L., Jr.; Hollenshead, Jeromy Todd; Buffleben, George M.; McElhanon, James Ross; Nilson, Robert H.

    2003-11-01

    A new generation of irreversible, chemically reacting getters specifically targeted toward assuring the integrity of the local environment within microsystem packages were developed and evaluated. These reactive getters incorporate volatile species into a polymer through covalent bonds, thus producing a non-volatile product. These reactive getters will be combined with getters that rely on absorption media (e.g. zeolites and high surface area carbon fibers) to scavenge non-reactive species, like solvents. Our getter systems will rely on device packaging to limit exchange between the microsystem and the global environment. Thus, the internal getters need only provide local environmental control within the microsystem package. A series of experiments were conducted to determine uptake rates and capacities absorption and reactive-based getters. Diffusion rates through the binder used to hold the getter particles together were also investigated. Getters were evaluated in environments with a saturated headspace and with a limited amount of the volatile species of interest. One- and two-dimensional numerical models and analysis techniques have been developed and used to predict the transport of contaminant species within a representative microsystem package consisting of an open gas-filled volume adjacent to a polymer layer containing embedded particles of getter. The two-dimensional model features explicit representation of the individual getter particles while the one-dimensional treatment assumes a homogeneous distribution of getter material within the getterlpolymer layer. Example calculations illustrate the dependence of getter performance on reaction rates, polymer diffusivity, and getter particle volume fraction. In addition, the model is used to deduce surface reaction rates, solid phase diffusivities, and maximum-loading densities by least-squares fitting of model predictions to measured histories of gas-phase contaminant concentration and getter weight gain.

  14. Fabrication of 3D Packaging TSV using DRIE

    Puech, M; Gruffat, J M; Launay, N; Arnal, N; Godinat, P

    2008-01-01

    Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch through-silicon via (TSV) for advanced interconnections. The interconnection step can be done prior to or post CMOS manufacturing, each requiring different etch process performances. A review of the DRIE capability in terms of etching profile, etch rate, etch depth has been carried out. Excellent tool flexibility allows a wide range of basic and complex profiles to be achieved. Unlike other techniques, DRIE has the capability to etch feature sizes ranging from sub-micron to millimeter width. The main specificity of the DRIE is that etch rate is sensitive to the total exposed area and the aspect ratio. For the TSV applications, where the total exposed area is lower than 10%, high etch rates are achievable. A study has also been done to highlight the importance of via profile for the success of the refilling step. In addition, due to the high flexibility of DRIE, we also explore the capability o...

  15. AlN 3D Thermal Packaging Project

    National Aeronautics and Space Administration — This proposal addresses the need for compact, lightweight packaging to cool high heat producing electronics. Technology Assessment & Transfer, Inc. (TA&T)...

  16. A Review of Failure Analysis Methods for Advanced 3D Microelectronic Packages

    Li, Yan; Srinath, Purushotham Kaushik Muthur; Goyal, Deepak

    2016-01-01

    Advanced three dimensional (3D) packaging is a key enabler in driving form factor reduction, performance benefits, and package cost reduction, especially in the fast paced mobility and ultraportable consumer electronics segments. The high level of functional integration and the complex package architecture pose a significant challenge for conventional fault isolation (FI) and failure analysis (FA) methods. Innovative FI/FA tools and techniques are required to tackle the technical and throughput challenges. In this paper, the applications of FI and FA techniques such as Electro Optic Terahertz Pulse Reflectometry, 3D x-ray computed tomography, lock-in thermography, and novel physical sample preparation methods to 3D packages with package on package and stacked die with through silicon via configurations are reviewed, along with the key FI and FA challenges.

  17. Inferring 3D Articulated Models for Box Packaging Robot

    Yang, Heran; Cong, Matthew; Saxena, Ashutosh

    2011-01-01

    Given a point cloud, we consider inferring kinematic models of 3D articulated objects such as boxes for the purpose of manipulating them. While previous work has shown how to extract a planar kinematic model (often represented as a linear chain), such planar models do not apply to 3D objects that are composed of segments often linked to the other segments in cyclic configurations. We present an approach for building a model that captures the relation between the input point cloud features and the object segment as well as the relation between the neighboring object segments. We use a conditional random field that allows us to model the dependencies between different segments of the object. We test our approach on inferring the kinematic structure from partial and noisy point cloud data for a wide variety of boxes including cake boxes, pizza boxes, and cardboard cartons of several sizes. The inferred structure enables our robot to successfully close these boxes by manipulating the flaps.

  18. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

    Miniaturization of solid state lighting (SSL) luminaires as well as reduction of packaging and assembly costs are of prime interest for the SSL lighting industry. A novel silicon based LED package for lighting applications is presented in this paper. The proposed design consists of 5 rigid Si tiles connected by flexible polyimide hinges with embedded interconnects (ICs). Electrical, optical and thermal characteristics were taken into consideration during design. The fabrication process involved polyimide (PI) application and patterning, aluminium interconnect integration in the flexible hinge, LED reflector cavity formation and metalization followed by through wafer DRIE etching for chip formation and release. A method to connect chip front to backside without TSVs was also integrated into the process. Post-fabrication wafer level assembly included LED mounting and wirebond, phosphor-based colour conversion and silicone encapsulation. The package formation was finalized by vacuum assisted wrapping around an assembly structure to form a 3D geometry, which is beneficial for omnidirectional lighting. Bending tests were performed on the flexible ICs and optical performance at different temperatures was evaluated. It is suggested that 3D packages can be expanded to platforms for miniaturized luminaire applications by combining monolithic silicon integration and system-in-package (SiP) technologies. (paper)

  19. A Switchable 3D-Coverage Phased Array Antenna Package for 5G Mobile Terminals

    Ojaroudiparchin, Naser; Shen, Ming; Zhang, Shuai;

    2016-01-01

    This manuscript proposes a new design of a millimeter-wave (mm-Wave) array antenna package with beam steering characteristic for the fifth generation (5G) mobile applications. In order to achieve a broad 3D scanning coverage of the space with high-gain beams, three identical sub arrays of patch...... antennas have been compactly arranged along the edge region of the mobile phone PCB to form the antenna package. By switching the feeding to one of the sub arrays, the desired direction of coverage can be achieved. The proposed design has >10 dB gain in the upper spherical space, good directivity and...

  20. Three dimensional field computation software package DE3D and its applications

    A software package DE3D, which can be run on PC, for three dimensional electrostatic and magnetostatic field computations is developed in China Institute of Atomic Energy. The features of the code and its applications are introduced. Typical examples are given on the design of a cyclotron magnet and magnetic elements on its beam transport line, which show how the program help the designer to improve his design of products

  1. Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products

    K.; N.; TU; TIAN; Tian

    2013-01-01

    Metallurgical challenges in controlling the microstructural stability of Cu and solder microbumps in 3D IC packaging technol-ogy are discussed. Using uni-directional <111> oriented nanotwinned Cu, the controlled growth of oriented Cu6Sn5 on the nanotwinned Cu and its transformation to Cu3Sn without Kirkendall voids have been achieved. In order to join a stack of Si chips into a 3D device, multiple reflows of solder microbumps may be required; we consider localized heating to do so by the use of self-sustained explosive reaction in multi-layered Al/Ni thin films of nano thickness. It avoids re-melting of those solder joints which have been formed already in the 3D stacking structure.

  2. A reliable Cu–Sn stack bonding technology for 3D-TSV packaging

    In this paper, Cu–Sn stack bonding technology for 3D-TSV packaging was described; some key technologies such as TSV (through silicon via) formation, silicon wafer thinning, TSV electroplating and Cu–Sn multilayer stack bonding were introduced. First of all, some sample chips with TSV and Cu–Sn bonding pads were fabricated for stacking. Then, two kinds of stack bonding experiments with or without TSV were carried out, respectively. 3-die, 7-die, and 10-die stacks were bonded and assembled. Finally, the bonding strengths of 3D-TSV stacking were characterized by shear test and tensile test, and also the electrical properties, thermal properties and corrosion resistance of stacked module. All the test results suggested that the reliable stack bonding technology can be used for 3D integration applications. (paper)

  3. Science version 2: the most recent capabilities of the Framatome 3-D nuclear code package

    The Framatome nuclear code package SCIENCE developed in the 1990's has been fully operational for nuclear design since 1997. Results obtained using the package demonstrate the high accuracy of its physical models. Nevertheless, since the first release of the SCIENCE package, continuous improvement work has been carried out at Framatome, which leads today to Version 2 of the package. The intensive use of the package by Framatome teams, for example, while performing reload calculations and the associated core follow, is a permanent opportunity to point out any trend or scattering in the results, even the smaller they are. Thus the main objective of improvements was to take advantage of the progress in computer performances in using more sophisticated calculation schemes conducting to more accurate results. Besides the implementation of more accurate physical models, SCIENCE Version 2 also exploits developments conducted in other fields, mainly for transient calculations using 3-D kinetics or coupling with open-channel core thermal-hydraulics and the plant simulator. These developments allow Framatome to perform accident analyses with advanced methodologies using the SCIENCE package. (author)

  4. 3-D land subsidence simulation using the NDIS package for MODFLOW

    Kang, D. H.; Li, J.

    2015-11-01

    The standard subsidence package for MODFLOW, MODFLOW-SUB simulates aquifer-system compaction and subsidence assuming that only 1-D-vertical displacement of the aquifer system occurs in response to applied stresses such as drawdowns accompanying groundwater extraction. In the present paper, 3-D movement of an aquifer system in responses to one or more pumping wells is considered using the new aquifer-system deformation package for MODFLOW, NDIS. The simulation of aquifer- system 3-D movement using NDIS was conducted with a stress or hydraulic head dependent specific storage coefficient to simulate nonlinear deformation behavior of aquifer-system sedimentary materials. NDIS's numerical simulation for aquifer horizontal movement is consistent with an analytic solution for horizontal motion in response to pumping from a leaky confined aquifer (Li, 2007). For purposes of comparison, vertical subsidence of the aquifer system in response to groundwater pumping is simulated by the both the NDIS and MODFLOW-SUB models. The results of the simulations show that land subsidence simulated by MODFLOW-SUB is significantly larger and less sensitive to pumping rate and time than that simulated by NDIS. The NDIS simulations also suggest that if the total pumpage is the same, pumping from a single well may induce more land subsidence than pumping from multiple wells.

  5. UCVM: An Open Source Software Package for Querying and Visualizing 3D Velocity Models

    Gill, D.; Small, P.; Maechling, P. J.; Jordan, T. H.; Shaw, J. H.; Plesch, A.; Chen, P.; Lee, E. J.; Taborda, R.; Olsen, K. B.; Callaghan, S.

    2015-12-01

    Three-dimensional (3D) seismic velocity models provide foundational data for ground motion simulations that calculate the propagation of earthquake waves through the Earth. The Southern California Earthquake Center (SCEC) has developed the Unified Community Velocity Model (UCVM) package for both Linux and OS X. This unique framework provides a cohesive way for querying and visualizing 3D models. UCVM v14.3.0, supports many Southern California velocity models including CVM-S4, CVM-H 11.9.1, and CVM-S4.26. The last model was derived from 26 full-3D tomographic iterations on CVM-S4. Recently, UCVM has been used to deliver a prototype of a new 3D model of central California (CCA) also based on full-3D tomographic inversions. UCVM was used to provide initial plots of this model and will be used to deliver CCA to users when the model is publicly released. Visualizing models is also possible with UCVM. Integrated within the platform are plotting utilities that can generate 2D cross-sections, horizontal slices, and basin depth maps. UCVM can also export models in NetCDF format for easy import into IDV and ParaView. UCVM has also been prototyped to export models that are compatible with IRIS' new Earth Model Collaboration (EMC) visualization utility. This capability allows for user-specified horizontal slices and cross-sections to be plotted in the same 3D Earth space. UCVM was designed to help a wide variety of researchers. It is currently being use to generate velocity meshes for many SCEC wave propagation codes, including AWP-ODC-SGT and Hercules. It is also used to provide the initial input to SCEC's CyberShake platform. For those interested in specific data points, the software framework makes it easy to extract P and S wave propagation speeds and other material properties from 3D velocity models by providing a common interface through which researchers can query earth models for a given location and depth. Also included in the last release was the ability to add small

  6. System-in-package LTCC platform for 3D RF to millimeter wave

    Vähä-Heikkilä, T.; Lahti, M.

    2011-04-01

    This presentation shows recent trends and results in 3D Low Temperature Co-Fired Ceramics (LTCC) modules in applications from RF to millimeter waves. The system-in-package LTCC platform is a true three dimensional module technology. LTCC is a lightweight multi-layer technology having typically 6-20 ceramic layers and metallizations between. The metallization levels i.e different metal layers can be patterned and connected together with metal vias. Passive devices can also be fabricated on LTCC while active devices and other chips are connected with flip-chip, wire bonding or soldering. In addition to passives directly fabricated to LTCC, several different technologies/ chips can be hybrid integrated to the same module. LTCC platform is also well suited for the realization of antenna arrays for microwave and millimeter wave applications. Potential applications are ranging from short range communications to space and radars. VTT has designed, fabricated and characterized microwave and millimeter wave packages for Radio Frequency (RF) Micro Electro Mechanical Systems (MEMS) as well as active devices. Also, several types of system-in-package modules have been realized containing hybrid integrated CMOS and GaAs MMICs and antenna arrays.

  7. LIGHT-WEIGHT SENSOR PACKAGE FOR PRECISION 3D MEASUREMENT WITH MICRO UAVS E.G. POWER-LINE MONITORING

    Kuhnert, K.-D.; Kuhnert, L.

    2013-01-01

    The paper describes a new sensor package for micro or mini UAVs and one application that has been successfully implemented with this sensor package. It is intended for 3D measurement of landscape or large outdoor structures for mapping or monitoring purposes. The package can be composed modularly into several configurations. It may contain a laser-scanner, camera, IMU, GPS and other sensors as required by the application. Also different products of the same sensor type have been inte...

  8. Package analysis of 3D-printed piezoresistive strain gauge sensors

    Das, Sumit Kumar; Baptist, Joshua R.; Sahasrabuddhe, Ritvij; Lee, Woo H.; Popa, Dan O.

    2016-05-01

    Poly(3,4-ethyle- nedioxythiophene)-poly(styrenesulfonate) or PEDOT:PSS is a flexible polymer which exhibits piezo-resistive properties when subjected to structural deformation. PEDOT:PSS has a high conductivity and thermal stability which makes it an ideal candidate for use as a pressure sensor. Applications of this technology includes whole body robot skin that can increase the safety and physical collaboration of robots in close proximity to humans. In this paper, we present a finite element model of strain gauge touch sensors which have been 3D-printed onto Kapton and silicone substrates using Electro-Hydro-Dynamic ink-jetting. Simulations of the piezoresistive and structural model for the entire packaged sensor was carried out using COMSOLR , and compared with experimental results for validation. The model will be useful in designing future robot skin with predictable performances.

  9. 3-D readout-electronics packaging for high-bandwidth massively paralleled imager

    Kwiatkowski, Kris; Lyke, James

    2007-12-18

    Dense, massively parallel signal processing electronics are co-packaged behind associated sensor pixels. Microchips containing a linear or bilinear arrangement of photo-sensors, together with associated complex electronics, are integrated into a simple 3-D structure (a "mirror cube"). An array of photo-sensitive cells are disposed on a stacked CMOS chip's surface at a 45.degree. angle from light reflecting mirror surfaces formed on a neighboring CMOS chip surface. Image processing electronics are held within the stacked CMOS chip layers. Electrical connections couple each of said stacked CMOS chip layers and a distribution grid, the connections for distributing power and signals to components associated with each stacked CSMO chip layer.

  10. Evaluating Dense 3d Reconstruction Software Packages for Oblique Monitoring of Crop Canopy Surface

    Brocks, S.; Bareth, G.

    2016-06-01

    Crop Surface Models (CSMs) are 2.5D raster surfaces representing absolute plant canopy height. Using multiple CMSs generated from data acquired at multiple time steps, a crop surface monitoring is enabled. This makes it possible to monitor crop growth over time and can be used for monitoring in-field crop growth variability which is useful in the context of high-throughput phenotyping. This study aims to evaluate several software packages for dense 3D reconstruction from multiple overlapping RGB images on field and plot-scale. A summer barley field experiment located at the Campus Klein-Altendorf of University of Bonn was observed by acquiring stereo images from an oblique angle using consumer-grade smart cameras. Two such cameras were mounted at an elevation of 10 m and acquired images for a period of two months during the growing period of 2014. The field experiment consisted of nine barley cultivars that were cultivated in multiple repetitions and nitrogen treatments. Manual plant height measurements were carried out at four dates during the observation period. The software packages Agisoft PhotoScan, VisualSfM with CMVS/PMVS2 and SURE are investigated. The point clouds are georeferenced through a set of ground control points. Where adequate results are reached, a statistical analysis is performed.

  11. Study on a robust insert-bump (ISB) bonding technique for a 3D package

    Lee, J. H.; Song, J. Y.; Kim, S. M.; Kim, Y. J.; Lee, Y. K.

    2016-07-01

    The Cu pillar bump to Cu pillar bump bonding process, commonly used in bonding technology for the 3D stacking of TSV (through silicon via) formed chips, requires an additional process for the generation of bumps on the face and back-side of the chip, and it has a drawback in that it is structurally vulnerable to mechanical stresses, such as thermal stress. This study proposes an ISB (insert-bump) bonding process to overcome such drawbacks. Compared to the conventional Cu pillar bump to Cu pillar bump bonding process, the ISB bonding process has advantages in that it is simple and has high mechanical reliability of the package due to the mechanical interlocking. The stress distributions at the joints of the packages produced from Cu pillar bump to Cu pillar bump bonding and ISB processes were compared and analyzed through FEM analyses, and characteristics analyses of the fracture mode and joint characteristics; process variable optimization with respect to the bonding parameters was also conducted through experiments. The results of the analyses and experiments verified that the ISB bonding process yields a bonding strength of 917.6 mgf/bump, which is approximately twice as much as that of the conventional Cu pillar bump to Cu pillar bump bonding, and which yields a highly reliable mechanical structure.

  12. HALLEY: A 3D Orbital Integration and Visualization Software Package for Undergraduate Applications

    Williams, Darren M.; Palma, C.; Williams, H. R.

    2010-01-01

    Almost no one outside the astronomical community understands gravity and orbital motion. This is at odds with the seemingly boundless public enthusiasm for space exploration and interest in the origin of the Solar System. Although programs for calculating the orbits of planets and spacecraft are now available to anyone with a computer, most programs available on the internet do require some expertise and are not well suited for K-12 or lower-level undergraduate applications. We are developing an astronomy software package known as Halley that can be used for both pedagogical and research-grade simulations; and that can both accurately compute the orbits of planets and spacecraft, and generate three-dimensional stills and movies of the orbital motion. Halley is designed using IDL (Interactive Display Language) software and powered using the IDL Virtual Machine, a program that allows users to freely share and run IDL code on any computer. The software is an improvement over comparable programs available on the internet that either lack 3D display capability, or that cannot compute the orbits of hypothetical, user-generated systems. In addition to these advantages, Halley will be designed with students and teachers in mind, and will be uniquely tied to both undergraduate and K-12 education. We anticipate that Halley will broadly improve the introduction and teaching of astronomy and science to people at all stages of education.

  13. Use of 3D imaging in CT of the acute trauma patient: impact of a PACS-based software package.

    Soto, Jorge A; Lucey, Brain C; Stuhlfaut, Joshua W; Varghese, Jose C

    2005-04-01

    To evaluate the impact of a picture archiving and communication systems (PACS)-based software package on the requests for 3D reconstructions of multidetector CT (MDCT) data sets in the emergency radiology of a level 1 trauma center, we reviewed the number and type of physician requests for 3D reconstructions of MDCT data sets for patients admitted after sustaining multiple trauma, during a 12-month period (January 2003-December 2003). During the first 5 months of the study, 3D reconstructions were performed in dedicated workstations located separately from the emergency radiology CT interpretation area. During the last 7 months of the study, reconstructions were performed online by the attending radiologist or resident on duty, using a software package directly incorporated into the PACS workstations. The mean monthly number of 3D reconstructions requested during the two time periods was compared using Student's t test. The monthly mean +/- SD of 3D reconstructions performed before and after 3D software incorporation into the PACS was 34+/-7 (95% CI, 10-58) and 132+/-31 (95% CI, 111-153), respectively. This difference was statistically significant (p<0.0001). In the multiple trauma patient, implementation of PACS-integrated software increases utilization of 3D reconstructions of MDCT data sets. PMID:16028324

  14. PRIAM/ANTIGONE: a 2D/3D Package for accelerator design

    Le Meur, G.; Touze, F. [Paris-11 Univ., 91 - Orsay (France). Lab. de l`Accelerateur Lineaire]|[Paris-11 Univ., 91 - Orsay (France)

    1994-07-01

    The status of the finite element package PRIAM/ANTIGONE, developed at LAL for electromagnetic engineering, is presented. A short review of the available capabilities of the package is given. (authors). 4 refs.

  15. PRIAM/ANTIGONE: a 2D/3D Package for accelerator design

    The status of the finite element package PRIAM/ANTIGONE, developed at LAL for electromagnetic engineering, is presented. A short review of the available capabilities of the package is given. (authors). 4 refs

  16. Light-Weight Sensor Package for Precision 3d Measurement with Micro Uavs E.G. Power-Line Monitoring

    Kuhnert, K.-D.; Kuhnert, L.

    2013-08-01

    The paper describes a new sensor package for micro or mini UAVs and one application that has been successfully implemented with this sensor package. It is intended for 3D measurement of landscape or large outdoor structures for mapping or monitoring purposes. The package can be composed modularly into several configurations. It may contain a laser-scanner, camera, IMU, GPS and other sensors as required by the application. Also different products of the same sensor type have been integrated. Always it contains its own computing infrastructure and may be used for intelligent navigation, too. It can be operated in cooperation with different drones but also completely independent of the type of drone it is attached to. To show the usability of the system, an application in monitoring high-voltage power lines that has been successfully realised with the package is described in detail.

  17. Implantable biomedical microsystems design principles and applications

    Bhunia, Swarup; Sawan, Mohamad

    2015-01-01

    Research and innovation in areas such as circuits, microsystems, packaging, biocompatibility, miniaturization, power supplies, remote control, reliability, and lifespan are leading to a rapid increase in the range of devices and corresponding applications in the field of wearable and implantable biomedical microsystems, which are used for monitoring, diagnosing, and controlling the health conditions of the human body. This book provides comprehensive coverage of the fundamental design principles and validation for implantable microsystems, as well as several major application areas. Each co

  18. Development in Electronic Packaging – Moving to 3D System Configuration

    I. Szendiuch

    2011-04-01

    Full Text Available The electronic industry is reducing package dimensions of components as well as complete electronics systems. Surface mount device passives and semiconductor chips have to be mounted together bringing a functional system that must realize the required function with necessary reliability and acceptable price. To make up a reliable and cost effective system, the size and weight is being reduced by employing lower voltages and higher speeds. For example, the typical size of SMD passives 30 years ago was 1206 when they were first introduced. Generally, all components including electrical joints are becoming miniaturized and smaller. The industry is moving toward a reduced size of 0201 and 01005 for passives, new fine pitch packages for actives, but the PCB now feature limits for further integration. System on Package (SOP is one way to reach the three-dimensional package concept where components will be placed in three-dimensional configuration. A similar concepts are “Package on Package” (PoP or ”Package in Package” (PiP.

  19. Standardizing the microsystems technology description

    Liateni, Karim; Thomas, Gabriel; Hui Bon Hoa, Christophe; Bensaude, David

    2002-04-01

    The microsystems industry is promising a rapid and widespread growth for the coming years. The automotive, network, telecom and electronics industries take advantage of this technology by including it in their products; thus, getting better integration and high energetic performances. Microsystems related software and data exchange have inherited from the IC technology experience or standards, which appear not to fit the advanced level of conception currently needed by microsystems designers. A typical design flow to validate a microsystem device involves several software from disconnected areas like layout editors, FEM simulators, HDL modeling and simulation tools. However, and fabricated microsystem is obtained through execution of a layered process. Process characteristics will be used at each level of the design and analysis. Basically, the designer will have to customize each of his tools after the process. The project introduced here intends to unify the process description language and speed up the critical and tedious CAD customization task. We gather all the information related to the technology of a microsystem process in a single file. It is based on the XML standard format to receive worldwide attention. This format is called XML-MTD, standing for XML Microsystems Technology Description. Built around XML, it is an ASCII format which gives the ability to handle a comprehensive database for technology data. This format is open, given under general public license, but the aim is to manage the format withing a XML-MTD consortium of leader and well-established EDA companies and Foundries. In this way, it will take profit of their experience. For automated configuration of design and analysis tools regarding process-dependant information, we ship the Technology Manger software. Technology Manager links foundries with a large panel of standard EDA and FEA packages used by design teams relying on the Microsystems Technology Description in XML-MTD format.

  20. Heterogeneously integrated microsystem-on-a-chip

    Chanchani, Rajen

    2008-02-26

    A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect structure, and can include embedded passives. The stacked wafer technology provides a heterogeneously integrated, ultra-miniaturized, higher performing, robust and cost-effective microsystem package. The highly integrated microsystem package, comprising electronics, sensors, optics, and MEMS, can be miniaturized both in volume and footprint to the size of a bottle-cap or less.

  1. Silicon carbide microsystems for harsh environments

    Wijesundara, Muthu B J

    2011-01-01

    Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods

  2. MEMS packaging

    Hsu , Tai-Ran

    2004-01-01

    MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing.The Institution of Engineering and Technology is

  3. Microsystem process networks

    Wegeng, Robert S.; TeGrotenhuis, Ward E.; Whyatt, Greg A.

    2006-10-24

    Various aspects and applications of microsystem process networks are described. The design of many types of microsystems can be improved by ortho-cascading mass, heat, or other unit process operations. Microsystems having exergetically efficient microchannel heat exchangers are also described. Detailed descriptions of numerous design features in microcomponent systems are also provided.

  4. Microsystem design

    Senturia, Stephen D

    2007-01-01

    Foreword. Preface. Acknowledgments. Part I: Getting Started. 1. Introduction. 2. An Approach to MEMS Design. 3. Microfabrication. 4. Process Integration. Part II: Modeling Strategies. 5. Lumped Modeling. 6. Energy-Conserving Transducers. 7. Dynamics. Part III: Domain-Specific Details. 8. Elasticity. 9. Structures. 10. Energy Methods. 11. Dissipation and the Thermal Energy Domain. 12. Lumped Modeling of Dissipative Processes. 13. Fluids. Part IV: Circuit and System Issues. 14. Electronics. 15. Feedback Systems. 16. Noise. Part V: Case Studies. 17. Packaging. 18. A Piezoresistive Pres

  5. Biomedical microsystems

    Meng, Ellis

    2010-01-01

    IntroductionEvolution of MEMSApplications of MEMSBioMEMS ApplicationsMEMS ResourcesText Goals and OrganizationMiniaturization and ScalingBioMEMS MaterialsTraditional MEMS and Microelectronic MaterialsPolymeric Materials for MEMSBiomaterialsMicrofabrication Methods and Processes for BioMEMSIntroductionMicrolithographyDopingMicromachiningWafer Bonding, Assembly, and PackagingSurface TreatmentConversion Factors for Energy and Intensity UnitsLaboratory ExercisesMicrofluidicsIntroduction and Fluid PropertiesConcepts in MicrofluidicsFluid-Transport Phenomena and PumpingFlow ControlLaboratory Exercis

  6. Implications of intelligent, integrated microsystems for product design and development

    Intelligent, integrated microsystems combine some or all of the functions of sensing, processing information, actuation, and communication within a single integrated package, and preferably upon a single silicon chip. As the elements of these highly integrated solutions interact strongly with each other, the microsystem can be neither designed nor fabricated piecemeal, in contrast to the more familiar assembled products. Driven by technological imperatives, microsystems will best be developed by multi-disciplinary teams, most likely within the flatter, less hierarchical organizations. Standardization of design and process tools around a single, dominant technology will expedite economically viable operation under a common production infrastructure. The production base for intelligent, integrated microsystems has elements in common with the mathematical theory of chaos. Similar to chaos theory, the development of microsystems technology will be strongly dependent on, and optimized to, the initial product requirements that will drive standardization--thereby further rewarding early entrants to integrated microsystem technology

  7. Implications of intelligent, integrated microsystems for product design and development

    MYERS,DAVID R.; MCWHORTER,PAUL J.

    2000-04-19

    Intelligent, integrated microsystems combine some or all of the functions of sensing, processing information, actuation, and communication within a single integrated package, and preferably upon a single silicon chip. As the elements of these highly integrated solutions interact strongly with each other, the microsystem can be neither designed nor fabricated piecemeal, in contrast to the more familiar assembled products. Driven by technological imperatives, microsystems will best be developed by multi-disciplinary teams, most likely within the flatter, less hierarchical organizations. Standardization of design and process tools around a single, dominant technology will expedite economically viable operation under a common production infrastructure. The production base for intelligent, integrated microsystems has elements in common with the mathematical theory of chaos. Similar to chaos theory, the development of microsystems technology will be strongly dependent on, and optimized to, the initial product requirements that will drive standardization--thereby further rewarding early entrants to integrated microsystem technology.

  8. Full 3D internal strain measurement for device packaging materials using synchrotron laminography and volumetric digital image correlation method

    In order to measure full 3D internal strain field of resin molding compound specimens, synchrotron computed tomography and laminography at SPring-8 were performed. Then the reconstructed images were applied to 3D digital image correlation method to compute internal strain field. The results showed that internal strains in resin molding compound could be visualized in this way. (author)

  9. Developing a 3D Game Design Authoring Package to Assist Students' Visualization Process in Design Thinking

    Kuo, Ming-Shiou; Chuang, Tsung-Yen

    2013-01-01

    The teaching of 3D digital game design requires the development of students' meta-skills, from story creativity to 3D model construction, and even the visualization process in design thinking. The characteristics a good game designer should possess have been identified as including redesign things, creativity thinking and the ability to…

  10. Microsystem Aeromechanics Wind Tunnel

    Federal Laboratory Consortium — The Microsystem Aeromechanics Wind Tunnel advances the study of fundamental flow physics relevant to micro air vehicle (MAV) flight and assesses vehicle performance...

  11. Using Single-Camera 3-D Imaging to Guide Material Handling Robots in a Nuclear Waste Package Closure System

    Nuclear reactors for generating energy and conducting research have been in operation for more than 50 years, and spent nuclear fuel and associated high-level waste have accumulated in temporary storage. Preparing this spent fuel and nuclear waste for safe and permanent storage in a geological repository involves developing a robotic packaging system--a system that can accommodate waste packages of various sizes and high levels of nuclear radiation. During repository operation, commercial and government-owned spent nuclear fuel and high-level waste will be loaded into casks and shipped to the repository, where these materials will be transferred from the casks into a waste package, sealed, and placed into an underground facility. The waste packages range from 12 to 20 feet in height and four and a half to seven feet in diameter. Closure operations include sealing the waste package and all its associated functions, such as welding lids onto the container, filling the inner container with an inert gas, performing nondestructive examinations on welds, and conducting stress mitigation. The Idaho National Laboratory is designing and constructing a prototype Waste Package Closure System (WPCS). Control of the automated material handling is an important part of the overall design. Waste package lids, welding equipment, and other tools must be moved in and around the closure cell during the closure process. These objects are typically moved from tool racks to a specific position on the waste package to perform a specific function. Periodically, these objects are moved from a tool rack or the waste package to the adjacent glovebox for repair or maintenance. Locating and attaching to these objects with the remote handling system, a gantry robot, in a loosely fixtured environment is necessary for the operation of the closure cell. Reliably directing the remote handling system to pick and place the closure cell equipment within the cell is the major challenge

  12. Preconditioning techniques for constrained vector potential integral equations, with application to 3-D magnetoquasistatic analysis of electronic packages

    Kamon, M.; Phillips, J.R. [Massachusetts Institute of Technology, Cambridge, MA (United States)

    1994-12-31

    In this paper techniques are presented for preconditioning equations generated by discretizing constrained vector integral equations associated with magnetoquasistatic analysis. Standard preconditioning approaches often fail on these problems. The authors present a specialized preconditioning technique and prove convergence bounds independent of the constraint equations and electromagnetic excitation frequency. Computational results from analyzing several electronic packaging examples are given to demonstrate that the new preconditioning approach can sometimes reduce the number of GMRES iterations by more than an order of magnitude.

  13. Dosimetric evaluation of a commercial 3D treatment planning system using the AAPM Task Group 23 test package.

    Casanova Borca, Valeria; Pasquino, Massimo; Bresciani, Sara; Catuzzo, Paola; Ozzello, Franca; Tofani, Santi

    2005-03-01

    The accuracy of the dose calculation algorithm is one of the most critical steps in assessing the radiotherapy treatment to achieve the 5% accuracy in dose delivery, which represents the suggested limit to increase the complication-free local control of tumor. We have used the AAPM Task Group 23 (TG-23) test package for clinical photon external beam therapy to evaluate the accuracy of the new version of the PLATO TPS algorithm. The comparison between tabulated values and calculated ones has been performed for 266 and 297 dose values for the 4 and 18 MV photon beams, respectively. Dose deviations less than 2% were found in the 98.5%- and 90.6% analyzed dose points for the two considered energies, respectively. Larger deviations were obtained for both energies, in large dose gradients, such as the build-up region or near the field edges and blocks. As far as the radiological field width is concerned, 64 points were analyzed for both the energies: 53 points (83%) and 64 points (100%) were within +/-2 millimeters for the 4 and 18 MV photon beams, respectively. The results show the good accuracy of the algorithm either in simple geometry beam conditions or in complex ones, in homogeneous medium, and in the presence of inhomogeneities, for low and high energy beams. Our results fit well the data reported by several authors related to the calculation accuracy of different treatment planning systems (TPSs) (within a mean value of 0.7% and 1.2% for 4 and 18 MV respectively). The TG-23 test package can be considered a powerful instrument to evaluate dose calculation accuracy, and as such may play an important role in a quality assurance program related to the commissioning of a new TPS. PMID:15839346

  14. Microsystem design framework based on tool adaptations and library developments

    Karam, Jean Michel; Courtois, Bernard; Rencz, Marta; Poppe, Andras; Szekely, Vladimir

    1996-09-01

    Besides foundry facilities, Computer-Aided Design (CAD) tools are also required to move microsystems from research prototypes to an industrial market. This paper describes a Computer-Aided-Design Framework for microsystems, based on selected existing software packages adapted and extended for microsystem technology, assembled with libraries where models are available in the form of standard cells described at different levels (symbolic, system/behavioral, layout). In microelectronics, CAD has already attained a highly sophisticated and professional level, where complete fabrication sequences are simulated and the device and system operation is completely tested before manufacturing. In comparison, the art of microsystem design and modelling is still in its infancy. However, at least for the numerical simulation of the operation of single microsystem components, such as mechanical resonators, thermo-elements, elastic diaphragms, reliable simulation tools are available. For the different engineering disciplines (like electronics, mechanics, optics, etc) a lot of CAD-tools for the design, simulation and verification of specific devices are available, but there is no CAD-environment within which we could perform a (micro-)system simulation due to the different nature of the devices. In general there are two different approaches to overcome this limitation: the first possibility would be to develop a new framework tailored for microsystem-engineering. The second approach, much more realistic, would be to use the existing CAD-tools which contain the most promising features, and to extend these tools so that they can be used for the simulation and verification of microsystems and of the devices involved. These tools are assembled with libraries in a microsystem design environment allowing a continuous design flow. The approach is driven by the wish to make microsystems accessible to a large community of people, including SMEs and non-specialized academic institutions.

  15. Control of dynamic microsystems

    Lyshevski, Sergey Edward

    2015-11-01

    This paper formulates and solves control problems for nonlinear microsystems which comprise micro-electromechanical devices, micromachined transducers and microelectronics. We perform a consistent dynamic analysis and coherent designs with a minimum level of simplifications using high-fidelity mathematical models. The proposed methodology enables practical implementation for multi-input/multi-output systems due to overall conceptual consistency, design coherence, computational efficiency, algorithmic effectiveness and hardware simplicity. Various issues in nonlinear analysis and control are examined and experimentally verified substantiating design concepts for high-performance microsystems. The reported findings are demonstrated for a proof-of-concept closed-loop electrostatic microactuator.

  16. Microscopic TV Holography for Microsystems Metrology

    Upputuri Paul Kumar

    2011-09-01

    Full Text Available Normal 0 false false false MicrosoftInternetExplorer4 The continuously advancing Micro-Electro-Mechanical Systems (MEMS technology requires a robust non-contact quantitative measurement system for the characterization of their performance, reliability and integrity. A TV holographic system with long working distance microscope is developed for the static, dynamic and 3-D surface profile characterization of Microsystems. The system can be operated either in continuous or stroboscopic illumination mode of operation. In this paper we present the development of a microscopic imaging system and its applications for Microsystems Metrology.Defence Science Journal, 2011, 61(5, pp.491-498, DOI:http://dx.doi.org/10.14429/dsj.61.908 Normal 0 false false false MicrosoftInternetExplorer4  

  17. Electrohydrodynamic pumping in microsystems

    Ramos, Antonio, E-mail: ramos@us.es [Deptartamento de Electronica y Electromagnetismo, Universidad de Sevilla, Avenida Reina Mercedes s/n, 41012-Sevilla (Spain)

    2011-06-23

    The physical principles behind the electrohydrodynamic (EHD) actuation in microsystems is presented by reviewing five different EHD micropumps. These are classified into two groups: micropumps that exert electric forces in the liquid bulk and micropumps that exert forces in the diffuse double layer. This review of five EHD micropumps allows us to analyse the EHD actuation ranging from very insulating liquids to electrolytic solutions.

  18. Microsystems technology: objectives

    Fluitman, Jan

    1996-01-01

    This contribution focuses on the objectives of microsystems technology (MST). The reason for this is two fold. First of all, it should explain what MST actually is. This question is often posed and a simple answer is lacking, as a consequence of the diversity of subjects that are perceived as MST. T

  19. Blender 3D cookbook

    Valenza, Enrico

    2015-01-01

    This book is aimed at the professionals that already have good 3D CGI experience with commercial packages and have now decided to try the open source Blender and want to experiment with something more complex than the average tutorials on the web. However, it's also aimed at the intermediate Blender users who simply want to go some steps further.It's taken for granted that you already know how to move inside the Blender interface, that you already have 3D modeling knowledge, and also that of basic 3D modeling and rendering concepts, for example, edge-loops, n-gons, or samples. In any case, it'

  20. SU-C-201-06: Utility of Quantitative 3D SPECT/CT Imaging in Patient Specific Internal Dosimetry of 153-Samarium with GATE Monte Carlo Package

    Purpose: Patient-specific 3-dimensional (3D) internal dosimetry in targeted radionuclide therapy is essential for efficient treatment. Two major steps to achieve reliable results are: 1) generating quantitative 3D images of radionuclide distribution and attenuation coefficients and 2) using a reliable method for dose calculation based on activity and attenuation map. In this research, internal dosimetry for 153-Samarium (153-Sm) was done by SPECT-CT images coupled GATE Monte Carlo package for internal dosimetry. Methods: A 50 years old woman with bone metastases from breast cancer was prescribed 153-Sm treatment (Gamma: 103keV and beta: 0.81MeV). A SPECT/CT scan was performed with the Siemens Simbia-T scanner. SPECT and CT images were registered using default registration software. SPECT quantification was achieved by compensating for all image degrading factors including body attenuation, Compton scattering and collimator-detector response (CDR). Triple energy window method was used to estimate and eliminate the scattered photons. Iterative ordered-subsets expectation maximization (OSEM) with correction for attenuation and distance-dependent CDR was used for image reconstruction. Bilinear energy mapping is used to convert Hounsfield units in CT image to attenuation map. Organ borders were defined by the itk-SNAP toolkit segmentation on CT image. GATE was then used for internal dose calculation. The Specific Absorbed Fractions (SAFs) and S-values were reported as MIRD schema. Results: The results showed that the largest SAFs and S-values are in osseous organs as expected. S-value for lung is the highest after spine that can be important in 153-Sm therapy. Conclusion: We presented the utility of SPECT-CT images and Monte Carlo for patient-specific dosimetry as a reliable and accurate method. It has several advantages over template-based methods or simplified dose estimation methods. With advent of high speed computers, Monte Carlo can be used for treatment planning

  1. Extension of the simulation capabilities of the 1D system code ATHLET by coupling with the 3D CFD software package ANSYS CFX

    The thermal-hydraulic system code ATHLET (Analysis of THermal-hydraulics of LEaks and Transients) is developed at Gesellschaft fuer Anlagen- und Reaktorsicherheit (GRS) for the analysis of anticipated and abnormal plant transients, small and intermediate leaks as well as large breaks in light water reactors. The aim of the code development is to cover the whole spectrum of design basis and beyond design basis accidents (without core degradation) for PWRs and BWRs. In order to extend the simulation capabilities of the 1D system code ATHLET, different approaches are applied at GRS to enable multidimensional thermal-hydraulic representation of relevant primary circuit geometries. One of the current major strategies at the technical safety organization is the coupling of ATHLET with the commercial 3D Computational Fluid Dynamics (CFD) software package ANSYS CFX. This code is a general purpose CFD software program that combines an advanced solver with powerful pre- and post-processing capabilities. It is an efficient tool for simulating the behavior of systems involving fluid flow, heat transfer, and other related physical processes. In the frame of the German CFD Network on Nuclear Reactor Safety, GRS and ANSYS Germany developed a general computer interface for the coupling of both codes. This paper focuses on the methodology and the challenges related to the coupling process. A great number of simulations including test cases with closed loop configurations have been carried out to evaluate and improve the performance of the coupled code system. Selected results of the 1D-3D thermal-hydraulic calculations are presented and analyzed. Preliminary comparative calculations with CFX-ATHLET and ATHLET stand alone showed very good agreement. Nevertheless, an extensive validation of the developed coupled code is planned. Finally, the optimization potential of the coupling methodology is discussed. (author)

  2. SU-C-201-06: Utility of Quantitative 3D SPECT/CT Imaging in Patient Specific Internal Dosimetry of 153-Samarium with GATE Monte Carlo Package

    Fallahpoor, M; Abbasi, M [Tehran University of Medical Sciences, Vali-Asr Hospital, Tehran, Tehran (Iran, Islamic Republic of); Sen, A [University of Houston, Houston, TX (United States); Parach, A [Shahid Sadoughi University of Medical Sciences, Yazd, Yazd (Iran, Islamic Republic of); Kalantari, F [UT Southwestern Medical Center, Dallas, TX (United States)

    2015-06-15

    Purpose: Patient-specific 3-dimensional (3D) internal dosimetry in targeted radionuclide therapy is essential for efficient treatment. Two major steps to achieve reliable results are: 1) generating quantitative 3D images of radionuclide distribution and attenuation coefficients and 2) using a reliable method for dose calculation based on activity and attenuation map. In this research, internal dosimetry for 153-Samarium (153-Sm) was done by SPECT-CT images coupled GATE Monte Carlo package for internal dosimetry. Methods: A 50 years old woman with bone metastases from breast cancer was prescribed 153-Sm treatment (Gamma: 103keV and beta: 0.81MeV). A SPECT/CT scan was performed with the Siemens Simbia-T scanner. SPECT and CT images were registered using default registration software. SPECT quantification was achieved by compensating for all image degrading factors including body attenuation, Compton scattering and collimator-detector response (CDR). Triple energy window method was used to estimate and eliminate the scattered photons. Iterative ordered-subsets expectation maximization (OSEM) with correction for attenuation and distance-dependent CDR was used for image reconstruction. Bilinear energy mapping is used to convert Hounsfield units in CT image to attenuation map. Organ borders were defined by the itk-SNAP toolkit segmentation on CT image. GATE was then used for internal dose calculation. The Specific Absorbed Fractions (SAFs) and S-values were reported as MIRD schema. Results: The results showed that the largest SAFs and S-values are in osseous organs as expected. S-value for lung is the highest after spine that can be important in 153-Sm therapy. Conclusion: We presented the utility of SPECT-CT images and Monte Carlo for patient-specific dosimetry as a reliable and accurate method. It has several advantages over template-based methods or simplified dose estimation methods. With advent of high speed computers, Monte Carlo can be used for treatment planning

  3. Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

    Talebanpour, B.; Huang, Z.; Chen, Z.; Dutta, I.

    2016-01-01

    In 3-dimensional (3D) packages, a stack of dies is vertically connected to each other using through-silicon vias and very thin solder micro-bumps. The thinness of the micro-bumps results in joints with a very high volumetric proportion of intermetallic compounds (IMCs), rendering them much more brittle compared to conventional joints. Because of this, the reliability of micro-bumps, and the dependence thereof on the proportion of IMC in the joint, is of substantial concern. In this paper, the growth kinetics of IMCs in thin Sn-3Ag-0.5Cu joints attached to Cu substrates were analyzed, and empirical kinetic laws for the growth of Cu6Sn5 and Cu3Sn in thin joints were obtained. Modified compact mixed mode fracture mechanics samples, with adhesive solder joints between massive Cu substrates, having similar thickness and IMC content as actual micro-bumps, were produced. The effects of IMC proportion and strain rate on fracture toughness and mechanisms were investigated. It was found that the fracture toughness G C decreased with decreasing joint thickness ( h Joint). In addition, the fracture toughness decreased with increasing strain rate. Aging also promoted alternation of the crack path between the two joint-substrate interfaces, possibly proffering a mechanism to enhance fracture toughness.

  4. Microsystem Cooler Development

    Moran, Matthew E.; Wesolek, Danielle M.; Berhane, Bruk T.; Rebello, Keith J.

    2004-01-01

    A patented microsystem Stirling cooler is under development with potential application to electronics, sensors, optical and radio frequency (RF) systems, microarrays, and other microsystems. The microsystem Stirling cooler is most suited to volume-limited applications that require cooling below the ambient or sink temperature. Primary components of the planar device include: two diaphragm actuators that replace the pistons found in traditional-scale Stirling machines; and a micro-regenerator that stores and releases thermal energy to the working gas during the Stirling cycle. The use of diaphragms eliminates frictional losses and bypass leakage concerns associated with pistons, while permitting reversal of the hot and cold sides of the device during operation to allow precise temperature control. Three candidate microregenerators were custom fabricated for initial evaluation: two constructed of porous ceramic, and one made of multiple layers of nickel and photoresist in an offset grating pattern. An additional regenerator was prepared with a random stainless steel fiber matrix commonly used in existing Stirling machines for comparison to the custom fabricated regenerators. The candidate regenerators were tested in a piezoelectric-actuated test apparatus designed to simulate the Stirling refrigeration cycle. In parallel with the regenerator testing, electrostatically-driven comb-drive diaphragm actuators for the prototype device have been designed for deep reactive ion etching (DRIE) fabrication.

  5. A generic synthetic image generator package for the evaluation of 3D Digital Image Correlation and other computer vision-based measurement techniques

    Garcia, Dorian; Orteu, Jean-José; Robert, Laurent; Wattrisse, Bertrand; Bugarin, Florian

    2013-01-01

    Stereo digital image correlation (also called 3D DIC) is a common measurement technique in experimental mechanics for measuring 3D shapes or 3D displacement/strain fields, in research laboratories as well as in industry. Nevertheless, like most of the optical full-field measurement techniques, 3D DIC suffers from a lack of information about its metrological performances. For the 3D DIC technique to be fully accepted as a standard measurement technique it is of key importance to assess its mea...

  6. Flow dynamics and sedimentation of lateral accretion packages in sinuous deep-water channels: A 3D seismic case study from the northwestern South China Sea margin

    Li, Shengli; Gong, Chenglin

    2016-07-01

    The current study uses 3D seismic data to document architectural styles and flow dynamics of lateral accretion packages (LAPs) associated with sinuous deep-water channels, contributing to a better understanding of flow processes and sedimentation associated with LAPs. The documented LAPs underwent three main stages of architectural evolution, including the early incision stages characterized by intense downcutting, active migration stages characterized by active migration and avulsion of the individual channels, and late abandonment stages characterized by the termination of sediment gravity-flows and LAP growth. These three stages of LAP growth repeated through time, yielding a fining-upward pattern from sandy channel-fill turbidites, into sand-mud couplets, all capped by muddy turbidites. A river-reversed helical flow circulation was created by an imbalance, through the flow depth, of inwardly directed pressure gradient forces near the bed and outwardly directed centrifugal forces near the surface. It consists of low-velocity cores near the outer banks and low-velocity cores along the inner banks. Such river-reversed helical flow pattern is evidenced by volumetrically extensive LAPs and toplap and downlap terminations along the gentle banks and by aerially restricted, seismically unresolvable levees and truncation terminations near the steep banks. This river-reversed helical flow circulation favors asymmetric intra-channel deposition characterized by inner bank deposition versus outer bank erosion, and which, in turn, forced individual channels to consistently migrate towards outer banks, resulting in significant asymmetric cross-channel profiles with aerially extensive LAPs along inner banks.

  7. Microsystems technology: objectives

    Fluitman, Jan

    1996-01-01

    This contribution focuses on the objectives of microsystems technology (MST). The reason for this is two fold. First of all, it should explain what MST actually is. This question is often posed and a simple answer is lacking, as a consequence of the diversity of subjects that are perceived as MST. The second reason is that a map of the somewhat chaotic field of MST is needed to identify sub-territories, for which standardization in terms of system modules an interconnections is feasible. To d...

  8. Design of 3D integrated circuits and systems

    Sharma, Rohit

    2014-01-01

    Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and sys

  9. Integrated genetic analysis microsystems

    With the completion of the Human Genome Project and the ongoing DNA sequencing of the genomes of other animals, bacteria, plants and others, a wealth of new information about the genetic composition of organisms has become available. However, as the demand for sequence information grows, so does the workload required both to generate this sequence and to use it for targeted genetic analysis. Microfabricated genetic analysis systems are well poised to assist in the collection and use of these data through increased analysis speed, lower analysis cost and higher parallelism leading to increased assay throughput. In addition, such integrated microsystems may point the way to targeted genetic experiments on single cells and in other areas that are otherwise very difficult. Concomitant with these advantages, such systems, when fully integrated, should be capable of forming portable systems for high-speed in situ analyses, enabling a new standard in disciplines such as clinical chemistry, forensics, biowarfare detection and epidemiology. This review will discuss the various technologies available for genetic analysis on the microscale, and efforts to integrate them to form fully functional robust analysis devices. (topical review)

  10. Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems

    Kopola, Harri K.; Karioja, Pentti; Rusanen, Outi; Lehto, Heikki; Lammasniemi, Jorma

    1998-03-01

    This paper presents an overview of the research and development work on packaging and manufacturing different optoelectronic modules and microsystems for spectroscopic applications at VTT Electronics. Four different spectrometer concepts are analyzed: a multiwavelength detector module, an LED array spectrometer module, a PGP-spectrograph and an IR- spectrometer on silicon. The construction, main features, packaging concepts and performance are reviewed.

  11. 2D and 3D heterogeneous photonic integrated circuits

    Yoo, S. J. Ben

    2014-03-01

    Exponential increases in the amount of data that need to be sensed, communicated, and processed are continuing to drive the complexity of our computing, networking, and sensing systems. High degrees of integration is essential in scalable, practical, and cost-effective microsystems. In electronics, high-density 2D integration has naturally evolved towards 3D integration by stacking of memory and processor chips with through-silicon-vias. In photonics, too, we anticipate highdegrees of 3D integration of photonic components to become a prevailing method in realizing future microsystems for information and communication technologies. However, compared to electronics, photonic 3D integration face a number of challenges. This paper will review two methods of 3D photonic integration --- fs laser inscription and layer stacking, and discuss applications and future prospects.

  12. Wafer level 3-D ICs process technology

    Tan, Chuan Seng; Reif, L Rafael

    2009-01-01

    This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

  13. Microsystem integration from RF to millimeter wave applications

    Vähä-Heikkilä, T.; Lahti, M.

    2015-05-01

    Radio frequency systems have been applied successfully to consumer products. Typically these radios operate up to 6 GHz. During recent years, interest towards microwave (up to 30 GHz) and millimeter wave frequencies (30 ... 300 GHz) has increased significantly. Technologies have been developed to have high performance microwave and millimeter wave components. On the other hand, integration and packaging technologies have not developed as fast while their importance is crucial especially in consumer applications. This presentation focuses to latest trends in wireless microsystem component integration and packaging trends backed up with demonstrators and measured results based on VTT's demonstrations.

  14. A Wireless and Batteryless Microsystem with Implantable Grid Electrode/3-Dimensional Probe Array for ECoG and Extracellular Neural Recording in Rats

    Chih-Wei Chang

    2013-04-01

    Full Text Available This paper presents the design and implementation of an integrated wireless microsystem platform that provides the possibility to support versatile implantable neural sensing devices in free laboratory rats. Inductive coupled coils with low dropout regulator design allows true long-term recording without limitation of battery capacity. A 16-channel analog front end chip located on the headstage is designed for high channel account neural signal conditioning with low current consumption and noise. Two types of implantable electrodes including grid electrode and 3D probe array are also presented for brain surface recording and 3D biopotential acquisition in the implanted target volume of tissue. The overall system consumes less than 20 mA with small form factor, 3.9 × 3.9 cm2 mainboard and 1.8 × 3.4 cm2 headstage, is packaged into a backpack for rats. Practical in vivo recordings including auditory response, brain resection tissue and PZT-induced seizures recording demonstrate the correct function of the proposed microsystem. Presented achievements addressed the aforementioned properties by combining MEMS neural sensors, low-power circuit designs and commercial chips into system-level integration.

  15. Construction and 3-D computer modeling of connector arrays with tetragonal to decagonal transition induced by pRNA of phi29 DNA-packaging motor.

    Guo, Yin Yin; Blocker, Forrest; Xiao, Feng; Guo, Peixuan

    2005-06-01

    The bottom-up assembly of patterned arrays is an exciting and important area in current nanotechnology. Arrays can be engineered to serve as components in chips for a virtually inexhaustible list of applications ranging from disease diagnosis to ultrahigh-density data storage. In attempting to achieve this goal, a number of methods to facilitate array design and production have been developed. Cloning and expression of the gene coding for the connector of the bacterial virus phi29 DNA-packaging motor, overproduction of the gene products, and the in vitro construction of large-scale carpet-like arrays composed of connector are described in this report. The stability of the arrays under various conditions, including varied pH, temperature and ionic strength, was tested. The addition of packaging RNA (pRNA) into the array caused a dramatic shift in array structure, and resulted in the conversion of tetragonal arrays into larger decagonal structures comprised of both protein and RNA. RNase digestion confirmed that the conformational shift was caused by pRNA, and that RNA was present in the decagons. As has been demonstrated in biomotors, conformational shift of motor components can generate force for motor motion. The conformational shift reported here can be utilized as a potential force-generating mechanism for the construction of nanomachines. Three-dimensional computer models of the constructed arrays were also produced using a variety of connector building blocks with or without the N- or C-terminal sequence, which is absent from the current published crystal structures. Both the connector array and the decagon are ideal candidates to be used as templates to build patterned suprastructures in nanotechnology. PMID:16060143

  16. Microsystems for biological cell characterization

    Rissanen, Anna

    2012-01-01

    This thesis describes three techniques for the characterization of living cells using micro-electro-mechanical systems (MEMS) based devices. The study of cellular function and structure is essential for bioprocess control, disease diagnosis, patient treatment and drug discovery. Microsystem technology enables characterization of very small samples, minimal use of expensive reagents, testing of multiple samples in parallel, and point-of-care testing, all of which increase throughput and reduce...

  17. 3D video

    Lucas, Laurent; Loscos, Céline

    2013-01-01

    While 3D vision has existed for many years, the use of 3D cameras and video-based modeling by the film industry has induced an explosion of interest for 3D acquisition technology, 3D content and 3D displays. As such, 3D video has become one of the new technology trends of this century.The chapters in this book cover a large spectrum of areas connected to 3D video, which are presented both theoretically and technologically, while taking into account both physiological and perceptual aspects. Stepping away from traditional 3D vision, the authors, all currently involved in these areas, provide th

  18. 3D Animation Essentials

    Beane, Andy

    2012-01-01

    The essential fundamentals of 3D animation for aspiring 3D artists 3D is everywhere--video games, movie and television special effects, mobile devices, etc. Many aspiring artists and animators have grown up with 3D and computers, and naturally gravitate to this field as their area of interest. Bringing a blend of studio and classroom experience to offer you thorough coverage of the 3D animation industry, this must-have book shows you what it takes to create compelling and realistic 3D imagery. Serves as the first step to understanding the language of 3D and computer graphics (CG)Covers 3D anim

  19. Does HDR Pre-Processing Improve the Accuracy of 3D Models Obtained by Means of two Conventional SfM-MVS Software Packages? The Case of the Corral del Veleta Rock Glacier

    Álvaro Gómez-Gutiérrez

    2015-08-01

    Full Text Available The accuracy of different workflows using Structure-from-Motion and Multi-View-Stereo techniques (SfM-MVS is tested. Twelve point clouds of the Corral del Veleta rock glacier, in Spain, were produced with two different software packages (123D Catch and Agisoft Photoscan, using Low Dynamic Range images and High Dynamic Range compositions (HDR for three different years (2011, 2012 and 2014. The accuracy of the resulting point clouds was assessed using benchmark models acquired every year with a Terrestrial Laser Scanner. Three parameters were used to estimate the accuracy of each point cloud: the RMSE, the Cloud-to-Cloud distance (C2C and the Multiscale-Model-to-Model comparison (M3C2. The M3C2 mean error ranged from 0.084 m (standard deviation of 0.403 m to 1.451 m (standard deviation of 1.625 m. Agisoft Photoscan overcome 123D Catch, producing more accurate and denser point clouds in 11 out 12 cases, being this work, the first available comparison between both software packages in the literature. No significant improvement was observed using HDR pre-processing. To our knowledge, this is the first time that the geometrical accuracy of 3D models obtained using LDR and HDR compositions are compared. These findings may be of interest for researchers who wish to estimate geomorphic changes using SfM-MVS approaches.

  20. Researching and Designing Photovoltaic Microsystems

    Hilse, D.; Kapała, J.; Sztymelski, K.; Zeltins, N.; Ekmanis, J.

    2016-02-01

    Research on the photovoltaic module efficiency in the south of Poland was conducted in 2009 in Stryszawa and afterwards in 2012 in Zabrze and Stryszawa. The research involved taking measurements of electric energy produced by systems of various power and technical solutions. The efficiency of PV modules was compared to the intensity of solar radiation in the locations under consideration and, thus, the efficiency of converting solar energy into electricity was determined. The research results facilitated designing and mounting of forty PV microsystems in Zabrze in 2014 (power from 2000 Wp to 3000 Wp). To the satisfaction of their users, they operate without failure.

  1. Optimized microsystems-enabled photovoltaics

    Cruz-Campa, Jose Luis; Nielson, Gregory N.; Young, Ralph W.; Resnick, Paul J.; Okandan, Murat; Gupta, Vipin P.

    2015-09-22

    Technologies pertaining to designing microsystems-enabled photovoltaic (MEPV) cells are described herein. A first restriction for a first parameter of an MEPV cell is received. Subsequently, a selection of a second parameter of the MEPV cell is received. Values for a plurality of parameters of the MEPV cell are computed such that the MEPV cell is optimized with respect to the second parameter, wherein the values for the plurality of parameters are computed based at least in part upon the restriction for the first parameter.

  2. EUROPEANA AND 3D

    D. Pletinckx

    2012-09-01

    Full Text Available The current 3D hype creates a lot of interest in 3D. People go to 3D movies, but are we ready to use 3D in our homes, in our offices, in our communication? Are we ready to deliver real 3D to a general public and use interactive 3D in a meaningful way to enjoy, learn, communicate? The CARARE project is realising this for the moment in the domain of monuments and archaeology, so that real 3D of archaeological sites and European monuments will be available to the general public by 2012. There are several aspects to this endeavour. First of all is the technical aspect of flawlessly delivering 3D content over all platforms and operating systems, without installing software. We have currently a working solution in PDF, but HTML5 will probably be the future. Secondly, there is still little knowledge on how to create 3D learning objects, 3D tourist information or 3D scholarly communication. We are still in a prototype phase when it comes to integrate 3D objects in physical or virtual museums. Nevertheless, Europeana has a tremendous potential as a multi-facetted virtual museum. Finally, 3D has a large potential to act as a hub of information, linking to related 2D imagery, texts, video, sound. We describe how to create such rich, explorable 3D objects that can be used intuitively by the generic Europeana user and what metadata is needed to support the semantic linking.

  3. Solid works 3D

    This book explains modeling of solid works 3D and application of 3D CAD/CAM. The contents of this book are outline of modeling such as CAD and 2D and 3D, solid works composition, method of sketch, writing measurement fixing, selecting projection, choosing condition of restriction, practice of sketch, making parts, reforming parts, modeling 3D, revising 3D modeling, using pattern function, modeling necessaries, assembling, floor plan, 3D modeling method, practice floor plans for industrial engineer data aided manufacturing, processing of CAD/CAM interface.

  4. Copper Electrodeposition for 3D Integration

    Beica, Rozalia; Ritzdorf, Tom

    2008-01-01

    Two dimensional (2D) integration has been the traditional approach for IC integration. Due to increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages, has driven the semiconductor industry to develop more advanced packaging technologies. Three-dimensional (3D) approaches address both miniaturization and integration required for advanced and portable electronic products. Vertical integration proved to be essential in achieving a greater integration flexibility of disparate technologies, reason for which a general trend of transition from 2D to 3D integration is currently being observed in the industry. 3D chip integration using through silicon via (TSV) copper is considered one of the most advanced technologies among all different types of 3D packaging technologies. Copper electrodeposition is one of technologies that enable the formation of TSV structures. Because of its well-known application for copper damascene, it was believed ...

  5. Open 3D Projects

    Felician ALECU

    2010-01-01

    Full Text Available Many professionals and 3D artists consider Blender as being the best open source solution for 3D computer graphics. The main features are related to modeling, rendering, shading, imaging, compositing, animation, physics and particles and realtime 3D/game creation.

  6. 3d-3d correspondence revisited

    Chung, Hee-Joong; Dimofte, Tudor; Gukov, Sergei; Sułkowski, Piotr

    2016-04-01

    In fivebrane compactifications on 3-manifolds, we point out the importance of all flat connections in the proper definition of the effective 3d {N}=2 theory. The Lagrangians of some theories with the desired properties can be constructed with the help of homological knot invariants that categorify colored Jones polynomials. Higgsing the full 3d theories constructed this way recovers theories found previously by Dimofte-Gaiotto-Gukov. We also consider the cutting and gluing of 3-manifolds along smooth boundaries and the role played by all flat connections in this operation.

  7. IZDELAVA TISKALNIKA 3D

    Brdnik, Lovro

    2015-01-01

    Diplomsko delo analizira trenutno stanje 3D tiskalnikov na trgu. Prikazan je razvoj in principi delovanja 3D tiskalnikov. Predstavljeni so tipi 3D tiskalnikov, njihove prednosti in slabosti. Podrobneje je predstavljena zgradba in delovanje koračnih motorjev. Opravljene so meritve koračnih motorjev. Opisana je programska oprema za rokovanje s 3D tiskalniki in komponente, ki jih potrebujemo za izdelavo. Diploma se oklepa vprašanja, ali je izdelava 3D tiskalnika bolj ekonomična kot pa naložba v ...

  8. Bayesian tomographic reconstruction of microsystems

    Salem, Sofia Fekih; Vabre, Alexandre; Mohammad-Djafari, Ali

    2007-11-01

    The microtomography by X ray transmission plays an increasingly dominating role in the study and the understanding of microsystems. Within this framework, an experimental setup of high resolution X ray microtomography was developed at CEA-List to quantify the physical parameters related to the fluids flow in microsystems. Several difficulties rise from the nature of experimental data collected on this setup: enhanced error measurements due to various physical phenomena occurring during the image formation (diffusion, beam hardening), and specificities of the setup (limited angle, partial view of the object, weak contrast). To reconstruct the object we must solve an inverse problem. This inverse problem is known to be ill-posed. It therefore needs to be regularized by introducing prior information. The main prior information we account for is that the object is composed of a finite known number of different materials distributed in compact regions. This a priori information is introduced via a Gauss-Markov field for the contrast distributions with a hidden Potts-Markov field for the class materials in the Bayesian estimation framework. The computations are done by using an appropriate Markov Chain Monte Carlo (MCMC) technique. In this paper, we present first the basic steps of the proposed algorithms. Then we focus on one of the main steps in any iterative reconstruction method which is the computation of forward and adjoint operators (projection and backprojection). A fast implementation of these two operators is crucial for the real application of the method. We give some details on the fast computation of these steps and show some preliminary results of simulations.

  9. 3D and Education

    Meulien Ohlmann, Odile

    2013-02-01

    Today the industry offers a chain of 3D products. Learning to "read" and to "create in 3D" becomes an issue of education of primary importance. 25 years professional experience in France, the United States and Germany, Odile Meulien set up a personal method of initiation to 3D creation that entails the spatial/temporal experience of the holographic visual. She will present some different tools and techniques used for this learning, their advantages and disadvantages, programs and issues of educational policies, constraints and expectations related to the development of new techniques for 3D imaging. Although the creation of display holograms is very much reduced compared to the creation of the 90ies, the holographic concept is spreading in all scientific, social, and artistic activities of our present time. She will also raise many questions: What means 3D? Is it communication? Is it perception? How the seeing and none seeing is interferes? What else has to be taken in consideration to communicate in 3D? How to handle the non visible relations of moving objects with subjects? Does this transform our model of exchange with others? What kind of interaction this has with our everyday life? Then come more practical questions: How to learn creating 3D visualization, to learn 3D grammar, 3D language, 3D thinking? What for? At what level? In which matter? for whom?

  10. European Master Programs in Nanoelectronics and Microsystems

    Bruun, Erik; Demarchi, Danilo; Nielsen, Ivan Ring

    Nanotechnology and Microsystems are having increasing impact on university curricula in electrical engineering. The advent of nanotechnology brings about new possibilities in nanoelectronics, including increasingly complex systems on chip, sophisticated technology fusion between electronic devices...

  11. Microsystems for cellular force measurement: a review

    Microsystems are providing key advances in studying single cell mechanical behavior. The mechanical interaction of cells with their extracellular matrix is fundamentally important for cell migration, division, phagocytosis and aptoptosis. This review reports the development of microsystems on studying cell forces. Microsystems provide advantages of studying single cells since the scale of cells is on the micron level. The components of microsystems provide culture, loading, guiding, trapping and on chip analysis of cellular mechanical forces. This paper gives overviews on how MEMS are advancing in the field of cell biomechno sensory systems. It presents different materials, and mode of studying cell mechanics. Finally, we comment on the future directions and challenges on the state of art techniques

  12. Sensors and Microsystems : AISEM 2011 Proceedings

    Natale, Corrado; Mosiello, Lucia; Zappa, Giovanna

    2012-01-01

    This book contains a selection of papers presented at the 16th AISEM (“Associazione Italiana Sensori e Microsistemi”) National Conference on Sensors and Microsystems, held in Rome 7-9 February 2011. The conference highlighted updated results from both theoretical and applied research in the field of sensors and microsystems. This book presents material in an interdisciplinary approach, covering many aspects of the disciplines related to sensors and microsystems, including physics, chemistry, materials science, biology and applications. Provides a selection of the best papers from the most recent AISEM conference; Covers a broad range of topics relating to sensors and microsystems, including physics, chemistry, materials science, biology and applications; Offers interdisciplinary coverage, aimed at defining a common ground for sensors beyond the specific differences among the different particular implementation of sensors.              

  13. European Master Programs in Nanoelectronics and Microsystems

    Bruun, Erik; Demarchi, Danilo; Nielsen, Ivan Ring

    2014-01-01

    Nanotechnology and Microsystems are having increasing impact on university curricula in electrical engineering. The advent of nanotechnology brings about new possibilities in nanoelectronics, including increasingly complex systems on chip, sophisticated technology fusion between electronic devices...... have been around for a number of years. This paper presents an overview of present European programs in nanoelectronics and Microsystems. Also, the services provided for universities by the EuroTraining program1 are described....

  14. Case study: Beauty and the Beast 3D: benefits of 3D viewing for 2D to 3D conversion

    Handy Turner, Tara

    2010-02-01

    From the earliest stages of the Beauty and the Beast 3D conversion project, the advantages of accurate desk-side 3D viewing was evident. While designing and testing the 2D to 3D conversion process, the engineering team at Walt Disney Animation Studios proposed a 3D viewing configuration that not only allowed artists to "compose" stereoscopic 3D but also improved efficiency by allowing artists to instantly detect which image features were essential to the stereoscopic appeal of a shot and which features had minimal or even negative impact. At a time when few commercial 3D monitors were available and few software packages provided 3D desk-side output, the team designed their own prototype devices and collaborated with vendors to create a "3D composing" workstation. This paper outlines the display technologies explored, final choices made for Beauty and the Beast 3D, wish-lists for future development and a few rules of thumb for composing compelling 2D to 3D conversions.

  15. 3D virtuel udstilling

    Tournay, Bruno; Rüdiger, Bjarne

    2006-01-01

    3d digital model af Arkitektskolens gård med virtuel udstilling af afgangsprojekter fra afgangen sommer 2006. 10 s.......3d digital model af Arkitektskolens gård med virtuel udstilling af afgangsprojekter fra afgangen sommer 2006. 10 s....

  16. Underwater 3D filming

    Roberto Rinaldi

    2014-12-01

    Full Text Available After an experimental phase of many years, 3D filming is now effective and successful. Improvements are still possible, but the film industry achieved memorable success on 3D movie’s box offices due to the overall quality of its products. Special environments such as space (“Gravity” and the underwater realm look perfect to be reproduced in 3D. “Filming in space” was possible in “Gravity” using special effects and computer graphic. The underwater realm is still difficult to be handled. Underwater filming in 3D was not that easy and effective as filming in 2D, since not long ago. After almost 3 years of research, a French, Austrian and Italian team realized a perfect tool to film underwater, in 3D, without any constrains. This allows filmmakers to bring the audience deep inside an environment where they most probably will never have the chance to be.

  17. An Improved Version of TOPAZ 3D

    An improved version of the TOPAZ 3D gun code is presented as a powerful tool for beam optics simulation. In contrast to the previous version of TOPAZ 3D, the geometry of the device under test is introduced into TOPAZ 3D directly from a CAD program, such as Solid Edge or AutoCAD. In order to have this new feature, an interface was developed, using the GiD software package as a meshing code. The article describes this method with two models to illustrate the results

  18. An Improved Version of TOPAZ 3D

    Krasnykh, Anatoly K

    2003-01-01

    An improved version of the TOPAZ 3D gun code is presented as a powerful tool for beam optics simulation. In contrast to the previous version of TOPAZ 3D, the geometry of the device under test is introduced into TOPAZ 3D directly from a CAD program, such as Solid Edge or AutoCAD. In order to have this new feature, an interface was developed, using the GiD software package as a meshing code. The article describes this method with two models to illustrate the results.

  19. FUN3D Manual: 12.5

    Biedron, Robert T.; Derlaga, Joseph M.; Gnoffo, Peter A.; Hammond, Dana P.; Jones, William T.; Kleb, William L.; Lee-Rausch, Elizabeth M.; Nielsen, Eric J.; Park, Michael A.; Rumsey, Christopher L.; Thomas, James L.; Wood, William A.

    2014-01-01

    This manual describes the installation and execution of FUN3D version 12.5, including optional dependent packages. FUN3D is a suite of computational uid dynamics simulation and design tools that uses mixed-element unstructured grids in a large number of formats, including structured multiblock and overset grid systems. A discretely-exact adjoint solver enables ecient gradient-based design and grid adaptation to reduce estimated discretization error. FUN3D is available with and without a reacting, real-gas capability. This generic gas option is available only for those persons that qualify for its beta release status.

  20. FUN3D Manual: 13.0

    Biedron, Robert T.; Carlson, Jan-Renee; Derlaga, Joseph M.; Gnoffo, Peter A.; Hammond, Dana P.; Jones, William T.; Kleb, Bill; Lee-Rausch, Elizabeth M.; Nielsen, Eric J.; Park, Michael A.; Rumsey, Christopher L.; Thomas, James L.; Wood, William A.

    2016-01-01

    This manual describes the installation and execution of FUN3D version 13.0, including optional dependent packages. FUN3D is a suite of computational fluid dynamics simulation and design tools that uses mixed-element unstructured grids in a large number of formats, including structured multiblock and overset grid systems. A discretely-exact adjoint solver enables efficient gradient-based design and grid adaptation to reduce estimated discretization error. FUN3D is available with and without a reacting, real-gas capability. This generic gas option is available only for those persons that qualify for its beta release status.

  1. FUN3D Manual: 12.9

    Biedron, Robert T.; Carlson, Jan-Renee; Derlaga, Joseph M.; Gnoffo, Peter A.; Hammond, Dana P.; Jones, William T.; Kleb, Bil; Lee-Rausch, Elizabeth M.; Nielsen, Eric J.; Park, Michael A.; Rumsey, Christopher L.; Thomas, James L.; Wood, William A.

    2016-01-01

    This manual describes the installation and execution of FUN3D version 12.9, including optional dependent packages. FUN3D is a suite of computational fluid dynamics simulation and design tools that uses mixed-element unstructured grids in a large number of formats, including structured multiblock and overset grid systems. A discretely-exact adjoint solver enables efficient gradient-based design and grid adaptation to reduce estimated discretization error. FUN3D is available with and without a reacting, real-gas capability. This generic gas option is available only for those persons that qualify for its beta release status.

  2. FUN3D Manual: 12.4

    Biedron, Robert T.; Derlaga, Joseph M.; Gnoffo, Peter A.; Hammond, Dana P.; Jones, William T.; Kleb, Bil; Lee-Rausch, Elizabeth M.; Nielsen, Eric J.; Park, Michael A.; Rumsey, Christopher L.; Thomas, James L.; Wood, William A.

    2014-01-01

    This manual describes the installation and execution of FUN3D version 12.4, including optional dependent packages. FUN3D is a suite of computational fluid dynamics simulation and design tools that uses mixedelement unstructured grids in a large number of formats, including structured multiblock and overset grid systems. A discretely-exact adjoint solver enables efficient gradient-based design and grid adaptation to reduce estimated discretization error. FUN3D is available with and without a reacting, real-gas capability. This generic gas option is available only for those persons that qualify for its beta release status.

  3. Chip-level three-dimensional assembling of microsystems

    Toshiyoshi, Hiroshi; Mita, Yoshio; Ogawa, Minoru; Fujita, Hiroyuki

    1999-03-01

    We propose a new method of assembling 3D microsystems by means of chip level electrical interconnection. Silicon dies are flip-chipped out of a silicon wafer by using ICP-RIE instead of a dicing saw. Fringes of the chips are patterned into pin-shapes so that they can be vertically inserted into the micro motherboard for electrical and physical connection. The pins are coated with Cr-Au, and the contact pads are electroplated with Cu for low contact resistance. the pins are tapered in width, and assembling was easily done by manual positing under the optical binocular microscope. This technique is a break through to the hybrid integration of various kinds of micro chips independent of materials or fabrication compatibility.

  4. pH-Taxis of Biohybrid Microsystems

    Zhuang, Jiang; Wright Carlsen, Rika; Sitti, Metin

    2015-06-01

    The last decade has seen an increasing number of studies developing bacteria and other cell-integrated biohybrid microsystems. However, the highly stochastic motion of these microsystems severely limits their potential use. Here, we present a method that exploits the pH sensing of flagellated bacteria to realize robust drift control of multi-bacteria propelled microrobots. Under three specifically configured pH gradients, we demonstrate that the microrobots exhibit both unidirectional and bidirectional pH-tactic behaviors, which are also observed in free-swimming bacteria. From trajectory analysis, we find that the swimming direction and speed biases are two major factors that contribute to their tactic drift motion. The motion analysis of microrobots also sheds light on the propulsion dynamics of the flagellated bacteria as bioactuators. It is expected that similar driving mechanisms are shared among pH-taxis, chemotaxis, and thermotaxis. By identifying the mechanism that drives the tactic behavior of bacteria-propelled microsystems, this study opens up an avenue towards improving the control of biohybrid microsystems. Furthermore, assuming that it is possible to tune the preferred pH of bioactuators by genetic engineering, these biohybrid microsystems could potentially be applied to sense the pH gradient induced by cancerous cells in stagnant fluids inside human body and realize targeted drug delivery.

  5. 3D Digital Modelling

    Hundebøl, Jesper

    wave of new building information modelling tools demands further investigation, not least because of industry representatives' somewhat coarse parlance: Now the word is spreading -3D digital modelling is nothing less than a revolution, a shift of paradigm, a new alphabet... Research qeustions. Based...... on empirical probes (interviews, observations, written inscriptions) within the Danish construction industry this paper explores the organizational and managerial dynamics of 3D Digital Modelling. The paper intends to - Illustrate how the network of (non-)human actors engaged in the promotion (and arrest) of 3......D Modelling (in Denmark) stabilizes - Examine how 3D Modelling manifests itself in the early design phases of a construction project with a view to discuss the effects hereof for i.a. the management of the building process. Structure. The paper introduces a few, basic methodological concepts...

  6. Photonic microsystems micro and nanotechnology applied to optical devices and systems

    Solgaard, Olav

    2009-01-01

    ""Photonic Microsystems: Micro and Nanotechnology Applied to Optical Devices and Systems"", describes MEMS technology and demonstrates how MEMS allow miniaturization, parallel fabrication, and efficient packaging of optics, as well as integration of optics and electronics. It shows how the characteristics of MEMS enable practical implementations of a variety of applications, including projection displays, fiber switches, interferometers, spectrometers. The book describes the phenomenon of Photonic crystals (nanophotonics) and demonstrates how Photonic crystals enable synthesis of materials wit

  7. Professional Papervision3D

    Lively, Michael

    2010-01-01

    Professional Papervision3D describes how Papervision3D works and how real world applications are built, with a clear look at essential topics such as building websites and games, creating virtual tours, and Adobe's Flash 10. Readers learn important techniques through hands-on applications, and build on those skills as the book progresses. The companion website contains all code examples, video step-by-step explanations, and a collada repository.

  8. A micro-assembly station used for 3D reconfigurable hybrid MOEMS assembly - (Special Award).

    Rabenorosoa, Kanty; Clévy, Cédric; Lutz, Philippe; Bargiel, Sylwester; Gorecki, Christophe

    2009-01-01

    Micro-assembly has been identified to be a critical technology in the microsystems technology and nanotechnology. The increasing needs of MOEMS (Micro-Opto-Electro- Mechanical Systems) for the microsystems conducts to development of new concepts and skilled micro-assembly stations. This paper presents a 3D micro-assembly station used for the reconfigurable free space micro-optical benches (RFS-MOB) which are a promising type of MOEMS. The designed parts of RFS-MOB are assembled by using the d...

  9. Integrated power management for microsystems

    Fry, D.N.; Wintenberg, A.L.; Bryan, B.L. [Oak Ridge National Lab., TN (United States). Instrumentation and Controls Div.

    1997-12-01

    There is a need for a universal power module for microsystems. This module should provide power conditioning, energy storage, and load matching for a variety of energy sources and loads such as microelectromechanical systems (MEMS) and wireless sensors and micro-robots. There are a variety of potential ambient and human powered energy sources, which can supply some of the power needs of the military. The challenge is to capture these available sources of electrical energy and condition them to meet the voltage, current, and overall power demands of field-deployable microelectronics and MEMs-based devices such as wireless sensors and micro-robots. Most natural and man-made energy sources found in the environment have a low specific power and are not generally available on a continuous basis. Likewise, human-based energy sources must be optimally managed to meet the power needs in the field. Therefore, a power supply must have the ability to capture the available energy and store it in such a manner to be useful to meet the mission requirements of the device that is connected to the source. It must continuously monitor the status of energy stored and determine the expected demands of the device. A microelectronics-based power management chip can be developed to meet these objectives. The major challenge in realizing this concept will be the design of an intelligent power-conditioning chip that consumes a minimum of power to perform the functions of power conditioning, storage, load matching, and status monitoring. The prototype power conditioning integrated circuit would be capable of delivering a peak power of 100 mW at 5 V. The nominal operating condition would be a very low duty cycle for a relatively high power load, and a low-power source available for long periods of time, or a moderate-power source available intermittently.

  10. Heteromagnetic Microelectronics Microsystems of Active Type

    Ignatiev, Alexander A

    2010-01-01

    Heteromagnetic Microelectronics: Microsystems of Active Type, by Alexander A. Ignatiev of Saratov State University and Alexander V. Lyashenko of JSC Research Institute Tantal in Russia, offers a very detailed and specialized account of the author's research and development of heteromagnetic materials and devices. The book is based on original material from the author's programs of designing heteromagnetic microsystems. Polyvalent, multiple parameter magneto-semiconductor microsystems are described and the book reports on extensive experimental and theoretical results of research in a range of frequencies up to 1000 GHz. For the first time the direction of satisfying criteria, and burst technologies, which can make a subject of discovery, are discussed in great detail. This book is intended for post-graduate students and researchers specializing in the design and application of heteromagnetic materials and devices. Alexander A. Ignatiev is author of Magnetoelectronics of Microwaves and Extremely High Frequenci...

  11. 3D Spectroscopic Instrumentation

    Bershady, Matthew A

    2009-01-01

    In this Chapter we review the challenges of, and opportunities for, 3D spectroscopy, and how these have lead to new and different approaches to sampling astronomical information. We describe and categorize existing instruments on 4m and 10m telescopes. Our primary focus is on grating-dispersed spectrographs. We discuss how to optimize dispersive elements, such as VPH gratings, to achieve adequate spectral resolution, high throughput, and efficient data packing to maximize spatial sampling for 3D spectroscopy. We review and compare the various coupling methods that make these spectrographs ``3D,'' including fibers, lenslets, slicers, and filtered multi-slits. We also describe Fabry-Perot and spatial-heterodyne interferometers, pointing out their advantages as field-widened systems relative to conventional, grating-dispersed spectrographs. We explore the parameter space all these instruments sample, highlighting regimes open for exploitation. Present instruments provide a foil for future development. We give an...

  12. 3D Projection Installations

    Halskov, Kim; Johansen, Stine Liv; Bach Mikkelsen, Michelle

    2014-01-01

    Three-dimensional projection installations are particular kinds of augmented spaces in which a digital 3-D model is projected onto a physical three-dimensional object, thereby fusing the digital content and the physical object. Based on interaction design research and media studies, this article...... contributes to the understanding of the distinctive characteristics of such a new medium, and identifies three strategies for designing 3-D projection installations: establishing space; interplay between the digital and the physical; and transformation of materiality. The principal empirical case, From...... Fingerplan to Loop City, is a 3-D projection installation presenting the history and future of city planning for the Copenhagen area in Denmark. The installation was presented as part of the 12th Architecture Biennale in Venice in 2010....

  13. Herramientas SIG 3D

    Francisco R. Feito Higueruela

    2010-04-01

    Full Text Available Applications of Geographical Information Systems on several Archeology fields have been increasing during the last years. Recent avances in these technologies make possible to work with more realistic 3D models. In this paper we introduce a new paradigm for this system, the GIS Thetrahedron, in which we define the fundamental elements of GIS, in order to provide a better understanding of their capabilities. At the same time the basic 3D characteristics of some comercial and open source software are described, as well as the application to some samples on archeological researchs

  14. Bootstrapping 3D fermions

    Iliesiu, Luca; Kos, Filip; Poland, David; Pufu, Silviu S.; Simmons-Duffin, David; Yacoby, Ran

    2016-03-01

    We study the conformal bootstrap for a 4-point function of fermions in 3D. We first introduce an embedding formalism for 3D spinors and compute the conformal blocks appearing in fermion 4-point functions. Using these results, we find general bounds on the dimensions of operators appearing in the ψ × ψ OPE, and also on the central charge C T . We observe features in our bounds that coincide with scaling dimensions in the GrossNeveu models at large N . We also speculate that other features could coincide with a fermionic CFT containing no relevant scalar operators.

  15. TOWARDS: 3D INTERNET

    Ms. Swapnali R. Ghadge

    2013-01-01

    In today’s ever-shifting media landscape, it can be a complex task to find effective ways to reach your desired audience. As traditional media such as television continue to lose audience share, one venue in particular stands out for its ability to attract highly motivated audiences and for its tremendous growth potential the 3D Internet. The concept of '3D Internet' has recently come into the spotlight in the R&D arena, catching the attention of many people, and leading to a lot o...

  16. 3D Dental Scanner

    Kotek, L.

    2015-01-01

    This paper is about 3D scan of plaster dental casts. The main aim of the work is a hardware and software proposition of 3D scan system for scanning of dental casts. There were used camera, projector and rotate table for this scanning system. Surface triangulation was used, taking benefits of projections of structured light on object, which is being scanned. The rotate table is controlled by PC. The camera, projector and rotate table are synchronized by PC. Controlling of stepper motor is prov...

  17. Interaktiv 3D design

    Villaume, René Domine; Ørstrup, Finn Rude

    2002-01-01

    Projektet undersøger potentialet for interaktiv 3D design via Internettet. Arkitekt Jørn Utzons projekt til Espansiva blev udviklet som et byggesystem med det mål, at kunne skabe mangfoldige planmuligheder og mangfoldige facade- og rumudformninger. Systemets bygningskomponenter er digitaliseret som...... 3D elementer og gjort tilgængelige. Via Internettet er det nu muligt at sammenstille og afprøve en uendelig  række bygningstyper som  systemet blev tænkt og udviklet til....

  18. 3D Harmonic Echocardiography:

    M.M. Voormolen

    2007-01-01

    textabstractThree dimensional (3D) echocardiography has recently developed from an experimental technique in the ’90 towards an imaging modality for the daily clinical practice. This dissertation describes the considerations, implementation, validation and clinical application of a unique

  19. Tangible 3D Modelling

    Hejlesen, Aske K.; Ovesen, Nis

    2012-01-01

    This paper presents an experimental approach to teaching 3D modelling techniques in an Industrial Design programme. The approach includes the use of tangible free form models as tools for improving the overall learning. The paper is based on lecturer and student experiences obtained through...

  20. Shaping 3-D boxes

    Stenholt, Rasmus; Madsen, Claus B.

    2011-01-01

    Enabling users to shape 3-D boxes in immersive virtual environments is a non-trivial problem. In this paper, a new family of techniques for creating rectangular boxes of arbitrary position, orientation, and size is presented and evaluated. These new techniques are based solely on position data...

  1. Wafer-Level 3D Integration for ULSI Interconnects

    Gutmann, Ronald J.; Lu, Jian-Qiang

    Three-dimensional (3D) integration in a system-in-a-package (SiP) implementation (packaging-based 3D) is becoming increasingly used in consumer, computer, and communication applications where form factor is critical. In particular, the hand-held market for a growing myriad of voice, data, messaging, and imaging products is enabled by packaging-based 3D integration (i.e., stacking and connecting individual chips). The key drivers are for increased memory capacity and for heterogeneous integration of different IC technologies and functions.

  2. Fabrication challenges for indium phosphide microsystems

    From the inception of III–V microsystems, monolithically integrated device designs have been the motivating drive for this field, bringing together the utility of single-chip microsystems and conventional fabrication techniques. Indium phosphide (InP) has a particular advantage of having a direct bandgap within the low loss telecommunication wavelength (1550 nm) range, able to support passive waveguiding and optical amplification, detection, and generation depending on the exact alloy of In, P, As, Ga, or Al materials. Utilizing epitaxy, one can envision the growth of a substrate that contains all of the components needed to establish a single-chip optical microsystem, containing detectors, sources, waveguides, and mechanical structures. A monolithic InP MEMS system has, to our knowledge, yet to be realized due to the significant difficulties encountered when fabricating the integrated devices. In this paper we present our own research and consolidate findings from other research groups across the world to give deeper insight into the practical aspects of InP monolithic microsystem development: epitaxial growth of InP-based alloys, etching techniques, common MEMS structures realized in InP, and future applications. We pay special attention to shedding light on considerations that must be taken when designing and fabricating a monolithic InP MEMS device. (topical review)

  3. Fabrication challenges for indium phosphide microsystems

    Siwak, N. P.; Fan, X. Z.; Ghodssi, R.

    2015-04-01

    From the inception of III-V microsystems, monolithically integrated device designs have been the motivating drive for this field, bringing together the utility of single-chip microsystems and conventional fabrication techniques. Indium phosphide (InP) has a particular advantage of having a direct bandgap within the low loss telecommunication wavelength (1550 nm) range, able to support passive waveguiding and optical amplification, detection, and generation depending on the exact alloy of In, P, As, Ga, or Al materials. Utilizing epitaxy, one can envision the growth of a substrate that contains all of the components needed to establish a single-chip optical microsystem, containing detectors, sources, waveguides, and mechanical structures. A monolithic InP MEMS system has, to our knowledge, yet to be realized due to the significant difficulties encountered when fabricating the integrated devices. In this paper we present our own research and consolidate findings from other research groups across the world to give deeper insight into the practical aspects of InP monolithic microsystem development: epitaxial growth of InP-based alloys, etching techniques, common MEMS structures realized in InP, and future applications. We pay special attention to shedding light on considerations that must be taken when designing and fabricating a monolithic InP MEMS device.

  4. Recent Advances in Neural Recording Microsystems

    Benoit Gosselin

    2011-04-01

    Full Text Available The accelerating pace of research in neuroscience has created a considerable demand for neural interfacing microsystems capable of monitoring the activity of large groups of neurons. These emerging tools have revealed a tremendous potential for the advancement of knowledge in brain research and for the development of useful clinical applications. They can extract the relevant control signals directly from the brain enabling individuals with severe disabilities to communicate their intentions to other devices, like computers or various prostheses. Such microsystems are self-contained devices composed of a neural probe attached with an integrated circuit for extracting neural signals from multiple channels, and transferring the data outside the body. The greatest challenge facing development of such emerging devices into viable clinical systems involves addressing their small form factor and low-power consumption constraints, while providing superior resolution. In this paper, we survey the recent progress in the design and the implementation of multi-channel neural recording Microsystems, with particular emphasis on the design of recording and telemetry electronics. An overview of the numerous neural signal modalities is given and the existing microsystem topologies are covered. We present energy-efficient sensory circuits to retrieve weak signals from neural probes and we compare them. We cover data management and smart power scheduling approaches, and we review advances in low-power telemetry. Finally, we conclude by summarizing the remaining challenges and by highlighting the emerging trends in the field.

  5. Study of 3D-modelling software environments

    Егорова, Ирина Николаевна; Гайдамащук, Алиса Владимировна

    2013-01-01

    The study of three-dimensional modeling software packages such as Autodesk Maya, Autodesk 3Ds Studio Max, Lightwave 3D, Maxon Cinema 4D, Blender, ZBrush was conducted in the paper. The analysis of software packages allowed to identify the most effective ones. These were Autodesk Maya, Autodesk 3Ds Studio Max and ZBrush packages. The selected software packages were used for the creation of a computer scene, the main elements of which are interior, character and animation. Practical research al...

  6. 3D animace

    Klusoň, Jindřich

    2010-01-01

    Computer animation has a growing importance and application in the world. With expansion of technologies increases quality of the final animation as well as number of 3D animation software. This thesis is currently mapped animation software for creating animation in film, television industry and video games which are advisable users requirements. Of them were selected according to criteria the best - Autodesk Maya 2011. This animation software is unique with tools for creating special effects...

  7. Massive 3D Supergravity

    Andringa, Roel; de Roo, Mees; Hohm, Olaf; Sezgin, Ergin; Townsend, Paul K

    2009-01-01

    We construct the N=1 three-dimensional supergravity theory with cosmological, Einstein-Hilbert, Lorentz Chern-Simons, and general curvature squared terms. We determine the general supersymmetric configuration, and find a family of supersymmetric adS vacua with the supersymmetric Minkowski vacuum as a limiting case. Linearizing about the Minkowski vacuum, we find three classes of unitary theories; one is the supersymmetric extension of the recently discovered `massive 3D gravity'. Another is a `new topologically massive supergravity' (with no Einstein-Hilbert term) that propagates a single (2,3/2) helicity supermultiplet.

  8. Massive 3D supergravity

    Andringa, Roel; Bergshoeff, Eric A; De Roo, Mees; Hohm, Olaf [Centre for Theoretical Physics, University of Groningen, Nijenborgh 4, 9747 AG Groningen (Netherlands); Sezgin, Ergin [George and Cynthia Woods Mitchell Institute for Fundamental Physics and Astronomy, Texas A and M University, College Station, TX 77843 (United States); Townsend, Paul K, E-mail: E.A.Bergshoeff@rug.n, E-mail: O.Hohm@rug.n, E-mail: sezgin@tamu.ed, E-mail: P.K.Townsend@damtp.cam.ac.u [Department of Applied Mathematics and Theoretical Physics, Centre for Mathematical Sciences, University of Cambridge, Wilberforce Road, Cambridge, CB3 0WA (United Kingdom)

    2010-01-21

    We construct the N=1 three-dimensional supergravity theory with cosmological, Einstein-Hilbert, Lorentz Chern-Simons, and general curvature squared terms. We determine the general supersymmetric configuration, and find a family of supersymmetric adS vacua with the supersymmetric Minkowski vacuum as a limiting case. Linearizing about the Minkowski vacuum, we find three classes of unitary theories; one is the supersymmetric extension of the recently discovered 'massive 3D gravity'. Another is a 'new topologically massive supergravity' (with no Einstein-Hilbert term) that propagates a single (2,3/2) helicity supermultiplet.

  9. MEMS & microsystems design, manufacture, and nanoscale engineering

    Hsu, Tai-Ran

    2008-01-01

    A bestselling MEMS text...now better than ever. An engineering design approach to Microelectromechanical Systems, MEMS and Microsystems remains the only available text to cover both the electrical and the mechanical aspects of the technology. In the five years since the publication of the first edition, there have been significant changes in the science and technology of miniaturization, including microsystems technology and nanotechnology. In response to the increasing needs of engineers to acquire basic knowledge and experience in these areas, this popular text has been carefully updated, including an entirely new section on the introduction of nanoscale engineering. Following a brief introduction to the history and evolution of nanotechnology, the author covers the fundamentals in the engineering design of nanostructures, including fabrication techniques for producing nanoproducts, engineering design principles in molecular dynamics, and fluid flows and heat transmission in nanoscale substances.

  10. TOWARDS: 3D INTERNET

    Ms. Swapnali R. Ghadge

    2013-08-01

    Full Text Available In today’s ever-shifting media landscape, it can be a complex task to find effective ways to reach your desired audience. As traditional media such as television continue to lose audience share, one venue in particular stands out for its ability to attract highly motivated audiences and for its tremendous growth potential the 3D Internet. The concept of '3D Internet' has recently come into the spotlight in the R&D arena, catching the attention of many people, and leading to a lot of discussions. Basically, one can look into this matter from a few different perspectives: visualization and representation of information, and creation and transportation of information, among others. All of them still constitute research challenges, as no products or services are yet available or foreseen for the near future. Nevertheless, one can try to envisage the directions that can be taken towards achieving this goal. People who take part in virtual worlds stay online longer with a heightened level of interest. To take advantage of that interest, diverse businesses and organizations have claimed an early stake in this fast-growing market. They include technology leaders such as IBM, Microsoft, and Cisco, companies such as BMW, Toyota, Circuit City, Coca Cola, and Calvin Klein, and scores of universities, including Harvard, Stanford and Penn State.

  11. Tools for chemical synthesis in microsystems

    Jensen, Klavs F.; Newman, Stephen G.; Reizman, Brandon Jacob

    2014-01-01

    Chemical synthesis in microsystems has evolved from simple proof-of-principle examples to become a general technique in academia and industry. Numerous such “flow chemistry” applications are now found in pharmaceutical and fine chemical synthesis. Much of the development has been based on systems employing macroscopic flow components and tubes, rather than the integrated chip technology envisioned by the lab-on-a-chip community. We review the major developments in systems for flow chemistry a...

  12. Energy harvesting with functional materials and microsystems

    Bhaskaran, Madhu; Iniewski, Krzysztof

    2013-01-01

    For decades, people have searched for ways to harvest energy from natural sources. Lately, a desire to address the issue of global warming and climate change has popularized solar or photovoltaic technology, while piezoelectric technology is being developed to power handheld devices without batteries, and thermoelectric technology is being explored to convert wasted heat, such as in automobile engine combustion, into electricity. Featuring contributions from international researchers in both academics and industry, Energy Harvesting with Functional Materials and Microsystems explains the growi

  13. Multilayer ISFET membranes for microsystems applications

    Cané, Carles; Götz, A; Merlos, A.; Gràcia, I.; Errachid, Abdelhamid; Losantos Viñolas, Pedro; Lora-Tamayo, E.

    1996-01-01

    The fabrication of microsystems in which chemical measurements play a role make the on-chip combination of chemical sensors and signal processing circuitry highly desirable. Chemical sensors use sensitive layers which are not a part of MOS devices and in this sense, the determination of the best sensors and technological processes to achieve good integrated smart sensors is very important. In this paper a study of compatibility of ISFET chemical sensors and CMOS circuitry is presented for app...

  14. Corrosion and microfluidics in hot water microsystems

    Eriksson, Mimmi

    2013-01-01

    This thesis addresses some important issues when designing microfluidic systems for hot pressurized water. The properties and behavior of water at elevated temperatures and in micro scale is briefly reviewed, and opportunities and possible problems of using hot pressurized water in microfluidic devices are brought up. Experimental work was focused on corrosion resistance for commonly used microsystem materials in hot pressurized water, and the microfluidic behavior for hot pressurized water. ...

  15. Digital holography for MEMS and microsystem metrology

    Asundi, Anand

    2011-01-01

    Approaching the topic of digital holography from the practical perspective of industrial inspection, Digital Holography for MEMS and Microsystem Metrology describes the process of digital holography and its growing applications for MEMS characterization, residual stress measurement, design and evaluation, and device testing and inspection. Asundi also provides a thorough theoretical grounding that enables the reader to understand basic concepts and thus identify areas where this technique can be adopted. This combination of both practical and theoretical approach will ensure the

  16. DNA origami design of 3D nanostructures

    Andersen, Ebbe Sloth; Nielsen, Morten Muhlig

    2009-01-01

    [8]. We have recently developed a semi-automated DNA origami software package [9] that uses a 2D sequence editor in conjunction with several automated tools to facilitate the design process. Here we extend the use of the program for designing DNA origami structures in 3D and show the application......Structural DNA nanotechnology has been heavily dependent on the development of dedicated software tools for the design of unique helical junctions, to define unique sticky-ends for tile assembly, and for predicting the products of the self-assembly reaction of multiple DNA strands [1-3]. Recently......, several dedicated 3D editors for computer-aided design of DNA structures have been developed [4-7]. However, many of these tools are not efficient for designing DNA origami structures that requires the design of more than 200 unique DNA strands to be folded along a scaffold strand into a defined 3D shape...

  17. Further improvements on TRACE 3-D

    TRACE 3-D, an interactive beam-dynamics program that calculates the envelopes of a bunched beam (including linear space-charge forces) through a user-defined transport system, has undergone several upgrades in physics, coding, and capabilities. Recent modifications include centroid tracking (and misalignment capabilities) and an improved beam description that allows study of some nonlinear effects such as wakefields. The Fortran code has been made portable and runs on numerous platforms. It can be used with a variety of graphics packages. The additional beamline elements, new commands, expanded fitting capabilities, improved beam description, and coding modifications have extended TRACE 3-D's usefulness and applicability to the accelerator community. These changes are documented in the third edition of TRACE 3-D Documentation

  18. Intelligent Microsystems: Keys to the Next Silicon Revolution

    MCWHORTER,PAUL J.

    1999-10-20

    Paul McWhorter, Deputy Director for of the Microsystems Center at Sandia National Laboratories, discusses the potential of surface micromachining. A vision of the possibilities of intelligent Microsystems for the future is presented along with descriptions of several possible applications. Applications that are just around the corner and some that maybe quite a ways down the road but have a clear development path to their realization. Microsystems will drive the next silicon revolution.

  19. 3D printing for dummies

    Hausman, Kalani Kirk

    2014-01-01

    Get started printing out 3D objects quickly and inexpensively! 3D printing is no longer just a figment of your imagination. This remarkable technology is coming to the masses with the growing availability of 3D printers. 3D printers create 3-dimensional layered models and they allow users to create prototypes that use multiple materials and colors.  This friendly-but-straightforward guide examines each type of 3D printing technology available today and gives artists, entrepreneurs, engineers, and hobbyists insight into the amazing things 3D printing has to offer. You'll discover methods for

  20. 3D monitor

    Szkandera, Jan

    2009-01-01

    Tato bakalářská práce se zabývá návrhem a realizací systému, který umožní obraz scény zobrazovaný na ploše vnímat prostorově. Prostorové vnímání 2D obrazové informace je umožněno jednak stereopromítáním a jednak tím, že se obraz mění v závislosti na poloze pozorovatele. Tato práce se zabývá hlavně druhým z těchto problémů. This Bachelor's thesis goal is to design and realize system, which allows user to perceive 2D visual information as three-dimensional. 3D visual preception of 2D image i...

  1. Mobile 3D tomograph

    Mobile tomographs often have the problem that high spatial resolution is impossible owing to the position or setup of the tomograph. While the tree tomograph developed by Messrs. Isotopenforschung Dr. Sauerwein GmbH worked well in practice, it is no longer used as the spatial resolution and measuring time are insufficient for many modern applications. The paper shows that the mechanical base of the method is sufficient for 3D CT measurements with modern detectors and X-ray tubes. CT measurements with very good statistics take less than 10 min. This means that mobile systems can be used, e.g. in examinations of non-transportable cultural objects or monuments. Enhancement of the spatial resolution of mobile tomographs capable of measuring in any position is made difficult by the fact that the tomograph has moving parts and will therefore have weight shifts. With the aid of tomographies whose spatial resolution is far higher than the mechanical accuracy, a correction method is presented for direct integration of the Feldkamp algorithm

  2. X3D: Extensible 3D Graphics Standard

    Daly, Leonard; Brutzman, Don

    2007-01-01

    The article of record as published may be located at http://dx.doi.org/10.1109/MSP.2007.905889 Extensible 3D (X3D) is the open standard for Web-delivered three-dimensional (3D) graphics. It specifies a declarative geometry definition language, a run-time engine, and an application program interface (API) that provide an interactive, animated, real-time environment for 3D graphics. The X3D specification documents are freely available, the standard can be used without paying any royalties,...

  3. 3D game environments create professional 3D game worlds

    Ahearn, Luke

    2008-01-01

    The ultimate resource to help you create triple-A quality art for a variety of game worlds; 3D Game Environments offers detailed tutorials on creating 3D models, applying 2D art to 3D models, and clear concise advice on issues of efficiency and optimization for a 3D game engine. Using Photoshop and 3ds Max as his primary tools, Luke Ahearn explains how to create realistic textures from photo source and uses a variety of techniques to portray dynamic and believable game worlds.From a modern city to a steamy jungle, learn about the planning and technological considerations for 3D modelin

  4. 3D Printing an Octohedron

    Aboufadel, Edward F.

    2014-01-01

    The purpose of this short paper is to describe a project to manufacture a regular octohedron on a 3D printer. We assume that the reader is familiar with the basics of 3D printing. In the project, we use fundamental ideas to calculate the vertices and faces of an octohedron. Then, we utilize the OPENSCAD program to create a virtual 3D model and an STereoLithography (.stl) file that can be used by a 3D printer.

  5. 3D modelling and recognition

    Rodrigues, Marcos; Robinson, Alan; Alboul, Lyuba; Brink, Willie

    2006-01-01

    3D face recognition is an open field. In this paper we present a method for 3D facial recognition based on Principal Components Analysis. The method uses a relatively large number of facial measurements and ratios and yields reliable recognition. We also highlight our approach to sensor development for fast 3D model acquisition and automatic facial feature extraction.

  6. Cost-driven design of smart microsystems

    Niedermayer, Michael

    2011-01-01

    Today's professionals are constantly striving to create sensor technology and systems with lower cost and higher efficiency. Miniaturization and standardization have become critical drivers for cost reduction in the design and development process, giving rise to a new era of smart sensors and actuators. These devices contain more components, but normally provide significant cost savings due to wider applicability and mass production. This first-of-its-kind resource presents methods for cost optimization of smart microsystems to help you select highly cost-efficient implementation variants. Wri

  7. Robust Bioinformatics Recognition with VLSI Biochip Microsystem

    Lue, Jaw-Chyng L.; Fang, Wai-Chi

    2006-01-01

    A microsystem architecture for real-time, on-site, robust bioinformatic patterns recognition and analysis has been proposed. This system is compatible with on-chip DNA analysis means such as polymerase chain reaction (PCR)amplification. A corresponding novel artificial neural network (ANN) learning algorithm using new sigmoid-logarithmic transfer function based on error backpropagation (EBP) algorithm is invented. Our results show the trained new ANN can recognize low fluorescence patterns better than the conventional sigmoidal ANN does. A differential logarithmic imaging chip is designed for calculating logarithm of relative intensities of fluorescence signals. The single-rail logarithmic circuit and a prototype ANN chip are designed, fabricated and characterized.

  8. 3-D contextual Bayesian classifiers

    Larsen, Rasmus

    distribution for the pixel values as well as a prior distribution for the configuration of class variables within the cross that is made of a pixel and its four nearest neighbours. We will extend these algorithms to 3-D, i.e. we will specify a simultaneous Gaussian distribution for a pixel and its 6 nearest 3......-D neighbours, and generalise the class variable configuration distributions within the 3-D cross given in 2-D algorithms. The new 3-D algorithms are tested on a synthetic 3-D multivariate dataset....

  9. Taming Supersymmetric Defects in 3d-3d Correspondence

    Gang, Dongmin; Romo, Mauricio; Yamazaki, Masahito

    2015-01-01

    We study knots in 3d Chern-Simons theory with complex gauge group $SL(N,\\mathbb{C})$, in the context of its relation with 3d $\\mathcal{N}=2$ theory (the so-called 3d-3d correspondence). The defect has either co-dimension 2 or co-dimension 4 inside the 6d $(2,0)$ theory, which is compactified on a 3-manifold $\\hat{M}$. We identify such defects in various corners of the 3d-3d correspondence, namely in 3d $SL(N,\\mathbb{C})$ Chern-Simons theory, in 3d $\\mathcal{N}=2$ theory, in 5d $\\mathcal{N}=2$ super Yang-Mills theory, and in the M-theory holographic dual. We can make quantitative checks of the 3d-3d correspondence by computing partition functions at each of these theories. This Letter is a companion to a longer paper, which contains more details and more results.

  10. Novel microsystem applications with new techniques in LTCC.

    Nordquist, Christopher Daniel; Peterson, Kenneth Allen; Patel, Kamlesh D.; Okandan, Murat; Rohde, Steven Barney; Ho, Clifford Kuofei; Wroblewski, Brian D.; Walker, Charles A.

    2005-04-01

    Low-temperature co-fired ceramic (LTCC) enables development and testing of critical elements on microsystem boards as well as nonmicroelectronic meso-scale applications. We describe silicon-based microelectromechanical systems packaging and LTCC meso-scale applications. Microfluidic interposers permit rapid testing of varied silicon designs. The application of LTCC to micro-high-performance liquid chromatography (?-HPLC) demonstrates performance advantages at very high pressures. At intermediate pressures, a ceramic thermal cell lyser has lysed bacteria spores without damaging the proteins. The stability and sensitivity of LTCC/chemiresistor smart channels are comparable to the performance of silicon-based chemiresistors. A variant of the use of sacrificial volume materials has created channels, suspended thick films, cavities, and techniques for pressure and flow sensing. We report on inductors, diaphragms, cantilevers, antennae, switch structures, and thermal sensors suspended in air. The development of 'functional-as-released' moving parts has resulted in wheels, impellers, tethered plates, and related new LTCC mechanical roles for actuation and sensing. High-temperature metal-to-LTCC joining has been developed with metal thin films for the strong, hermetic interfaces necessary for pins, leads, and tubes.

  11. PLOT3D- DRAWING THREE DIMENSIONAL SURFACES

    Canright, R. B.

    1994-01-01

    PLOT3D is a package of programs to draw three-dimensional surfaces of the form z = f(x,y). The function f and the boundary values for x and y are the input to PLOT3D. The surface thus defined may be drawn after arbitrary rotations. However, it is designed to draw only functions in rectangular coordinates expressed explicitly in the above form. It cannot, for example, draw a sphere. Output is by off-line incremental plotter or online microfilm recorder. This package, unlike other packages, will plot any function of the form z = f(x,y) and portrays continuous and bounded functions of two independent variables. With curve fitting; however, it can draw experimental data and pictures which cannot be expressed in the above form. The method used is division into a uniform rectangular grid of the given x and y ranges. The values of the supplied function at the grid points (x, y) are calculated and stored; this defines the surface. The surface is portrayed by connecting successive (y,z) points with straight-line segments for each x value on the grid and, in turn, connecting successive (x,z) points for each fixed y value on the grid. These lines are then projected by parallel projection onto the fixed yz-plane for plotting. This program has been implemented on the IBM 360/67 with on-line CDC microfilm recorder.

  12. Advanced microsystems for automotive applications 2008

    Valldorf, J.; Gessner, W. (eds.) [VDI/VDE Innovation und Technik GmbH, Berlin (Germany)

    2008-07-01

    With the total number of vehicles steadily increasing and soon approaching one billion, the world is facing serious challenges in terms of both safety of road transport and sustainability. Consequently the two major persistent issues for the automotive industry are improved safety and reduced emissions. The integration of complex microsystems with enhanced intelligence has enabled an increase in efficiency of the previously 'dumb' internal combustion engine by an average 1% annually during the last 20 years. In the future, such smart systems may help to leverage novel powertrain concepts towards the zero emission vehicle. Particularly for electric cars, anticipatory power management and efficient driving assistance will be needed to overcome range limitations. Electrical in-wheel motors equipped with novel miniaturized functionalities will be required. Intelligent systems for tire monitoring and control deserve special attention as well, since insufficient tire pressure accounts for more than 3% of the efficiency losses in the car. The conference book in hand is a showroom of activities, the International Forum on Advanced Microsystems for Automotive Applications (AMAA) has been known for during the last 12 years: advanced sensors including one based on the giant magneto resistance (GMR) effect, several camera and radar systems making road traffic safer by assisting the driver in recognizing pedestrians and obstacles, and human-machine interfaces based on the recognition of hand gestures - a striking example of how smart systems will further enhance the usability of vehicles and the comfort of driving. (orig.)

  13. 3D Printing Functional Nanocomposites

    Leong, Yew Juan

    2016-01-01

    3D printing presents the ability of rapid prototyping and rapid manufacturing. Techniques such as stereolithography (SLA) and fused deposition molding (FDM) have been developed and utilized since the inception of 3D printing. In such techniques, polymers represent the most commonly used material for 3D printing due to material properties such as thermo plasticity as well as its ability to be polymerized from monomers. Polymer nanocomposites are polymers with nanomaterials composited into the ...

  14. 3D IBFV : Hardware-Accelerated 3D Flow Visualization

    Telea, Alexandru; Wijk, Jarke J. van

    2003-01-01

    We present a hardware-accelerated method for visualizing 3D flow fields. The method is based on insertion, advection, and decay of dye. To this aim, we extend the texture-based IBFV technique for 2D flow visualization in two main directions. First, we decompose the 3D flow visualization problem in a

  15. 3D Elevation Program—Virtual USA in 3D

    Lukas, Vicki; Stoker, J.M.

    2016-01-01

    The U.S. Geological Survey (USGS) 3D Elevation Program (3DEP) uses a laser system called ‘lidar’ (light detection and ranging) to create a virtual reality map of the Nation that is very accurate. 3D maps have many uses with new uses being discovered all the time.  

  16. 3D for Graphic Designers

    Connell, Ellery

    2011-01-01

    Helping graphic designers expand their 2D skills into the 3D space The trend in graphic design is towards 3D, with the demand for motion graphics, animation, photorealism, and interactivity rapidly increasing. And with the meteoric rise of iPads, smartphones, and other interactive devices, the design landscape is changing faster than ever.2D digital artists who need a quick and efficient way to join this brave new world will want 3D for Graphic Designers. Readers get hands-on basic training in working in the 3D space, including product design, industrial design and visualization, modeling, ani

  17. 3-D printers for libraries

    Griffey, Jason

    2014-01-01

    As the maker movement continues to grow and 3-D printers become more affordable, an expanding group of hobbyists is keen to explore this new technology. In the time-honored tradition of introducing new technologies, many libraries are considering purchasing a 3-D printer. Jason Griffey, an early enthusiast of 3-D printing, has researched the marketplace and seen several systems first hand at the Consumer Electronics Show. In this report he introduces readers to the 3-D printing marketplace, covering such topics asHow fused deposition modeling (FDM) printing workBasic terminology such as build

  18. A 3-D Contextual Classifier

    Larsen, Rasmus

    1997-01-01

    . This includes the specification of a Gaussian distribution for the pixel values as well as a prior distribution for the configuration of class variables within the cross that is m ade of a pixel and its four nearest neighbours. We will extend this algorithm to 3-D, i.e. we will specify a simultaneous Gaussian...... distr ibution for a pixel and its 6 nearest 3-D neighbours, and generalise the class variable configuration distribution within the 3-D cross. The algorithm is tested on a synthetic 3-D multivariate dataset....

  19. 3D Bayesian contextual classifiers

    Larsen, Rasmus

    2000-01-01

    We extend a series of multivariate Bayesian 2-D contextual classifiers to 3-D by specifying a simultaneous Gaussian distribution for the feature vectors as well as a prior distribution of the class variables of a pixel and its 6 nearest 3-D neighbours.......We extend a series of multivariate Bayesian 2-D contextual classifiers to 3-D by specifying a simultaneous Gaussian distribution for the feature vectors as well as a prior distribution of the class variables of a pixel and its 6 nearest 3-D neighbours....

  20. Interactive 3D multimedia content

    Cellary, Wojciech

    2012-01-01

    The book describes recent research results in the areas of modelling, creation, management and presentation of interactive 3D multimedia content. The book describes the current state of the art in the field and identifies the most important research and design issues. Consecutive chapters address these issues. These are: database modelling of 3D content, security in 3D environments, describing interactivity of content, searching content, visualization of search results, modelling mixed reality content, and efficient creation of interactive 3D content. Each chapter is illustrated with example a

  1. Hyperspectral Polymer Solar Cells, Integrated Power for Microsystems

    Stiebitz, Paul [Rochester Institute of Technology, NY(United States)

    2014-05-27

    The purpose of this research is to address a critical technology barrier to the deployment of next generation autonomous microsystems – the availability of efficient and reliable power sources. The vast majority of research on microsystems has been directed toward the development and miniaturization of sensors and other devices that enhance their intelligence, physical, and networking capabilities. However, the research into power generating and power storage technologies has not keep pace with this development. This research leveraged the capabilities of RIT’s NanoPower Research Laboratories (NPRL) in materials for advanced lithium ion batteries, nanostructured photovoltaics, and hybrid betavoltaics to develop reliable power sources for microsystems.

  2. Micro-system inertial sensing technology overview.

    Allen, James Joe

    2009-02-01

    The purpose of this report is to provide an overview of Micro-System technology as it applies to inertial sensing. Transduction methods are reviewed with capacitance and piezoresistive being the most often used in COTS Micro-electro-mechanical system (MEMS) inertial sensors. Optical transduction is the most recent transduction method having significant impact on improving sensor resolution. A few other methods are motioned which are in a R&D status to hopefully allow MEMS inertial sensors to become viable as a navigation grade sensor. The accelerometer, gyroscope and gravity gradiometer are the type of inertial sensors which are reviewed in this report. Their method of operation and a sampling of COTS sensors and grade are reviewed as well.

  3. Improvement of 3D Scanner

    2003-01-01

    The disadvantage remaining in 3D scanning system and its reasons are discussed. A new host-and-slave structure with high speed image acquisition and processing system is proposed to quicken the image processing and improve the performance of 3D scanning system.

  4. 3D Printing for Bricks

    ECT Team, Purdue

    2015-01-01

    Building Bytes, by Brian Peters, is a project that uses desktop 3D printers to print bricks for architecture. Instead of using an expensive custom-made printer, it uses a normal standard 3D printer which is available for everyone and makes it more accessible and also easier for fabrication.

  5. Modular 3-D Transport model

    MT3D was first developed by Chunmiao Zheng in 1990 at S.S. Papadopulos & Associates, Inc. with partial support from the U.S. Environmental Protection Agency (USEPA). Starting in 1990, MT3D was released as a pubic domain code from the USEPA. Commercial versions with enhanced capab...

  6. Using 3D in Visualization

    Wood, Jo; Kirschenbauer, Sabine; Döllner, Jürgen;

    2005-01-01

    The notion of three-dimensionality is applied to five stages of the visualization pipeline. While 3D visulization is most often associated with the visual mapping and representation of data, this chapter also identifies its role in the management and assembly of data, and in the media used...... to display 3D imagery. The extra cartographic degree of freedom offered by using 3D is explored and offered as a motivation for employing 3D in visualization. The use of VR and the construction of virtual environments exploit navigational and behavioral realism, but become most usefil when combined...... with abstracted representations embedded in a 3D space. The interactions between development of geovisualization, the technology used to implement it and the theory surrounding cartographic representation are explored. The dominance of computing technologies, driven particularly by the gaming industry...

  7. PLOT3D/AMES, APOLLO UNIX VERSION USING GMR3D (WITHOUT TURB3D)

    Buning, P.

    1994-01-01

    PLOT3D is an interactive graphics program designed to help scientists visualize computational fluid dynamics (CFD) grids and solutions. Today, supercomputers and CFD algorithms can provide scientists with simulations of such highly complex phenomena that obtaining an understanding of the simulations has become a major problem. Tools which help the scientist visualize the simulations can be of tremendous aid. PLOT3D/AMES offers more functions and features, and has been adapted for more types of computers than any other CFD graphics program. Version 3.6b+ is supported for five computers and graphic libraries. Using PLOT3D, CFD physicists can view their computational models from any angle, observing the physics of problems and the quality of solutions. As an aid in designing aircraft, for example, PLOT3D's interactive computer graphics can show vortices, temperature, reverse flow, pressure, and dozens of other characteristics of air flow during flight. As critical areas become obvious, they can easily be studied more closely using a finer grid. PLOT3D is part of a computational fluid dynamics software cycle. First, a program such as 3DGRAPE (ARC-12620) helps the scientist generate computational grids to model an object and its surrounding space. Once the grids have been designed and parameters such as the angle of attack, Mach number, and Reynolds number have been specified, a "flow-solver" program such as INS3D (ARC-11794 or COS-10019) solves the system of equations governing fluid flow, usually on a supercomputer. Grids sometimes have as many as two million points, and the "flow-solver" produces a solution file which contains density, x- y- and z-momentum, and stagnation energy for each grid point. With such a solution file and a grid file containing up to 50 grids as input, PLOT3D can calculate and graphically display any one of 74 functions, including shock waves, surface pressure, velocity vectors, and particle traces. PLOT3D's 74 functions are organized into

  8. PLOT3D/AMES, APOLLO UNIX VERSION USING GMR3D (WITH TURB3D)

    Buning, P.

    1994-01-01

    PLOT3D is an interactive graphics program designed to help scientists visualize computational fluid dynamics (CFD) grids and solutions. Today, supercomputers and CFD algorithms can provide scientists with simulations of such highly complex phenomena that obtaining an understanding of the simulations has become a major problem. Tools which help the scientist visualize the simulations can be of tremendous aid. PLOT3D/AMES offers more functions and features, and has been adapted for more types of computers than any other CFD graphics program. Version 3.6b+ is supported for five computers and graphic libraries. Using PLOT3D, CFD physicists can view their computational models from any angle, observing the physics of problems and the quality of solutions. As an aid in designing aircraft, for example, PLOT3D's interactive computer graphics can show vortices, temperature, reverse flow, pressure, and dozens of other characteristics of air flow during flight. As critical areas become obvious, they can easily be studied more closely using a finer grid. PLOT3D is part of a computational fluid dynamics software cycle. First, a program such as 3DGRAPE (ARC-12620) helps the scientist generate computational grids to model an object and its surrounding space. Once the grids have been designed and parameters such as the angle of attack, Mach number, and Reynolds number have been specified, a "flow-solver" program such as INS3D (ARC-11794 or COS-10019) solves the system of equations governing fluid flow, usually on a supercomputer. Grids sometimes have as many as two million points, and the "flow-solver" produces a solution file which contains density, x- y- and z-momentum, and stagnation energy for each grid point. With such a solution file and a grid file containing up to 50 grids as input, PLOT3D can calculate and graphically display any one of 74 functions, including shock waves, surface pressure, velocity vectors, and particle traces. PLOT3D's 74 functions are organized into

  9. Anticancer photodynamic therapy based on the use of a microsystem

    Jastrzebska, E.; Bulka, N.; Zukowski, K.; Chudy, M.; Brzozka, Z.; Dybko, A.

    2015-07-01

    The paper presents the evaluation of photodynamic therapy (PDT) procedures with an application of a microsystem. Two cell lines were used in the experiments, i.e. human lung carcinoma - A549 and normal human fetal lung fibroblast MRC5. Mono-, coculture and mixed cultures were performed in a microsystem at the same time. The microsystem consisted of a concentration gradient generator (CGG) which generates different concentrations of a photosensitizer, and a set of microchambers for cells. The microchambers were linked by microchannels of various length in order to allow cells migration and in this way cocultures were created. Transparent materials were used for the chip manufacture, i.e. glass and poly(dimethylsiloxane). A high power LED was used to test photodynamic therapy effectiveness in the microsystem.

  10. ADT-3D Tumor Detection Assistant in 3D

    Jaime Lazcano Bello

    2008-12-01

    Full Text Available The present document describes ADT-3D (Three-Dimensional Tumor Detector Assistant, a prototype application developed to assist doctors diagnose, detect and locate tumors in the brain by using CT scan. The reader may find on this document an introduction to tumor detection; ADT-3D main goals; development details; description of the product; motivation for its development; result’s study; and areas of applicability.

  11. Unassisted 3D camera calibration

    Atanassov, Kalin; Ramachandra, Vikas; Nash, James; Goma, Sergio R.

    2012-03-01

    With the rapid growth of 3D technology, 3D image capture has become a critical part of the 3D feature set on mobile phones. 3D image quality is affected by the scene geometry as well as on-the-device processing. An automatic 3D system usually assumes known camera poses accomplished by factory calibration using a special chart. In real life settings, pose parameters estimated by factory calibration can be negatively impacted by movements of the lens barrel due to shaking, focusing, or camera drop. If any of these factors displaces the optical axes of either or both cameras, vertical disparity might exceed the maximum tolerable margin and the 3D user may experience eye strain or headaches. To make 3D capture more practical, one needs to consider unassisted (on arbitrary scenes) calibration. In this paper, we propose an algorithm that relies on detection and matching of keypoints between left and right images. Frames containing erroneous matches, along with frames with insufficiently rich keypoint constellations, are detected and discarded. Roll, pitch yaw , and scale differences between left and right frames are then estimated. The algorithm performance is evaluated in terms of the remaining vertical disparity as compared to the maximum tolerable vertical disparity.

  12. Integration of ferroelectric thin films into silicon based microsystems

    Kügeler, Carsten

    2006-01-01

    The integration of ferroelectric materials will enhance the functionality of conventional microsystems. The converse piezoelectric effect can be used for the fabrication of integrated actuators, which will help to realize integrated high frequency switches. The aim of this thesis is the integration of ferroelectric thin films into silicon based microsystems. Therefore, PZT thin films have been deposited on platinum coated silicon substrates by chemical solution deposition (CSD) and are charac...

  13. The introduction of powder blasting for sensor and microsystem applications

    Belloy, E.; Thurre, S.; Walckiers, E.; Sayah, A.; Gijs, M. A. M.

    2000-01-01

    We introduce powder blasting using a pressurised nozzle and a metallic mask as a new promising technology for microsystem fabrication. We study basic parameters of this powder blasting erosion process as well as mask-geometry effects on the erosion rate. We demonstrate the application potential of this technique in three important fields of microsystems research: (i) the realisation of microfluidic chips for biochemical separations, (ii) the micropatterning of composite hard magnetic layers f...

  14. Color 3D Reverse Engineering

    2002-01-01

    This paper presents a principle and a method of col or 3D laser scanning measurement. Based on the fundamental monochrome 3D measureme nt study, color information capture, color texture mapping, coordinate computati on and other techniques are performed to achieve color 3D measurement. The syste m is designed and composed of a line laser light emitter, one color CCD camera, a motor-driven rotary filter, a circuit card and a computer. Two steps in captu ring object's images in the measurement process: Firs...

  15. 3-D neutron transport benchmarks

    A set of 3-D neutron transport benchmark problems proposed by the Osaka University to NEACRP in 1988 has been calculated by many participants and the corresponding results are summarized in this report. The results of Keff, control rod worth and region-averaged fluxes for the four proposed core models, calculated by using various 3-D transport codes are compared and discussed. The calculational methods used were: Monte Carlo, Discrete Ordinates (Sn), Spherical Harmonics (Pn), Nodal Transport and others. The solutions of the four core models are quite useful as benchmarks for checking the validity of 3-D neutron transport codes

  16. 3D on the internet

    Puntar, Matej

    2012-01-01

    The purpose of this thesis is the presentation of already established and new technologies of displaying 3D content in a web browser. The thesis begins with a short presentation of the history of 3D content available on the internet and its development together with advantages and disadvantages of individual technologies. The latter two are described in detail as well is their use and the differences among them. Special emphasis has been given to WebGL, the newest technology of 3D conte...

  17. 5-axis 3D Printer

    Grutle, Øyvind Kallevik

    2015-01-01

    3D printers have in recent years become extremely popular. Even though 3D printing technology have existed since the late 1980's, it is now considered one of the most significant technological breakthroughs of the twenty-first century. Several different 3D printing processes have been invented during the years. But it is the fused deposition modeling (FDM) which was one of the first invented that is considered the most popular today. Even though the FDM process is the most popular, it still s...

  18. Handbook of 3D integration

    Garrou , Philip; Ramm , Peter

    2014-01-01

    Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology.As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading fo

  19. Exploration of 3D Printing

    Lin, Zeyu

    2014-01-01

    3D printing technology is introduced and defined in this Thesis. Some methods of 3D printing are illustrated and their principles are explained with pictures. Most of the essential parts are presented with pictures and their effects are explained within the whole system. Problems on Up! Plus 3D printer are solved and a DIY product is made with this machine. The processes of making product are recorded and the items which need to be noticed during the process are the highlight in this th...

  20. Tuotekehitysprojekti: 3D-tulostin

    Pihlajamäki, Janne

    2011-01-01

    Opinnäytetyössä tutustuttiin 3D-tulostamisen teknologiaan. Työssä käytiin läpi 3D-tulostimesta tehty tuotekehitysprojekti. Sen lisäksi esiteltiin yleisellä tasolla tuotekehitysprosessi ja syntyneiden tulosten mahdollisia suojausmenetelmiä. Tavoitteena tässä työssä oli kehittää markkinoilta jo löytyvää kotitulostin-tasoista 3D-laiteteknologiaa lähemmäksi ammattilaistason ratkaisua. Tavoitteeseen pyrittiin keskittymällä parantamaan laitteella saavutettavaa tulostustarkkuutta ja -nopeutt...

  1. 3D stacked chips from emerging processes to heterogeneous systems

    Fettweis, Gerhard

    2016-01-01

    This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.   •Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems; •Explains the use of wireless 3D integration to improve 3D IC reliability and yield; •Describes techniques for monitoring and mitigating thermal behavior in 3D I...

  2. Main: TATCCAYMOTIFOSRAMY3D [PLACE

    Full Text Available TATCCAYMOTIFOSRAMY3D S000256 01-August-2006 (last modified) kehi TATCCAY motif found in rice (O. ... otif and G motif (see S000130) are responsible for sugar ... repression (Toyofuku et al. 1998); GATA; amylase; ...

  3. Heterodyne 3D ghost imaging

    Yang, Xu; Zhang, Yong; Yang, Chenghua; Xu, Lu; Wang, Qiang; Zhao, Yuan

    2016-06-01

    Conventional three dimensional (3D) ghost imaging measures range of target based on pulse fight time measurement method. Due to the limit of data acquisition system sampling rate, range resolution of the conventional 3D ghost imaging is usually low. In order to take off the effect of sampling rate to range resolution of 3D ghost imaging, a heterodyne 3D ghost imaging (HGI) system is presented in this study. The source of HGI is a continuous wave laser instead of pulse laser. Temporal correlation and spatial correlation of light are both utilized to obtain the range image of target. Through theory analysis and numerical simulations, it is demonstrated that HGI can obtain high range resolution image with low sampling rate.

  4. Conducting polymer 3D microelectrodes

    Sasso, Luigi; Vazquez, Patricia; Vedarethinam, Indumathi;

    2010-01-01

    Conducting polymer 3D microelectrodes have been fabricated for possible future neurological applications. A combination of micro-fabrication techniques and chemical polymerization methods has been used to create pillar electrodes in polyaniline and polypyrrole. The thin polymer films obtained...

  5. Combinatorial 3D Mechanical Metamaterials

    Coulais, Corentin; Teomy, Eial; de Reus, Koen; Shokef, Yair; van Hecke, Martin

    2015-03-01

    We present a class of elastic structures which exhibit 3D-folding motion. Our structures consist of cubic lattices of anisotropic unit cells that can be tiled in a complex combinatorial fashion. We design and 3d-print this complex ordered mechanism, in which we combine elastic hinges and defects to tailor the mechanics of the material. Finally, we use this large design space to encode smart functionalities such as surface patterning and multistability.

  6. AI 3D Cybug Gaming

    Ahmed, Zeeshan

    2010-01-01

    In this short paper I briefly discuss 3D war Game based on artificial intelligence concepts called AI WAR. Going in to the details, I present the importance of CAICL language and how this language is used in AI WAR. Moreover I also present a designed and implemented 3D War Cybug for AI WAR using CAICL and discus the implemented strategy to defeat its enemies during the game life.

  7. 3D Face Appearance Model

    Lading, Brian; Larsen, Rasmus; Åström, Kalle

    2006-01-01

    We build a 3d face shape model, including inter- and intra-shape variations, derive the analytical jacobian of its resulting 2d rendered image, and show example of its fitting performance with light, pose, id, expression and texture variations.}......We build a 3d face shape model, including inter- and intra-shape variations, derive the analytical jacobian of its resulting 2d rendered image, and show example of its fitting performance with light, pose, id, expression and texture variations.}...

  8. 3D Face Apperance Model

    Lading, Brian; Larsen, Rasmus; Astrom, K

    2006-01-01

    We build a 3D face shape model, including inter- and intra-shape variations, derive the analytical Jacobian of its resulting 2D rendered image, and show example of its fitting performance with light, pose, id, expression and texture variations......We build a 3D face shape model, including inter- and intra-shape variations, derive the analytical Jacobian of its resulting 2D rendered image, and show example of its fitting performance with light, pose, id, expression and texture variations...

  9. New portable FELIX 3D display

    Langhans, Knut; Bezecny, Daniel; Homann, Dennis; Bahr, Detlef; Vogt, Carsten; Blohm, Christian; Scharschmidt, Karl-Heinz

    1998-04-01

    An improved generation of our 'FELIX 3D Display' is presented. This system is compact, light, modular and easy to transport. The created volumetric images consist of many voxels, which are generated in a half-sphere display volume. In that way a spatial object can be displayed occupying a physical space with height, width and depth. The new FELIX generation uses a screen rotating with 20 revolutions per second. This target screen is mounted by an easy to change mechanism making it possible to use appropriate screens for the specific purpose of the display. An acousto-optic deflection unit with an integrated small diode pumped laser draws the images on the spinning screen. Images can consist of up to 10,000 voxels at a refresh rate of 20 Hz. Currently two different hardware systems are investigated. The first one is based on a standard PCMCIA digital/analog converter card as an interface and is controlled by a notebook. The developed software is provided with a graphical user interface enabling several animation features. The second, new prototype is designed to display images created by standard CAD applications. It includes the development of a new high speed hardware interface suitable for state-of-the- art fast and high resolution scanning devices, which require high data rates. A true 3D volume display as described will complement the broad range of 3D visualization tools, such as volume rendering packages, stereoscopic and virtual reality techniques, which have become widely available in recent years. Potential applications for the FELIX 3D display include imaging in the field so fair traffic control, medical imaging, computer aided design, science as well as entertainment.

  10. 3D Integration for Wireless Multimedia

    Kimmich, Georg

    The convergence of mobile phone, internet, mapping, gaming and office automation tools with high quality video and still imaging capture capability is becoming a strong market trend for portable devices. High-density video encode and decode, 3D graphics for gaming, increased application-software complexity and ultra-high-bandwidth 4G modem technologies are driving the CPU performance and memory bandwidth requirements close to the PC segment. These portable multimedia devices are battery operated, which requires the deployment of new low-power-optimized silicon process technologies and ultra-low-power design techniques at system, architecture and device level. Mobile devices also need to comply with stringent silicon-area and package-volume constraints. As for all consumer devices, low production cost and fast time-to-volume production is key for success. This chapter shows how 3D architectures can bring a possible breakthrough to meet the conflicting power, performance and area constraints. Multiple 3D die-stacking partitioning strategies are described and analyzed on their potential to improve the overall system power, performance and cost for specific application scenarios. Requirements and maturity of the basic process-technology bricks including through-silicon via (TSV) and die-to-die attachment techniques are reviewed. Finally, we highlight new challenges which will arise with 3D stacking and an outlook on how they may be addressed: Higher power density will require thermal design considerations, new EDA tools will need to be developed to cope with the integration of heterogeneous technologies and to guarantee signal and power integrity across the die stack. The silicon/wafer test strategies have to be adapted to handle high-density IO arrays, ultra-thin wafers and provide built-in self-test of attached memories. New standards and business models have to be developed to allow cost-efficient assembly and testing of devices from different silicon and technology

  11. Using 3D Geometric Models to Teach Spatial Geometry Concepts.

    Bertoline, Gary R.

    1991-01-01

    An explanation of 3-D Computer Aided Design (CAD) usage to teach spatial geometry concepts using nontraditional techniques is presented. The software packages CADKEY and AutoCAD are described as well as their usefulness in solving space geometry problems. (KR)

  12. Laser induced forward transfer of interconnects for 3D integration

    Oosterhuis, G.; Prenen, A.; Huis in 't veld, A.J.

    2011-01-01

    Interconnects are an important cost driver in advanced 3D chip packaging. This holds for Through Silicon Vias (TSVs) for chip stacking, but also for other interconnect steps like re-distribution layers and solder bumps. Especially in applications with a low number (<100 mm-2) of relatively large fea

  13. Yield and Cost Analysis or 3D Stacked ICs

    Taouil, M.

    2014-01-01

    3D stacking is an emerging technology promising many benefits such as low latency between stacked dies, reduced power consumption, high bandwidth communication, improved form factor and package volume density, heterogeneous integration, and low-cost manufacturing. However, it requires modification o

  14. Fabrication of 3D solenoid microcoils in silica glass by femtosecond laser wet etch and microsolidics

    Meng, Xiangwei; Yang, Qing; Chen, Feng; Shan, Chao; Liu, Keyin; Li, Yanyang; Bian, Hao; Du, Guangqing; Hou, Xun

    2015-02-01

    This paper reports a flexible fabrication method for 3D solenoid microcoils in silica glass. The method consists of femtosecond laser wet etching (FLWE) and microsolidics process. The 3D microchannel with high aspect ratio is fabricated by an improved FLWE method. In the microsolidics process, an alloy was chosen as the conductive metal. The microwires are achieved by injecting liquid alloy into the microchannel, and allowing the alloy to cool and solidify. The alloy microwires with high melting point can overcome the limitation of working temperature and improve the electrical property. The geometry, the height and diameter of microcoils were flexibly fabricated by the pre-designed laser writing path, the laser power and etching time. The 3D microcoils can provide uniform magnetic field and be widely integrated in many magnetic microsystems.

  15. From 3D view to 3D print

    Dima, M.; Farisato, G.; Bergomi, M.; Viotto, V.; Magrin, D.; Greggio, D.; Farinato, J.; Marafatto, L.; Ragazzoni, R.; Piazza, D.

    2014-08-01

    In the last few years 3D printing is getting more and more popular and used in many fields going from manufacturing to industrial design, architecture, medical support and aerospace. 3D printing is an evolution of bi-dimensional printing, which allows to obtain a solid object from a 3D model, realized with a 3D modelling software. The final product is obtained using an additive process, in which successive layers of material are laid down one over the other. A 3D printer allows to realize, in a simple way, very complex shapes, which would be quite difficult to be produced with dedicated conventional facilities. Thanks to the fact that the 3D printing is obtained superposing one layer to the others, it doesn't need any particular work flow and it is sufficient to simply draw the model and send it to print. Many different kinds of 3D printers exist based on the technology and material used for layer deposition. A common material used by the toner is ABS plastics, which is a light and rigid thermoplastic polymer, whose peculiar mechanical properties make it diffusely used in several fields, like pipes production and cars interiors manufacturing. I used this technology to create a 1:1 scale model of the telescope which is the hardware core of the space small mission CHEOPS (CHaracterising ExOPlanets Satellite) by ESA, which aims to characterize EXOplanets via transits observations. The telescope has a Ritchey-Chrétien configuration with a 30cm aperture and the launch is foreseen in 2017. In this paper, I present the different phases for the realization of such a model, focusing onto pros and cons of this kind of technology. For example, because of the finite printable volume (10×10×12 inches in the x, y and z directions respectively), it has been necessary to split the largest parts of the instrument in smaller components to be then reassembled and post-processed. A further issue is the resolution of the printed material, which is expressed in terms of layers

  16. YouDash3D: exploring stereoscopic 3D gaming for 3D movie theaters

    Schild, Jonas; Seele, Sven; Masuch, Maic

    2012-03-01

    Along with the success of the digitally revived stereoscopic cinema, events beyond 3D movies become attractive for movie theater operators, i.e. interactive 3D games. In this paper, we present a case that explores possible challenges and solutions for interactive 3D games to be played by a movie theater audience. We analyze the setting and showcase current issues related to lighting and interaction. Our second focus is to provide gameplay mechanics that make special use of stereoscopy, especially depth-based game design. Based on these results, we present YouDash3D, a game prototype that explores public stereoscopic gameplay in a reduced kiosk setup. It features live 3D HD video stream of a professional stereo camera rig rendered in a real-time game scene. We use the effect to place the stereoscopic effigies of players into the digital game. The game showcases how stereoscopic vision can provide for a novel depth-based game mechanic. Projected trigger zones and distributed clusters of the audience video allow for easy adaptation to larger audiences and 3D movie theater gaming.

  17. Printing nanotube/nanowire for flexible microsystems

    Tortorich, Ryan P.; Choi, Jin-Woo

    2014-04-01

    Printing has become an emerging manufacturing technology for mechanics, electronics, and consumer products. Additionally, both nanotubes and nanowires have recently been used as materials for sensors and electrodes due to their unique electrical and mechanical properties. Printed electrodes and conductive traces particularly offer versatility of fabricating low-cost, disposable, and flexible electrical devices and microsystems. While various printing methods such as screen printing have been conventional methods for printing conductive traces and electrodes, inkjet printing has recently attracted great attention due to its unique advantages including no template requirement, rapid printing at low cost, on-demand printing capability, and precise control of the printed material. Computer generated conductive traces or electrode patterns can simply be printed on a thin film substrate with proper conductive ink consisting of nanotubes or nanowires. However, in order to develop nanotube or nanowire ink, there are a few challenges that need to be addressed. The most difficult obstacle to overcome is that of nanotube/nanowire dispersion within a solution. Other challenges include adjusting surface tension and controlling viscosity of the ink as well as treating the surface of the printing substrate. In an attempt to pave the way for nanomaterial inkjet printing, we present a method for preparing carbon nanotube ink as well as its printing technique. A fully printed electrochemical sensor using inkjet-printed carbon nanotube electrodes is also demonstrated as an example of the possibilities for this technology.

  18. TOPICAL REVIEW: Integrated genetic analysis microsystems

    Lagally, Eric T.; Mathies, Richard A.

    2004-12-01

    With the completion of the Human Genome Project and the ongoing DNA sequencing of the genomes of other animals, bacteria, plants and others, a wealth of new information about the genetic composition of organisms has become available. However, as the demand for sequence information grows, so does the workload required both to generate this sequence and to use it for targeted genetic analysis. Microfabricated genetic analysis systems are well poised to assist in the collection and use of these data through increased analysis speed, lower analysis cost and higher parallelism leading to increased assay throughput. In addition, such integrated microsystems may point the way to targeted genetic experiments on single cells and in other areas that are otherwise very difficult. Concomitant with these advantages, such systems, when fully integrated, should be capable of forming portable systems for high-speed in situ analyses, enabling a new standard in disciplines such as clinical chemistry, forensics, biowarfare detection and epidemiology. This review will discuss the various technologies available for genetic analysis on the microscale, and efforts to integrate them to form fully functional robust analysis devices.

  19. Intelligent agents: adaptation of autonomous bimodal microsystems

    Smith, Patrice; Terry, Theodore B.

    2014-03-01

    Autonomous bimodal microsystems exhibiting survivability behaviors and characteristics are able to adapt dynamically in any given environment. Equipped with a background blending exoskeleton it will have the capability to stealthily detect and observe a self-chosen viewing area while exercising some measurable form of selfpreservation by either flying or crawling away from a potential adversary. The robotic agent in this capacity activates a walk-fly algorithm, which uses a built in multi-sensor processing and navigation subsystem or algorithm for visual guidance and best walk-fly path trajectory to evade capture or annihilation. The research detailed in this paper describes the theoretical walk-fly algorithm, which broadens the scope of spatial and temporal learning, locomotion, and navigational performances based on optical flow signals necessary for flight dynamics and walking stabilities. By observing a fly's travel and avoidance behaviors; and, understanding the reverse bioengineering research efforts of others, we were able to conceptualize an algorithm, which works in conjunction with decisionmaking functions, sensory processing, and sensorimotor integration. Our findings suggest that this highly complex decentralized algorithm promotes inflight or terrain travel mobile stability which is highly suitable for nonaggressive micro platforms supporting search and rescue (SAR), and chemical and explosive detection (CED) purposes; a necessity in turbulent, non-violent structured or unstructured environments.

  20. A biodynamic microsystem for fluids viscosity measurements

    The purpose of this research was to model, design and fabricate a biodynamic analysis microsystem required for determination of various molecular transport properties of the biological fluids. In order to achieve this, a lab-on-a-chip device was fabricated. The microfluidic system developed satisfies the objectives for the study of microcirculation and characterization of cell rheological properties, functions and behaviour. The measurement principle of the viscosity of biological fluids is based on the detection of the rotation of a polysilicon gear-wheels system. The gear-wheels have external diameters of 250 μm, 200 μm, 160 μm and 3 μm thickness. The micromachining process combines the undercut and refill technique with pin-joint bearing permitting the fabrication of bushings that were used to elevate the rotor away from the silicon surface. The testing of the microfluidic dynamic system was performed using electromagnetic micropumps and magnetic controllers. Each device was fabricated by silicon micromachining technology and tested to obtain the specific characteristics

  1. Remote 3D Medical Consultation

    Welch, Greg; Sonnenwald, Diane H.; Fuchs, Henry; Cairns, Bruce; Mayer-Patel, Ketan; Yang, Ruigang; State, Andrei; Towles, Herman; Ilie, Adrian; Krishnan, Srinivas; Söderholm, Hanna M.

    Two-dimensional (2D) video-based telemedical consultation has been explored widely in the past 15-20 years. Two issues that seem to arise in most relevant case studies are the difficulty associated with obtaining the desired 2D camera views, and poor depth perception. To address these problems we are exploring the use of a small array of cameras to synthesize a spatially continuous range of dynamic three-dimensional (3D) views of a remote environment and events. The 3D views can be sent across wired or wireless networks to remote viewers with fixed displays or mobile devices such as a personal digital assistant (PDA). The viewpoints could be specified manually or automatically via user head or PDA tracking, giving the remote viewer virtual head- or hand-slaved (PDA-based) remote cameras for mono or stereo viewing. We call this idea remote 3D medical consultation (3DMC). In this article we motivate and explain the vision for 3D medical consultation; we describe the relevant computer vision/graphics, display, and networking research; we present a proof-of-concept prototype system; and we present some early experimental results supporting the general hypothesis that 3D remote medical consultation could offer benefits over conventional 2D televideo.

  2. Novel 3D media technologies

    Dagiuklas, Tasos

    2015-01-01

    This book describes recent innovations in 3D media and technologies, with coverage of 3D media capturing, processing, encoding, and adaptation, networking aspects for 3D Media, and quality of user experience (QoE). The contributions are based on the results of the FP7 European Project ROMEO, which focuses on new methods for the compression and delivery of 3D multi-view video and spatial audio, as well as the optimization of networking and compression jointly across the future Internet. The delivery of 3D media to individual users remains a highly challenging problem due to the large amount of data involved, diverse network characteristics and user terminal requirements, as well as the user’s context such as their preferences and location. As the number of visual views increases, current systems will struggle to meet the demanding requirements in terms of delivery of consistent video quality to fixed and mobile users. ROMEO will present hybrid networking solutions that combine the DVB-T2 and DVB-NGH broadcas...

  3. 3D future internet media

    Dagiuklas, Tasos

    2014-01-01

    This book describes recent innovations in 3D media and technologies, with coverage of 3D media capturing, processing, encoding, and adaptation, networking aspects for 3D Media, and quality of user experience (QoE). The main contributions are based on the results of the FP7 European Projects ROMEO, which focus on new methods for the compression and delivery of 3D multi-view video and spatial audio, as well as the optimization of networking and compression jointly across the Future Internet (www.ict-romeo.eu). The delivery of 3D media to individual users remains a highly challenging problem due to the large amount of data involved, diverse network characteristics and user terminal requirements, as well as the user’s context such as their preferences and location. As the number of visual views increases, current systems will struggle to meet the demanding requirements in terms of delivery of constant video quality to both fixed and mobile users. ROMEO will design and develop hybrid-networking solutions that co...

  4. Materialedreven 3d digital formgivning

    Hansen, Flemming Tvede

    2010-01-01

    Formålet med forskningsprojektet er for det første at understøtte keramikeren i at arbejde eksperimenterende med digital formgivning, og for det andet at bidrage til en tværfaglig diskurs om brugen af digital formgivning. Forskningsprojektet fokuserer på 3d formgivning og derved på 3d digital...... formgivning og Rapid Prototyping (RP). RP er en fællesbetegnelse for en række af de teknikker, der muliggør at overføre den digitale form til 3d fysisk form. Forskningsprojektet koncentrerer sig om to overordnede forskningsspørgsmål. Det første handler om, hvordan viden og erfaring indenfor det keramiske...... fagområde kan blive udnyttet i forhold til 3d digital formgivning. Det andet handler om, hvad en sådan tilgang kan bidrage med, og hvordan den kan blive udnyttet i et dynamisk samspil med det keramiske materiale i formgivningen af 3d keramiske artefakter. Materialedreven formgivning er karakteriseret af en...

  5. NASA 3D Models: Cassini

    National Aeronautics and Space Administration — Cassini spacecraft from SPACE rendering package, built by Michael Oberle under NASA contract at JPL. Includes orbiter only, Huygens probe detached. Accurate except...

  6. 3D-LSI technology for image sensor

    Recently, the development of three-dimensional large-scale integration (3D-LSI) technologies has accelerated and has advanced from the research level or the limited production level to the investigation level, which might lead to mass production. By separating 3D-LSI technology into elementary technologies such as (1) through silicon via (TSV) formation, (2) bump formation, (3) wafer thinning, (4) chip/wafer alignment, and (5) chip/wafer stacking and reconstructing the entire process and structure, many methods to realize 3D-LSI devices can be developed. However, by considering a specific application, the supply chain of base wafers, and the purpose of 3D integration, a few suitable combinations can be identified. In this paper, we focus on the application of 3D-LSI technologies to image sensors. We describe the process and structure of the chip size package (CSP), developed on the basis of current and advanced 3D-LSI technologies, to be used in CMOS image sensors. Using the current LSI technologies, CSPs for 1.3 M, 2 M, and 5 M pixel CMOS image sensors were successfully fabricated without any performance degradation. 3D-LSI devices can be potentially employed in high-performance focal-plane-array image sensors. We propose a high-speed image sensor with an optical fill factor of 100% to be developed using next-generation 3D-LSI technology and fabricated using micro(μ)-bumps and micro(μ)-TSVs.

  7. Modification of 3D milling machine to 3D printer

    Halamíček, Lukáš

    2015-01-01

    Tato práce se zabývá přestavbou gravírovací frézky na 3D tiskárnu. V první části se práce zabývá možnými technologiemi 3D tisku a možností jejich využití u přestavby. Dále jsou popsány a vybrány vhodné součásti pro přestavbu. V další části je realizováno řízení ohřevu podložky, trysky a řízení posuvu drátu pomocí softwaru TwinCat od společnosti Beckhoff na průmyslovém počítači. Výsledkem práce by měla být oživená 3D tiskárna. This thesis deals with rebuilding of engraving machine to 3D pri...

  8. 3D Imager and Method for 3D imaging

    Kumar, P.; Staszewski, R.; Charbon, E.

    2013-01-01

    3D imager comprising at least one pixel, each pixel comprising a photodetectorfor detecting photon incidence and a time-to-digital converter system configured for referencing said photon incidence to a reference clock, and further comprising a reference clock generator provided for generating the re

  9. Crowded Field 3D Spectroscopy

    Becker, T; Roth, M M; Becker, Thomas; Fabrika, Sergei; Roth, Martin M.

    2003-01-01

    The quantitative spectroscopy of stellar objects in complex environments is mainly limited by the ability of separating the object from the background. Standard slit spectroscopy, restricting the field of view to one dimension, is obviously not the proper technique in general. The emerging Integral Field (3D) technique with spatially resolved spectra of a two-dimensional field of view provides a great potential for applying advanced subtraction methods. In this paper an image reconstruction algorithm to separate point sources and a smooth background is applied to 3D data. Several performance tests demonstrate the photometric quality of the method. The algorithm is applied to real 3D observations of a sample Planetary Nebula in M31, whose spectrum is contaminated by the bright and complex galaxy background. The ability of separating sources is also studied in a crowded stellar field in M33.

  10. Validation of TRAB-3D

    TRAB-3D is a reactor dynamics code with three-dimensional neutronics coupled to core and circuit thermal-hydraulics. The code, entirely developed at VTT, can be used in transient and accident analyses of boiling (BWR) and pressurized water (PWR) reactors with rectangular fuel bundle geometry. The validation history of TRAB-3D includes calculation of international benchmark exercises, as well as comparisons with measured data from real plant transients. The most recent validation case is a load rejection test performed at the Olkiluoto 1 nuclear power plant in 1998 in connection with the power uprating project. The fact that there is local power measurement data available from this test makes it a suitable case for three-dimensional core model validation. The agreement between the results of the TRAB-3D calculation and the measurements is very good. (orig.)

  11. 3D-grafiikkamoottori mobiililaitteille

    Vahlman, Lauri

    2014-01-01

    Tässä insinöörityössä käydään läpi mobiililaitteille suunnatun yksinkertaisen 3D-grafiikkamoottorin suunnittelu ja toteutus käyttäen OpenGL ES -rajapintaa. Työssä esitellään grafiikkamoottorin toteutuksessa käytettyjä tekniikoita sekä tutustutaan moottorin rakenteeseen ja toteutuksellisiin yksityiskohtiin. Työn alkupuolella tutustutaan myös modernin 3D-grafiikan yleisiin periaatteisiin ja toimintaan sekä käydään läpi 3D-grafiikkaan liittyviä suorituskykyongelmia. Työn loppupuolella esitel...

  12. Markerless 3D Face Tracking

    Walder, Christian; Breidt, Martin; Bulthoff, Heinrich;

    2009-01-01

    We present a novel algorithm for the markerless tracking of deforming surfaces such as faces. We acquire a sequence of 3D scans along with color images at 40Hz. The data is then represented by implicit surface and color functions, using a novel partition-of-unity type method of efficiently...... combining local regressors using nearest neighbor searches. Both these functions act on the 4D space of 3D plus time, and use temporal information to handle the noise in individual scans. After interactive registration of a template mesh to the first frame, it is then automatically deformed to track...... the scanned surface, using the variation of both shape and color as features in a dynamic energy minimization problem. Our prototype system yields high-quality animated 3D models in correspondence, at a rate of approximately twenty seconds per timestep. Tracking results for faces and other objects...

  13. 3D vector flow imaging

    Pihl, Michael Johannes

    The main purpose of this PhD project is to develop an ultrasonic method for 3D vector flow imaging. The motivation is to advance the field of velocity estimation in ultrasound, which plays an important role in the clinic. The velocity of blood has components in all three spatial dimensions, yet...... conventional methods can estimate only the axial component. Several approaches for 3D vector velocity estimation have been suggested, but none of these methods have so far produced convincing in vivo results nor have they been adopted by commercial manufacturers. The basis for this project is the Transverse...... on the TO fields are suggested. They can be used to optimize the TO method. In the third part, a TO method for 3D vector velocity estimation is proposed. It employs a 2D phased array transducer and decouples the velocity estimation into three velocity components, which are estimated simultaneously based on 5...

  14. 3D proton beam micromachining

    Focused high energy ion beam micromachining is the newest of the micromachining techniques. There are about 50 scanning proton microprobe facilities worldwide, but so far only few of them showed activity in this promising field. High energy ion beam micromachining using a direct-write scanning MeV ion beam is capable of producing 3D microstructures and components with well defined lateral and depth geometry. The technique has high potential in the manufacture of 3D molds, stamps, and masks for X-ray lithography (LIGA), and also in the rapid prototyping of microcomponents either for research purposes or for components testing prior to batch production. (R.P.)

  15. 3D Computations and Experiments

    Couch, R; Faux, D; Goto, D; Nikkel, D

    2004-04-05

    This project consists of two activities. Task A, Simulations and Measurements, combines all the material model development and associated numerical work with the materials-oriented experimental activities. The goal of this effort is to provide an improved understanding of dynamic material properties and to provide accurate numerical representations of those properties for use in analysis codes. Task B, ALE3D Development, involves general development activities in the ALE3D code with the focus of improving simulation capabilities for problems of mutual interest to DoD and DOE. Emphasis is on problems involving multi-phase flow, blast loading of structures and system safety/vulnerability studies.

  16. 3D unstructured mesh discontinuous finite element hydro

    The authors present detailed features of the ICF3D hydrodynamics code used for inertial fusion simulations. This code is intended to be a state-of-the-art upgrade of the well-known fluid code, LASNEX. ICF3D employs discontinuous finite elements on a discrete unstructured mesh consisting of a variety of 3D polyhedra including tetrahedra, prisms, and hexahedra. The authors discussed details of how the ROE-averaged second-order convection was applied on the discrete elements, and how the C++ coding interface has helped to simplify implementing the many physics and numerics modules within the code package. The author emphasized the virtues of object-oriented design in large scale projects such as ICF3D

  17. 3D unstructured mesh discontinuous finite element hydro

    Prasad, M.K.; Kershaw, D.S.; Shaw, M.J. [Lawrence Livermore National Lab., CA (United States)

    1995-07-01

    The authors present detailed features of the ICF3D hydrodynamics code used for inertial fusion simulations. This code is intended to be a state-of-the-art upgrade of the well-known fluid code, LASNEX. ICF3D employs discontinuous finite elements on a discrete unstructured mesh consisting of a variety of 3D polyhedra including tetrahedra, prisms, and hexahedra. The authors discussed details of how the ROE-averaged second-order convection was applied on the discrete elements, and how the C++ coding interface has helped to simplify implementing the many physics and numerics modules within the code package. The author emphasized the virtues of object-oriented design in large scale projects such as ICF3D.

  18. 3D Printing: Exploring Capabilities

    Samuels, Kyle; Flowers, Jim

    2015-01-01

    As 3D printers become more affordable, schools are using them in increasing numbers. They fit well with the emphasis on product design in technology and engineering education, allowing students to create high-fidelity physical models to see and test different iterations in their product designs. They may also help students to "think in three…

  19. Making Inexpensive 3-D Models

    Manos, Harry

    2016-01-01

    Visual aids are important to student learning, and they help make the teacher's job easier. Keeping with the "TPT" theme of "The Art, Craft, and Science of Physics Teaching," the purpose of this article is to show how teachers, lacking equipment and funds, can construct a durable 3-D model reference frame and a model gravity…

  20. 3D Face Appearance Model

    Lading, Brian; Larsen, Rasmus; Åström, Kalle

    2006-01-01

    We build a 3d face shape model, including inter- and intra-shape variations, derive the analytical jacobian of its resulting 2d rendered image, and show example of its fitting performance with light, pose, id, expression and texture variations.}

  1. 3D Face Apperance Model

    Lading, Brian; Larsen, Rasmus; Astrom, K

    2006-01-01

    We build a 3D face shape model, including inter- and intra-shape variations, derive the analytical Jacobian of its resulting 2D rendered image, and show example of its fitting performance with light, pose, id, expression and texture variations

  2. Viewing galaxies in 3D

    Krajnović, Davor

    2016-01-01

    Thanks to a technique that reveals galaxies in 3D, astronomers can now show that many galaxies have been wrongly classified. Davor Krajnovi\\'c argues that the classification scheme proposed 85 years ago by Edwin Hubble now needs to be revised.

  3. 3D terahertz beam profiling

    Pedersen, Pernille Klarskov; Strikwerda, Andrew; Wang, Tianwu;

    2013-01-01

    We present a characterization of THz beams generated in both a two-color air plasma and in a LiNbO3 crystal. Using a commercial THz camera, we record intensity images as a function of distance through the beam waist, from which we extract 2D beam profiles and visualize our measurements into 3D beam...

  4. Priprava 3D modelov za 3D tisk

    Pikovnik, Tomaž

    2015-01-01

    Po mnenju nekaterih strokovnjakov bo aditivna proizvodnja (ali 3D tiskanje) spremenila proizvodnjo industrijo, saj si bo vsak posameznik lahko natisnil svoj objekt po želji. V diplomski nalogi so predstavljene nekatere tehnologije aditivne proizvodnje. V nadaljevanju diplomske naloge je predstavljena izdelava makete hiše v merilu 1:100, vse od modeliranja do tiskanja. Poseben poudarek je posvečen predelavi modela, da je primeren za tiskanje, kjer je razvit pristop za hitrejše i...

  5. Post processing of 3D models for 3D printing

    Pikovnik, Tomaž

    2015-01-01

    According to the opinion of some experts the additive manufacturing or 3D printing will change manufacturing industry, because any individual could print their own model according to his or her wishes. In this graduation thesis some of the additive manufacturing technologies are presented. Furthermore in the production of house scale model in 1:100 is presented, starting from modeling to printing. Special attention is given to postprocessing of the building model elements us...

  6. 3D Cameras: 3D Computer Vision of Wide Scope

    May, Stefan; Pervoelz, Kai; Surmann, Hartmut

    2007-01-01

    First of all, a short comparison of range sensors and their underlying principles was given. The chapter further focused on 3D cameras. The latest innovations have given a significant improvement for the measurement accuracy, wherefore this technology has attracted attention in the robotics community. This was also the motivation for the examination in this chapter. On this account, several applications were presented, which represents common problems in the domain of autonomous robotics. For...

  7. DYNA3D2000*, Explicit 3-D Hydrodynamic FEM Program

    1 - Description of program or function: DYNA3D2000 is a nonlinear explicit finite element code for analyzing 3-D structures and solid continuum. The code is vectorized and available on several computer platforms. The element library includes continuum, shell, beam, truss and spring/damper elements to allow maximum flexibility in modeling physical problems. Many materials are available to represent a wide range of material behavior, including elasticity, plasticity, composites, thermal effects and rate dependence. In addition, DYNA3D has a sophisticated contact interface capability, including frictional sliding, single surface contact and automatic contact generation. 2 - Method of solution: Discretization of a continuous model transforms partial differential equations into algebraic equations. A numerical solution is then obtained by solving these algebraic equations through a direct time marching scheme. 3 - Restrictions on the complexity of the problem: Recent software improvements have eliminated most of the user identified limitations with dynamic memory allocation and a very large format description that has pushed potential problem sizes beyond the reach of most users. The dominant restrictions remain in code execution speed and robustness, which the developers constantly strive to improve

  8. Pipe3D, a pipeline to analyze Integral Field Spectroscopy Data: I. New fitting philosophy of FIT3D

    Sánchez, S. F.; Pérez, E.; Sánchez-Blázquez, P.; González, J. J.; Rosález-Ortega, F. F.; Cano-Dí az, M.; López-Cobá, C.; Marino, R. A.; Gil de Paz, A.; Mollá, M.; López-Sánchez, A. R.; Ascasibar, Y.; Barrera-Ballesteros, J.

    2016-04-01

    We present an improved version of FIT3D, a fitting tool for the analysis of the spectroscopic properties of the stellar populations and the ionized gas derived from moderate resolution spectra of galaxies. This tool was developed to analyze integral field spectroscopy data and it is the basis of Pipe3D, a pipeline used in the analysis of CALIFA, MaNGA, and SAMI data. We describe the philosophy and each step of the fitting procedure. We present an extensive set of simulations in order to estimate the precision and accuracy of the derived parameters for the stellar populations and the ionized gas. We report on the results of those simulations. Finally, we compare the results of the analysis using FIT3D with those provided by other widely used packages, and we find that the parameters derived by FIT3D are fully compatible with those derived using these other tools.

  9. Microsystem engineering of lab-on-a-chip devices

    Geschke, Oliver; Telleman, Pieter

    2006-01-01

    Written on a non-specialist level by an interdisciplinary team of chemists, biologists and engineers from one of Europe's leading centres for microsystem research, the Danish Mikroelektronik Centret (MIC), this is a concise practical introduction to the subject. As such, the book is the first to focus on analytical applications, providing life and analytical scientists, biotechnologists and pharmaceutists with an understanding of the principles behind the design and manufacture of chemical and biochemical microsystems. The text is backed by a chapter devoted to troubleshooting as well as a g

  10. Introduction to microsystem technology a guide for students

    Gerlach, Gerald; Müller, Dörte

    2008-01-01

    Over half a century after the discovery of the piezoresistive effect, microsystem technology has experienced considerable developments. Expanding the opportunities of microelectronics to non-electronic systems, its number of application fields continues to increase. Microsensors are one of the most important fields, used in medical applications and micromechanics. Microfluidic systems are also a significant area, most commonly used in ink-jet printer heads. This textbook focuses on the essentials of microsystems technology, providing a knowledgeable grounding and a clear path through this we

  11. Microsystems Engineering of Lab-on-a-Chip Devices

    microsystem. The idea behind this vision is, that such a system is portable and delivers more and qualitative better data more rapidly than a conventional system, while using only very small amounts of the reagents. To realize such a system, components from different fields, such as electronics, optics......, mechanics and fluidics, have to be miniaturized. In this book we will discuss the different aspects of (bio)chemical microsystem development, which are simulation, design, materials, microfabrication, microliquid handling components, interconnections, integration and applications. These topics are...... illustrated with examples, mainly from research projects at Mikroelektronik Centret....

  12. PubChem3D: Conformer generation

    Bolton Evan E

    2011-01-01

    Full Text Available Abstract Background PubChem, an open archive for the biological activities of small molecules, provides search and analysis tools to assist users in locating desired information. Many of these tools focus on the notion of chemical structure similarity at some level. PubChem3D enables similarity of chemical structure 3-D conformers to augment the existing similarity of 2-D chemical structure graphs. It is also desirable to relate theoretical 3-D descriptions of chemical structures to experimental biological activity. As such, it is important to be assured that the theoretical conformer models can reproduce experimentally determined bioactive conformations. In the present study, we investigate the effects of three primary conformer generation parameters (the fragment sampling rate, the energy window size, and force field variant upon the accuracy of theoretical conformer models, and determined optimal settings for PubChem3D conformer model generation and conformer sampling. Results Using the software package OMEGA from OpenEye Scientific Software, Inc., theoretical 3-D conformer models were generated for 25,972 small-molecule ligands, whose 3-D structures were experimentally determined. Different values for primary conformer generation parameters were systematically tested to find optimal settings. Employing a greater fragment sampling rate than the default did not improve the accuracy of the theoretical conformer model ensembles. An ever increasing energy window did increase the overall average accuracy, with rapid convergence observed at 10 kcal/mol and 15 kcal/mol for model building and torsion search, respectively; however, subsequent study showed that an energy threshold of 25 kcal/mol for torsion search resulted in slightly improved results for larger and more flexible structures. Exclusion of coulomb terms from the 94s variant of the Merck molecular force field (MMFF94s in the torsion search stage gave more accurate conformer models at

  13. Forensic 3D Scene Reconstruction

    LITTLE,CHARLES Q.; PETERS,RALPH R.; RIGDON,J. BRIAN; SMALL,DANIEL E.

    1999-10-12

    Traditionally law enforcement agencies have relied on basic measurement and imaging tools, such as tape measures and cameras, in recording a crime scene. A disadvantage of these methods is that they are slow and cumbersome. The development of a portable system that can rapidly record a crime scene with current camera imaging, 3D geometric surface maps, and contribute quantitative measurements such as accurate relative positioning of crime scene objects, would be an asset to law enforcement agents in collecting and recording significant forensic data. The purpose of this project is to develop a feasible prototype of a fast, accurate, 3D measurement and imaging system that would support law enforcement agents to quickly document and accurately record a crime scene.

  14. Forensic 3D Scene Reconstruction

    Traditionally law enforcement agencies have relied on basic measurement and imaging tools, such as tape measures and cameras, in recording a crime scene. A disadvantage of these methods is that they are slow and cumbersome. The development of a portable system that can rapidly record a crime scene with current camera imaging, 3D geometric surface maps, and contribute quantitative measurements such as accurate relative positioning of crime scene objects, would be an asset to law enforcement agents in collecting and recording significant forensic data. The purpose of this project is to develop a feasible prototype of a fast, accurate, 3D measurement and imaging system that would support law enforcement agents to quickly document and accurately record a crime scene

  15. 3-D Relativistic MHD Simulations

    Nishikawa, K.-I.; Frank, J.; Koide, S.; Sakai, J.-I.; Christodoulou, D. M.; Sol, H.; Mutel, R. L.

    1998-12-01

    We present 3-D numerical simulations of moderately hot, supersonic jets propagating initially along or obliquely to the field lines of a denser magnetized background medium with Lorentz factors of W = 4.56 and evolving in a four-dimensional spacetime. The new results are understood as follows: Relativistic simulations have consistently shown that these jets are effectively heavy and so they do not suffer substantial momentum losses and are not decelerated as efficiently as their nonrelativistic counterparts. In addition, the ambient magnetic field, however strong, can be pushed aside with relative ease by the beam, provided that the degrees of freedom associated with all three spatial dimensions are followed self-consistently in the simulations. This effect is analogous to pushing Japanese ``noren'' or vertical Venetian blinds out of the way while the slats are allowed to bend in 3-D space rather than as a 2-D slab structure.

  16. 3D Printed Robotic Hand

    Pizarro, Yaritzmar Rosario; Schuler, Jason M.; Lippitt, Thomas C.

    2013-01-01

    Dexterous robotic hands are changing the way robots and humans interact and use common tools. Unfortunately, the complexity of the joints and actuations drive up the manufacturing cost. Some cutting edge and commercially available rapid prototyping machines now have the ability to print multiple materials and even combine these materials in the same job. A 3D model of a robotic hand was designed using Creo Parametric 2.0. Combining "hard" and "soft" materials, the model was printed on the Object Connex350 3D printer with the purpose of resembling as much as possible the human appearance and mobility of a real hand while needing no assembly. After printing the prototype, strings where installed as actuators to test mobility. Based on printing materials, the manufacturing cost of the hand was $167, significantly lower than other robotic hands without the actuators since they have more complex assembly processes.

  17. [Real time 3D echocardiography

    Bauer, F.; Shiota, T.; Thomas, J. D.

    2001-01-01

    Three-dimensional representation of the heart is an old concern. Usually, 3D reconstruction of the cardiac mass is made by successive acquisition of 2D sections, the spatial localisation and orientation of which require complex guiding systems. More recently, the concept of volumetric acquisition has been introduced. A matricial emitter-receiver probe complex with parallel data processing provides instantaneous of a pyramidal 64 degrees x 64 degrees volume. The image is restituted in real time and is composed of 3 planes (planes B and C) which can be displaced in all spatial directions at any time during acquisition. The flexibility of this system of acquisition allows volume and mass measurement with greater accuracy and reproducibility, limiting inter-observer variability. Free navigation of the planes of investigation allows reconstruction for qualitative and quantitative analysis of valvular heart disease and other pathologies. Although real time 3D echocardiography is ready for clinical usage, some improvements are still necessary to improve its conviviality. Then real time 3D echocardiography could be the essential tool for understanding, diagnosis and management of patients.

  18. Stacking technology for a space constrained microsystem

    Heschel, Matthias; Kuhmann, Jochen Friedrich; Bouwstra, Siebe;

    1998-01-01

    In this paper we present a stacking technology for an integrated packaging of an intelligent transducer which is formed by a micromachined silicon transducer and an integrated circuit chip. Transducer and circuitry are stacked on top of each other with an intermediate chip in between. The bonding...

  19. A 3D Hybrid Integration Methodology for Terabit Transceivers

    Dong, Yunfeng; Johansen, Tom Keinicke; Zhurbenko, Vitaliy;

    2015-01-01

    integration are described. An equivalent circuit model of the via-throughs connecting the RF circuitry to the modulator is proposed and its lumped element parameters are extracted. Wire bonding transitions between the driving and RF circuitry were designed and simulated. An optimized 3D interposer design...... demonstrated a simulated -3 dB transmission bandwidth up to 95 GHz with associated return loss better than 10 dB. A thermal analysis of a subassembly for the packaged transmitter module is performed. A maximum temperature of 74 °C is predicted when copper-tungsten is used as the material of the sub-mount and...

  20. CVD Diamond Sink Application in High Power 3D MCMs

    XIE Kuo-jun; JIANG Chang-shun; LI Cheng-yue

    2005-01-01

    As electronic packages become more compact, run at faster speeds and dissipate more heat, package designers need more effective thermal management materials. CVD diamond, because of its high thermal conductivity, low dielectric loss and its great mechanical strength, is an excellent material for three dimensional (3D) multichip modules (MCMs) in the next generation compact high speed computers and high power microwave components. In this paper, we have synthesized a large area freestanding diamond films and substrates, and polished diamond substrates, which make MCMs diamond film sink becomes a reality.

  1. Preliminary Thermal Characterization of a Fully-Passive Wireless Backscattering Neuro-Recording Microsystem

    Schwerdt, H. N.; Xu, W.; Shekhar, S.; Chae, J.; Miranda, F. A.

    2011-01-01

    We present analytical and experimental thermal characteristics of a battery-less, fully-passive wireless backscattering microsystem for recording of neuropotentials. A major challenge for cortically implantable microsystems involves minimizing the heat dissipated by on-chip circuitry, which can lead to permanent brain damage. Therefore, knowledge of temperature changes induced by implantable microsystems while in operation is of utmost importance. In this work, a discrete diode appended to the neuro-recording microsystem has been used to indirectly monitor the aforesaid temperature changes. Using this technique, the maximum temperature rise measured for the microsystem while in operation was 0.15 +/- 0.1 C, which is significantly less than current safety guidelines. Specific absorption ratio (SAR) due to the microsystem was also computed to further demonstrate fully-passive functionality of the neuro-recording microsystem.

  2. 3D simulation studies of tokamak plasmas using MHD and extended-MHD models

    The M3D (Multi-level 3D) tokamak simulation project aims at the simulation of tokamak plasmas using a multi-level tokamak code package. Several current applications using MHD and Extended-MHD models are presented; high-β disruption studies in reversed shear plasmas using the MHD level MH3D code, ω*i stabilization and nonlinear island saturation of TAE mode using the hybrid particle/MHD level MH3D-K code, and unstructured mesh MH3D++ code studies. In particular, three internal mode disruption mechanisms are identified from simulation results which agree which agree well with experimental data

  3. Internet Use and Child Development: The Techno-Microsystem

    Johnson, Genevieve Marie

    2010-01-01

    Ecological systems theory assumes that child development is the consequence of ongoing reciprocal and spiraling interactions between the child and his/her microsystem (immediate home, school, and community environments). The increasing presence of digital technologies in children's immediate environments suggests the need for the proposed…

  4. Macro-meso-microsystems integration in LTCC : LDRD report.

    De Smet, Dennis J.; Nordquist, Christopher Daniel; Turner, Timothy Shawn; Rohrer, Brandon Robinson; Walker, Charles A.; Ho, Clifford K..; Patel, Kamlesh D.; Okandan, Murat; Rohde, Steven Barney; Wroblewski, Brian D.; Pfeifer, Kent Bryant; Peterson, Kenneth Allen; Buerger, Stephen P.

    2007-03-01

    Low Temperature Cofired Ceramic (LTCC) has proven to be an enabling medium for microsystem technologies, because of its desirable electrical, physical, and chemical properties coupled with its capability for rapid prototyping and scalable manufacturing of components. LTCC is viewed as an extension of hybrid microcircuits, and in that function it enables development, testing, and deployment of silicon microsystems. However, its versatility has allowed it to succeed as a microsystem medium in its own right, with applications in non-microelectronic meso-scale devices and in a range of sensor devices. Applications include silicon microfluidic ''chip-and-wire'' systems and fluid grid array (FGA)/microfluidic multichip modules using embedded channels in LTCC, and cofired electro-mechanical systems with moving parts. Both the microfluidic and mechanical system applications are enabled by sacrificial volume materials (SVM), which serve to create and maintain cavities and separation gaps during the lamination and cofiring process. SVMs consisting of thermally fugitive or partially inert materials are easily incorporated. Recognizing the premium on devices that are cofired rather than assembled, we report on functional-as-released and functional-as-fired moving parts. Additional applications for cofired transparent windows, some as small as an optical fiber, are also described. The applications described help pave the way for widespread application of LTCC to biomedical, control, analysis, characterization, and radio frequency (RF) functions for macro-meso-microsystems.

  5. Wireless 3D Chocolate Printer

    FROILAN G. DESTREZA

    2014-02-01

    Full Text Available This study is for the BSHRM Students of Batangas State University (BatStateU ARASOF for the researchers believe that the Wireless 3D Chocolate Printer would be helpful in their degree program especially on making creative, artistic, personalized and decorative chocolate designs. The researchers used the Prototyping model as procedural method for the successful development and implementation of the hardware and software. This method has five phases which are the following: quick plan, quick design, prototype construction, delivery and feedback and communication. This study was evaluated by the BSHRM Students and the assessment of the respondents regarding the software and hardware application are all excellent in terms of Accuracy, Effecitveness, Efficiency, Maintainability, Reliability and User-friendliness. Also, the overall level of acceptability of the design project as evaluated by the respondents is excellent. With regard to the observation about the best raw material to use in 3D printing, the chocolate is good to use as the printed material is slightly distorted,durable and very easy to prepare; the icing is also good to use as the printed material is not distorted and is very durable but consumes time to prepare; the flour is not good as the printed material is distorted, not durable but it is easy to prepare. The computation of the economic viability level of 3d printer with reference to ROI is 37.14%. The recommendation of the researchers in the design project are as follows: adding a cooling system so that the raw material will be more durable, development of a more simplified version and improving the extrusion process wherein the user do not need to stop the printing process just to replace the empty syringe with a new one.

  6. INGRID, 3-D Mesh Generator for Program DYNA3D and NIKE3D and FACET and TOPAZ3D

    1 - Description of program or function: INGRID is a general-purpose, three-dimensional mesh generator developed for use with finite element, nonlinear, structural dynamics codes. INGRID generates the large and complex input data files for DYNA3D (NESC 9909), NIKE3D (NESC 9725), FACET, and TOPAZ3D. One of the greatest advantages of INGRID is that virtually any shape can be described without resorting to wedge elements, tetrahedrons, triangular elements or highly distorted quadrilateral or hexahedral elements. Other capabilities available are in the areas of geometry and graphics. Exact surface equations and surface intersections considerably improve the ability to deal with accurate models, and a hidden line graphics algorithm is included which is efficient on the most complicated meshes. The most important new capability is associated with the boundary conditions, loads, and material properties required by nonlinear mechanics programs. Commands have been designed for each case to minimize user effort. This is particularly important since special processing is almost always required for each load or boundary condition. 2 - Method of solution: Geometries are described primarily using the index space notation of the INGEN program (NESC 975) with an additional type of notation, index progression. Index progressions provide a concise and simple method for describing complex structures; the concept was developed to facilitate defining multiple regions in index space. Rather than specifying the minimum and maximum indices for a region, one specifies the progression of indices along the I, J and K directions, respectively. The index progression method allows the analyst to describe most geometries including nodes and elements with roughly the same amount of input as a solids modeler

  7. Tehokas 3D-animaatiotuotanto

    Järvinen, Manu

    2009-01-01

    Opinnäytetyössä tutkittiin tehokasta tapaa toteuttaa minuutin mittainen animaatio Scene.org Awards -tapahtuman avajaisseremoniaan. Kyseinen video toteutettiin osana opinnäytetyötä. Työhön osallistui tekijän lisäksi 3D-mallintaja sekä muusikko. Työkaluina käytettiin pääasiassa Autodesk 3ds Max-, sekä Adobe After Effects- ja Adobe Photoshop -ohjelmia. Opinnäytetyö koostuu animaatioprojektin tuotantoputken ja tiedostonhallintamallin perinpohjaisesta läpikäymisestä sekä sen asian tutkimisesta...

  8. Making Inexpensive 3-D Models

    Manos, Harry

    2016-03-01

    Visual aids are important to student learning, and they help make the teacher's job easier. Keeping with the TPT theme of "The Art, Craft, and Science of Physics Teaching," the purpose of this article is to show how teachers, lacking equipment and funds, can construct a durable 3-D model reference frame and a model gravity well tailored to specific class lessons. Most of the supplies are readily available in the home or at school: rubbing alcohol, a rag, two colors of spray paint, art brushes, and masking tape. The cost of these supplies, if you don't have them, is less than 20.

  9. Virtual 3-D Facial Reconstruction

    Martin Paul Evison

    2000-06-01

    Full Text Available Facial reconstructions in archaeology allow empathy with people who lived in the past and enjoy considerable popularity with the public. It is a common misconception that facial reconstruction will produce an exact likeness; a resemblance is the best that can be hoped for. Research at Sheffield University is aimed at the development of a computer system for facial reconstruction that will be accurate, rapid, repeatable, accessible and flexible. This research is described and prototypical 3-D facial reconstructions are presented. Interpolation models simulating obesity, ageing and ethnic affiliation are also described. Some strengths and weaknesses in the models, and their potential for application in archaeology are discussed.

  10. How 3-D Movies Work

    吕铁雄

    2011-01-01

    难度:★★★★☆词数:450 建议阅读时间:8分钟 Most people see out of two eyes. This is a basic fact of humanity,but it’s what makes possible the illusion of depth(纵深幻觉) that 3-D movies create. Human eyes are spaced about two inches apart, meaning that each eye gives the brain a slightly different perspective(透视感)on the same object. The brain then uses this variance to quickly determine an object’s distance.